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SIM5350 Hardware Design V1.00硬件设计手册

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SIM5350_ Hardware_Design _V1.00Document Title SIM5350 Hardware DesignVersion 1.00Date2013-08-15Status ReleaseDocumentSIM5350_Hardware_Design_V1.00Control IDGeneral NotesSIMCom offers this information as a service to its customers, to support application and engineering efforts that use the products designed by SIMCom. The information provided is based upon requirements specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, system validation of this product designed by SIMCom within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change.CopyrightThis document contains proprietary technical information which is the property of SIMCom Limited, copying of this document and giving it to others and the using or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of a patent or the registration of a utility model or design. All specification supplied herein are subject to change without notice at any time.Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2013ContentsSIM5350_ Hardware_Design _V1.00 (1)Version History (7)1.Introduction (8)2.SIM5350 Overview (9)2.1.SIM5350 Key Features (10)2.2.Operating Mode (12)2.3.Functional Diagram (13)3.Package Information (14)3.1.Pin Out Diagram (14)3.2.Pin Description (14)3.3.Package Dimensions (17)4.Application Interface (19)4.1.Power Supply (19)4.2.Hardware Reset (20)4.3.Power Saving Mode (21)4.3.1.Minimum Functionality Mode and Sleep Mode (21)4.3.2.Wake Up of SIM5350 from Sleep Mode (21)B 2.0 (21)B Application Port (22)B Debug Port (22)B Speech Port (22)4.4.4.Modem (22)4.4.5.Removable Disk (22)4.4.6.Firmware Update (22)4.5.Serial Interface (22)4.5.1.Function of Serial Interface (23)4.5.2.Serial Interface Connection (23)4.5.3.RI Behaviors (24)4.6.SIM Card Interface (25)4.6.1.SIM card Application (25)4.6.2.SIM Card Design Proposal (25)4.6.3.Design Considerations for SIM Card Holder (26)4.7.PCM Interface (26)4.8.SDIO Interface (28)4.9.I2C BUS (29)4.10.GPIO (29)work Status Indication (30)4.10.2.Controllable Clock Output (31)4.10.3.Flight Mode Control (31)4.10.4.SD Memory Card Detecting (31)4.10.5.SIM Card Detecting (31)4.11.PWM (31)4.12.LDO (32)4.13.Antenna Interface (32)4.13.1.Recommended Antenna Characteristics (32)4.13.2.The Difference between Main and Diversity Antenna (33)4.13.3.Antenna Design Proposals (33)5.PCB Design (36)5.1Module Pin Assignment (36)5.2PCB Design Proposals (37)5.2.1.Antenna (37)5.2.2.Power supply (37)5.2.3.SIM Card Holder (38)B 2.0 (38)5.2.5.Others (38)6.Electrical, Reliability and Radio Characteristics (39)6.1Absolute Maximum Ratings (39)6.2Recommended Operating Temperature (39)6.3Digital Interface Characteristics (39)6.4SIM Card Interface Characteristics (40)6.5V_USIM Characteristics (40)6.6VDD_SD Characteristics (40)6.7VDD_1V8 Characteristics (41)6.8Current Consumption (VCC_RF, VCC_BB=3.3V+0.3V/-0.1V) (41)6.9Electro-Static Discharge (42)6.10Radio Characteristics (43)6.10.1.Conducted Output Power (43)6.10.2.Conducted Receive Sensitivity (43)6.10.3.Supported Band (43)7.Manufacturing (45)7.1.SIM5350 Top and Bottom View (45)7.2.Typical Solder Reflow Profile (46)7.3.Moisture sensitivity (46)8.Appendix (47)I.Related Documents (47)II.Multiplexing Function List (48)III.Terms and Abbreviations (49)IV.Safety Caution (51)Contact us: (52)Table IndexTABLE 1: SIM5350 SERIES FREQUENCY BANDS (9)TABLE 2: SIM5350 KEY FEATURES (10)TABLE 3: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE (11)TABLE 4: OPERATING MODE (12)TABLE 5: PIN DESCRIPTION (14)TABLE 6: RECOMMENDED ZENER DIODE (19)TABLE 7: RESET ELECTRICAL CHARACTERISTIC (20)TABLE 8: THE CURRENT CONSUMPTION OF MINIMUM FUNCTIONALITY MODE (BS-PA-MFRMS=5) (21)TABLE 9: SERIAL INTERFACE PIN DEFINITION (22)TABLE 10: MULTIPLEXING FUNCTION OF SERIAL INTERFACE (23)TABLE 12: SIM PIN DEFINITION (25)TABLE 13: PIN DESCRIPTION (AMPHENOL SIM CARD HOLDER) (26)TABLE 14: PCM PIN DEFINITION (27)TABLE 15: PCM MULTIPLEXING FUNCTION (27)TABLE 16: PCM SPECIFICATION (27)TABLE 17: SDIO PIN DEFINITION (28)TABLE 18: SDIO MULTIPLEXING FUNCTION (28)TABLE 19: I2C PIN DEFINITION (29)TABLE 20: I2C MULTIPLEXING FUNCTION (29)TABLE 21: GPIO PIN DEFINITION (29)TABLE 21: NETWORK STATUS INDICATION PIN STATUS (30)TABLE 22: FLIGHT MODE CONTROL FUNCTION (31)TABLE 23: PWM PIN DEFINITION (32)TABLE 24: LDO PIN DEFINITION (32)TABLE 25: RECOMMENDED PASSIVE ANTENNA CHARACTERISTICS (33)TABLE 26: RECOMMENDED ACTIVE ANTENNA CHARACTERISTICS (33)TABLE 27: ABSOLUTE MAXIMUM RATINGS (39)TABLE 28: OPERATING TEMPERATURE (39)TABLE 29: VDD_1V8 DOMAIN DIGITAL INTERFACE CHARACTERISTICS (GPIO, I2C, UART, PCM)* (39)TABLE 30: VDD_SD DOMAIN DIGITAL INTERFACE CHARACTERISTICS (SDIO)* (39)TABLE 31: SIM CARD INTERFACE CHARACTERISTICS (40)TABLE 32: V_USIM CHARACTERISTICS (40)TABLE 33: VDD_SD CHARACTERISTICS (40)TABLE 34: VDD_1V8 CHARACTERISTICS (41)TABLE 35: CURRENT CONSUMPTION (41)TABLE 36: ESD CHARACTERISTICS (TEMPERATURE: 25℃, HUMIDITY: 45 %) (43)TABLE 37: CONDUCTED OUTPUT POWER (43)TABLE 38: CONDUCTED RECEIVE SENSITIVITY (43)TABLE 39: SUPPORTED BAND (44)TABLE 40: MOISTURE CLASSIFICATION LEVEL AND FLOOR LIFE (46)TABLE 41: RELATED DOCUMENTS (47)TABLE 42: MULTIPLEXING FUNCTION LIST (48)TABLE 43: TERMS AND ABBREVIATIONS (49)TABLE 44: SAFETY CAUTION (51)Figure IndexFIGURE 1: SIM5350 FUNCTIONAL DIAGRAM (13)FIGURE 2: SIM5350 PIN OUT DIAGRAM (TOP PERSPECTIVE VIEW) (14)FIGURE 3: DIMENSIONS OF SIM5350 (UNIT: MM) (17)FIGURE 4: RECOMMENDED PCB FOOTPRINT (UNIT: MM) (18)FIGURE 5: VCC_BB &VCC_RF INPUT REFERENCE CIRCUIT (19)FIGURE 6: LDO POWER SUPPLY REFERENCE CIRCUIT (20)FIGURE 7: RESET INTERIOR CIRCUIT (20)FIGURE 8: RESET TIMING (20)FIGURE 9: USB REFERENCE CIRCUIT (22)FIGURE 10: SERIAL INTERFACE CONNECTION (23)FIGURE 11: RI BEHA VIOUR IN NULL MODEM (24)FIGURE 12: RI BEHA VIOUR IN FULL MODEM (24)FIGURE 13: RI BEHA VIOR AS A CALLER (24)FIGURE 14: SIM CARD HOLDER CIRCUIT (25)FIGURE 15: AMPHENOL C707 10M006 5122 SIM CARD HOLDER (26)FIGURE 16: PCM REFERENCE CIRCUIT (28)FIGURE 17: SDIO REFERENCE CIRCUIT (28)FIGURE 18: I2C REFERENCE CIRCUIT (29)FIGURE 19: NETLIGHT REFERENCE CIRCUIT (30)FIGURE 20: FLIGHT MODE SWITCH REFERENCE CIRCUIT (31)FIGURE 21: PWM REFERENCE CIRCUIT (32)FIGURE 22: MAIN AND DIVERSITY ANTENNA REFERENCE CIRCUIT (34)FIGURE 23: MAIN AND DIVERSITY ANTENNA SIMPLIFIED REFERENCE CIRCUIT (35)FIGURE 24: MODULE PIN ASSIGNMENT (TOP PERSPECTIVE VIEW) (36)FIGURE 25: ANTENNA LAYOUT DIAGRAM (37)FIGURE 26: POWER SUPPLY DIAGRAM (38)FIGURE 27: SIM5350 TOP AND BOTTOM VIEW (45)FIGURE 28: TYPICAL SOLDER REFLOW PROFILE (46)Version HistoryDate Version Description of change Author2013-08-15 1.00 Origin Yang HongliangWang Yang1.IntroductionThis document describes SIM5350 hardware interface in great details, which can help user to quickly understand SIM5350 interface specifications, electrical and mechanical details.2.SIM5350 OverviewSIM5350series support quad-band GSM/GPRS/EDGE and dual-band UMTS/HSDPA/HSUPA/HSPA+, which work on frequencies GSM850, EGSM900, DCS1800, PCS1900, WCDMA2100/900 and 2100/850 or 1900/850. The modules can be chosen based on the wireless network configuration. In this document, the entire radio band configuration of SIM5350 series is described in the following table.Table 1: SIM5350 Series Frequency Bandsl SDIO Interfacel I2C Interfacel GPIOl PWMl LDO Power Output2.1.SIM5350 Key Features Table 2: SIM5350 Key Featuresl Storage temperature: -45℃~ +90℃Physical characteristics Size: 20*30*2.4mm Weight: 3gFirmware upgrade Firmware upgrade over USB interfaceTable 3: Coding schemes and maximum net data rates over air interfaceFigure 1: SIM5350 Functional Diagram3.Package Information3.1.Pin Out DiagramFigure 2: SIM5350 Pin Out Diagram (Top Perspective View)3.2.P in DescriptionTable 5: Pin Description3.3.P ackage DimensionsFigure 3: Dimensions of SIM5350 (Unit: mm)Figure 4: Recommended PCB Footprint (Unit: mm)4.A pplication Interface4.1.P ower SupplyThe recommended power supply voltage of SIM5350 is 3.3V+0.3V/-0.1V, including VCC_RF and VCC_BB. The transmitting burst will cause voltage drop and the power supply must be able to provide sufficient current up to2A. For the VCC_RF input, 2 bypass capacitors (low ESR) such as 220 µF are strongly recommended. Increase the 33PF and 10PF capacitors can effectively eliminate the high frequency interference. A 5.1V/500mW zenerThe following figure is a reference design of +5V input power supply linear regulator with +3.3V output.Figure 6: LDO power supply Reference Circuit4.2.Hardware ResetThe RESET pin could be used to reset the module. This function is used as an emergency reset. User can pull the RESET pin to ground, then the module will reset. Reset pin is already pulled up in module, so the external pull-up resistor is not necessary. The following figure is the interior circuit of reset.Figure 8: Reset timing4.3.P ower Saving ModeSIM5350 has two power saving modes: minimum functionality mode and sleep mode. When SIM5350 is in sleep mode and minimum functionality mode, the current of module is lowest.4.3.1.Minimum Functionality Mode and Sleep ModeThe AT command “AT+CFUN=<fun>” can be used to set SIM5350 into minimum functionality.There are three functionality modes, which could be set by the AT command “AT+CFUN=<fun>”. The command provides the choice of the functionality levels <fun>=0, 1, 4.l Receive a voice or data call from network.l Receive a SMS from network.l Receive external interruptB 2.0SIM5350 could achieve data transfer, voice call, debug and software download, etc, through USB interface. When module is powered on and connected USB_DP, USB_DM and GND to USB HOST, and drivers are installed successfully, then 3 COM port, 1 modem port and 1 removable disk could be recognized by USB HOST. The following diagram is the recommended connection circuit.Figure 9: USB Reference CircuitThe TVS on USB data lines should be less than 5pf, and traced by 90Ohm+/-10% differential impedance.B Application PortModule could be controlled by sending AT command to USB Application Port.B Debug PortModule could be debugged by grabbing log through USB Debug Port.B Speech PortVoice call could be achieved through USB Speech Port.4.4.4.ModemModule could transfer data through Modem.4.4.5.Removable DiskSDIO could be controlled through Removable disk.4.4.6.Firmware UpdateIf users need to upgrade through USB port, it is necessary to power on SIM5350 first, then connect USB_DP, USB_DM, GND to USB HOST, then send AT command “AT+ESWM=3,0” to switch mode for download mode and reset module, when module will enter USB download mode automatically.Note: About AT command “AT+ESWM=3,0”, for more details, please refer to document [1].4.5.Serial InterfaceSIM5350 provides one unbalanced asynchronous serial interface. The module is designed as a DCE (Data Communication Equipment). The following table shows pin definition about serial interface.Table 9: Serial Interface Pin DefinitionPin Name Pin Number DescriptionUART_TXD 17 Transmit dataUART_RXD 18 Receive dataUART_CTS 19 Clear to sendUART_RTS 20 Request to sendUART_DCD 35 Data carrier detectUART_RI 36 Ring indicator/wake up host（DTE）UART_DTR 37 Data terminal ready/wake up SIM5350(DCE)Note: Hardware flow control is disabled by default. The AT command “AT+IFC=2,2” can enable hardware flow control. The AT command “AT+IFC=0,0” can disable hardware flow control. For more details please refer to document [1]Serial interface multiplexing function is described in the following table.Figure 10: Serial Interface Connection4.5.3.RI BehaviorsIf UART interface is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until the master clears the interrupt event with AT command.Figure 12: RI behaviour in FULL ModemFigure 13: RI behavior as a caller4.6.SIM Card InterfaceThe SIM interface complies with the GSM Phase 1 specification and the new GSM Phase 2+ specification for FAST 64 kbps SIM card. Both 1.8V and 3.0V SIM card are supported. The SIM interface is powered from an internal regulator in the module.Table 11: SIM Pin Definitionstrongly recommended to follow these guidelines while designing:l Make sure that SIM card holder stays away from GSM antenna while in PCB layout;l SIM traces should be kept away from RF lines, VBAT and high-speed signal lines, and must be as short as possible;l Keep good connectivity between SIM holder’s GND and module’s GND;l It is recommended to do some protection on SIMCLK to keep away from the interference;l It is recommended to place a 1uF capacitor on VSIM line and keep close to the holder;l Place some TVS, the parasitic capacitance should not exceed 50pF, and cascade 22Ohm resistor to enhance ESD protection.4.6.3.Design Considerations for SIM Card HolderAmphenol C707 10M006 5122 is recommended to use for 6-pin SIM card holder. User can visit http: // for more information about the holder.4.7.PCM InterfaceSIM5350provides a hardware PCM interface.Table 13: PCM Pin DefinitionPin Name Pin Number DescriptionPCM_SYNC 9 PCM synchrony, Internal 4.7K pull-down for system configure PCM_DIN 10 PCM data input,PCM_DOUT 11 PCM data output, Internal 4.7K pull-down for system configure PCM_CLK 12 PCM clockNote: If PCM_SYNC and PCM_DOUT are unused, please keep them open.Figure 16: PCM Reference Circuit0R resistors could be added in PCM lines for debugging.4.8.SDIO InterfaceSIM5350provides a hardware SDIO2.0 interface, which fully supports the SD memory card bus protocol as defined in SD Memory Card Specification Part 1 Physical Layer Specification version 2.0, and also partially supports SDIO card specification version 2.0.Please refer to the following table for SDIO pin definition.Figure 17: SDIO Reference Circuit0R resistors could be added in SDIO lines for debugging.4.9.I2C BUSSIM5350 provides an I2C interface, which supports I2C protocol fully. Please refer to the following table for I2C pin definition.Table 18: I2C Pin DefinitionFigure 18: I2C Reference Circuit0R resistors could be added in I2C lines for debugging.4.10.G PIOSIM5350 provides up to 12 GPIO pins. All GPIOs can be configured as inputs or outputs by AT command. Please refer to document [1] for details.Table 20: GPIO Pin DefinitionFigure 19: NETLIGHT Reference Circuit4.10.2.Controllable Clock OutputThe GPIO49 pin can be used to output a clock by default. It can be used for PCM codec chip clock source.4.10.3.Flight Mode ControlThe EINT0 pin controls SIM5350 module to enter or exit the Flight mode by default. In Flight mode, SIM5350 closes RF function to prevent interference with other equipments or minimize current consumption. Bidirectional ESD protection component is suggested to add near the switch.PWM output discrete frequency varies from 0 to 80MHz and duty cycle varies from 0% to 100%. But the frequency and duty cycle must meet the following conditions:l PWM output frequency: F = CLK/(PWM_COUNT+1);l PWM output duty cycle: D = PWM_THRES/(PWM_COUNT+1);l CLK could only be selected among 4KHZ, 8KHZ, 16KHZ, and 32KHZ, 10MHZ, 20MHZ, 40MHZ and 80MHZ.l The range of PWM_COUNT and PWM_THRES is 0 to 0x1FFF.Note: The PWM output frequency and duty cycle could be set with AT command “AT+CPWMCLKS” and “AT+CPWM”. For details, please refer to document [1].A typical buzzer circuit is in the following figure.4.13.A ntenna InterfaceSIM5350 has 2 antennas, one of which is the main GSM/WCDMA antenna; the other is WCDMA diversity antenna.4.13.1.Recommended Antenna CharacteristicsRecommended antenna characteristics of SIM5350 are described by two following tables.Table 25: Recommended Passive Antenna CharacteristicsPassive Recommended standardDirection omnidirectionalGain > -3dBi (Avg)Input impedance 50 ohmEfficiency> 50 %VSWR < 2isTwo RF connectors and two matching networks should be added between module pads to antenna pads, for antenna debugging and testing. Please refer to the following recommended design. In the following figure, the main antenna matching network contains R101, C101 and C102, and the diversity antenna matching network contains R102, C103 and C104, the value of the 6 passive devices will be adjusted and fixed after PCB and antenna selected. OR resistors are mounted on R101 and R102, and C101, C102, C103 and C104 are not mounted on by default.Antenna circuit could be simplified for space constraints or other reasons. Please refer to the following simplified circuit.5.PCB DesignElectronic products with good performance depend on good PCB design in a manner. Products without good PCB design could appear many issues, for example TDD noise, SIM card can’t be found, etc. If device placement could be dealt with reasonably, traces could be optimized, the development cycle time and cost will be reduced5.1Module Pin AssignmentFollowing figure is the overview of module pin assignment.Figure 24: Module Pin Assignment (Top Perspective View)5.2PCB Design ProposalsThe circuits mentioned by following sections should be dealt with carefully.5.2.1.AntennaEnsure the trace from SIM5350 to antenna as short as possible. In addition, keep the distance between primary antenna and diversity antenna to be enough to avoid interference. Keep the cable of connecting antenna and PCB away from PCB circuits, especially SMPS and SIM card. The schematic diagram is shown as below:Figure 25: Antenna layout diagramThe VCC_RF and VCC_BB nets should be traced as short and wide as possible. The zener diode and capacitors should be placed on VCC_RF and VCC_BB nets directly. Power supply cycle should be optimized as small asFigure 26: Power Supply diagram5.2.3.SIM Card HolderSIM card holder normally is the biggest device on board, the SIM circuit is easily interfered, so SIM card holder should be kept away from the RF antenna, and placed far from module as much as possible. The clock signal, data signal, reset signal and power supply lines of SIM circuit should be far away from power and high speed signal lines.B 2.0USB data lines should be traced by 90Ohm+/-10% differential impedance as short as possible, and be surrounded by reference ground from left and right, upper and lower. One of the reference ground planes should be kept complete, the incomplete area of the other planes should be smallest.5.2.5.OthersThe serial interface, SDIO interface and PCM interface lines should be traced by group and as short as possible.6.Electrical, Reliability and Radio Characteristics6.1Absolute Maximum RatingsThe absolute maximum ratings are described by the following table. Module may be damaged beyond these ratings.Table 30: VDD_SD Domain Digital Interface Characteristics (SDIO)*Symbol Parameter Min Type Max UnitV IH High-level input voltage 0.8*VDD_SD VDD_SD VDD_SD+0.3 VV IL Low-level input voltage -0.3 0 0.2*VDD_SD VV OH High-level output voltage 2.38 VDD_SD - VV OL Low-level output voltage - 0 0.42 V Note: *These parameters apply to SDIO.6.4SIM Card Interface CharacteristicsTable 31: SIM Card Interface Characteristics6.6VDD_SD CharacteristicsTable 33: VDD_SD CharacteristicsSymbol Parameter Min Type Max Unit2.65 2.80 2.95 V 2.853.0 3.15 V 2.845 3.1 3.155 V V OOutput voltage3.135 3.3 3.465 V I O Output current--100mA6.7 VDD_1V8 Characteristicsthe mass production stage, there may be differences among each individual.6.9Electro-Static DischargeSIM5350 is an ESD sensitive component, so more attention should be paid to the procedure of handling and packaging. The ESD test results are shown in the following table.℃Table 36: ESD characteristics (Temperature: 25, Humidity: 45 %)Pin Contact discharge Air discharge VCC_RF,VCC_BB ±5KV ±10KVGND ±5KV ±10KVRXD, TXD ±3KV ±6KVAntenna port ±4KV ±8KVUSB_DP,USB_DM ±3KV ±6KVRESET ±3KV ±6KVRemark: The data in above table are got at static condition.6.10.3.Supported BandThe following table shows SIM5350 supported band, which complies with 3GPP spec. Table 39: Supported Band7.Manufacturing7.1.SIM5350 Top and Bottom ViewFigure 27: SIM5350 Top and Bottom View7.2.Typical Solder Reflow Profile8.AppendixI.Related Documents Table 41: Related DocumentsII.Multiplexing Function List Table 42: Multiplexing Function ListIII.T erms and Abbreviations Table 43: Terms and Abbreviations。

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硬件设计技术手册

硬件设计技术手册

硬件设计技术手册第一章：引言硬件设计技术手册是一份详细介绍硬件设计技术的文档，旨在为硬件设计工程师提供指导和帮助。

本手册将涵盖硬件设计的各个方面，包括电路设计、PCB设计、硬件测试等内容。

它将涵盖从概念证明到制造的整个硬件生命周期。

第二章：电路设计2.1概述电路设计是硬件设计的核心部分之一。

它包括了模拟电路设计、数字电路设计和混合信号电路设计。

在电路设计过程中，需要了解电路理论、器件特性、损耗、噪音、干扰、时序等相关知识。

2.2模拟电路设计模拟电路设计涵盖了大量的电路设计技术。

包括了放大器设计、滤波器设计、参考源设计等。

此外，还需要熟悉各种电路拓扑结构，并能够根据设备需求进行相应的选择。

2.3数字电路设计数字电路设计应该覆盖数字电路家族的所有基本逻辑门，芯片电路整合、数码电路整合等，需要掌握各类逻辑设计语言和软件，如Verilog、VHDL及各种模拟器等。

2.4混合信号电路设计混合信号电路设计在数字电路和模拟电路的基础上实现模拟和数字混合信号的融合，其中包含硬件的AD、DA转换、软件的仿真等方面的内容。

第三章：PCB设计3.1概述电路板(PCB)是一个重要的硬件配件，PCB的设计影响到硬件的性能、稳定性和可靠性。

在PCB设计中，一定要考虑到PCB板形、布局、层数、连线方式以及PCB排布等各个方面的内容。

3.2PCB设计工具常见的PCB设计工具有Altium Designer、CircuitMaker、Eagle等。

其中Altium Designer是最流行的PCB设计工具之一，其拥有强大的功能和易用的界面，可以帮助用户更快地完成PCB设计。

3.3PCB设计规范在PCB设计中，必须遵守一些规范，以确保PCB具有良好的尺寸、性能和可靠性。

其中包括电路板层数、PCB板形、PCB排布规律、布线方向等。

第四章：硬件测试4.1概述硬件测试是硬件设计的最后一个阶段，目的是确保硬件符合预期的性能和规格。

测试过程中的各种测试手段将涵盖到电路板的功能测试、稳定性测试、可靠性测试以及兼容性测试等内容。

MOXA UC-8540 Series 硬件用户手册说明书

MOXA UC-8540 Series 硬件用户手册说明书

UC-8540 Series Hardware User’s ManualVersion 1.1, November 2022/product© 2022 Moxa Inc. All rights reserved.UC-8540 Series Hardware User’s Manual The software described in this manual is furnished under a license agreement and may be used only in accordancewith the terms of that agreement.Copyright Notice© 2022 Moxa Inc. All rights reserved.TrademarksThe MOXA logo is a registered trademark of Moxa Inc.All other trademarks or registered marks in this manual belong to their respective manufacturers.DisclaimerInformation in this document is subject to change without notice and does not represent a commitment on the part of Moxa.Moxa provides this document as is, without warranty of any kind, either expressed or implied, including, but not limited to, its particular purpose. Moxa reserves the right to make improvements and/or changes to this manual, or to the products and/or the programs described in this manual, at any time.Information provided in this manual is intended to be accurate and reliable. However, Moxa assumes no responsibility for its use, or for any infringements on the rights of third parties that may result from its use.This product might include unintentional technical or typographical errors. Changes are periodically made to the information herein to correct such errors, and these changes are incorporated into new editions of the publication.Technical Support Contact Information/supportMoxa AmericasToll-free: 1-888-669-2872 Tel: +1-714-528-6777 Fax: +1-714-528-6778Moxa China (Shanghai office) Toll-free: 800-820-5036Tel: +86-21-5258-9955 Fax: +86-21-5258-5505Moxa EuropeTel: +49-89-3 70 03 99-0 Fax: +49-89-3 70 03 99-99Moxa Asia-PacificTel: +886-2-8919-1230 Fax: +886-2-8919-1231Moxa IndiaTel: +91-80-4172-9088 Fax: +91-80-4132-1045Table of Contents1.Introduction ...................................................................................................................................... 1-1Model Descriptions and Package Checklist .............................................................................................. 1-2 Product Features ................................................................................................................................ 1-2 Hardware Specifications ...................................................................................................................... 1-3 Hardware Block Diagram ..................................................................................................................... 1-3 2.Hardware Introduction...................................................................................................................... 2-1Appearance ........................................................................................................................................ 2-2 Dimensions ........................................................................................................................................ 2-2 LED Indicators .................................................................................................................................... 2-3 Reset Button ...................................................................................................................................... 2-4 3.Hardware Connection Description ..................................................................................................... 3-1Installing the UC-8540 Series ............................................................................................................... 3-2 Wiring Requirements ........................................................................................................................... 3-2 Connecting the Power .................................................................................................................. 3-3Grounding the Unit ...................................................................................................................... 3-3Connecting Data Transmission Cables ............................................................................................ 3-4Connecting Wi-Fi/Cellular Modules and Antennas ............................................................................. 3-6Installing SIM Cards for the Cellular Modules .................................................................................. 3-8Installing the mSATA Module ........................................................................................................ 3-9Replacing the RTC Battery ............................................................................................................ 3-91Introduction Thank you for using Moxa’s UC-8540 Series computer. The UC-8540 Series computer is a programmable communication-centric gateway offering a rich variety of communication interfaces such as Ethernet, wireless, and serial ports. This EN 50155-compliant computer is built for rail applications and comes with multiple wireless WAN gateway interfaces making it an ideal choice for building wireless communication infrastructure with 802.11 a/b/g/n/ac, and for LTE data collection and transmission.This computer runs on the Debian Linux operating system, providing a powerful communication platform without generating too much heat, even when loaded with heavy application tasks. In addition, the mSATA socket helps you easily expand the storage capacity for large-scale data acquisition.This chapter describes the product package checklist, product features, and hardware specifications.The following topics are covered in this chapter:❒Model Descriptions and Package Checklist❒Product Features❒Hardware Specifications❒Hardware Block DiagramModel Descriptions and Package Checklist The UC-8540 Series consists of the following models:•UC-8540-LX: Programmable multiple-wireless computing platform for rail onboard applications, supporting Wi-Fi and LTE modules, with a -25 to 55°C operating temperature range•UC-8540-T-LX: Programmable multiple-wireless computing platform for rail onboard applications, supporting Wi-Fi and LTE modules, with a -40 to 70°C operating temperature range •UC-8540-T-CT-LX: Programmable multiple-wireless computing platform for rail onboard applications, supporting Wi-Fi and LTE modules, with a -40 to 70°C operating temperature range, and conformalcoatingThe UC-8540 Series computer is shipped with the following items:•UC-8540 Series computer•Mounting kits•CBL-4PINDB9F-100: 4-pin pin header to DB9 female console port cable, 100 cm•Quick Installation Guide (printed)•Warranty cardProduct FeaturesThe UC-8540 Series computer includes the following features:•Armv7 Cortex-A7 dual-core 1 GHz processor• 1 GB DDR3L SDRAM•8 GB eMMC for OS• 1 mSATA slot for expansion storage• 2 auto-sensing 10/100/1000 Mbps Ethernet M12 ports• 1 USB 3.0/2.0 host with Type A connector• 2 PCIe mini slots (1 PCIe/USB 2.0 and 1 USB 2.0 signals)•Isolated power input with a wide range of 24 to 110 VDC•TPM 2.0 (HW V1.1.0 and later)Hardware SpecificationsNOTE The latest specifications for Moxa’s products can be found at https://. Hardware Block Diagram2Hardware Introduction The UC-8540 computer is compact and designed to be rugged enough for industrial applications. This chapter provides information on the appearance and dimensions of the UC-8540 and describes the LED indicators, reset button, and RTC that can help you monitor system performance and identify issues. The serial ports on the UC-8540 allow you to connect different devices, and the reliable and stable hardware platform lets you devote your attention to developing your applications.The following topics are covered in this chapter:❒Appearance❒Dimensions❒LED Indicators❒Reset ButtonAppearanceDimensionsUnit = mm (in)LED IndicatorsLED NameStatus FunctionP Green Power is onOff No power input or any other power-input errorR Green System is readyOff System is booting up, OS boot-up failure, or any other systeminitialization errorEthernet (located next to the Ethernet ports) Green Steady On: 100 Mbps Ethernet linkBlinking: Data transmission is in progressYellow Steady On: 1000 Mbps Ethernet linkBlinking: Data transmission is in progressOff Data transmission speed at 10 Mbps or the data cable is not connectedSerial Green Tx: Data transmission is in progressYellow Rx: Receiving DataOff No operation on the serial portsS Green Data is being accessed from either the eMMC or the mSATA module Off No data is being accessedPGM Red Programmable LED for user-defined functionWireless Green The number of glowing LEDs indicate the wireless signal strength asfollows:3 Green: Excellent2 Green: Good1 Green: PoorOff No wireless signalReset ButtonPress the Reset button on the front panel of the UC-8540 computer to set the system to the factory default values and reboot the system automatically. The R LED will flash for 5 seconds and then maintain a steady glow when the system has rebooted. All system configurations will be reset to the factory default once thecomputer restarts.3 Hardware Connection DescriptionIn this chapter, we show how to connect the UC-8540 computer to the network and to various devices.The following topics are covered in this chapter:❒Installing the UC-8540 Series❒Wiring RequirementsConnecting the PowerGrounding the UnitConnecting Data Transmission CablesConnecting Wi-Fi/Cellular Modules and AntennasInstalling SIM Cards for the Cellular ModulesInstalling the mSATA ModuleReplacing the RTC BatteryInstalling the UC-8540 SeriesWall or Desk MountingUse two screws per side to fasten the mounting kits on to the UC-8540 computer and then mount the computer on to a wall or desk.Wiring RequirementsBe sure to read and follow these common safety precautions before proceeding with the installation of any electronic device:• Use separate paths to route wiring for power and devices. If power wiring and device wiring paths mustcross, make sure the wires are perpendicular at the intersection point.NOTEDo not run signal or communication wiring together with power wiring in the same wire conduit. To avoid interference, wires with different signal characteristics should be routed separately.• Use the type of signal transmitted through a wire to determine which wires should be kept separate. Therule of thumb is that wiring that shares similar electrical characteristics can be bundled together. • Keep input wiring and output wiring separate.•It is advisable to label the wiring to all devices in the system for easy identification.Wall MountingDesk MountingFasten the screws to the back panel of the UC-8540Fasten the screws to the bottom panel of the UC-8540Connecting the PowerConnect the 24 to 110 VDC power line with M12 A-coded connector to the UC-8540 Series computer. If the power is supplied properly, theP LED will glow a solid green after a 25 to 30-second delay. The power input location and pin definition are shown in the following figures:Grounding the UnitGrounding and wire routing help limit the effects of noise due to electromagnetic interference (EMI). Run the ground connection from the ground screw to the grounding surface prior to connecting the power.The grounding connector is located on the front panel. Connect the grounding wire to an appropriate grounded metal surface.Power Input(24-110 VDC, M12)Grounding ConnectorConnecting Data Transmission CablesIn this section, we describe how to connect the UC-8540 embedded computer to a network and serial devices.Connecting to an Ethernet NetworkConnect your network cable to the embedded computer’s Ethernet port. The other end of the cable should be connected to your Ethernet network. When the cable is properly connected, the green LED corresponding to the Ethernet port turns on indicating a valid connection.Two 10/100/1000 Mbps Ethernet ports with M12 X-coded connectors are located on the rear panel of the UC-8540 computer. See the following figure for the location of the Ethernet ports and the pin assignments:NOTEIf you are using your own Ethernet cable, make sure that the pin assignment on the connector of the Ethernet cable matches the pin assignment shown below.Connecting a Serial DeviceUse serial cables to connect your serial devices to the computer’s serial ports. The serial port with DB9 interface can be configured for RS-232, RS-422, or RS-485 communication. The pin location and assignment of the serial ports are shown in the following diagrams:LAN Ports x 2, LEDs x 4 (10/100/1000 Mbps,M12)Pin RS-232 RS-422 RS-485(4-wire)RS-485(2-wire)1 DCD TxDA(-) TxDA(-) -2 RxD TxDB(+) TxDB(+) -3 TxD RxDB(+) RxDB(+) DataB(+)4 DTR RxDA(-) RxDA(-) DataA(-)5 GND GND GND GND6 DSR - - -7 RTS - - -8 CTS - - -Connecting a USB DeviceThe UC-8540 computer is provided with a USB 3.0 port on the front panel for connecting a USB device.Serial Ports(RS-232/422/485, DB9)USB Port x 1(USB 3.0, type A)Connecting Wi-Fi/Cellular Modules and AntennasThe UC-8540 computer is provided with two sets of QMA antenna holes for installing antennas for the Wi-Fi and cellular modules. Unfasten the two screws on the side panel and lift up the panel to check the location of the Wi-Fi/cellular module sockets.Socket Name Usage CellularCellular moduleWi-FiWi-Fi ModuleTo install a wireless (Wi-Fi/cellular) module, do the following: 1. Remove the plastic protective film on the thermal pads.The thermal pads come attached to the wireless module.SIM Slots x 2 (Micro SIM)2.Insert the wireless module in the designated socket and tighten the two screws on the module.3.Attach the flat end of the antenna cable to the connector marked MAIN on the module.Follow the procedure described above to attach the AUX antenna cable.If your UC-8540 is not a standalone GPS version, you can attach the GPS antenna cable to the connector marked GPS on the module.Refer to the following figure provided on the front panel to identify the antenna mounting holes for the wireless modules.4. Connect the antennas to the connectors on the front panel.Refer to the following figure for the specific location of each antenna connector, including a connector for a GPS antennaUse the procedure described above to install other Wi-Fi or cellular modulesNOTEThe Wi-Fi module installed in the socket requires three antennas. Ensure all three antennas are installed and secured properly before you use the module.Installing SIM Cards for the Cellular ModulesThe cellular module in the UC-8540 supports 2 Micro SIM cards. To install Micro SIM cards for the cellular modules, do the following:1. Open the case of the Micro SIM card socket.2. Insert the Micro SIM-card into the socket in the correct direction.To remove the SIM card, push it down to release the card.Wi-Fi Antenna QMA Connectors x 3Cellular AntennaQMA Connectors x 2GPS AntennaTNC ConnectorInstalling the mSATA ModuleThe UC-8540 computer is provided with one storage socket for installing a mSATA module.To install the mSATA module, do the following:1.Unfasten the screws on the cover of the mSATA socket located on the bottom panel of the UC-8540.2.Insert the mSATA module onto the socket and fasten the two screws on the module to secure the module.3.Replace the cover and faster the screws on the cover.Replacing the RTC BatteryThe RTC battery (BR2032) socket is located beside the mSATA socket, as shown below:。

F8L10D 系列 LoRa 模块用户硬件设计手册说明书

F8L10D 系列 LoRa 模块用户硬件设计手册说明书

本手册适用于F8L10D 系列LoRa 模块厦门四信通信科技有限公司Add：厦门市集美区软件园三期诚毅大街370号A06栋11层客户热线：400-8838-199电话：+86-592-6300320传真：+86-592-5912735网址F8L10D LoRa 模块用户硬件设计手册文档版本密级V2.0.1产品名称：F8L10D共29页文件修定记录日期版本号备注作者2016-09-14V1.0.0初始版本XQ.QIU 2017-07-04V1.1.0修改硬件设计部分参数XQ.QIU 2017-09-23V2.0.0更新地址Faine2017-11-23V2.0.1修改Uart接口RX引脚编号YSL著作权声明本文档所载的所有材料或内容受版权法的保护，所有版权由厦门四信通信科技有限公司拥有，但注明引用其他方的内容除外。

未经四信公司书面许可，任何人不得将本文档上的任何内容以任何方式进行复制、经销、翻印、连接、传送等任何商业目的的使用，但对于非商业目的的、个人使用的下载或打印（条件是不得修改，且须保留该材料中的版权说明或其他所有权的说明）除外。

商标声明Four-Faith、四信、、、均系厦门四信通信科技有限公司注册商标，未经事先书面许可，任何人不得以任何方式使用四信名称及四信的商标、标记。

目录目录 (4)前言 (5)1概述 (6)1.1技术规格 (6)1.1.1规格说明 (6)1.1.2基本功能 (6)1.1.3模块接口 (7)1.1.4LoRa参数 (7)1.1.5供电 (7)1.1.6功耗 (8)1.2相关文档 (8)1.3缩略语 (8)2F8L10D模块产品框图 (11)3管脚描述 (12)4硬件接口描述 (14)4.1概述 (14)4.2电源 (14)4.3UART接口 (15)4.3.1硬件连接 (15)4.3.2通讯传输字节格式 (16)4.3.2F8L10D通信对象为PC机 (17)4.3.2F8L10D通信对象为工控机 (17)4.4复位 (17)4.5GPIO口 (18)4.5.1控制LED灯 (19)4.5.2ADC采集参考电路 (19)4.5.3IO口保护电路 (20)4.6模块休眠 (20)4.6.1休眠控制脚SLEEP_RQ (21)4.9LoRa通过MCU对模块升级 (21)4.9.1双串口升级模式 (21)4.9.2MCU单串口升级模式 (22)4.10天线 (22)4.10.1F8L10D兼容2种天线模式： (22)4.10.2天线安装 (23)5模块硬件设计 (25)5.1硬件设计 (25)5.2模块封装尺寸 (25)5.3Re-flow回流焊温度范围 (27)订购信息 (29)前言概述本文档适用的产品是：F8L10D系列模块。

imx51硬件设计指南

imx51硬件设计指南

imx51硬件设计指南i.MX51 EVK HardwareUser’s GuideDocument Number: - 924 - 76363Rev. 1.609/2009Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use ascomponents in systems intended for surgical implant into the body, or otherapplications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use FreescaleSemiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.Learn More: For more information about Freescale products, please visit .Freescale? and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ? Freescale Semiconductor, Inc. 2009. All rights reserved.How to Reach Us:Home Page:E-mail:*********************USA/Europe or Locations Not Listed:Freescale SemiconductorTechnical Information Center, CH370 1300 N. Alma SchoolRoadChandler, Arizona 85224+1-800-521-6274 or +1-480-768-2130 *********************Europe, Middle East, and Africa:Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 781829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French)*********************Japan:Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan0120 191014 or +81 3 5437 9125 ***************************Asia/Pacific:Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King StreetTai Po Industrial EstateTai Po, N.T., Hong Kong +800 2666 8080**************************For Literature Requests Only:Freescale Semiconductor Literature Distribution Center P.O. Box 5405Denver, Colorado 802171-800-441-2447 or 303-675-2140 Fax: 303-675-2150*********************************************Table of ContentsAbout This Book (1)1. General Information (4)2. i.MX51 Processor (8)3. DDR II SDRAM (9)4. SPI NOR Flash (10)5. Stereo Audio Codec & Audio extension Connector (11)6. Touch screen controller (12)7. USB OTG and Host (13)8. CMOS Sensor (14)9. VGA and DVI out (15)10. LCD Connectors (16)11. MMC/SD Interface (19)12. Fast Ethernet Connect (20)13. FM (21)14. Power Supply (22)14.1 Power of i.MX51 IO bank (22)14.2 Power block diagram (23)14.3 Power Measurement Point (25)15. Accessory boards for i.MX51 EVK (26)15.1 Expansion Card (26)15.2 LCD Module Card (27)15. Boot mode setting for i.MX51 EVK (29)About This BookThis manual explains how to connect and operate the i.MX51 EVK System.AudienceThis document is intended for software, hardware, and system engineers who are planning to use the product and want to understand more about the productRevision History2009.08 Ver1.02009.09 Ver2.0Reference Documents1.MCIMX51EVKJ Product Preview (Rev. 0) , Freescale Semiconductor, 2009.012.Atlas AP Lite MC13892 Reference Manual (Rev 2.0), Freescale Semiconductor, 2008.113.MC34713 Datasheet(Rev4.0), Freescale Semiconductor, 2007.054.SGTL5000 Datasheet, SigmaTel, 2007.045.EDE1116AEBG, 1Gb DDR2 SDRAM Specification, Elpida, 2008.016.SD Memory Card Specifications, SD Group, 2001.04.Acronyms and AbbreviationsThe following acronyms and abbreviations are used in this manual. This list does not include signal, register, and software mnemonics.ATA Hard drive interface specCD Compact DiskCMOS Complementary Metal Oxide SemiconductorCPLD Custom Programmed Logic DevicesCPU Central Processing UnitCSI Camera Sensor ImagingCSPI Serial Peripheral InterfaceDCE Data Communications EquipmentDDR Double Data RateDIP Dual In-line PackageDMA Direct Memory AccessDTE Data Terminal EquipmentDUART Dual Universal Asynchronous Receiver/TransmitterEEPROM Electrically Erasable Programmable Read Only Memory EPROM Erasable Programmable Read Only MemoryFIR Infra RedGPIO General Purpose Input/OutputGPO General Purpose OutputI2C Inter-Integrated CircuitICE In-Circuit EmulatorI/O Input/OutputIrDA Infrared Data AssociationISA Instrumentation, System, and Automation Society JTAG Joint Test Access GroupLAN Local Area NetworkLCD Liquid Crystal DisplayLED Light Emitting DiodeMB MegabyteMCU Microcontroller UnitMMC Multi-media CardMCP Multi-chip productMS Memory StickNVRAM Non-volatile Random Access MemoryOTG On the GoPC Personal ComputerPCMCIA Personal Computer Memory Card International Association PCB Printed Circuit BoardPHY Physical interfacePOR Power on ResetPSRAM Pseudo Random Access MemoryPWM Pulse Width ModulationQVGA Graphics AdapterRAM Random Access MemorySD SanDisk (Smart Media)SDRAM Synchronous Dynamic Random Access MemorySI System International (international system of units and measures) SIMM Single In-Line Memory ModuleSPST Single Pole Single ThrowSSI2 Synchronous Serial InterfaceTFT Thin Film TransistorUART Universal Asynchronous Receiver/TransmitterUSB Universal Serial Bus1. General InformationThe i.MX51 EVK architecture is different form 3DS. It is only one board including CPU and other peripheral blocks. Also it can connect many peripheral cards for expansion functions. Figure 1-1 and Figure 1-2 show the top view and bottom view of i.MX51 EVK board.Figure 1-1: Top view of i.MX51 EVKLVDSDVI ConnectorUARTPowerJACKLCD ModuleCard ConnectorS1 Boot SwitchEthernet ConnectoDual USBAMicroUSB MIC In Jack MMAudioJackMini PCI Connector Expansion Card ConnectorJTAGLVDSSATAConnectorMicrophoneConnectorSpeakerConnector MMC/SDConnectorKeyBoardConnector USB CameraConnectorFigure 1-2: Bottom view of i.MX51 EVKFigure 1-3 shows Block diagram of i.MX51 EVK board.Characteristic Specifications Clock Selectable 32.768KHz or 24 MHzTemperature:Operating -10 °C to + 50 °CStorage-40 °C to +85 °CRelative Humidity 0 to 90% (noncondensing)****************************Dimension 4.724 inch × 4.724 inchTable 1-1: SpecificationsCAUTIONNever supply more than +5.0V power to the i.MX51 EVK.Doing so can damage board components.2. i.MX51 ProcessorThe i.MX51 multimedia applications processor represents Freescale Semiconductor’s latest addition to a growing familyof multimedia-focused products offering high performance processing optimized for lowest power consumption.The i.MX51 EVK platform is intended to support the followings:Multi-standard Audio playbackMulti-standard Video Playback of 30fps at D1 (720×576) resolutionOpen OS support (Linux, WinCE, Other auto RTOS)Figure 2-1: i.MX51 Block Diagram3. DDR II SDRAMThere are total 4x128MB DDR II SDRAM, the part numberEDE1116AEBG-6E-F from Elpida, each is organized as 8M words × 16 bits × 8 banks. The key feature is:tRC(min)tRFC(min) tRP(min) tRCD(min) Speed CASlatency5(tCK) 127.5(ns) 15(ns) 15(ns) 60(ns) DDR2-6675-5-5Figure 3-1: Connection between i.MX51 and DDR IIThe bus width is 32bit.The clock is 200MHz.The DDR II works at 1.8V.The ODT (on-die-termination) is disabled in default.4. SPI NOR Flashi.MX51 has the SPI boot mode. A 4MB SPI NOR Flash is integrated on i.MX51 EVK. Costumer can flash the boot code into the SPI NOR Flash and choose SPI boot mode by configuring theSW1 setting on board.Figure 4-1: Connection between i.MX51 and SPI NOR FLASH1.SPI NOR Flash works at2.775V.2.SPI NOR Flash connect to SPI1, it is able to be used as boot device.5. Stereo Audio Codec & Audio extension ConnectorA stereo automotive qualified audio codec is integrated on i.MX51 EVK; the part number is SGTL5000 from SigmaTel. The SGTL5000 uses 26MHz clock which can come from external oscillator (Y2) on board as its MCLK. It is connected to I2S interface to i.MX51 as audio stream path and configured byi.MX51 through I2C2.Figure 5-1: Connection of i.MX51 and SGTL5000The SGTL5000 is a low power stereo codec with integrated headphone amplifier. It is designed to provide a complete audio solution for portable products needing line-in, mic-in (mic bias only available in 32QFN version), line-out, headphone-out, and digital I/O.6. Touch screen controlleri.MX51 EVK supports 4-wire touch screen controller which is controlled by ATLAS AP LITE.Figure 6-1: Touch screen controlThere is no LCD panel by default. The 4 wire touch control signals are connected to LCD Module card connector (J18). It can support touch screen function for kinds of LCD panels on display card for i.MX51 EVK.7. USB OTG and Hosti.MX51 has on-chip USB PHY for USB2.0 high speed which can support USB OTG. Costumer can just add an USB OTG connector on board to realize the USB2.0 OTG function.Also i.MX51 has USB parallel interface which is connected to USB transceiver to support USB host function. On i.MX51 EVK board, a USB Hub chip is connected to the USB host interface to expand 7 ports for many applications, such as USB mouse, keypad, HDD and etc. The diagram is shown as below:i.MX51Figure 7-1: USB connection8. CMOS SensorIPUv3EX in i.MX51 enables connectivity to displays andimage sensors, relevant processing and synchronization. It supports two display ports and two camera ports. As the cost and functional agility consideration, there is no Camera sensor on i.MX51 EVK board by default. Costumers can test Camera sensors in their future design through the expansion connector (J14) on board.Figure 8-1: CMOS to CSI connection9. VGA and DVI outThere are rich of video interfaces on i.MX51 EVK for different purposes. DVI and VGA output are important features of i.MX51 EVK. The ADV7123 is the VGA DAC and the TFP410PA is the DVI DAC.i.MX51Figure 9-1: VGA and DVI connection。