allegro错误代码

Shape to Route Keepout Spacing
Shape在Route Keepout之内
KV
BBVia to Route Keepin Spacing
BBVia在Route Keepin之外
BBVia to Route Keepout Spacing
BBVia在Route Keepout之内
斜线与垂直/水平线之间的距离太近
Orthogonal Wire to Orthogonal Wire Spacing
垂直/水平线之间的距离太近
WX
Max Number of Crossing
无
Min Distance between Crossing
无
XB
135 Degree Turn to Adjacent Crossing Distance
BB Via与Test Via太近
BB Via to Through Via Spacing
BB Via与Through Via太近
Test Via to Test Via Spacing
Test Via之间太近
Test Via to Through Via Spacing
Test Via与Through Via太近
BBVia to SMD Pin Spacing
BBVia与SMD元件脚太近
BBVia to Test Pin Spacing
BBVia与Test元件脚太近
BBVia to Through Pin Spacing
BBVia与Through元件脚太近
SMD Pin to Test Via Spacing
Route keepout to Bondpad
Bondpad在keepout之内
Via Keepout Байду номын сангаасo Bondpad
Bondpad在Via Keepout之内
KC
Package to Place Keepin Spacing
元件在Place Keepin之外
Package to Place Keepout Spacing
LS
Line to Shape Spacing
走线与Shape太近
LW
Min Line Width
走线的宽度太细
Min Neck Width
走线变细的宽度太细
MA
Soldermask Alignment Error Pad
Soldermask Tolerance太小
MC
Pin/Via Soldermask to Symbol Soldermask
Pad在另一个Pad之上
VL
BB Via to Line Spacing
BB Via与走线太近
Line to Through Via Spacing
走线与Through Via太近
Line to Test Via Spacing
走线与Test Via太近
VS
BB Via to Shape Spacing
Bondpad之间的错误
BL
Bondpad to Line
Bondpad与Line之间的错误
BS
Bondpad to Shape
Bondpad与Shape之间的错误
CC
Package to Package
Package之间的Spacing错误
Symbol Soldermask to Symbol
Soldermask零件防焊层之间的Spacing错误
Line to Test Pin Spacing
走线与Test元件脚太近
Line to Through Pin Spacing
走线与Through元件脚太近
PP
SMD Pin to SMD Pin Spacing
SMD元件脚与SMD元件脚太近
SMD Pin to Test Pin Spacing
SMD元件脚与Test元件脚太近
Differential Pair Secondary Max Length
差分对走线的次要距离长度过长
DI
Design Constraint Negative Plane Island
负片孤铜的错误
ED
Propagation-Delay
走线的长度错误
Relative-Propagation-Delay
Test Pin to Test Pin Spacing
Test元件脚与Test元件脚太近
Test Pin to Through Pin Spacing
Test元件脚与Through元件脚太近
Through Pin to SMD Pin Spacing
Through元件脚与SMD元件脚太近
Through Pin to Through Pin Spacing
Test Via to Via Keepout Spacing
Test Via在Via Keepout之内
Through Via to Route Keepin Spacing
Through Via在Route Keepin之外
Through Via to Route Keepout Spacing
Test Via to Through Pin Spacing
Test Via与Through Pin太近
Through Pin to Through Via Spacing
Through Pin与Through Via太近
RC
Package to Hard Room
元件在其他的Room之内
RE
Min Length Route End Segment at 135Degree
Through Via to Through Via Spacing
Through Via之间太近
WA
Min Bonding Wire Length
Bonding Wire长度太短
WE
Min End Segment Length
无
Min Length Wire End Segment at 135Degree
DF
Differential Pair Length Tolerance
差分对走线的长度误差过长
Differential Pair Primary Max Separation
差分对走线的主要距离太大
Differential Pair Secondary MaxSeparation
差分对走线的次要距离太大
BBVia to Via Keepout Spacing
BBVia在Via Keepout之内
Test Via to Route Keepin Spacing
Test Via在Route Keepin之外
Test Via to Route Keepout Spacing
Test Via在Route Keepout之内
元件在Place Keepout之内
KL
Line to Route Keepin Spacing
走线在Route Keepin之外
Line to Route Keepout Spacing
走线在Route Keepout之内
KS
Shape to Route Keepin Spacing
Shape在Route Keepin之外
BB Via与Shape太近
Shape to Test Via Spacing
Shape与Test Via太近
Shape to Through Via Spacing
Shape与Through Via太近
VV
BB Via to BB Via Spacing
BB Via之间太近
BB Via to Test Via Spacing
Through元件脚与Through元件脚太近
PS
Shape to SMD Pin Spacing
Shape与SMD元件脚太近
Shape to Test Pin Spacing
Shape与Test元件脚太近
Through Pin to Shape Spacing
Through元件脚与Shape太近
PV
无
Min Length Single Segment Wire
无
SN
Allow on Etch Subclass
允许在走线层上
SO
Segment Orientaion
无
BB
Bondpad to Bondpad
Bondpad之间的错误
SS
Shape to Shape
Shape之间的错误
TA
Max Turn Angle
SMD Pin与Test Via太近
SMD Pin to Through Via Spacing
SMD Pin与Through Via太近
Test Pin to Test Via Spacing
Test Pin与Test Via太近
Test Pin to Through Via Spacing
Test Pin与Through Via太近
EV
Max Via Count
已超过走线使用的VIA的最大数目
EX
Max Crosstalk
已超过Crosstalk值
Max Peak Crosstalk
已超过Peak Crosstalk值
HH
Hold to Hold Spacing
钻孔之间的距离太近
HW
Diagonal Wire to Hold Spacing