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255RUL R ecognized File No. E 13224RTHE S E R IE S B 255 IS A TWO C OIL LATC HING VE R S ION OF THE G E NE R AL P UR P OS E TY P E 219 R E LAY. WHE N THE OP E R ATE C OIL IS MOME NTAR ILY E NE R G IZE D, THE R E LAY ME C HANIC ALLY LATC HE S IN THE E NE R G IZE D P OS ITION AND R E MAINS IN THE E NE R G IZE D P OS ITION WITH THE P OWE R R E MOVE D F R OM THE C OIL. THE S E C OND C OIL WHE N MOME NTAR LY E NE R G IZE D, P R OVIDE S E LE C TR IC AL R E S E T OF THE C ONTAC TS. ALL C ONTAC TS OP E R ATE F R OM A C OMMON AR MATUR E TO P R E VE NT C ONTAC T OVE R LAP P ING. C OILS AR E R ATE D F OR C ONTINUOUS DUTY.U V L M 33S UF F IXOP TIONS130 C C oilC oil S uppression Light & ActuatorF ine S ilver-G old Diffused B ifurcated C ontactsB 255 XC X P L M -S eriesB255 2 C oil Latch plug-in C ontact Arrangements XB X DP DT XC X 3P DTAB X S P S T-NO & 2 F orm C B XB DP S T-NO & 2 F orm B S tandard F eaturesP olycarbonate C over- C ODE "P "Optional F eaturesIndicator Lamp across both coils - C ODE "L " Manual Actuator- C ODE "M" P erm. Magnet B lowout - C ODE "69"C oil VoltageC oil Voltages & F requencies mus t be s pecified.Note: F or time delay on energizing reset coil,specify 256 series in lieu of B 255OR DE R ING C ODE Typical Type No.DC R E LAY S , 1.8 WATTS (2.5 W @ 125VDC )PAGEWEBSITE: EMAIL:info@ FAX # 1-843-662-8862 PHONE # 1-843-664-3303C ONTAC TS61712B 255XB XP (DP DT )61712B 255XC XP (3 P DT)61712B 255AB XP (DP DT + 1 N.O. )R E S E TO P E R A T EO P E R A T ER E S E TR E S E TO P E R A T E61712B 255B XB P (2 N.O. + 2 N.C. )R E S E TO P E R A T EB 255AB XP B 255XB XP B 255XC P B 255B XB PDP DT + 1 NODP DT 3P DT 2 NO + 2 NCWIR ING DIAG R AMS(VIE WE D F R OM TE R MINAL E ND)TY P E4.56(115.8)12167L O C K I N G D E V I C E2.625(66.67)1.468(37.28)3.75(95.25)OUTL INE DIME NS IONSDimensions shown Inch & (Millimeters)MATING S OC K E TS 27390 - 12 P INSTRUTHERS-DUNNSTRUTHERS-DUNN DUAL COIL LATCHING PLUG-IN RELAYSCLASSNUCLEAR QUALIFIED VERSION AVAILABLEOPTIONS*Electrical Set Manual Reset* Manual Set Electrical ResetWE B S ITE : www.s truthers E MAIL:info@ms truthers FAX # 1-843-662-8862 PHONE # 1-843-664-330385% of Nominal Voltage 80 % of Nominal Voltage 110% of nominal, voltageS ilver Alloy & G old Diffused (S tandard)25 mS Max. @ Nominal Voltage.20 mS Max. @ Nominal Voltage.1500 V rms1/4" over surface, 1/8" thru Air-10 C to +60 C10 Million Operations no load100,000 Operations @ R ated Load.500,000 Operations 1/2 R ated Load.C lear polycarbonate.215 g (7.58 oz.) AP P R OX.G E NE R AL S P E C IF IC ATIONSC OIL P ull-in, min. AC P ull-in min. DC Overvoltage, max.C ONTAC TSC ontact Material:TIMINGOperate Time: (operate coil) R elease Time: (R eset coil energized)DIE L E C TR IC S TR E NG THAll Mutually Insulated P oints: Insulation :TE MP E R ATUR E R ated Operation:L IF E E XP E C TANC Y Mechanical: E lectrical:MIS C E L L ANE OUS E nclosure: Weight:RUL R ecognized File No. E 13224R3.014.552.01450500084025615026.54.8 1.104.2015.5540181561224120240R esistance Ohms ± 10%C oil P ower (mA)Nominal Voltage R esistance Ohms ± 10%C oil P ower(mA)80041020045.013.2R E S E T C OIL (3VA)OP E R ATE C OIL (5VA)*AC C OIL , 50/60 HZC OIL S P E C IF IC ATIONS @ 25 C C urrent inrush on all AC coils is less than twice the listedmilliamperes ratings as shown in the AC coil data table.*C urrents shown in table measured at 60 Hz.61224115/125Nominal Voltage DC relays, 1.8 Watts (2.5 W @ 125VDC )DC C OIL DATAR E S E T C OIL 1.4W)38518996.020.015.563.525062002861418014.421.085.03008000R esistance Ohms ± 10%C oil P ower (mA)OP E R ATE C OIL (1.8W)R esistanceOhms± 10%C oil P ower(mA)10A 3A 1A 3A 0.1A0.5A 1.5A 150 mA 0.5A24 VDC 120 VAC 240 VAC 28 VDC 125 VDC125 VDC S M 125 VDC DM 250 VDC S M 250 VDC DMVOLTSMAK E 30A 30A 30A 30A 30A30A 30A 30A 30A10A 10A 10A 10A 10A10A 10A 10A 10A10A 10A 5A 10A 0.5A1.5A 4A 0.5A 1.5AR E S IS TIVE INDUC TIVEC AR R Y B R E AKC ONTAC T R ATING S** F or vers ions with s uffix "69" P ermanent Magnet B lowouts**R elays with C ode 69 feature ( C heck with factory for UL & C S A Listing).PAGESTRUTHERS-DUNN00255DUAL COIL LATCHING PLUG-IN RELAYSCLASS。
Benefits• Approvals: ENEC, UL, cUL• Rated voltage: 660 VAC 50/60 Hz • Capacitance range: 0.001 – 0.1 µF • Lead spacing: 15.2 – 25.4 mm • Capacitance tolerance: ±20%• Climatic category: 40/85/56, IEC 60068–1• Tape and reel in accordance with IEC 60286–2• RoHS Compliant and lead-free terminationsOverviewThe PME264 Series is constructed of multilayer metallized paper encapsulated and impregnated in self-extinguishing material meeting the requirements of UL 94 V–0.ApplicationsTypical applications include worldwide use inelectromagnetic interference suppression in all X2 and across-the-line applications. These capacitors are also for use in high AC and DC voltage applications such as commutator capacitor in converters and ignition circuits.AC Line EMI Suppression and RC NetworksPME264 Series Metallized Impregnated Paper, Class X2, 660 VACLegacy Part Number SystemNew KEMET Part Number SystemClick image above for interactive 3D contentOpen PDF in Adobe Reader for full functionalityOrdering Options Table Benefits cont'd• Operating temperature range of −40˚C to +85˚C• 100% screening factory test at 3,000 VDC• The highest possible safety regarding active and passive flammability• Excellent self-healing properties ensure long life even when subjected to frequent over-voltages • Good resistance to ionization due to impregnated dielectric • High dV/dt capability• The impregnated paper ensures excellent stability and outstanding reliability properties, especially in applications with continuous operationDimensions – MillimetersFRONT VIEW SIDE VIEWPerformance CharacteristicsEnvironmental Test DataApprovalsEnvironmental ComplianceAll KEMET EMI capacitors are RoHS Compliant.Table 1 – Ratings & Part Number Reference(1) Insert ordering code for lead type and packaging. See Ordering Options Table for available options.Soldering ProcessThe implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has increased the liquidus temperature from that of 183ºC for SnPb eutectic alloy to 217 – 221ºC for the new alloys. As a result, the heat stress to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 – 170ºC). Wave soldering can be destructive, especially for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm), and great care has to be taken during soldering. The recommended solder profiles from KEMET should be used. Please consult KEMET with any questions. In general, the wave soldering curve from IEC Publication 61760-1 Edition 2 serves as a solid guideline for successful soldering. Please see Figure 1.Reflow soldering is not recommended for through-hole film capacitors. Exposing capacitors to a soldering profile in excess of the above the recommended limits may result to degradation or permanent damage to the capacitors.Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through-hole parts after the curing of surface mount parts. Consult KEMET to discuss the actual temperature profile in the oven, if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the capacitor surface temperature to return to a normal temperature before the second soldering cycle.Manual Soldering Recommendations Following is the recommendation for manual soldering with a soldering iron.The soldering iron tip temperature should be set at 350°C (+10°C maximum) with the soldering duration not to exceed more than 3 seconds.Recommended Soldering TemperatureSoldering time (sec)S o l d e r i n g i r o n b i t t e m p e r a t u r e (d e g C )0501001502002503004080120160200240T e m p e r a t u r e (°C )Time (s)Soldering Process cont'dWave Soldering Recommendations cont'd1. The table indicates the maximum set-up temperature of the soldering processFigure 12. The maximum temperature measured inside the capacitor:Set the temperature so that inside the element the maximum temperature is below the limit:Temperature monitored inside the capacitor.Selective Soldering RecommendationsSelective dip soldering is a variation of reflow soldering. In this method, the printed circuit board with through-holecomponents to be soldered is preheated and transported over the solder bath as in normal flow soldering without touching the solder. When the board is over the bath, it is stopped and pre-designed solder pots are lifted from the bath with molten solder only at the places of the selected components, and pressed against the lower surface of the board to solder the components.The temperature profile for selective soldering is similar to the double wave flow soldering outlined in this document, however, instead of two baths, there is only one bath with a time from 3 to 10 seconds. In selective soldering, the risk ofoverheating is greater than in double wave flow soldering, and great care must be taken so that the parts are not overheated.ConstructionDetailed Cross SectionSelf-ExtinguishingSelf-ExtinguishingResinMetal ContactLayerMetal ContactLayerMarginMetallized Impregnated Paper(First Layer)MarginMetallized Impregnated Paper(Second Layer)Metal Spraying Impregnated Series Design — Multilayer Impregnated Paper Dielectric2 SectionWinding SchemeMarkingBACKFRONTTOPSeriesSelf HealingPackaging QuantitiesLead Taping & Packaging (IEC 60286–2)Taping Specifi cation(1) Maximum cumulative feed hole error, 1 mm per 20 parts.(2) 16.5 mm available on request.(3) Depending on case size.(4) 15 mm available on request.Lead Taping & Packaging (IEC 60286–2) cont'd Ammo Specifi cationsReel Specifi cationsManufacturing Date Code (IEC–60062)KEMET Electronic Corporation Sales Offi cesFor a complete list of our global sales offi ces, please visit /sales.DisclaimerAll product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required.KEMET is a registered trademark of KEMET Electronics Corporation.。
1. ScopeThis specification is applied to Multilayer Ceramic Chip Capacitor(MLCC) for use in electric equipment for the voltage is ranging from 4V to 50V.The series suitable for general electrics circuit, telecommunications, personal computers and peripheral, power circuit and mobile application. (This product is compliant with the RoHS & HF.)2. Parts Number Code3. Nominal Capacitance and Tolerance3.1 Standard Combination of Nominal Capacitance and ToleranceClass CharacteristicTolerance Nominal CapacitanceⅡX7RK (± 10.0 %)E-3, E-6 series3.2 E series(standard Number) Standard No.Application CapacitanceE- 3 1.02.24.7E- 6 1.0 1.52.23.34.76.8E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 E-241.0 1.2 1.5 1.82.2 2.73.3 3.94.75.66.8 8.2 1.1 1.31.62.02.43.0 3.64.35.16.27.5 9.14. Operation Temperature RangeClassCharacteristic Temperature Range Reference Temp.Ⅱ X7R (X)-55 ~ +125℃℃25℃5. Storage ConditionStorage Temperature ：5 to 40℃ Relative Humidity ：20 to 70 % (6)Rated Voltage Code Rated Voltage (Vdc)05050 (1) (2) (3) (4) (5) (6) (7) (1)ProductProduct CodeC Multilayer Ceramic Chip Capacitor(3)Temperature Characteristics Code Temperature Characteristic Temperature Range Temperature Coefficient X X7R -55℃~+125℃ ± 15% (4)Capacitance unit :pico farads(pF)Code Nominal Capacitance (pF) 104 100,000.0 ※. If there is a decimal point, it shall be expressed by an English capital letter R(5)Capacitance Tolerance Code Tolerance Nominal CapacitanceK ± 10.0 % More Than 10 pF (7)TappingCode TypeT Tape & Reel(2)Chip Size Code Length×Width unit : mm(inch) 06031.60× 0.80 (.063× .031)6. Dimensions6.1 Configuration and Dimension ：Unit:mmTYPE LW TB (min)BW (min) 06031.60± 0.100.80± 0.100.85± 0.150.400.156.2 Termination Type ：External Electrodes BarrierInner ElectrodesPolymer Electrodes (If applicable)7. PerformanceWhen operating at temperature range from 100℃to 125℃, the operation shall be carried out at a derating voltage or less as shown belowFig.1P.C. Board for Bending Strength TestMaterial : Glass Epoxy Substrate: Solder ResistTest SubstrateMaterial : Glass Epoxy Substrate: Copper (Thickness : 0.035mm)Thickness : 1.6 mmUnit:mmType A B C 0201 0.2 0.9 0.4 0402 0.5 1.5 0.6 0603 1.0 3.0 1.0 0805 1.2 4.0 1.6 1206 2.2 5.0 2.0 1210 2.2 5.0 2.9 1808 3.5 7.0 2.5 1812 3.5 7.0 3.7 2208 4.5 8.0 2.5 2211 4.5 8.0 3.0 22204.58.05.68. Packing8.1 Bulk PackingAccording to customer request. 8.2 Chip Capacitors Tape Packing8.3 Material And QuantityTape Material 0201 0402 0603/0805 T 0.≦33mm T 0.55mm ≦ T ≦1.00mm T ＞1.00mm Paper 15,000 pcs/Reel 10,000 pcs/Reel 4,000 pcs/Reel NAPlastic NA NA NA 3,000 pcs/ReelTape Material 1206T ≦1.00mm 1.00mm ＜T 1.25mm ≦T ＞1.25mmPaper 4,000 pcs/ReelNANAPlastic NA3,000 pcs/Reel2,000 pcs/ReelTape Material 1808/1210T ≦1.25mm1.25mm ＜T ≦2.40mmT ＞2.40mmPaper NANANAPlastic 3000 pcs/Reel2000 pcs/Reel500/1,000 pcs/ReelTape Material 1812/2211/2220 1825/2225 2208 T ≦2.20mm T ＞2.20mm T ≦2.20mm T ＞2.20mm T ≦2.20mm Paper NA NA NA NA NAPlastic 1000 pcs/Reel 700 pcs/Reel 700 pcs/Reel400 pcs/Reel 1000 pcs/Reel NA ：Not Available8.4 Cover Tape Reel Off Force8.4.1 Peel-Off Force5 g·f Peel ≦-Off Force 70 g ≦·f 8.4.2 Measure Method8.5 Paper TapeUnit:mm8.6 Plastic TapeUnit:mm TYPE A B C DE 0201 0.37± 0.1 0.67± 0.1 4.00± 0.1 2.00± 0.052.00± 0.10402 0.61± 0.1 1.20± 0.1 0603 1.10± 0.2 1.90± 0.2 4.00± 0.10805 1.50± 0.2 2.30± 0.2 1206 1.90± 0.2 3.50± 0.2 1210 2.90± 0.2 3.60± 0.2 TYPE FG H It0201 1.75± 0.103.50± 0.058.0± 0.30 φ1.50 +0.10/-0 1.10 max.0402 0603 0805 1206 1210Type A B C D E F 0805 1.5±0.2 2.3±0.2 4.0± 0.12.0± 0.054.0± 0.11.75± 0.11206 1.9±0.2 3.5±0.2 1210 2.9±0.2 3.6±0.2 1808 2.5±0.2 4.9±0.2 1812 3.6±0.2 4.9±0.2 8.0± 0.11825 6.9±0.2 4.9±0.2 2208 2.5±0.2 6.1±0.2 2211 3.2±0.2 6.1±0.2 2220 5.4±0.2 6.1±0.2 22256.9±0.26.1±0.28.7 Reel DimensionsReel Material ：PolystyreneType G H IJ t O 0805 3.5± 0.058.0± 0.3φ1.5+0.1/-03.0 max.0.3 max.1.0± 0.11206 1210 1808 5.5± 0.05 12.0 ± 0.3 4.0 max. 1.5± 0.11812 1825 2208 2211 2220 2225Type AB C DE W 0201 φ382 max φ50 min φ13± 0.5φ21± 0.82.0±0.510± 0.150402 0603 0805 1206 1210 1808 φ178±0.2 φ60±0.2 13±0.31812 1825 2208 2211 2220 2225Unit:mmPrecautionary Notes:1. StorageStore the capacitors where the temperature and relative humidity don’t exceed 40°C and 70%RH. Werecommend that the capacitors be used within 12 months from the date of manufacturing. Store the products in the original package and do not open the outer wrapped, polyethylene bag, till just before usage. If it is open, seal it as soon as possible or keep it in a desiccant with a desiccation agent.2. Construction of Board PatternImproper circuit layout and pad/land size may cause excessive or not enough solder amount on the PC board. Not enough solder may create weak joint, and excessive solder may increase the potential of mechanical or thermal cracks on the ceramic capacitor. Therefore we recommend the land size to be as shown in the following table: 2.1 Size and recommend land dimensions for reflow soldering2.2 Mechanical strength varies according to location of chip capacitors on the P .C. board.Design layout of components on the PC board such a way to minimize the stress imposed on the components, upon flexure of the boards in depanelization or other processes.Component layout close to the edge of the board or the “depanelization line” is not recommended. Susceptibility to stress is in the order of: a>b>c and d>eEIA Code Chip (mm) Land (mm) L W A B C D E 0201 0.60 0.30 0.2~0.3 0.2~0.4 0.2~0.4 -- -- 0402 1.00 0.50 0.3~0.5 0.3~0.5 0.4~0.6 -- -- 0603 1.60 0.80 0.4~0.6 0.6~0.7 0.6~0.8 -- -- 0805 2.00 1.25 0.7~0.9 0.6~0.8 0.8~1.1 -- -- 1206 3.20 1.60 2.2~2.4 0.8~0.9 1.0~1.4 1.0~2.0 3.2~3.7 1210 3.20 2.50 2.2~2.4 1.0~1.2 1.8~2.3 1.0~2.0 4.1~4.6 1808 4.60 2.00 2.8~3.4 1.8~2.0 1.5~1.8 1.0~2.8 3.6~4.1 1812 4.60 3.20 2.8~3.4 1.8~2.0 2.3~3.0 1.0~2.8 4.8~5.3 1825 4.60 6.35 2.8~3.4 1.8~2.0 5.1~5.8 1.0~4.0 7.1~8.3 2208 5.70 2.00 4.0~4.6 2.0~2.2 1.5~1.8 1.0~4.0 3.6~4.1 2211 5.70 2.80 4.0~4.6 2.0~2.2 2.0~2.6 1.0~4.0 4.4~4.9 2220 5.70 5.00 4.0~4.6 2.0~2.2 3.5~4.8 1.0~4.0 6.6~7.1 2225 5.70 6.354.0~4.62.0~2.2 5.1~5.8 1.0~4.07.1~8.32.3 Layout Recommendation3. Mounting3.1 Sometimes crack is caused by the impact load due to suction nozzle in pick and place operation.In pick and place operation, if the low dead point is too low, excessive stress is applied to component. This maycause cracks in the ceramic capacitor, therefore it is required to move low dead point of a suction nozzle to the higher level to minimize the board warp age and stress on the components. Nozzle pressure is typically adjusted to 1N to 3N (static load) during the pick and place operation.3.2 Amount of Adhesivea0.2mm min. b 70 ~ 100 µm cDo not touch the solder landExample : 0805 & 12064. Soldering4.1. Wave SolderingMost of components are wave soldered with solder at 230 to 250°C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to the soldering methods below for optimum soldering benefits.Recommend flow soldering temperature ProfileTo optimize the result of soldering, proper preheating is essential: 1) Preheat temperature is too low a. Flux flows to easilyb. Possibility of thermal cracks2) Preheat temperature is too higha. Flux deteriorates even when oxide film is removedb. Causes warping of circuit boardc. Loss of reliability in chip and other componentsCooling Condition:Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference (ΔT) between the solvent and the chips must be less than 100°C.4.2 Reflow SolderingPreheat and gradual increase in temperature to the reflow temperature is recommended to decrease the potential of thermal crack on the components. The recommended heating rate depends on the size of component, however it should not exceed 3°C/Sec.Recommend reflow profile for Lead-Free soldering temperature Profile (MIL-STD-202G #210F)Soldering Method Change in Temp.( )℃1206 and Under ΔT 190 ≦℃ 1210 and Over ΔT 130 ≦℃Soldering Method Change in Temp.( )℃ 1206 and UnderΔT ≤ 100~130 max.SolderingT e m p e r a t u r e (°C )T e m p e r a t u r e (°C )※ The cycles of soldering : Twice (max.)4.3 Hand SolderingSudden temperature change in components, results in a temperature gradient recommended in the following table, and therefore may cause internal thermal cracks in the components. In general a hand soldering method is not recommended unless proper preheating and handling practices have been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder Iron.Soldering Method Change in Temp.( )℃1206 and Under ΔT 1≦50 ℃1210 and Over ΔT 130≦℃How to Solder Repair by Solder Iron1) Selection of the soldering iron tipThe required temperature of solder iron for any type of repair depends on the type of the tip, the substrate material, and the solder land size.2) recommended solder iron conditiona.) Preheating Condition：Board and components should be preheated sufficiently at 150°C or over,and soldering should be conducted with soldering iron as boards and components are maintainedat sufficient temperatures.b.) Soldering iron power shall not exceed 30 W.c.) Soldering iron tip diameter shall not exceed 3mm.d.) Temperature of iron tip shall not exceed 350°C to perform the process within 5 seconds.(refer to MIL-STD-202G)f.) Do not touch the ceramic body with the tip of solder iron. Direct contact of the soldering iron tip to ceramicbody may cause thermal cracks.g.) After soldering operation, let the products cool down gradually in the room temperature.5. Handling after chip mounted5.1 Proper handling is recommended, since excessive bending and twist of the board, depends on the orientationof the chip on the board, may induce mechanical stress and cause internal crack in the capacitor.Temperature(°C)200→Higher potential of crack Lower potential of crack ╳5.3 Mechanical stress due to warping a (a) Crack occurrence ratio will be in (b) Crack occurrence ratio will be in :Tensile Stress ╳6. Handling of Loose Chip Capacitor 6.1 If dropped the chip capacitor may c6.2 In piling and stacking of the P .C. bo may hit the chip capacitor mounted7. Safekeeping condition and period For safekeeping of the products, we re under humidity of 20 to 70% RH. The sing and torsion.be increased by manual separation.be increased by tensile force , rather than compressiv s○ :Compressive Stress tor may crack. .C. boards after mounting for storage or handling, the unted on another board to cause crack.we recommend to keep the storage temperature betwe The shelf life of capacitors is 12 months. ressive force.ess, the corner of the P .C. boardbetween +5 to +40°C and Crack。
