ST3 unit Test

TDA7303 Digital controlled stereo audio processor with loudnessFeatures■Input multiplexer:– 3 stereo inputs–Selectable input gain for optimal adaptationto different sources■Volume control in 1.25 dB steps■Loudness function■Treble and bass controL■Four speaker attenuators:– 4 independent speakers control in 1.25d Bsteps for balance and fader facilities –Independent mute function■All functions programmable via serial I2C bus DescriptionThe TDA7303 is a volume, tone (bass and treble) balance (left/right) and fader (front/rear) processor for quality audio applications in car radio, Hi-Fi and portable systems. Selectable input gain and external loudness function are provided. Control is accomplished by serial I2C bus microprocessor interface.The AC signal setting is obtained by resistor networks and switches combined with operational amplifiers.Thanks to the used bipolar/CMOS technology, low distortion, low noise and low DC stepping are obtained.Table 1.Device summaryOrder code Package PackingTDA7303SO-28T rayTDA7303TR SO-28T ape and reelMarch 2009 Rev 31/20Contents TDA7303Contents1Block, test and pin diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.1Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.2Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61.3Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.2Quick reference data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.3Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.4Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.5Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103I2C bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.1Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.2Start and stop conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3Byte format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.4Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.5Transmission without acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134Software specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154.1Interface protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154.2Subaddress (receive mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154.3Data bytes (detailed description) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192/20TDA7303List of tables List of tablesTable 1.Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2.Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 3.Quick reference data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4.Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5.Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6.Chip address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 7.Data bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 8.Volume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 9.Speaker attenuators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 10.Audio switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 11.Bass and treble. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 12.Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193/20List of figures TDA7303 List of figuresFigure 1.Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2.Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3.Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4.Loudness vs. volume attenuation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5.Loudness vs. frequency (CLOUD = 100 nF) vs. volume attenuation . . . . . . . . . . . . . . . . . 10 Figure 6.Loudness vs. external capacitors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 7.Noise vs. volume/gain setting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 8.Signal to noise ratio vs. volume setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 9.Distortion and noise vs. frequency (V IN = 1 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 10.Distortion and noise vs. frequency (V IN = 250 mV). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 11.Distortion vs. load resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 12.Channel separation (L Æ R) vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 13.Input separation (L1 Æ L2, L3) vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 14.Supply voltage rejection vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 15.Output clipping level vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 16.Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 17.Supply current vs. temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 18.Bass resistance vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 19.Typical tone response (with the external components indicated in the test circuit) . . . . . . 12 Figure 20.Data validity on the I2C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 21.Timing diagram of S-bus and I2C bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 22.Acknowledge on the I2C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 23.Interface protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 24.SO-28 mechanical data and package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4/20TDA7303Block, test and pin diagrams5/201Block, test and pin diagrams1.1 Block diagramBlock, test and pin diagrams TDA73036/201.2 Test circuitFigure 2.Test circuit1.3 PinconnectionFigure 3.Pin connection (top view)TDA7303Electrical specifications7/202 Electrical specifications2.1Absolute maximum ratings2.2 Quick reference data2.3 Thermal dataTable 2.Absolute maximum ratingsSymbol ParameterValue Unit V S Operating supply voltage 10.0V T amb Ambient temperature -40 to 85°C T stgStorage temperature range-55 to +150°CTable 3.Quick reference dataSymbol ParameterMin.Typ.Max.Unit V S Supply voltage6910V V CL Max. input signal handling2Vrms THD Total harmonic distortion V = 1 Vrms; f = 1 kHz 0.01%S/N Signal to noise ratio106dB S CChannel separation f = 1 kHz 103dB Volume control 1.25d B step -78.750dB Bass and treble control 2 dB step -14+14dB Fader and balance control 1.25 dB step -38.750dB Input gain 3.75 dB step1.25 dB step 011.25dB Mute attenuation100dBTable 4.Thermal dataSymbol ParameterValue Unit R th j-pinsThermal resistance junction to pinsMax.85°C/WElectrical specifications TDA73038/202.4 Electrical characteristicsTable 5.Electrical characteristics(T amb = 25 °C, V S = 9 V , R L = 10 k Ω, R G = 600 Ω, all control flat (G = 0), f = 1 kHz unless otherwise specified)Symbol ParameterTest conditionMin.Typ.Max.UnitSupply V S Supply voltage 6910V I S Supply current 811mA SVRRipple rejection6080dBInput selectors R II Input resistance Input 1, 2, 3, 450k ΩV CL Clipping level 2 2.5Vrms S IN Input separation (2)80100dB R L Output load resistance pin 7, 172k ΩG INmin Min. input gain -101dB G INmax Max. input gain 11.25dB G STEP Step resolution 3.75dB e INInput noiseG = 11.25 dB 2µVVolume control R INInput resistance33k ΩC RANGE Control range 707580dB A VMIN Min. attenuation -101dB A VMAX Max. attenuation 707580dB A STEP Step resolution 0.51.25 1.75dB E A Attenuation set error A V = 0 to -20 dB -1.2501.25dB A V = -20 to -60 dB-32dB E TT racking error2dBSpeaker attenuators C range Control range 3537.540dB S STEP Step resolution 0.51.251.75dB E A Attenuation set error 1.5dB A MUTEOutput mute attenuation80100dBBass control (1)Gb Control range Max. Boost/cut±12±14±16dB B STEPStep resolution123dBTDA7303Electrical specifications9/20R BInternal feedback resistance44k ΩTreble control (1)Gt Control range Max. Boost/cut±13±14±15dB T STEPStep Resolution123dBAudio outputs V OCL Clipping leveld = 0.3 %2 2.5Vrms R L Output load resistance 2k ΩC L Output load capacitance 10nF R OUT Output resistance 75ΩV OUT DC voltage level4.24.54.8VGenerale NOOutput noise (2)BW = 20-20 kHz, flat output muted all gains = 0 dB 2.55µV µV A curve all gains = 0 dB3µV S/NSignal to noise ratioall gains = 0 dB; V O = 1 Vrms 106dB dDistortionA V = 0; V IN = 1 Vrms0.01%A V = -20 dB, V IN = 1 Vrms 0.090.3%A V = -20 dB, V IN = 0.3 Vrms0.04%ScChannel separation left/right 80103dB T otal tracking errorA V = 0 to -20 dB 01dB -20 to -60 dB2dBBus inputs V IL Input low voltage 1V V IH Input high voltage 3V I IN Input current-5+5µA V OOutput voltage SDA acknowledgeI O = 1.6 mA0.4V1.Bass and treble response see attached diagram (Figure 19). The center frequency and quality of the resonance behaviorcan be chosen by the external circuitry. A standard first order bass response can be realized by a standard feedback network 2.The selected input is grounded through the 2.2 µF capacitor.Table 5.Electrical characteristics (continued)(T amb = 25 °C, V S = 9 V , R L = 10 k Ω, R G = 600 Ω, all control flat (G = 0), f = 1 kHz unless otherwise specified)Symbol ParameterTest conditionMin.Typ.Max.UnitElectrical specifications TDA730310/202.5 Electrical characteristics curvesFigure 4.Loudness vs. volume attenuation Figure 5.Loudness vs. frequency (C LOUD =100 nF) vs. volume attenuationFigure 6.Loudness vs. external capacitors Figure 7.Noise vs. volume/gain settingFigure 8.Signal to noise ratio vs. volume settingFigure 9.Distortion and noise vs. frequency (V IN= 1 V)TDA7303Electrical specifications11/20Figure 10.Distortion and noise vs. frequency (VIN= 250 mV)Figure 11.Distortion vs. load resistanceFigure 12.Channel separation (L →R) vs.frequencyFigure 13.Input separation (L1→ L2, L3) vs.frequencyFigure 14.Supply voltage rejection vs.frequencyFigure 15.Output clipping level vs. supplyvoltageElectrical specifications TDA730312/20Figure 16.Quiescent current vs. supplyvoltageFigure 17.Supply current vs. temperatureFigure 18.Bass resistance vs. temperatureFigure 19.Typical tone response (with theexternal components indicated in the test circuit)TDA7303I 2C bus interface13/203 I 2C bus interfaceData transmission from microprocessor to the TDA7303 and viceversa takes place through the 2 wires I 2C bus interface, consisting of the two lines SDA and SCL (pull-up resistors to positive supply voltage must be connected).3.1 Data validityAs shown in Figure 20, the data on the SDA line must be stable during the high period of theclock. The high and low state of the data line can only change when the clock signal on the SCL line is lOW.3.2 Start and stop conditionsAs shown in Figure 21 a start condition is a high to low transition of the SDA line while SCL is high. The stop condition is a low to high transition of the SDA line while SCL is high.3.3 Byte formatEvery byte transferred on the SDA line must contain 8 bits. Each byte must be followed byan acknowledge bit. The MSB is transferred first.3.4 AcknowledgeThe master (μP) puts a resistive HIGH level on the SDA line during the acknowledge clock pulse (see Figure 22). The peripheral (audioprocessor) that acknowledges has to pull-down (low) the SDA line during the acknowledge clock pulse, so that the SDA line is stable low during this clock pulse.The audioprocessor which has been addressed has to generate an acknowledge after the reception of each byte, otherwise the SDA line remains at the high level during the ninth clock pulse time. In this case the master transmitter can generate the stop information in order to abort the transfer.3.5 Transmission without acknowledgeAvoiding to detect the acknowledge of the audioprocessor, the μP can use a simplertransmission: simply it waits one clock without checking the slave acknowledging, and sends the new data.This approach of course is less protected from misreading and decreases the noise immunity.I2C bus interface TDA730314/20222Patent note:Purchase of I2C Components of STMicrolectronics,conveys a license under the Philips I2C Patent Rights touse these components in an I2C system, provided that thesystem conforms to the I2C Standard Specifications asdefined by Philips.TDA7303Software specification15/204 Software specification4.1 Interface protocolThe interface protocol comprises:● A start condition (s)●A chip address byte, containing the TDA7303 address (the 8th bit of the byte must be0).The TDA7303 must always acknowledge at the end of each transmitted byte.● A sequence of data (N-bytes + acknowledge)●A stop condition (P)Figure 23.Interface protocolACK = Acknowledge S = Start P = StopMax. clock speed 400 kbits/s4.2 Subaddress (receive mode)Ax = 1.25dB steps; Bx = 10dB steps; Cx = 2dB steps; Gx = 3.75dB stepsTable 6.Chip addressMSB LSB 11Table 7.Data bytesMSB LSBFunction 00B2B1B0A2A1A0Volume control 110B1B0A2A1A0Speaker A TT LR 111B1B0A2A1A0Speaker A TT RR 100B1B0A2A1A0Speaker A TT LF 101B1B0A2A1A0Speaker A TT RF 010G1G0S2S1S0Audio switch 0110C3C2C1C0Bass control 0111C3C2C1C0Treble controlSoftware specification TDA7303 4.3 Data bytes (detailed description)Table 8.VolumeMSB LSB Function00B2B1B0A2A1A0Volume 1.25 dB steps0000001-1.25010-2.5011-3.75100-5101-6.25110-7.5111-8.75Volume 10 dB steps0000001-10010-20011-30100-40101-50110-60111-70 For example a volume of -45 dB is given by: 0 0 1 0 0 1 0 0Table 9.Speaker attenuatorsMSB LSB Function100B1B0A2A1A0Speaker LF101B1B0A2A1A0Speaker RF110B1B0A2A1A0Speaker LR111B1B0A2A1A0Speaker RR0000001-1.25010-2.5011-3.75100-5101-6.25110-7.5111-8.7500001-1010-2011-3011111Mute For example attenuation of 25 dB on speaker RF is given by: 1 0 1 1 0 1 0 016/20TDA7303Software specificationTable 10.Audio switchMSB LSB Function010G1G0S2S1S0Audio Switch00Stereo 101Stereo 210Stereo 311Not allowed0Loudness ON1Loudness OFF00+11.25 dB01+7.5 dB10+3.75d B110 dB For example to select the stereo 2 input with a gain of +7.5dB LOUDNESS ON the 8bitstring is: 0 1 0 0 1 0 0 1Table 11.Bass and trebleMSB LSB Function0110C3C2C1C0Bass0111C3C2C1C0Treble0000-140001-120010-100011-80100-60101-40110-2011101111011102110141100610118101010100112100014 C3 = SignFor example Bass at -10dB is obtained by the following 8 bit string: 0 1 1 0 0 0 1 017/20Package information TDA730318/205 Package informationIn order to meet environmental requirements, ST offers these devices in different grades ofECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: .ECOPACK ® is an ST trademark.TDA7303Revision history19/206 Revision historyTable 12.Document revision historyDate RevisionChanges04-Aug-20061Initial release.13-Mar-20092Updated “distortion” parameter in the T able 5: Electricalcharacteristics on the page 9.Modified the max. clock speed value in Section 4.1: Interface protocol on page 15.Updated Section 5: Package information on page 18.18-Mar-20093Modified the test condition of the parameter “distortion” in the Table 5: Electrical characteristics on the page 9.TDA730320/20Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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All other names are the property of their respective owners.© 2009 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America。

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硫氧还蛋白还原酶（Thioredoxin reductase），是一种NADPH依赖的包含FAD结构域的二聚体硒酶，属于吡啶核苷酸-二硫化物氧化还原酶家族成员。

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Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog SwitchGeneral DescriptionThe HTS3005 is a dual, low on-resistance, low voltage, bidirectional, single-pole/double-throw (SPDT) CMOS analog switch designed to operate from a single 1.8V to 5.5V powersupply. Targeted applications include battery powered equipment that benefit from lowR ON (0.5Ω) and fast switching speeds (t ON = 50ns, t OFF = 15ns).The on resistance profile is very flat over the full analog signal range. This ensuresexcellent linearity and low distortion when switching audio signals.The HTS3005 is a committed dual single-pole/double- throw (SPDT) that consist of twonormally open (NO) and two normally close (NC) switches. This configuration can beused as a dual 2-to-1 multiplexer.HTS3005 is available in Green TDFN-3×3-10L and MSOP-10 packages.Featuresn Low Voltage Operation: 1.8V to 5.5Vn Low On-Resistance: 0.5Ω (TYP)n Low On-Resistance Flatnessn-3dB Bandwidth: 15MHzn Fast Switching Times:Øt ON 50nsØt OFF 15nsn Rail-to-Rail Operationn Typical Power Consumption (<0.01µW)n TTL/CMOS Compatiblen Microsize PackagesApplicationn Battery-powered, Handheld, and Portable EquipmentØCellular/Mobile PhonesØLaptops, Notebooks, Palmtopsn Communication Systemsn Sample-and-Hold Circuitsn Audio Signal Routingn Audio and Video Switchingn Portable Test and Measurementn Medical EquipmentUltra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch Pin ConfigurationsPin DescriptionSymbol DescriptionV+ Power supply.GND Ground.IN1, IN2Digital control pin to connect the COM terminal to the NO or NC terminals.COM1, COM2Common terminal.NO1, NO2Normally-open terminal.NC1, NC2Normally-closed terminal.Ordering InformationType Number Package Name Package Quantity Marking CodeHTS3005XV10/R6MSOP10 Tape and Reel,3000C3005XHTS3005XF10/R6TDFN-3×3-10 Tape and Reel,3000C3005X Recommended Operating Conditionsn Operating voltage range: 1.8V to 5.5Vn Specified temperature range: -40℃ to 125℃Absolute Maximum RatingsParameter Symbol Absolute Maximum Rating Unit V+ to GND-0.3V to 6V V Analog, Digital voltage range (1)-0.3V to (V+) + 0.3V VContinuous Current NO, NC, or COM±300mA mA Peak Current NO, NC, or COM ±500mA mAOperating Temperature Range -40℃ to +125℃ ℃TemperatureStorage--65℃ to +150℃℃Junction150℃℃Package Thermal Resistance @ TA = 25℃TDFN-3×3-10L, θJA 33℃/W ℃/W MSOP-10, θJA205℃/W ℃/W Lead Temperature (soldering, 10s)260℃℃ESD SusceptibilityHBM2000V V MM400VVAttention: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(1) Signals on NC, NO, or COM exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings.(2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog SwitchElectrical CharacteristicsUltra Low ON-Resistance, Low Voltage, Dual, SPDT Analog SwitchV+ = +5V, GND = 0V, TA = -40℃ to +125℃, typical values are at TA = + 25℃, unless otherwise noted SymbolParameterConditionsMin.Typ.Max.UnitANALOG SWITCH V NO ,V NC ,V COM Analog Signal RangeT A =-40℃ to ﹢125℃ 0 V +V R ONOn-Resistance0 ≤ V NO or V NC ≤ V +, I COM = -10mA,Test Circuit 10.50.9ΩT A =-40℃ to ﹢125℃1.1Ω∆R ONOn-Resistance Match Between Channels0 ≤ V NO or V NC ≤ V +, I COM = -10mA,Test Circuit 10.050.09ΩT A =-40℃ to ﹢125℃0.12ΩR FLAT(ON)On-Resistance Flatness0 ≤ V NO or V NC ≤ V +, I COM = -10mA,Test Circuit 10.250.3ΩT A =-40℃ to ﹢125℃0.4ΩLEAKAGE CURRENTS I NC(OFF), I NO(OFF)Source OFF Leakage CurrentV NO or V NC = 4.5V/1V, V COM = 1V/4.5V, V + = +5.5V, Test Circuit 2±4±10nA T A =-40℃ to ﹢125℃±1000nA I NC(ON),I NO(ON), I COM(ON),Channel ON Leakage CurrentV NO or V NC = V COM = 1V or 4.5V, V + = +5.5V, Test Circuit 3±4±10nA T A =-40℃ to ﹢125℃±1000nADIGITAL INPUTS V INH Input High Voltage T A =-40℃ to ﹢125℃ 2.4V V INL Input Low VoltageT A =-40℃ to ﹢125℃0.8V I INL or I INHInput CurrentV IN = V INH or V INL ±0.01±0.1μA T A =-40℃ to ﹢125℃±1μADYNAMIC CHARACTERISTICS t ON Turn-On Time V NO or V NC = 3V, R L = 300Ω, C L = 35pF,Test Circuit 450nS t OFF Turn-Off Time V NO or V NC = 3V, R L = 300Ω, C L = 35pF,Test Circuit 415nS Q Charge Injection C L = 1.0nF, V G = 0V, R G = 0Ω, Test Circuit 520pC t DBreak-Before-MakeTime Delay V NO1 or V NC1 = V NO2 or V NC2 = 3V, R L = 300Ω, C L = 35pF, Test Circuit 6 10nS O ISOOff IsolationR L =50ΩC L = 5pF, TestCircuit 7f = 100kHz -70dB f = 10kHz -85dBElectrical CharacteristicsV+ = +5V, GND = 0V, TA = -40℃ to +125℃, typical values are at TA = + 25℃, unless otherwise notedUltra Low ON-Resistance, Low Voltage, Dual, SPDT Analog SwitchSymbol Parameter Conditions Min.Typ.Max.UnitX TALK Channel-to-ChannelCrosstalkRL= 50Ω,CL= 5pF,Test Circuit 8f = 100kHz -90 dBf = 10kHz-105dBTHD Total HarmonicDistortionf = 20Hz to 20kHz, VCOM=3.5V P-P, RL= 600Ω, CL=50pF0.065 %BW-3dB Bandwidth RL= 50Ω, CL= 5pF, TestCircuit 915 MHZCNC(OFF),CNO(OFF)Source off Capacitance 80 pFCNC(ON),CNO(ON),CCOM(ON)Channel on Capacitance380pF POWER REQUIREMENTSI +Power Supply CurrentV+= +5.5V, VIN= 0V or 5V 0.001μAT A=-40℃ to﹢125℃1μAElectrical CharacteristicsUltra Low ON-Resistance, Low Voltage, Dual, SPDT Analog SwitchV+ = +3V, GND = 0V, TA = -40℃ to +125℃, typical values are at TA = + 25℃, unless otherwise noted.SymbolParameterConditionsMin.Typ.Max.UnitANALOG SWITCH V NO ,V NC ,V COM Analog Signal RangeT A =-40℃ to ﹢125℃ 0 V +V R ONOn-Resistance0 ≤ V NO or V NC ≤ V +, I COM = -10mA,Test Circuit 10.61.0ΩT A =-40℃ to ﹢125℃1.3Ω∆R ONOn-Resistance Match Between Channels0 ≤ V NO or V NC ≤ V +, I COM = -10mA,Test Circuit 10.050.1ΩT A =-40℃ to ﹢125℃0.13ΩR FLAT(ON)On-Resistance Flatness0 ≤ V NO or V NC ≤ V +, I COM = -10mA,Test Circuit 10.250.3ΩT A =-40℃ to ﹢125℃0.4ΩLEAKAGE CURRENTS I NC(OFF), I NO(OFF)Source OFF Leakage CurrentV NO or V NC =3V/1V, V COM = 1V/3V, V + = +3.3V, Test Circuit 2±5±11nA T A =-40℃ to ﹢125℃±1000nA I NC(ON),I NO(ON), I COM(ON),Channel ON Leakage CurrentV NO or V NC = V COM = 1V or 3V, V + = +3.3V, Test Circuit 3±5±11nA T A =-40℃ to ﹢125℃±1000nADIGITAL INPUTS V INH Input High Voltage T A =-40℃ to ﹢125℃ 2.0V V INL Input Low VoltageT A =-40℃ to ﹢125℃0.4V I INL or I INHInput CurrentV IN = V INH or V INL ±0.01±0.1μA T A =-40℃ to ﹢125℃±1μADYNAMIC CHARACTERISTICS t ON Turn-On Time V NO or V NC = 2V, R L = 300Ω, C L = 35pF,Test Circuit 450nS t OFF Turn-Off Time V NO or V NC = 2V, R L = 300Ω, C L = 35pF,Test Circuit 417nS Q Charge Injection C L = 1.0nF, V G = 0V, R G = 0Ω, Test Circuit 525pC t DBreak-Before-MakeTime Delay V NO1 or V NC1 = V NO2 or V NC2 = 2V, R L = 300Ω, C L = 35pF, Test Circuit 6 11nS O ISOOff IsolationR L =50ΩC L = 5pF, TestCircuit 7f = 100kHz -70dB f = 10kHz -85dBElectrical CharacteristicsV+ = +5V, GND = 0V, TA = -40℃ to +125℃, typical values are at TA = + 25℃, unless otherwise notedUltra Low ON-Resistance, Low Voltage, Dual, SPDT Analog SwitchSymbol Parameter Conditions Min.Typ.Max.UnitX TALK Channel-to-ChannelCrosstalkRL= 50Ω,CL= 5pF,Test Circuit 8f = 100kHz -90 dBf = 10kHz-105dBTHD Total HarmonicDistortionf = 20Hz to 20kHz, VCOM=2VP-P, RL= 600Ω, CL=50pF0.06 %BW-3dB Bandwidth RL= 50Ω, CL= 5pF, TestCircuit 915 MHZCNC(OFF),CNO(OFF)Source off Capacitance 80 pFCNC(ON),CNO(ON),CCOM(ON)Channel on Capacitance380pF POWER REQUIREMENTSI +Power Supply CurrentV+= +3.3V, VIN= 0V or 5V 0.001μAT A=-40℃ to﹢125℃1μAUltra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch Type Performance CharacteristicsUltra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch Application NotesTest Circuit 1. On ResistanceTest Circuit 2. Off Leakage Test Circuit 3. On LeakageTest Circuit 4. Switching TimesTest Circuit 5. Charge InjectionUltra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch Application NotesTest Circuit 6. Break-Before-Make Time Delay, tDTest Circuit 7. Off IsolationApplication Notes Data SheetHTS3005Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog SwitchTest Circuit 8. Channel-to-Channel CrosstalkTest Circuit 9. -3dB BandwidthPackage OutlinesMSOP-10Data Sheet HTS3005Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog SwitchHTS3005Data Sheet Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch Package OutlinesTDFN-3×3-10L。

Project Number:Tracking Code: TC0547--0887 Requested by: Gary LewisDate: 11/17/2005Product Rev: 1Part #: SQCD-025-06.00-STR-TEU-1 Lot #: N/ATech: Troy CookEng: Dave ScopellitiPart description: SQCD Qty to test: 75Test Start: 04/12/2006 Test Completed: 7/27/2006SQCD-0XX-X.XX-XXX-XXX-XDVT ReportCERTIFICATIONAll instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST) traceable standards according to IS0 10012-l and ANSI/NCSL 2540-1, as applicable.All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be reproduced without prior written approval of Samtec.SCOPETo perform the following tests: CCC, IR/DWV, FLEX, PULLAPPLICABLE DOCUMENTSStandards: EIA Publication 364TEST SAMPLES AND PREPARATION1)All materials were manufactured in accordance with the applicable product specification.2)All test samples were identified and encoded to maintain traceability throughout the test sequences.3)After soldering, the parts to be used for LLCR and DWV/IR testing were cleaned according to TLWI-0001.4)Either an automated cleaning procedure or an ultrasonic cleaning procedure may be used.5)The automated procedure is used with aqueous compatible soldering materials.6)Parts not intended for testing LLCR and DWV/IR are visually inspected and cleaned if necessary.7)Any additional preparation will be noted in the individual test sequences.8)Solder Information: Lead Free9)Re-Flow Time/Temp: See accompanying profile.10)Internal Test PCBs used: PCB-100392-TST-XXOVEN PROFILE (Soldering Parts to Test Boards)ATTRIBUTE DEFINITIONSThe following is a brief, simplified description of attributes.THERMAL:1) EIA-364-17, Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors. 2) Test Condition 4 at 105° C.3) Test Time Condition B for 250 hours.4) Connectors are sometimes mated and all samples are pre-conditioned at ambient.HUMIDITY:1) Reference document: EIA-364-31, Humidity Test Procedure for Electrical Connectors. 2) Test Condition B, 240 Hours.3) Method III, +25° C to + 65° C, 90% to 98% Relative Humidity excluding sub-cycles 7a and 7b. 4) Connectors are sometimes mated and all samples are pre-conditioned at ambient.TEMPERATURE RISE (Current Carrying Capacity, CCC):1) EIA-364-70, Temperature Rise versus Current Test Procedure for Electrical Connectors and Sockets .2) When current passes through a contact, the temperature of the contact increases as a result of I 2R (resistive)heating.3) The number of contacts being investigated plays a significant part in power dissipation and thereforetemperature rise.4) The size of the temperature probe can affect the measured temperature. 5) Copper traces on PC boards will contribute to temperature rise:a. Self heating (resistive)b. Reduction in heat sink capacity affecting the heated contacts6) A de-rating curve, usually 20%, is calculated.7) Calculated de-rated currents at three temperature points are reported:a. Ambientb. 55оCc. 65оCd. 70оC8) Typically, neighboring contacts (in close proximity to maximize heat build up) are energized.9) The thermocouple (or temperature measuring probe) will be positioned at a location to sense the maximumtemperature in the vicinity of the heat generation area.10) A computer program, TR 803.exe , ensures accurate stability for data acquisition.11) Hook-up wire cross section is larger than the cross section of any connector leads/PC board traces, jumpers,etc.12) Hook-up wire length is longer than the minimum specified in the referencing standard.INSULATION RESISTANCE (IR):To determine the resistance of insulation materials to leakage of current through or on the surface of these materials when a DC potential is applied.1)PROCEDURE:a.Reference document: EIA-364-21, Insulation Resistance Test Procedure for Electrical Connectors.b.Test Conditions:i.Between Adjacent Contactsii.Electrification Time 2.0 minutesiii.Test Voltage (500 VDC) corresponds to calibration settings for measuring resistances.2)MEASUREMENTS:3)When the specified test voltage is applied (VDC), the insulation resistance shall not be less than 5000megohms.DIELECTRIC WITHSTANDING VOLTAGE (DWV):To determine if the sockets can operate at its rated voltage and withstand momentary over potentials due to switching, surges, and other similar phenomenon. Separate samples are used to evaluate the effect ofenvironmental stresses so not to influence the readings from arcing that occurs during the measurementprocess.1)PROCEDURE:a.Reference document: EIA-364-20, Withstanding Voltage Test Procedure for Electrical Connectors.b.Test Conditions:i.Between Adjacent Contactsii.Rate of Application 500 V/Seciii.Test Voltage (VAC) until breakdown occurs2)MEASUREMENTS/CALCULATIONSa.The breakdown voltage shall be measured and recorded.b.The dielectric withstanding voltage shall be recorded as 75% of the minimum breakdown voltage.c.The working voltage shall be recorded as one-third (1/3) of the dielectric withstanding voltage (one-fourth of the breakdown voltage).SUPPLEMENTAL TESTSCONNECTOR PULL:1)Secure cable near center and pull on connectora.At 90°, right angle to cableb.At 0°, in-line with cableFig. 1(Typical set-up, actual part not depicted.)0° Connector pull, notice the electrical continuity hook-up wires. CABLE DURABILITY:1)Oscillate and monitor electrical continuity for open circuit indication.a.± 35° Pendulum Mode,bend up to 25,000 cycles with 8 oz. load on cable end.Fig. 2b.± 90° Flex Mode, bend up to 25,000 cycles with 8 oz. load on cable end.Fig. 3(Typical set-up, actual part not depicted.)RESULTSTemperature Rise, CCC at a 20% de-rating•CCC for a 30°C Temperature Rise (1 Cable)-----------0.6 A per contact with 6 adjacent contacts powered •CCC for a 30°C Temperature Rise (2 Cables)---------0.4 A per contact with 6 adjacent contacts powered Insulation Resistance minimums, IR•Initialo Top Cable------------------------------------------50,000 Meg Ω------------------------Passo Bottom Cable------------------------------------100,000 Meg Ω•Thermalo Top Cable-----------------------------------------100,000 Meg Ωo Bottom Cable------------------------------------100,000 Meg Ω•Humidityo Top Cable------------------------------------------50,000 Meg Ωo Bottom Cable------------------------------------100,000 Meg ΩDielectric Withstanding Voltage minimums, DWV•Initialo BreakdownTop Cable-----------------------------------800 VACBottom Cable-----------------------------1,020 VACo DWVTop Cable-----------------------------------600 VACUnmated-------------------------------------765 VACo Working voltageTop Cable-----------------------------------200 VACBottom Cable-------------------------------255 VAC•Thermalo BreakdownTop Cable---------------------------------1,020 VACBottom Cable-----------------------------1,120 VACo DWVTop Cable-----------------------------------765 VACUnmated-------------------------------------840 VACo Working voltageTop Cable-----------------------------------255 VACBottom Cable-------------------------------280 VAC•Humidityo BreakdownTop Cable-----------------------------------940 VACBottom Cable-------------------------------840 VACo DWVTop Cable-----------------------------------705 VACBottom Cable-------------------------------630 VACo Working voltageTop Cable-----------------------------------235 VACBottom Cable-------------------------------210 VACSUPPLEMENTAL TESTINGSupplemental – Connector/Cable Pull•0°-----------------------------------------------------------------------99.18 lbs min•90°---------------------------------------------------------------------57.53 lbs minSupplemental – Cable Bend 25,000 Cycles•±35° Pendulum Mode---------------------------------------------No Electrical Failures•±90°Flex Mode------------------------------------------------------Minimum # of 3,746 Cycles to Failure.DATA SUMMARIES Continued INSULATION RESISTANCE (IR):Initial, Meg Ohms Thermal, Meg Ohms Humidity, Meg OhmsTop Bottom Top Bottom Top BottomInsulation Resistance InsulationResistanceInsulationResistanceInsulationResistanceInsulationResistanceInsulationResistanceAverage 50000 100000 100000 100000 75000 100000 Min 50000 100000 100000 100000 50000 100000 Max 50000 100000 100000 100000 100000 100000DIELECTRIC WITHSTANDING VOLTAGE (DWV):Initial, VAC Top Initial, VAC BottomBreakdownVoltage DWV WorkingVoltageBreakdownVoltage DWVWorkingVoltageAverage 880 660 220 1030 773 258 Min 800 600 200 1020 765 255 Max 960 720 240 1040 780 260Thermal, VAC Top Thermal, VAC BottomBreakdownVoltage DWV WorkingVoltageBreakdownVoltage DWVWorkingVoltageAverage 1070 803 268 1120 840 280 Min 1020 765 255 1120 840 280 Max 1120 840 280 1120 840 280 Humidity, VAC Top Humidity, VAC BottomBreakdownVoltage DWV WorkingVoltageBreakdownVoltage DWVWorkingVoltageAverage 960 720 240 930 698 233 Min 940 705 235 840 630 210 Max 980 735 245 1020 765 255DATA SUMMARIES ContinuedSUPPLEMENTAL – CONNECTOR/CABLE PULL0 Deg. Pull 90 Deg. Pull(Lbs)Force (Lbs) ForceMinimum 99.18 57.53Maximum 164.99 78.44Average 147.5 69.2SUPPLEMENTAL – CABLE BEND 25,000 CYCLESA.35 Deg. PendulumInitial 5000Cycles 10000 Cycles 15000 Cycles 20000 Cycles 25000 Cycles Avg 20.1080 20.0480 20.0100 20.0640 20.0620 20.1120 Min 20.0500 19.9800 19.9300 19.9800 19.9900 20.0400 Max 20.1800 20.1300 20.0900 20.1300 20.1300 20.1800 St. Dev. 0.0545 0.0630 0.0711 0.0627 0.0540 0.0630 Count 5 5 5 5 5 5B.90 Deg. FlexInitial 5000Cycles 10000 Cycles 15000 Cycles 20000 Cycles 25000 Cycles Avg 30.4383 25.0100 20.5950 24.1150 20.8400 #DIV/0!Min 20.1000 20.3500 20.4800 20.6100 20.8400 0.0000 Max 80.9300 36.6100 20.7100 27.6200 20.8400 0.0000 St. Dev. 24.7371 7.7772 0.1626 4.9568 #DIV/0! #DIV/0!Count 6 4 2 2 1 0DATAINSULATION RESISTANCE (IR):Initial, Meg Ohms Thermal, Meg Ohms Humidity, Meg OhmsTop Bottom Top Bottom Top BottomSample# InsulationResistanceInsulationResistanceInsulationResistanceInsulationResistanceInsulationResistanceInsulationResistance1 50000 100000 100000 100000 100000 1000002 50000 100000 100000 100000 50000 100000DIELECTRIC WITHSTANDING VOLTAGE (DWV):Initial, VAC Top Initial, VAC BottomSample# BreakdownVoltage DWVWorkingVoltageBreakdownVoltage DWVWorkingVoltage1 800 600 200 1020 765 2552 960 720 240 1040 780 260Thermal, VAC Top Thermal, VAC BottomSample# BreakdownVoltage DWVWorkingVoltageBreakdownVoltage DWVWorkingVoltage1 1120 840 280 1120 840 2802 1020 765 255 1120 840 280Humidity, VAC Top Humidity, VAC BottomSample# BreakdownVoltage DWVWorkingVoltageBreakdownVoltage DWVWorkingVoltage1 940 705 235 840 630 2102 980 735 245 1020 765 255 SUPPLEMENTAL – CONNECTOR/CABLE PULL0 Deg. Pull 90 Deg. PullSample# Maximum Force (Lbs) MaximumForce(Lbs)1 164.99 74.172 158.30 78.443 156.24 75.934 158.58 57.535 99.18 60.12DATA (Continued)SUPPLEMENTAL – CABLE BEND 25,000 CYCLESA.35 Deg. PendulumCable Resistance,OhmsInitial 5000Cycles 10000 Cycles 15000 Cycles 20000 Cycles 25000 Cycles1 20.05 19.98 19.93 20.02 20.03 20.062 20.18 20.13 20.09 20.13 20.13 20.183 20.14 20.08 20.05 20.11 20.09 20.174 20.11 19.99 19.94 19.98 19.99 20.045 20.06 20.06 20.04 20.08 20.07 20.11B.90 Deg. FlexCable Resistance,OhmsInitial 5000Cycles 10000Cycles 15000Cycles 20000Cycles 25000Cycles1 20.10 20.80 Failed @ 7329Cycles N/A N/A N/A2 20.24 36.61 Failed @ 7590Cycles N/A N/A N/A3 20.29 20.35 20.71 27.62 20.84 Failed @ 22448Cycles4 20.23 22.28 20.48 20.61 Failed @ 18372Cycles5 20.84 Failed @ 3746Cycles N/A N/A N/A N/AEQUIPMENT AND CALIBRATION SCHEDULES Equipment #: THL-02Description: Temperature/Humidity Chart RecorderManufacturer: DicksonModel: THDXSerial #: 00120351Accuracy: Temp: +/- 1C; Humidity: +/-2% RH (0 - 60%) +/- 3% RH (61 - 95%). … Last Cal: 06/16/06, Next Cal: 06/16/07Equipment #: MO-02Description: Multimeter /Data Acquisition SystemManufacturer: KeithleyModel: 2700Serial #: 0780546Accuracy: See Manual… Last Cal: 05/12/06, Next Cal: 05/12/07Equipment #: MO-04Description: Multimeter /Data Acquisition SystemManufacturer: KeithleyModel: 2700Serial #: 0798688Accuracy: See Manual… Last Cal: 01/31/06, Next Cal: 01/31/07Equipment #: PS-01Description: System Power SupplyManufacturer: Hewlett PackardModel: HP 6033ASerial #: (HP) 3329A-07330Accuracy: See Manual… Last Cal: 05/12/06, Next Cal: 05/12/07Equipment #: TC090601-103/105Description: IC Thermocouple-103/105Manufacturer: SamtecModel:Serial #: TC090601-103/105Accuracy: +/- 1 degree C… Last Cal: , Next Cal:Equipment #: HPM-01Description: Hipot MegommeterManufacturer: HipotronicsModel: H306B-ASerial #: M9905004Accuracy: 2 % Full Scale AccuracyEquipment #: OV-03Description: Cascade Tek Forced Air OvenManufacturer: Cascade TekModel: TFO-5Serial #: 0500100Accuracy: Temp. Stability: +/-.1C/C change in ambient Temp. Stability: +/-.1C/C change in ambient … Last Cal: 05/12/06, Next Cal: 05/12/07Equipment #: THC-01Description: Temperature/Humidity ChamberManufacturer: ThermotronModel: SM-8-7800Serial #: 30676Accuracy: See Manual… Last Cal: 8/18/2006, Next Cal: 8/18/2007Equipment #: TCT-03Description: Dillon Quantrol TC2 Test StandManufacturer: Dillon QuantrolModel: TC2Serial #: 02-1033-03Accuracy: Speed Accuracy: +/- 5% of indicated speed; Displacement: +/- 5 micrometers.… Last Cal: 5/12/06, Next Cal: 5/12/07Equipment #: LC-2500N(icell)Description: 2500 N Load Cell for Dillon QuantrolManufacturer: Dillon QuantrolModel: icellSerial #: 01-0132-01Accuracy: .10% of capacity… Last Cal: 6/13/06, Next Cal: 6/13/07Equipment #: HDR - 01Description: HDR Flex TesterManufacturer: Samtec Inc.Model: AT-1440-000Serial #: 00120351Accuracy: N/A… Last Cal: No Calibration Required, Next Cal:…。

BEFORE USE ....Thank you for choosing M-System. Before use, please check contents of the package you received as outlined below .I f you have any problems or questions with the product, please contact M-System’s Sales Office or representatives. ■PACKAGE INCLUDES:Surge protector ....................................................................(1) ■MODEL NO.Confirm Model No. marking on the product to be exactly what you ordered.■INSTRUCTION MANUALThis manual describes necessary points of caution when you use this product, including installation, connection and basic maintenance procedures.When using this product in potentially explosive atmos-phere or hazardous (classified) location, you have to follow the safety procedure to install it. Please refer to “SAFE IN-STALLATION MANUAL” for each type of certification.LIMITATION APPLICABLE TO M-RESTERThe M-RESTER will protect electronics equipment from damage caused by lightning by absorbing most of the surge voltages.However, M-RESTER may not be effective against cer-tain extremely high voltages caused by a direct or almost direct hit by lightning.M-RESTER must be installed according to this installa-tion / instruction manual.GENERAL■FUNCTION & FEATURES• High discharge current capacity 20 kA (8 / 20 µs), 1 kA (10 / 350 µs)• Ultra-thin 7-mm-wide module can be mounted in high density• Excellent protection employing multi-stage SPD circuits • DIN rail mounting and grounding • Shield terminal provided ■SPECIFICATIONS See Table 1.Table 1. SpecificationsMODEL NO.NOMINAL VOLTAGE MD7ST -24MD7ST -60SHLD TERMINAL FF FG GF GG FF FG GF GGMax. continuousoperating voltage (Uc)Line to Line 30V 70VLine to Earth ±160V 30V ±160V 70V Line to SHLD±160V 30V ±160V 70V SHLD to Earth±160V short ±160V short ±160V short ±160V shortVoltage protection level (Up)@4kV (1.2 / 50 µs)Line to Line 60V 115VLine to Earth ±800V ±60V ±800V ±115VLine to SHLD±1200V ±800V ±60V ±1200V ±800V ±115V SHLD to Earth±800V short ±800V short ±800V short ±800V shortLeakage current @Uc Line to Line ≤5µA ≤5µA Other sections ≤5µA ≤5µA Response time Line to Line≤4 nsec.≤4 nsec.Other sections≤20 nsec.≤20 nsec.Max. discharge current (Imax)20kA (8 / 20 µs), 1.0kA (10 / 350 µs)Nominal current (I N )250mAInternal series resistance Without fuse 4.7Ω ±10% per line 10Ω ±10% per line With fuse 7.5Ω ±10% per line 12.5Ω ±10% per line056 222 38 18SEN TRONIC AGPOINTS OF CAUTION■ENVIRONMENT• Indoor use.• When heavy dust or metal particles are present in the air, install the unit inside proper housing with sufficient ventilation.• Do not install the unit where it is subjected to continuous vibration. Do not subject the unit to physical impact.• Environmental temperature must be within -25 to +85°C (-13 to +185°F) with relative humidity within 30 to 90% RH in order to ensure adequate life span and operation.• This unit needs a DIN rail as earth grounding bar. Ox-ide coating of an aluminium rail may lower the electric conductivity between this module and the ground. Use a steel or copper rail.■DIELECTRIC STRENGTH TESTING• The surge protector starts discharging when 160V or greater voltage (with floating shield type) or several volts (with grounding shield type) is applied between lines and earth. Remove the grounding wire before conducting a test. Be sure to return the wire after the test.■AND ....• We recommend that you keep spare surge protectors so that you can replace them when necessary.• Lightning surge can enter not only through signal lines but also through power supply lines. We recommend that you also use the Lightning Surge Protector for Power Lines for adequate protection. COMPONENT IDENTIFICATION*Option identified by model number suffix.INSTALLATIONMount the unit on a DIN rail. Once installed, do not move it to another DIN rail.■MOUNTING THE UNIT ON A DIN RAILA) Hang the upper hook of the DIN rail mounting adaptor at the rear side of unit, on the DIN rail.B) Push in the lower in keeping pressing the unit to the DIN rail.C) DIN rails generally have slight individual variability in size. If you find it difficult to push in the lower part, go back to (A) and hang the upper part more deeply onto the rail and try (B) again.■REMOVING THE UNITA) Push down the spring loader utilizing a minus screwdriv-er.B) Confirm that it is pulled enough down and pull out the lower part of the unit.C) Detach the upper part from the DIN rail.REPLACING FUSE1)Hang the tip of a minus screwdriver on the groove at ei-ther side of the fuse and push it out of the housing.2)I nsert a replacement fuse. There is no polarity for thefuse to be observed.TERMINAL CONNECTIONConnect the unit as in the diagram below .Be sure to ground the DIN rail on which the unit is mounted and cross-wire between the rail and FG terminal of the protected device as shown in Figure 1 in order to equalize the earth potential.When the unit is connected with a device which has no FG terminal, ground the surge protector only . ■EXTERNAL DIMENSIONS unit: mm (inch)8–M3 EURO■Figure 1. GROUNDINGCross-wire from the DIN rail to the metal housing of the protected device to equalize the ground potential.Ground only the surge protector when the protected device has no grounding terminal.■CAUTION WHEN WIRINGHold the module steady at the front when you tighten/loosen screw terminals.■CONNECTION DIAGRAM• Specify ‘Loop disconnect fuse’ type when multiple transmitters are connected to single power bus.• Loop disconnect fuse is used to separate a transmitter loop from the power bus when it fails in the shortcircuit mode.4 – 20mA Field-mount*1. O xide film on the surface of an aluminium rail may lower the electric conductivity between this module and the ground.Use a steel or copper rail.*2. B e sure to ground the DIN rail. Recommended grounding resistance ≤100Ω*3. C ross-wire between the DIN rail and the metal housing of the protected device to equalize the earth potential. Ground only the surge protector when the protected device has no ground terminal.*4. S hield wiring method is an example. Proceed according to the system requirements.WIRING INSTRUCTIONS■EURO TERMINALTorque: 0.3 N·mApplicable wire size: 0.2 – 2.5 mm2Stripped length: 8 mmMAINTENANCECheck surge protectors periodically. Many cases of light-ning are ignored, and even lightning at a far distance often causes inductive surges.We recommend that you check your surge protector about twice a year, before and after the rainy season. Check whenever you experience a strong lightning occurrence. Checking procedure is explained in the following:■CHECKINGWIRING1)Make sure that wiring is done as instructed in the con-nection diagram.2)Make sure that the DI N rail is connected to the metal enclosure of protected device.3)Make sure that the surge protector is securely attached to the DIN rail, and that the rail is grounded to earth.■DISCHARGE ELEMENT1)Remove all wiring connected to the surge protector when you test the module.2)Check resistance across the terminals indicated in Table 2 on the high resistance range of multimeter and confirm no conduction. The tester should show 10 MΩ or greater.3)Confirm conduction across the same terminals with a 500 V DC 1000 MΩ insulation tester. The tester should show 20 MΩ or less.With loop disconnect fuse option, confirm conduction across the following terminals on the high resistance range of multimeter. The tester should show 15 Ω or less.1 – 4,2 – 5Polarity of the insulation tester does not matter.4)I f any of the above tests shows negative, replace the surge protector.Table 2.TERM.MODEL MD7ST-xFF MD7ST-xFG MD7ST-xGF MD7ST-xGG4 – 5Yes Yes Yes Yes4 – 8No Yes Yes Yes5 – 8No Yes Yes Yes8 – 5No No Yes Yes5 – DIN rail Yes Yes No Yes8 – DIN rail Yes No Yes No Note 1: A pply (+) voltage of the multimeter to the terminal number indicated on the left side.Note 2: Polarity does not matter for the insulation tester.。

Building a safe and secure embedded worldUnit Testing for Software QualityTest in the real environment and document the results> T ESSY and CTETESSY performs automated dynamic module/unit and integration testing of embedded software and determines the code coverage along the way. This kind of test is required for certifications according to standards such as DO-178, IEC 61508, ISO 13849, IEC 62279, or ISO 26262.Integrated with TESSY is the ClassificationTree Editor (CTE), a tool to specify test cases systematically according to the Classification Tree Method (CTM). TESSY is based on Eclipse Rich Client Platform (RCP) thus featuring the well-known Eclipse user interface with views and perspectives.TESSY automatically executes the tests, evaluates the test results, and generates the test reports. TESSY can eliminate manual testing and therefore saves the embedded development engineer a tremendous amount of time. A faster development process ensures the tool recovers its costs quickly, and what‘s more, produces better quality software and documented tests.TESSY is successfully used in large projects with dozens of users in multiple locations across the world. TESSY is used extensively in automotive, aerospace, avionics, railway, medical, military, and industrial applications. Ask for a testimonial!TESSY can be operated without user intervention which is useful for regression testing and continuous integration.The quickest route to a safe application TESSY: the invaluable test tool for safety critical applications TESSY – The invaluable test toolWhat Is Module/Unit Testing?During unit testing the test object is tested rigorously and in isolation from the rest of the application. The test object is a C-level function or a method (in C++). Often unit testing is also called module testing.Rigorous means that testing is tightly focused on the unit in question; the test cases are specific for the unit, demanding, comprehensive, using boundary values and values that are likely to reveal a problem in the unit under test.Isolated means that the test result does notdepend on the behaviour of the other units in the application. It can be achieved by directly calling the unit under test and replacing calls to other units by stub functions.Tested for the unexpected: systematic, rigorous, isolated testingModule / unit testing eliminates errors early on and prevents them from showing up inlater stages of the development process.What are the benefits? 1. Find errors earlyUnit testing can be conducted as soon as the unit to be tested compiles successfully. Therefore errors inside the unit can be detected very soon after their creation.2. Save moneyIt is generally accepted that errors detected late in a project are more expensive to correct than errors that are detected early. Hence unit testing saves money.3. Give confidenceUnit testing gives confidence. After the unit testing, the application will be made up of fully tested units. A test for the whole application will then be more likely to pass.4. Specific for the unitI nstead of trying to create test cases that test the whole set of interacting units, the test cases for unit testing are specific to the unit under test (divide-and-conquer). Test cases can easily comprise of input data that is unexpected by the unit under test, something which may be hard to achieve during system testing.5. Easy defect isolationIf the unit under test is tested in isolation from the other units, detecting the cause of a failed test case is easy. The fault must be related to the unit undertest.A tour around the testing workflow How TESSY worksUnleash it for a test run> TESSY starts off by analyzing the source module and then lets the user select the test object. This can be a function or amethod (in C++). TESSY then identifies the interface of thetest object, such as global variables, parameters, andfunctions/methods called by the test object.> TESSY determines whether a variable of the interface is input, output, or both.> TESSY can be directed to allocate memory to be used as targetfor pointers in the interface.State your caseTESSY provides several ways to specify values for the test cases:> Interactive test data input is accomplished in thetabular Test Data view> Test data import in various file formats (including Excel)> Test cases specified systematically by use of theClassification Tree Method can be imported fromthe Classification Tree Editor (CTE)> TESSY can generate test cases from value ranges> TESSY can generate random test dataMeet your test driverTESSY then generates source code for the test driver, which callsthe test object. If it calls another function/method, TESSY is ableto create a stub function as replacement. This is necessary forunit testing in its strictest sense and useful if the called function/method is not implemented yet.TESSY provides two types of stub functions:One type allowsthe user to specify expected values for the input variables of thestub function which then are compared with the actual values byTESSY. Furthermore this stub function type allows you to specifythe inputs from the stub function to the test object, e.g. the returnvalue. The other type of stub function allows the user to providesource code for the body of the stub.Go TESSY go!Using a cross compiler, TESSY compiles and links the driver sourcecode, the function under test and any stub functions, and thendownloads the resulting executable to the test system. This mightbe an in-circuit emulator in stand-alone mode or one connected toa target system, or a JTAG / BDM / OCDS debug system. This mightalso be a simulation of the target microcontroller running on thehost PC. Testing can also be performed on the host PC using thenative GNU compiler.TESSY executes each test case and then determines, if it haspassed or failed. A comprehensive test report can be created in pdf,word, html, and xml format.The interface separates thetest object from the rest of theapplicationNon-interactive testingTESSY features a command language which allows the user to automate almost all tasks in TESSY.The command language enables the integration of TESSY in Continuous Integration (CI) systems.Dream debuggingIf a test case fails, an easy and efficient debug plan is in place. TESSY is able to re-execute a test case and direct the debugger in use to stop test execution at the beginning of the test object.The debugger’s features now can be used to reveal theculprit. After the source code is changed to fix the bug, the test case in question (and all others) can easily be re-run to verify that the correction operates successfully.Regression testingRegression testing can reveal if new errors have been introduced during further development of the application, such as bug fixes in other sections, rewriting of the tested function, switching to a new compiler version or porting the software to another microcontroller architecture. TESSY’s easy-to-use regression testing ability is an extremely helpful method of checking modified software, therefore ensuring software quality.Trace your requirementsTraceability of requirements to test cases checks if allrequirements have a test case associated with them and also lets you find out which test cases may need adaptation if a requirement has changed. Requirements can be imported / exported and created in TESSY.Why TESSY eases testingSoftware quality needs TESSYRe-use test data and save timeIf any interface element of a tested function has been changed in the course of the development process, TESSY allows the user to re-use test data from the old interface, which considerably aids the regression testing process.Fault injectionTESSY features a faultinjection mechanism allowing comfortable testing of the reaction of the test object to faults from the outside, e.g. defective RAM.This mechanism can also be used to execute theoretically unreachable code parts, hence achieving 100% code coverage.Test case specififcation according to the Classification Tree Method. The CTE (Classification Tree Editor), integrated in TESSY, supports thismethodIntegration testing – check the interactionTESSY can test the interaction of cooperating units even if the units do not call each other, e.g. push() and pop() of a stack. Several units are composed to form a bigger unit, usually called a component. A test case calls the units in a certain order and sets variables of the component. Resulting calls to other components and variable values can be checked by TESSY. Integration test cases can also include simulated time(temporal component testing).The Classification Tree MethodThe Classification Tree Method supports a developer confronted with issues such as:> Finding the ”right” test cases> Minimizing a set of test cases while assuring that none are missing > Estimating the amount of testing required> Defining criteria needed to conclude testing without risking integrity of the test processTransforming requirementsThe Classification Tree Method transforms requirements systematically into a set of error-sensitive, low-redundancy test cases. This method classifies test-relevant aspects using the equivalence partitioning method and leads to test case specifications that can comprise boundary values.Intuitive and easy to learnThe Classification Tree Method is intuitive and easy to learn. It requires and encourages the developer to employ his creativity. Because thinking about the problem specification is at the very beginning, the Classification Tree Method also reveals inconsistencies or omissions in the problem specification.Testing of software variantsTESSY eases the testing of software variants. Test cases for a base software can be transferred andadapted to the software variants. If a base test case changes, the change is applied to the inherited testcases of the variants automatically.Hitex UKHitex (UK) Ltd Millburn Hill RoadUniversity of Warwick Science Park Coventry CV4 7HS United KingdomPhone: +44-24-7669-2066Fax: +44-24-7669-2131Email: info@hitex.c Engineering Testing Training ToolsSoftware Components SystemsManufacturingConsultingHitex Head Office, Germany Hitex GmbHGreschbachstraße 1276229 Karlsruhe GermanyPhone: +49-721-9628-0Fax: +49-721-9628-149Email:*************B -T E S S Y -E 04.i n d d - D EC 2018© Hitex GmbH. All Rights Reserved. This document is intended to give overview information only. Hitex makes no warranties or representations with regard to this content of any kind, whether express or implied,including without limitation, warranties or representations of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. Hitex reserves the right to make corrections, deletions, modifications, enhancements, improvements and other changes to the content and materials, its products, programs and services at any time or to move or discontinue any content, products, programs, or services without notice. Trademarks of other companies used in the text refer exclusively to the products of these companies. Hitex is a trademark of Hitex GmbH.TESSY is qualified to be used in safety-related software development according to IEC 61508, ISO 26262, EN 50128, and IEC 62304。

英语24字整体教学法2019新人教版高中英语必修第二册各单元生词和习惯用语精校Word版Unit 1heritage/'heritid3/n.遗产（指国家或社会长期形成的历史、传统和特色）creatively/kri:'ertivli/ adv 创造性地；有创造力地creative/kri:'ertiv/ adj.创造性的；有创造力的；有创意的temple/'templ/ n.庙；寺relic/'relik/ n.遗物；遗迹mount/maont/n.山峰vt.爬上；骑上vi.爬；登上former/'fo:m s（r）/ adj.以前的；（两者中）前者的clue/klu:/ n.线索；提示preserve/pri'z3:v/ vt.保存；保护；维持n.保护区promote/pr a'm a ut/vt.促进；提升；推销；晋级cypress/'saipr a s/n.柏树app/出p/n.应用程序；应用软件（application的缩略形式）application/,出pli'keifn/n.申请（表）；用途；运用；应用（程序）take part in参与（某事）；参加（某活动）give way to 让步；屈服balance/'b出l a ns/n.平衡；均匀vt.使平衡keep balance保持平衡lead to导致dam/d出m/n.水坝；拦河坝proposal/pr a'p a uzl/n.提议；建议make a proposal 提出建议protest/'prootest/n.^^ / pra'test/vi.& vt.（公开）反对；抗议Likely /' laikli/adj.可能的adv.可能地turn to 向..... 求助committee /k a'miti/n.委员会establish /'st出bl i f/ ▽.建立；创立limit /'l i m i t/n.限度；限制vi.限制；限定prevent/pri'vent/vt.阻止；阻碍；阻挠prevent...from...阻止；不准loss/lps/n.丧失；损失contribution /kontri'bju: § n/ n.捐款；贡献；捐赠contribute /k a n'tribju:t/vi.& vt.捐献；捐助department/di'pa:tmont/n.部；司；科fund/fand/n.基金；专款within /w i'd i n/ prep. & adv.在（某段时间、距离或范围）之内investigate/in'vestigeit/vi.& vt 调查；研究issue /'i fu:; BrE also 'isju:/n.重要议题；争论的问题vt.宣布；公布conduct/'kondakt/n.行为；举止；管理方法/k a n'd.kt/vt.组织；安排；带领document /'dokjum a nt/ n.文件；公文；（计算机）文档vt.记录；记载（详情）英语24字整体教学法donate /d s u'neit/ vt.（尤指向慈善机构）捐赠；赠送；献（血）donate...to一向.... 捐赠......disappear /,dis a'pi a（r）/vi.消失；灭绝；消亡attempt /a'tempt/n.& vt.企图；试图；尝试make sure确保；设法保证worthwhile /,w3:（r）0'wail/ adj.值得做的；值得花时间的download/,daun'l a ud/vt.下载n.下载；已下载的数据资料republic/ri'pablik/n.共和国professional /pr s'fef s nl/ adj.专业的；职业的n.专业人员；职业选手archaeologist/a:ki'p b dzist/n.考古学家entrance /'entr a ns/n.入口；进入pyramid/'pir a mid/n.（古埃及的）金字塔：棱锥体process/'prouses/n.过程；进程；步骤 / pra'ses/vt.处理：加工overseas /,a ov a（r）'si:z/adj.海外的adv.在海外exit /'eksit/n.出口；通道vi.&vt 出去；离去sheet/fi:t/n.一张（纸）；床单；被单parade/p a′reid/n.游行；检阅vi.游行庆祝；游行示威mirror /'mir a/n.镜子roof/ru:f/n.顶部：屋顶chiwen/'tfowan/鸱吻dragon /'dr出g a n/n.龙forgive /f a'g i v/ vt. & vi. （forgave,forgiven原谅；宽恕v.对不起；请原谅digital/'did3itl/adj.数码的；数字显示的image /'i m i d3/n.形象；印象cave/keiv/n.山洞；洞穴throughout/9 ru:'aut/ prep.各处；遍及；自始至终quality /'kwolati/ n.质量；品质；素质；特征adj.优质的；高质量的all over the world在世界各地tradition /tr a'd i fn/ n.传统；传统的信仰或风俗further /'f3:d a（r）/adv.（far 的比较级）更远；进一步historic /hi'stprik/ adj.历史上著名（或重要）的；有史时期的opinion/a'p i nj a n/n.意见；想法；看法quote/kwout/vt.弓|用paraphrase /'p出r a fre i zin.,vi.&vt.（用更容易理解的文字）解释comparison/k a m'p出risn/n.比较；相比contrast /'kontra:st/n对比；对照 / k a n'tra:st/vt.对比；对照identify /al'dentifal/vt.确认；认出；找到forever/far'ev a（r）/adv.永远；长久地Aswan/'a:swpn/ Dam 阿斯旺大坝the Nile/'nail/尼罗河Egypt/'i:d3ipt/埃及（国家名）Egyptian /i'd31pfn/adj.埃及的UNESCO/ju:'neskoo/abbr,United Nations Educational,Scientific andCultural Organization联合国教科文组织英语24字整体教学法Cairo/'kaiorou/开罗（埃及首都）Tanzania//出nz a'ni:a/坦桑尼亚（国家名）the Kremlin/'kremlin/ 克里姆林（宫）Moscow/'mpsk s u/莫斯科（俄罗斯首都）Saint Basil's Cathedral /'s s nt ,b^zlz k s' 9 i:dr s l/ 圣瓦希里大教堂the Forbidden/f s'bidn/City 紫禁城Los Angeles/,los '出nd3s li:z/洛杉矶（美国城市）Unit 2poster /'p s ust s（r）/n.海报illegal/i'li:gl/adj.不合法的；非法的illegally/il'li:g s li/adv.不合法地；非法地hunt/hAnt/vt.& vi.打猎；搜寻；追捕hunter/'hAnt s/n.猎人immediately/i'mi:di s tli/adv.^^ species/'spi:fi:z/n.物种shark/fa:k/n.鲨鱼fin/fin/n.（鱼的）鳍on earth（放在疑问词之后表示强调）究竟；到底die out灭亡；逐渐消失alarming/s'la:min/adj.惊人的；使人惊恐的alarm/s'la:m/vt.使惊恐；使害怕；使担心n.恐慌；警报；警报器rate/reit/n.速度；（比）率vt.划分等级步rating/'reitin/n.等级；级别extinct/k'stinkt/adj.已灭绝的extinction/ik'stinkfn/n.灭绝mass/m 出s/adj.大量的；广泛的n.大量；堆；群habitat/'h出bit出t/n.（动植物的）生活环境；栖息地aware/s'we s（r）/adj.知道；发觉；有意识的aware of意识到；知道endanger/in'deind3a（r）/vt.使遭受危险；危害average/'出v s rid3/n.平均数；平均水平adj.平均的；正常的；普通的on average 平均prince/prins/n.王子；王孙；亲王make progress取得进步concern/k a n's3:n/vt.涉及；让... 担忧concerned/k a n's3:nd/adj.担心的；关切的concerned about对..... 关切的；为...... 担忧的living/'livin/adj.居住的；活的；在用的n.生活；生计adapt/a'd出pt/vi.适应vt.使适应；使适合adapt to 适应measure /'me3a（r）/n.措施；方法vt.测量；度量；估量英语24字整体教学法authority/a:'®pr a ti/n.官方；当权；权威pressure /'pref a(r)/n.压力；要求under pressure在压力下；承受压力whale/werl/n.鲸antelope /'出ntibup/n.羚；羚类动物Tibetan antelope 藏羚羊reserve/ri'z3:v/n.(动植物)保护区；储藏(量)vt.预订；预留；保留plain/plein/n.平原adj.简单明了的；直率的；平凡的make out看清；听清；分清herd/h3:d/n.牧群；鲁群observe/a b'z3:v/vt.观察(到)；注视；遵守beauty/'bju:ti/n.美；美人；美好的东西remind/ri'maind/vt.提醒；使想起remind sb of sb/sth使某人想起(类似的人或物)fur/f3:/n.毛(皮)；毛皮衣服sacred/'seikrid/adj.神圣的；受尊敬的shoot/fu:t/vt.& vi.(shot,shot)射杀；射伤；发射profit/'profit/n.利润；利益watch over保护；照管；监督day and night日日夜夜；夜以继日attack/a't出k/n.,vi.& vt.攻击；抨击effective/lfektiv/adj有效的；生效的recover/rr'kav a(r)/vi.恢复；康复vt.找回；寻回remove/ri'mu:v/vt.去除；移开；脱去intend/in'tend/vi.& vt.打算；计划；想要threat/ 9 ret/n.威胁threaten/' 9 retn/vt.威胁；危及exist/1g'zist/vi.存在；生存harmony/'ha:moni/n.和谐；融洽goods/godz/n.商品；货物creature/'kri:tf a(r)/n.生物；动物deer/di a(r)/n.鹿kangaroo/k出门83川:加.袋鼠reduce/ri'dju:s/ vt.减少due/dju:/adj.由于；因为due to由于；因为insect/'insekt/n.昆虫net/net/n.=Internet;网adj.净得的；纯的neighbourhood/'neib s hud/ n.临近的地方；街区binoculars/bi'npkjol a z/n.双筒望远镜bird field guide 鸟类图鉴search for搜索；查找英语24字整体教学法dolphin/'dolfin/n.海豚Yangtze River dolphin 白鳍豚koala/k a u'a:l a/n.树袋熊；考拉stir/st3:/vt.激发；搅动stir up激起emotion/i'm a ufn/n.感情；情感；情绪skin/skin/n.皮；皮肤unusual/An'ju:3u a l/adj.特别的；不寻常的Tibetan/tr′betn/ adj.西藏的；藏语的；藏族（人）的n.西藏人；藏族人；藏语丁七01/七七01/"西藏Unit 3blog/blbg/n.博客vi.写博客blog post博文；博客帖子blogger/'blog a（r）/n.博客作者；博主engine/'end3in/n.引擎；发动机；火车头search engine（互联网上的）搜索引擎chat/tfa出t/vi.聊天；闲聊stream/stri:m/ vt.流播（不用下载直接在互联网上播放音视频）；流出vi.流动n.小河；溪流identity/ar'dentati/n.身份；个性identity card 身份证convenient /k a n'vi:ni a nt/adj.方便的；近便的cash/k出l n.现金；金钱update/,ap'deit/vt.更新；向提供最新信息n.更新；最新消息database/'deit a beis/n.数据库；资料库software/'spftwe a（r）/n.软件network/'netw3:（r）k/n.（互联）网络；网状系统；人际网▽七将连接成网络；联播vi. 建立工作关系stuck/stak/adj.卡住；陷（入）；困（于）keep sb company 陪伴某人surf/s3:（r）f/vt.& vi.浏览；冲浪benefit/'benifit/n.益处vt.使受益vi.得益于distance/'distons/n.距离inspire/in'spat a（r）/vt.鼓舞；激励；启发思考now that既然；由于access/'出kses/ n.通道；（使用、查阅、接近或面见的）机会▽七进入；使用；获取charity/'tf出r a ti/n.慈善；慈善机构（或组织）go through经历；度过；通读tough/taf/adj.艰难的；严厉的province/'provins/n省conference/'konf a r a ns/ n.会议；研讨会；正式会谈resident/'rezid a nt/n.居民；（美国的）住院医生adj.（在某地）居住的plus/plas/conj.而且；此夕卜n.加号；优势prep.加；另加英语24字整体教学法function/'fAnkfn/n.功能；作用；机能vi.起作用；正常工作；运转battery/'b出tri/工电池confirm/k a n'f3:(r)m/vt.确认；使确信Wi-Fi/'wai fa1/n.无线保真(用无线电波而非网线在计算机网络传输数据的系统) press/pres/ vt.按，压；敦促button/'bAtn/n.按钮；纽扣file/fail/n.文件；文件夹；档案in shape状况良好keep track of掌握.... 的最新消息；了解...... 的动态discount/'diskaunt/n.^^ vt.打折account/'kaont/n.账户；描述click/klik/vt.& vi.点击privacy /'priv s si; NAmE 'praiv-/n.隐私；私密theft/0eft/n.偷(窃)盗窃罪rude/ru:d/adj.粗鲁的；无礼的target/'ta:git/n.目标；对象；靶子vt.把..... 作为攻击目标troll/trol; troul/ n.发挑衅帖子的人；恶意挑衅的帖子cyberbully/'sarb a buli/n.网霸vt.& vi.网络欺凌false/fs:ls/adj.假的；错误的particular/p s'tikjal s(r)/ adj.特定的；特别的；讲究的embarrassing/im'ber a sin/ adj.让人难堪(尴尬；害羞)的make fun of取笑；戏弄upset/Ap'set/ adj.心烦的；苦恼的；沮丧的vt.(upset,upset)使烦恼；使生气；搅乱guideline/'gaidlain/n.准则；指导原则author /'5: 9 a(r)/n.作者；作家tip/tip/n.忠告；诀窍；实用的提示familiar/f a'mili a(r)/adj.熟悉；熟知keep (...)in mind 牢记define/di′fain/vt.给 ... 下定义；界定；解释case/kers/n.盒；箱；情况；案件the World Wide Web abbr.WWW万维网；环球信息网Jan/d3出n/Tchamani/tfe'm出ni/简•夏曼尼Birmingham/'b3:min s m;NAmE 'b3:rminh出m/ 伯明翰(英国城市)Unit 4Confucius/kan'fju:f a s/n.孔子mansion/'m出nfn/n.公馆；宅第cemetery/'sem a tri/n.墓地；公墓philosophy/f s'lps s fi/ n.哲学descendant/di'send a nt/n.后裔；后代；子孙individual/indr'vid3u a l/adj.单独的；个别的门.个人heel/hi:/n.足踉；(脚、袜子、鞋等的)后是艮英语24字整体教学法Achilles'/a'kili:z/heel（喻）（希腊神话）阿喀琉斯的脚跟，致命的弱点kingdom/'kind a m/n.王国；领域chief/tfi:f/adj.最重要的；最高级别的n.（公司或机构的）首领；酋长puzzle/'pAzl/n.谜；智力游戏；疑问vt.迷惑；使困惑nearby/,n a'bal/adj.附近的；邻近的adv.在附近join...to.HE .......... 和 .... 连接或联结起来break away （from sb/sth）脱离；背叛；逃脱belong/bi'lon/vi.应在（某处）；适应belong to 属于as well as同（一样也）；和；还currency /'kAr a nsi/n.通货；货币military /'mil a tri/ adj.军事的；军用的defence /di'fens/ n.防御；保卫legal/'li:gl/adj.法律的；合法的surround /s a'raund/ vt.围绕；包围evidence /'evid a ns/ n.证据；证明achievement /a'tfi:vm a nt/ n.成就；成绩；达到location/l a u'keifn/n.地方；地点；位置conquer /'ko n k a（r）/ vt.占领；征服；控制battle /'b出tl/n.战役；搏斗vi.& vt.搏斗；奋斗port/po:t/n.港口（城市）fascinating/'f出sineitin/adj.极有吸引力的；迷人的keep your eyes open（for）留心；留意charge /tfa:d3/n.收费；指控；主管vt.收费；控告；充电announce /a'nauns/vt.宣布；通知；声称amount /a'maunt/ n.金额；数量gallery /'g出l a ri/ n.（艺术作品的）展览馆；画廊approach/a'pr a utf/n.方法；途径；接近vt.接近；接洽；着手处理vi.靠近ensure /in'fu a （r）/vt.保证；确保；担保landscape/'l出ndskeip/ n.（陆上，尤指乡村的）风景generous/'d 3 en a r a s/ adj.慷慨的；大方的；丰富的butter /'bat a（r）/n.黄油；奶油vt.涂黄油于八。

第一单元文件操作第1 题【操作要求】1.建立新文件：运行AutoCAD 软件，建立新模板文件，模板的图形范围是120×90，0 层颜色为红色（RED ）。

2.保存：将完成的图形以KSCAD1-1.DWT 为文件名保存在考生文件夹中。

第2 题【操作要求】1.建立新文件：运行AutoCAD 软件，建立新模板文件，模板的图形范围是1200×900，加载线型为acad_iso03W100 ，设此线型为当前线型，设置合理的线型比例。

2.保存：将完成的图形以KSCAD1-2.DWT 为文件名保存在考生文件夹中。

第3 题【操作要求】1.建立新文件：运行AutoCAD 软件，建立新模板文件，模板的图形范围是4200×2900 ，网格（grid ）点矩为100。

2.保存：将完成的图形以KSCAD1-3.DWT 为文件名保存在考生文件夹中。

第4 题【操作要求】1.建立新文件：运行AutoCAD 软件，建立新模板文件，模板的图形范围是4200×2900 ，光标捕捉（snap ）间距为100 ，并打开光标捕捉。

2.保存：将完成的图形以KSCAD1-4.DWT 为文件名保存在考生文件夹中。

第5 题【操作要求】1.建立新文件：运行AutoCAD 软件，建立新模板文件，模板的图形范围是4200×2900 ，设置单位为Meters ，长度、角度单们精确度为小数后 3 位。

2.保存：将完成的图形以KSCAD1-5.DWT 为文件名保存在考生文件夹中。

第6 题【操作要求】1.建立新文件：运行AutoCAD 软件，建立新模板文件，模板的图形范围是4200×2900 ，打开正交模式。

打开Osanp 捕捉模式，并设置端点、平行、垂直捕捉。

2.保存：将完成的图形以KSCAD1-6.DWT 为文件名保存在考生文件夹中。

第7 题【操作要求】1.建立新文件：运行AutoCAD 软件，建立新模板文件，模板的图形范围是4200×2900 ，设置单位为Meters ，长度、角度单们精确度为小数后 2 位。