Journals

投稿指南（中文版）Journal Publishing Agreement每篇手稿在提交时都必须正确填写并签署期刊出版协议。

一旦手稿被分配给编辑，ACS Paragon Plus提供的电子版本的协议将会在作者的通讯主页上显示My Authoring Activity选项。

该协议的PDF版本也可以使用，但强烈建议作者使用电子期刊出版的协议。

如果使用的是PDF版本，必须提交PDF签署的所有页面。

如果通讯作者不能或不应该以任何理由完成电子版或PDF版本，那么另一位作者应签署PDF版本形式。

可以在该网站获得期刊出版协议的完整的指导说明/page/copyright/journals/index.html.Cover LetterCover letter必须和稿件同时提交，可以使用Word或PDF文件创建或输入到ACS Paragon Plus Environment相应的文本框中。

信中必须提供通讯作者的姓名、邮编和电子邮件地址及电话和传真号码。

相关编辑稿件的接收、状态、审查、修订及提交的所有相关稿件将只发送给已被指定为评估稿件的通讯作者。

通讯作者负责处理和论文发表之前或者之后所有的事情并且获得合著者在修订稿件内容或诠释上做出的一些实质性建议。

投稿信可能会推荐一个合适的JACS副主编。

然而，分配给副主编的稿件最终由编辑自行决断。

作者必须建议至少六到八人主管审阅他们的稿件，其中至少一半是来自北美的评论员。

选择合适的评论员是副主编在处理稿件时的独有的权利。

投稿信应明确保证稿件没有在发表进行中，也没有在任何其他媒介中发表，包括电子期刊和公共性质的电脑资料库。

论文投稿所有稿件必须通过ACS Paragon Plus Environment发表(/login). 完整的指导说明和电子在线（网络）提交过程的概述都可以通过安全ACS Paragon Plus 网站获取信息。

同时，作者还须通过ACS Paragon Plus Environment提交所有修改的稿件。

使用手冊目次BMJ出版簡介 (2)BMJ Journals Online (2)BMJ-British Medical Journal (4)BMJ首頁功能選項介紹 (5)Articles文章 (5)Interaction互動 (6)Services服務 (7)Other resources其他連結資源 (8)檢索方式 (9)快速查詢 (9)進階查詢 (9)檢索結果 (10)E-mail Alert (13)Alerts based on journal issues and new Online First articles (13)Alerts based on a particular article (13)Alerts based on a particular word or words and Search Terms (14)Alerts based on UK health news stories (14)Gut (15)Gut首頁各項功能 (15)Current Issue (15)Special Features (17)Online tools (17)Site resources (19)Online First (20)Search Gut (21)Related Resources (22)檢索方式、檢索結果、Email Alert (22)BMJ出版簡介BMJ-British Medical Journal 《英國醫學雜誌》是由英國醫學會（British Medical Association）、英國BMJ出版集團出版的一種綜合醫學、臨床醫學學會刊物。

該刊初創於1840年，1857年改為現名，每年出版51期，每週五出刊，主要刊載醫學科學原始研究論文、綜述、教育性論文以及對人類健康有影響的臨床、科學、社會、政治與經濟因素等方面的評論性文章，也刊登相關書評、新聞等類型文章並介紹醫學新發展、討論醫學道德問題，每週也用較大的篇幅刊登編輯者述評（Editorials）、新聞（News）和讀者來信（Letters）等類型的文獻。

免费外文电子期刊推荐（之一）2008年06月06日星期五10:05利用我的工作之便，我搜集了一些网络资料，可以帮助朋友们搞科研和论文写作。

现在给大家推荐一些网上免费的高层次外文电子期刊，希望对大家有所帮助，另外，如果朋友们需要搜集什么外文资料，特别是外文期刊上的文章，我可以给大家帮忙。

不用谢，Let's help each other免费外文电子期刊推荐（之一）1、Directory of Open Access Journals（DOAJ）一访问网址：/该系统收录的均为学术性、研究性期刊，一般都是经过同行评审，或者有编辑作质量控制的期刊，具有免费、全文、高质量的特点，对学术研究有很高的参考价值。

该目录及其收录期刊、论文可自由存取，任何人可以使用，不反对商业用途。

该目录的目标是包含各种语言、各个主题的期刊。

2、Digital Technical Journal访问网址：/wrl/DECarchives/DTJ/这份刊物是由COMPAQ公司所出版的数位科技期刊，主要是在介绍有关数位工程技术方面的文章：包括标准设定网络与储存的技术、VAX系统的介绍、ALPHA微处理器与半导体技术、进阶应用软件及提升效能产品的介绍等，除此之外，每期皆有一特定主題的专论文章；本杂志的內容多是由公司內部的工程人員抽空所撰写的，因此是一分兼具理论与实践的专业期刊。

3、Carleton University Student Journal of Philosophy访问网址：http://rideau.carleton.ca/philosophy/cusjp/该期刊是由Carleton大学哲学系的学生所创办的一分哲学期刊，其內容主要在收录各大学哲学系大学部学生及研究生针对有关哲学方面多种主題所发表的文章，该期刊自1997年起开始电子版的发行。

4、Australian Humanities Review访问网址：.au/AHR/本期刊主要发行目地在于提供图书馆自动化与资讯检索的相关讯息，包括技术研发成果、市场行销、自动化系统软硬件评估、各类型图书馆系统展示指南及设备厂商指引等。

1IEEE Abbreviations for Transactions, Journals, LettersNOTE: * denotes past acronyms/abbreviations of journals (used for pre-1988 publications).Publication Acronym Reference Abbreviation IEEE T RANSACTIONS ON A DVANCED P ACKAGING ADVP IEEE Trans. Adv. Packag.CPMTB * IEEE Trans. Compon., Packag., Manuf. Technol. B * (1994–1998) IEEE T RANSACTIONS ON A EROSPACE AND E LECTRONIC S YSTEMS AES IEEE Trans. Aerosp. Electron. Syst. ANE* IEEE Trans. Aeronaut. Navig. Electron.* ANE* IEEE Trans. Aerosp. Navig. Electron.* AS* IEEE Trans. Aerosp.* MIL* IEEE Trans. Mil. Electron.* AE* IEEE Trans. Airborne Electron.* IEEE T RANSACTIONS ON A NTENNAS AND P ROPAGATION AP IEEE Trans. Antennas Propag. IEEE A NTENNAS AND W IRELESS P ROPAGATION L ETTERS LAWP IEEE Antennas Wireless Propag. Lett. IEEE T RANSACTIONS ON A PPLIED S UPERCONDUCTIVITY ASC IEEE Trans. Appl. Supercond. IEEE T RANSACTIONS ON A UTOMATIC C ONTROL AC IEEE Trans. Autom. Control IEEE T RANSACTIONS ON A UTOMATION S CIENCE AND E NGINEERINGASE IEEE Trans. Autom. Sci. Eng. (from July 2004) IEEE T RANSACTIONS ON A UTONOMOUS M ENTAL D EVELOPMENT AMD IEEE Trans. Auton. Mental Develop. IEEE R EVIEWS IN B IOMEDICAL E NGINEERING RBME IEEE Rev. Biomed. Eng. IEEE T RANSACTIONS ON B IOMEDICAL E NGINEERING BME IEEE Trans. Biomed. Eng. BME* IEEE Trans. Bio-Med. Eng.* BME* IEEE Trans. Bio-Med. Electron.* PGME* IEEE Trans. Med. Electron.* IEEE T RANSACTIONS ON B IOMEDICAL C IRCUITS AND S YSTEMS BCAS IEEE Trans. Biomed. Circuits Syst. IEEE T RANSACTIONS ON B ROADCASTING BC IEEE Trans. Broadcast. BC* IEEE Trans. Broadcast. Technol.* IEEE T RANSACTIONS ON C IRCUITS AND S YSTEMS —I: R EGULAR P APERS CSI IEEE Trans. Circuits Syst. I, Reg. Papers IEEE T RANSACTIONS ON C IRCUITS AND S YSTEMS —II: E XPRESS B RIEFS CSII IEEE Trans. Circuits Syst. II, Exp. Briefs IEEE T RANSACTIONS ON C IRCUITS AND S YSTEMS —I: F UNDAMENTAL T HEORY AND A PPLICATIONS CAS1* IEEE Trans. Circuits Syst. I, Fundam. Theory Appl. (1993–2003) IEEE T RANSACTIONS ON C IRCUITS AND S YSTEMS —II: A NALOG AND D IGITAL S IGNAL P ROCESSING CAS2* IEEE Trans. Circuits Syst. II, Analog Digit. Signal Process.(1993–2003) CAS* IEEE Trans. Circuits Syst.* (1974–1992) CT* IEEE Trans. Circuit Theory * (until 1973) IEEE T RANSACTIONS ON C IRCUITS AND S YSTEMS FOR V IDEO T ECHNOLOGY CSVT IEEE Trans. Circuits Syst. Video Technol. IEEE T RANSACTIONS ON C OMMUNICATIONS COM IEEE Trans. Commun. COM*IEEE Trans. Commun. Technol.* (through 1971) IEEE C OMMUNICATIONS L ETTERS COMML IEEE Commun. Lett. IEEE T RANSACTIONS ON C OMPONENTS AND P ACKAGING T ECHNOLOGY CAPT IEEE Trans. Compon. Packag. Technol.CPMTA* IEEE Trans. Compon., Packag., Manuf. Technol. A * (1994–1998)CHMT* IEEE Trans. Compon., Hybrids, Manuf. Technol.* (1978–1993)MFT* IEEE Trans. Manuf. Technol.* (1972–1977)PHP* IEEE Trans. Parts, Hybrids, Packag.* (June 1971–1977) PMP* IEEE Trans. Parts, Mater., Packag.* (until 1971)Publication Acronym Reference AbbreviationIEEE T RANSACTIONS ON C OMPUTER-A IDED D ESIGN OFI NTEGRATED C IRCUITS AND S YSTEMS CAD IEEE Trans. Comput.-Aided Design Integr. Circuits Syst. IEEE T RANSACTIONS ON C OMPUTATIONAL I NTELLIGENCEAND A RTIFICIAL I NTELLIGENCE IN G AMES CIAIG IEEE Trans. Comput. Intell. AI in Games.IEEE C OMPUTER A RCHITECTURE L ETTERS IEEE Comput. Archit. Lett.IEEE T RANSACTIONS ON C ONSUMER E LECTRONICS CE IEEE Trans. Consum. Electron.IEEE T RANSACTIONS ON C ONTROL S YSTEMS T ECHNOLOGY CST IEEE Trans. Control Syst. Technol.IEEE T RANSACTIONS ON D EVICE AND M ATERIALSR ELIABILITY DMR IEEE Trans. Device Mater. Rel.IEEE T RANSACTIONS ON D IELECTRICS AND E LECTRICALI NSULATION DEI IEEE Trans. Dielectr. Electr. Insul.EI* IEEE Trans. Electr. Insul.*(until 1993)IEEE/OSA J OURNAL OF D ISPLAY T ECHNOLOGY DT J. Display Technol.IEEE T RANSACTIONS ON E DUCATION E IEEE Trans. Educ.IEEE T RANSACTIONS ON E LECTROMAGNETICC OMPATIBILITY EMC IEEE Trans. Electromagn. Compat.RFI* IEEE Trans. Radio Freq. Interference*IEEE T RANSACTIONS ON E LECTRON D EVICES ED IEEE Trans. Electron DevicesIEEE E LECTRON D EVICE L ETTERS EDL IEEE Electron Device Lett.IEEE T RANSACTIONS ON E LECTRONICS P ACKAGINGM ANUFACTURING EPM IEEE Trans. Electron. Packag. Manuf.CPMTC* IEEE Trans. Compon., Packag., Manuf.Technol. C* (1996–1998)IEEE E MBEDDED S YSTEMS L ETTERS ES IEEE Embedded Syst. Lett.IEEE T RANSACTIONS ON E NERGY C ONVERSION EC IEEE Trans. Energy Convers.IEEE T RANSACTIONS ON E NGINEERING M ANAGEMENT EM IEEE Trans. Eng. Manag.IEEE T RANSACTIONS ON E VOLUTIONARY C OMPUTATION EVC IEEE Trans. Evol. Comput.IEEE T RANSACTIONS ON F UZZY S YSTEMS FUZZ IEEE Trans. Fuzzy Syst.IEEE T RANSACTIONS ON G EOSCIENCE AND R EMOTES ENSING GRS IEEE Trans. Geosci. Remote Sens.IEEE G EOSCIENCE AND R EMOTE S ENSING L ETTERS GRSL IEEE Geosci. Remote Sens. Lett.IEEE T RANSACTIONS ON I MAGE P ROCESSING IP IEEE Trans. Image Process.IEEE T RANSACTIONS ON I NDUSTRIAL E LECTRONICS IE IEEE Trans. Ind. Electron.IEEE T RANSACTIONS ON I NFORMATION F ORENSICS ANDS ECURITY IFS IEEE Trans. Inf. Forensics SecurityIEEE T RANSACTIONS ON I NDUSTRIAL I NFORMATICS IINF IEEE Trans Ind. Informat.IEEE T RANSACTIONS ON I NDUSTRY A PPLICATIONS IA IEEE Trans. Ind. Appl.IEEE T RANSACTIONS ON I NFORMATION T ECHNOLOGYIN B IOMEDICINE ITB IEEE Trans. Inf. Technol. Biomed.IEEE T RANSACTIONS ON I NFORMATION T HEORY IT IEEE Trans. Inf. TheoryIEEE T RANSACTIONS ON I NSTRUMENTATION ANDM EASUREMENT IM IEEE Trans. Instrum. Meas.I, PGI* IEEE Trans. Instrum.*IEEE T RANSACTIONS ON I NTELLIGENT T RANSPORTATIONS YSTEMS ITS IEEE Trans. Intell. Transp. Syst.IEEE T RANSACTIONS ON K NOWLEDGE AND D ATAE NGINEERING KDE IEEE Trans. Knowl. Data Eng.IEEE/OSA J OURNAL OF L IGHTWAVE T ECHNOLOGY LT J. Lightw. Technol.IEEE T RANSACTIONS ON M AGNETICS MAG IEEE Trans. Magn.IEEE/ASME T RANSACTIONS ON M ECHATRONICS MECH IEEE/ASME Trans. MechatronicsIEEE T RANSACTIONS ON M EDICAL I MAGING MI IEEE Trans. Med. Imag.IEEE/ASME J OURNAL OF M ICROELECTROMECHANICALS YSTEMS MEMS J. Microelectromech. Syst.IEEE M ICROWAVE AND G UIDED W AVE L ETTERS MGWL IEEE Microw. Guided Wave Lett. (until 2002)IEEE M ICROWAVE AND W IRELESSC OMPONENTS L ETTERS LMWC IEEE Microw. Wireless Compon. Lett.IEEE T RANSACTIONS ON M ICROWAVE T HEORY ANDMTT IEEE Trans. Microw. Theory Tech.T ECHNIQUESPublication Acronym Reference AbbreviationIEEE T RANSACTIONS ON M ULTIMEDIA MM IEEE Trans. MultimediaIEEE T RANSACTIONS ON M OBILE C OMPUTING MC IEEE Trans. Mobile Comput.IEEE T RANSACTIONS ON M ULTIMEDIA MM IEEE Trans. MultimediaIEEE T RANSACTIONS ON N ANO B IOSCIENCE NB IEEE Trans. Nanobiosci.IEEE T RANSACTIONS ON N ANOTECHNOLOGY NANO IEEE Trans. Nanotechnol.IEEE T RANSACTIONS ON N ETWORK AND S ERVICEM ANAGEMENT NSM IEEE Trans. Netw. Service Manag.IEEE/ACM T RANSACTIONS ON N ETWORKING NET IEEE/ACM Trans. Netw.IEEE T RANSACTIONS ON N EURAL N ETWORKS NN IEEE Trans. Neural Netw.IEEE T RANSACTIONS ON N UCLEAR S CIENCE NS IEEE Trans. Nucl. Sci.IEEE T RANSACTIONS ON N EURAL S YSTEMS ANDR EHABILITATION E NGINEERING NSRE IEEE Trans. Neural Syst. Rehabil. Eng.IEEE T RANSACTIONS ON R EHABILITATION E NGINEERING RE* IEEE Trans. Rehabil. Eng.*(1993–2000)IEEE J OURNAL OF O CEANIC E NGINEERING OE IEEE J. Ocean. Eng.IEEE J OURNAL OF O PTICAL C OMMUNICATIONS ANDN ETWORKING OCN IEEE J. Opt. Commun. Netw.IEEE T RANSACTIONS ON P ARALLEL AND D ISTRIBUTEDS YSTEMS PDS IEEE Trans. Parallel Distrib. Syst.IEEE T RANSACTIONS ON P ATTERN A NALYSIS ANDM ACHINE I NTELLIGENCE PAMI IEEE Trans. Pattern Anal. Mach. Intell.IEEE P HOTONICS T ECHNOLOGY L ETTERS PTL IEEE Photon. Technol. Lett.IEEE P HOTONICS J OURNAL PJ IEEE Photon. J.IEEE T RANSACTIONS ON P LASMA S CIENCE PS IEEE Trans. Plasma Sci.IEEE T RANSACTIONS ON P OWER A PPARATUS AND S YSTEMS PAS* IEEE Trans. Power App. Syst.*(through 1985)IEEE T RANSACTIONS ON P OWER D ELIVERY PWRD IEEE Trans. Power Del.IEEE T RANSACTIONS ON P OWER E LECTRONICS PEL IEEE Trans. Power Electron.IEEE P OWER E LECTRONICS L ETTERS LPEL IEEE Power Electron Lett.IEEE T RANSACTIONS ON P OWER S YSTEMS PWRS IEEE Trans. Power Syst.IEEE J OURNAL OF P RODUCT S AFETY E NGINEERING IEEE J. Product Safety Eng.IEEE T RANSACTIONS ON P ROFESSIONAL C OMMUNICATION PC IEEE Trans. Prof. Commun.IEEE J OURNAL OF Q UANTUM E LECTRONICS QE IEEE J. Quantum Electron.IEEE T RANSACTIONS ON R ELIABILITY R IEEE Trans. Rel.IEEE T RANSACTIONS ON R OBOTICS RO IEEE Trans. Robot..IEEE T RANSACTIONS ON R OBOTICS AND A UTOMATION RA* IEEE Trans. Robot. Autom.*(1989–June 2004)RA* IEEE J. Robot. Autom.* (1985–1988)IEEE J OURNAL OF S ELECTED T OPICS IN A PPLIED E ARTHO BSERVATIONS IN R EMOTE S ENSING STAERS IEEE J. Sel. Topics Appl. Earth Observ. IEEE J OURNAL ON S ELECTED A REAS IN C OMMUNICATIONS SAC IEEE J. Sel. Areas Commun.IEEE J OURNAL OF S ELECTED T OPICS IN Q UANTUME LECTRONICS STQE IEEE J. Sel. Topics Quantum Electron.IEEE J OURNAL OF S ELECTED T OPICS IN S IGNALP ROCESSING STSP IEEE J. Sel. Topics Signal Process.IEEE T RANSACTIONS ON S EMICONDUCTORM ANUFACTURING SM IEEE Trans. Semicond. Manuf.IEEE S ENSORS J OURNAL SEN IEEE Sensors J.IEEE T RANSACTIONS ON S IGNAL P ROCESSING SP IEEE Trans. Signal Process.ASSP* IEEE Trans. Acoust., Speech, SignalProcess. * (1975–1990)AU* IEEE Trans. Audio Electroacoust.(until 1974)IEEE S IGNAL P ROCESSING L ETTERS SPL IEEE Signal Process. Lett.IEEE S YSTEMS J OURNAL SYSJ IEEE Syst. J.IEEE T RANSACTIONS ON S OFTWARE E NGINEERING SE IEEE Trans. Softw. Eng.IEEE J OURNAL OF S OLID-S TATE C IRCUITS SSC IEEE J. Solid-State CircuitsIEEE T RANSACTIONS ON S PEECH AND A UDIO P ROCESSING SAP IEEE Trans. Speech Audio Process.IEEE T RANSACTIONS ON S YSTEMS,M AN, ANDC YBERNETICS—P ART A:S YSTEMS AND H UMANS SMCA IEEE Trans. Syst., Man, Cybern. A, Syst., HumansPublication Acronym Reference AbbreviationIEEE Transactions on Sustainable Energy IEEE T RANSACTIONS ON S YSTEMS,M AN, ANDC YBERNETICS—P ART B:C YBERNETICS STESMCBIEEE Trans. Sustainable EneryIEEE Trans. Syst., Man, Cybern. B, Cybern.IEEE T RANSACTIONS ON S YSTEMS,M AN, ANDC YBERNETICS—P ART C:A PPLICATIONS AND R EVIEWS SMCC IEEE Trans. Syst., Man, Cybern. C, Appl. Rev. SMC* IEEE Trans. Syst., Man, Cybern.*(1971–1995)SSC* IEEE Trans. Syst. Sci. Cybern.*(through 1970)IEEE T RANSLATION J OURNAL ON M AGNETICS IN J APAN TJMJ IEEE Transl. J. Magn. Jpn.MMS* IEEE Trans. Man-Mach. Syst.*(through 1970)HFE* Hum. Factors Electron. *(through 1968)IEEE J OURNAL ON T ECHNOLOGY IN C OMPUTER A IDEDD ESIGN JTCAD IEEE J. Technol. Computer Aided Design IEEE T RANSACTIONS ON U LTRASONICS,F ERROELECTRICS,AND F REQUENCY C ONTROL UFFC IEEE Trans. Ultrason., Ferroelectr.,Freq. ControlSU* IEEE Trans. Sonics Ultrason.*(through 1985)UE* IEEE Trans. Ultrason. Eng.*PGUE* IEEE Trans. Ultrason. Eng.*IEEE T RANSACTIONS ON V EHICULAR T ECHNOLOGY VT IEEE Trans. Veh. Technol.VC* IEEE Trans. Veh. Commun.*IEEE T RANSACTIONS ON V ERY L ARGE S CALEI NTEGRATION (VLSI) S YSTEMS VLSI IEEE Trans. Very Large Scale Integr. (VLSI) Syst. IEEE T RANSACTIONS ON V ISUALIZATION ANDC OMPUTER G RAPHICS VCG IEEE Trans. Vis. Comput. GraphicsIEEE T RANSACTIONS ON W IRELESS C OMMUNICATIONS WC IEEE Trans. Wireless Commun.P ROCEEDINGS OF THE IEEE Proc. IEEEProc. IRE* (through 1962)IEEE EDITORIAL STYLE MANUAL 5List of IEEE MagazinesMagazines Reference AbbreviationIEEE Aerospace and Electronics Systems Magazine IEEE Aerosp. Electron. Syst. Mag.IEEE Annals of the History of Computing IEEE Ann. Hist. Comput.IEEE Antennas and Propagation Magazine IEEE Antennas Propag. Mag.IEEE ASSP Magazine (1984–1990) IEEE ASSP Mag.IEEE Circuits and Systems Magazine (1979–1984) IEEE Circuits Syst. Mag.IEEE Circuits and Devices Magazine (1985–present) IEEE Circuits Devices Mag.IEEE Communications Society Magazine (through 1978) IEEE Commun. Soc. Mag.IEEE Communications Magazine (1979–present) IEEE Commun. Mag.IEEE Computational Intelligence Magazine IEEE Comput. Intell. Mag.IEEE Computational Science and Engineering IEEE Comput. Sci. Eng.IEEE Computer Applications in Power IEEE Comput. Appl. PowerIEEE Computer Graphics and Application IEEE Comput. Graph. Appl.IEEE Concurrency IEEE ConcurrencyIEEE Control Systems Magazine IEEE Control Syst. Mag.IEEE Design & Test of Computers IEEE Des. Test. Comput.IEEE Electrical Insulation Magazine IEEE Electr. Insul. Mag.IEEE ElectroTechnology Review IEEE ElectroTechnol. Rev.IEEE Engineering in Medicine and Biology Magazine IEEE Eng. Med. Biol. Mag.IEEE Engineering Management Review IEEE Eng. Manag. Rev.IEEE Expert (through 1997) IEEE ExpertIEEE Industrial Electronics Magazine IEEE Ind. Electron.. Mag.IEEE Industry Applications Magazine IEEE Ind. Appl. Mag.IEEE Instrumentation and Measurement Magazine IEEE Instrum. Meas. Mag.IEEE Intelligent Systems (formerly IEEE Expert) IEEE Intell. Syst.IEEE Internet Computing IEEE Internet Comput.IEEE IT Professional IEEE IT Prof.IEEE Micro IEEE MicroIEEE Microwave Magazine IEEE Microw. Mag.IEEE MultiMedia IEEE MultimediaIEEE Nanotechnology Magazine IEEE Nanotechnol. Mag.IEEE Network IEEE Netw.IEEE Personal Communications IEEE Pers. Commun.IEEE Potentials IEEE PotentialsIEEE Power and Energy Magazine IEEE Power Energy Mag.IEEE Power Engineering Review IEEE Power Eng. Rev.IEEE Robotics and Automation Magazine IEEE Robot. Autom. Mag.IEEE Signal Processing Magazine (1991–present) IEEE Signal Process. Mag.IEEE Solid State Circuits Magazine IEEE Solid State Circuits Mag.IEEE Security and Privacy IEEE Security PrivacyIEEE Software IEEE Softw.IEEE Spectrum IEEE Spectr.IEEE Technology and Society Magazine IEEE Technol. Soc. Mag.IEEE Vehicular Technology Magazine IEEE Veh. Technol. Mag.Communications Surveys and Tutorials Commun. Surveys Tuts.Computer ComputerInternet Computing Internet Comput.Pervasive Computing Pervasive Comput.Today’s Engineer Today’s EngineerWireless Communications Wireless Commun.。

TitleName, first author1AffiliationFull Mailing Addresse-mailASME Membership (if applicable)Name, second authorAffiliationFull Mailing Addresse-mailASME Membership (if applicable)Name, third authorAffiliationFull Mailing Addresse-mailASME Membership (if applicable)Name, add additional authors as necessaryAffiliationFull Mailing Addresse-mailASME Membership (if applicable)ABSTRACTA short abstract (250 words maximum) should open the paper. The purposes of an abstract are: (1) to give a clear indication of the objective, scope, and results of the paper so that readers may determine whether the full text will be of particular interest to them; (2) to provide key words and phrases for indexing, abstracting, and retrieval purposes. The abstract should not attempt to condense the whole subject matter into a few words for quick reading.1 Corresponding author information can be added as a footnote.INTRODUCTIONBecause ASME typesets accepted papers prior to publication, it is not necessary for authors to do more than structural formatting for the body of the paper. Figures and tables should not be inserted in the text, but each should be included on a separate page at the end of the paper. For readability, please be sure to use double spacing.A citation must appear for each reference in the reference section. Citations should be consecutively numbered using square brackets [1]. The sentence punctuation follows the brackets [2]. Multiple references [2, 3] or a range of references [4-7] should appear within a single set of brackets. In sentences, refer simply to the reference number, as in [8]. Do not use “Ref. [9]” or “reference [9]” except at the beginning of a sent ence: “Reference [9] shows ... ”. The References should be in a separate section at the end of the paper.Equations should be numbered consecutively beginning with (1) to the end of the paper, including any appendices. The number should be enclosed in parentheses and set flush right in the column on the same line as the equation.LEVEL-ONE HEADSThe text should be organized into logical parts or sections. Headings and subheadings should appear throughout the paper to divide the subject matter to emphasize the major elements. These headings assist the reader in following the trend of thought and in forming a mental picture of the points of importance. Parts or sections may be numbered, if desired, but paragraphs should not be numbered.COPYRIGHT REMINDERIf any material that is included in a paper is under copyright, the authors of the paper are responsible for obtaining copyright permissions, including any information required by the copyright holder, and be able to produce such permissions upon request.Level-Two HeadsAll papers should be concise regardless of length. Long quotations should be avoided by referring to sources. Illustrations and tables, where they help clarify the meaning or are necessary to demonstrate results properly, are desirable, but they should be kept to a practicable minimum, and included on individual pages at the end of the manuscript. Level-Three HeadsIt is ASME policy that SI units of measurement be included in all papers with the U.S. customary units provided in parentheses or in a supplementary table. ACKNOWLEDGMENTPlease spell “acknowledgment” in American English is without an “e” after the “g” using it in the singular for the heading even if there are multiple acknowledgments. Specific company names should be mentioned only in the acknowledgment and not in the body of the manuscript.FUNDINGA separate section listing funding sources should be included. The full names along with their abbreviation should be included, e.g., U.S. Department of Energy (DOE).NOMENCLATUREV variables should appear in first column with the description in second column, mI all variables should appear in italicstl two-letter abbreviations should appear in italicstla three-letter abbreviations should not appear in italicsRe Reynolds number and similar abbreviations do not use italicsT use the “Tab” key to add more rows to this tableREFERENCES(Samples of the most commonly referenced materials are provided. If in doubt, please refer to the latest editor of the Chicago Manual of Style. DOIs should be provided whenever possible for the greatest accuracy.[1] Ning, X., and Lovell, M. R., 2002, "On the Sliding Friction Characteristics of Unidirectional Continuous FRP Composites," ASME Journal of Tribology, 124(1), pp. 5-13. DOI: 10.1115/1.40224567[2] Barnes, M., 2001, "Stresses in Solenoids," J. Appl. Phys., 48(5), pp. 2000-2008. DOI: 10.1115/1.40224567[3] Jones, J., 2000, Contact Mechanics, Cambridge University Press, Cambridge, UK, Chap.6. ISBN: 978-3-16-148410-0[4] Lee, Y., Korpela, S. A., and Horne, R. N., 1982, "Structure of Multi-Cellular Natural Convection in a Tall Vertical Annulus," Proc. 7th International Heat Transfer Conference, U. Grigul et al., eds., Hemisphere, Washington, DC, 2, pp. 221-226.[5] Hashish, M., 2000, "600 MPa Waterjet Technology Development," High Pressure Technology, PVP-Vol. 406, pp. 135-140.[6] Watson, D. W., 1997, "Thermodynamic Analysis," ASME Paper No. 97-GT-288.[7] Tung, C. Y., 1982, "Evaporative Heat Transfer in the Contact Line of a Mixture," Ph.D. thesis, Rensselaer Polytechnic Institute, Troy, NY.[8] Kwon, O. K., and Pletcher, R. H., 1981, "Prediction of the Incompressible Flow Over A Rearward-Facing Step," Technical Report No. HTL-26, CFD-4, Iowa State Univ., Ames, IA.[9] Smith, R., 2002, "Conformal Lubricated Contact of Cylindrical Surfaces Involved in a Non-Steady Motion," Ph.D. thesis,/rsmith/homepage.htmlFigure Captions ListFig. 1 Capitalize only the first word in the captionFig. 2 Punctuation is not used if the caption is a single sentenceFig. 3 Punctuation is used if a caption contains multiple sentences. Punctuation is used to separate the multiple sentences.Fig. 4Fig. 5Fig. 6 use “Tab” key to add more rowsTable Caption ListTable 1 Capitalize the first word in the captionTable 2 Punctuation is not included if the is only a single line in the caption Table 3 Table notes should use superscript lowercase roman letters a, b, c Table 4Table 5Table 6 use “Tab” key to add more rowsInformation Regarding Figures and Tables▪Each figure and table should be included on a separate sheet (one figure or table per page) at the end of the manuscript.▪Tables can be created using Microsoft Word.▪Figures (graphics files) must be saved as a TIFF, PostScript, or EPS (Encapsulated PostScript) files for uploading individually if the paper is accepted for publication▪ASME Papers are targeted for 9 typeset pages, which is approximately 9000 words (9 typeset pages). Using 1000 words for each typeset page, figures can be estimated at ~250 “words” for each quarter of a column they will occupy.▪Text in figures should be reviewed for legibility for reproduction in the following sizes:Single Column20 picas8 cm3.25 inDouble Column40 picas16 cm wide6.5 in.。

中科院一区sci 英语表达The Prestige of SCI Journal Publications from the Chinese Academy of Sciences.The Chinese Academy of Sciences (CAS) holds aprestigious position in the global scientific community,and its contributions to various fields of research are widely recognized. One of the key indicators of thisprestige is the number and quality of scientific articles published by its researchers in highly regardedinternational journals. Among these, being published in the top-tier Scientific Citation Index (SCI) journals is particularly esteemed.The SCI is a database that indexes and providescitation data for a select group of peer-reviewedscientific journals. It is widely used by researchers, academics, and institutions to evaluate the impact and influence of published research. Journals included in the SCI are typically those with a high level of academic rigor,broad scope, and international reach.For researchers at the CAS, publishing in SCI journals is not only a matter of professional ambition but also a requirement for career advancement and funding. The CAS recognizes the importance of international collaboration and dissemination of research findings, and encourages its researchers to publish their work in top-tier journals.To achieve this, the CAS provides extensive support to its researchers, including funding for research projects, access to advanced research facilities, and training and mentorship programs. It also fosters an environment that promotes innovation, critical thinking, and collaboration among researchers from different disciplines and backgrounds.The rigorous peer-review process and high standards set by SCI journals ensure that the research published by the CAS is of the highest quality. This, in turn, enhances the reputation of the CAS and its researchers and attracts global recognition and respect.In addition to the scientific impact, publishing in SCI journals also has practical benefits for the CAS. It helps attract funding from various sources, including governments, private organizations, and philanthropic foundations. The presence of high-quality research outputs in SCI journals also boosts the CAS's profile in internationalcollaborations and partnerships, opening up opportunitiesfor joint research projects, knowledge sharing, and technology transfer.Moreover, the CAS recognizes that scientific researchis not just about generating new knowledge but also about contributing to societal development and addressing global challenges. Therefore, it encourages its researchers to focus on research that has practical applications and can benefit society. Publishing in SCI journals helps bring these research findings to a wider audience, including policymakers, industry leaders, and the general public,thus promoting the application of science in addressingreal-world problems.In conclusion, the prestige associated with publishing in SCI journals is not just a matter of academic vanity for the CAS. It represents a significant achievement that reflects the institution's commitment to excellence in research, its investment in its researchers, and itsoverall contribution to the global scientific enterprise. As the CAS continues to make groundbreaking discoveries and publish its work in top-tier journals, it will further cement its position as a leading force in global science and technology.。