103SR17A-1中文资料

USB总线转接芯片CH341中文手册版本： 21、概述CH341是一个USB总线的转接芯片，通过USB总线提供异步串口、打印口、并口以及常用的2线和4线等同步串行接口。

在异步串口方式下，CH341提供串口发送使能、串口接收就绪等交互式的速率控制信号以及常用的MODEM联络信号，用于将普通的串口设备直接升级到USB总线。

在打印口方式下，CH341提供了兼容USB相关规范和Windows操作系统的标准USB打印口，用于将普通的并口打印机直接升级到USB总线。

在并口方式下，CH341提供了EPP方式或MEM方式及BUS扩展方式的8位并行接口，用于在不需要单片机/DSP/MCU的环境下，直接输入输出数据。

除此之外，CH341A芯片还支持一些常用的同步串行接口，例如2线接口（SCL线、SDA线）和4线接口（CS线、CLK线、DIN线、DOUT线）等。

2、特点2.1. 概述●全速设备接口，兼容USB V2.0，外围元器件只需要晶体和电容。

●可选：通过外部的低成本串行EEPROM定义厂商ID、产品ID、序列号等。

●支持5V电源电压和3.3V电源电压。

●低成本，直接转换原串口外围设备、原并口打印机、原并口外围设备。

●采用SOP-28封装，串口应用还提供小型的SSOP-20封装。

●由于是通过USB转换的接口，所以只能做到应用层兼容，而无法绝对相同。

2.2. 异步串口●仿真标准串口，用于升级原串口外围设备，或者通过USB增加额外串口。

●计算机端Windows操作系统下的串口应用程序完全兼容，无需修改。

●硬件全双工串口，内置收发缓冲区，支持通讯波特率50bps～2Mbps。

●支持串口发送使能、串口接收就绪等传输速率控制信号和MODEM联络信号。

●通过外加电平转换器件，提供RS232、RS485、RS422等接口。

2.3. 打印口●标准USB打印口，用于升级原并口打印机，兼容相关的USB规范。

●兼容Windows操作系统，在Windows 2000和XP下无需驱动程序，应用程序完全兼容。

Document Number 17249Surface Mount ESD Protection DiodesFeatures•For surface mounted applications •Low-profile package•Optimized for LAN protection applications •Ideal for ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2) •Ideal for EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4) •IEC 61000-4-2 (ESD) 15 kV (air) 8 kV (contact) •Low incremental surge resistance, excellent clamping capability •200 W peak pulse power capability with a 10/1000 µs waveform, repetition rate (duty cycle): 0.01 % •Very fast response time•High temperature soldering guaranteed:260°C/ 10 seconds at terminals •Lead (Pb)-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECMechanical DataCase: JEDEC DO-219AB (SMF ®) Plastic case Terminals: Solder plated, solderable per MIL-STD-750, Method 2026Polarity:The band denotes the cathode, which is positive with respect to the anode under normal TVS operationMounting Position: Any Weight: approx. 15 mgPackaging Codes/Options:GS18 / 10 k per 13 " reel (8 mm tape), 50 k/box GS08 / 3 k per 7 " reel (8 mm tape), 30 k/boxAbsolute Maximum RatingsRatings at 25°C, ambient temperature unless otherwise specified1)Non-repetitive current pulse and derated above T A = 25°CThermal CharacteristicsRatings at 25°C, ambient temperature unless otherwise specified2) Mounted on epoxy glass PCB with 3 x 3 mm, Cu pads ( ≥ 40 µm thick)ParameterT est conditionSymbol Value Unit Peak pulse power dissipation 10/1000 µs waveform 1)P PPM 200W 8/20 µs waveform 1)P PPM 1000W Peak pulse current 10/1000 µs waveform 1)I PPM next Table A Peak forward surge current8.3 ms single half sine-waveI FSM20AParameterT est conditionSymbol Value Unit Thermal resistance 2)R thJA 180K/W Operation junction and storage temperature rangeT stg , T J- 55 to + 150°C Document Number 85811Electrical CharacteristicsRatings at 25°C ambient temperature unless otherwise specified. V F = 3.5 V at I F = 12 A (uni-directional only)1) Pulse test t p≤ 5.0 ms2)Surge current waveform 10/1000 µs3) All terms and symbols are consistent with ANSI/IEEE C62.35PartnumberMarking Code UNIBreakdown Voltage 1)Test CurrentStand-off VoltageMaximum Reverse Leakage Maximum Peak Pulse Surge Current 2,3)Maximum Clamping VoltageJunction CapacitanceV (BR)@ I TV WM@ V WMI D I PPM@ I PPM V CC j @ V R = 0 V, f = 1 MHzV mA V µA AV pF mintypSMF5V0A AE 6.4010 5.040021.79.21030SMF6V0A AG 6.6710 6.040019.410.31010SMF6V5A AK 7.2210 6.525017.911.2850SMF7V0A AM 7.78107.010016.712.0750SMF7V5A AP 8.33 1.07.55015.512.9730SMF8V0A AR 8.89 1.08.02514.713.6670SMF8V5A AT 9.44 1.08.51013.914.4660SMF9V0A AV 10.0 1.09.0 5.013.515.4620SMF10A AX 11.1 1.010 2.511.817.0570SMF11A AZ 12.2 1.011 2.511.018.2460SMF12A BE 13.3 1.012 2.510.119.9440SMF13A BG 14.4 1.013 1.09.321.5420SMF14A BK 15.6 1.014 1.08.623.2370SMF15A BM 16.7 1.015 1.08.224.4350SMF16A BP 17.8 1.016 1.07.726.0340SMF17A BR 18.9 1.017 1.07.227.6310SMF18A BT 20.0 1.018 1.0 5.829.2305SMF20A BV 22.2 1.020 1.0 6.232.4207SMF22A BX 24.4 1.022 1.0 5.635.5265SMF24A BZ 26.7 1.024 1.0 5.138.9240SMF26A CE 28.9 1.026 1.0 4.842.1225SMF28A CG 31.1 1.028 1.0 4.445.4210SMF30A CK 33.3 1.030 1.0 4.148.4205SMF33A CM 36.7 1.033 1.0 3.853.3190SMF36A CP 40.0 1.036 1.0 3.458.1180SMF40A CR 44.4 1.040 1.0 3.164.5165SMF43A CT 47.8 1.043 1.0 2.969.4160SMF45A CV 50.0 1.045 1.0 2.872.7155SMF48A CX 53.3 1.048 1.0 2.677.4150SMF51ACZ56.71.0511.02.482.4145Document Number Typical Characteristics (Tamb = 25 °C unless otherwise specified)Figure 1. Peak Pulse Power RatingFigure 2. Pulse Derating CurveFigure 3. Pulse WaveformP P P M -P e a k P u l s e P o w e r (k W )0.11100.1µ s 1.0µ s 10µ s t d -Pulse Width (sec.)100µ s 1.0ms 10ms172502550751000752550100125150175200P e a k P u l s e P o w e r (P P P )o r C u r r e n t (I P P M )D e r a t i n g i n P e r c e n t a g e ,%T A -Ambient Temperature (°C)17251I P P M -P e a k P u l s e C u r r e n t ,%I R S M2.0t -Time (ms)17252Package Dimensions in mm (Inches) Document Number 85811Blistertape for SMFDocument Number Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendmentsrespectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Document Number 85811。

SA1117C1A LDO 稳压器电路概述SA1117C是一款正电压输出的低压降三端线性稳压电 路，在1A输出电流下压降为1.2V。

SA1117C分为两个版本：固定电压输出版本和可调电 压 输 出 版 本 ， 固 定 输 出 电 压 为 1.5V ， 1.8V ， 2.5V ， 3.3V ， 5.0V 和可调版本的电压精度为 1.5% ，固定电压为 1.2V的产品输出电压精度为2%。

SA1117C内部集成过热保护和限流电路，适用于各类 电子产品。

TO-252-2L SOT-223-3L特点* 固定输出电压为 1.5V，1.8V，2.5V， 3.3V，5.0V 和 可调版本的电压输出精度为 1.5%； * 固定电压为 1.2V 的输出精度为 2% * 低压降电压：1A 输出电流时仅为 1.2V * 限流功能 * 过热切断 * 温度范围：-40°C~ 125°C应用* 膝上型电脑，掌上电脑和笔记本 电脑 * 电池充电器 * SCSI-II 主动终端 * 移动电话 * 无绳电话 * 电池供电系统 * 便携式设备 * 开关电源的后置稳压器产品规格分类(温度范围：-40°C ~ 125°C）杭州士兰微电子股份有限公司版本号：1.02010.05.14 共9页 第1页SA1117C产品名称 SA1117CH-ADJTR SA1117CH-1.2TR SA1117CH-1.5TR SA1117CH-1.8TR SA1117CH-2.5TR SA1117CH-3.3TR SA1117CH-5.0TR SA1117CD-ADJ SA1117CD-ADJTR SA1117CD-1.2 SA1117CD-1.2TR SA1117CD-1.5 SA1117CD-1.5TR SA1117CD-1.8 SA1117CD-1.8TR SA1117CD-2.5 SA1117CD-2.5TR SA1117CD-3.3 SA1117CD-3.3TR SA1117CD-5.0 SA1117CD-5.0TR TO-252-2L SOT-223-3L 封 装 打印名称 SA1117CH-ADJ SA1117CH-1.2 SA1117CH-1.5 SA1117CH-1.8 SA1117CH-2.5 SA1117CH-3.3 SA1117CH-5.0 SA1117CD-ADJ SA1117CD-ADJ SA1117CD-1.2 SA1117CD-1.2 SA1117CD-1.5 SA1117CD-1.5 SA1117CD-1.8 SA1117CD-1.8 SA1117CD-2.5 SA1117CD-2.5 SA1117CD-3.3 SA1117CD-3.3 SA1117CD-5.0 SA1117CD-5.0 材料 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 无铅 包装 编带 编带 编带 编带 编带 编带 编带 料管 编带 料管 编带 料管 编带 料管 编带 料管 编带 料管 编带 料管 编带杭州士兰微电子股份有限公司版本号：1.02010.05.14 共9页 第2页SA1117C内部框图3VINTSDCurrent Limit VOUT Fixed: F1 and F2 connect, disconnect A F2 A Adj: A connect, F1 and F2 disconnect 1 ADJ/GNDBandGap F12极限参数参 输入工作电压 引脚温度 (焊接5秒) 工作结温范围 储存温度 功耗 ESD能力 (最小值) 数 符号 VIN TLead TJ Tstg PD ESD 范 围 单位 V °C °C °C mW V15 260 150 -65 ~ +150 内部限制 (注1) 2000注1：最大允许功耗是最大工作结温TJ (max)，结对空热阻θJA 和环境温度Tamb的函数。

产品型号 XPT4933 XPT4955 XPT4956 XPT4978 XPT5943 XPT5963
XPT5983 XPT9971 XPT8871 XPT9812
XPT9612
XPT9412 XPT9410 XPT9833
XPT9633 XPT9433 XPT9403 XPT6011
XPT6012
道（双声道）提供4W 平均功率
产品型号 XPT6013 XPT6871 XPT6875 XPT4809
XPT9863
XPT8863
XPT2008
XPT2069
XPT2068 C
XPT4098 XPT4871
F XPT4890 XPT4990 XPT0030 XPT4066 XPT4088 XPT4068 XPT6872
4 SOP18/SS OP24/SOP
16
SOP16/QF N16/DIP16 MSOP8/SO P8/ESOP8/
DFN8 MSOP8/SO
P8/DFN
WCSP9
MSOP8/ES OP8/SOP8/
DFN
WCSP
备注 单端模式，5V，THD+N≤0.5％，75mW （32Ω）。XPT4963的 SD 是高电平工作，
封装
ETSSOP20
SOP8
ESOP8
MSOP8/SO P8
SOP16/DIP 16/ETSSO P16/ETSS OP20 SOP16/ET SSOP20/DI P16
SOP8/ ESOP8
SOP16/DIP 16/ESOP16
SOP16/ES OP16/DIP1
6
QFN16/SO P16/DIP16
完全兼容 LM4861/8002 ，XPT4871H