EMS术语表
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n – can vary with the customer (Quantum uses E for
C CN, CONN, J, P Y D, Z, CR, VR F L C, U, E OSU RL, K
R RN RP Q S, SW certified in production and inventory management component reference designator - a letter that identifies the various components,followed by a number that identifies their location on the PCB cathode ray tube (picture tube in a television and in a computer monitor) contract work authorization drive by wire metrics design engineer direct fulfillment; products made by Jabil sent directly to the end-user, not the initial customer design for manufacturability direct labor digital linear tape system (hard drives, tape automation, data storage) design of experiment defects per million = (observed defects/total production in the period) x 1,000,000 defects per million opportunities; opportunities include not just the parts themselves, but every solder connection on an assembly; for example, on a board that has 500 parts, there may be 4500 opportunities to have a defect dynamic replenishment; an inventory management model that Jabil uses dock to stock; parts requiring no additional work to prepare them for use in production direct sale direct withdrawal engineering change notice; it is usually found next to a part number
Manufacturing Acronyms AIT AML AOI APICS ATP AVL BGA BOM
BPH
BST BUD BUM CAC CAR CAS CIQ COB COC Component Identification – can vary with the customer (Quantum uses E for integrated circuits) Capacitor Connector Crystal Diode Fuse Inductors Integrated circuit Oscillator Relay
Resistor Resistor/network Resistor/package Transistor Switches CPIM
CRD
CRT CWA DBWM DE
DF DFM DL
DLT DOE DPM
DPMO
DR
DTS D/S D/W ECN
ECO
EDI EEO
EFF EMI ERP ESD
Goods Issue Goods Receipt good manufacturing practices goods received notification, general reference number general surface mount; Universal surface mount placement machine that is not as fast as HSP, but can handle a wider variety of shapes and sizes of parts highly accelerated stress screening; uses vibration and heat to test boards manufacturer’s part number in SAP highly marketable product human resources high speed placement; Universal surface mount placement machine inventory analyst Integrated Circuit in-circuit test; used to test the flow of current throughout the board to identify shorts and defective electrical components indirect labor Inventory Management individual and moving range chart integrated manufacturing production control; enterprise resource program partly replaced by SAP R/3 testing Institute for inter-connecting and Packaging electronic Circuits issues new quality standard that is required by many customers just-in-time inventory system; a manufacturing practice that emphasizes minimizing inventories to hold down costs, supplies are replenished as they are used local area network; Jabil’s in-house computer network lower control limit last in, first out manufacturing engineer metal electrode face; a surface mount device, usually a resistor or diode of tubular shape
MRB MRO
MRP MSDS MTBF MTD NPF’s OBA
ORT OSHA OTD PC & L PCA PCB PE PEL PFTA PGI PLCC
PLV P/N PO POST PP PPE PRWS
PTF PTH PSA PVT PWA PWB PWSH QBR QC QE QFP QM QN QTEC RAMTF RI RIR RMA
on a schedule to convey to manufacturing that the part is waiting on a last minute revision by the customer or by Jabil engineering staff; an ECN is also a cover sheet for a BOM engineering change order; cover sheet for revisions to visuals electronic data interface between assembly purchasers and suppliers; there are 3 types of EDI…JIT, SMI, and SMCI equal employment opportunity efficiency (actual number achieved vs. target, or goal number established by engineering; the target number is based on (60 min./hour) ¸ (cycle time (seconds)/unit) of the product = number of target units per hour electromagnetic interference enterprise resource planning; what the SAP system allows us to do electro-static discharge; the reason we wear heel and/or wrist straps environmental stress screening; an oven which heats the PCA’s to extreme usage temperatures to check performance, to desiccate moisture-sensitive components, and to bake pad/trace repairs; temperature is at 1250 C, or 269.50 F estimated time of arrival Field/Failure Analysis bare board first in, first out final inspection failure mode effect analysis free on board first pass yield; the number of finished units in a group that pass inspection tests at each process point, w/o any rework,expressed in terms of a percentage of the group. All of the machines, the pace line, second manual,ICT, FVT, and OBA have each have their own FPY which are included in the shift report final quality control functional system test; a Ping test using real network traffic functional verification test
C CN, CONN, J, P Y D, Z, CR, VR F L C, U, E OSU RL, K
R RN RP Q S, SW certified in production and inventory management component reference designator - a letter that identifies the various components,followed by a number that identifies their location on the PCB cathode ray tube (picture tube in a television and in a computer monitor) contract work authorization drive by wire metrics design engineer direct fulfillment; products made by Jabil sent directly to the end-user, not the initial customer design for manufacturability direct labor digital linear tape system (hard drives, tape automation, data storage) design of experiment defects per million = (observed defects/total production in the period) x 1,000,000 defects per million opportunities; opportunities include not just the parts themselves, but every solder connection on an assembly; for example, on a board that has 500 parts, there may be 4500 opportunities to have a defect dynamic replenishment; an inventory management model that Jabil uses dock to stock; parts requiring no additional work to prepare them for use in production direct sale direct withdrawal engineering change notice; it is usually found next to a part number
Manufacturing Acronyms AIT AML AOI APICS ATP AVL BGA BOM
BPH
BST BUD BUM CAC CAR CAS CIQ COB COC Component Identification – can vary with the customer (Quantum uses E for integrated circuits) Capacitor Connector Crystal Diode Fuse Inductors Integrated circuit Oscillator Relay
Resistor Resistor/network Resistor/package Transistor Switches CPIM
CRD
CRT CWA DBWM DE
DF DFM DL
DLT DOE DPM
DPMO
DR
DTS D/S D/W ECN
ECO
EDI EEO
EFF EMI ERP ESD
Goods Issue Goods Receipt good manufacturing practices goods received notification, general reference number general surface mount; Universal surface mount placement machine that is not as fast as HSP, but can handle a wider variety of shapes and sizes of parts highly accelerated stress screening; uses vibration and heat to test boards manufacturer’s part number in SAP highly marketable product human resources high speed placement; Universal surface mount placement machine inventory analyst Integrated Circuit in-circuit test; used to test the flow of current throughout the board to identify shorts and defective electrical components indirect labor Inventory Management individual and moving range chart integrated manufacturing production control; enterprise resource program partly replaced by SAP R/3 testing Institute for inter-connecting and Packaging electronic Circuits issues new quality standard that is required by many customers just-in-time inventory system; a manufacturing practice that emphasizes minimizing inventories to hold down costs, supplies are replenished as they are used local area network; Jabil’s in-house computer network lower control limit last in, first out manufacturing engineer metal electrode face; a surface mount device, usually a resistor or diode of tubular shape
MRB MRO
MRP MSDS MTBF MTD NPF’s OBA
ORT OSHA OTD PC & L PCA PCB PE PEL PFTA PGI PLCC
PLV P/N PO POST PP PPE PRWS
PTF PTH PSA PVT PWA PWB PWSH QBR QC QE QFP QM QN QTEC RAMTF RI RIR RMA
on a schedule to convey to manufacturing that the part is waiting on a last minute revision by the customer or by Jabil engineering staff; an ECN is also a cover sheet for a BOM engineering change order; cover sheet for revisions to visuals electronic data interface between assembly purchasers and suppliers; there are 3 types of EDI…JIT, SMI, and SMCI equal employment opportunity efficiency (actual number achieved vs. target, or goal number established by engineering; the target number is based on (60 min./hour) ¸ (cycle time (seconds)/unit) of the product = number of target units per hour electromagnetic interference enterprise resource planning; what the SAP system allows us to do electro-static discharge; the reason we wear heel and/or wrist straps environmental stress screening; an oven which heats the PCA’s to extreme usage temperatures to check performance, to desiccate moisture-sensitive components, and to bake pad/trace repairs; temperature is at 1250 C, or 269.50 F estimated time of arrival Field/Failure Analysis bare board first in, first out final inspection failure mode effect analysis free on board first pass yield; the number of finished units in a group that pass inspection tests at each process point, w/o any rework,expressed in terms of a percentage of the group. All of the machines, the pace line, second manual,ICT, FVT, and OBA have each have their own FPY which are included in the shift report final quality control functional system test; a Ping test using real network traffic functional verification test
