下载文档原格式
印制线路板术语中英对照版AAccelerate Aging ——加速老化，使用人工的方法，加速正常的老化过程。
Acceptance Quality Level (AQL) ——一批产品中最大可以接受的缺陷数目，通常用于抽样计划。
Acceptance Test ——用来测定产品可以接受的试验，由客户与供应商之间决定。
Access Hole ——在多层线路板连续层上的一系列孔，这些孔的中心在同一个位置，而且通到线路板的一个表面。
Annular Ring ——是指保围孔周围的导体部分。
Artwork ——用于生产“Artwork Master”“production Master”,有精确比例的菲林。
Artwork Master ——通常是有精确比例的菲林，其按1：1的图案用于生产“Production Master”。
BBack Light ——背光法，是一种检查通孔铜壁完好与否得放大目检方法，其做法是将孔壁外的基材自某一方向上小心的予以磨薄，再利用树脂半透明的原理，从背后射入光线。
假如化学铜孔壁品质完好而无任何破洞或针孔时，则该铜层必能阻绝光线而在显微中呈现黑暗，一旦铜壁有破洞时，则必有光点出现而被观察到，并可放大摄影存证，称为背光法，但只能看到半个孔。
Base Material ——绝缘材料，线路在上面形成。
（可以是刚性或柔性，或两者综合。
它可以是不导电的或绝缘的金属板。
）。
Base Material thickness ——不包括铜箔层或镀层的基材的厚度。
Bland Via ——导通孔仅延伸到线路板的一个表面。
Blister ——离层的一种形式，它是在基材的两层之间或基材与铜箔之间或保护层之间局部的隆起。
Board thickness 是——指包括基材和所有在上面形成导电层在内的总厚度。
Bonding Layer ——结合层，指多层板之胶片层。
CC-Staged Resin ——处于固化最后状态的树脂。
香港展会PCB专业术语（中英文）1.线路板生产流程：• 板材(board：硬板 rigid board、环氧玻璃纤维板(FR-4 Epoxy glass fiber board-type4 双面板 double layers board 多层板 Multi-layers board• 开料(board cut：来料检查material incoming inspection、剪板 material-cutting磨边Milling、洗板 board washing、烤板 board baking• 内层线路inner circuit：前处理pretreat、压干膜dry film pressing、对位registration 曝光exposed、显影development、蚀刻etching、品质控制（QC） quality control • 层压：lamination-pressing• 钻孔 drilling• 沉铜 (PTH plated through hole• 外层线路outer circuit• 外层蚀刻：outer etching• 阻焊 soldermask• 字符 legends• 表面处理surface finishing：沉金(ENIGElectroless nickel immersion gold沉银immersion silver 沉锡 immersion Tin；有铅喷锡(HALHot air leveling无铅喷锡Lead-free hot air leveling 抗氧化(OSPOrganic Solderability Preservatives；电金gold-plating；金手指 gold finger• 成型routing：冲压pounching、楔形掏槽（V-cut）wedge cut• 电测试(E-test electronic test：飞针probeflying, 测试架fixture• 终检（FQC）final quality control• 包装packing2.其他相关术语a.金厚测试仪gold thickness tester 阻抗测试仪impedance tester拉力测试仪Tension measuring instrument 二次元测试仪 Two dimensional tester b.通孔Vias、过孔via hole 埋孔buried holes、盲孔blind holes 定位孔tooling holes 半固化片（PP）prepregc.拼板panel、工艺边tooling edge、干膜dry film、菲林filmd.尺寸size、样板sample、批量mass production、交期lead time、产能production capacitye.板厚board thickness、铜厚copper thickness、公差tolerancef.线宽line width、线距line space、孔径hole size。
PCB线路板工艺流程及中英文对照 (2009/04/0813:56)目录：公司动态流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔A.开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B.钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲( 埋) 孔钻孔(Blind & Buried Hole Drilling)C.干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理, 化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D.压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E.减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F.电镀(Horizontal Electrolytic Plating) 浏览字体：大中小( 绿漆/ 绿油)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于 1 mil ( Less than 1 mil Thickness )f-4 高于 1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G.塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H.防焊(绿漆/ 绿油): (Solder Mask)h-1 C 面印刷(Printing Top Side)h-2 S 面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV 烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V 型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L.开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester) l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘 ( Warpage Remove)m-2 X-OUT 印刷 (X-Out Marking)m-3 包装及出货 (Packing & shipping)m-4 目检 ( Visual Inspection)m-5 清洗及烘烤 ( Final Clean & Baking)m-6 护铜剂 (ENTEK Cu-106A)(OSP)m-7 离子残余量测试 (Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验 (Thermal cycling Testing)m-9 焊锡性试验 ( Solderability Testing )N. 雷射钻孔 (Laser Ablation)N-1 雷射钻 Tooling 孔 (Laser ablation Tooling Hole)N-2 雷射曝光对位孔 (Laser Ablation Registration Hole)N-3 雷射 Mask 制作(Laser Mask)N-4 雷射钻孔 (Laser Ablation)N-5 AOI 检查及 VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣 (Desmear)N-8 微蚀 (Microetching )综合词汇 印制电路： printed circuit 印制线路： printed wiring 印制板： printed board 印制板电路： printed circuit board (pcb) 印制线路板： printed wiring board(pwb) 印制元件： printed component 印制接点： printed contact 印制板装配： printed board assembly 板： board 单面印制板： single-sided printed board(ssb) 双面印制板：double-sided printed board(dsb) 多层印制板： mulitlayer printed board(mlb) 多层印制电路板： mulitlayer printed circuit board 多层印制线路板： mulitlayer prited wiring board刚性印制板： rigid printed board rigid single-sided printed borad rigid double-sided printed borad rigid multilayer printed board flexible multilayer printed board 挠性印制板： flexible printed board 挠性单面印制板： flexible single-sided printed board 挠性双面印制板： flexible double-sided printed board 23、 挠性印制电路： flexible printed circuit (fpc) 24、挠性印制线路： flexible printed wiring 25、刚性印制板： flex-rigid printed board, rigid-flex printed board26、刚性双面印制板： flex-rigid double-sided printed board, rigid-flex double-sided printed 27、 刚性多层印制板： flex-rigid multilayer printed board, rigid-flex multilayer printed board 1、 2、 3、 4、 5、 6、 7、 8、 9、 10、 11、 12、 13、 14、 15、 16、 17、 18、 19、 20、 21、 22、刚性单面印制板 刚性双面印制板 刚性多层印制板28、齐平印制板： flush printed board29、金属芯印制板： metal core printed board30、金属基印制板： metal base printed board31、多重布线印制板： mulit-wiring printed board32、陶瓷印制板： ceramic substrate printed board33、导电胶印制板： electroconductive paste printed board34、模塑电路板： molded circuit board35、模压印制板： stamped printed wiring board36、顺序层压多层印制板： sequentially-laminated mulitlayer37、散线印制板： discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a 阶树脂：a-stage resin2、b 阶树脂：b-stage resin3、c 阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e 玻璃纤维：e-glass fibre43、d 玻璃纤维：d-glass fibre44、s 玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔(剖面)轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化(设计) ：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走(布)线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线(通道) ：conduction (track)2、导线(体)宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/ 间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v 形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole。
電路東常用術語整理Activator 活化劑----在PCB工業中常指助焊劑中的活化成份,如無機的氯化鋅或氯化銨,及有機性氫鹵化胺類或有機酸類等,皆能在高溫中協助“松脂酸”對待焊金屬表成進行清潔的工作.此等添加劑皆稱為Activator.ANSI 美國標準協會──American National Standard Institute是一民間的法人學術組織，目前對各種工業已發布了400 多种權威而實用的規範標準.AOI 自動光學檢驗──Automatic Optical Inspection, 是冺用普通光線或雷射光配合電腦程式，對電路東面進行外觀的視覺檢驗，以代替人工目檢的光學設備〃AQL 品質允收水準──Acceptable Quality Level,在大量產品的品檢項目中，抽取少量進行檢驗，再據以決定整批動向的品管技術〃Base Material 基材──指東材的樹脂及補強材料部份，可當做為銅線路與導體的載體及絕緣材料〃Binder 粘結劑----各種積層東中的接著樹脂部份, 或乾膜之阻劑中, 所添加用以“成形”而不致太“散”的接著及形成劑類.Blind Via Hole 盲導孔----指復雜的多層東中, 部份導通孔因只需某幾層之互連, 故刻意不完全鑽透, 若其中有一孔口是連接在外層東的孔環上, 這種如杯狀死胡同的特殊孔, 稱之為“盲孔”(Blind Hole).Blow Hole 吹孔----指完工的PTH銅壁上, 可能有破洞(V oid俗稱窟窿)存在. 當東子在下游進行焊錫時, 其高溫可能造成破洞中的殘液迅速氣化而產生壓力, 往外向孔中灌入的熔錫吹出. 冷卻后孔中之錫柱會出現空洞. 這種會吹氣的劣質PTH, 特稱為“吹孔”. 吹孔為PCB制程不良的表征, 必頇徹底避免才能在業界立足.Bow, Bowing 東彎----當東子失去其應有的帄坦度(Flatness)後,以其凹面朝下放在帄坦的表面上,若能保持東角的四點落在一個帄面上時,則稱為東彎或東翹(Warp或Warpage),若只能三點落在帄面上時,稱為東扭轉(Twist).不過通常這種彎翹的情況很輕微不太明顯時,一律俗稱為東翹(Warpage).Buried Via Hole 埋導孔----指多層東之局部導通孔, 當其埋在多層東內部各層間的“內通孔”, 且未與外層東“連通”者, 稱為埋導孔或簡稱埋孔.CAD 電腦輔助設計----Computer Aided Design, 是冺用特殊軟體及硬體, 對電路東以數位化進行布局(Layout), 並以光學繪圖機將數位資料轉制成原始底片. 此种CAD對電路東的制前工程, 遠比人工方式更為精確及方便.Carbon Treatment, Active 活性碳處理----各種電鍍槽液經過一段時間的使用後,都不免因添加劑裂解,及東面阻劑的溶入而產生有機污染,需要用极細的活性炭粉粒摻入攪拌予以吸收,再經過濾而得以除污,稱為活性處理.帄日也可以活性炭粒之濾筒進行維護過濾.Catalyzing 催化----“催化”是一般化學反應前, 在各反應物中所額外加入的“介紹人”,令所需的反應能順冺展開. 在電路東業中則是專指PTH制程中, 其“氯化鈀”槽液對非導體東材進行的“活化催化”, 對化學銅鍍層先埋下成長的種子. 不過此學術性的用語現已更通俗的說成“活化”(Activation)或“核化”(Nucleating), 或“下種”(Seeding)了. 另有Catalyst ,其正確譯名是“催化劑”.Component Side 組件面----早期電路東全采通孔插裝的時代, 零件是要裝在東子的正面，故又稱其正面為“組件面”；東子的反面因只供波焊的錫波通過，故又稱為“焊錫面”（Soldering Side）〃目前ＳＭＴ的東類兩面都要粘裝零件，故已無所謂“組件面”或“焊錫面”了，只能稱為正面或反面〃通常正面會印有該電子機器的製造廠商名稱，而電路東製造廠的ＵＬ代字與生產日期，則可加在東子的反面〃Copper Foil 銅箔、銅皮----是CCL銅箔基東外表所壓覆的金屬銅層。
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamim ates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
A- stage A阶段Abietic Acid 松脂酸Abrasion Resistance 耐磨性Abrasives 磨料,刷材ABS 树脂Absorption 吸收,吸入AC impedance 交流阻抗Accelerated(Aging) Test 加速试验,加速老化Acceleration 速化反应Accelerator 加速剂,速化剂Acceptability, Acceptance 允收性,允收Acceptable Quality Level(AQL) 允收质量水平Access 存取,使用,接近,进入Access Hole 露出孔(穿露孔,露底孔) Accuracy 准确度Acid Copper Plating 酸性电镀铜Acid Dip浸酸Acid Number(Acid Value) 酸值Acoustic Microscope(AM) 感音成像显微镜Acrylic 压克力Actinic Light(or intensity ,or Radiation) 有效光Activation 活化Activator 活化剂Active Carbon 活性炭Active Parts(Components or Devices) 主动零件Acutance 解像锐利度Addition Agent 添加剂Additive Process 加成法Additives 添加剂Adhesion 附着力Adhesion Promotor 附着力促进剂Adhesive 胶类或接着剂Admittance 导纳Aerosol 喷雾剂,气溶胶,气悬体Agglomeration 凝絮Aging 老化Air Agitation空气搅伴Air Bearing空气轴承Air inclusion气泡夹杂Air Knife气刀,气廉Algorithm 算法Aliphatic Solvent 脂肪族溶剂Aluminium Nitride(AIN) 氮化铝Ambient Temp 环境温度Amorphous 无定形,非晶形Amp-Hour 安培小时Analog Circuit/Analog Signal 模拟电路/模拟讯号Anchoring Spurs 着力爪Angle of Attack 攻角Angle of Contact 接触角Anion 阳向游子(阴离子)Anisotropic 异向的,单向的Anisotropic Conductive Adhesive (ACA)单向(垂直)导向胶Anisotropic Conductive Film (Adhesive)单向导电接着膜Anneal 韧化Annular Ring 孔环Anode 阳极Anode Sludge 阳极泥Anodizing 阳极化ANSI 美国标准协会Anti-foaming Agent 消泡剂Anti-pad 空圆,隔离空垫Anti-pit Agent 抗凹剂Any Layer interstitial Via Hole(ALIVH) 阿力夫制程AOI 自动光学检验Apertures开口,钢版开口,光束出口AQL 质量允收水平Aramid 聚酰胺树脂Aramid Fiber 聚酰胺纤维Arc Resistance 耐电弧性Area Array Package 面积格列封装(组件)Array 格列,排列,数组,一排,一条,一套组合Artwork 底片As Received 到货,收货ASIC 特定用途的集成电路器Aspect Ratio 纵横比Assembly 装配,组装,构装Automatic Testing Equipment(ATE) 自动电测设备Attenuation 讯号衰减Autoclave 压力锅Auxiliary Anode(or Cathode) 辅助阳极(阴极) Availability 航空电子品Axial Lead 轴心引脚Azeotrope 共沸混合液B-stage B阶段Back Light(Back Lighting) 背光法Back Taper 反斜锥角Back-up 垫板Backpanels,Backplanes 背板,支撑板Bail Outqyi 勺出Balanced Transmission Lines 平衡式传输线Ball Grid Array 球脚数组(封装)Bandability 可弯曲性,弯曲能力Bandwidth 频带宽度,频宽Banking Agent 护岸剂Bar Chart 直方圆Bar Code条形码Bare Board 空板,未装板(大陆业称光板)Bare Chip Assembly裸体芯片组装Barrel 孔壁,滚镀Barrier 障凝层Base Material 基材Baseband Area 基频区Basic Grid 基本方格Batch 批Baume 波美度Beam Lead 光芒式的平行密集引脚Bed-of-Nails Testing 针床测试Bellows Contact 弹片式接触Bend Test 弯曲试验Beta Ray Backscatter 具他射线反弹散射Bevelling 切斜边Bias 斜张网布,斜织法Bi-level Stencil 双阶式钢版Binder 黏结剂Bipolar Electrodes 偶极性电极组Bits 头,针尖Black Oxide 黑氧化层Blanking 冲空断开Bleach 漂洗Bleeding 渗流Blind Via Hole 盲导孔Blister 局部性分层或起泡Block Diagram 电路系统整合图Blockout 封网Blotting 干印Blotting Paper 吸水纸,吸墨纸Blow Hole 吹孔Blue Plaque 蓝纹Blue Print 蓝图Bluetooth 蓝牙/蓝芽(短期无线通讯之整合技术) Blur Edge(Circle) 模糊边带,模糊边圈Bomb Sight 弹标Bond Strength 结合强度,固着强度Bondability 结合性,固着性Bonding Layer 结合层,固着层Bonding Sheet(Ply,Layer) 接合片,接着层Bonding Wire 结合线Bow,Bowing 板弯Braid 编线Brazing 硬焊Break Point 出像点,显像点,露铜点Breakaway Panel 可断开板Breakdown Voltage 崩溃电压Break-out 破出Bridging 搭桥,桥接Bright Dip 光泽浸溃处理Brightener 光泽剂Brown Oxide 棕氧化Brush Plating 刷镀Build-up 增厚,堆积,增层Build-up Multilayer(BUM) 增层法多层板Build-up Process 增层法制程Built-in 内建Bulge 鼓起,凸出Bulk Solution 主槽液,主体溶液Bump 突块,凸块Bumping 凸块封装技术Bumping Process 凸块制程Buoyancy 浮力Buried Capacitor (or Resistor) 埋入式(内建式)电容器(或电阻器) Buried Hole 埋通孔Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Bus Bar 汇电杆Butter Coat 外表树脂层By-product 副产品,副产物C-stage C阶段Controlled Collapse Chip Connection(C4 Chip Joint)C4芯片焊接Cable 电缆CAD 计算机辅助设计Calendered Fabric 轧平式网布Camcorder 摄录像(像)机Cap Lamination 帽式压合法Capacitance 电容Capaci电容耦合Capillary Action 毛细作用Capillary Direct Film(CDF) 毛细式直接版膜Capture Pad 微盲孔之外环,面环Carbide 碳化物Carbon Arc Lamp 碳弧灯Carbon lnk 碳胶,碳膜Carbon Treatment, Active 活性碳处理Card 卡板Card Cages, Card Racks 电路板构装箱Carlson Pin 卡式定位梢Carrier 载体Cartridge 滤芯Cascade Rinse 连续溢流式清洗Castallation 堡型集成电路器Catalyzed Board, Catalyzed Substrate (or Material)催化板材Catalyzing 催化Cathode 阴极Cathode Rod Agitation 阴极杆搅拌Cation 阴向游子,阳离子Caul Plate 隔板Cavitation 空泡化,半真空状态Cavity Down/Cavity Up 方凹区朝下或朝上Cell Phone 行动电话Center-to-Center Spacing 中间间距Ceramics 陶瓷Cermet 陶金粉Certificate 证明书CFC 氟氯碳化物Chamfer 倒角Characteristic lmpedance 特性阻抗Chase 网框Check List 检查清单Chelate 螯合,螯合剂,ChelatorChemical Milling 化学研磨Chemical Resistance 抗化性,耐化性Chemisorption 化学吸附Chip 晶粒,芯片,片状Chip Clearance 排屑间隙Chip Clogging 堵屑,塞屑Chip interconnection 芯片互连Chip On Board(COB) 晶板接装法Chip on Flex (COF) 芯片直接安装软板Chip On Glass (COG) 晶玻接装法(芯片对玻璃电路板的直接安装) Chip Scale Package 芯片级封装Chisel 錾刃Chlorinated Solvent 含氯溶剂,氯化溶剂Choline Hydroxide 瞻碱Circuitization 成线Circumferential Separation 环状断孔Clad/Cladding 披覆Clean Room 无尘室,洁净室Cleanliness 清洁度Clearance 空环,余隙Clinched Lead Terminal 紧箝式引脚Clinched-wire Through Connection 通孔弯线连接法Clip Terminal 绕线端接Clock Frequency(Clock Speed Clock Rate) 频率速率Coat, Coating 皮膜,表层Coaxial Cable 同轴缆线Coefficient of Thermal Expansion 热膨胀系数Co-firing 共烧Cold Flow 冷流Cold Solder Joint 冷焊点Collapse 塌扁Collect 夹头,夹筒Collimated Light 平行光Colloid 胶体Columnar Structure 柱状组织Comb Pattern 梳型电路Commodity Board 商品板Comparative Tracking lndex 比较性漏电指数Complex lon错离子Component Density 零件密度Component Hole 零件孔Component Orientation 零件方向Component Side 组件面Composite Epoxy Material (CEM)环氧树脂复合板材Compositech 非纺织型玻织布Composites(CEM-1,CEM-3) 复合板材Condensation Soldering 凝热焊接,液化放热焊接Conditioning 整孔Conductance 导电Conductive Adhesive 导电胶Conductive Anodic Filament 玻织纱式漏电Conductive Paste 导电膏Conductive Salt 导电盐Conductivity 导电度Conductor Spacing 导体间距Conform贴护层,护形Conformal Mask 铜窗Conformity 吻合性,服贴性Connector 连接器Contact Angle 接触角Contact Area接触区Contact Resistance 接触电阻Continuity 连通性Continuous Lamination 连续压合,连续层压Contract Electronic Manufacturer (CEM or CM) 电子品合同式制造商Contract Service 协力商,分包商,外包厂Controlled Colaspse 定高坍塌Controlled Depth Drilling 定深钻孔Conversion Coating 转化皮膜Coplanarity 共面性Copolymer 共聚物Copper Foil 铜箔,铜皮Copper-invar-Copper(ClC) 综合夹心板Copper Mirror Test 铜镜试验Copper Paste 铜膏Core(Board) 核心板,核板Core Material 内层板材,核材Corner Crack通孔断角Corner Mark 板角标记Counterboring 垂直向下扩孔,埋头孔Counterflow (槽液)上下翻流,上下回流Countersinking 锥型扩孔,喇叭孔Coupling Agent 耦合剂Coupon, Test Coupon 板边试样Coverlayer, Coverlay 表护层Crack 裂痕Crater 弹坑,凹坑Crazing 白斑Crease 皱褶Creep 潜变Crossection Area 截面积Crosshatching 十字交叉区Crosshatch Testing 十字割痕试验Crosslinking, Crosslinkage 交联,回桥Crossover 越交,搭交Crosstalk 噪声,串讯Crush zone 磨碎区Crystalline Melting Point 晶体熔点Cure 硬化,熟化Current-Carrying Capability 载流能力Current Density 电流密度Curtain Coating 濂涂法Cycle Mode逐次打击式D-glass D玻璃Daisy Chained Design, Daisy Chaining 菊瓣设计, 菊花瓣连垫Datum Reference 基准参考点Daughter Board 子板Debris 碎屑,残材Deburring 去毛头Decibel(Db) 分贝Declination Angle 斜射角Definition 边缘齐直度,边缘逼真度Degradation 劣化Degrasing 脱脂Deionized Water 去离子水Delamination 分层Delay Line(Serpentine Line) 延迟线路(蛇形线路)Dendritic Growth 枝状生长Denier 丹尼尔Densitomer 透光度计Dent 凹陷Depanelization 切开,分开Deposition 沉积,附积,皮膜处理Desiccator 干燥器Desmearing 除胶渣Desoldering 解焊Developer 显像液,显像机Developing 显像Deviation 偏差Device 电子组件Demetting 缩锡Diazo Film 偶氮棕片Dichromate 重铬酸盐Dicing 芯片分割Dicyandiamide(Dicy) 双氰胺Die 冲模,铸模Die Attach 晶粒安装Die Bonding 晶粒接着Die Stamping 冲压Dielectric 介质Dielectric Breakdown 介质崩溃Dielectric Breakdown Voltage 介质崩溃电压Dielectric Constant 介质常数Dielectric Strength 介质强度Differential Scanning Calorimetry(DSC) 微差扫瞄熟卡分析法Diffusio扩散层Digitizing 数字化Dihedral Angle 双反斜角Dimensional Stability 尺度安定性,尺寸安定性Dimensional Stable Anode(DSA) 尺度稳定之阳极Dimple 酒窝,微凹Diode 二极管DlP(Dual lnline Package) 双排脚封装体Dip Coating 浸涂法Dip Soldering 浸焊法Dipole 偶极,双极Direct Clip Attach(DCA) 芯片直接安装在电路板Direct Emulsion 直接乳胶Direct/ lndirect Stencil 直间版膜Direct Plating 直接电镀,直接镀板Discrete Component 散装零件Discrete Wiring Board 散线电路板,复线板Dish Down 碟型下陷Dispensing 逐点分配,定点分配,定量分配Dispersant 分散剂Disspation Factor 散失因素Disturbed Joint 受扰焊点Doctor Blade 修平刀,刮平刀Dog Bone Design 哑铃式(原文狗骨式)互连设计Dog Ear 狗耳Doping 掺杂Double Access 双面露出Double Density 双倍密度Double Layer 电双层Double Treated Foil 双面处理铜箔Drag ln/Drag Out 带进/带出Drag Soldering 拖焊Drawbridging 吊桥效应Drift 漂移Drill Facet 钻尖切削面Drill Pointer 钻针重磨机Drilled Blank 已钻孔的裸板Dross 浮渣Drum Side铜箔光面,光胴面Dry Film干膜Dual Wave Soldering双波焊接Ductility 展性Dummy, Dummying 假镀片(板),假镀Dummy Land 假垫Durometer 橡胶硬度计DYCO strate电浆蚀孔增层法Dynamic Flex (FPC) 动态软板Dynamic Flexible Printed Board 动态软板Dynamic Mechanical Analysis (DMA) 动态热机分析法E-Beam(Electron Beam) 电子束E-glass 电子级玻璃Eddy Current 涡电流Edge-Board Connector 板边(金手指)承接器Edge-Board contact 板边金手指Edge Clip 板边插针Edge-Dip Solderability Test 板面焊锡性测试Edge Spacing 板边空地,边宽EDTA 乙二胺四醋酸Eductor (液中)强流器,增流器Effluent 排放物Elastomer 弹性体Electric Strength (耐)电性强度Electro-deposited Photoresist 电着光阻,电泳光阻Electrodeposition 电镀Electroforming 电铸Electroless Deposition 无电镀,化学镀Electroless Nickel/lmmersion Gold(EN/LG)化镍浸金Electrolytic Cleaning 电解清洗Electrolytic Tough Pitch 电解铜Electro-migration 电迁移Electronic Package Hierarchy 电子构装层极Electro-phoresis 电泳动,电渗,电子构装Electro-static Damage 静电伤害Electro-tinning 镀锡Electro-winning 电解治炼Elongation 延伸性,延伸率Embossing 凸出性压花EMF 电动势EMI 电磁干扰Emulsion 乳化Emulsion Side 药膜面Encapsulating 囊封,胶囊Encapsulation 封胶,封包Encroachment 沾污,侵犯End Cap 封头Entek 有机保焊处理Entrapment 夹杂物Entry Material 盖板Epoxy Resin 环氧树脂Etchant 蚀刻剂,蚀刻液Etchba回蚀Etch Factor 蚀刻因子,蚀刻函数Etching Indicator 蚀刻指标Etching Resist 抗蚀阻剂Eutetic Composition 共融组成Excimer Laser 准分子雷射Exotherm 放热(曲线)Expanded PTFE 扩张型“聚四氟乙烯”补强材简写为ePTFEExposure 曝光Eyelet 铆眼Fabric 网布Face Bonding 晶面朝下之结合Failure 故障,损坏Failure Analysis 故障分析Fan Out Wiring/Fan In Wiring扇出布线/扇入布线Farad 法拉Faraday 法拉第Fatigue Strength 抗疲劳强度Fault 缺陷,瑕疵Fault Plane 断层面Feasibility Analysis 可行性分析Features 成员,诸元Feed Through Hole 导通孔Feeder 进料器,送料器Fiber Exposure 玻纤显露Fiducial Mark 基准记号,光学靶标Filament 纤丝,单丝Fill 纬向Filler 填充料Fillet 内圆填角,填锡Film 底片Film Adhesive 接着膜,黏合膜Filter 过滤器,滤光镜片,滤波器Final Finishing 外表处理,终面处理Fine Line 细线Fineness 纯度,成色,粒度Fine Pitch 密脚距,密线距,密垫距Finger 手指(板边连续排列接点)Finishing 终饰,终修Finite Element Method 有限要素分析法First Article首产品First Pass-Yield 初检良品率Fish Bone Chant 鱼骨图Fixture 夹具Flair 第一面外缘变形,刃角变形Flag 芯片安置区Flame Point 自燃点Flammability 燃性Flame Resistant 耐燃性Flammability Rate 燃性等级Flare 扇形崩口Flash Plating 闪镀Flashover 闪络Flat Coat 全平涂布,板面平铺Flat Plug 平塞,平填Flat Cable 扁平排线Flat Pack 扁平封装(之零件)Flatness 平坦度Flexible Printed Circuit ,FPC 软板Flexural Failure 挠曲故障Flexural Module 弯曲模数,抗挠性模数Flexural Strength 抗挠强度Flexural Strength at Elevalted Temperature 高渐中抗挠强度Flip Chip 覆晶,扣晶Flip Chip Packaging 覆晶封装法(或组装法)Floating Shielding 浮起式挡架Flocculation 絮凝,凝聚Flood Stroke Print 覆墨冲程印刷Flow Soldering 流焊Fluorescence 荧光Flurocarbon Resin 碳氟树脂Flush Board 表面全平板Flush Conductor 嵌入式线路,贴平式导体Flush Point 闪火点Flute 退屑槽Flux 助焊剂Flying Lead 飞脚Foil Burr 铜箔毛边Foil Lamination 铜箔压板法Foot 残足Foot Print(Land Pattern) 脚垫Foreign Material 外来物,异物Form-to-List 布线说明清单Four Point Twisting四点扭曲法Freeboard 干舷Free Radical 自由基,自由根Frequency 频率Frit 玻璃熔料Fully-additive Process 全加成法Fungus抗霉性Fused Coating 熔锡层Fusing 熔合Fusing Fluid 助熔液Gage, Gauge量规Gallium Arsenide(GaAs) 砷化镓Galvanic Corrosion 贾凡尼式腐蚀Galvanic Series 贾凡尼次序Galvanizing 镀锌Galvanometer Mirror 电流计式反射镜GAP 第一面分离,长刃断开Gas Knife Cooling 氯刀冷却法Gate Array 阐极数组,阐列Gel Time 胶性时间Gelation Particle 胶凝点Gerber Date, Gerber File格博档案GETEK 奇异公司板材Ghost image 阴影Gilding 镀金Glass Fiber 玻纤Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破Glass Transition Temperature , Tg 玻璃态转化温度Glaze 釉面,釉料Glob Top 圆顶封装体Globule Test 球状测试法Glycol(Ethylene Glycol) 乙二醇Golden Board 测试用标准板Grain Size 结晶粒度Graphite 石墨Grid 标准格Ground Plane(or Earth Plane) 接地层Ground Plane Clearance 接地空环Gull Wing Lead 鸥翼引脚Grid Spacing(Distance) 格距,孔距Gross Leak 大漏Guide Pin导针GP (Global Warming Potentials) 地球温室潜因Galf Angle 半角Halide 卤化物Haloing 白圈,白边Halon 海龙Halation 环晕Hard Anodizing 硬阳极化Hard Chrome Plating 镀硬铬Hard Soldering 硬焊Hardener 硬化剂Hardness 硬度Haring-Blum Cell 海因槽Harness 电缆组合Hay Wire 跳线Heat Cleaning 烧洁Heat Dissipation 散热Heat Distortion Point (Temp.) 热变形点(温度)Heat Sealing 热封Heat Sink 散热器Heat Sink Plane 散热层Heatsink Tool 散热工具Heat Transfer Paste 导热膏,传热膏Hertz(tz) 赫High Efficiency Particulate Air Filter高效空气尘粒过滤机Hi-Rel 高可靠度Hipot Test 高压电测Hit 击Holding Time 停置时间Hole Breakout 孔位破出Hole Counter 数孔机Hole Density 孔数密度Hole Location 孔位Hole Preparation 通孔准备Hole Pull Strength 孔壁抗拉强度Hole Void 破洞Hook 切削刃缘外凸Hot Air Solder Levelling (HASL) 喷锡Hot Bar (Reflow) Soldering 热把焊接Hot Gas Soldering 热风手焊Hot Roll Lamination 热转轴压贴法THE (High Temperature Elongation) 高温延伸性(率) Hull Cell 哈氏槽Hybrid integrated Circuit 混成电路Hydraulic Bulge Test 液压鼓起试验Hydrogen 氢气Hydrogen Embrittlement 气脆Hydrogen Overvoltage 氢超电压,氢过电压Hydrolic Pressure 液压,油压Hydrolysis 水解Hydrophilic 亲水性Hygroscopic 吸湿性Hypersorption 超吸附I. C. So集成电路器插座icicle 锡尖Illuminance 照度Image Transfer 影像转移,图像转移Imaging 成像处理Immersion Plating 浸镀Immersion Silver 浸镀银Immersion Tin浸镀锡Impedance 阻抗Impedance Match 阻抗匹配Impinge 冲打Impregnate 含浸In-circuit Testing 组装板电测Inclusion 异物,夹杂物Interconnection Defect (ICD)孔壁与孔环互连处之缺失Indexing Hole 基准孔,参考孔Inductance (L) 电感In-feed Rate(Down-feed Rate) 进刀速率Information Appliance(IA) 信息家电Infrared (IR) 红外线Input/Output 输入/输出Insert, Insertion 插接,插装Inspection Overlay 重合套检底片Insulation Resistance 绝缘电阻Integrated Circuit (IC) 集成电路器Interconnection 互连Interface 界面Intermatallic Compound(IMC) 界面合金共化物Internal Stress 内应力Interposer 互连导电物,互连体Interstitial Via Hole (IVH)/Inner Hole局部层间导通孔,内通孔Invar 殷钢Ion Cleanliness 离子清洁度Ion Exchange Resins 离子交换树脂Ion Migration 离子迁移Ionizable (Ionic) Contaimination 离子性污染Ionization 游离,电离Ionization Voltage (Corona Level)电离化电压(电晕水平)IPC 美国印刷电路板协会Isolation 隔离性,隔绝性Isotropic Conductive Adhesive 均向导电胶J-Lead J型接脚,弯钩型接脚JEDEC 联合电子组件工程委员会Job Shop 专业工厂,职业工厂Joule 焦耳Jump Wire 跳线Junction 接(合)面,接头Just-In-Time (JIT) 适时供应,及时出现Kapton 聚亚酰胺软材Karat 克拉,开Kauri-Butanol Value考立丁醇值(简称K.B值) Kerf 切形,裁截Kevlar 聚酰胺纤维Key 电键Key Board 键盘,键盘板Kiss Pressure 吻压,低压Knoop Hardness 努普硬度Known Good Die (KGD) 已知之良好芯片Kovar 科伐合金Kraft Paper 牛皮纸Lamda Wave 延伸平波Laminar Flow 平流Laminar Structure 片状结构Laminate Void 板材空洞Lamination Void 压合空洞Laminate(s) 基板/积层板Laminator 压膜机Land 孔环焊垫,表面(方型)焊垫Land Grid Array (LGA) 承垫(焊垫)格列封装法Landless Hole 无环通孔Large Window 开大窗Laser 雷射,激光Laser Ablation 雷射烧蚀,雷射成孔Laser Ablation Thresholds 烧蚀起限Laser Absorption (Absortance) 雷射吸收度Laser Beam Divergence雷射散射光束Laser Conformal Mask 铜窗Laser Direct Imaging (LDI) 雷射直接成像Laser Fluence 能量密度Laser Heat Affedted Zone 雷热感应Laser Machining 雷射加工法Laser Photochemical Ablation 光化性裂蚀Laser Photogenerator (LPG), Laser Photoplotter 雷射曝光机Laser Photothermal Ablation光热性烧蚀Laser Power Density 功率密度Laser Pulse Frequency 脉冲频率Laser P脉冲稳定性Laser Pulse Width, Pulse Length (or Pulse Duration) 脉冲长度Laser Soldering 雷射焊接法Laser Structuring 雷射成线术Laser Trepanning 雷射环锯成孔法Lay Back 刃角磨损,突刃Lay Up 迭合Layout 布线,布局Layer to Layer Registration 层间对准度Layer to Layer Spacing 层间距离Leaching 焊点熔渗,漂出,溶出Lead 引脚,接脚Lead Frame 脚架Lead Pitch 脚距,中距,跨距Leading Edge 尖端,先锋Leakage Current 漏电电流Learning Curve 学习阶段,学习曲线Legend 文字标记,符号Leveling 整平Lifted Land 孔环(或焊垫)浮起Ligand 错离子附属体Light Integrator 光能累积器,光能积分器Light Emitting Diodes ,LED 发光二极管Light Intensity 光强度Limiting Current Density 极限电流密度Lipophilic 亲油性Liquid Crystal Display ,LCD 液晶显示器Liquid Crystal Polyester Fiber(LCP)液晶聚酯类纤维Liquid Dielectrics 液态介质Liquid Photoimagible Solder Mask, LPSM液态感光防焊绿漆Lithography 影像转移,网印技术Local Area Network 局域网络Logic 逻辑Logic Circuit 逻辑电路Loop 回路Loss Tamgent(TanδD k) 损失正切Lot Size 批量Luminance 发光强度,耀度Lyophilic 可亲水性胶体Macro-throwing Power 巨观分布力Major Defect 严重缺点,主要缺点Major Weave Direction 主要纤向Margin 刃带,脉筋Marking 标记Mask 阻剂Mass Finishing 大量整面,大量抛光Mass Lamination 大型压板(层压)Mass Transport 质量输送Master Drawing 主图Mat 席Matte Side 毛面Mealing 泡点Mean Time To Failure 故障前可使用之平均时数Measling 白点Mechanical Stretcher 机械式张网机Mechanical Warp 机械性缠绕Mechanism 机理Membrane Switch薄膜开关Meniscograph Test 弧面状沾锡试验Meniscus 弯月面,上凹面Mercury Vaper Lamp汞气灯Mesh Count 网目数Metal core Boad (Sulstrate) 金属夹心板Metal Halide Lamp 金属卤素灯Metallization 金属化Metallized Fabric 金属化网布Metal phototool 金属底片Micelle 微胞Micro BGE (μ-BGA) 微型BGAMicro –electronics 微电子Microetching 微蚀Microsectioning 微切片法Microstrip 微条线,微带线Microstrip Line 微条线,微带线Microthrowing Power 微分布力Microvia 微盲孔,微孔Microwave 微波Microwire Board 复线板,微封线(漆包线)路板Migration 迁移Migration Rate 迁移率Mil 英丝,条Minimum Annular Ring 孔环下限Minimum Electrical Spacing下限电性间距,最窄电性间距Minor Weave Direction 次要纤向Misregistration 失准,对不准Mixed Component Mounting T echnology混合零件之组装技术Modelling 模型法,模式法Modem调变及解调器,调制解调器Modification 修改,改质Module 模块Modulus of Elasticity 弹性模数,弹性系数Moisture Absorption 吸湿率,吸水率(又名Water Absorption)Moisture and Insulation Resistance Test湿气与绝缘电阻试验(MIR)Mold Release 脱模剂,离型剂Mole 摩尔,克分子,克原子Monofilament 单丝Mother Board 主构板,母板,主机板Moulded Circuit 模造立体电路板Mounting Hole 组装孔,机装孔Mouse Bite 鼠齿Multi-Chip-Module (MCM) 多芯片(芯片)模块Multiwiring Board(or Discrete Wiring Board)复线板Nail Head 钉头N.C 数值控制Near IR 近红外线Needle Dispense 针管注射法Negative 负片,钻尖第一面外缘变窄Negative-acting Resist 负性作用之阻剂,负型阻剂Negative Etchback 反回蚀Negative Stencil 负性感光版膜Network 网状组件Newton (N) 牛顿Newton Ring 牛顿环Newtonian Liquid 牛顿流体Nick 缺口N-Methyl Pyrrolidine (NMP) N-甲基四氢比咯Noble Metal Paste 贵金属印膏Node 节点Nodule 瘤Noise Budget 噪声上限Nomencleature 标示文字符号,命名法Nominal Cured Thickness 标示厚度Non-circular Land 非圆形孔环焊垫Non-contact Testing 非接触性电性测试Non-flammable 非燃性Non-Flow 非流性Non-recurring Engineering Cost 非经常性工程成本Non-Wetting 不沾锡Normal Concentration (Strength) 标准浓度,当量浓度Normal Distribution 常态分配,常态分布Novolac 酯醛树脂Nucleation, Nucleating 核化Numerical Control 数值控制,数控Nylon 耐龙Occlusion 吸藏Off-contact 架空Offset 第一面大小不均OFHC 无氧高导电铜Ohm 奥姆Oilcanning 盖板弹动OLB(Outer Lead Bond) 外引脚结合Oligomer 寡聚物Omega Meter 离子污染检测仪Omega Wave 振荡波On-contact Printing 密贴式印刷Opaquer 不透明剂,遮光剂Open Circuits 断线Optical Comparator 光学对比器(光学放大器) Optical Density 光密度Optical Fiber 光纤Optical Inspection 光学检验Optical Instrument 光学仪器Organic Solderability Preservatives 有机保焊剂Osmosis 渗透Outgassing 出气,吹气Outgrowth 悬出,横出,侧出Output 产出,输出Overflow 溢流Overhang 总浮空Overiap 钻尖点分离Overpotential (Overvoltage) 过电位,过电压Oxidation氧化Oxidation Reduction Potential(ORP)氧化还原电位Oxygen lnhibitor 氧气抑制现象Ozone Depletion 臭氧层耗损Ozone Killer 臭氧层杀手Packaging 封装,构装Packaging Efficiency 封装效率Pad 焊垫,圆垫Pad Master 圆垫底片(孔位底片)Pads on Via 盖盲孔,反盲孔Pads Only Board 唯环板Palladium 钯Panel 生产板面,制程(排)板,一个大片板Panel Plating 全板镀铜,Panel P全板电镀法Paper Phenolic 纸质酚醛树脂(板材) Parasitics Capacity (Capacitance) 寄生电容Parting Agent 脱膜剂Passivation 钝化,钝化处理Passive Device (Conponent) 被动组件(零件) Paste 膏,糊Pastevia 铜膏导孔Pattern 板面圆形Pattern Plating 线路电镀(大陆术语称圆形电镀) Pattern Process 线路电镀法Peak Voltage 峰值电厌Peel Strength 抗撕强度Periodic Reverse(PR) Current 周期性反电流Peelable Resist 可剥胶,可撕阻剂Perimeter Array 周边排列,四周排列Periodic Reverse(PR) Current 周期性反向电流Peripheral 周边附属设备Permeability 透气性,导磁率Permittivity 容电率(日文为诱电率)Phase 相Phase Diagram 相图Phenolic 酚醛树脂Ph Value 酸碱值Photofugitive 感光褪色Photographic Film 感光成像之底片Photo-imagible Dielectric (PID) 感光介质(材料) Photoinitiator 感光启始剂Photomask 光罩Photoplotter, Plotter 光学绘图机Photoresist 光阻Photoresist Chemical Machining (Milling)光阻式化学(铣刻)加工Phototool 底片Photo-Via 感光孔,感光成孔Pick and Place 拾取与放置Piezoelectric 压电性Pin 接脚,插梢,插针Pin Grid Array (PGE) 针脚格列封装体Pin-In-Paste (PIP) 锡膏中插脚Pinhole 针孔Pink Ring 粉红圈Pitch 跨距,脚距,垫距,线距,中距Pits 凹点Plain Weave 平纤Planarity 平坦性Planarization 精密磨平,精密压平Plasma 电浆Plasticizers 可塑剂,增塑剂Plated Through Hole ,PTH 镀通孔Platen 热盘Plating 镀Plotting 标绘Plowing 犁沟Plug 插脚,塞柱Plug Gauge 孔规Ply 层,股Pneumatic Stretcher 气动拉伸器Pogo Pin 伸缩探针Point Angle 钻尖角Point Source Light 点状光源Point 钻尖Poise 泊Polar Solvent 极性溶剂Polarity 电极性Polarization 分极化,极化Polarizing Slot 偏槽Poly Solder 聚合物焊料Polyester Films 聚酯类薄片Polyimide (PI) 聚亚酰胺Polymer Thick Film(PTF) 厚膜糊Polymerization 聚合,聚合反应Popcorn Effect 爆米花效应Porosity Test 疏孔度试验Positive Acting Resist 正型(性)光阻剂Post Separation 后制程分离,事后分离Post Treatment 后处理Postcure 后续硬化,后烤Pot Life 适用期,堪用时段Potting 铸封,模封Porcelain 瓷材,瓷面Power Supply 电源供应器Preform 预制品Preheat 预热Prepreg 胶片,树脂片Press Plate 钢板Press-Fit Contact 挤入式接触Pressure Cooker Test 压力铜试验Pre-tinning 预先沾锡Primary image 线路成像Probe 探针Pressure Foot 压力脚Print and Etch 印后即蚀,成像后立即蚀刻Print Through 压透,过度挤压Prism Hole Inspector 九孔镜Process Camera 制程用照像机Process Window 操作范围Production Master 生产底片Profile 轮廓,剖面图,升温曲线图,棱线Propagation 传播Propagation Delay 传播延迟Puddle Effect 水坑效应Pull Away 拉离Pulse Plating 脉冲电镀法Pumice Powder 浮石粉Punch 冲切Purge, Purging 净空,净洗Purple Plague 紫疫Pyrolysis 热裂解,高温分解Q-Factor (Quality Factor) (板材之)质量因素Quad Density 四倍密度Quad Flat Pack(QFP) 方扁形封装体Qualification 资格认可Qualification Agency 资格认证机构Qualification inspection 资格检验Qualified Products List 合格产品(供应者)名单Qualitative Analysis 定性分析Quality Assurance 质量保证Quality Conformance Test Circuitry (Coupon) 质量符合之试验线路(样板)Quality Control 质量管理Quality Inspection 质量检查,质量检验Quantitative Analysis 定量分析Quench 淬火,骤冷Quick Disconnect 快速接头Quill 纬纱绕轴Rack 挂架Radial Lead 放射状引脚Radio Frequency Interference (RFL) 射频干扰Radiometer 辐射计,光度计Rake Angle (or Helix Angle)耙起角,盘旋角,抠角,耙角Rated Temperature, Voltage 额定温度,额定电压Reactance 电抗Real Estate 板面空地,底材面,基板面Real-Time System 实时系统Reclaiming 再生,再制Reel to Reel 卷轮(盘)式操作Reference Dimension 参考尺度,参考尺寸Reference Edge 参考边缘Reflection 反射Reflow Profile 熔焊温度曲线Reflow Soldering 重熔焊接,熔焊Refraction 折射Refractive Index 折射率Register Mark 对准用标记Registration 对准度Reinforcement 补强物,补强材Rejection 剔退,拒收Relamination (Re-Lam) 多层板压合Relative Permitivity(ε) 相对容电率Relaxation 松驰,缓和Relay 继电器Release Agent , Release Sheets 脱模剂,离型膜Reliability 可靠度,信赖度Relief 削空Relief Angle 浮角,切削浮角,浮空角Repair 修理Repeated Insertion 多次插触Resin Coated Copper Foil 背胶铅箔Resin Content 胶含量,树脂含量Resin Flow 胶流量,权脂流量Resin Recession 树脂缩陷Resin Rich Area 树脂丰富区,多胶区Resin Smear 胶糊渣,胶渣Resin Starved Area 树脂缺乏区,缺胶区Resist 阴剂,阴膜Resistivity 电阻系数,电阻率Resistor 电阻器,电阻Resistor Drift 电阻漂移Resistor Paste 电阻印膏Resolution 解像,解像度,分辨率Resolving Power 解析力,解像力(分辨力) Retraction Rate 退刀(针)速率Return Path 归路,回程Reverse Blind Hole反盲孔,压合盲孔Reverse Current Cleaning 反电流(电解)清洗Reverse Etchback 反回蚀Reverse lmage 负片影像(阻剂)Reverse Osmosis (RO) 逆渗透Revers反转,还原Revision 修正版,改订版Rework (ing ) 重工,再加工Rhology流变学,流变性质Ribbion Cable 圆线缆带Rigid-Flex Printed Board 硬软合板Ring 套环Rinsing 水洗,冲洗Ripple 纹波Rise Time(tr) 升起时间,上升时间Roadmap 产品变化趋势Robber 辅助阴极Roll to Roll (Reel to Reel) 卷轴对卷轴(连续生产位)Rolled and Annealed Copper Foil (RA Foil) 辊辗铜箔,压延铜箔Roller Coating 滚筒涂布法,辊轮涂布法Roller Cutter 辊切机(业界俗称锯板机)Roller Tinning 辊锡法,滚锡法Rosin 松香Rotary Dip Test 摆动沾锡试验Route and Retain Stiffeners(软板)切术外形之补强模板Routing 切外型Runout 偏转,累积距差Rupture 进裂Sacrificial Protection 牺牲性保护层Salt Spray Test 盐雾试验Sand Blast 喷砂Saponification 皂化作用Saponifier 皂化剂Satellite Handset 卫星行动电话手机Satin Finish 缎面处理Scaled Flow Test 比便流量试验Scavening 刮凹,刮走,刮凹带走Schematic Diagram 电路概略图Scoring 刻沟,刻槽,V型刻槽Scratch 刮痕Screen Printing 网版印刷Screenability 网印能力Scrubber 磨刷机,磨刷器Sculptured Flex Circuit 雕刻式软板Scum 透明歼膜Sealing 封孔Secondary Side 第二面Seeding 下种Selective Plating 选择性电镀Self-Alignment 自我回正Self-Distinguishing 自熄性Selvage 布边Semi-additive Process 半加成制程Semiconductor 半导体Sensitizing 敏化Separable Component Part 可分离式零件Separator Plate 隔板,钢板,镜板Sequential Build-UP(SBU) 完工后(逐次)增层Sequential Buried Via(SBV) 增层后之埋孔Sequential Electrochemical Reduction Analysis (SERA) 顺序性电化学还原分析法Sequential Lamination 接续压合法,镀后压合式制程Sequestering Agent 螫合剂Serpentine Line 蛇形线路Shadowing 阴影,回蚀死角Shadow Moire (or Ther Moire) 莫瑞光影法Shear Strength 抗剪(力)强度Shelf Life 储龄Shield 遮蔽,屏遮Shore Hardness 萧氏硬度Short 短路Shoulder Angle 肩斜角Shunt 分路Side Wall 侧壁Siemens 电阻值Sigma(Stamdard Deviation) 标准差Signal 讯号Signal Integrity (SI) 讯号完整性Silane 硅烷Silica Gel 硅胶砂Silicon 硅Silicon Platforms 封装载板,硅芯片平柜Silicone 硅铜Silk Screen 丝网Silver Migration 银迁移Silver Paste 银膏Silver Fhrough Hole (STH) 银胶贯孔,银胶通孔Single-Inline Package (SIP) 单边插脚封装体Singulation 单片化,裁切单片Sintering 烧结Sizing 上浆处理,上浆Skew (讯号)正时歪斜,错时Skin Effect 集肤效应,表皮效应Skip Printing, Skip Plating 漏印,漏镀Skip So缺锡,漏焊Slash Sheet (规范)附列规格单Slashing 浆经Sleeve Jint 套接Sliver 边丝,边条Slot, Slotting 槽口,开槽Sludge 沉殿物,淤泥Smear 胶糊渣,胶渣Smudging 锡点沾污Snap-off 弹回高度Socket 插座Soft Contact 轻触Soft Glass 软质玻璃(铅玻璃)Solder 焊锡Solder Ball 焊锡球,锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Column Package 锡柱脚封装法Solder Connection 焊接点Solder Coat 焊锡皮膜Solder Dam 防焊,锡堤,阻焊堤Solder Fillet 填锡Solder Joint Density 焊点密度Solder Levelling 喷锡,热风整平Solder Mask(S/M) 绿漆,防焊膜Solder Paste 锡膏Solder Plug 锡塞,锡柱Solder Preforms 预焊料Solder Projection 焊锡突点Solder Sag 焊锡垂流物Solder Side 焊锡面Solder Spatter 溅锡Solder Splash 溅锡Solder Spread Test 散锡试验Solder Webbing 锡网Solder Wicking 焊锡之灯芯效应,渗锡Solder Wire 焊锡丝,软焊丝Solderability 焊锡性,可焊性Soldering 软焊,焊接Soldering Fluid Soldering oil 助焊液,护焊油Soldering iron 烙铁,焊枪Solid Content 固体含量,固形份,固形物Solidus Line 固相线Solubility Product 溶解度乘积,溶解度积Spacing 间距Span 跨距Spark Over 闪络Specification (Spec) 规范,规格Specific Heat 比热Specimen 样品,试样Spectrophotometry 分光光度计检测法Spindle 钻轴,主轴Spinning Coating 自转涂布Splay 斜钻孔Spoke Connection 轮辐状连接垫Spray Coating 喷着涂装,喷射涂装Spur 底片图形边缘突出Spurs and Nodules 突刺与歼瘤Sputtering 溅射Squeege 刮刀Stacked Height 迭高Stacked Microvia 迭置式微盲孔Stacked CSP (Stacked Chips) 重迭式芯片级封装体Stagger Grid 蹒跚格点Stalagometer 滴管式表面张力计Stand-off Terminals 直立型端子Starvation 缺胶State of the Art 艺术境界Static Eliminator 静电消除器Steel Rule Die (钢)刀模Stencil 版膜Step and Repeat 逐次重复曝光Step Microvia (Via) 梯阶式微盲孔(盲孔)Step Plating 梯阶式镀层Step Tablet 阶段式(光密度)曝光表Stiffener 补强条,补强板Stop-off 阻剂,防镀膜Strain 变形,应变Strand 绞Stray Current 迷走电流,散杂电流Stress Corrosion 应力腐蚀Stress Relief 消除应力Strike 预镀,打底Stringing 拖尾,牵丝Stripline 条线,带线Stripper 剥除液,剥除器Stub 支线,线脚Sublimates 升华Substractive Process 减成法Substrate 板材,素材,底材,封装载板。
线路板流程术语中英文对照流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask) I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )。
线路板术语中英文对照-PCB综合词汇PCB综合词汇：1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark。
SMT术语详解3 T+ y4 1 \: x: o4 ZAAccelerate Aging ——加速老化，使用人工的方法，加速正常的老化过程。
* o1 } ]9 y1 y( s9 v+ N3 q; hAcceptance Quality Level (AQL) ——一批产品中最大可以承受的缺陷数目，通常用于抽样计划。
( |3 k" ^9 8 o% I/ n0 Q: eAcceptance Test ——用来测定产品可以承受的试验，由客户与供给商之间决定。
6 \: Y2 P2 n1 l ^Access Hole ——在多层板连续层上的一系列孔，这些孔中心在同一个位置，而且通到线路板的一个外表。
Annular Ring ——是指保围孔周围的导体局部。
4 ^7 S: u+ u0 z8 }3 I/ |Artwork ——用于生产“Artwork Master〞“production Master〞,有准确比例的菲林。
s# A& S4 |- c; ~6 \1 Z) Q2 oArtwork Master ——通常是有准确比例的菲林，其按1：1的图案用于生产“Production Master〞。
% O7 # s# m9 i2 e5 ^1 ]: ]% f! L4 f- I; r& N! {1 z返回顶部B 3 n' ^/ d$ C9 ~2 x7 W* Y; LBack Light ——背光法，是一种检查通孔铜壁完好与否得放大目检方法，其做法是将孔壁外的基材自某一方向上小心的予以磨薄，再利用树脂半透明的原理，从背后射入光线。
假设化学铜孔壁品质完好而无任何破洞或针孔时，那么该铜层必能阻绝光线而在显微中呈现黑暗，一旦铜壁有破洞时，那么必有光点出现而被观察到，并可放大摄影存证，称为背光法，但只能看到半个孔。
Base Material ——绝缘材料，线路在上面形成。
〔可以是刚性或柔性，或两者综合。
Process说明:A. 下料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling) C. 乾膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低於1 mil ( Less than 1 mil Thickness )f-4 高於1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 短断路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货 (Packing & shipping)。
线路板流程术语中英文对照线路板流程术语中英文对照流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油) －－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask) I . 镀金Gold plating i-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired) N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )喷锡、熔锡、滚锡、沉锡、银及化学镍金制程1、Blue Plaque 蓝纹熔锡或喷锡的光亮表面，在高温湿气中一段时间后，常会形成一薄层淡蓝色的钝化层，这是一种锡的氧化物层，称为Blue Plaque。
线路板流程术语中英文对照丝印、碳墨、银胶、可剥胶与铜膏制程1、Angle of Attack 攻角指在网版印刷时，行进中的刮刀面与网版平面所构成前倾之平面夹角而言。
2、Bias 斜张网布，斜织法指网版印刷法的一种特殊张网法，即坚持掉网布经纬方向与外框平行的正统张法，故意令网布经向与两侧网框的纵向构成22°之组合。
至于图形版膜的贴网，那么仍按网框方向正贴。
如此在刮刀往前推进油墨时，会让油墨发生一种侧向驱动的力气。
如在绿漆印刷时，可令其在板面线路面前有较充足的油墨散布。
不过这种"斜张网"法却很糜费网布。
普通故仍可采用正张网而改为斜贴版膜方式，或往复各印一次，亦能处置漏印的效果。
Bias也另指网布经纬纱不垂直的织法。
3、Bleach 漂洗指网版印刷预备工程中，为使再生网版上的网布，与版膜(Stencil)或感光乳胶之间有更好的附着力起见，须将用过的网布以漂白水或细金钢砂为助洗剂，予以刷磨洗净及粗化，以便再生运用，谓之Bleach 。
4、Bleeding 溢流在电路板制程中常指完成通孔铜壁后，能够尚有破洞存在，致使常有残液流出。
有时也指印刷的液态阻剂图形，在后续枯燥进程中能够有少许成份自其边缘向外溢渗出。
如传统烘烤式绿漆，就常出现这种效果。
5、Blockout 封网直接性网版完成版膜(stencil)贴合后，其中心的空网处须以水溶胶加以涂满封锁，以免在实印时形成边缘的漏墨。
6、Blotting 干印"网版"经数次刮印后，朝下的印面上常有多余的残墨存在，须以白报纸替代电路板，在不覆墨下以刮刀(大陆业界称为刮板)干印一次，以吸掉图形边缘的残墨，称为Blotting。
传统烘烤型绿漆必需要不时的干印，才干坚持电路板上所印绿漆边缘的质量。
7、Blotting Paper 吸水纸用以吸收掉多余液体的纸张。
8、Calendered Fabric轧平式网布是针对传统PET网布(商名特多龙)，耐龙网布及不锈网布等，将其刮刀面特别予以单面轧平，使容易刮墨并令"印墨"减薄，而让UV油墨的曝光更容易及透彻。
中英文对照PCB生产流程常用术语PCB（Printed Circuit Board）是电子产品中不可缺少的组成部分之一，其生产流程中涉及到许多常用术语。
以下是PCB生产流程常用术语的中英文对照：1. Substrate 基板2. Copper foil 铜箔3. Etching 蚀刻4. Resist 前刻蚀剂5. Photolithography 光刻6. Exposure 曝光7. Development 显影8. Plating 镀金9. Solder mask 焊膜10. Screen printing 丝网印刷11. Drilling 钻孔12. Plated through hole (PTH) 镀孔14. Surface mount technology (SMT) 表面贴装技术15. Solder paste 焊膏16. Reflow soldering 回流焊接17. Wave soldering 浪涌焊接18. Automated optical inspection (AOI) 自动光学检测19. Flying probe testing 飞针测试20. Automated X-ray inspection (AXI) 自动X射线检测21. Printed circuit assembly (PCA) 印刷电路组装23. Pick and place machine 取放机24. Reflow oven 回流炉25. Wave soldering machine 浪涌焊接机26. Conformal coating 敷膜27. Inspection 检查28. Testing 测试29. Quality control 质量控制30. Failure analysis 故障分析31. Rework 修复32. Final inspection 最终检验33. Packaging 包装34. Shipping 出货35. Documentation 文件以上是PCB生产流程中常用的术语，为了有效沟通和交流，在工作中我们要熟悉这些术语的中英对照。
线路板词汇中英文对照200９-０8—2０ 1８:4２A／W (artｗｏrk) 底片ﻫAbｌatioｎ烧溶(laｓｅr),切除ﻫﻫａｂrade 粗化ａｂrａsiｏn ｒesiｓｔanｃe 耐磨性aｂｓorpｔion 吸收ﻫAＣC ( ａｃcepｔ ) 允收ﻫaccelｅｒatｅd ｃorrｏｓioｎtｅｓt 加速腐蚀ﻫacｃelｅrated test 加速试验ａcceleration 速化反应ﻫaccelerator 加速剂ﻫacceptable 允收activator 活化液ﻫacｔive work in procesｓ实际在制品ﻫﻫadheｓioｎ附着力ﻫﻫadhesive ｍethod 黏着法aｉr ｉnclｕsion 气泡ａir ｋnife 风刀ﻫaｍｏrpｈous ｃhａｎge 不定形的改变ﻫamount 总量ﻫamｙlｎiｔriｔe 硝基戊烷ﻫanalｙzeｒ分析仪aｎnｅaｌ回火ﻫanｎulａｒ ring 环状垫圈；孔环ﻫﻫaｎode slｉme （sludｇe) 阳极泥ﻫaｎoｄizing 阳极处理ﻫﻫAＯＩ（ auｔomaｔiｃoptｉcal inｓpection ) 自动：光学检测ａpplicabｌe docuｍents 引用之文件ﻫAQL sampling 允收水准抽样ａquｅouｓpｈotｏｒesｉst 液态光阻ﻫﻫaspecｔｒａtio 纵横比（厚宽比) ﻫＡs reｃｅiveｄ到货时ｂack ｌigｈｔing 背光ﻫﻫback—ｕｐ垫板ﻫﻫbanked ｗork in prｏcｅss 预留在制品ﻫﻫbase material 基材ﻫｂaseｌine perfoｒmaｎcｅ基准绩效batｃｈ批ﻫｂｅta baｃkｓcattｅriｎｇ贝他射线照射法ﻫbeveling 切斜边;斜边ﻫbiａxiａl defｏｒmation 二方向之变形ｂlacｋ—oxiｄe 黑化ﻫﻫｂlank coｎtroller 空白对照组ﻫﻫbｌank pａneｌ空板ﻫﻫblaｎkinｇ挖空blip 弹开ﻫｂlisｔeｒ气泡;起泡bliｓtering 气泡ﻫｂｌｏw hoｌe 吹孔ﻫﻫbｏａrd-thｉcknesｓeｒｒｏr 板厚错误ﻫﻫboｎｄing pｌiｅs 黏结层ﻫbow ；bowing 板弯breａｋｏuｔ从平环内破出ﻫbridging 搭桥;桥接ＢＴO （Build To Orｄｅr) 接单生产ﻫﻫｂuｒniｎg 烧焦ﻫﻫburr 毛边（毛头)ﻫﻫcamcｏrdｅr 一体型摄录放机ﻫcａrbiｄe 碳化物ﻫcarlson piｎ定位梢ｃarrier 载运剂ﻫｃaｔalyzing 催化ﻫcatholｉc sputteｒiｎｇ阴极溅射法ﻫcaul plaｔe 隔板;钢板ﻫcalｉbration systｅm ｒequiremeｎtｓ校验系统之各种要求centｅr ｂeaｍmethｏｄ中心光束法ﻫﻫｃentｒaｌ prｏjｅｃtiｏｎ集中式投射线ﻫﻫｃertifiｃation 认证ﻫｃhamfer 倒角(金手指）ﻫｃhamferinｇ切斜边;倒角ﻫｃhａraｃteｒｉstｉｃ iｍpedａnce 特性阻抗chaｒge tｒaｎｓfer oｖerpｏｔeｎtial 电量传递过电压ﻫﻫcｈasｅ网框ｃｈeckbｏard 棋盘ﻫｃhｅlaｔor 蟹和剂ﻫｃhemical bｏｎd 化学键cheｍical vapor deｐｏｓitｉon 化学蒸着镀ﻫcirｃumfｅrential vｏｉd 圆周性之孔破clａd metａl 包夹金属ﻫcｌean rｏｏm 无尘室ﻫﻫcｌeａrancｅ间隙ﻫﻫcoaｔ镀外表ｃｏaｔing error 防焊覆盖错误ｃoｅffｉcｉｅｎt ｏf thｅｒmａl expanｓioｎ (CTE) 热澎胀系数cold soldｅr joinｔ冷焊点ﻫcold—welｄ金属粉末冷焊ﻫﻫｃoｌｏr 颜色ﻫcoloｒ error 颜色错误ﻫｃompeｎｓatiｏn 补偿ﻫﻫcompeｔitive performａnｃe 竞争力绩效ﻫﻫcomplｅｘsalｔ错化物ﻫｃｏmplexoｒ错化物ﻫｃｏmpｏnent ｈｏle 零件孔ﻫcomponent side 零件面ﻫconｃeｎｔric 同心ﻫcｏnformａnce 密贴性ﻫcｏnsｕmer ｐroducts 消费性产品ﻫconｔａct resｉstａnce 接触电阻ﻫﻫｃontiｎｕous performaｎce 连续发挥效能ﻫﻫcoｎtrａct seｒvｉce 协力厂ﻫconｔrolｌｅd sｐlit 均裂式ﻫconveｎtionａl floｗ乱流方式conventional tｅnsile tｅst 传统张力测试法ﻫcｏnversion coａｔing 转化层ﻫconvex 突出ﻫcoordiｎate list 数据清单ﻫｃopper ｃladed ｌaｍinａtｅs (CCＬ) 铜箔基板ﻫcoｐper ｅxｐoｓｕｒe 线路露铜ﻫﻫcopper ｍirrｏr 镜铜ﻫcoｐper ｐad 铜箔圆配ﻫcｏｐｐer residue (cｏpper sｐｌasｈ）铜渣ｃorrｏｓｉon rａte numbering 腐蚀速率计数系统ﻫﻫcｏrroｓion resistance 抗蚀性ﻫcouｌombs law 库伦定律ﻫﻫcoｕｎｔersｉnk 喇叭孔ﻫcoupoｎ试样ﻫcoupon ｌocation 试样点ﻫcoveｒing power 遮盖力ﻫﻫCPＵ中央处理器ﻫﻫcrａck 破裂；裂痕ﻫﻫｃrａzing 裂痕;白斑ﻫcross lｉｎking 交联聚合ﻫcｒｏｓs talk 呼应作用ﻫcrｏssｌｉnkｉng 交联ﻫcｒyｓｔaｌcolｌeｃｔｉon 结晶收集ﻫｃuring 聚合体cuｒrent eｆｆiciｅｎcy 电流效率ﻫcut－outｓ挖空ﻫcuｔtiｎg 裁板ﻫcyanide 氰化物ﻫﻫcycles oｆ lｅarning 学习循环ﻫcyｃle－time ｒｅducｔｉon 交期缩短dａte coｄｅ周期ﻫdeｂurriｎg 去毛头ﻫdｅdicａted 专用型degradatiｏn 退变ﻫdｅｌamiｎatｉoｎ分层ﻫdenｔ / pin hole 凹陷/ 针孔ﻫｄepartmｅnt of defeｎsｅ国防部ﻫﻫdesignａtiｏn 字码简示法ﻫｄe-smｅａｒ除胶渣ﻫdevｅlopiｎg 显影ﻫdewｅttiｎg 缩锡ﻫdeｗettinｇ tｉmｅ缩锡时间ｄimeｎｓｉon erroｒ外形尺寸错误ﻫdielectric ｃonstaｎt 介质常数ﻫﻫdifficuｌtｙ困难度ﻫdiｆunｃtional 双功能ﻫﻫｄimeｎｓion 尺寸dimｅnsｉｏn staｂilitｙ尺寸安定性ﻫdｉｍｅnsionaｌ staｂility 尺度安定性ﻫｄimeｎsｉon and ｔolerancｅ尺寸与公差dｉrtｙhole 孔内异物ｄiｓcolｏr hoｌe 孔黑；孔灰；氧化ﻫﻫdｉscolｏｒation 变色ﻫﻫdispｏsaｂle eｙeｌｅｔｍetｈod 消耗性铆钉法ﻫdistortion ｆａctｏr 尺寸变形函数ﻫﻫdｏubｌe side 双面板ﻫｄowｎtimｅ停机时间ﻫdrｉll 钻孔drill bｉt 钻头ﻫdrill fａcet 钻尖切萷面ﻫdrill pointeｒ钻尖重(研）磨机ﻫﻫdrilled blａnk board 已钻孔之裸板driｌlinｇ钻孔dry film 干膜ducｔility 延展性ﻫﻫeconｏｍy of sｃａlｅ经济规模ﻫｅdge spacinｇ板边空地ﻫﻫｅdgｅ-ｂoaｒd ｃoｎｔaｃt ( gold finger ) 金手指ﻫeffｉｃiency 能量效率ﻫﻫelectric teｓｔ电测ﻫﻫelｅcｔｒicａｌtｅstiｎg 电测;测试ﻫｅlectｒocｈeｍicaｌ maｃｈine ECM 电化学加工法elｅctrochemiｃaｌ reaｃtor 电化学反应器ﻫﻫｅlectｒofoｒming 电铸ﻫﻫｅlectｒoless plate 化学铜ﻫeｌｅｃtrolesｓ－depoｓition 无电镀ﻫelｅcｔropolishinｇ电解拋光ﻫeleｃtｒｏｒｅｆining 电解精炼ﻫﻫeｌeｃtｒoｗｉnｎing 电解萃取ﻫｅlｌipｔical seｔ椭圆形ﻫﻫｅmbｒiｔｔｌemeｎt 脆性ﻫentitlement ｐerformancｅ可达成绩效ﻫentｒａｐmｅnｔ电镀夹杂物ﻫﻫepoxy 环氧树酯ﻫﻫeqｕipoｔｅnｔiaｌ电位线ﻫｅrrｏr daｔａ file 异常情形ﻫetch ratｅ蚀铜速率ﻫｅtｃhａnｔs 蚀刻液etchback 回蚀ﻫｅｖａluaｔiｏn proｇｒａm 评估用程序ﻫｅxｐoｓｕre 曝光ﻫｅｘｔｅｒnaｌ piｎｍｅｔhod 外部插梢法eyelet hole 铆钉孔ﻫEｙeｌettｉnｇ铆眼ﻫﻫｆaｂric 网布failuｒｅ故障ﻫfaｓt ｒｅsｐonｓe 快速响应ﻫfault 瑕庛；缺陷ﻫﻫfｉber expｏsuｒe 纤维显露ﻫfiｂｅr prｏtｒusｉoｎ纤维突出ﻫfiｄｕcial mark 光学点，基准记号fｉller 填充料film 底片ﻫfiltｒation 过滤ﻫｆiniｓhed ｂoard 成品ﻫﻫｆiｘｉnｇ固着fixturｅ电测夹具(治具）ﻫﻫｆlaking off 粹离ﻫﻫｆlaｍｍabiliｔｙ rating 燃性等级ﻫflａre 喇叭形孔ﻫｆlat cａbｌe 并排电缆ﻫﻫfeedback ｌoop 回馈循环ﻫfiｒｓt—ｉn—fiｒsｔ-oｕt （FIFＯ）先进先出fｌeｘｉble ｍanufaｃturing systｅm （ＦＭS）弹性制造系统ﻫﻫfｌux 助焊剂ﻫfｏil disｔｏrtion 铜层变形fｏｌd 空泡ﻫｆoｒeign inclｕde 异物forｅigｎmａtｅrial 基材内异物ﻫfrｅe radicａl chain polyｍeriｚａtioｎ自由基连锁聚合ﻫｆully adｄitive 加成法fulｌy aｎnｅalｅd tyｐe 彻底回火轫化之类形ﻫfunctiｏn 函数ﻫfuｎdamenｔａｌ and bａsｉc 基本ﻫﻫfuｎｇuｓ resiｓｔance 抗霉性ﻫｆunneｌ flａnｇe 喇叭形折翼ﻫﻫｇaｌvanizｅd 加法尼化制程ﻫgａｐ钻尖分开ﻫｇaugｅｌｅｎgth 有效长度gel time 胶化时间gｅnerａｌ resist ｉnｋ一般阻剂油墨ﻫﻫgeｎerａl 通论ﻫgｅneｒal ｉnｄustrial 一般性(电子)工业级ｇeometrical levelling 几何平整ﻫgｌass traｎsitiｏn ｔempeｒatｕｒｅ (Tg) 玻璃态转换温度ﻫGold 金ﻫgｏｌd fiｎger 金手指ﻫgｏld plating 镀金ﻫｇolden boaｒd 标准板ﻫﻫgｏugｅs 刷磨凹沟ｇouｇing 挖破ﻫgｒain boｕndary 金属晶体之四边ｇｒｅｅn 绿色ﻫﻫｇriｐ夹头ﻫgrouｎd plａne 接地层ﻫﻫgｒound ｐlane clearaｎce 接地空环ﻫhackerｓ骇客ﻫHAＬ（ hot ａｉｒｌeveliｎg ) 喷锡ｈaloing 白边；白圈ﻫhardener 硬化剂ﻫﻫhardnｅss 硬度ﻫhｅｐa ｆilｔeｒ空气滤清器ﻫﻫhiｇｈperforｍaｎcｅ iｎduｓｔriaｌ高性能（电子）工业级ﻫhigh rｅliａbｉlity 高可靠度ﻫhigh rｅsolutｉｏn 高分辨率ﻫｈｉｇh ｔemperatｕｒe elongatiｏn （HTＥ）高温延展性铜箔ﻫﻫhigｈtemperature eｐoxy (ＨＴE) 高温树酯ﻫhit 击ﻫhoｌe cｏuntｅr 数孔机ﻫhole diaｍeｔer 孔径ﻫhole diamｅter ｅrrｏr 孔径错误ﻫhｏｌe loｃaｔiｏn 孔位ﻫﻫｈole ｎｕmbeｒ孔数ﻫhole ｗall quａｌity 孔壁品质ﻫﻫhoｏk 外弧hot dｉp 热浸法ﻫﻫhuｌｌ ceｌl 哈氏槽ﻫﻫhｙｂrｉｄ混成集成电路ﻫﻫhydro ｇｅn bonding 氢键ﻫhydrolｙｓis 水解ﻫhydroｍetallurgy 湿法冶金法ﻫimagｅ anaｌｙｓiｓsystem 影像分析系统ﻫimagｅｔｒanｓｆeｒ影像转移immeｒsｉｏn gold 浸金(化镍金)ﻫimｍerｓｉｏn platｉng 浸镀法ﻫｉｍｐedanｃe 阻抗infｒared rｅflow 红外线重熔ﻫinhibitor 热聚合抑制剂ﻫﻫiｎjｅcｔioｎ mｏlｄ射模ﻫink 油墨ﻫiｎｎerlaｙeｒ＆ outlayｅr 内外层ﻫinsulation rｅsistanｃe 绝缘电阻ﻫﻫintｅｎdeｄｐｏｓitｉｏn 应该在的位置ﻫﻫinｔeｎｓifier 增强器ﻫintenｓity 强度ﻫﻫinｔｅr molecｕｌａr exchange 交互改变interconnectｉon 互相连通ﻫﻫionic contａｍinanｔs 离子性污染物ﻫｉｏnic ｃontａｍiｎation teｓtiｎg 离子污染试验ﻫIＰＡ异丙醇ﻫ5I ： insｐiraｔｉon （启蒙）ﻫidｅｎtificaｔioｎ确认计划目标ﻫﻫimpｌeｍentation 改善方案ﻫinformａtioｎ数据ﻫｉntｅｒnaｌizaｔｉｏｎ制度化ﻫｉnvisibｌe inventorｙ无形的库存ﻫknifｅ edgeｓ刀缘ﻫＫnoop 努普(硬度单位)ﻫｋｒａft paｐer 牛皮纸lａmiｎar fｌow 层流ﻫｌａminａｔｅ基层板ﻫlａｍiｎａtiｎg 压合ﻫｌaminatiｏn 压合lａmｉnaｔｏr 压膜机ﻫlａnd 焊垫lay bacｋ刃角磨损ﻫlａy ｕp 组合叠板ﻫlayout 布线；布局ﻫｌeａd ｓcrｅw 牵引螺丝ﻫleakagｅ漏电ﻫleａrniｎｇ curve 学习曲线lｅgend 文字标记ﻫlｅveｌiｎｇ平整ﻫﻫlｅveｌｌing additive 平整剂ﻫlevellｉnｇｐoｗeｒ平整力ﻫｌｉfe ｓupporｔ维系生命ﻫlimitiｎg cｕrrenｔ极限电流ﻫﻫlｉne spaｃｅ线距line wｉｄtｈ线宽ﻫﻫlinｅaｒ variａble diffeｒentｉaｌ transfｏrmer(LVDL) 线性可变差动：转换器ﻫｌｉquid 液状(态)ﻫﻫｌiquiｄ cryｓtal rｅsins 液晶树脂ﻫliquid photoimａgeable soｌder resｉst inｋ液态感光防焊油墨ﻫlｉquid ｐhoｔｏｒｅｓist iｎk 液态光阻剂油墨ﻫloｔsｉze 批量ﻫlowｅr carrｉeｒ底部承载板ﻫmechanical plａtｉｎｇ机祴镀法ﻫmacｈine sｃrub 刷磨清洁法ﻫmacrothroｗiｎg poweｒ巨分布力ﻫﻫmargｉn 钻头刃带ﻫﻫmａrｋet share 市场占有率ﻫﻫｍaｒking erroｒ文字错误ﻫｍaskｅd leｖeliｎg 儰装平整ﻫmasｓｌaminａtioｎ大型压板ｍasｓtransfer 质量传送效应ﻫmass ｔransfeｒ ovｅrｐｏtｅｎｔiaｌ质量传递过电压ﻫﻫmass tranｓporta ｔiｏn 质传ﻫﻫｍastｅr drawing 主图;蓝图mａteriａl use ｆａctｏr 材料使用率meaｌing 泡点;白点ﻫﻫｍemory 记忆装置ﻫmｅnisｃograph solderaｂｉｌity meａsuremｅnt 新月型焊锡效果ﻫmicroetch 微蚀micrｏetchｉng 微蚀ｍｉｃroｆｏｃus 微焦距ﻫmicｒｏfoｃus syｓtem 微焦距系统ﻫmicｒoprofｉlｅ微表面ﻫmiｃroｓｅctiｏninｇ微切片法microｔhrowiｎg powｅr 微分布力ｍigｒation 迁移ﻫmｉni-teｎｓilｅ tｅｓｔｅr 迷你拉力测试仪ﻫﻫmis hoｌe locａtｉｏn 孔位错误ﻫmiｓregｉｓtrａtｉon 焊锡面与零件面对位偏差ﻫｍｉsrｅgsitration 对不准ﻫmoisｔure aｎｄiｎｓｕlatiｏn resistance ｔesｔ湿气与绝缘电阻试验ﻫmｏldeｄ circuit ｂoａrｄ(MCＢ) 模制电路板ﻫmonｏethaｎaｌａｍｉｎｅ单乙醇氨moｎoｈydratｅ staｔｅ水化物moｎoｍer 单分子膜；单体ﻫmouse ｂｉte 锯齿;蚀刻缺口ﻫmsec 毫秒ﻫﻫmuffｌｅｆurｎace 高温焚火炉multichip 超大IC型(多芯片模块)ﻫﻫmylar 保护膜ﻫﻫﻫnaiｌ hｅａｄ钉头NＣ drill 数字钻孔机ﻫnegａｔive eｔchbaｃｋ反回蚀ﻫnegative fｉｌm 负片ﻫnegaｔｉve rake ａngle 负抠耙角ﻫnｅtwoｒk 回路；网络ﻫﻫnｅutralization 中和ﻫｎick 缺口ﻫｎiｃｋel 镍ﻫﻫｎoｄule 铜瘤;瘤粒ﻫno flｏｗ reｓｉn 不流树脂ﻫﻫnｏise 噪声ﻫｎominａl 标示ﻫnomｉnａl dimensioｎ标定长度ﻫﻫnｏminａl gel ｔｉme 标示胶性时间ﻫnomｉnal rｅsｉn coｎtent 标示胶含量ﻫnomｉnaｌ resin ｆlow 标示胶流量ﻫﻫnominal scaｌed fｌow tｈickness 标示比例流量厚度ﻫﻫＯA eqｕｉp 办公室自动:化设备ﻫoｂｓｏlescence ｆactｏr 报废因素ﻫOEＭ原设备制造商ﻫoffset—ｌｉst 补偿数据清单oｈmｍeter 欧姆计ﻫopen 断路ﻫopｅn cirｃuｉtｓ断路oｐｅｎｓhｏｒt ｔesting 断短路测试ﻫopeniｎg 开口ﻫｏrｉginａl art work (Ａ/W）原稿底片ﻫﻫOtheｒs 其它ﻫoｕｔgrowth 增出ovｅr deｓiｇｎ牛刀杀鸡ﻫｏvｅrlap 钻尖重叠ﻫoveｒlaｙeｎtｒy 盖板ﻫoverpｏtｅntial 过电压ﻫoxidaｔion 氧化ﻫoxｉde ｔreａtmｅｎt 黑化处理ﻫﻫoｘided cytoｃhrome 氧化性之细包色素oxygen ｅvoluｔｉoｎ氧气发生反应ﻫﻫﻫｐacｋｅｄbｅｄ充填床式pad 锡垫;圆配ﻫpaｄcoｐper expoｓure paｄ露铜panel 小型板面；母板panel pｌａｔiｎg 一次铜电镀ﻫﻫparａｓiｔｉc 寄生的parｔno. 料号ﻫpattern pｌaｔing 二次铜电镀ﻫＰＣB （ｐrｉｎｔｃiｒcuit bｏard ) 印刷电路板ﻫｐｃｓ片ﻫpeｅｌ strengtｈ抗撕强度ﻫpｅeliｎg oｆf 剥离(剥落)perfｏrmancｅ spｅcifｉcａｔｉｏn 性能规范ﻫｐｅrmittｉviｔｙ透电率ﻫpersｐecｔｉves on exｐｅrｉence 经验透视PET 聚酯ﻫﻫｐhotoｄiｏdｅ deteｃtｏr 发光二极管侦测器ﻫphoto iniｔiａtor 感光启始剂ﻫｐhotoｒｅsist 光阻ﻫｐhｏtotoｏｌ光具（指工作底片)ﻫﻫｐiｅce 子板面ﻫpiｎcｅtoｎ apｐlied resｅaｒch 腐蚀测定仪pink rｉng 粉红圈ﻫﻫpiｔ凹点ﻫpitｃh 脚距ﻫﻫplａnａr 平面plａting 电镀ｐlating exposuｒe 下镀层露出ﻫplug gａｕge 插规ﻫｐｌｕg holｅ孔塞ＰＮL （pａnel）排板polar-ｐolar interａctｉon 极性之间的吸力ﻫpolyestｅr 聚酯类ﻫﻫpoｌyglycｏlｓ聚乙二醇ﻫﻫpolyimiｄｅ聚亚醯氨ﻫpoor bevｅlｌing 磨边加工引起突起,剥离ﻫﻫｐoor driｌl 孔形不良pooｒ HAL 喷锡不良pｏｏr marｋinｇ字体不良ﻫﻫpoｏｒｐａd 锡垫不良ﻫﻫpoor ｐrｉｎted 印刷偏差poｏｒ sｏlderabilｉty 焊锡性不良ﻫｐoor touch-uｐ补线不良ﻫｐoｓition coｎtrｏl ｓｙstem 位置控制系统ﻫﻫpｏsiｔivｅ rake angle 正抠耙角poｗer curve model 幕次曲线模式ﻫprａｃtice 工艺惯例ﻫprｅferrｅd 良好prｅmaturｅteaｒing 提前撕裂ﻫpｒepolｙmeｒ预聚合物ﻫﻫｐreｐｒeg 胶片pre-process ( fｒoｎt－eｎd）制前presｓ压床ﻫpｒess cyｃle 压合周期ﻫpriｍａry cuｒrｅｎt diｓtｒibution 一次电流分布ﻫpriｍａry 主要ﻫﻫproducｔlifetimes 生命周期pｒｏducｔ procｅss 制程ﻫprｏmoter 促进剂ﻫﻫpｒotoｃal 初步资料ﻫｐrussic acid 普鲁士酸ﻫＰTF-basｅｄ proceｓs 厚膜糊法ﻫPTH (pｌａtｉng thｏuｇｈｈolｅ) 导通孔pull awaｙ拉开ﻫpumiｃe 浮石粉ｐumicｅ scｒｕｂ喷砂清洁法ﻫpyｒomｅtallｕｒgｙ火烧法冶炼ﻫﻫﻫQC ( qualiｔy coｎtroｌ）品管ﻫQＦP (ｑｕad flat pacｋ ) 扁方型封装体ﻫqｕalifｉcaｔion inspｅcｔion 资格审查检验qｕaｌificatｉon ｔesｔinｇ资格检定ﻫｑuａliｔy classification 品质等级ﻫﻫquanｔiｔative 计量式测试ﻫﻫﻫｒａｃｋ挂架ﻫﻫradｉomeｔeｒ能量剂ﻫrake angle 抠耙角ﻫRAＭ［Ｒandoｍ Acｃess Memorｙ随机存取内存ﻫreal timｅ关键时刻ﻫreｃesｓｅd trａce ｐroｃeｓs 凹槽线路法ﻫreｃｏvery tank 回收槽ﻫredｕｃtion 还原ﻫﻫre—eninforcement 强化ﻫﻫreｆｒａction 折光率ﻫﻫreinforcemｅｎｔｓtyｌe 补强材料的型式ﻫﻫreｇistｅｒ maｒk 对位用标记reｇisｔration holｅ对位孔reｇistratｉoｎｐaｔｔern 长方形铜地ﻫﻫREJ ( ｒeｊect ) 退货;拒收ﻫrｅjｅctaｂle 拒收ﻫﻫrelease ａｇent 脱模剂ﻫﻫrelief ａnｇlｅ浮离角ﻫrｅmark 备注ﻫﻫｒｅｐair 修理ﻫreｓin ｃoｎtenｔ树脂含量(胶含量）ﻫｒｅｓin fｌow 胶流量ﻫresin floｗ percentaｇe 树脂流量之百分率ｒｅｓiｎｒeｃesｓｉon 树脂下陷ﻫﻫrｅｓin sｍeaｒ胶渣ﻫﻫｒeｓist ｓtrippers 剥干膜剂ｒesiｓtor network 排列电阻ｒesｏlutiｏn 解像度ﻫrｅtｕrn on aｓｓｅｔs 资产报酬率rｅversibilｉty 可逆性ﻫﻫrｅwork 重工rosin 天然松香ﻫﻫrotａｔing ｃyliｎdｅr 旋转圆柱形ﻫrouｇhｔｎeｓs 孔壁粗糙;粗慥ﻫｒoｕｔｉng 切外形,成型ﻫrouｔing biｔ铣刀ﻫrunout 偏转ﻫﻫＳ/L ｏn hｏle 孔内沾文字ﻫＳ/M （sｏldｅr mask ）, S/L 防焊文字ﻫﻫＳ／Ｍ (sｏｌdｅr ｍask) 防焊ﻫS/M ｅrror 防焊种类错误ﻫS/M on hole 孔内绿漆ﻫﻫｓalｔsｐrａｙｔest 盐水喷雾试验ﻫsａmplinｇ size 抽样数ﻫｓcopｅ范围ﻫｓcｏｒed 刻痕scoriｎg 枢槽;刮线scｒap 废框sｃrａtcheｓ刮伤ﻫscreeｎ pｒiｎtinｇ网版印刷sｃuｍ透明残膜ﻫseａling 封孔处理ﻫﻫseconｄａｒｙ次要semi-addｉtive 半加成法senｓｉｔize 敏化ﻫﻫsenｓitｉｚer 敏化液seｐaratoｒ钢隔板ﻫsequeｎtial lamination 渐成式压法ﻫserratｅｄ edｇes 毛边ﻫﻫshａtteｒ破碎sｈｏrｔ短路shｕnｔ分路ﻫsilane tｒeatｍenｔ硅烷处理ｓilｉconｅ couｐling aｇｅnｔ硅烷偶合剂ﻫｓilk ｓcreen 文字印刷ﻫﻫsｉmuｌatoｒ仿真器ﻫｓingｌe aｘis 单轴siziｎg 底片之伸缩补偿skｉp 漏印ﻫsｋip pｒintiｎg 跳印;漏印ﻫｓｌiｖer 丝条ﻫslot 开槽ﻫsｌｏtｔinｇ开槽ﻫSMＤ（ surfacｅ moｕnｔdeｖｉｃe ) 表面黏着组件ﻫsmear 胶渣ﻫSＭT ( surface mount ｔechnolｏgy )表面黏着技术ﻫsoｄｉuｍ carbonate mｏnohｙdrate 结晶水碳酸钠ﻫsoft tooling 软性工具soｌdｅｒ焊锡；锡铅sｏlｄｅr bridge 锡桥ﻫsｏｌder bｕmp 锡突ﻫﻫsolder ｆloat 漂锡ﻫsolder mａsk adｈesｉon 绿漆附着力ﻫsoｌder ｏn G/Ｆ金手指沾锡ﻫﻫsolｄer ｏn tｒace 线路沾锡ﻫﻫｓolｄer plug 锡塞ﻫﻫsoldeｒｓiｄe 焊锡面soｌderaｂｉｌity 焊锡性solid ｃarｂiｄe 实质碳化物spacｉng 间距ﻫﻫspａcing nonenough 间距不足ﻫﻫSPC ( Statiｓticａl Proc ｅss Ｃｏnｔｒol ) 统计生管ﻫspecｉficａｔｉoｎ规范ﻫsｐｅciａｌ cｏｎsideｒatｉｏns 特别考虑sｐin ｃoaｔinｇ旋转涂布ﻫspiｎdlｅ钻轴ｓpｉral ｃoｎtractoｍｅter 螺旋收缩仪ﻫsｐoｔfａce 铣靶ﻫspray cｏatｉng 喷涂ﻫSｑuｅegeｅ刮刀ﻫﻫstackiｎg structure 叠板结构stamｐinｇ冲压ﻫstａndard hｙｄraulｉc laminａtioｎ标准液压法ﻫﻫstandａrdizｉｎｇ标准化ﻫﻫstarｖatioｎ缺胶ﻫsteｐｔableｔ格片数ﻫstoｃk optiｏn 认股选择权ｓtrａin 应度ﻫﻫsｔreｎgth 强度ﻫﻫｓtressmeter 应力计ﻫsubｔｒactive 减除法ﻫｓurfａｃｅ cｏnｖｅx 表面突起ﻫsｕrfａｃe ｅｘaminaｔion 表面检查ﻫﻫsｕrfacｅinsulatiｏn resistａnc ｅ（ＳＩR）表面绝缘电阻ｓurface moｕｎｔ表面黏着方式ｓｕrｆace roｕｇhｎｅｓs 表面粗慥度surｇｅｓ突波ｓwitch cｉrｃｕiｔ开关线路ﻫｔab 金手指ﻫﻫtack free 不黏ﻫtapeｄｈole gａuｇe 锥形孔规ﻫﻫtａrget hoｌｅ靶孔ﻫﻫtaｓｋｆorce 任务编组ﻫtensile strengｔｈ抗拉强度ﻫtensile stress 张性应力tent 浮盖ﻫterms anｄ dｅｆｉnｉｔiｏns 术语与定义ﻫtｅrmｉｎatiｏn ｌoａd 抗匹配负载ｔeｓt circｕit 测试线路tesｔmeｔｈod 试验方法ﻫtest point 测试点ﻫﻫtｈeｒｍａl shoｃk 热震荡试验ﻫｔhｅrｍal stｒｅsｓ热应力试验ﻫﻫtｈermiｓtor 热电感应式ﻫtheｒmo cｙcliｎg 热循环试验ﻫtheｏretｉcal ｃycｌｅｔｉmｅ理论性周期时间ﻫﻫｔhickｎeｓs 厚度ﻫｔimｅ to mａrkｅt 上市时机ﻫtｈiｃkness distｒibutiｏｎ厚度分布ﻫﻫthief 补助阴极ﻫﻫthin cｏre 薄基板;内层板ﻫｔhrｏｗing powｅｒ分布力ﻫtolerance 公差;容差ﻫﻫtｏoling hole 工具孔ﻫｔoｒｑue load 扭力拒之负载ﻫtotａl quality ｐrｏgram 全面的品质计划ﻫｔoughnｅss 坚度trace ｅrror 线路错误ﻫｔrace nicｋ & pin hole 线路缺口及针孔ﻫﻫtrace peeliｎｇ线路剥离ﻫtｒacｅｐin-hole 线路针孔ﻫﻫｔrace surface ｒoughnｅss 线路表面粗糙ﻫtaｒｎｉsh and oxidｅｒeｓiｓt 抗污抗氧化剂ﻫtｒanｓmｉttance 透光度ﻫtrim line 裁切线ﻫｔrｕe ｌevｅlliｎg 真平整ﻫﻫtｒue ｐosｉtion 真正位置的孔；真位ﻫtwisｔ板翘ﻫﻫtypｅ种类ﻫﻫumbra 本影ﻫundｅrcut 侧蚀ﻫuneｖen ｃoatｉng 喷锡厚镀不平整ﻫｕniverｓal 万用型ﻫﻫunｉｖeｒsａl tｅnsｉle ｔｅｓｔer 万用拉力试验机ﻫｕｎiverｓal tester 泛用型测试机ﻫupper ｃarrｉeｒ顶部承载钢ﻫﻫupｔimｅ稼动:时间vacuum ｄepoｓitｉon 真空蒸镀法ﻫｖａｃｕum hydraulｉc laminaｔiｏn真空液压法ﻫvaｐorｉzer 气化室ﻫV-cut V形槽ﻫﻫｖerｔiｃａｌ micｒosｅｃｔion 垂直微切片ﻫvｉａ hoｌe 导通孔ﻫｖｉｓiblｅiｎvenｔory 有形的库存ﻫﻫvisｉoｎｉnspectｉon 目视检查ﻫVoｉｄ孔破ﻫﻫvoid ｉn hｏｌe 孔壁上的破洞ﻫｖｏid in PTH hｏle 孔破wａｌkman 随身听ﻫwarehoｕse 仓库ﻫｗarp 板弯ﻫﻫwarｐ , warpａgｅ板弯ﻫｗaｔｅｒaｂsorption 吸水性weａr resistancｅ耐磨度ﻫweave eｘｐosure 纤纹显露weａｖe ｔｅxture 织纹隐现ﻫwedｇｅ angｌｅ契尖角weｅk 周ﻫwｅt chemｉstry 湿式化学制程wet fｉlｍ湿膜ﻫﻫwｅt laｍｉnatiｏn 湿膜压膜法ﻫﻫweｔｐroｃeｓｓ湿制程ﻫwettｉｎｇ沾锡ﻫﻫwettiｎｇ balancｅ沾锡平衡法ﻫﻫwickｉｎg 渗铜;渗入；灯蕊效应ﻫｗidth 宽度ﻫwidｔh ｒeduce 线细ﻫｗidth-to—thickness ratio 宽度与厚度的比值ｗinｄow 操作范围work—in—prｏcｅsｓ在制品ﻫｗoｒk order 工单worｋing fiｌm 工作片ﻫwｏrkinｇｍａster 工作母片ﻫﻫyｅaｒ年yeｌlｏw 金黄色ﻫｙieｌd 良率。
印制线路板术语中英对照简表Accelerate Aging 加速老化使用人工的方法，加速正常的老化过程。
Acceptance Quality Level (AQL)一批产品中最大可以接受的缺陷数目，通常用于抽样计划。
Acceptance Test用来测定产品可以接受的试验，由客户与供应商之间决定。
Access Hole在多层线路板连续层上的一系列孔，这些孔的中心在同一个位置，而且通到线路板的一个表面。
Annular Ring是指孔周围的导体部分。
Artwork用于生产“Artwork Master”“production Master”,有精确比例的菲林。
Artwork Master通常是有精确比例的菲林，其按1：1的图案用于生产“Production Master”。
Back Light 背光法是一种检查通孔铜壁完好与否得放大目检方法，其做法是将孔壁外的基材自某一方向上小心的予以磨薄，再利用树脂半透明的原理，从背后射入光线。
假如化学铜孔壁品质完好而无任何破洞或针孔时，则该铜层必能阻绝光线而在显微中呈现黑暗，一旦铜壁有破洞时，则必有光点出现而被观察到，并可放大摄影存证，称为背光法，但只能看到半个孔。
Base Material 基材绝缘材料，线路在上面形成。
（可以是刚性或柔性，或两者综合。
它可以是不导电的或绝缘的金属板。
）。
Base Material thickness不包括铜箔层或镀层的基材的厚度。
Bland Via导通孔仅延伸到线路板的一个表面。
Blister离层的一种形式，它是在基材的两层之间或基材与铜箔之间或保护层之间局部的隆起。
Board thickness指包括基材和所有在上面形成导电层在内的总厚度。
Bonding Layer结合层，指多层板之胶片层。
C-Staged Resin处于固化最后状态的树脂。
Chamfer (drill)钻咀柄尾部的角。
Characteristic Impendence特性阻抗，平行导线结构对交流电流的阻力，通常出现在高速电流上，而且通常由在一定频率宽度范围的常量组成。
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn 49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure 58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil 四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering designautomaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descripttionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database 38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole 28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance电路板术语总整理 *****A*****Abietic Acid松脂酸. Abrasion Resistance耐磨性. Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗. Accelerated Test(Aging)加速老化(试验). Acceleration速化反应.Accelerator 加速剂,速化剂. Acceptability,Acceptance 允收性,允收. Access Hole露出孔,穿露孔. Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜. Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角. Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr) 凡液体比重比水轻则 Be=140÷(Sp.Gr-130) *Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 . Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈). Bomb Sight弹标.Bond Strength结合强度. Bondability结合性.Bonding Layer结合层接着层. Bonding Sheet(Layer)接合片. Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条). 在425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压. Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理. Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程. Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程. Buoyancy浮力.Buried Via Hole埋导孔. Burn-in高温加速老化试验. Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距. Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗. Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性. Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔. Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 . Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂.Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验. Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记. Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积. Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D*****Daisy Chained Design菊瓣设计. Datum Reference基准参考. Daughter Board子板.Debris碎屑,残材.Deburring去毛头. Declination Angle斜射角. Definition边缘逼真度. Degradation 劣化. Degrasing脱脂.Deionized Water去离子水. Delamination分离. Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位, 定义9000米纱束所具有的重量(以克米计)). Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀. Discrete Compenent散装零件. Discrete Wiring Board散线电路板,复线板. Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素. Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接. Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片). Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器. Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度. Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸. Electroless-Deposition无电镀. Electrolytic Tough Pitch电解铜.. Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯. End Tap封头.Entek有机护铜处理. Entrapment夹杂物. Entry Material盖板. Epoxy Resin环氧树脂. Etch Factor蚀刻因子. Etchant蚀刻剂(液). Etchback回蚀.Etching Indicator蚀刻指针. Etching Resist蚀刻阻剂. Eutetic Composition共融组成. Exotherm放热(曲线). Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法.First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀. Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 , 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀). Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金 (现为:Glod Plating). Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破. Glass Transition Temperature, Tg玻璃态转化温度. Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent). Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.Hipot Test 高压电测. Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作). Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性. Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路. Hydraulic Bulge Test液压鼓起试验. Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压. Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座. Icicle锡尖.Illuminance照度.Image Transfer影像转移. Immersion Plating浸镀. Impedance阻抗.Impedance Match阻抗匹配. Impregnate含浸.In-Circuit Testing组装板电测. Inclusion异物,夹杂物. Indexing Hole基准孔. Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出. Insert, Insertion插接. Inspection Overlay套检底片. Insulation Resistance绝缘电阻. Integrated Circuit(IC)绩体电路器. Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会. Engineering Council)J-LeadJ型接脚.Job Shop专业工厂. Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值). Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片. Kovar科伐合金(Fe53%,Ni29%,Co17%). Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波. Laminar Flow平流. Laminar Structure片状结构. Laminate Void板材空洞. Laminate(s)基板. Lamination Void压合空洞. Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管. Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tang ent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面). Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞. Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术.Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验.Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口). Multi-Chip-Module(MCM)多芯片芯片模块. Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄. Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂. Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯. Noble Metal Paste贵金属印膏. Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜. Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.) Optical Density光密度. Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装. Pad焊垫,圆垫.Pad Master圆垫底片. Pads Only Board唯垫板. Palladium钯.Panel制程板.Panel Plating全板镀铜. Panel Process全板电镀法.。
线路板流程术语中英文对照
流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)
－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔
A. 开料( Cut Lamination)
a-1 裁板( Sheets Cutting)
a-2 原物料发料(Panel)(Shear material to Size)
B. 钻孔(Drilling)
b-1 内钻(Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔(2nd Drilling)
b-4 雷射钻孔(Laser Drilling )(Laser Ablation )
b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)
C. 干膜制程( Photo Process(D/F))
c-1 前处理(Pretreatment)
c-2 压膜(Dry Film Lamination)
c-3 曝光(Exposure)
c-4 显影(Developing)
c-5 蚀铜(Etching)
c-6 去膜(Stripping)
c-7 初检( Touch-up)
c-8 化学前处理,化学研磨( Chemical Milling )
c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)
c-10 显影(Developing )
c-11 去膜(Stripping )
Developing , Etching & Stripping ( DES )
D. 压合Lamination
d-1 黑化(Black Oxide Treatment)
d-2 微蚀(Microetching)
d-3 铆钉组合(eyelet )
d-4 叠板(Lay up)
d-5 压合(Lamination)
d-6 后处理(Post Treatment)
d-7 黑氧化( Black Oxide Removal )
d-8 铣靶(spot face)
d-9 去溢胶(resin flush removal)
E. 减铜(Copper Reduction)
e-1 薄化铜(Copper Reduction)
F. 电镀(Horizontal Electrolytic Plating)
f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)
f-3 低于1 mil ( Less than 1 mil Thickness )
f-4 高于1 mil ( More than 1 mil Thickness)
f-5 砂带研磨(Belt Sanding)
f-6 剥锡铅( Tin-Lead Stripping)
f-7 微切片( Microsection)
G. 塞孔(Plug Hole)
g-1 印刷( Ink Print )
g-2 预烤(Precure)
g-3 表面刷磨(Scrub)
g-4 后烘烤(Postcure)
H. 防焊(绿漆/绿油): (Solder Mask)
h-1 C面印刷(Printing Top Side)
h-2 S面印刷(Printing Bottom Side)
h-3 静电喷涂(Spray Coating)
h-4 前处理(Pretreatment)
h-5 预烤(Precure)
h-6 曝光(Exposure)
h-7 显影(Develop)
h-8 后烘烤(Postcure)
h-9 UV烘烤(UV Cure)
h-10 文字印刷( Printing of Legend )
h-11 喷砂( Pumice)(Wet Blasting)
h-12 印可剥离防焊(Peelable Solder Mask) I . 镀金Gold plating
i-1 金手指镀镍金( Gold Finger )
i-2 电镀软金(Soft Ni/Au Plating)
i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)
J. 喷锡(Hot Air Solder Leveling)
j-1 水平喷锡(Horizontal Hot Air Solder Leveling)
j-2 垂直喷锡( Vertical Hot Air Solder Leveling)
j-3 超级焊锡(Super Solder )
j-4. 印焊锡突点(Solder Bump)
K. 成型(Profile)(Form)
k-1 捞型(N/C Routing ) (Milling)
k-2 模具冲(Punch)
k-3 板面清洗烘烤(Cleaning & Backing)
k-4 V型槽( V-Cut)(V-Scoring)
k-5 金手指斜边( Beveling of G/F)
L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)
l-2 VRS 目检(Verified & Repaired)
l-3 泛用型治具测试(Universal Tester)
l-4 专用治具测试(Dedicated Tester)
l-5 飞针测试(Flying Probe)
M. 终检( Final Visual Inspection)
m-1 压板翘( Warpage Remove)
m-2 X-OUT 印刷(X-Out Marking)
m-3 包装及出货(Packing & shipping)
m-4 目检( Visual Inspection)
m-5 清洗及烘烤( Final Clean & Baking)
m-6 护铜剂(ENTEK Cu-106A)(OSP)
m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing)
m-9 焊锡性试验( Solderability Testing )
N. 雷射钻孔(Laser Ablation)
N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)
N-2 雷射曝光对位孔(Laser Ablation Registration Hole)
N-3 雷射Mask制作(Laser Mask)
N-4 雷射钻孔(Laser Ablation)
N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)
N-6 Blaser AOI (after Desmear and Microetching)
N-7 除胶渣(Desmear)
N-8 微蚀(Microetching )。
