PCB 印制电路板工序中英文结合

中英文对照的PCB专业用语--------------------------------------------------------------------------------一、 综合词汇1、 印制电路：printed circuit2、 印制线路：printed wiring3、 印制板：printed board4、 印制板电路：printed circuit board (pcb)5、 印制线路板：printed wiring board(pwb)6、 印制元件：printed component7、 印制接点：printed contact8、 印制板装配：printed board assembly9、 板：board10、 单面印制板：single-sided printed board(ssb)11、 双面印制板：double-sided printed board(dsb)12、 多层印制板：mulitlayer printed board(mlb)13、 多层印制电路板：mulitlayer printed circuit board14、 多层印制线路板：mulitlayer prited wiring board15、 刚性印制板：rigid printed board16、 刚性单面印制板：rigid single-sided printed borad17、 刚性双面印制板：rigid double-sided printed borad18、 刚性多层印制板：rigid multilayer printed board19、 挠性多层印制板：flexible multilayer printed board20、 挠性印制板：flexible printed board21、 挠性单面印制板：flexible single-sided printed board22、 挠性双面印制板：flexible double-sided printed board23、 挠性印制电路：flexible printed circuit (fpc)24、 挠性印制线路：flexible printed wiring25、 刚性印制板：flex-rigid printed board, rigid-flex printed board26、 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、 齐平印制板：flush printed board29、 金属芯印制板：metal core printed board30、 金属基印制板：metal base printed board31、 多重布线印制板：mulit-wiring printed board32、 陶瓷印制板：ceramic substrate printed board33、 导电胶印制板：electroconductive paste printed board34、 模塑电路板：molded circuit board35、 模压印制板：stamped printed wiring board36、 顺序层压多层印制板：sequentially-laminated mulitlayer37、 散线印制板：discrete wiring board38、 微线印制板：micro wire board39、 积层印制板：buile-up printed board40、 积层多层印制板：build-up mulitlayer printed board (bum)41、 积层挠印制板：build-up flexible printed board42、 表面层合电路板：surface laminar circuit (slc)43、 埋入凸块连印制板：b2it printed board44、 多层膜基板：multi-layered film substrate(mfs)45、 层间全内导通多层印制板：alivh multilayer printed board46、 载芯片板：chip on board (cob)47、 埋电阻板：buried resistance board48、 母板：mother board49、 子板：daughter board50、 背板：backplane51、 裸板：bare board52、 键盘板夹心板：copper-invar-copper board53、 动态挠性板：dynamic flex board54、 静态挠性板：static flex board55、 可断拼板：break-away planel56、 电缆：cable57、 挠性扁平电缆：flexible flat cable (ffc)58、 薄膜开关：membrane switch59、 混合电路：hybrid circuit60、 厚膜：thick film61、 厚膜电路：thick film circuit62、 薄膜：thin film63、 薄膜混合电路：thin film hybrid circuit64、 互连：interconnection65、 导线：conductor trace line66、 齐平导线：flush conductor67、 传输线：transmission line68、 跨交：crossover69、 板边插头：edge-board contact70、 增强板：stiffener71、 基底：substrate72、 基板面：real estate73、 导线面：conductor side74、 元件面：component side75、 焊接面：solder side76、 印制：printing77、 网格：grid78、 图形：pattern79、 导电图形：conductive pattern80、 非导电图形：non-conductive pattern81、 字符：legend82、 标志：mark二、 基材：1、 基材：base material2、 层压板：laminate3、 覆金属箔基材：metal-clad bade material4、 覆铜箔层压板：copper-clad laminate (ccl)5、 单面覆铜箔层压板：single-sided copper-clad laminate6、 双面覆铜箔层压板：double-sided copper-clad laminate7、 复合层压板：composite laminate8、 薄层压板：thin laminate9、 金属芯覆铜箔层压板：metal core copper-clad laminate10、 金属基覆铜层压板：metal base copper-clad laminate11、 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、 基体材料：basis material13、 预浸材料：prepreg14、 粘结片：bonding sheet15、 预浸粘结片：preimpregnated bonding sheer16、 环氧玻璃基板：epoxy glass substrate17、 加成法用层压板：laminate for additive process18、 预制内层覆箔板：mass lamination panel19、 内层芯板：core material20、 催化板材：catalyzed board ,coated catalyzed laminate21、 涂胶催化层压板：adhesive-coated catalyzed laminate22、 涂胶无催层压板：adhesive-coated uncatalyzed laminate23、 粘结层：bonding layer24、 粘结膜：film adhesive25、 涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、 无支撑胶粘剂膜：unsupported adhesive film27、 覆盖层：cover layer (cover lay)28、 增强板材：stiffener material29、 铜箔面：copper-clad surface30、 去铜箔面：foil removal surface31、 层压板面：unclad laminate surface32、 基膜面：base film surface33、 胶粘剂面：adhesive faec34、 原始光洁面：plate finish35、 粗面：matt finish36、 纵向：length wise direction37、 模向：cross wise direction38、 剪切板：cut to size panel39、 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、 超薄型层压板：ultra thin laminate50、 陶瓷基覆铜箔板：ceramics base copper-clad laminates51、 紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、 基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、 环氧树脂：epoxy resin5、 酚醛树脂：phenolic resin6、 聚酯树脂：polyester resin7、 聚酰亚胺树脂：polyimide resin8、 双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、 丙烯酸树脂：acrylic resin10、 三聚氰胺甲醛树脂：melamine formaldehyde resin11、 多官能环氧树脂：polyfunctional epoxy resin12、 溴化环氧树脂：brominated epoxy resin13、 环氧酚醛：epoxy novolac14、 氟树脂：fluroresin15、 硅树脂：silicone resin16、 硅烷：silane17、 聚合物：polymer18、 无定形聚合物：amorphous polymer19、 结晶现象：crystalline polamer20、 双晶现象：dimorphism21、 共聚物：copolymer22、 合成树脂：synthetic23、 热固性树脂：thermosetting resin24、 热塑性树脂：thermoplastic resin25、 感光性树脂：photosensitive resin26、 环氧当量：weight per epoxy equivalent (wpe)27、 环氧值：epoxy value28、 双氰胺：dicyandiamide29、 粘结剂：binder30、 胶粘剂：adesive31、 固化剂：curing agent32、 阻燃剂：flame retardant33、 遮光剂：opaquer34、 增塑剂：plasticizers35、 不饱和聚酯：unsatuiated polyester36、 聚酯薄膜：polyester37、 聚酰亚胺薄膜：polyimide film (pi)38、 聚四氟乙烯：polytetrafluoetylene (ptfe)39、 聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、 增强材料：reinforcing material41、 玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、 玻璃布：glass fabric46、 非织布：non-woven fabric47、 玻璃纤维垫：glass mats48、 纱线：yarn49、 单丝：filament50、 绞股：strand51、 纬纱：weft yarn52、 经纱：warp yarn53、 但尼尔：denier54、 经向：warp-wise55、 纬向：weft-wise, filling-wise56、 织物经纬密度：thread count57、 织物组织：weave structure58、 平纹组织：plain structure59、 坏布：grey fabric60、 稀松织物：woven scrim61、 弓纬：bow of weave62、 断经：end missing63、 缺纬：mis-picks64、 纬斜：bias65、 折痕：crease66、 云织：waviness67、 鱼眼：fish eye68、 毛圈长：feather length69、 厚薄段：mark70、 裂缝：split71、 捻度：twist of yarn72、 浸润剂含量：size content73、 浸润剂残留量：size residue74、 处理剂含量：finish level75、 浸润剂：size76、 偶联剂：couplint agent77、 处理织物：finished fabric78、 聚酰胺纤维：polyarmide fiber79、 聚酯纤维非织布：non-woven polyester fabric80、 浸渍绝缘纵纸：impregnating insulation paper81、 聚芳酰胺纤维纸：aromatic polyamide paper82、 断裂长：breaking length83、 吸水高度：height of capillary rise84、 湿强度保留率：wet strength retention85、 白度：whitenness86、 陶瓷：ceramics87、 导电箔：conductive foil88、 铜箔：copper foil89、 电解铜箔：electrodeposited copper foil (ed copper foil)90、 压延铜箔：rolled copper foil91、 退火铜箔：annealed copper foil92、 压延退火铜箔：rolled annealed copper foil (ra copper foil)93、 薄铜箔：thin copper foil94、 涂胶铜箔：adhesive coated foil95、 涂胶脂铜箔：resin coated copper foil (rcc)96、 复合金属箔：composite metallic material97、 载体箔：carrier foil98、 殷瓦：invar99、 箔（剖面）轮廓：foil profile100、 光面：shiny side101、 粗糙面：matte side102、 处理面：treated side103、 防锈处理：stain proofing104、 双面处理铜箔：double treated foil四、 设计1、 原理图：shematic diagram2、 逻辑图：logic diagram3、 印制线路布设：printed wire layout4、 布设总图：master drawing5、 可制造性设计：design-for-manufacturability6、 计算机辅助设计：computer-aided design.(cad)7、 计算机辅助制造：computer-aided manufacturing.(cam)8、 计算机集成制造：computer integrat manufacturing.(cim)9、 计算机辅助工程：computer-aided engineering.(cae)10、 计算机辅助测试：computer-aided test.(cat)11、 电子设计自动化：electric design automation .(eda)12、 工程设计自动化：engineering design automaton .(eda2)13、 组装设计自动化：assembly aided architectural design. (aaad)14、 计算机辅助制图：computer aided drawing15、 计算机控制显示：computer controlled display .(ccd)16、 布局：placement17、 布线：routing18、 布图设计：layout19、 重布：rerouting20、 模拟：simulation21、 逻辑模拟：logic simulation22、 电路模拟：circit simulation23、 时序模拟：timing simulation24、 模块化：modularization25、 布线完成率：layout effeciency26、 机器描述格式：machine descriptionm format .(mdf)27、 机器描述格式数据库：mdf databse28、 设计数据库：design database29、 设计原点：design origin30、 优化（设计）：optimization (design)31、 供设计优化坐标轴：predominant axis32、 表格原点：table origin33、 镜像：mirroring34、 驱动文件：drive file35、 中间文件：intermediate file36、 制造文件：manufacturing documentation37、 队列支撑数据库：queue support database38、 元件安置：component positioning39、 图形显示：graphics dispaly40、 比例因子：scaling factor41、 扫描填充：scan filling42、 矩形填充：rectangle filling43、 填充域：region filling44、 实体设计：physical design45、 逻辑设计：logic design46、 逻辑电路：logic circuit47、 层次设计：hierarchical design48、 自顶向下设计：top-down design49、 自底向上设计：bottom-up design50、 线网：net51、 数字化：digitzing52、 设计规则检查：design rule checking53、 走（布）线器：router (cad)54、 网络表：net list55、 计算机辅助电路分析：computer-aided circuit analysis56、 子线网：subnet57、 目标函数：objective function58、 设计后处理：post design processing (pdp)59、 交互式制图设计：interactive drawing design60、 费用矩阵：cost metrix61、 工程图：engineering drawing62、 方块框图：block diagram63、 迷宫：moze64、 元件密度：component density65、 巡回售货员问题：traveling salesman problem66、 自由度：degrees freedom67、 入度：out going degree68、 出度：incoming degree69、 曼哈顿距离：manhatton distance70、 欧几里德距离：euclidean distance71、 网络：network72、 阵列：array73、 段：segment74、 逻辑：logic75、 逻辑设计自动化：logic design automation76、 分线：separated time77、 分层：separated layer78、 定顺序：definite sequence五、 形状与尺寸：1、 导线（通道）：conduction (track)2、 导线（体）宽度：conductor width3、 导线距离：conductor spacing4、 导线层：conductor layer5、 导线宽度/间距：conductor line/space6、 第一导线层：conductor layer no.17、 圆形盘：round pad8、 方形盘：square pad9、 菱形盘：diamond pad10、 长方形焊盘：oblong pad11、 子弹形盘：bullet pad12、 泪滴盘：teardrop pad13、 雪人盘：snowman pad14、 v形盘：v-shaped pad15、 环形盘：annular pad16、 非圆形盘：non-circular pad17、 隔离盘：isolation pad18、 非功能连接盘：monfunctional pad19、 偏置连接盘：offset land20、 腹（背）裸盘：back-bard land21、 盘址：anchoring spaur22、 连接盘图形：land pattern23、 连接盘网格阵列：land grid array24、 孔环：annular ring25、 元件孔：component hole26、 安装孔：mounting hole27、 支撑孔：supported hole28、 非支撑孔：unsupported hole29、 导通孔：via30、 镀通孔：plated through hole (pth)31、 余隙孔：access hole32、 盲孔：blind via (hole)33、 埋孔：buried via hole34、 埋/盲孔：buried /blind via35、 任意层内部导通孔：any layer inner via hole (alivh)36、 全部钻孔：all drilled hole37、 定位孔：toaling hole38、 无连接盘孔：landless hole39、 中间孔：interstitial hole40、 无连接盘导通孔：landless via hole41、 引导孔：pilot hole42、 端接全隙孔：terminal clearomee hole43、 准表面间镀覆孔：quasi-interfacing plated-through hole44、 准尺寸孔：dimensioned hole45、 在连接盘中导通孔：via-in-pad46、 孔位：hole location47、 孔密度：hole density48、 孔图：hole pattern49、 钻孔图：drill drawing50、 装配图：assembly drawing51、 印制板组装图：printed board assembly drawing52、 参考基准：datum referance。

十层电路板工艺流程英语Ten-Layer PCB Fabrication Process.The fabrication of a ten-layer printed circuit board (PCB) involves a series of complex and precise steps that require specialized equipment and materials. The process typically begins with the design of the PCB layout, whichis then transferred to a physical board using a variety of techniques. The board is then processed through a series of chemical, mechanical, and electrical steps to create the desired circuit pattern and electrical connections.1. Design.The first step in the PCB fabrication process is to design the layout of the board. This is typically done using a computer-aided design (CAD) software program, which allows the designer to create a precise representation of the board's electrical connections and physical dimensions. The CAD file is then used to generate a set ofmanufacturing instructions that will be used to create the physical board.2. Fabrication.Once the design is complete, the PCB is fabricated using a variety of techniques. The most common method is to use a subtractive process, in which a copper-clad laminate is etched to create the desired circuit pattern. This process begins by applying a photoresist layer to the laminate, which is then exposed to ultraviolet light through a mask that defines the circuit pattern. The exposed areas of the photoresist are then developed, leaving the copper exposed in the areas that will form the circuit traces. The board is then etched in a chemical solution that removes the exposed copper, leaving the desired circuit pattern.3. Drilling.Once the circuit pattern is created, holes are drilled into the board to allow for the insertion of components.The holes are typically drilled using a CNC machine, which uses a computer-controlled drill to precisely locate and drill the holes. The size and location of the holes are determined by the design of the board.4. Plating.After the holes are drilled, the board is plated with a thin layer of copper to protect the copper traces and to provide a surface for soldering. The plating process is typically done using an electroless deposition process, in which the copper is deposited onto the board using a chemical reaction.5. Laminating.The next step in the PCB fabrication process is to laminate the board to a layer of insulating material. This is typically done using a press that applies heat and pressure to bond the two layers together. The insulating material is typically made of a fiberglass-reinforced epoxy resin, which provides strength and electrical insulation.6. Pressing.After the board is laminated, it is pressed to create a smooth and flat surface. This is typically done using a hydraulic press, which applies a uniform pressure to the board. The pressing process also helps to remove any air bubbles that may have been trapped between the layers of the board.7. Routing.Once the board is pressed, it is routed to create the final shape and size. This is typically done using a CNC router, which uses a computer-controlled cutting tool to cut the board to the desired shape. The routing process also creates any slots or cutouts that may be required for the board to fit into its enclosure.8. Testing.After the board is routed, it is tested to ensure thatit meets the design specifications. This is typically done using a variety of electrical tests, which check for continuity, shorts, and other electrical faults. The board may also be subjected to environmental testing, such as temperature cycling and vibration testing, to ensure that it will withstand the conditions in which it will be used.9. Assembly.Once the board has passed testing, it is ready for assembly. This involves soldering the components to the board, which is typically done using a surface mount technology (SMT) machine. The SMT machine places the components on the board and solders them in place using a reflow oven.10. Inspection.After the board is assembled, it is inspected to ensure that all of the components have been placed correctly and that there are no soldering defects. This is typically done using a combination of visual inspection and automatedoptical inspection (AOI). The AOI machine uses a camera to inspect the board for any defects, such as missing components or solder bridges.The process of fabricating a ten-layer PCB is complex and requires a high level of precision and expertise. By following the steps outlined above, manufacturers can produce high-quality PCBs that meet the demanding requirements of modern electronic devices.。

线路板流程术语中英文对照丝印、碳墨、银胶、可剥胶与铜膏制程1、Angle of Attack 攻角指在网版印刷时，行进中的刮刀面与网版平面所形成前倾之立体夹角而言。

2、Bias 斜张网布，斜织法指网版印刷法的一种特殊张网法，即放弃掉网布经纬方向与外框平行的正统张法，有意令网布经向与两侧网框的纵向形成22°之组合。

至于图形版膜的贴网，则仍按网框方向正贴。

如此在刮刀往前推动油墨时，会让油墨产生一种侧向驱动的力量。

如在绿漆印刷时，可令其在板面线路背后有较充足的油墨分布。

只是这种"斜张网"法却很浪费网布。

通常故仍可使用正张网而改为斜贴版膜方式，或者往返各印一次，亦能解决漏印的问题。

Bias也另指网布经纬纱不垂直的织法。

3、Bleach 漂洗指网版印刷准备工程中，为使再生网版上的网布，与版膜(Stencil)或者感光乳胶之间有更好的附着力起见，须将用过的网布以漂白水或者细金钢砂为助洗剂，予以刷磨洗净及粗化，以便再生使用，谓之Bleach 。

4、Bleeding 溢流在电路板制程中常指完成通孔铜壁后，可能尚有破洞存在，以致常有残液流出。

有的时候也指印刷的液态阻剂图形，在后续干燥过程中可能有少许成份自其边缘向外溢渗出。

如传统烘烤式绿漆，就常出现这种问题。

5、Blockout 封网间接性网版完成版膜(stencil)贴合后，其外围的空网处须以水溶胶加以涂满封闭，以免在实印时造成边缘的漏墨。

6、Blotting 干印"网版"经数次刮印后，朝下的印面上常有多余的残墨存在，须以白报纸代替电路板，在不覆墨下以刮刀(大陆业界称之刮板)干印一次，以吸掉图形边缘的残墨，称之Blotting。

传统烘烤型绿漆务必要不断的干印，才能保持电路板上所印绿漆边缘的品质。

7、Blotting Paper 吸水纸用以汲取掉多余液体的纸张。

8、Calendered Fabric轧平式网布是针对传统PET网布(商名特多龙)，耐龙网布及不锈网布等，将其刮刀面特别予以单面轧平，使容易刮墨并令"印墨"减薄，而让UV油墨的曝光更容易及透彻。

pcb线路板制作工艺流程英文版The process of making a PCB board involves several important steps that ensure the quality and functionality of the final product.First, the design of the PCB layout is created using specialized software. This design includes the placement of components, as well as the routing of traces to create the necessary connections between the various parts of the circuit.Once the layout is finalized, the design is printed onto a transparent film, which will be used in the next step of the process.The next step involves transferring the design onto the copper-clad board. This is typically done using a photosensitive process, where the film is placed on the board and exposed to UV light. The areas of the board that are notcovered by the design will be etched away, leaving behind the copper traces that form the circuit.After the etching process is complete, the board is cleaned and inspected to ensure that the traces are clear and free of any defects.The next step in the process is to drill holes for the through-hole components and vias. These holes are essential for connecting the different layers of the PCB together, as well as for mounting components onto the board.Once the drilling is complete, the board is plated to create a surface finish that will protect the copper traces from corrosion and oxidation.After the surface finish has been applied, the final step is to apply a solder mask and silkscreen to the board. The solder mask is a protective layer that covers the copper traces and ensures that solder only adheres to the intended areas. The silkscreen is used to label the components andprovide other important information about the board's layout and design.In conclusion, the process of making a PCB board involves several important steps, each of which is necessary to ensure the quality and functionality of the final product. From the initial design and layout to the final application of solder mask and silkscreen, each step plays a crucial role in creating a reliable and effective PCB board.。

pcb插件工艺流程英文English Answer:PCB Plug-in Process Flow.The PCB plug-in process is a critical step in the manufacturing of electronic assemblies. It involves the insertion of components into pre-drilled holes on a printed circuit board (PCB). The components are then soldered in place to create a permanent connection.The plug-in process flow can be divided into the following steps:1. Component preparation. The components are first prepared for insertion into the PCB. This may involve cutting the leads to the appropriate length, forming the leads into the correct shape, and adding solder paste or flux to the leads.2. PCB preparation. The PCB is prepared for component insertion by cleaning the holes and applying solder paste or flux to the pads.3. Component insertion. The components are inserted into the pre-drilled holes on the PCB. The components are typically held in place by hand or by a machine.4. Soldering. The components are soldered in place by applying heat to the solder paste or flux. The heat can be applied using a soldering iron, a wave soldering machine, or a reflow oven.5. Inspection. The soldered joints are inspected to ensure that they are free of defects. This can be done visually or by using an automated optical inspection (AOI) machine.6. Cleaning. The PCB is cleaned to remove any residual solder paste or flux. This can be done by hand or by a machine.The plug-in process flow is a complex and critical process. It is important to follow the steps carefully to ensure that the electronic assembly is manufactured correctly.中文回答：PCB插件工艺流程。

PCB板制做工序中英文介绍PCB板是电子产品中不可或缺的组件，它是电子元器件的支持物理平台，具有导电、绝缘、保护和固定元器件等多种功能。

PCB板制作是一个复杂的工序，需要经过多个步骤完成。

下面是PCB板制作的工序介绍。

1.设计：2.材料准备：在PCB板制作之前，需要准备各种原材料。

常见的材料包括铜箔、绝缘基板、化学药品等。

这些材料具有优良的导电性、绝缘性和耐腐蚀性。

3.板材切割：绝缘基板常用的材料有玻璃纤维、塑料等。

在制作PCB板之前，需要根据设计要求将板材进行切割。

切割后，板材之间的厚度可以进行控制，以满足电路的要求。

4.铜箔涂布：在绝缘基板上涂布金属铜箔。

这是因为铜具有良好的导电性能，可以提供电子元器件之间的连接。

涂布铜箔时，需要注意涂布的均匀性和厚度的控制。

5.图形绘制：在涂布上铜箔的基础上，根据设计图纸绘制电路图形。

这通常使用光刻技术进行，首先在相片纸上绘制电路图形，然后通过光刻机将图形转移到涂布的铜箔上。

6.蚀刻：电路图经过绘制后，需要进行蚀刻。

蚀刻的目的是去除多余的铜箔，只保留电路图形上的铜箔。

蚀刻使用化学药品，如氯化铁或过氧化氢。

蚀刻后，没有被腐蚀的铜箔就形成了电路连接线路。

7.钻孔：在蚀刻后，需要在电路板上钻孔。

钻孔的目的是为了安装元器件和电气连接。

钻孔必须准确，并且要遵循设计规范。

8.制作焊盘和浸锡：接下来是焊盘和浸锡的制作。

焊盘是用来连接元器件和PCB板的金属垫片。

浸锡是为了给焊盘添加一层防护的锡层，可以提高连接的可靠性。

9.喷覆阻焊：阻焊是一种用于保护电路的材料，可以防止短路和漏电。

喷覆阻焊材料需要均匀地覆盖整个PCB板表面，并通过热处理固化。

10.制作文字和标识：在PCB板上添加文字和标识。

这些文字和标识用于区分不同的电路元器件、方向、功能等。

11.检测和测试：在PCB板制作完成后，需要进行检测和测试。

利用专业测试仪器和设备进行电路的连通性、性能和可靠性测试。

这是为了确保PCB板质量符合要求。

PCB线路板工艺流程及中英文对照 (2009/04/0813:56)目录：公司动态流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔A.开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B.钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲( 埋) 孔钻孔(Blind & Buried Hole Drilling)C.干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理, 化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D.压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E.减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F.电镀(Horizontal Electrolytic Plating) 浏览字体：大中小( 绿漆/ 绿油)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating)f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于 1 mil ( Less than 1 mil Thickness )f-4 高于 1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G.塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H.防焊(绿漆/ 绿油): (Solder Mask)h-1 C 面印刷(Printing Top Side)h-2 S 面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV 烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V 型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L.开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester) l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘 ( Warpage Remove)m-2 X-OUT 印刷 (X-Out Marking)m-3 包装及出货 (Packing & shipping)m-4 目检 ( Visual Inspection)m-5 清洗及烘烤 ( Final Clean & Baking)m-6 护铜剂 (ENTEK Cu-106A)(OSP)m-7 离子残余量测试 (Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验 (Thermal cycling Testing)m-9 焊锡性试验 ( Solderability Testing )N. 雷射钻孔 (Laser Ablation)N-1 雷射钻 Tooling 孔 (Laser ablation Tooling Hole)N-2 雷射曝光对位孔 (Laser Ablation Registration Hole)N-3 雷射 Mask 制作(Laser Mask)N-4 雷射钻孔 (Laser Ablation)N-5 AOI 检查及 VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣 (Desmear)N-8 微蚀 (Microetching )综合词汇 印制电路： printed circuit 印制线路： printed wiring 印制板： printed board 印制板电路： printed circuit board (pcb) 印制线路板： printed wiring board(pwb) 印制元件： printed component 印制接点： printed contact 印制板装配： printed board assembly 板： board 单面印制板： single-sided printed board(ssb) 双面印制板：double-sided printed board(dsb) 多层印制板： mulitlayer printed board(mlb) 多层印制电路板： mulitlayer printed circuit board 多层印制线路板： mulitlayer prited wiring board刚性印制板： rigid printed board rigid single-sided printed borad rigid double-sided printed borad rigid multilayer printed board flexible multilayer printed board 挠性印制板： flexible printed board 挠性单面印制板： flexible single-sided printed board 挠性双面印制板： flexible double-sided printed board 23、 挠性印制电路： flexible printed circuit (fpc) 24、挠性印制线路： flexible printed wiring 25、刚性印制板： flex-rigid printed board, rigid-flex printed board26、刚性双面印制板： flex-rigid double-sided printed board, rigid-flex double-sided printed 27、 刚性多层印制板： flex-rigid multilayer printed board, rigid-flex multilayer printed board 1、 2、 3、 4、 5、 6、 7、 8、 9、 10、 11、 12、 13、 14、 15、 16、 17、 18、 19、 20、 21、 22、刚性单面印制板 刚性双面印制板 刚性多层印制板28、齐平印制板： flush printed board29、金属芯印制板： metal core printed board30、金属基印制板： metal base printed board31、多重布线印制板： mulit-wiring printed board32、陶瓷印制板： ceramic substrate printed board33、导电胶印制板： electroconductive paste printed board34、模塑电路板： molded circuit board35、模压印制板： stamped printed wiring board36、顺序层压多层印制板： sequentially-laminated mulitlayer37、散线印制板： discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a 阶树脂：a-stage resin2、b 阶树脂：b-stage resin3、c 阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e 玻璃纤维：e-glass fibre43、d 玻璃纤维：d-glass fibre44、s 玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔(剖面)轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化(设计) ：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走(布)线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线(通道) ：conduction (track)2、导线(体)宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/ 间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v 形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole。

PCB电路板步骤流程外贸英文翻译PCB Circuit Board Production ProcessPCB (Printed Circuit Board) is an integral part of almostall electronic devices. The production of PCBs involves a series of steps to ensure the final product meets the required specifications and quality standards. In this article, we will walk you through the PCB production process, from design tofinal inspection.Material Selection - After the prototype is approved, the next step is material selection. PCBs are made using various materials, including copper, fiberglass, and solder mask. The selection of materials is based on factors such as the intended application and the desired performance of the PCB.Preparation - After selecting the materials, the next step is to prepare them for production. This involves cutting the base material, such as fiberglass, into the desired size and shape. The copper foil is then laminated onto the base material.Printing - In the printing process, the PCB design is transferred onto the board using a photosensitive film or photoresist. This process involves exposing the film or resist to UV light through a stencil or mask. After exposure, the unexposed areas are removed, leaving behind the desired pattern.Etching - Etching is a crucial step in PCB production. In this process, the PCB is immersed in an etchant solution, typically an acid, to remove the unwanted copper. The etching solution dissolves the exposed copper, leaving behind the copper traces and pads as per the design.Plating - Plating is done to protect the exposed copper surfaces and improve solderability. The PCB is plated with athin layer of solder or a metallic substance, such as gold or tin, to prevent oxidation and enhance conductivity.。

PCB Printed Circuit BoardA1.Process 流程Board Cut 开料→Drill钻孔→Incoming Quality Control (IQC)→Plated Through Hole (PTH) →Panel Plating 整板镀铜→dry film 干膜→patterm plating 图形电镀→Flash Gold Plating 闪金电镀Cu(Copper)/Sn(Tin) Plating →etch 蚀刻→quality control (FIRST)QC →Wetfilm W/F →Legend ( Mark Printing , Component Mark)文字→Hot Air Leveling 喷锡( Immersion Gold Chemical Gold 沉金)→Routing 锣板(Punching啤板)→V-Cut →Rinse 洗板→E-test →Entek →Final Quality Control FQC →QA Audit 审核→Package →Shipment ( Delivery) 出货B drill process 钻孔工序the type of holes 孔的类型Via hole 通孔Componenthole 元件孔Installing hole 安装孔Registration hole (for Printing ,HAL ,Chemical gold etc) 定位孔Slot 槽孔PTH hole 电镀孔NPTH hole 非电镀孔Big hole(Too big to tent 孔太大,不能掩孔) Small hole 小孔1.Drill process Board cut 开料→Pin hole making 销钉孔(Registration pin ) →Board up 上板→Drilling →Board down →Check 检查2.Parameters 参数Drill Bit 钻咀Diameter of hole (drill bit)孔径Feed speed 进刀速度RPM (Round per minute ) 转速How many panels (Total thickness 厚度) 上板数量Hole quantity 孔数3.Quality 品质about drill bit 关于钻咀chips 缺口overlap 重合gap 间隙flair变形about hole 关于孔rough (roughness) 粗糙度bur(debur) 去毛刺nailhead 钉头(multilayer多层板) resin smear (desmear)除胶渣surface scratch 表面擦花breakout of registration hole 定位孔爆hole shift 偏孔(位) hole plugged堵孔raw material 材料Laminate 板材copper foil 铜箔prepreg 半固化片C Main contents IQC （IQC主要内容）Measuring tooling 测量工具Pin gauge针规Caliper 卡尺C-caliper 螺旋卡尺X-ray instrument for Au/Ni thickness X光金/镍测厚仪Outline Artwork for outline dimension 外形菲林V isual check 肉眼检查 2. The main raw materials 主要材料laminate 板材prepreg半固化片copper foil铜箔chemical 化学药品dry film wetfilm Pb(lead)/Sn(Tin) Alloy mixture of metals 铅锡合金flux 松香etch salt 蚀板盐carbon ink 碳油legend ink字符油墨die 模具Semifinished products form sub-contractor 外协厂 3.Quality of laminate 板材品质Pin hole 针孔dent 凹痕scratch 擦花delamination 分层white spot 白点fibre exposure 露纤维discolour 变色thickness deviation 厚度偏差surface oxidation 表面氧化D PTH Process Debur 除胶渣→Degrease 除油脂→Rinse (Ci Water) →Microetch 微蚀→Rinse →Dip In Sulfate Acid Solution 酸洗→Rinse →Pre-Dip 预浸→Catalyst 崔化剂→Rinse →Accelerate 加速剂→Rinse →PTH →Rinse →Dry烘干E Several Concepts Electroless Plating (Electroplating) 无电镀铜Dummy Plating拖缸APS (Ammonium Per Sulfate) 过硫酸铵Deionized Water 去离子水 C.I Water 自来水Loading 负载Deposition Rate 沉铜速率Foam 泡沫Heater 加热器Pink Ring 粉红圈(红环) Clot 结块Hard Water 硬水Soft Water 软水Debris 树脂屑Rough Copper Deposit 沉铜粗糙Peel Off 铜层剥离V oid 空洞Poor Adhesion 结合力不良Short Bath Life 槽液短命Poor Backlight 背光不良No Copper Deposit On Hole Wall 黑孔F D/F process Scrub 磨板→Laminate 贴膜→Artwork check 菲林检查→Image transfer 对位→expose 曝光→develop 显影→touchup 执漏Main materials 主要材料dry film sodium carbonate 碳酸钠defoam 除泡剂alcohol 洒精yellow film黄菲林Main machines 主要设备Laminator 贴膜机exposure machine 曝光机developing machine 显影机developing machine foryellow artwork 黄菲林显影机(重氮显影机) Quality Open/short bur chip underdevelop 显影不够overdevelop 显影过度underexposure 曝光不够overexposure 曝光过度scratch surfacecontamination 表面污染bubble 气泡Main parameters参数break point 突破点footprint 磨痕exposure index 曝光指数stauffer 曝光尺(光楔表)G Sn(Tin)-plating degrease 除油污→rinse →microetch 微蚀→rinse →dip insulfate acid solution 酸洗→Cu(copper)-plating 电铜→rinse→Tin-plating 镀锡Main materials Copper sulfate 硫酸铜copper ball 铜球Acid sulfate 硫酸Tin metal bar 锡条Stannous sulfate硫酸亚锡Additives 添加剂brightener 光亮剂The other useful words Make-up 开缸make-up procedure 开缸程序Anode 阳极Cathode 阴极maintenance 维护\保养litre 升gram 克volume 容积carbon treat 碳处理Current Density 电流密度Current Area 电流面积Quality corner crack 角部断裂pit 凹痕(麻点,大凹痕为dent) Non-uniform 不均匀dull plating 镀层发暗poor adhesion 结合力不良void 空洞copper thickness under spec. 铜厚不符合要求(标准)Etch process strip 去膜→etch →tin-strip →QC(quality check)Etching line 蚀刻线etch salt 蚀板盐ammonia 氨水(ammonium 铵) copper chloride 氯化铜tin-strip chemical退锡水poor strip 退膜不良poor tin-strip 退锡不良（净）poor etch 蚀刻不良over-etch 蚀刻过度open/short black hole 黑孔void 空洞scratch 刮花chip 缺口bur 毛刺peel off 剥离etch factor 蚀刻因子tin-transfer 锡迁移undercut 侧蚀line width 线宽line space 线距W/F process scrub 磨板(pumice 火山灰or chemical treatment 化学处理) →screen printing 丝印→pre-cure 前焗→expose →develop →postcure 后焗→touchupScrubber (scrub machine) printing machine 丝印机exposing machine developing machinePumice火山灰chemical diazo film 重氮片wet film sodium carbonate poor developing scratch peel off S(solder)/M(mask) in hole 绿油入孔S/M on pad 绿油上焊盘S/M on gold finger 绿油上金手指S/M on mark overdevelop 显影过度residue 垃圾，杂物(particals 颗粒) copper exposure 露铜stauffer test 曝光尺实验adhesion 粘度stencil 网板footprint 磨痕breakpoint 突破点，显影点C/M process (component/mark) legend printing →cure →QC check ovenResidue missing character illegible character character broken C/M on pad (finger.in hole) discolor peel offHA T process (hot air leveling) pretreatment →HAL →posttreatment →QC check Solder fluxAPS (ammonium per sulfate ) copper exposure (hole wall ) ununiform rough surface bubble (discolor) of S/Mevery lot 每批reworked 返工scrapped 报废spec. 规格,说明choice 选择solve 解决semifinished product 半成品co-operation 合作improve 改善dispose of surface 表面处理purchase order 采购单standerd 标准gerber data GERBER文件item 序号Part No description 描述model 型号delivery schedule 交货日期U/P 单价amount 总计remark 备注CIF 到岸价specifications 说明solvent test 溶剂试验defect 缺陷nonconforming 不一致corrective action 纠正措施First Article check 首件检查customer 客户complain投诉take action 采取行动Thank you for your attention。