IRG4PC50SDPBF中文资料

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IRG4PC50SDPbF
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
V CES = 600V
V CE(on) typ. = 1.28V
@V GE = 15V, I C = 41A
Standard Speed CoPack IGBT
Features
Standard: Optimized for minimum saturation voltage and low operating frequencies (<1kHz)
IGBT co-packaged with HEXFRED TM ultrafast, ultra-soft-recovery anti-parallel diodes for use in bridge configurations
Industry standard TO-247AC package
Benefits
Generation -4 IGBT's offer highest efficiencies available
IGBT's optimized for specific application conditions HEXFRED diodes optimized for performance with IGBT's . Minimized recovery characteristics require
less/no snubbing
PD - 97316
G
C E TO-247AC
C
U
IRG4PC50SDPbF
Notes:
Repetitive rating: V GE=15V; pulse width limited by maximum junction temperature. (See figure 20) V CC=80%(V CES), V GE=15V, R G = 5.0Ω. (See figure 19)
Pulse width≤80µs; duty factor≤0.1%.
IRG4PC50SDPbF
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I RMS of fundamental)
Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics
IRG4PC50SDPbF
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
Fig. 4 - Maximum Collector Current vs.
Case Temperature
Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case
IRG4PC50SDPbF
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
Fig. 9 - Typical Switching Losses vs. Gate
Resistance Fig. 10 - Typical Switching Losses vs.
Junction Temperature
IRG4PC50SDPbF
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
Fig. 12 - Turn-Off SOA
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
1
10
100
0.6
1.0 1.4 1.8
2.2 2.6
FM
F
I n s t a n t a n e o u s F o r w a r d C u r r e n t - I (A ) Forward Voltage Drop - V (V)
IRG4PC50SDPbF
Fig. 14 - Typical Reverse Recovery vs. di f /dt
Fig. 15 - Typical Recovery Current vs. di f /dt
Fig. 16 - Typical Stored Charge vs. di f /dt
Fig. 17 - Typical di (rec)M /dt vs. di f /dt
300
600
900
1200
1500100
1000
f di /dt - (A/µs)R R Q - (n C )
100
1000
10000
100
1000
f
di /dt - (A/µs)d i (r e c )M /d t - (A /µs )
1
10
100
100
1000
f
di /dt - (A/µs)I - (A )I R
R M
20
40
60
80
100
120
140
100
1000
f
di /dt - (A/µs)t - (n s )
r r
IRG4PC50SDPbF
t1t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
E off , t d(off), t
f
Fig. 18a - Test Circuit for Measurement of
I LM , E on , E off(diode), t rr , Q rr , I rr , t d(on), t r , t d(off), t f
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining E on , t d(on), t r
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining E rec , t rr , Q rr , I rr
IRG4PC50SDPbF
Vg GATE SIGNAL
DEVICE UNDER TEST
CURRENT D.U.T.
VOLTAGE IN D.U.T.
CURRENT IN D1
t0t1t2
Figure 19. Clamped Inductive Load Test
Circuit =
480V
4 X I C @25°C
Figure 18e. Macro Waveforms for Figure 18a's
Test Circuit
Figure 20. Pulsed Collector Current
Test Circuit
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903 Visit us at for sales contact information. 04/08。