封装工艺流程简介(英文版)

封测工艺流程英语Here is an English essay on the topic of "Encapsulation Process Workflow" that is over 1000 words, with no title and no extra punctuation:The encapsulation process is a critical step in the manufacturing of various products ranging from electronic devices to medical implants. This process involves the sealing of components or materials within a protective casing or housing to shield them from external environmental factors such as moisture, dust, and physical damage. The encapsulation process workflow is a systematic approach that ensures the consistency and quality of the final product.The first step in the encapsulation process workflow is the preparation of the components or materials that will be encapsulated. This involves cleaning and degreasing the surfaces to remove any contaminants that could interfere with the bonding process. Depending on the specific application, various cleaning methods may be used, such as solvent cleaning, ultrasonic cleaning, or plasma cleaning.Once the components are clean and prepared, the next step is theapplication of the encapsulation material. This material can be a polymer-based resin, such as epoxy or silicone, or a metal-based material, such as ceramic or glass. The choice of encapsulation material depends on the specific requirements of the application, including the operating environment, the required level of protection, and the desired physical and electrical properties.The encapsulation material is typically applied using one of several methods, such as potting, transfer molding, or injection molding. In the potting process, the encapsulation material is poured or injected into a mold or cavity containing the components to be encapsulated. The material then hardens or cures, forming a solid, protective casing around the components.In the transfer molding process, the encapsulation material is first heated and softened in a separate chamber, and then forced into a mold containing the components to be encapsulated. The material then cools and hardens, forming the protective casing.Injection molding is a similar process, but the encapsulation material is injected into the mold at a higher pressure, allowing for more complex and precise encapsulation geometries.Regardless of the specific method used, the goal of the encapsulation process is to ensure that the components or materialsare fully and evenly encapsulated, with no air pockets or voids that could compromise the integrity of the final product.After the encapsulation material has been applied, the next step in the workflow is curing or hardening. This process involves the application of heat, pressure, or other forms of energy to cause the encapsulation material to solidify and harden. The curing process can take anywhere from a few minutes to several hours, depending on the specific material and the required level of hardness.Once the encapsulation material has cured, the final step in the workflow is the removal of the encapsulated components from the mold or cavity. This process may involve the use of specialized tools or equipment, such as ejector pins or robotic handling systems, to gently remove the components without causing any damage.After the components have been removed from the mold, they may undergo additional processing steps, such as trimming, drilling, or surface finishing, to ensure that they meet the required specifications and standards.Throughout the encapsulation process workflow, quality control measures are in place to ensure the consistency and reliability of the final product. This may include visual inspections, dimensional measurements, and various testing and characterization techniques,such as X-ray imaging, thermal analysis, or electrical testing.The encapsulation process workflow is a critical component of the manufacturing process for a wide range of products, and its importance cannot be overstated. By protecting sensitive components and materials from environmental factors, the encapsulation process helps to ensure the long-term reliability and performance of the final product.As technology continues to advance and the demand for more complex and compact electronic devices and medical implants increases, the importance of the encapsulation process workflow will only continue to grow. Manufacturers must stay up-to-date with the latest materials, technologies, and best practices in order to remain competitive and meet the evolving needs of their customers.In conclusion, the encapsulation process workflow is a complex and multifaceted process that requires a deep understanding of materials science, manufacturing techniques, and quality control measures. By mastering this process, manufacturers can produce high-quality, reliable products that meet the needs of a wide range of industries and applications.。

led封装工艺流程（Led packaging process）LED process flowchart (revolution)LED packagingLED packaging technology has been developed and evolved on the basis of discrete device packaging technology, but it has great particularity. In general, the core of the discrete device is sealed in the encapsulation. The main function of encapsulation is to protect the core and complete the electrical interconnection. And LED encapsulation is completed the output electric signal, protection tube core work, output: the function of visible light, both the electric parameters, and the optical parameters of design and technical requirements, cannot simply be discrete device packaging for the LED.The core of the LED light-emitting part is composed of p-type and n-type semiconductor pn junction tube core, when the minority carrier injection pn junction with majority carrier compound, can emit visible light, ultraviolet light ornear-infrared light. But p-n junction area of photons is directional, to launch the same chance in all directions, therefore, not all of the light tube core can be released, the quality depends mainly on semiconductor materials, the sealed tube core structure and geometric shape, structure and coating materials, application for higher internal and external quantum efficiency of leds. Conventional Φ type 5 mm LED encapsulation is the side length of 0.25 mm square tube core bonding or sintering in lead frame, the positive by the spherical contact point of the tube core with gold, within the bonded to lead connected to a tube feet, the cathode throughreflection cup and wire rack connected to another pin, and then the top with epoxy resin coating. The function of the reflecting cup is to collect the light from the side of the tube and the interface, and to launch into the desired direction. The top encapsulated epoxy resin is made of a certain shape, which has several functions: protecting the core and so on. Using different shape and material properties (with or without dispersing agent), the function of lens or diffuse lens is used to control the divergence Angle of the light. Tube core index related to air refractive index is too big, causing the inside of the tube core total reflection critical Angle is small, its output of light only a fraction of the active layer is removed, most easily inside the tube core is absorbed by multiple reflection, easily lead to too much light in total reflection loss, choose corresponding refractive index of the epoxy resin as the transition, improve the efficiency of light emergent tube core. The epoxy resin used to form the shell of the tube shall be of moisture resistance, insulation, mechanical strength, the refractive index and transmittance of the light of the pipe core. Choose different refractive index of packaging materials, packaging geometry on the photon escape efficiency is different, the influence of the Angle of the luminous intensity distribution and core tube structure, the light output way, encapsulation used material and shape of the lens. If using the pointed resin lens, the light can be concentrated in the direction of the axis of the LED, and the corresponding Angle is smaller. If the resin lens at the top is rounded or flat, the corresponding Angle will increase.In general, the LED light wavelength with the temperature change of 0.2 0.3 nm / ℃, the spectral width will increase,affect the color brilliance. In addition, when the forward current flows through the p-n junction, and make the junction area produces a febrile loss, temperature near the room tempera ture, temperature rise per 1 ℃, the luminous intensity of leds will correspondingly reduced about 1%, encapsulation cooling; It is very important to maintain the color purity and the intensity of luminescence. In the past, the method of reducing the driving current is used to reduce the temperature, and the driving current of most leds is limited to about 20mA. However,LED light output will increase along with the increase of current, at present, a lot of power type LED drive current can reach 70 ma and 100 ma even 1 a, need to improve the encapsulation structure, new LED packaging design concept and low thermal resistance package structure and technology, improve the thermal characteristics. For example, large scale chip inversion structure is adopted to select silver gel with good thermal conductivity and increase the surface area of metal stents, and the silicon carrier of solder convex spots is directly installed in the hot and sink method. In addition, thermal design and thermal conductivity of PCB circuit board are also important in application design.1. Product packaging structure typeSince the 1990 s, research and development of LED chips and materials technology, has been a number of breakthroughs, transparent substrate trapezoidal structure, texture, surface structure, the structure of the flip chip, the commercialization of ultra-high brightness (1 CD) of red,orange, yellow, green, blue LED products have the introduction, as shown in table 1, 2000 in low, the luminous flux of special lighting applications. Leds, middle industry has been unprecedented attention, further promote the development of downstream encapsulation technology and industry, using different encapsulation structure forms and sizes, different light color tube core and double color, or three color combination, can produce various series of varieties, specifications of the products.The type of LED product packaging structure is shown in table 2, and it is classified according to the characteristics of luminescent color, chip material, luminance brightness, size and so on. Single tube core generally constitute a point light source, multiple core tube assembly in general can constitute a plane light source and line source, for information, state directives and display, light emitting display is also with multiple tube core, through the appropriate connection tube core (including series and parallel) with appropriate optical structure combination, constitute a light-emitting display light-emitting section and markers. The surface mounted LED can gradually replace the lead LED, the application design is more flexible, it has a certain share in the LED display market, and has the accelerated development trend. The solid lighting source has some products to go public, which is the long-term development direction of leds.2. Pin packagingLED the type USES the lead frame for various packaging shaped pin, were the first to market research and development successof encapsulation structure, the number of varieties is various, technical maturity is higher, package structure and reflector continues to improve. Standard LED display industry is considered by most customers is the most convenient and economical solution, in typical conventional leds can withstand the 0.1 W input power coating, 90% of the heat is distributed by the cathode pin frame to the PCB, and then send out into the air, how to reduce the work of pn junction temperature rise is encapsulation and application must be considered. Coating material with high temperature curing epoxy resin, the optical performance is good, good adaptability to process, product * can be high, but make it colored or colorless transparent or colorless, transparent and colored scattering scattering lens assembly, different lens shape a variety of shapes and sizes, for example, circles are divided into Φ diameter 2 mm, 3 mm and 4.4 mm ΦΦ, 5 mm and 7 mm ΦΦseveral kinds, such as the different components of the epoxy resin can produce different luminous effect. There are many different kinds of packaging structure for the color point light source: ceramic base epoxy resin packaging has better working temperature performance.The pins can be bent into the desired shape, small volume; The metal base plastic reflector is an energy-saving indicator, suitable for power supply indication; The scintillation will encapsulate the CMOS oscillating circuit chip and LED tube core, which can generate the blinking light of the stronger visual impact. Double color type is composed of two different luminous color tube core, packaging in the same epoxy resin lens, in addition to the double color can also be a third of the mixed color, has extensive application in the large screen displaysystem, and packaging of double color display devices; The voltage type will encapsulate the constant current source chip and LED tube core, and can directly replace the various voltage indicator lamps of 5-24v. Plane light source is multiple LED chip bonding on the regulation of miniature PCB position, plastic reflection and potting epoxy resin to form a box cover, the different PCB design to determine the outer lead arrangement and connection mode, there are dual in structure with single upright, etc. The light source has developed hundreds of package shapes and sizes for the market and customers.LED luminescent display can be composed of a variety of products, such as a digital tube or a meter pipe, a symbol tube, and a rectangular tube. The actual requirements are designed into various shapes and structures. Digital tube, for example, a reflector type, monolithic integrated type, such as a single seven sections of three kinds of encapsulation structure, the connection mode has a total of anode and cathode two, one is often said of the digital tube, two or more commonly known as the monitor. Reflector type, with large fonts, with makings provinces, hybrid packaging characteristics of flexible assembly, generally made of white plastic into shape shell with reflective cavity seven pieces, will be a single LED chip bonding with seven reflex reflector cavity registration on the PCB board of each other, each reflection cavity at the bottom of the center position is a form of luminous tube core area, bonding with bonding method fuses, within the reflector drops of epoxy resin, and the tube core PCB surface glue, glue and curing. The reflector type is divided into two kinds, namely empty sealing and solid seal. The former USES the epoxy resinof the scattering agent and the dye, which is used in the unit and the two devices. The latter is covered with a filter and a smooth film, and on the tube core and the bottom plate are coated with a transparent insulating gel, which increases the efficiency of the light, which is generally used for more than four figures. Monolithic integrated chip is in luminescent material on a large number of seven segment digital display graphics chip, then scribing divided into single chip graphics chip, bonding, bonding and encapsulating the lens (commonly known as the fisheye lens). A single seven stages will have to make a good large LED chips, cross cut into article contains one or more than just the core of light, so the same seven bonding in digital glyph of kovar rack, the bonding, epoxy resin encapsulation. The feature of single chip and single style is micro-miniaturization, which can be used in double column direct interpolation, mostly dedicated products. LED light display on the 106 mm length of the circuit board, 101 just core (up to 201 just core), belongs to high density packaging, using optics refraction principle, make the point light through a transparent cover article 13 to 15 grating imaging, finish every just core from dot to line, according to packaging technology is more complicated.Electroluminescent mechanism of semiconductor pn junction decision is unlikely to have a continuous spectrum of white light LED, at the same time, single LED is not likely to produce two or more of the high brightness monochromatic light, only in the wrapping with the aid of fluorescent material,The blue or ultraviolet LED tube is coated with phosphor powder, which indirectly produces the broad band spectrum, and thewhite light is synthesized. Or adopt several (two or three or more kinds) of tubes with different colored light to be encapsulated in a component shell, which forms white leds through a mixture of colored light. Both methods have practical application, the Japanese production white LED up to 100 million, 2000, developed into a kind of steady hair white light products, and will be more than white LED assembly design flux requirement is not high, in pairs is given priority to with local adornment effect, the pursuit of new electric light source.3. Surface mounting and packagingIn 2002, surface-mount package LED (SMD leds) is gradually accepted by the market, and get a certain market share, from pin type packaging to SMD conforms to the whole electronic industry development trend, many manufacturers to launch such products.The early SMD leds were mostly modified with sot-23 with transparent plastic body, with a size of 3.04 x 1.11mm, and the packing of the coil tray. Based on SOT - 23, the slm-125 series with high brightness SMD with lens is developed, and slm-245 series leds, the former is monochrome, and the latter is bichromatic or trichromatic luminescence. Development become a hot spot in recent years, SMD LED, well solved the brightness, perspective, flatness, can be *, consistency, use lighter PCB board and reflector material, the display reflector need fill less epoxy resin, pins and remove the heavier carbon steel material, through the smaller size, lower weight, half the weight of the product, and easily will eventually make theapplication more hasten is perfect, especially suitable for indoor, half outdoor full-color display applications.Table 3 shows several sizes of common SMD leds and the best viewing distance calculated according to size (plus necessary clearance). The welding disk is an important channel for its heat dissipation. The data of SMD LED supplied by the manufacturer are based on the welding disk of 4.0 x 4.0 mm, and the backflow welding can be designed as the welding disk and the primer phase. Ultra-high brightness LED products can be used PLCC (laminate with lead chip carrier) - 2 encapsulation, shape size is 3.0 * 2.8 mm, with unique method high brightness tube core assembly, product thermal resistance of 400 k/W, can press welding CECC way, its luminous intensity in 50 ma drive current issued 1250 MCD. One, two, three and four digital SMD LED display devices have a height of 5.08-12.7 mm, indicating a wide range of sizes. PLCC encapsulation to avoid the pin 7 digital display for manual insert and pin alignment process, conform to the requirements of the automatic pick up - SMT equipment production, flexible application design space, display bright and clear. Multicolor PLCC encapsulated with an external reflector, can be easily combined with luminous tube or optical, replace the current transmission type with reflective optical design, to provide uniform illumination for wide area, research and development under the condition of 3.5 V, 1 a drive to work the power type of SMD leds encapsulation.4. Power type packageLED chip and package to develop in the direction of high power, the big electric flow produce 10 to 20 times larger than 5 mmledΦluminous flux, must adopt effective heat dissipation and no degradation of the packaging material to solve the problem of light failure, therefore, shell and assembly as well as the key technology, can withstand the number W power LED packaging.5 W series of white, green, blue, green, and blue type power supply LED from the beginning of 2003, white LED light output up to 1871 m, 44.31 m/W green lighting failure problems, develop sustainable 10 W power leds, large tube; The size of the dagang is 2.5 x 2.5 mm, which can be used to work at 5A, and the light output reaches 2001m. As a solid lighting source, there is a lot of room for development.Luxeon series power LED is A1GalnN power type inversion tube core inversion welding in silicon with solder bumps carrier, and then put the complete inversion welding silicon carrier into heat sink and the shell, the bonding wire for encapsulation. This kind of encapsulation is optimal for the efficiency of light, heat dissipation, and the design of higher working current density. Its main features: low thermal resistance, generally is only 14 ℃ / W, only 1/10 of the conventional leds; Fill the sealed * can be high, stable flexible gel, the range - 40-120 ℃, without internal stress caused by temperature shock, make gold and lead frame disconnected, and prevent yellowing epoxy resin lens, lead frame will not defiled by oxidation; The best design of the reflection cup and lens makes the radiation pattern controlled and optical efficiency the highest. In addition, the output light power, the external quantum efficiency and other performance are excellent, the LED solid light source development to a new level.Norlux series power LED encapsulation structure for the hexagonal aluminum plate base (which is not conductive) multichip combination, base diameter of 31.75 mm, light emitting area is located in the center of the site, (0.375 x 25.4) mm in diam., can accommodate 40 only LED tube core, aluminum plate as a hot line at the same time. Tube core bonding wire through the base of the contact points of the two connected to the positive and negative, according to the size of the output light power required to determine the base with the number of the tube core, composable encapsulation of ultra-high brightness AlGaInN and AlGaInP tube core, the emission light monochrome, respectively, for the color or synthetic white, with high refractive index material finally according to the shape of optical design for coating. This using conventional tube core density composite packaging, high light efficiency, low thermal resistance, better protection tube core and bonding wire, in large electrical shed have higher optical output power, is also a kind of promising LED solid-state light source.In the application, can be in already packaging product assembly with an aluminum laminated metal core PCB, form the power density of LED, PCB board as a device of electrode connection wiring, aluminum core sandwich can be used for hot line, higher luminous flux and photoelectric conversion efficiency. In addition, the encapsulated SMD LED is small, and can be combined flexibly to form a colorful lighting source, such as modular, light-emitting, optical, reflective, and so on.Thermal characteristics of the power type LED directly affect the LED working temperature, the luminous efficiency, lightwavelength, service life, etc., therefore, the power type LED chips encapsulation design, the manufacture technology is more important.。

led封装流程英语介绍英文回答：LED Packaging Process.The LED packaging process is a critical step in the manufacturing of light-emitting diodes (LEDs). It involves assembling the LED chip, encapsulating it in a protective material, and providing electrical connections. The packaging process helps to protect the LED chip from damage and ensures that it can operate reliably for its intended lifespan.The first step in the LED packaging process is to mount the LED chip on a substrate. The substrate is typically made of metal or ceramic and provides a stable base for the LED chip. The LED chip is then wire bonded to the substrate using gold or aluminum wires. The wire bonds provide the electrical connections between the LED chip and the external circuit.Once the LED chip is mounted and wire bonded, it is encapsulated in a protective material. The encapsulation material is typically a polymer or epoxy resin that protects the LED chip from moisture, dust, and other environmental factors. The encapsulation process also helps to dissipate heat from the LED chip.The final step in the LED packaging process is to provide electrical connections to the LED. This istypically done by soldering leads to the substrate. The leads provide the electrical connections between the LED and the external circuit.The LED packaging process is a complex and precise process that requires specialized equipment and materials. The quality of the packaging process can have a significant impact on the performance and reliability of the LED.中文回答：LED封装流程。

cowos封装工艺流程英文回答：Cowos stands for Chip-on-Wafer-on-Substrate, which is a packaging technology used in the semiconductor industry. It involves the integration of multiple chips onto a single wafer, which is then attached to a substrate for electrical connections. This technology offers several advantages, such as improved performance, reduced form factor, and increased functionality.The Cowos packaging process begins with the fabrication of individual chips on separate wafers. These chips can be of different types or functionalities, depending on the desired application. Once the chips are ready, they are transferred onto a common wafer using a process called chip transfer. This involves aligning and bonding the chips onto the wafer surface.After the chip transfer, the next step is the waferthinning process. This is done to reduce the thickness of the wafer, making it more flexible and easier to handle. Thinning is typically achieved through mechanical grinding or chemical etching. The thickness of the thinned wafer depends on the specific requirements of the application.Once the wafer is thinned, the next step is the redistribution layer (RDL) formation. RDL is a crucial part of the Cowos process as it provides the electrical interconnects between the chips and the substrate. RDL is created by depositing and patterning metal layers on the wafer surface, which are then connected to the chip pads using fine-pitch bonding techniques.After the RDL formation, the wafer is ready for the chip-on-wafer bonding process. This involves aligning and bonding the wafer with the chips onto a substrate. The bonding can be achieved through various methods, such as soldering, thermocompression bonding, or adhesive bonding. The choice of bonding method depends on factors like chip size, substrate material, and electrical requirements.Once the bonding is complete, the final step is the singulation process. This involves separating theindividual packaged chips from the wafer and substrate. Singulation can be done through dicing, where a diamond saw is used to cut the wafer into individual chips. Alternatively, laser cutting or mechanical scribing techniques can also be used.In conclusion, Cowos is a packaging technology that enables the integration of multiple chips onto a single wafer, offering various benefits in terms of performance and form factor. The process involves chip transfer, wafer thinning, redistribution layer formation, chip-on-wafer bonding, and singulation. This technology plays a crucial role in the advancement of semiconductor devices, allowing for more compact and efficient electronic systems.中文回答：Cowos是芯片-晶圆-基板封装技术的缩写，是半导体行业中使用的一种封装技术。

点胶机封装工艺流程英文回答：Glue dispensing is a crucial process in the packaging industry, especially in electronic manufacturing. Itinvolves applying adhesive materials to specific areas of a product for bonding or sealing purposes. The processensures product stability, durability, and protection against external factors.The glue dispensing process typically follows a seriesof steps. First, the product or component that requires adhesive application is prepared. This may involve cleaning, surface treatment, or positioning the product in a fixtureor jig for precise dispensing.Next, the appropriate adhesive material is selected based on the specific requirements of the product and its intended use. There are various types of adhesives available, such as epoxy, silicone, acrylic, or UV-curableadhesives. Each type has its own characteristics, such as viscosity, curing time, and bonding strength, which need to be considered during the selection process.Once the adhesive material is chosen, it is loaded into a dispensing system, such as a glue gun or a pneumatic dispenser. The dispensing system is set up with the desired dispensing parameters, including the flow rate, dispense pattern, and dispense volume. These parameters are determined based on factors such as the size and shape of the product, the required bond strength, and the desired aesthetic appearance.After the dispensing system is prepared, the adhesiveis dispensed onto the product in a controlled manner. The operator guides the dispensing system over the designated areas, ensuring precise application. The dispensed adhesive may be in the form of dots, lines, or patterns, depending on the requirements of the product and the dispensing system used.Once the adhesive is applied, the product may undergo acuring process to facilitate bonding. This can be done through various methods, such as air drying, heat curing, or UV curing. The curing time and conditions depend on the type of adhesive used and the desired bond strength.Finally, the product is inspected to ensure the adhesive application meets the required standards. This may involve visual inspection, mechanical testing, or other quality control measures. Any defects or inconsistencies in the adhesive application are identified and rectified to ensure the product's reliability and performance.中文回答：点胶机封装工艺流程在包装行业中至关重要，尤其在电子制造领域。