日本红宝石Lead_Taping_Chi(小型铝电解电容器)

Tolerance
4 T5 Fig.2
8 TZ Fig.1
d L P P0 P1 P2 F W W0 W1 W2 H H0 L1 D0 h p t 5.1
0.45 6.5 12.7 12.7
(
Quantity (pcs)
)
小型铝电解电容器
MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS
Distance between center of driving hole and clinch part of lead
End of lead Dia. of driving hole Off alignment of body top Off alignment of body top
Sum of thickness for mounting and adhesive tape without lead dia
W1
L
(mm) 7mm or 7.5mm Height 4 T5 Fig.2 6.3 4 TZ Fig.1 0.45 8.5 12.7 12.7 3.85 6.35 2.5 18.0 5.0 9.0 1.5 17.5 16.0 0.5 4.0 1.0 1.0 0.6 2000 ( 17.5 16.0 0.5 4.0 1.0 1.0 0.6 8:1000) 5.0 2.5 5.1 3.85 6.35 5.0 18.0 5.0 9.0 1.5 20.0 3.5 4.6 6.3 TA Fig.1 8 T7 Fig.2 0.05 MAX 1.0 0.2 0.5 1.0 0.8 0.2 0.3 MIN 0.5 MAX 0.75 0.5 MAX 0.2 MAX MAX 0.3
18) ( 5 Lead cutting code : CA CC CE
H
d 0.05
5.0 ………………… (CA) 4.0 ………………… (CC) 3.5 ………………… (CE) 0.5 2.0 2.5 3.5 0.6 5.0 0.8 7.5
H
0.5
d
F
பைடு நூலகம்
E D
0.2
• Kinked lead forming 8) ( 5 Kinked lead forming code : KC
d D
P E d
P MAX
0.5
H2
+1.0 –0.5
0.05
H1
0.5
•
(
10
18) Low profile with horizontal mounting
2.3 0.5
F 0.5
A Type A
B Type B
(mm) D Code d F RI 10, 12.5 RK RX SG 0.6 5.0 4.0 A B A 3.5 B A 4.0 B A RI 14.5, 16, 18 RK RX SG 0.8 7.5 3.5 B
D
d
0.05
H
0.5
H 0.5
H Type
F 0.5
F 0.5
小型铝电解电容器
MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS
TAPING SPECIFICATIONS (04
Fig.1
P2
)
P D p p
DIMENSIONS
Fig.2
P2 P D p p h h
P1 F W2 d H0 H W2
L
P1 F d H L1 W0 W P0 D0 t W1
(
Quantity (pcs)
)
小型铝电解电容器
MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS
LEAD CUTTING FORMING SPECIFICATIONS
: ( ) Rubycon provides lead-formed and lead-cut products to facilitate mounting on printed circuit boards, as well as products with leads specially processed (kink formed) for self supporting insertions to printed circuit boards.
L1
P0
L
(mm)
5 T1 Fig.2
6.3 TA Fig.1 TA Fig.1
8 T7 Fig.2
10 T8 Fig.2
12.5 G4 Fig.2
16 GC Fig.3 0.8
18 Tolerance
d L P P0 P1 P2 F W W0 W1 W2 H H0 L1 D0 h p t 2.5 5.1
Fig.3
P2 P D
p
p
P1 W2 H D0 F d
W0
W
W1
SPECIFICATION TABLE
9mm or more Height
Items Taping code Applicable Fig. No. Dia. of lead Height of body Distance from center to center of next body Distance from center to center of next driving hole Distance between center of driving hole and lead Distance between center of driving hole and body Pitch of lead Width of mounting tape Width of adhesive tape Code
0.5 13.0 22.0 12.7 12.7 3.85 6.35 5.0 3.5 4.6
0.6 30.0 15.0 15.0 3.85 5.0
0.05 MAX 1.0 0.2 0.5 1.0 0.8 0.2 0.3 MIN 0.5 MAX
42.0 30.0 15.0 0.3
3.75 7.5
5.0 0.8
• Lead forming ( 5 8) Lead forming code : FA
2.5MAX 5 0.5 D d 0.05 F 0.5
(mm) D d F 5 6.3 0.5 5.0 8 0.6
(mm) • Lead cutting
F 0.5 D
D
5
6.3
8
10 12.5 14.5 16
18
L1
W0
W
P0
D0
SPECIFICATION TABLE
5mm Height
Items Taping code Applicable Fig. No. Dia. of lead Height of body Distance from center to center of next body Distance from center to center of next driving hole Distance between center of driving hole and lead Distance between center of driving hole and body Pitch of lead Width of mounting tape Width of adhesive tape Distance between center of driving hole and mounting tape edge Max. allowable distance between mounting and adhesive tape edges Distance between center of driving hole and bottom of body Distance between center of driving hole and clinch part of lead End of lead Dia. of driving hole Off alignment of body top Off alignment of body top Sum of thickness for mounting and adhesive tape without lead dia Code
7.5 0.8
18.0 5.0 9.0 1.5 18.5 16.0 0.5 4.0 1.0 1.0 0.6 2000 1000 500 250 20.0 18.5
0.75 0.5
Distance between center of driving hole and mounting tape edge
Max. allowable distance between mounting and adhesive tape edges
Distance between center of driving hole and bottom of body
0.75 0.5 MAX 0.2 MAX MAX 0.3
P MAX
H2
+1.0
–0.5
(mm)
F 0.5
d
0.05
D H1 H2 H3 F
E 0.2
5
6.3
8
10 12.5 14.5 16 4.5 2.8
18
H3MAX H1 0.5
2.5 5.0 1.0 1.2 1.3 0.6 0.8 7.5
• Kinked lead cutting 18) ( 10 Kinked lead cutting code : KC