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研究生教材国际学术交流英语-外研版Task 1 Call for Conference Papers The planning process for holding a conference should begin very early. A chairperson is selected to make the plan. Various committees are formed, with members in charge of specific activities. These committees generally consist of Conference Organizing Committee and Conference Academic Committee. The committees are then to work out a general program, including a call for papers, which is to notify the prospective participants of the conference.Format of call for conference papers·Theme and/or background·Conference objectives·Topics to be discussed·Time and venue·Papers and submissions·Organizing institution and committee·Contact informationSampleConference Goals:To promote the study of material science in China; to introduce the development of the research work; to discuss the important issues in the field; to provide opportunities for international communication; to promote the understanding of related disciplines; to explore future cooperation possibilities between the countries.Topics to be Discussed:Papers are solicited on theoretical issues and their applications related to crystal materials. Suggested topics include but are not limited to:Papers and Submissions:Authors are invited to submit full papers, up to six pages, with the authors’names and affiliations, complete address (including email, fax and phone number of the corresponding author), before April 10,2006, by email to aa@/doc/91f14474872458fb770bf78a6529647 d2*******.html . The language is Chinese or English. The papers will be reviewed by the program committee based on content, presentation and suitability for the conference. The papers must be in an MS word or Latex format (A4, single space, Songti, 10 points if in Chinese, or Times New Roman, 12 points if in English). More detailed information will be available on the web page: /doc/91f14474872458fb770bf78a6529647d272 83431.html .Useful Expressions and Sentence Patterns1. Call for papers·Papers are being invited for TI 83rd World Conference to be held in Shanghai, May 23-27, 2004.·Titles of proposed papers with a 200-word abstract should be submitted no laterthan May 10, 2006.·The IASTED Secretariat must receive your paper by July 15, 2006.2. Submission·The submitted papers should be original and have not been published elsewhere. ·Best papers will be selected by the Advisory Committee and Program Committee, and the authors a re invited to submit their papers to an international journal. ·For all submissions, please include the following information: title of the paper, name, affiliation, address, phone number, email, andaudiovisual request. ·Abstracts are invited for 20-minute talks followed by 10 minutes of discussion addressing any topic in the areas of Asian environmental protection…3. Format and length·Abstracts should be submitted electronically in an MS Word format and sent by email to the conference secretariat.·Auth ors of accepted papers should send the full text paper in format of PDF or MS Word before September 15, 2006 to aa@/doc/91f14474872458fb770bf78a6529647 d2*******.html with attachment.·All submissions should be in Adobe Acrobat (.pdf), postscript (.ps), or MS Word (.doc) format.·Initial paper submissions should be approximately ten pages.4. Notification of acceptance and refusal·Notification of acceptance will be sent via email by August 1, 2006. ·Receipt of paper submission will be confirm ed by email.·Submissions received after this date will not be given primary consideration. ·Acceptance of the paper will be confirmed by JICC 2006 Program Committee based on content quality of the extended abstract.·Late registration fees or paper submis sions will result in papers being excluded from the conference proceedings.Called to order by the presiding officer主持人致辞roll call点名announcement of quorum宣布大会决议reading of the minutes of the previous meeting宣读前期会议纪要approval of the minutes of the previous meeting通过前期会议纪要related matters相关事宜unfinished business未尽事宜appointments and removal任命及离任nomination and elections提名及选举adjournment休会opening ceremony开幕式keynote speech主题发言forum论坛plenary session全体会议poster session论文展示panel session专题讨论会discussion / question & answer session讨论/提问与回答时间field trip考察活动closing ceremony闭幕式reception/banquet招待晚宴Task 1 Letters of Invitation Before the international conference, the conference host or organizer(s) will send invitation letters to famous scholars and experts in the field and invite them as keynote speakers to the conference. They will also invite other prospective authors to present their new ideas, valuable works, and ongoing research at the conference. These letters are formal letters and therefore should bear all the necessary information about the occasion(s), and express the host’s sincerity and hospitality toward the attendees.在国际会议，会议主持人或组织者（）将发送邀请信，著名学者在该领域的专家和邀请他们作为主讲人会议。
常用光学期刊缩写光学与应用光学等领域常用期刊英文缩写 Acta Optica SinicaActa Photonica SinicaAIP CONFERENCE PROCEEDINGS AIP CONF PROCAPPLIED OPTICSAPPL. OPTICSAPPLIED PHYSICS LETTERSAPPL PHYS LETTChinese Journal of LasersChinese J. LasersHigh Power Laser and Particle BeamsIEEE AEROSPACE AND ELECTRONIC SYSTEMS MAGAZINE IEEE AERO EL SYS MAG IEEE ANNALS OF THE HISTORY OF COMPUTINGIEEE ANN HIST COMPUTIEEE ANTENNAS AND PROPAGATION MAGAZINEIEEE ANTENNAS PROPAGIEEE CIRCUITS & DEVICESIEEE CIRCUITS DEVICEIEEE CIRCUITS AND DEVICES MAGAZINEIEEE CIRCUIT DEVICIEEE COMMUNICATIONS LETTERS IEEE COMMUN LETTIEEE COMMUNICATIONS MAGAZINE IEEE COMMUN MAGIEEE COMPUTATIONAL SCIENCE & ENGINEERINGIEEE COMPUT SCI ENGIEEE COMPUTER APPLICATIONS IN POWER IEEE COMPUT APPL POW IEEE COMPUTER GRAPHICS AND APPLICATIONSIEEE COMPUT GRAPHIEEE COMPUTER GROUP NEWSIEEE COMPUT GROUP NIEEE CONCURRENCYIEEE CONCURRIEEE CONTROL SYSTEMS MAGAZINEIEEE CONTR SYST MAGIEEE DESIGN & TEST OF COMPUTERSIEEE DES TEST COMPUTIEEE ELECTRICAL INSULATION MAGAZINEIEEE ELECTR INSUL MIEEE ELECTROMAGNETIC COMPATIBILITY SYMPOSIUM RECORD IEEE ELECTROMAN COMPIEEE ELECTRON DEVICE LETTERSIEEE ELECTR DEVICE LIEEE ENGINEERING IN MEDICINE AND BIOLOGY MAGAZINEIEEE ENG MED BIOLIEEE 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SIGNAL PROCESSING LETTERSIEEE SIGNAL PROC LETIEEE SIGNAL PROCESSING MAGAZINEIEEE SIGNAL PROC MAGIEEE SOFTWAREIEEE SOFTWAREIEEE SPECTRUMIEEE SPECTRUMIEEE TECHNOLOGY AND SOCIETY MAGAZINE IEEE TECHNOL SOC MAGIEEE TRANSACTIONS ON ACOUSTICS SPEECH AND SIGNAL PROCESSINGIEEE T ACOUST SPEECHIEEE TRANSACTIONS ON ADVANCED PACKAGING IEEE TRANS ADV PACKIEEE TRANSACTIONS ON AEROSPACEIEEE T AEROSPIEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS IEEE T AERO ELEC SYSIEEE TRANSACTIONS ON AEROSPACE AND NAVAL ELECTRONICS IEEE T AERO NAV ELECIEEE TRANSACTIONS ON AEROSPACE AND NAVIGATIONAL ELECTRONICSIEEE TRANS AEROSP NIEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION IEEE T ANTENN PROPAG IEEE TRANSACTIONS ON APPLICATIONS AND INDUSTRY IEEE T APPL INDIEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITYIEEE T APPL SUPERCONIEEE TRANSACTIONS ON AUDIOIEEE TRANS AUDIOIEEE TRANSACTIONS ON AUDIO AND ELECTROACOUSTICS IEEE T ACOUST SPEECH IEEE TRANSACTIONS ON AUTOMATIC CONTROL IEEE T AUTOMAT CONTRIEEE TRANSACTIONS ON BIOMEDICAL ENGINEERINGIEEE T BIO-MED ENGIEEE TRANSACTIONS ON BROADCAST AND TELEVISION RECEIVERS IEEE T BROADC TELEVIEEE TRANSACTIONS ON BROADCASTINGIEEE T BROADCASTIEEE TRANSACTIONS ON CIRCUIT THEORYIEEE T CIRCUITS SYSTIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMSIEEE T CIRCUITS SYSTIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGYIEEE T CIRC SYST VIDIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONSIEEE T CIRCUITS-IIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-ANALOG AND DIGITAL SIGNAL PROCESSINGIEEE T CIRCUITS-IIIEEE TRANSACTIONS ON COMMUNICATION AND ELECTRONICS IEEE T COMMUN ELECTRIEEE TRANSACTIONS ON COMMUNICATION TECHNOLOGYIEEE T COMMUN TECHNIEEE TRANSACTIONS ON COMMUNICATIONSIEEE T COMMUNIEEE TRANSACTIONS ON COMMUNICATIONS SYSTEMS IEEE T COMMUN SYSTIEEE TRANSACTIONS ON COMPONENT PARTSIEEE T COMPON PARTSIEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIESIEEE T COMPON PACK TIEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY IEEE T COMPON HYBRIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART AIEEE T COMPON PACK AIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCEDPACKAGINGIEEE T COMPON PACK BIEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMSIEEE T COMPUT AID DIEEE TRANSACTIONS ON COMPUTERSIEEE T COMPUTIEEE TRANSACTIONS ON CONSUMER ELECTRONICSIEEE T CONSUM ELECTRIEEE TRANSACTIONS ON CONTROL SYSTEMS TECHNOLOGY IEEE T CONTR SYST T IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION IEEE T DIELECT EL INIEEE TRANSACTIONS ON EDUCATIONIEEE T EDUCIEEE TRANSACTIONS ON ELECTRICAL INSULATIONIEEE T ELECTR INSULIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY IEEE T ELECTROMAGN CIEEE TRANSACTIONS ON ELECTRON DEVICESIEEE T ELECTRON DEVIEEE TRANSACTIONS ON ELECTRONIC COMPUTERS IEEE TRANS ELECTRONIEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURINGIEEE T ELECTRON PA MIEEE TRANSACTIONS ON ENERGY CONVERSIONIEEE T ENERGY CONVERIEEE TRANSACTIONS ON ENGINEERING MANAGEMENT IEEE T ENG MANAGEIEEE TRANSACTIONS ON ENGINEERING WRITING AND SPEECH IEEE T PROF COMMUNIEEE TRANSACTIONS ON EVOLUTIONARY COMPUTATION IEEE T EVOLUT COMPUT IEEE TRANSACTIONS ON FUZZY SYSTEMSIEEE T FUZZY SYSTIEEE TRANSACTIONS ON GEOSCIENCE AND REMOTE SENSINGIEEE T GEOSCI REMOTEIEEE TRANSACTIONS ON GEOSCIENCE ELECTRONICS IEEE T GEOSCI ELECT IEEE TRANSACTIONS ON HUMAN FACTORS IN ELECTRONICS IEEE TRANS HUM FACTIEEE TRANSACTIONS ON HUMAN FACTORS IN ENGINEERING IEEE T HUM FACT ENGIEEE TRANSACTIONS ON IMAGE PROCESSINGIEEE T IMAGE PROCESSIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICSIEEE T IND ELECTRONIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS AND CONTROL INSTRUMENTATIONIEEE T IND EL CON INIEEE TRANSACTIONS ON INDUSTRY AND GENERAL APPLICATIONS IEEE TRANS IND GEN AIEEE TRANSACTIONS ON INDUSTRY APPLICATIONSIEEE T IND APPLIEEE TRANSACTIONS ON INFORMATION TECHNOLOGY IN BIOMEDICINE IEEE T INF TECHNOL BIEEE TRANSACTIONS ON INFORMATION THEORYIEEE T INFORM THEORYIEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT IEEE T INSTRUM MEASIEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERINGIEEE T KNOWL DATA ENIEEE TRANSACTIONS ON MAGNETICSIEEE T MAGNIEEE TRANSACTIONS ON MAN-MACHINE SYSTEMS IEEE T MAN MACHINEIEEE TRANSACTIONS ON MANUFACTURING TECHNOLOGYIEEE T MANUF TECHIEEE TRANSACTIONS ON MEDICAL IMAGING IEEE T MED IMAGINGIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES IEEE T MICROW THEORYIEEE TRANSACTIONS ON MILITARY ELECTRONICS IEEE T MIL ELECTRONIEEE TRANSACTIONS ON NEURAL NETWORKSIEEE T NEURAL NETWORIEEE TRANSACTIONS ON NUCLEAR SCIENCEIEEE T NUCL SCIIEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS IEEE T PARALL DISTRIEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING IEEE T PARTS HYB PACIEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGINGIEEE TR PARTS MATERIEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCEIEEE T PATTERN ANALIEEE TRANSACTIONS ON PLASMA SCIENCEIEEE T PLASMA SCIIEEE TRANSACTIONS ON POWER APPARATUS AND SYSTEMS IEEE T POWER AP SYSTIEEE TRANSACTIONS ON POWER DELIVERYIEEE T POWER DELIVERIEEE TRANSACTIONS ON POWER ELECTRONICS IEEE T POWER ELECTRIEEE TRANSACTIONS ON POWER SYSTEMSIEEE T POWER SYSTIEEE TRANSACTIONS ON PRODUCT ENGINEERING AND PRODUCTIONIEEE T PROD ENG PRODIEEE TRANSACTIONS ON PROFESSIONAL COMMUNICATION IEEE T PROF COMMUN IEEE TRANSACTIONS ON REHABILITATION ENGINEERING IEEE T REHABIL ENG IEEE TRANSACTIONS ON RELIABILITYIEEE T RELIABIEEE TRANSACTIONS ON ROBOTICS AND AUTOMATIONIEEE T ROBOTIC AUTOMIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING IEEE T SEMICONDUCT MIEEE TRANSACTIONS ON SIGNAL PROCESSINGIEEE T SIGNAL PROCESIEEE TRANSACTIONS ON SOFTWARE ENGINEERINGIEEE T SOFTWARE ENGIEEE TRANSACTIONS ON SONICS AND ULTRASONICS IEEE T SON ULTRASONIEEE TRANSACTIONS ON SPACE ELECTRONICS AND TELEMETRY IEEE T SPACE EL TELIEEE TRANSACTIONS ON SPEECH AND AUDIO PROCESSING IEEE T SPEECH AUDIPIEEE TRANSACTIONS ON SYSTEMS MAN AND CYBERNETICS IEEE T SYST MAN CYB IEEE TRANSACTIONS ON SYSTEMS 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PRECISION ENG.OPTICA ACTAOPT ACTAOPTICA APPLICATAOPT APPLOPTICAL AND QUANTUM ELECTRONICS OPT QUANT ELECTRON OPTICAL ENGINEERING OPT ENGOPTICAL FIBER TECHNOLOGYOPT FIBER TECHNOLOPTICAL IMAGING OF BRAIN FUNCTION AND METABOLISM 2 ADV EXP MED BIOLOPTICAL INFORMATION SYSTEMS OPT INF SYSTOPTICAL MATERIALSOPT MATEROPTICAL PROPERTIES OF SEMICONDUCTOR QUANTUM DOTS SPRINGER TR MOD PHYSOPTICAL REVIEWOPT REVOPTICAL SPECTRAOPT SPECTRAOPTICS & PHOTONICS NEWS OPT PHOTONICS NEWS OPTICS AND LASER TECHNOLOGY OPT LASER TECHNOL OPTICS AND LASERS IN ENGINEERINGOPT LASER ENGOPTICS AND SPECTROSCOPY OPT SPECTROSC+OPTICS AND SPECTROSCOPY-USSROPT SPECTROSC-USSROPTICS COMMUNICATIONS OPT COMMUNOPTICS EXPRESSOPT EXPRESSOPTICS LETTERSOPT LETTOPTIKOPTIKOPTIKA I SPEKTROSKOPIYA OPT SPEKTROSK+ PATTERN ANALYSIS AND APPLICATIONSPATTERN ANAL APPLPATTERN FORMATION IN GRANULAR MATERIALS SPRINGER TR MOD PHYSPATTERN RECOGNITION PATTERN RECOGNPATTERN RECOGNITION LETTERS PATTERN RECOGN LETT PROGRESS IN OPTICS PROG OPTICSPROGRESS IN OPTICS, VOL 33 PROG OPTICSPROGRESS IN OPTICS, VOL 35 PROG OPTICSPROGRESS IN OPTICS, VOL 38PROG OPTICSPROGRESS IN OPTICS, VOL XLPROG OPTICSPROGRESS IN OPTICS, VOL XXXII PROG OPTICSPROGRESS IN OPTICS, VOL XXXIXPROG OPTICSPROGRESS IN OPTICS, VOL XXXVIPROG OPTICSPROGRESS IN OPTICS, VOL. 37PROG OPTICSSpacecraft Recovery & Remote SensingSOLAR ENERGY MATERIALSSOL ENERG MATERSOLAR ENERGY MATERIALS AND SOLAR CELLS SOL ENERG MAT SOL C VISION RESEARCHVISION RESVISION TECNOLOGICAVIS TECNOL。
Preparing a paper for publication in IOP:Conference SeriesJ Mucklow1and A Jansson21Senior Production Editor,IOP Publishing,Bristol,UK2Production Assistant,IOP Publishing,Bristol,UKE-mail:jacky.mucklow@Abstract.These guidelines(laid out in the recommended format of a published article)summarize the key requirements for an article to be published in IOP:Conference Series.Articles will not be edited,proofread or have changes made to the layout;thesubmitted PDF will be used for both online and print.It is,therefore,the author’sresponsibility to ensure that the content and layout are correct—no changes can be made afterpublication.1.Key requirementsThe following lists the essential requirements for an article to be published in an IOP:Conference Series journal:•the page size should be A4;•each page should have clear margins of4cm(top),2.5cm(left and right)and2.7cm(bottom);•pages should not contain page numbers,running heads or footlines;•all articles must contain an abstract;•in the PDF,all fonts should be embedded.yout of the title pageThe title should be followed by a list of all authors’names and their affiliations.The style for the names is initials(no periods)followed by the family name.The authors’affiliations follow the author list.If there is more than one address then a superscripted number should come at the start of each address;each author should also have a superscripted number or numbers following their name to indicate which address,or addresses,are the appropriate ones for them. E-mail addresses may be given for any or all of the authors.The abstract follows the list of addresses.The abstract text should be indented25mm from the left margin.As the abstract is not part of the text it should be complete in itself;no table numbers,figure numbers,references or displayed mathematical expressions should be included. It should be suitable for direct inclusion in abstracting services.2.The textThe text of your article should start on the same page as the abstract.Any Acknowledgments should be placed immediately after the last numbered section of the paper,and any appendices after the Acknowledgments section.The length limit will be provided by the conference organizer.3.Figures and tablesFigures and tables should be numbered serially and positioned(centred on the width of the page)close to where they are mentioned in the text,not grouped together at the end.Each figure and table should have a brief explanatory caption.3.1.ColourfiguresThere are no restrictions on the use of colour in the online version of your article.However, you should bear in mind that any print version of your article is likely to be in black and white which may make coloured lines difficult to distinguish.4.Supplementary dataWe are happy for authors to submit supplementary data attachments to enhance the online versions of published articles.Supplementary data enhancements typically consist of video clips,animations or supplementary data such as datafiles,tables of extra information or extra figures.5.ReferencesOnline references will be linked to their original source or to the article within a secondary service such as INSPEC or ChemPort wherever possible.To facilitate this linking extra care should be taken when preparing reference lists.A complete reference should provide enough information to locate the article concerned in print or electronic form.If you are unsure of a particular journal’s abbreviated title it is best to leave the title in full.The terms loc.cit.and ibid.should not be used.5.1.References to printed journal articlesReferences to printed journal articles should typically contain:•the authors,in the form:family name(only thefirst letter capitalized)followed by initials with no periods after the initials;•the year of publication;•the article title(optional)in lower case letters,except for an initial capital;•the journal title(italic and abbreviated).Parts denoted by letters should be inserted after the journal in Roman type;•the volume number in bold type;•the article number or the page numbers.5.2.A typical(numerical)reference listReferences[1]Strite S and Morkoc H1992J.Vac.Sci.Technol.B101237[2]Gusev A A et al2011J.Phys.:Conf.Series291012052[3]Kurata M1982Numerical Analysis for Semiconductor Devices(Lexington,MA:Heath)[4]Kunze K2003T-duality and Penrose limits of spatially homogeneous and inhomogeneous cosmologies Phys.Rev.D6*******(Preprint gr-qc/0303038)[5]Milson R,Coley A,Pravda V and Pravdova A2004Alignment and algebraically special tensors Preprintgr-qc/0401010[6]Caplar R and Kulisic P1973Proc.Int.Conf.on Nuclear Physics(Munich)vol1(Amsterdam:North-Holland)p517[7]Kuhn T1998Density matrix theory of coherent ultrafast dynamics Theory of Transport Properties ofSemiconductor Nanostructures(Electronic Materials vol4)ed E Sch¨o ll(London:Chapman and Hall) chapter6pp173–214。
