Engineering Query

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Engineering Query常见问题的英文问题纸:No. Problem SuggestionConfirm1. No fabrication standard provided by the customer. 未提供制作标准。

Will follow IPC-A-600F& IPC-6012 class 2.2. No general fabrication tolerance specified as below shown:(a) finished board thickness(b) outline dimensions(c) finished hole diameters(d) big hole diameter(Φ9.0 mm)(e) slot sizes(f) Internal corner radius when routing未提供常见的板厚,外形,孔径,大孔,坑槽,内角的公差。

Finished as below shown:(a)T+/-0.xxmm(b)+/-0.15mm(c)+/-0.10mm(d)+/-0.127mm(e)+/-0.127mm(f) R1.2mm (max)3. Didn't specify:1). surface treatment;2). finished board thickness;3). finished copper thickness未注明表面处理,完成板厚,铜厚Finished as below shown:1). HASL;2). 1.6+/-0.15mm;3). Inner layers 1 oz,outer layers 1 oz.4. No outline dimensions provided by the customer. 未提供外形尺寸We will build as per gerber data as att.x shown.5. The standard for tolerance of outline dimensions (or hole size, Twist/Warp, etc) is strict for us. (Please see att.x ) 外形尺寸 (或孔径等)的公差较严Relax it to be xxx.6. Some holes' attributes (plated or non-plated) weren't specified by the customer. 未注明孔的属性We will produce as per att.x shown.7. There are some plated through holes (Φ mm) without circuit pads on both sides. 一些镀通孔表面无线路PAD (a) We will build them as PTH withoutannular ring.Or (b) We will build them as NPTH.8. There are some non-plated holes (Φ mm) with circuit pads larger than hole diameter (Φ mm) on both sides.一些非镀通孔表面有比孔大的线路PAD(a) Delete the circuit pads.Or (b) Trim pads to keep 10 milsclearance away from hole edges.Or (c ) Leave as is but we'll 2nd drill theholes.9. There are no full holes to be used as punching (or routing) tooling holes.无足够的工具孔可作为啤板(锣板)管位孔。

Will add x holes to be tooling holes at breakaway tabs (or in unit).(see att.x)10. In order to balance plating and obtain more even board thickness after pressing, we'll add thieving copper on breakaway tabs on all layers.加抢电铜皮于各层拗板边。

Please confirm.11. To decrease short/open circuit in inner layers, we'll delete isolated pads for all inner layers.为减少开短路,将删除内层的独立PAD.Please confirm.12. There is no full spacing between traces (or pads, characters, etc) & outline. Copper will be exposed.铜位(或pad, 客字,线路等)与外围间无足够的间隙。

We'll move/trim traces to keep x mils clearance away from outline to avoid exposing copper.13. To get more annular ring and decrease open circuits, we'll add tear drops at location of traces-pads connection. 于线,焊盘连接处加泪珠。

Please confirm.14. There is only x mils spacing between SMT pads, which is out of our capability to build s/m bridge.SMT pads间距仅xmil,超出本厂能力来作出绿油桥。

(a) Trim pads to keep 9 mils clearance in our productionartwork.Or (b) Don't make s/m bridge.15. There are some plated through holes (Φ mm) without s/m opening on one side (or both sides).一些镀通孔未开绿油窗。

如VIA孔径<16mils,且单面未开窗,则问成:(a) Finished via holes will have 4 mils(max) annular rings.Or (b) Will plug via holes, but solderballs in holes is allowed.如VIA孔径<16mils,且双面未开窗,则问成:(a) Finished via holes will have 4 mils(max)can't catch the meaning for those words as att.x shown.不能理解如附页所示句子的意思。

Ignore them.Or (b) Please translate them intoEnglish.29. 30. Because we don't applycorresponding UL mark now; we will not add our UL mark.Please confirm!31. Not provide E-T passing mark.Mark line on board edge as E-T passing marking.32. 文件问题33. 34. We haven't such specify standard by the customer.See att3.Ignore them. We will follow IPC-6012 Class 2 and IPC-A-600F Class 2 to build.35. Read me file said "make sure all the via holes are covered makeing", but we don't know whether the vias should be plugged or not.Via holes:(0.60mm.Please confirm.36. The drawing specified copper thickness 3oz or 4.2+0/-0.4mil on both sides, the range is out of our capability.See Att.1The finished copper thickness will build as 3oz, 3.6mil min per our capability.37. Customer spec required to profile by punching, but SO told to mill outline.EMBED PBrush To profile by milling when proceed sample, please confirm.38. Did not call the tolerance:(a) The hole diameter(b) The finished board thickness(c) The finished copper thickness(d) Internal radius(a) +/-0.10 mm(b) 0.8+/-0.12mm(c) 1.0 oz(d) R1.0mm (max)39. The customer request finished copper thickness 2 oz.In order to smooth our production, please help to confirm whether we can build the finished copper thickness as 2.2mils min.40. No fabrication standard provided by the customer. Will follow IPC-A-600F& IPC-6012 class 2.41. The plated hole wall thickness is0.034" min. The thickness is too thick.(Please see Att.1)We will relax the thickness to 0.025" min.42. The customer provides of v-scoring corner degree and remainder thickness isn't common used.EMBED PBrush V-scoring corner degree: 30o+/-5oV-scoring remained thickness:0.35+/-0.10mm43. Did not specify Au and Ni thickness. Au: 1~3u"Ni: 160u"(min)44. According to attachment 1 layer structure requirement, we calculate 1.6mm for press thickness, and we don't know whether the thickness 0.7is including cu thickness.Please confirm the below layer construction. The below structure will ensure the finished thickness to be 1.6+/-0.15mm.TOP.Prepreg 2116x17628x1In2 0.7+/-0.064 mmIn3 (excl.cu)Prepreg 7628x12116x1BOTTOM45. The manufacturing and quality specification require to follow IPC- A-600F and IPC- 6012 Class 3. The standard class is very strict.(Please see Att.1)Please relax the standard to IPC-6012 Class 2 and IPC-A-600F Class 2.46. The customer of specification required fabricates 6 layer board. But there are 8 layer circuits gerber file.(See att.1)Follow Gerber. (Build 8 layer board.)47. The Sn/Pn thickness 2-4um provided by the custome is out of our capability.Relax as below :Hole : 0.1mil(min)Surface : 0.03mil(min)48. We can't catch the meaning for those hole and frame.See att2.Ignore them.49. The tolerance of hole to hole is too tight for us to control. (See att.1)We will relax 8.400+/-0.002mil to 8.400 +/-0.003 mm, please confirm.50.外形问题51. 52. We found outline dimensions are conflicted between unit and panel drawing.EMBED PBrush A>. Follow unit to build.B>. Follow panel to build.53.There are no full holes to be used as routing guide holes.See Att.1Add three hole ?4.00mm (3X) tooling holes onto breakaway.54.Not provide detailed panel mechanical drawing. (Please see att. I)We will follow att. I to build.55.We found a dimension (unit & panel size) is conflicted between specifications and fabricate drawing. (Please see att1, 2,3)Follow Gerber.56.We found some outline dimensions are conflicted between Gerber and fabricate drawing. (See att.1)A>. Follow Gerber to build.B>. Follow fabricate drawing to build.57. The delivery size conflict between PDF sheet and Gerber data.PDF sheet: 3.787X3.815 INCHGerber: 3.794X3.826 INCHWe will follow Gerber, please confirm.58. The unit dimension is inconsistent on unit drawing [1.65x12.0] and panel outline drawing [1.671x12.0]. (File name: Vent_border].Follow unit drawing dimension1.65x12.0inch, and other dimension follow panel outline drawing.(Detail to see att.1)59. Refer to att.1, it is unclear of panel drawing.A>. Please provide clear panel drawing.B>. Follow attachment 2 our panel drawing to build.60.There is a v-cut requirement in the drawing, but no v-cut in panel. (att.2)No v-cut requirement.61.Not specified the break-tab position.Follow our panel drawing, and please confirm our offered panel drawing. (att.3) 62.Not call the array direction of unit to panel.Refer our panel drawing and the unit Gerber drawing. (Att.3, att.1)63.64.No detailed fabrication drawing provided by the customer.We will produce as per att. I show.65. 孔问题66. 67. Without (3.4mm hole on drill type, we will follow Gerber to add drill four (3.4mm NPTH.(See Att.1 )Please confirm68. Customer didn't provided drill tape.Please send drill tape for us.69. The spacing between pt slot & hole is too small (only 10 mil), it may be broken out.(see below fig.)EMBED PBrush Follow Gerber and accept between hole & slot broken out and have burrs.70. The spacing between pt slots to outline is too small (only 3 mil), it may have burrs and break out.EMBED PBrush We'll building slot for square and accept slot to be broken . EMBED PBrush71. Customer didn't specify hole number & attributes. (Please see att1.) Please confirm.72. There are two PTH overlapped holes in the drill tape(?213mil).A>: We'll change it for slot. (Size:213X354mil; tolerance:+/-4mil)B>: Follow Gerber.73. There are two conterminous holes.EMBED PBrushWe will delete one hole random.74. Not specified the holes attribute.(PTH or NPTH)The Dia138mil(8x)holes are NPTH, others are PTH.75. There is a hole((0.30mm) center beyond outline.EMBED PBrush We'll delete the hole. Please confirm.76. Hole size & hole quantity mismatch on Gerber ((35mil 88x) and hole chart drawing ((37mil 78x;(35mil 10x).(Detail to see att.1&2)A>. Follow Gerber to build.B>. Follow hole chart drawing to build.77. The pad size of (4.77mm hole is same as hole size.A>. Build it NPTH.B>. Follow no ring PTH to build.78. Other holes will build plated through holes. (att.1)Please confirm.79. The spacing is very small (8mil) between the (2.30mm PT hole to (0.50mm PT hole. (att.1)Follow Gerber to accept broken hole.80. Some hole's attributes (Plated or non-plated) weren't specified by the customer.We will produce as per att. II show.81. 线路问题82. 83. Only solder side add fiducial on Gerber, we don't know whether it add fiducial mark both sides.A>.We will add fiducial mark only solder side, and solder mask openingdia.3.0mm.(detail to see attachment DS4457 pdf drawing)B>.We will add fiducial mark both sides, and solder mask opening dia.3.0mm.(detail to see attachment DS4457 pdf drawing)84. There is fiducial mark on top side only, and the copper ring will be expose after routing process, otherwise we don't know whether it add fiducial mark both sides.EMBED PBrush A>.add fiducial mark only top side, and add solder mask opening dia.3.0mm& delete copper ring.B>.add fiducial mark both sides, and add solder mask opening dia.3.0mm& delete copper ring.85. we will add fiducial mark both sides, and add solder mask opening dia.3.0mm& delete copper ring.EMBED PBrush Please confirm. (Detail to see attachment ds4466 pdf drawing)86. There are three holes ((0.76mm) and pad .It isn't same center on both sides.See Att.1,2A>: We'll move hole to hole and pad of center same.B>:please advised.87. The pad to pad of via hole ((0.30mm hole;Pad size 0.60mm) spacing is too small (only 7 mil), no enough spacing enlarge pad. (att.4)Via hole follow 0.30mm max. to build, and accept finished ring >0 mil.88. To get more annular ring and decrease open circuits, we'll add tear drops at location of traces-pads connection (for via hole).Please confirm.89. Some circuit pads annular ring is too small and no spacing to enlarge it.EMBED PBrush We'll enlarge the circuits pads and fabricate solder mask bridge, no enough spacing place allow 90 Deg. broken out.90. 91. There are two holes ((3.175mm) withcircuit pads small than hole diameteron both sides.EMBED PBrush A>. Build it NPTH and trim copper keep 8.0 mil min. clearance away hole edge.B>. Follow PTH to build. 92. There is no full spacing between the copper and hole (only 1.5 mil) at in2 layer. Copper will be exposed.EMBED PBrush (a) We'll trim copper to keep 10 mils clearance away from hole to avoid exposing copper.(b) Follow Gerber.93. In order to avoid short and open circuit in inner layers, we will delete isolated pads for all inner layers.Please confirm.94. We will add dummy thieving pad on breakaway for plating balance.Please confirm.95. There are some circuits abnormity.EMBED PBrush Follow Gerber.96. There is one NPT hole ((100mil) drilled on the copper.EMBED PBrush A>: Follow Gerber, build 2nd drills.B>: Trim copper to keep 10mil to ensure DF tent.97. By customer provides of Gerber files .In2 circuits pads have some abnormity. (See att.3)A>: Follow Gerber.B>: please provide new Gerber.98. There is no full spacing between copper & outline. Copper will be exposed.EMBED PBrush A>: We'll trim copper to keep 10 mils clearance away from outline to avoid exposing copper.B>: Follow Gerber.99. There is no full spacing between the copper and outline& hole (5mil). Copper will be exposed.EMBED PBrush(c) We'll trim copper to keep 10 mils clearance away from outline to avoid exposing copper and accept broken hole.(d) Follow Gerber.100. There are some plates through holes (0.25mm circuit pads annular ring is too small and no spacing to enlarge it.To get more annular ring and decrease open circuits, we'll add tear drops at location of traces-pads connection (for via hole) and no enough spacing place allow 90 Deg. broken out.101. 绿油问题102. 103. The solder mask bridge is too small that it is out of our capacity.EMBED PBrush A: Delete the bridge and build whole s/m opening.B: Trim copper to keep 9mil distance to build 5mil s/m bridge.104.We found lack a layer(s/s) solder maskPlease sent us solder mask(s/s).105.The soldermask opening on top side looks abnormal, but it haven't circuit pad.EMBED PBrushA:>We will delete it.B:>Follow Gerber.106.The some solder mask opening of holes((1.02& mm) is larger than their holes size, but smaller than their holes pads .Follow Gerber to proceed and permit solder mask on pads.orEnlarge their solder mask opening to avoid solder mask on pads.107. There is only one layer solder mask in the Gerber. (A) : Two layer circuits used a layer solder mask together.Or(B):We will add solder maskopening for all circuit pads tonot being on pads on top side.(C): pls provide to us.108. The customer hasn't provided solder resist layer on bottom layer.See Att.1A>: Use top side solder resist file for both side.B>: Don't print solder mask on whole bottom side.109. Customer requires the solder mask color on topside of LED board to be black, not specify the solder mask color of other side and controller board.A>: Use black color solder mask on both sides of LED board and controller board.B>: Use black color solder mask on topside and green color solder mask on bottom side.(See att.2,3)110.I found a superfluous s/m opening on solder side.EMBED PBrushA>. Follow Gerber data.B>. Delete the superfluous S/M opening.111.There are some plated trough hole ((0.50mm) s/m opening are small than the hole.A>. We will build solder mask to tent holes and allow 4.0mil max annular ring on both sides.B>. Solder mask will cover holes' edge and will be in holes but not plug the hole. 112.The spacing between SMT pads is only 7.87 mils, which is out of our capability to build solder mask bridge. (att.4)A:> Trim pads to keep 9 mils clearance.B:> Delete solder mask bridge.113.There are some plates through holes (0.33mm without s/m opening on both sides. A>. We will plug the via holes, please confirm.B>.Finished via holes will have 4 mils(max) annular rings.114. There are some plated through holes((0.50mm) without s/m opening on one side and both side.Solder mask will cover holes' edge andwill be in holes but not plug the holes.115. There are two (3.175mm hole on cutout area, and the solder mask cause copper to be exposed.EMBED PBrush Because the area will be cutout, we will delete two(3.175mm hole & solder mask opening,116. There are some s/m openings to cause trace copper to be exposed on both sides. EMBED PBrushFollow Gerber.117.We found the S/M opening (dia.4.00mm) on the breakaway, but no hole on the same position.Follow the Gerber data.118.The mark didn't solder mask opening. As below shown.Follow the Gerber data.119.Some solder mask opening too large, it causes copper to expose.A>.Follow gerber.B>.Reduce the s/m opening.120.字符问题121. 122. In customer's original gerber, there are many component marks will be on circuit pads, in holes & out of outline.EMBED PBrush We'll try to move/trim, or shrink/ enlarge the legends first; if no full space, we'll trim or delete them.123. We'll add character "A" on the silkscreen appoint area.See att.2,3Please confirm.124. The unit size is too small for us addUL logo and date code.We will add GB logo and "WWYY" on top side by silkscreen format on breakaway tabs.125. In order to better control the process, we would like to add our P/N on the breakaway by legend.Pls. confirm.126. Legends "MADE IN CANADA" were found in Gerber data.(b) Delete them.Or (b) Change them into "made inChina".Or ( c) Leave them as is.127. In customer's original gerber, there are many component marks will be on ground copper.EMBED PBrush A>: We'll delete them.B>: Follow Gerber.128. Didn't specify v-score requirement.Fabricate as below:Remainder thickness:0. 40+/-0.10mmAngle degree: 30o+/-5o129. Unless otherwise stated, we will follow IPC-A-600F class 2 to fabricate.Please confirm.130. Not specified the x-out number on mass production. (3units/set)1 x-out is acceptable.131. The customer didn't specify how to add UL marking & date code.We will add loge and date code (wwyy) on topside by legend.132. Other holes will build plated through holes.Please confirm.133. We'll delete the legend ( only 1 mil) and frame out of outline on the legend.EMBED PBrush Please confirm.134. Some circuit pads annular ring is too small and no spacing to enlarge it.EMBED PBrushAdd teardrop pad on the place connected line, other place allow 90 Deg. broken out. 135.The spacing are too small between circuits pad & peelable mask. It is have possibility be on circuits pads.EMBED PBrushAccept the peelable mask on circuits pads.136.There is one sheet of legend (component side) in the Gerber . But it request both sides legend on the drawing.EMBED PBrushFollow Gerber.( only silkscreen component side)137. Without (3.4mm hole on drill type, we will follow Gerber to add drill four (3.4mm NPTH.(See Att.1 )Please confirm138. There are no full holes to be used as routing guide holes.See Att.1 Add three hole ?3.20mm (3X) tooling holes onto breakaway.139. 140. We haven't such specify standard by the customer.See att3.Ignore them. We will follow IPC-6012 Class 2 and IPC-A-600F Class 2 to build.141. Some solder mask opening too large ,it cause copper to exposed.A>.Follow gerber.B>.Reduce the s/m opening.142. We found lack a layer(s/s) solder maskPlease sent us solder mask(s/s).143. I found a superfluous s/m opening on solder side. A>. Follow Gerber data.B>. Delete the superfluous S/M opening.144. 145.GAINBASE PCB PTE LTDToward Zero Quality DefectTo:Richard/LouIssue:1Copy:Mr. K.W. ManTotal: 2 pagesFrom:MEDept/HTYDate:2005.05.05Production P/N:H3583-00Customer No.:1923Customer Part No.:1500-430-0018-00 REV CSO:0224137Engineering Query ProblemSuggestionConfirm1. Refer to att.1,the spacing of the copper to outline is too small, the copper will be exposed after V-CUT process.A>. Follow GERBER to build and allow the copper to be exposed.B>. Trim copper to keep 20 mil clearance away v-cut center line.2. Customer requires the angle of the v-score to be 90°(min) on drawing, no way for us to proceed, pleasesee Att2.Relax the angle and tolerance to be 30+/-5°.3. The unit is too smaller no spacing to add LOGO & DATECODE.We will only add one LOGO & datecode(wwyy) on breakaway in etching form.4. Not specify the unit boards orientation in panel board.Proceed the unit board the same orientation on panel board.5. Not specify x-out(120unit/panel).Permit 15units per panel(max) and mark "X" on both sides of the bad units.6. For the quantity of unit boards in panel board is too many(120units/panel), too difficult to stamp E/T mark on the unit board.Stamp only one E/T mark on the breakaway tab of panel board.SHENZHEN GAINBASE P.C.B CO.LTDToward Zero Quality Defect。