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二次配通俗解释电工领域常用的术语之一，即“二次配电”。
其实，二次配电是指电力系统中的分配电流的一项重要工作。
为了更好地理解二次配电的含义和作用，下面就让我们详细探究一下。
在电力系统中，一次配电是指电源直接向用户提供电能的过程，如发电厂输出的电能通过变电站送至用户，此为一次配电。
而一次配电通常使用较高的电压进行输送，以减小输电损耗。
然而，高压电不能直接供给用户使用，因此需要通过二次配电将电能转换成适合用户使用的低压电。
二次配电主要涉及变电站、配电室和配电设备等组成部分。
变电站是将高压电能转换为低压电能的场所，而配电室则是将变电站的输出电能分配给各个用户的地方。
配电设备包括变压器、开关设备、保护装置等，它们的作用是确保电能经过二次配电后能稳定、安全地供给用户使用。
从组成部分来看，二次配电系统相对一次配电系统来说更加复杂。
二次配电系统需要考虑的因素包括负载特性、电压稳定性、电能浪费等。
其中，负载特性是指各个用户对电能的需求不同，需要根据用户的用电情况进行科学合理的分配。
电压稳定性是指在二次配电过程中，要保证供给用户的电压稳定在合理的范围内，以保证各种电器设备的正常运行。
电能浪费则是指在配电过程中，电能的浪费现象应尽量减少，以提高能源利用效率。
二次配电系统在实际应用中有着广泛的应用。
无论是城市的住宅小区、商业区还是工业园区，都需要通过二次配电系统来供给电能。
二次配电系统不仅需要满足电能的需求，还要保证供电的可靠性和安全性。
因此，在设计二次配电系统时，电力工程师需要充分考虑各种因素，并合理规划和配置电力设备。
总之，二次配电是电力系统中不可或缺的一环，它将高压电能转换为低压电能，以供给用户使用。
它需要经过变电站、配电室和配电设备等组成部分来实现，同时需要考虑负载特性、电压稳定性和电能浪费等因素。
二次配电系统对于保证电能的供给可靠性和安全性至关重要，因此在建设和维护二次配电系统时要充分考虑各种因素，以确保用户正常用电的需求得到满足。
半导体二次配系统介绍《半导体二次配系统介绍篇一》半导体二次配系统，这玩意儿听起来就很“高大上”，但其实也没那么神秘啦。
我刚接触的时候，那真的是一头雾水，就像掉进了一个装满高科技零件的迷宫，完全找不着北。
咱先说说这个二次配系统的作用吧。
简单来讲，它就像是半导体生产这个大舞台背后的“后勤部队”。
半导体制造那可是超级精密的活儿，就好比在米粒上雕刻一样，容不得半点差错。
一次配系统就像是把原材料和主要的设备先连接起来，搭起了一个大框架。
那二次配系统呢？它就是来完善这个框架的各种小细节的。
比如说，它要把各种气体啊、化学品准确无误地送到该去的地方，就像快递小哥把包裹精准地送到每家每户一样。
我记得有一次去参观一个半导体工厂，看到那些二次配系统的管道，密密麻麻的，像蜘蛛网一样。
当时我就想，这得有多复杂啊！这些管道输送的气体可有讲究了，有的像氢气这种易燃易爆的，就像是一个脾气火爆的小怪兽，稍微有点差错就可能“发威”，所以二次配系统得把它管得死死的，确保它安全地到达目的地。
还有那些化学品，有的腐蚀性很强，就像一个慢慢侵蚀一切的“小恶魔”，二次配系统的管道材料得能抵抗住它的“侵蚀”才行。
也许有人会说，二次配系统不就是些管道和连接装置嘛，有那么重要吗？嘿，这可就大错特错了。
要是没有二次配系统，那些昂贵的半导体制造设备就像是没了粮草的士兵，根本没法正常工作。
你想啊，设备都“饿肚子”了，还怎么生产出那些高科技的半导体芯片呢？这就好比你要做饭，没有燃气或者水，那你只能干瞪眼。
从技术层面来说，二次配系统的设计也是很有挑战性的。
它得考虑到流量的控制，就像控制水龙头流水的大小一样。
流量太大了，可能会把设备给“撑坏”；流量太小了，又达不到生产的要求。
而且不同的生产环节对气体和化学品的纯度要求也不一样，这就像是不同的人对食物的口味要求不同一样。
二次配系统就得像个超级大厨，能根据需求调整“菜肴”的“口味”。
这中间的技术难度啊，可能只有那些真正搞这个的工程师才能深刻体会到。
Secondary process system introductionWorking characteristics1. Wafer factory2. Fab features and capabilities of the gas required3. Chemical substances and their properties required for fab4. Work contents1. Wafer factoryFAB is a modern plant producing chips, the main workplace for the cleanroom. Clean room is a constant temperature and humidity, temperature is 21 ° c. Relative humidity 65%. Fab clean rooms divided into the diffusion zone (furnace batch), yellow, etching, thin film areas.2. Fab features and functionality of the gas requiredDue to the manufacturing process on the need and use of many kinds of gases in semiconductor factories. We generally are based on gas properties to distinguish words. Specialty gases and gas can be divided into two broad categories. The former to use less gas. Such as SiH4, and NF3 . Which use large amounts of gas. Such as N2, and CDA . Due to a larger amount; General gas often in " bulk gas " call. The Bulk Gas. Specialty gas -Specialty Gas.2-1 Bulk Gas In the semiconductor manufacturing process, need to provide a variety of high purity gas used in pneumatic equipment power, chemicals or pressure medium is used as an inert environment, or take part in the reaction or to remove impurities, such as different functions.Because of increasingly sophisticated semiconductor production, its requests for gas purity is ever mentioned. Semiconductor factory will be briefly described below the general quality requirements and the necessary equipment for gas and its functions.2-1-1Bulk gas products:Bulk gas Semiconductor plants can use, there are generally CDA 、GN2 、PN2 、PAr 、PO2 、PH2 、PHe 7 Species.2-1-2 Bulk gas manufacturing:<1> CDA/ICA(Clean Dry Air)Clean, dry air.CDA Sources taken from the air compressed by compressor dehumidifier, then by a filter or activated carbon adsorption to remove dust and hydrocarbons to supply the clean room CDA/ZCD 。
Secondary process system introductionWorking characteristics1. Wafer factory2. Fab features and capabilities of the gas required3. Chemical substances and their properties required for fab4. Work contents1. Wafer factoryFAB is a modern plant producing chips, the main workplace for the cleanroom. Clean room is a constant temperature and humidity, temperature is 21 ° c. Relative humidity 65%. Fab clean rooms divided into the diffusion zone (furnace batch), yellow, etching, thin film areas.2. Fab features and functionality of the gas requiredDue to the manufacturing process on the need and use of many kinds of gases in semiconductor factories. We generally are based on gas properties to distinguish words. Specialty gases and gas can be divided into two broad categories. The former to use less gas. Such as SiH4, and NF3 . Which use large amounts of gas. Such as N2, and CDA . Due to a larger amount; General gas often in " bulk gas " call. The Bulk Gas. Specialty gas -Specialty Gas.2-1 Bulk Gas In the semiconductor manufacturing process, need to provide a variety of high purity gas used in pneumatic equipment power, chemicals or pressure medium is used as an inert environment, or take part in the reaction or to remove impurities, such as different functions.Because of increasingly sophisticated semiconductor production, its requests for gas purity is ever mentioned. Semiconductor factory will be briefly described below the general quality requirements and the necessary equipment for gas and its functions.2-1-1Bulk gas products:Bulk gas Semiconductor plants can use, there are generally CDA 、GN2 、PN2 、PAr 、PO2 、PH2 、PHe 7 Species.2-1-2 Bulk gas manufacturing:<1> CDA/ICA(Clean Dry Air)Clean, dry air.CDA Sources taken from the air compressed by compressor dehumidifier, then by a filter or activated carbon adsorption to remove dust and hydrocarbons to supply the clean room CDA/ZCD 。
CDA System:Air compressor Buffer storage tank cooling dryerFilter CDA<2> GN2Compressed using compressor cooling gas into liquid gas. Catalytic converter, CO reaction to CO2, H2, reaction to H2O, then sieve absorption of CO2, and H2O And then slip separation O2&CnHm.N2=-195.6°C O2=-183°CPN2GN2 Through the Purifier (Purifier) Purification, producing high purityN2 。
Liquid original nitrogen purity99.9999%After purification for purification of nitrogen purity99.9999999%GN2&PN2 System(See attached map)<3> PO2Compressor compressed cooled gas into liquid gas, awarded by second slip 99% Above in purity O2 And then drop N2 、Ar 、CnHm 。
Another by electrolytic dissociation H2&O2PO2 System(See photos)<4> PArCompressor compressed cooled gas into liquid gas, awarded by second slip 99.0% More purity argon. Ar content in the air is only 0.93%. Production costs are relatively high.PAr System (See attached map)<5> PH2Compressor compressed cooled gas into liquid gas, awarded by second slip 99.0% Above in purity H2 。
Also by H2O electrolytic dissociation H2&O2. High hazard manufacturing cheap but easy to trigger explosions.PH2 System (See attached map)<6> PHeRare and rich He Extracted from natural gas, its main origin for the United States, and Russia. Air compressors compressed cooled gas in liquid, easily obtained from the slip.He lium=-268.9°C Methane (Methane)= -161.4°CPHe System (See attached map)2-1-3 Use of bulk gases in semiconductor plantsCDA Main supply FAB Pneumatic device powered air source and blowing (Purge),Local Scurruber Fuel it.ICA Main facility system pneumatic equipment-powered gas source and blowing.N2Main supply part of the pneumatic equipment air supply or supply blowing and dilute source of pressure of inert gas and chemical delivery.O2Supply ETCH -Process oxidizer needed and CPCVD Supplies oxidation process with business routine supply O3 Generator Required O2 Supplies and other processes required.Ar Supply Sputter Manufacturing process and ion sputtering heat transfer media Chamber Dilution and inert gas environment.H2Feeding tube devices burning mix of oxygen, POLY Manufacturing process H2 BAKE Purposes. W-PLUG manufacturing process as WF6 for the reduction of gas and other processes.He Pressure medium supply chemicals and processing chips cool.Bulk Gas Although not as Specialty Gas , Some with highly toxic and corrosive. But we still need to pay attention to safety using a bulk gas. GN2, and PN2, and PAr, and PHe has the danger of suffocating, that gas is colorless and odorless, massive emission of lead in the air contain O2 ( Usually 21%), decreased to 16% below, namely, headaches and nausea. Dang O2 less to 10% Shi, who will be in a State of the will is not clear,6% , instantly Faints, unable to breathe,6 minutes less than death. PH2 due to leakage or when mixing, concentration of his own as long as the H2 of the blast RADIUS (4%-75%) (air), if they got the fire burning this gas is mixed. PO2 will make material easily oxidized to yield burning, causing fire mishap. Therefore, our works in the semiconductor, in the design, construction, and how to avoid leaks, and how to protect themselves from, you are one of our hard work.2-2 Specialty GasUsed by the semiconductor factory Specialty Gas A wide range of about 40 or 50, according to risks can be divided into the following categories:2-2-1 Flammable gasesWhen some leaks gas when mixed with, as long as his own concentration in a certain range (air), if they got the fire, this gas is burning from the mix. This called the explosion of the gas range. Such as:SiH4 1.35%-100% SiH2CL2 4.1%-98.8% PH3 1.32%-100%2-2-2 Low pressure gasSome gases under normal for the viscous liquid gas at room temperature of saturated vapor pressure is less than 10Psi , Can also interfere with pipeline blocked, need to pack heat, improving the air vapor pressure can be an adequate supply of gas. For example:DCS, and CLF3, and WF62-2-3 Toxic gasSome gases due to its strong reaction of animals (including humans)respiratory and mucous membranes, skin and other features with a strong impact. Such as:NF3,PH32-2-4 Corrosive gasesSome gas and water effects, that is produced by hydrolysis HCL HF Acidic substances such as, the human body (including eyes, nose, skin, respiratory system, etc) and equipment (such as piping and valves) havea corrosive effect. This gas has the following:<1> HCL、CL2 、SiH2CL2 、BCL3 CL Elements of gas---HCL<2> BF3、SiF4 、WF6 F Element---HF<3> NH3---Ammonia water Very irritating2-2-5 Asphyxiant gasesSuch as: CO2 、CF4 、C2F6 Such gases, odorless and tasteless. If a large number of emission of air caused by O2 content reduced to 16% when the headache and nausea. Dang O2 less to 10% Shi, who will be in a State of the will is not clear,6% , instantly Faints, unable to breathe,6 minutes less than death.2-2-6 Spontaneous combustion gasesSome of the gases, mixed with the air, even without the fire catches fire spontaneously burst into flames. This is called spontaneous combustion gases. Its fire at room temperature. This gas are:SiH4、PH3 、B2H6Though we cannot exclude these gases can cause various adverse effects on us. But we working in semiconductor plants, may be included in the design, construction, and stop loss. To avoid leaks, he stressed. 3． Fabs require chemical substances and their properties3-1 Types of chemicals (solvents)C260、EKC-270 、NMP 、OK-73 、A515 、IPA In addition to EKC-270 PFA/304 BA Tube, others use 316L EP Tube. Take over the way with VMB outlet and themachine inlet side takes over.3-2 Chemical species (pH class)HF1%、HF49% 、H2O2 、NH4OH29% 、DEVELOPER 、M1 、BOE 200:1 、BOE 500:1、BOE 50:1 、HNO3 、HCL 、H3PO4 、H2SO4 。
