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《中波广播发射台理论基础与实践技术手册》介绍【作者】庄涛【出版社】光明日报出版社【索书号】 ISBN 978-7-5112—6624-8【字数】 488千字(427页)【馆藏地点】样本书库【定价】 120元内容简介《中波广播发射台理论基础与实践技术手册》一书,是专门为中波广播发射台站值机员、技术人员编写的一本实用书籍，目的是为提高中波发射台值机员的业务理论知识和实际操作技能，为技术培训、职业技术鉴定提供科学、规范的依据。
本书内容涵盖了中波广播发射台值机员及技术管理人员应知应会的理论性知识和实践性知识。
全书共十二个章节,分别是：广播发展简史、中波广播理论综述、中波发射台概况、电工电子技术、仪器仪表的操作、信号源系统、DAM全固态数字调制中波发射机、PDM中波发射机的原理与维修、天馈线系统、自动化监控系统、配电系统、发射台技术防护，以及发射台理论知识要点总结、中波发射台技术能手竞赛试题精选和中波专业术语名词解释等四个附录。
本书特点抛去了繁杂的理论赘述和计算公式，以分类、特点、方法为基本内容；注重内容的可操作性和实用性。
以够用为度,图文并茂，通俗易懂,便于自学，便于查询。
内容既有初级值机员应知应会的理论与实践知识，又有高级值机员应具备的解决复杂问题的理论与实践知识，更加符合中波台各层次值机员的认知水平,特别适合做中波台技术人员的培训教材使用(本书有配套教学PPT课件,需另购)。
作者简介庄涛，大专学历,高级工程师，从事自动化电气设备的安装与维修工作，有三十多年的基础电器维修实践经验，具有较强的实际操作动手能力。
一九九八年从部队转业到河南省潢川中波台工作，从事中波技术维护工作，先后发表过二十多篇中波发射相关技术论文。
自主研发或创新的DX系列全固态中波发射机故障查询系统、多路循环监听控制器、中波发射台信号源系统的整合等项目曾分获河南省广播电影电影电视局科技创新一、二、三等奖。
本书配套教学PPT课件为了配合中波值机员培训，本书各章节都有配套教学PPT课件，PPT课件的特点是清新、生动、信息量大，通过现代化多媒体投影仪实用,能够优化课堂教学,调动课堂气氛，增加学员的理解和记忆程度.彻底改变了“一本书、一支粉笔、一块黑板”单调的教学模式。
电工电子学课后习题答案目录电工电子学课后习题答案....................................... 错误!未定义书签。
第一章电路的基本概念、定律与分析方法....................... 错误!未定义书签。
练习与思考........................................... 错误!未定义书签。
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第二章正弦交流电 ........................................... 错误!未定义书签。
课后习题............................................. 错误!未定义书签。
第三章电路的暂态分析....................................... 错误!未定义书签。
第四章常用半导体器件....................................... 错误!未定义书签。
第五章基本放大电路......................................... 错误!未定义书签。
第六章集成运算放大器及其应用............................... 错误!未定义书签。
第七章数字集成电路及其应用................................. 错误!未定义书签。
第八章 Multisim简介及其应用................................. 错误!未定义书签。
第九章波形的产生与变换...................................... 错误!未定义书签。
第十章数据采集系统 ......................................... 错误!未定义书签。
ADVANCE DATA SHEETSKY77435 Front-End Module for WCDMA / HSDPA / HSUPA (Tx 1710-1770 MHz), (Rx 2110-2170 MHz)Applications •Digital cellular (WCMDA) handsetsFeatures•High Speed Downlink Packet Access (HSDPA) •High Speed Uplink Packet Access (HSUPA)•Low quiescent current-20 mA•Low current consumption -530 mA •Integrated Power Detector •16-pad package •Small profile-7 mm x 4 mm x 1.1 mm •Low voltage-3.1 V–4.45 V •Digital enable pad •Highly integrated, user friendly solution •InGaP HBT •Integrated interstage filter and duplexer •Requires few external componentsDescriptionThe SKY77435 Front-End Module (FEM) is a fully matched, 16-pad surface mount module developed for WCDMA applications. Small and efficient, this WCDMA FEM integrates the interstage filter, the input matching, the power amplifier, the output matching, the power detection, and the duplexer into a single 7 mm x 4 mm x 1.1 mm package.The SKY77435 meets the stringent spectral requirements of HSDPA standards up to 25.2 dBm output power. The FEM incorporates an InGaP HBT PA and contains circuitry to optimize power detector performance. Different control pads are available to enhance the performance of the FEM at different power levels.Integration of the RF front-end greatly simplifies the design of the handset radio as all critical matching between the interstage filter, PA, power detection, and duplexer is optimized within the module. By optimizing the efficiency of the InGaP HBT PA MMIC and reducing the RF loss between the integrated components, this FEM achieves current as low as 450 mA at maximum output power (25.2 dBm) that significantly improves the talk time of the WCDMA handset. This small package uses Skyworks’ low cost, multi-laminate substrate technology and is approximately half the size of individually packaged component solutions. The SKY77435 front-end module can save handset designers significant board space and design-cycle time.Figure 1. Functional Block DiagramADVANCE DATA SHEET SKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HSUPATx (1710-1770 MHz), Rx (2110-2170 MHz)Electrical SpecificationsThe following tables list the electrical characteristics of the SKY77435 Front-End Module for WCDMA. Table 1 lists the absolute maximum ratings and Table 2 specifies therecommended operating conditions necessary to achieve the electrical performance listed in Table 3. Table 4 through Table 7 defines the standard test configurations for WCDMA, HSDPA, and HSUPA modes. Table 8 provides specifications for PowerDetection. Table 9 and Table 10 specifies the Nominal Duplexer Performance for Band IV and Band X, respectively..Table 1. Absolute Ratings 1Parameter Symbol Minimum Nominal Maximum U nitRF Input Power P IN — — 10.0 dBm No RF —3.46.0VoltSupply VoltagesWith RFV CC1, V CC2, V BIAS— 3.4 4.7 VoltBias Control Voltage V CONT — — 2.7 VoltMode Control Voltage V MODE — — 3.0 VoltsEnable Control Voltage V EN — — 3.0 VoltOperating T CASE –20 +25 +110 TemperaturesStorage T STG –55 — +125°C 1 No damage assuming only one parameter at a time is set to limit with all other parameters set at nominal values.Table 2. Recommended Operating ConditionsParameter Symbol Minimum Nominal Maximum U nitTx Channel Center Frequency F T X 1712.4 1740.0 1767.6 MHz Rx Channel Center Frequency F R X = F T X + 400 MHz2112.42140.02167.6MHzV CC1, V CC2 3.1 1 3.4 4.45 Supply VoltagesV BIAS 3.1 3.4 4.45Volt Bias Control Voltage V CONT 0.5 — 1.9 VoltLow Power Mode (LPM) V MODE_L 1.5 1.8 2.85 Mode ControlHigh Power Mode (HPM)V MODE_H 0.0 0.0 0.56Volt Disabled V EN_L 0.0 0.0 0.56 Enable Control Setting EnabledV EN_H 1.5 1.8 2.85Volt Operating TemperatureT CASE –20 +25 +85 °C1 For V CC < 3.4 V, maximum output power = P MAX2SKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HS U PA ADVANCE DATA SHEETTx (1710-1770 MHz), Rx (2110-2170 MHz)Table 3. Electrical Specifications for Nominal Operating Conditions 1Parameter Symbol Conditions Minimum Typical Maximum U nitP MID HPM, LPMV CC ≥ 3.1 V 10.0 — — P MAX2 HPMV CC ≥ 3.1 V 24.4 — — Linear Output PowerP MAX1 HPM25.2——dBm Mid Power G MID LPMP MID 11.0 — 23.0 GainHigh Power G HIGHV CC = 3.4 V P MAX1T CASE = 25 °C 19.5 — 28.5dB Gain Flatness Over Frequency ΔG PWR Each Tx Frequency –2.5 — 2.5 dBMid Power LPM P MID— — 50Band IV High PowerP MAX1 — — 530 Mid PowerLPMP MID— — 50Current ConsumptionBand X High PowerI CCP MAX1 —— 530 mA Mid Power PAE_MID LPMP MID5.4 — —Band IV High Power PAE_HIGHP MAX1 18.4 — —Mid Power PAE_MID LPM P MID5.4 — —Power Added EfficiencyBand X High Power PAE_HIGHP MAX1 18.4 — —% Error Vector MagnitudeEVM — 5 % 5 MHz ACL1 —–40—Adjacent Channel Leakage Ratio 210 MHzACL2—— –54 —dBcSecond 2f O — — –33 Harmonic SuppressionThird 3f OP MAX1 — — –33 dBm NRx1 P MAX1869–894 MHz RBW = 3.84 MHz — — –61 NRx2 P MAX11575.42 MHz RBW = 2.046 MHz — — –100NRx3 P MAX11930–1990 MHz RBW = 3.84 MHz — — –61NRx4 P MAX12110–2170 MHz RBW = 3.84 MHz — — –114Tx Noise Power in Rx BandNRx5 P MAX12400–2483.5 MHz RBW = 1.0 MHz— — –90dBmADVANCE DATA SHEET SKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HSUPATx (1710-1770 MHz), Rx (2110-2170 MHz)Table 3. [continued] Electrical Specifications for Nominal Operating Conditions 1MaximumU nit Parameter Symbol Conditions MinimumTypicalInput Voltage Standing Wave Ratio VSWR — — — 2:118mA—Quiescent Current I CQ — —mA1—Control Current I BA ——mA1——Digital Enable Current I EN —— — 20 μALeakage Current I LEAK V CC1, V CC2, V BIAS = 4.45 VV CONT = 0 VV EN = 0.2 VV MODE_H = 0 VStability (spurious output) S 8:1 VSWR, all phases — — –65 dBc10:1——Ruggedness 3 Ru—1Unless otherwise specified: V CC = 3.4 V, Temp. = 25 °C.2For STC1 WCDMA, STC2 HSDPA, and STC3 HSUPA modes test conditions. For STC4 HSUPA, power back off = 2.6 dB.3ACLR is specified per 3GPP as the ratio of in-band power to adjacent power, both measured in 3.84 MHz bandwidth at specified offsets.4All phases, time = 10 seconds, continuous WCDMA/HSDPA modulated signal.Table 4. Standard Test Configuration – STC1 WCDMA ModeParameter Level Spread Code Spread Factor I/Q βc βd βhs βec βed Relative Power (dB)kbps 0 256 Q 8/15 — — — — –6.547DPCCH 15kbps 16 64 I — 15/15 — — — –1.087DPDCH 60Table 5. Standard Test Configuration – STC2 HSDPA ModeParameter Level Spread Code Spread Factor I/Q βc βd βhs βec βed Relative Power (dB)kbps 0 256 Q 12/15 — — — — –7.095DPCCH 15kbps 16 64 I — 15/15 — — — –5.157DPDCH 60kbps 64 256 Q — — 24/15 — — –3.01215HS-DPCCHTable 6. Standard Test Configuration – STC3 HSUPA ModeParameter Level Spread Code Spread Factor I/Q βc βd βhs βec βed Relative Power (dB)kbps 0 256 Q 8/15 — — — — –19.391DPCCH 15DPDCH 960kbps 1 4 I — 15/15 — — — –13.931HS- DPCCH 15 kbps 64 256 Q — — 8/15 — — –19.391kbps 1 256 I — — — 10/15 — –17.338E-DPCCH 15kbps 2 4 I — — — — 71.5/15 –0.371E-DPDCH 960SHEETSKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HSDATAU PA ADVANCETx (1710-1770 MHz), Rx (2110-2170 MHz)Table 7. Standard Test Configuration – STC4 HSUPA ModeParameter Level Spread Code Spread Factor I/Q βc βd βhs βec βed Relative Power (dB)kbps 0 256 Q 6/15 — — — — –12.499DPCCH 15kbps 1 4 I — 15/15 — — — –4.540DPDCH 960HS- DPCCH 15 kbps 64 256 Q — — 2/15 — — –22.041kbps 1 256 I — — — 12/15 — –6.478E-DPCCH 15kbps 2 4 I — — — — 15/15 –4.425E-DPDCH 960Table 8. Electrical Specifications for Power DetectorTx Power DetectionU nitMaximumTypicalCharacteristic Symbol Conditions MinimumdBm26.2Power Detect Range P DET0.0—Detector Output Range V DET 3 dBm ≤ P O ≤ 26.2 dBm 400 (rms) — 1800 (peak)mVTable 9. Nominal Duplexer Performance – Band IV7Antenna to Rx ParameterMaximumU nitTypicalCharacteristic Symbol Conditions MinimumInsertion Loss IL Rx2110 MHz…2170 MHz — — 2.5 dBRipple Each Rx Frequency –0.5 — 0.5 dB—dBAttenuation—DC (12750)MHz 20A R X1390 MHz…410 MHz 40 — —A R X2703 MHz…724 MHz 30 — —A R X31055 MHz…1085 MHz 45 — —A R X41310 MHz…1370 MHz 35 — —Tx Band A R X51710 MHz…1770 MHz 50 — —A R X61910 MHz…1970 MHz 25 — —Tx + Rx A R X73820 MHz…3940 MHz 35 — —2Tx + Rx A R X85530 MHz…5710 MHz 35 — —2.0:1—VSWR ——dBm—30Input ——Tx Power @ Rx Port 1710 MHz…1770 MHz— — –25 dBmP MAX1ADVANCE DATA SHEET SKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HSUPATx (1710-1770 MHz), Rx (2110-2170 MHz)Table 10. Nominal Duplexer Performance – Band X8Antenna to Rx ParameterU nitMaximum Characteristic Symbol Conditions MinimumTypicalInsertion Loss IL Rx2110 MHz…2170 MHz — — 2.8 dBRipple Each Rx Frequency –0.5 — 0.5 dBDC (12750)——AttenuationMHz 20dBA R X1390 MHz…410 MHz 40 — —A R X2703 MHz…724 MHz 30 — —A R X31055 MHz…1085 MHz 45 — —A R X41310 MHz…1370 MHz 35 — —Tx Band A R X51710 MHz…1770 MHz 50 — —A R X61910 MHz…1970 MHz 25 — —Tx + Rx A R X73820 MHz…3940 MHz 35 — —2Tx + Rx A R X85530 MHz…5710 MHz 35 — ——2.0:1—VSWR —30dBm—Input ——Tx Power @ Rx Port 1710 MHz…1770 MHz— — –25 dBmP MAX1SKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HS U PA ADVANCE DATA SHEETTx (1710-1770 MHz), Rx (2110-2170 MHz)Evaluation Board DescriptionThe evaluation board is a platform for testing and interfacingdesign circuitry. To accommodate the interface testing of the SKY77435, the evaluation board schematic and the basicassembly diagram are included for preliminary analysis and design. Figure 2 is a simple schematic of the board assembly in Figure 3.Figure 2. SKY77435 Evaluation Board Schematic DiagramFigure 3. SKY77435 Evaluation Board Assembly DiagramADVANCE DATA SHEET SKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HSUPATx (1710-1770 MHz), Rx (2110-2170 MHz)Package DimensionsThe SKY77435 is a multi-layer laminate base, overmoldencapsulated modular package designed for surface-mounted solder attachment to a printed circuit board. Figure 4 is amechanical drawing of the pad layout for this package. Figure 5provides a recommended phone board layout footprint for the FEM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50 ohmterminals.Figure 4. Dimensional Diagram for 7 x 4 x 1.1 mm, 6-Pad Package (All Views) – SKY77435SHEET SKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HSDATAU PA ADVANCETx (1710-1770 MHz), Rx (2110-2170 MHz)Figure 5. Phone PCB Layout Footprint for 7 x 4 mm, 16-Pad Package – SKY77435ADVANCE DATA SHEET SKY77435 FRONT-END MODULE FOR WCDMA/HSDPA/HSUPATx (1710-1770 MHz), Rx (2110-2170 MHz)Package DescriptionFigure 6 shows each pad name and the pad numberingconvention, which starts with pad 1 in the upper left, as indicated and increments counter-clockwise around the package. Figure 7illustrates typical case markings.Figure 6. SKY77435 16-Pad Configuration – (Top View)Figure 7. Typical Case Markings (Top View)Package Handling InformationBecause of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.The SKY77435 is currently qualified for MSL3/260 °C. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part isattached in a reflow oven, the temperature ramp rate should not exceed 3 °C per second; maximum temperature should notexceed 260 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J–STD–020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel – RF Modules, Document Number 101568. Electrostatic Discharge Sensitivity (ESD)To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class 1 ESD handling precautions listed below.• Personnel Grounding - Wrist Straps- Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges• Protective Workstation - Dissipative Table Top- Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors• Facility- Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 Ω to GND) • Protective Packaging and Transportation - Bags and Pouches (Faraday Shield)- Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts- Protective Work Order HoldersOrdering InformationModel Number Manufacturing Part Number Product Revision Package Operating Temperature SKY77435 SKY77435 MCM 4 x 7 x 1.1 mm –20 °C…+85 °CRevision HistoryRevision Date DescriptionA December 2, 2008 Initial Release – Advance InformationReferencesSkyworks Application Note: Tape and Reel – RF Modules, Document Number 101568Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752JEDEC Standard J–STD–020© 2008, Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, “Breakthrough Simplicity,” DCR, Helios, HIP3, Innovation to Go, Intera, iPAC, LIPA, Polar Loop, and System Smart are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.。
目录1．目的与任务 (1)2.教学内容基要求 (1)3.设计的方法与计算分析 (1)3.1 74H C138芯片简介 (1)3.2 电路设计 (3)3.3功耗与延时计算 (6)4.电路模拟 (14)4.1直流分析 (15)4.2 瞬态分析 (17)4.3功耗分析 (19)5.版图设计 (19)5.1 输入级的设计 (19)5.2 内部反相器的设计 (19)5.3输入和输出缓冲门的设计 (22)5.4内部逻辑门的设计 (23)5.5输出级的设计 (24)5.6连接成总电路图 (24)5.3版图检查 (24)6.总图的整理 (26)7.经验与体会 (26)8.参考文献 (26)附录 A 电路原理图总图 (28)附录B总电路版图 (29)集成1. 目的与任务本课程设计是《集成电路分析与设计基础》的实践课程，其主要目的是使学生在熟悉集成电路制造技术、半导体器件原理和集成电路分析与设计基础上，训练综合运用已掌握的知识，利用相关软件，初步熟悉和掌握集成电路芯片系统设计→电路设计及模拟→版图设计→版图验证等正向设计方法。
2. 教学内容基本要求2.1课程设计题目及要求器件名称：3-8译码器的74HC138芯片 要求电路性能指标：⑴可驱动10个LSTTL 电路（相当于15pF 电容负载）； ⑵输出高电平时，OH I ≤20uA,min,OH V =4.4V; ⑶输出低电平时，OLI ≤4mA ，manOL V , =0.4V⑷输出级充放电时间r t =ft ，pdt ＜25ns ；⑸工作电源5V ，常温工作，工作频率workf =30MHZ ，总功耗maxP =15mW 。
2.2课程设计的内容 1. 功能分析及逻辑设计； 2. 电路设计及器件参数计算；3. 估算功耗与延时；4. 电路模拟与仿真；5. 版图设计；6. 版图检查：DRC 与LVS ；7. 后仿真(选做)；8. 版图数据提交。
2.3课程设计的要求与数据1. 独立完成设计74HC138芯片的全过程；2. 设计时使用的工艺及设计规则： MOSIS:mhp_ns5；3. 根据所用的工艺，选取合理的模型库；4. 选用以lambda(λ)为单位的设计规则；3. 设计的方法与计算分析3.1 74HC138芯片简介74HC138是一款高速CMOS器件，74HC138引脚兼容低功耗肖特基TTL 系列图3-1 74HC138管脚图表3-1 74HC138真值表由于74HC138芯片是由两个2-4译码器组成，两个译码器是独立的，所以，这里只分析其中一个译码器。
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在程序设计中，我们已验证的先进技术将给予你强大的动力和空前的灵活性。
Six Sigma 质量标准设计方法保证了超强的可靠性。
业界领先的质量与革新手掌大小的尺寸，强大且经济VersaMaxNano和M icro PLC 的一体化结构节约了盘柜空间。
了更多的功能。
R新的 PACSystems 系列控制器具有轻便的应用机制，使其能够通过简单地更改几个设置即可把原有的平个独特的解决方案来满足控制应用的需求。
既可单独使用，也可与 HMI 和控制软件捆绑使用。
VersaMax 把一系列离散量、模拟量、混合的和特殊的 I/O 模块包含在一个小型系统中，却提供了大型 PLC 的性能。
置功能多样的控制系统。
出众的网络和通信能力，使得您可以使用开放的网络来组网、传送数据、上载和下载程序并进行诊断。
易于集成新的技术到已安装的基本系统中。
控制器提块，通过各种各样的网络进行通信，并支持系一整套在线开发工具帮助您进行调试，并很快地解决问题；PACSystems 系统为现有的PLC 技术提供了增强的速度和能力，以进行高速处理和通信，同时还加强了存储任务例如配方储存和数据记集成的解决方案要求有开放的结构、大量的与其近的高级诊断功能相关联，系列已经成为复杂应用的工业标准，点数和大量用户可以进一步丰富其定制化的系统结构，总线的单板计算机模块和特殊模块，还是运动控制器，来定制用户化的单机或者是分布式调试应用软件 —— M achine Edition —— 一整套控制硬件的核心CPU................................................................................................................................................................................................................................................背板 （机架）.......................................................................................................................................................................................................................电源模块....................................................................................................................................................................................................................................离散量I/O 模块 （输入）.............................................................................................................................................................................................模拟量I/O 模块 （输入）.............................................................................................................................................................................................RX3i 全新的8通道通用模拟量输入模块..............................................................................................................................................................离散量I/O 模块 （输出）...................................................................................................................................................................................................................模拟量I/O 模块 （输出）...................................................................................................................................................................................................................毫伏模拟量输入模块...............................................................................................................................................................................................................................RTD 输入模块 ...............................................................................................................................................................................................................................................张力输入模块................................................................................................................................................................................................................................................热电偶输入模块..........................................................................................................................................................................................................................................通讯模块............................................................................................................................................................................................................................................................特殊模块............................................................................................................................................................................................................................................................运动控制模块................................................................................................................................................................................................................................................本地和远程I/O 扩展模块.....................................................................................................................................................................................................................附件.......................................................................................................................................................................................................................................................................电缆............................................................................................................................................................................................................................................. .........................第一章 PACSystems RX3i 控制器.......................................................................................................................................................................................第二章 PACSystems RX7i 控制器....................................................................................................................................................................................CPU.............................................................................................................................................................................................................................................机架............................................................................................................................................................................................................................................电源...........................................................................................................................................................................................................................................离散量I/O 模块 （输入）...........................................................................................................................................................................................模拟量I/O 模块 （输入）..........................................................................................................................................................................................离散量I/O 模块 （输出）..........................................................................................................................................................................................模拟量I/O 模块 （输出）...........................................................................................................................................................................................I/O 接口模块.........................................................................................................................................................................................................................通信模块.................................................................................................................................................................................................................................特殊模块.................................................................................................................................................................................................................................扩展电源模块......................................................................................................................................................................................................................扩展机架.................................................................................................................................................................................................................................附件...........................................................................................................................................................................................................................................电缆...........................................................................................................................................................................................................................................目 录12346911162123242526282930323333353637383942454850515253545555第一章 PACSystems RX3i 控制器 1PACSystems RX3i 控制器第一章 PACSystems RX3i 控制器全新的控制器 RX3i 是 PACSystems 可编程自动化控制器 （PAC ） 家族的最新成员。
C.A 771, C.A 771 IP2XC.A 773, C.A 773 IP2X CAT IV 1,000 V Voltage Absence Testers (VATs) Array indoor and outdoor low-voltageUse in extreme conditions: type-S extended climatic classExtended continuity test (R< 2 kΩ, 60 kΩ and 300 kΩ)Two-pole phase-sequence testing with "2-wire method"up to 400 Hz, suitable for isolating transformers andCAT IV 1 000 V CEI 61243-3edition 2C.A 771 & C.A 773: beyond the standard recommendations• A comprehensive integrated autotest with indication of the type of fault.The C.A773 also displays a text message for complete information.• The C.A 771 & C.A 773 VATs benefit from IP65 protection for indoor and outdooruse, which is significantly higher than the IP54 rating required by the standard.• Extended class : for extreme environments, the C.A 771 can be used for measurements from -30 °C to + 60 °C (type S).• Audible and visual continuity indication up to 100 Ω, in compliance with therecommendation in Appendix B of the standard.• The test probes are removable to meet specific requirements or to complywith the legislation in certain countries. Various models are available, including IP2X versions.AC and DC voltage testingVoltage detection takes priority, is automatic and is indicated by distinct visual and audible signals:• Visual: bargraph• Audible: loud intermittent beepStray voltages can be detected by pressing two buttons simultaneously (double command) in order to switch to low-impedance mode. Crucial redundant safety:An (Extra-Low Voltage) LED is a redundant safety feature which lights up when the voltage present is higher than the ELV(50 V ac /120 V dc ). The higher the voltage present, the faster it flashes.Single-pole phase detectionYou can detect the phase simply by establishing contact with one of the test probes.FUNCTIONSSTANDARDSContinuity and resistance testingBy pressing the continuity button, you can check that the conductors are correctly connected. Continuity (R < 100 Ω) is indicated by a loud, continuous audio signal.In addition, the C.A 771 offers an extended continuity test and can be used to display the higher values via 3 thresholds (2 kΩ, 6 kΩ and 300 kΩ). The C.A 773 displays the resistance value directly.2-wire phase rotation with microprocessorSimple and quick, the 2-wire phase rotation function with microprocessor is useful in all circumstances, including on installations powered by an electrical generator set or behind an isolating transformer.Residual Current Device (RCD) trip test up to 30 mABy simultaneously pressing the double command , you can cause a fault current sufficient to trip the RCD to flow through a low-impedance load.CAT IV 1,000 V Voltage Absence Testers (VATs)C.A 771 - C.A 773Voltage Absence Testing: a clearly-defined procedureIn the context of work on installations connected to the electricity distribution network, the standards stipulate that the measurements must be performed with the power off to avoid electrical hazards (EN 50110-1 standard, DIN VDE 0682-401, NF C 18-510, etc.).To secure the installation and ensure that it is non-current-carrying, there is a procedure called Separation which imposes the use of a Voltage Absence Tester .Low battery Cable/test probe fault+= OK906210439 - E d .1 - 02/2015 - D o c u m e n t n o n c o n t r a c t u e l. C a r a c t ér i s t i q u e s à c o n fi r m e r à l a c o m m a n d e .FRANCEChauvin Arnoux190, rue Championnet 75876 PARIS Cedex 18Tél : +33 1 44 85 44 85Fax : +33 1 46 27 73 89**********************www.chauvin-arnoux.fr INTERNATIONAL Chauvin Arnoux190, rue Championnet 75876 PARIS Cedex 18Tél : +33 1 44 85 44 38Fax : +33 1 46 27 95 59************************ SUISSEChauvin Arnoux AG Moosacherstrasse 158804 AU / ZHTél : +41 44 727 75 55Fax : +41 44 727 75 56**********************www.chauvin-arnoux.chPour informations et commandes16 mm 16 mm19 mmAPPLICATIONSVoltage up to 1,000 V ac / 1,400 V dc at up to 800 HzThe specifications of the C.A 771 and C.A 773 mean they can be used for work on all LV electrical networks, whether they are electricity distribution networks or the more specific networks encountered in naval or aviation applications.Climatic conditionsThe type-S extended climatic class allows use in extreme temperature conditions. This means it offers an operating range from -30 °C to +60 °C for applications such as:• Installations at altitude (mountains, etc.), underground installations, etc.• Refrigeration installations, greenhouses, etc.,• Service vehicles (emergency, army, etc.)• The IP65 protection rating also ensures maximum protection against solid pollutants (dust)and liquid pollutants (projections), allowing both indoor and outdoor use.Ergonomics specially designed for use in the field• Digital display (C.A 773)• 2 moulded test probes to ensure excellent handling whileprotecting against falls and shocks• Built-in torch to light the point of measurement• Removable test probes and 2 positions provided on the VATfor 16 or 19 mm spacingACCESSORIESThe C.A 753 measurement adapter can be used for measurements in total safety on European 2P+E and Schuko sockets.Its design guarantees mechanical and electrical contact with all test probes (Ø 2 mm, Ø 4 mm, IP2x, etc.).The presence of a voltage (> 200 V) and the phase position are also indicated.Position 1Position 2Removable accessories according to the requirements Isolated test probes 2 or 4 mm in diameter, IP2X tip protection and test probes.C.A 771, C.A 771 IP2X & C.A 773, C.A 773 IP2XCAT IV 1,000 V Voltage Absence Testers (VATs)References to orderC.A 771 DTT CAT IV 1 kV ...................................................P0*******C.A 771 DDT IP2X ...............................................................P0*******A C.A 773 DTT CAT IV 1 kV ...................................................P0*******C.A 773 DDT IP2X ...............................................................P0*******A State at delivery• The C.A 771 and C.A 773 are delivered with 1 operating manual in 5 languages, 2 x 1.5 V LR06/AA batteries, 1 set of removable test probes Ø 2 mm with crystal safety cover, 1 probe-tip protection, 1 Velcro strap.• The C.A 771 IP2X and C.A 773 IP2X are delivered with 1 operating manual in 5 languages, 2 x 1.5 V LR06/AA batteries, 1 set of IP2X removable test probes Ø 4 mm, 1 Velcro strap.UNITED KINGDOM Chauvin Arnoux LTDUnit 1 Nelson Ct, Flagship Sq, Shaw Cross Business Pk Dewsbury, West Yorkshire - WF12 7TH Tel: +44 1924 460 494 Fax: +44 1924 455 328**********************.uk MIDDLE EASTChauvin Arnoux Middle East P.O. BOX 60-1541241 2020 JAL EL DIB - LEBANON Tel: +961 1 890 425 Fax: +961 1 890 424************************ FRANCEChauvin Arnoux190, rue Championnet 75876 PARIS Cedex 18 Tel: +33 1 44 85 44 38 Fax: +33 1 46 27 95 59 ************************ Accessories & replacement partsCAT IV test probes for VATs ...........................................P0*******Z Test probes Ø 2 mm for VATs .........................................P0*******Z Test probes Ø 4 mm for VATs ..........................................P0*******Z Probe-tip protection for VATs ........................................P0*******Z CAT IV IP2X probes for VATs ...........................................P0*******Z IP2X Ø 4 mm probes for VATs ........................................P0*******Z MultiFix bag, 120 x 320 x 60 mm ....................................P0*******C.A 753 measurement adapter ....................................P0*******Z for European 2P+E sockets906 211 439 - E d . 2 - 07/2015 - N o n -c o n t r a c t u a l d o c u m e n t . P l e a s e c o n fi r m s p e c i fi c a t i o n s w h e n o r d e r i n g .。
PRODUCT SUMMARYSKY77807 Quad-Band Power Amplifier Module for FDD/TDD LTE (Tx Bands 7, 38, 40, 41)Applications•Multi-band 4G handsets •Long Term Evolution (LTE)-Up to 20 MHz bandwidth/ 100resource blocks Features•Envelope Tracking(ET)FDD band•Average Power Tracking (APT) for TDD/FDD bands•50 ohm input/output impedance with internal DC-blocking •Fully programmable Mobile Industry Processor Interface digital control •Continuous bias control for3G/4G PA High Power Mode via MIPI/RFFE interface•Low Supply voltage•Low voltage support (0.6 V) for APT/SMPS applications •Low Leakage current in power-down mode •Temperature Sensor •Integrated TDD TX-Rx switch for single SAW architecture •Low voltage support forAPT/SMPS applications •Small, low profile package-4.0x 3.0x 1.0 (Max.) mm-24-pad configurationDescriptionThe SKY77807Quad-Band Power Amplifier Module (PAM) is a fully matched, 24-pad surface mount module developed for 4G LTE applications. The PAM consists of PA blocks, input and output matching, and a MIPI standard logic control block for multiple power control levels, output input switch control in a single 4.0mm x 3.0mm x 1.0 (Max.)mm package.The SKY77807uses an enhanced architecture to cover multiple bands and meet the spectral linearity requirements of LTE QPSK and 16QAM modulations with up to 20 MHz bandwidth and up to 100 resource block allocations. Output power is controlled by varying the input power and VCC is adjusted using an ET modulator or DCDC converter to maximize efficiency for each power level. Extremely low leakage current maximizes handset standby time.Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100•*********************•203049C• Skyworks Proprietary Information. • Products and product information are subject to change without notice. • January 13, 20141Ordering InformationProduct Name Order Number Evaluation Board Part NumberSKY77807SKY77807© 2013,Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects,errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.。
