单粒子效应ppt

单粒子效应预测模型解释说明1. 引言1.1 概述：本文旨在探讨单粒子效应预测模型的相关内容。

随着科技的不断进步，我们在各个领域都可以观测到来自单个粒子的效应和现象。

单粒子效应指的是当一个孤立的粒子与环境发生相互作用时所产生的影响和变化。

这些效应可能对我们理解物质行为以及应用于工程和科学领域中具有重要意义。

因此，开发出一种能够准确预测单粒子效应的模型对于推动科学研究和技术创新至关重要。

1.2 文章结构：本文共分为四个部分来进行阐述。

首先是引言部分，我们将介绍论文的背景和目的，并概述文章结构。

接下来是正文部分，将详细介绍单粒子效应预测模型相关的定义、方法论以及其应用与实例。

最后，在结论部分，将总结本文主要观点和发现，并提出对该研究领域未来研究方向以及当前模型存在的局限性进行探讨。

1.3 目的：本文旨在介绍单粒子效应预测模型的概念和应用，并探索其在科学和工程领域中的意义。

通过对该模型的研究，我们希望能够提高对单粒子效应的理解以及预测其产生的影响。

同时，本文也将讨论该模型存在的局限性，并提出未来研究方向，以推动单粒子效应相关领域的进一步发展和创新。

2. 正文：在本文中, 我们将详细阐述单粒子效应预测模型的相关内容。

为了更好地理解该模型，我们首先需要了解单粒子效应的概念和背景。

单粒子效应是指在某个系统或实验中，由于某个特定事件的发生而引发的瞬时现象或持续影响。

这种效应通常与个别粒子在系统中的行为相关，如原子、分子、电子等微观尺度上的单个实体。

对于复杂系统来说，单粒子效应可能会带来全局层面上的变化。

然而，要准确预测和量化这些单粒子效应通常十分困难。

因此，研究者们提出了一种称为“单粒子效应预测模型”的方法，旨在通过建立数学模型和计算方法来估计和预测这些效应以及其对系统整体性能和稳定性的影响。

3. 单粒子效应预测模型3.1 定义与背景单粒子效应预测模型是一种基于物理、统计学和数学原理构建起来的工具，用于描述并预测特定事件下引发的单粒子效应。

Single-Event and Radiation Effect on Enhancement Mode Gallium Nitride FETsA.Lidow1, J. Strydom1, Alana Nakata1, M. Rearwin2Member IEEE,M. Zafrani2member IEEE1Efficient Power Conversion Corporation2Microsemi CorporationABSTRACTThis paper presents responses of the latest MiGaN FETs to space radiation conditions. The new MiGaN has shown radiation tolerance to 1Mrad TID and SEGR and SEB immunity at LET of 85Mev/(mg/cm2) as well as immunity to displacement damage and Low dose (ELDRs) testing.I.INTRODUCTIONEnhancement-mode gallium nitride (eGaN®*) transistors have been commercially available for over four years. In that time they have enabled significant efficiency improvement in commercial DC-DC converters in a variety of topologies and at a variety of power levels [1]. Enhancement-mode transistors from Efficient Power Conversion Corporation (eGaN FETs) used in Microsemi MiGan TM FETs have also been demonstrated to have remarkable tolerance to gamma radiation [2] and single event effects (SEE) [3]. In September 2013, a new generation of eGaN FETs was introduced that was designed for high power density, multi-megahertz DC-DC conversion. In this paper we present new results characterizing the stability of these new improved EGaN devices under radiation exposures.As this is a relatively new technology an introduction of the eGaN device structure will be beneficial for future reference. eGaN devices based on EPC process and design are fabricated on a silicon wafer for process compatibility with today silicon manufacturing as well as cost. A thin layer of aluminum Nitride (AlN) is grown on the silicon to provide a seed layer for the subsequent growth of a gallium nitride Heterostructure.A Heterostructure of aluminum gallium nitride (AlGaN) and then GaN is grown on the AlN. A thin layer of AlGaN layer is grown on top of the highly resistive GaN creating a strained interface between the GaN and AlGaN crystal layers. This interface combined with the intrinsic piezoelectric nature of the GaN, creates a two dimensional electron gas (2DEG) which is filled with highly mobile and abundant electrons [4]. Further processing of a gate electrode forms a depletion region under the gate. The FET can be turned on by applying a positive bias to the voltage to the gate similar to a N-Channel MOSFET fig.1 show a typical I-V curve of a 40V MGN2915. Additional layers of metal are added to route the electrons to the gate, drain and source terminals as shown by the device cross section fig.2. This structure is repeated many times to form a power device similar to a power LDMOS layout.Fig. 1. Typical IV Curves for MGN2915* eGaN is a registered trademark of Efficient Power Conversion CorporationFig. 2. eGaN FET cross sectionII.EXPERIMENTAL METHODSTotal Ionizing Dose Testing:TID tests were performed in the “Gamma Cave” at the University of Massachusetts, Lowell. The devices were subjected to a total gamma dose of 1 MRads (Si) at a dose rate of 96 Rads (Si)/sec. A 60Co source was used and all testing was according to MIL-STD-750, Method 1019. Two different test conditions were used. The first test condition biased the drain-source at 80% of rated V DS(MAX) also referred as the “OFF” sta te with the gate grounded. The second test condition also referred as the “ON” state biased the gate-source at 5 V and the drain grounded.Low Dose Testing (ELDRs):Low dose testing was performed at Microsemi on our new JL Shepherd 484 irradiator with a Dual-Hemisphere Cobalt-60. The dual- hemisphere irradiator is capable of a 10mRad (Si)/sec and 100mRad (Si)/sec Low-Dose-Rate gamma simultaneously. The samples were subjected to a total dose of 100kRad (Si) at 100mRad (Si)/sec under three test conditions.-The ON state with 5V on the gate with the drain and source grounded.- The OFF state with drain-source at 80% of rated V DS(MAX) with the gate shorted-Un-biased this condition has shown to have an effect on other technology such as bipolar transistor.Neutron Testing:The devices were exposed to neutrons at the University of Massachusetts Lowell 1 MW Research Reactor using the Fast Neutron Irradiation (FNI) facility. This facility was specifically designed to provide an intense fast neutron flux (up to 9E10 n/cm^2-sec 1 MeV Si equivalent) with high beam uniformity (+/-10%) over a broad area of approximately 500 cm^2. Gamma shielding and thermal neutron filtering are also incorporated into the facility to eliminate gamma (TID) effects and minimized sample neutron activation. The gamma dose associated with a 1E13 1 MeV (Si) n/cm^2 exposure was approximately 1.33 krad (Si), while the fast to thermal neutron ratio was approximately 400:1.The samples were irradiated in the well characterized portion of the FNI, with all leads grounded in accordanceto MIL-STD-750 TM1017. Samples were removed after each exposure point was reached. Sulfur dosimetry was used to verify that each level achieved its desired exposure.Single Event Effects (SEE) Testing:SEE Testing is used to quantify the effects of ionizing radiation on electronic devices. Heavy-ion testing of third-generation MiGan TM FETs was performed at the Texas A&M cyclotron following MIL-STD-750E, METHOD 1080. Fig. 3 shows a block diagram of the test setup used during the SEE testing. The FTI1000 ATE is connected to a switch matrix with separate connections for the gate, source and drain to the laptop via a DSB cable. The test equipment is control by software which manages the setting of drain, gate and sources as well as performing the pre-electrical test and post stress measurement including thePost In situ Gate Stress (PIGS) test.Fig. 3. Block diagram and actual setup at TAMUDevice Tested:The table below shows the devices tested as well asthe radiation screening along with the test conditionsperformed.Table I. Summary of the MiGaN device testedIII. RESULTSTotal ionizing Dose Testing:The devices showed a small threshold shift post100kRad TID and stabilized up to 700kRad. The deviceswere within the datasheet specification. With no dielectricbeneath the gate for these eGaN FETs, this immunity to TIDwas expected. Fig 4 and 6 show the leakage and thresholdresponse over high dose exposure for the 40V, 100V and200V eGaN FETs.Fig.4.a MGN2901 Idss response to TID Spec<10uAFig. 4.b MGN2901 threshold response to TIDSpec 0.7<V TH<2.0Fig 5.a. MGN2910 Idss response to TID Spec<10uA Fig 5.b. MGN2910 threshold response to TIDSpec 0.7<V TH<2.0Fig 6.a. MGN29015 Idss response to TID Spec<10uA Fig 6.b. MGN2915 threshold response to TIDSpec 0.7<V TH<2.0Neutron Testing:As expected the MiGaN devices tested under Fast Neutron Irradiation did not exhibit any parameter shifts post neutron exposures up to 1e15 fluence. The minimum energy to displace GaN atoms is much larger than Si and GaAs and therefore did not seem to affect the 2DEG layer. Figures 7.a-d show the pre and post response of the MGN2915 (40V) .Fig 7.a. I GSS response of MGN2915Fig 7.b. I DSS response of MGN2915Fig 7.c. V TH response of MGN2915Fig 7.d. R DS(on) response of MGN2915Low Dose Testing (ELDRs):Some minorshifts were observed during low dose testing. Fig 8.b shows a decrease in leakage in the unbiased sample, but is probably due to tester equipment.Fig 8.c. shows a decrease in threshold voltage sample across all conditions, but still remaining within device specification up to 100kRad. This small shift in threshold could be similar to the one observed during the high dose exposure. It will be verified in further testing by carrying the exposure beyond 100kRad. Fig 8.a. I GSS response to ELDRs MGN2915Fig 8.b. I DSS response to ELDRs MGN2915Fig 8.c. V TH response to ELDRs MGN2915Fig 8.d. R DS(on) response to ELDRs MGN2915Single Event Effects (SEE) Testing:Being a lateral device, the worst case beam condition was at normal incidence with the highest surface LET. The Bragg peak was targeted to be near the 2DEG layer. The MGN2910 200V device did not show any shift in BV DSS voltage with Kr and Xe ions. A decrease to 180V was observed with Au ions when the Bragg peak was positioned near the 2DEG layer. Fig. 8 shows the SEE SOA. The MGN2915 40V device was extremely stable to its full ratedV DS , showing no degradation under worst condition and high fluence. Fig. 9 shows the SEE SOA response. The new process improvements made to the third generation of MiGaN has shown the devices to be near immune to single event exposure.Fig. 8. MGN2910 SEE SOA curve under worst conditionFig. 9. MGN2915 SEE SOA curve under worst conditionIV.CONCLUSIONThe new and third generation MiGaN devices manufactured by EPC for Microsemi HiRel space have demonstrated high radiation tolerance under TID, ELDRs, SEE and displacement damage.Further radiation testing will be performed in the coming year such as; angle testing, higher fluence, and low-dose testing across all the voltage platforms. Acknowledgement:The authors give thanks to Tom Regan from Lowell University for his help with the Neutron discussion and expertise in the subject.REFERENCES1. A. Lidow, J. Strydom, M. de Rooij, and Y. Ma, “GaNTransistors for Efficient Power Conversion,” Power Conversion Publications, 2012.2. Alexander Lidow, J. Brandon Witcher, and Ken Smalley,“Enhancement Mode Gallium Nitride (eGaN) FET Characteristics under Long Term Stress,” GOMAC Tech Conference, Orlando, Florida, March 2011.3. A. Lidow and K. Smalley, “Radiation Tolerant EnhancementMode Gallium Nitride (eGaN®) FET Cha racteristics,”GOMAC Tech Conference, Las Vegas, Nevada, March 2012. 4. M. Pavier, A. Woodworth, A. Sawle, R. Monteiro, C. Blake,and J. Chiu, “Understanding the effect of power MOSFET package parasitic on VRM circuit efficiency at frequencies above 1 MHz,” in Proc. PCIM Eur., May 2003, pp. 279–284.5. D. Reusch, J. Strydom, “Understanding the Effect of PCBLayout on Circuit Performance in a High Frequency Gallium Nitride Based Point of Load Converter,” Applied Power Electronics Conference APEC 2013, pp.649-655, 16-21 MaFig. 9. MGN2915 SEE SOA curve under worst condition。

cots器件单粒子效应COTS器件单粒子效应COTS（Commercial Off-The-Shelf）器件是指市售的、非专门为特定应用设计的电子器件。

在航天航空、核能、医疗器械等高可靠性应用中，COTS器件的使用越来越普遍。

然而，COTS器件在高辐射环境下可能会出现单粒子效应（Single Event Effects，SEE）的问题，这给系统的可靠性带来了挑战。

单粒子效应是指在高能粒子（如高能质子、中子、重离子等）的作用下，器件内部发生的瞬态电荷集中效应。

这些高能粒子穿过器件的敏感区域时，会与器件内的物质发生相互作用，产生离子化效应或电离效应，从而导致器件的临时或永久性损坏。

单粒子效应主要表现为位翻转（bit flip）、单粒子故障（single event upset，SEU）和单粒子硬故障（single event latch-up，SEL）等。

位翻转是指存储器单元（如静态随机存储器，SRAM）中的位被翻转，从而改变存储的信息。

单粒子故障是指逻辑电路中的一个或多个逻辑门的输出状态因为单个粒子的撞击而发生瞬时改变，但电路会在很短的时间内自动恢复到正常状态。

而单粒子硬故障是指逻辑电路中的一个或多个逻辑门的输出状态因为单个粒子的撞击而发生不可逆的损坏，需要手动或自动重启系统才能恢复。

COTS器件单粒子效应的发生与多个因素相关。

其中，器件的工作电压、工作温度和工作时间是最主要的因素。

此外，器件的结构和材料也会影响单粒子效应的敏感性。

例如，有些材料的离子化截面较小，对高能粒子的敏感性较低。

此外，器件的集成度越高，单粒子效应的风险也越高。

为了降低COTS器件单粒子效应的风险，可以采取以下措施。

首先，可以通过屏蔽材料来减少高能粒子的入射。

屏蔽材料可以是金属、陶瓷等，其厚度和材质的选择需要根据具体应用场景和粒子种类来确定。

其次，可以采用冗余设计来增强系统的容错性。

例如，在存储器中使用纠错码（Error Correcting Code，ECC）来检测和修复位翻转错误。

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