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2010-1-1《电子技术专业 Nhomakorabea语教程》
6
Backgrounds
Terminology
– – – – – silicon wafer Ion implantation wafer Fabrication radio frequency amplifiers mechanical strength 硅晶圆 离子注入 晶圆制造 音频放大器 机械强度
《电子技术专业英语教程》
Procedure in text
Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. 晶圆制造是一种由很多连续重复的加工步骤组成的, 用来制造完整的电子学或者光子学电路的加工过程.
《电子技术专业英语教程》
Etch
in dictionary
To cut into the surface of (glass, for example) by the action of acid. 蚀刻:用酸蚀刻(玻璃的)表面 To make or create by this method: 以蚀刻法制作:以蚀刻的方法制作或创作: To impress, delineate, or imprint clearly: 铭记:铭刻,描述或给…以极深的印象: To engage in etching. 蚀刻:从事蚀刻工作
《电子技术专业英语教程》
Optical
in text
Examples including production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. 实例包括音频放大器,发光二极管,光学器件和中央 处理器制造等加工过程.
A manner of proceeding; a way of performing or effecting something: 程序,进程,影响:方式;进行或完成某事的途径: A series of steps taken to accomplish an end: 步骤:为执行或完成某事采取的一系列步骤: a long therapeutic procedure. 长期治疗过程
2010-1-1
《电子技术专业英语教程》
5
Miller index
以晶胞基矢定义的互质整数,用以表示晶面的方向. 确定某平面在直角坐标系 3个轴上的截点,并以晶 格常数为单位测得相应的截距. 取截距的倒数,然后约简为 3 个没有公约数的整数, 即将其化简成最简单的整数比. 将此结果以 "(hkl)"表示,即为此平面的密勒指 数.
《电子技术专业英语教程》
Cleavage in text
Wafer cleavage typically occurs only in a few well-defined directions. 硅晶圆切割通常只发生在少数几个明确的方向..
《电子技术专业英语教程》
Language in use
Vocabulary
– substrate ,undergo , etch , procedure , optical , cleavage , prototype
– Structure
Reading/writing techniques
《电子技术专业英语教程》
《电子技术专业英语教程》
Substrate
in text
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many micro fabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. 晶片可以作为基片,经过很多种微加工工艺步骤来完 成各种微电子器件的制造.这些工艺步骤包括掺杂, 离子注入,刻蚀,各种材料的淀积以及光刻.
An etched silicon wafer
《电子技术专业英语教程》
The silicon wafer
The silicon wafer shaping involves … About crystal orientation …
《电子技术专业英语教程》
The wafer size
1 inch. 2 inch (50.8 mm). Thickness 275 m. 3 inch (76.2 mm). Thickness 375 m. 4 inch (100 mm). Thickness 525 m. 5 inch (127 mm) or 125 mm (4.9 inch). Thickness 625 m. 5.9 inch (150 mm, usually referred to as "6 inch"). Thickness 675 m. 7.9 inch (200 mm, usually referred to as "8 inch"). Thickness 725 m. 11.8 inch (300 mm, usually referred to as "12 inch" or "Pizza size" wafer). Thickness 775 m. 18 inch (450 mm ). Thickness 925 m (expected).
《电子技术专业英语教程》
Undergo in dictionary
To pass through; experience: 经过;经历 To endure; suffer: 忍受;遭受:
《电子技术专业英语教程》
Undergo in text
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many micro fabrication process steps 晶片可以作为基片,经过很多种微加工工艺步骤来完 成各种微电子器件的制造.
Vocabulary
《电子技术专业英语教程》
Substrate
in dictionary
(=substratum)底层,下层,[地]底土层,基础,本源,[生]培养基,[生化]酶 作用物,[摄](胶片)感光底层 The material or substance on which an enzyme acts. 被酶作用:酶在其上进行作用的物质 Biology A surface on which an organism grows or is attached. 【生物学】 基层:动植物生长或附着的表面 An underlying layer; a substratum. 底层,下层土
《电子技术专业英语教程》
Text tour
Outline
– Introduction (para.5) – The silicon wafer(para.6-8) – The wafer size(para.9-18)
《电子技术专业英语教程》
Introduction
What is the wafer? The processes of wafer Fabrication … The procedure of wafer Fabrication …
《电子技术专业英语教程》
Backgrounds
Terminology
– diamond cubic structure – crystal orientation – Miller index 金刚石立方结构 晶向 密勒指数
《电子技术专业英语教程》
diamond cubic structure
《电子技术专业英语教程》
Procedure in use
account closing procedure 结算手续 accounting procedure 会计程序, 会计手续, 衡算计量程序; 计量程 序 admission procedure 招生手续; 入学手续 alignment procedure 校直程序; 调整过程
《电子技术专业英语教程》
Optical
in dictionary
Of or relating to sight; visual: 视力的,与视力有关的,可见的; Of or relating to optics. 与光学有关的 Relating to or using visible light: 与可见光有关的,使用可见光的; Using light-sensitive devices. 使用微感应仪器的
《电子技术专业英语教程》
Cleavage in dictionary
The act of splitting or cleaving. 劈开:劈开或撕裂的动作 The state of being split or cleft; a fissure or division. 分裂,裂缝:劈开或裂开的状态;裂缝或分裂 Mineralogy The splitting or tendency to split of a crystallized substance along definite crystalline planes, yielding smooth surfaces. 【矿物学】 解理,裂纹:结晶物质沿一定结晶面产生 光滑面的分裂或分裂倾向 Embryology 【胚胎学】