wb-edm-imx6-rev-c1

IMX6UL ADC 硬件触发原理一、背景IMX6UL是一款由NXP半导体推出的高性能、低功耗的应用处理器。

该处理器具有丰富的外设接口和丰富的软件支持，适用于各种嵌入式系统设计。

其中，ADC（模数转换器）是IMX6UL处理器重要的外设之一，它可以用于对外部模拟信号的采集和转换。

二、IMX6UL ADC 概述IMX6UL中的ADC模块包含多个独立的ADC通道，每个通道可以独立进行模拟信号的采集。

ADC模块支持软件触发和硬件触发两种模式。

软件触发是通过编程的方式启动ADC采样，而硬件触发是通过外部信号触发ADC模块进行采样。

三、硬件触发原理1. 开启硬件触发模式在使用硬件触发模式前，需要通过配置寄存器将ADC模块切换到硬件触发模式。

具体的配置方法会根据不同的硬件评台而有所差异，通常需要设置相关寄存器来选择硬件触发模式并配置触发源。

2. 配置触发源硬件触发模式需要一个外部信号作为触发源，一般可以选择外部GPIO 信号、定时器触发信号或者其他外部信号作为ADC的触发源。

这需要在硬件电路设计时考虑，并将选择好的触发源连接到ADC模块的相应引脚上。

3. 触发采样当外部触发源产生触发信号时，ADC模块会在下一个时钟周期开始模拟信号的采样和转换。

在硬件触发模式下，ADC模块只有在接收到触发信号时才会进行采样，这样可以确保采样的时机和频率符合外部的要求。

4.数据处理采样完成后，ADC模块将采样得到的数字结果保存在相应的寄存器中，可以通过读取这些寄存器来获取最新的采样数据。

采样数据可以进一步送入处理器进行处理，如滤波、数据转换等。

四、应用场景硬件触发模式通常用于对模拟信号的精确定时采集，可以应用于实时控制系统、仪器仪表等场合。

一个温度控制系统需要对温度传感器的信号进行快速响应，就可以使用硬件触发模式来确保采样的时机和频率。

五、总结IMX6UL的ADC模块支持硬件触发模式，通过外部信号触发ADC模块进行采样，在某些应用场景下具有重要的意义。

明远智睿MY-IMX6 MfgTool 烧录指导手册适用范围（Applicable scope）操作系统所对应的文件系统支持(operating system VS file system) 由于Linux 系统与文件系统的关系是一对多，同一个Linux 系统可以支持不同的文件系统，这里把对应的关系列表如下：Because Linux OS correspond Multiple file system,the following table can support Correspondence:另外，文件系统相对比较大，最小的文件虽然只有几MB，但是最大的文件系统有1GB多。

为了节省大家的下载时间，大家先根据下表预先选定自己需要的文件系统，在下载文件系统那一步骤的时候就可以只下载自己需要的文件系统。

In addition，the size of file system is very big,the minimal file system is only 6.9MB,big file system up to 1GB.In order to save everyone's download time, we first according to the table below the pre-selected file system, in the download file system that step can only download the file systemyou need.注意：Ubuntu 16 GUI（armhf-rootfs-ubuntu-xenial-lxde.tar.bz2）文件系统第一次进入图形界面需要几分钟的时间，之后每次登录进入图形界面就快了。

Caution:First time login Ubuntu 16GUI(armhf-rootfs-ubuntu-xenial-lxde.tar.bz2) file system will take several minutes ,after that login quickly.准备烧录工具(Prepare MFG Tool)烧录工具的目录及文件说明(Contents of MFG Tool)这里直观的描述出完整的烧录工具目录及文件结构，并简要的对目录及文件进行说明，方便大家理解烧录工具。

思特威推出超高分辨率图像传感器新品3月9日消息，CMOS图像传感器供应商思特威(SmartSens)，推出其首颗50MP超高分辨率 1.0μm像素尺寸图像传感器新品——SC550XS。

新品采用先进的22nm HKMG Stack工艺制程，搭载思特威SmartClarity-2成像技术，以及SFCPixel与PixGain HDR专利技术，拥有出色的成像性能。

此外通过AllPix ADAF技术加持可实现100%全像素对焦，并配备了MIPI C-PHY 3.0Gsps高速数据传输接口。

产品在夜视全彩成像、高动态范围以及低功耗性能上均可满足旗舰级智能手机主摄的需求。

据Counterpoint的最新研究，预计2022手机将占据全球CIS市场总收入71.4%。

旗舰级智能手机正在追求单反相机般的拍摄性能。

图像传感器作为核心成像器件成为了手机摄像头性能破壁的重点领域，其中5000万像素芯片较受欢迎。

作为旗舰级手机主摄目前的主流配置，5000万像素图像传感器将会在未来较长时间内拥有稳固的生命周期。

创新技术加持，成像性能出色SC550XS拥有5000万像素超高分辨率，像素尺寸仅为1.0μm。

在先进的22nm HKMG Stack工艺制程基础上结合思特威的SFCPixel专利技术及PixGain技术下High Gain高转换增益，辅以2x2 SmartQCell 微透镜结构设计进一步提升单像素的光线获取率，使SC550XS得以拥有同规格产品下优越的感光度性能，再配合超低噪声外围读取电路技术及升级的色彩工艺，让SC550XS能够在夜间拍摄中呈现出如电影般的成像质感。

支持PixGain HDR等多种高动态范围技术SC550XS搭载了思特威创新的PixGain HDR技术，通过在同一帧曝光下的High Gain(高转换增益)及Low Gain(低转换增益)双影像结合，可在运动拍摄过程中实现无鬼影的高品质HDR成像。

此外，SC550XS 还可支持4K 30fps高达120dB的三重曝光行交叠HDR以及60fps 100dB的双重曝光行交叠HDR模式，通过多种高动态范围技术组合使摄像头能够捕捉更丰富的光影明暗细节。

I NTEGRATED C IRCUITS D IVISIONCPC2907BDual 60V Single-PoleNormally Open OptoMOS ®RelayPart #DescriptionCPC2907B8-Pin Power SOIC (25/T ube)Ratings Units Blocking Voltage 60V PLoad Current2A rms / A DCOn-Resistance (max)0.15ΩApplicationsFeaturesDescriptionApprovalsOrdering InformationPin ConfigurationSwitching Characteristics of Normally Open (Form A) Devices• Dual Relays• Low On-resistance: 150m Ω Max• 2 Amp Load Current; Single-Pole Operation • 4000V rms Input/Output Isolation • Low Drive Power Requirements • High Reliability• Arc-Free With No Snubbing Circuits • No EMI/RFI Generation• 8-Pin SOIC Surface Mount Package • Flammability Rating UL 94 V-0• Security• Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems• Medical Equipment-Patient/Equipment Isolation • Industrial Controls• UL 508 Certified Component: File E69938• CSA Certified Component: Certificate 1175739• EN/IEC 60950-1 Certified Component: Certificate available on our websiteCPC2907B is a dual, normally open (1-Form-A) Solid State Relay that comprises two independent, optically coupled MOSFET switches. The combination of highly efficient LEDs and photovoltaic die makes possible an input to output isolation of 4000V rms .The optically coupled output driver, which uses the patented OptoMOS architecture, is controlled by a highly efficient infrared LED.Dual OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications, saving board space by incorporating both switches in a single 8-pin package.+ Control - Switch #1– Control - Switch #1+ Control - Switch #2– Control - Switch #2Load - Switch #1Load - Switch #1Load - Switch #2Load - Switch #2Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.ParameterConditionsSymbolMinTypMaxUnitsOutput Characteristics Load CurrentContinuous, Single-pole 1-I L --2A rms / A DCPeakt =10ms I LPK --±10A P On-Resistance 2I F =5mA, I L =1A R ON -0.100.15ΩOff-State Leakage Current V L =60V P I LEAK --1μA Switching Speeds T urn-On I F =5mA, V L =10V t on -0.62 2.5ms T urn-Offt off -0.090.25Output CapacitanceI F =0mA, V L =50V , f=1MHzC OUT -60-pF Input CharacteristicsInput Control Current to Activate 3I L =1A I F -0.785mA Input Control Current to Deactivate --0.40.78-mA Input Voltage Drop I F =5mA V F 0.9 1.2 1.5V Reverse Input CurrentV R =5V I R --10μA Common Characteristics Capacitance, Input to OutputV IO =0V , f=1MHzC IO-3-pF1 If both poles operate at the same time, the load current must be deratedin order not to exceed the package power dissipation value. See Total Load Current chart on this page.2 Measurement taken within one (1) second of on-time.3 For applications requiring operation at temperatures greater than 60ºC, a minimum LED drive current of 10mA is recommended.Parameter Ratings UnitsBlocking Voltage 60V P Reverse Input Voltage 5V Input Control Current 50mA Peak (10ms)1A Input Power Dissipation1150mW Output Power Dissipation Single Pole 21125mW Both Poles 31700Isolation Voltage, Input to Output 4000V rms Operational T emperature (T A )-40 to +85°C Storage T emperature -40 to +125°C1 Derate linearly 1.33 mW / °C2 Derate linearly 11.4 mW / °C3 Derate linearly 17.1 mW / °CAbsolute Maximum Ratings @ 25°CElectrical Characteristics @ 25°CP o l e 2 C u r r e n t (A )0.00.51.01.52.02.5LED Forward Voltage (V)1.235 1.240 1.245 1.250 1.255 1.260 1.265D e v i c e C o u n t (N )51015202530LED Forward Voltage Distribution(N=50, I=5mA)Turn-On Time (P s)500550600650700750800D e v i c e C o u n t (N )5101520Typical Turn-On Time (N=50, I=5mA, I =100mA)Turn-Off Time (P s)84868890929496D e v i c e C o u n t (N )510152025Typical Turn-Off Time(N=50, I =5mA, I =100mA)LED Forward Current (mA)0.70.80.9 1.0 1.1D e v i c e C o u n t (N )51015202530Typical I F for Switch Operation(N=50, I =100mA)On-Resistance (:)0.070.080.090.100.110.12D e v i c e C o u n t (N )051015202530Typical On-Resistance Distribution(N=50, I =5mA, I =1A)Blocking Voltage (V P )81828384858687D e v i c e C o u n t (N )510152025Typical Blocking Voltage Distribution(N=50)Temperature (ºC)-40-2020406080100L E D C u r r e n t (m A )0.650.700.750.800.850.900.951.001.05Typical I F for Switch Operation(I =1A)Temperature (ºC)-40-2020406080100T u r n -O n T i m e (P s)05001000150020002500Typical Turn-On Time vs. Temperature(I =100mA)Temperature (ºC)-40-20020406080100T u r n -O f f T i m e (P s )60708090100110120130Typical Turn-Off Time vs. Temperature(I =100mA)Temperature (ºC)-40-2020406080100L E D F o r w a r d V o l t a g e (V )1.11.21.31.41.51.6LED Forward Voltage vs. TemperatureLED Forward Current (mA)1020304050T u r n -O n T i m e (P s)02004006008001000120014001600Typical Turn-On Time vs. LED Forward Current(I =100mA)LED Forward Current (mA)1020304050T u r n -O f f T i me (P s )859095100105Typical Turn-Off Time vs. LED Forward Current(I =100mA)PERFORMANCE DATA*Load Voltage (V)0102030405060O u t p u t C a p a c i t a n c e (p F )50100150200250Output Capacitance vs. Load VoltageTemperature (ºC)-40-20020406080100L e a k a g e C u r r e n t (n A )100150200250300350Leakage Current vs. Temperature(V=60V)Temperature (ºC)-40-2020406080100B l o c k i n g V o l t a g e (V P )78808284868890Typical Blocking Voltagevs. TemperatureLoad Voltage (V)-0.3-0.2-0.10.00.10.20.3L o a d C u r r e n t (A )-3-2-10123Typical Load Current vs. Load Voltage(I =5mA)Temperature (ºC)-40-20020406080100O n -R e s i s t a n c e (m :)5060708090100110120130140150Typical On-Resistancevs. Temperature (I=5mA, I =1A)Temperature (ºC)L o a d C u r r e n t (A )0.00.51.01.52.02.5Maximum Load Currentvs. Temperature(I =5mA)2.251.751.250.750.251030507090PERFORMANCE DATA*Manufacturing InformationMoisture SensitivityAll plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS IntegratedCircuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all ofour products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below.Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability.This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.Device cationCPC2907BMSL 1ESD SensitivityThis product is ESD Sensitive , and should be handled according to the industry standard JESD-625.Soldering ProfileProvided in the table below is the Classification T emperature (T C ) of this product and the maximum dwell time thebody temperature of this device may be (T C - 5)ºC or greater. The classification temperature sets the MaximumBody T emperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed.Device Classifi cation c )p )Max Refl ow CyclesCPC2907B245ºC30 seconds3Board WashIXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.For additional information please visit our website at: IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard T erms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.MECHANICAL DIMENSIONSCPC2907BDimensionsUnless Otherwise Notedmm (inches)0.889 ± 0.178FOOTPRINT 0.381 ± 0.025STANDOFF Recommended PCB PatternNotes:1. Pin-to-pin tolerances are non-cumulative.2. Lead thickness does not include plating (1000 microinches minimum).3. Package outline exclusive of mold flash and metal burr.。