蔗糖-PBS溶液(5%)

© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 1 of 28. Printed in The Netherlands.Bondstrand ® 2000M/7000M Glassfiber Reinforced Epoxy (GRE) pipe systems for marine servicewith external pressure requirementsIn 1993, IMO (International Maritime Organisation) issued a resolution (A.18/Res. 753) covering acceptance criteria for assuring ship safety. Major certifying bodies have adopted and implemented these Guidelines in their respective Rules and Regulations for the Classification of Ships.All Bondstrand pipe series used in the marine industry are designed and type-approved by the below major certifying bodies. (A complete list is available, on request)● American Bureau of Shipping (ABS), U.S.A.;● Bureau Veritas, France;● Det Norske Veritas, Norway;● Germanischer Lloyd, Germany;● Lloyd’s Register, United Kingdom;● Nippon Kaiji Kyokai, Japan; ● Registro Italiano Navale (RINA), Italy;● United States Coast Guard (USCG), U.S.A..Maximum operating temperature: up to 121°C.Pipe diameter: 1-40 inch (25-1000 mm).Pipe system design for pressure ratings up to 16 bar.ASTM D-2992 Hydrostatic Design Basis (Procedure B - service factor 0.5);ASTM D-1599 Safety factor of 4:1. Design criteria for external pressure requirements are in accordance with IMO regulations.Bondstrand 2000MASTM D-2310 Classification: RTRP-11FW for static hydrostatic design basis; MDA cured.ASTM D-2310 Classification: RTRP-11FX for static hydrostatic design basis; IPD plies with ASTM F-1173 Classification.Bondstrand 7000MASTM D-2310 Classification: RTRP-11AW for static hydrostatic design basis; MDA cured.ASTM D-2310 Classification: RTRP-11AX for static hydrostatic design basis; IPD plies with ASTM F-1173 Classification.ApprovalsUses and applicationsCharacteristicsA complete library of Bondstrand pipe and fittings in PDS and PDMS-format is available on CD-ROM. Please contact Ameron for details.For specific fire protection requirements, an outher layer of passive fire protection is available.For pipe systems without external pressure requirements, please refer to Bondstrand 3400 product data (FP 835) or contact your Ameron representative.● Ballast● Portable discharge line ● Chlorination ● Stripping lines● Draining ● Tankcleaning (salt water)● Cargo line● Fire protection mains● Sanitary service & sewage ● Various other applicationsTable of Contents GENERAL DATAAdhesives (27)Conversions (28)Engineering design & installation data (28)Hydrostatic testing (28)Important notice (28)Joining system and configuration (3)Mechanical properties (4)Physical properties (4)Pipe series (3)Pipe length (4)Pipe dimensions and weights (7)Pipe performance .....................................................................................................5-6Span length (9)Surge Pressure (28)Ultimate Collapse Pressures (8)FITTINGS DATAAdaptors ...............................................................................................................26-27Bell mouth (25)Couplings (22)Elbows ....................................................................................................................9-11Expansion coupling (26)Flanges .................................................................................................................20-22Joint dimensions Quick-Lock® (8)Joint dimensions Taper/Taper (8)Laterals (17)Nipples (23)Reducers ..............................................................................................................18-19Saddles .............................................................................................................17 & 24Specials (28)Tees .......................................................................................................................11-16© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 2 of 28. Printed in The Netherlands.© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 3 of 28. Printed in The Netherlands.Pipe seriesPipeFilament-wound Glassfiber Reinforced Epoxy (GRE) pipe for Bondstrand adhesive-bonding systems. MDA (diaminodiphenylmethane) or IPD (isophoronediamine) cured.FittingsA wide range of lined filament-wound Glassfiber Reinforced Epoxy (GRE) fittings for Bondstrand adhesive-bonding systems. For special fittings, not listed in this product guide, please contact your Ameron representative.FlangesFilament-wound Glassfiber Reinforced Epoxy (GRE) heavy-duty flanges, hubbed and stub-end flanges for Quick-Lock adhesive bonding systems. Standard flange drillingpatterns as per ANSI B16.5 (150 Lb). Other flange drilling patterns, such as ANSI B16.5 (> 150 Lb), DIN, ISO and JIS are also availabe.Bondstrand® 2000MGlassfiber Reinforced Epoxy (GRE) pipe system; IPD or MDA cured.Standard 0.5 mm internal resin-rich reinforced liner.Maximum operating temperature: 121°C for MDA cured and 93°C for IPD cured.Maximum pressure rating: 16 bar.Minimum pressure: full vacuum.External Pressure Requirements: In accordance with IMO Regulations.Bondstrand® 7000M (* conductive)Glassfiber Reinforced Epoxy (GRE) pipe system; IPD or MDA cured.Maximum operating temperature: 121°C for MDA cured and 93°C for IPD cured.Maximum pressure rating: 16 bar.Minimum pressure: full vacuum.External Pressure Requirements: In accordance with IMO Regulations.* ConductiveOur conductive pipe systems have been developed to prevent accumulation of potentially dangerous levels of static electrical charges. Pipe, fittings and flanges contain high strength conductive filaments. Together with a conductive adhesive this provides an electrically continuous system.Description Bondstrand® 2000MBondstrand® 7000MPipe diameter 1-40 inch1-40 inchJoining system Quick-Lock 1-16 inch Quick-Lock 1-16 inchTaper/Taper 18-40 inchTaper/Taper 18-40 inchLiner*0.5 mm -**Temperature 121°C 121°C Pressure Rating16 bar16 bar* Also available without liner;** Above 93°C, derate the pressure rating lineairly to 50% at 121°C.Pipe25-400 mm (1-16 inch):Quick-Lock (straight/taper) adhesive joint with integral pipe stop in bell end.End configuration: Integral Quick-Lock bell end x shaved straight spigot.450-1000 mm (18-40 inch): Taper/Taper adhesive joint.End configuration: Integral Taper bell x shaved taper spigotFitting25-400 mm (1-16 inch):Quick-Lock (straight/ taper) adhesive joint with integral pipe stop in bell end.End configuration: Integral Quick-Lock bell ends.450-1000 mm (18-40 inch): Taper/Taper adhesive joint.End configuration: Integral Taper bell ends.Flanges25-1000 mm (1-40 inch):Quick-Lock (straight/ taper) adhesive joint with integral pipe stop in bell end.End configuration: Integral Quick-Lock bell end.Note: * Pipe nipples, saddles and flanged fittings have different end configurations.Joining system &configurationTypical mechanical properties Nominal Joining Approximate overall Length*Pipe Size System Europe Plant Asia Plant[mm] [inch] [m] [m] 25-40 1-1½ Quick-Lock 5.5 3.0 50-125 2-5 Quick-Lock 6.15 5.85/9.0 150 6 Quick-Lock 6.1 5.85/9.0 200 8 Quick-Lock 6.1/11.8 5.85/9.0 250 10 Quick-Lock 6.1/11.8 5.85/11.89 300-400 12-16 Quick-Lock 6.05/11.8 5.85/11.89 450-1000 18-40 Taper/Taper 11.811.89 * Tolerance +/- 50 mm.Pipe property Units Value Method Thermal conductivity pipe wall W(m.K) .33 Ameron Thermal expansivity (lineair) 10-6 mm/mm °C 18.0 Ameron Flow coefficient Hazen-Williams 150 —Absolute roughness 10-6 m 5.3 —Density kg/m31800 — Specific gravity - 1.8 ASTM D-792Pipe property IPD cured Units 21°C. 93°C. Method Bi-axialUltimate hoop stress at weeping N/mm2300 — ASTM D-1599 CircumferentialHoop tensile strength N/mm2380 — ASTM D-2290 Hoop tensile modulus N/mm223250 18100 ASTM D-2290 Poisson’s ratio axial/hoop — 0.93 1.04 Ameron LongitudinalAxial tensile strength N/mm265 50 ASTM D-2105 Axial tensile modulus N/mm210000 7800 ASTM D-2105 Poisson’s ratio hoop/axial — 0.40 0.45 ASTM D-2105 Axial bending strength — 80 — Ameron BeamApparent elastic modulus N/mm29200 7000 ASTM D-2925 Hydrostatic Design BasisStatic N/mm2148* — ASTM D-2992(Proc. B.)Pipe property MDA cured Units 21°C. 93°C. Method Bi-axialUltimate hoop stress at weeping N/mm2250 — ASTM D-1599 CircumferentialHoop tensile strength N/mm2220 — ASTM D-2290 Hoop tensile modulus N/mm225200 ASTM D-2290 Poisson’s ratio axial/hoop — 0.65 0.81 Ameron LongitudinalAxial tensile strength N/mm280 65 ASTM D-2105 Axial tensile modulus N/mm212500 9700 ASTM D-2105 Poisson’s ratio hoop/axial — 0.40 0.44 ASTM D-2105 Axial bending strength — 85 — Ameron BeamApparent elastic modulus N/mm212500 8000 ASTM D-2925 Hydrostatic Design BasisStatic N/mm2124* — ASTM D-2992(Proc. B.) * At 65°C.Typical physicalpropertiesTypical pipe length© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 4 of 28. Printed in The Netherlands.© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 5 of 28. Printed in The Netherlands..Typical pipe performanceBondstrand 2000M (MDA cured) at 21°C.Nominal STISStifness Pipe Pipe Factor Stiffness Size [mm] [inch][kN/m 2] [lb.in] [psi]25 1 2079.1 502 1618740 1½ 618.1 502 4812 50 2 350.6 554 2729 80 3 102.2 554 796 100 4 110.8 1281 863125 5 57.7 1281 449 150 6 33.4 1281 260200 8 35.5 3092 276250 10 36.6 6375 285300 12 35.9 10627 280350 14 36.8 13548 286400 16 36.9 20308 287450 18 36.2 28265 282500 20 36.3 38976 283600 24 36.6 67877 285700 28 36.9 121531 288750 30 36.8 148680 286800 32 37.1 182139 289900 36 36.8 256919 28610004037.7361759294Bondstrand 2000M (IPD-cured) at 21°C. Nominal STISStifness Pipe Pipe Factor Stiffness Size [mm] [inch][kN/m 2] [lb.in] [psi]25 1 2087.4 504 1625140 1½ 620.6 504 483150 2 352.0 556 2740 80 3 102.6 556 799 100 4 111.3 1286 866125 5 57.9 1286 451150 6 33.5 1286 261200 8 35.6 3104 277250 10 36.8 6400 286300 12 36.1 10669 281350 14 36.9 13602 287400 16 37.1 20389 289450 18 36.3 28378 283500 20 36.5 39130 284600 24 36.6 68147 285700 28 36.9 122013 289750 30 36.8 149270 288800 32 37.1 182862 290900 36 36.8 257939 28810004037.7363195295Typical pipe performance Bondstrand 7000M (MDA-cured) at 21°C.Nominal STIS Stifness PipePipe Factor StiffnessSize[mm] [inch] [kN/m2] [lb.in] [psi]25 1 3142.4 797 2446440 1½ 949.6 797 739350 2 534.7 867 416280 3 157.3 867 1225100 4 154.4 1809 1202125 5 80.6 1809 627150 6 46.7 1809 363200 8 39.4 3092 276250 10 38.2 6375 285300 12 37.2 10627 280350 14 38.0 13548 286400 16 37.2 20308 287450 18 38.0 28265 282500 20 37.2 38976 283600 24 36.7 67877 285700 28 37.1 121531 288750 30 36.9 148680 286800 32 37.3 182139 289900 36 36.9 256919 2861000 40 37.9 361759 294Bondstrand 7000M (IPD-cured) at 21°C.Nominal STIS Stifness PipePipe Factor StiffnessSize[mm] [inch] [kN/m2] [lb.in] [psi]25 1 3154.9 800 2456140 1½ 953.3 800 742250 2 536.8 871 417980 3 157.9 871 1230100 4 155.0 1816 1207125 5 80.9 1816 630150 6 46.9 1816 365200 8 35.6 3104 277250 10 36.8 6400 286300 12 36.1 10669 281350 14 36.9 13602 287400 16 37.1 20389 289450 18 36.3 28378 283500 20 36.5 39130 284600 24 36.7 68147 286700 28 37.1 122013 289750 30 36.9 149270 288800 32 37.3 182862 290900 36 36.9 257939 2881000 40 37.9 363195 295© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 6 of 28. Printed in The Netherlands.Typical pipe dimensions and weights Bondstrand 2000M.Nominal Pipe Minimum Average Designation Pipe Inside Struct. Wall Pipe per ASTM Size Diameter Thickness [t] Weight D-2966 [mm] [inch] [mm] [mm] [kg/m] MDA IPD 25 1 27.1 3.0 0.7 RTRP-11 FW1-2112 FX1-3112 40 1½ 42.1 3.0 1.3 RTRP-11 FW1-2112 FX1-3112 50 2 53.0 3.1 1.3 RTRP-11FW1-2112 FX1-3112 80 3 81.8 3.1 1.8 RTRP-11FW1-2112 FX1-3112 100 4 105.2 4.1 3.1 RTRP-11FW1-2113 FX1-3113 125 5 131.9 4.1 3.5 RTRP-11FW1-2113 FX1-3113 150 6 159.0 4.1 4.6 RTRP-11FW1-2113 FX1-3113 200 8 208.8 5.5 7.4 RTRP-11FW1-2116 FX1-3116 250 10 262.9 7.0 12 RTRP-11FW1-2116 FX1-3116 300 12 313.7 8.3 17 RTRP-11FW1-2116 FX1-3116 400 14 337.6 9.0 19 RTRP-11FW1-2116 FX1-3116 400 16 385.8 10.3 25 RTRP-11FW1-2116 FX1-3116 450 18 433.8 11.5 32 RTRP-11FW1-2116 FX1-3116 500 20 482.1 12.8 39 RTRP-11FW1-2116 FX1-3116 600 24 578.6 15.4 56 RTRP-11FW1-2116 FX1-3116 700 28 700.0 18.7 75 RTRP-11FW1-2116 FX1-3116 750 30 750.0 20.0 93 RTRP-11FW1-2116 FX1-3116 800 32 800.0 21.4 102 RTRP-11FW1-2116 FX1-3116 900 36 900.0 24.0 132 RTRP-11FW1-2116 FX1-3116 1000 40 1000.0 26.9 165 RTRP-11FW1-2116 FX1-3116Bondstrand 7000M.Nominal Pipe Minimum Average Designation Pipe Inside Struct. Wall Pipe per ASTM Size Diameter Thickness [t] Weight D-2966 [mm] [inch] [mm] [mm] [kg/m] MDA IPD 25 1 27.1 3.5 0.7 RTRP-11AW1-2112 AX1-3112 40 1½ 42.1 3.5 1.3 RTRP-11AW1-2112 AX1-3112 50 2 53.0 3.6 1.3 RTRP-11AW1-2112 AX1-3112 80 3 81.8 3.6 1.8 RTRP-11AW1-2112 AX1-3112 100 4 105.2 4.6 3.1 RTRP-11AW1-2113 AX1-3113 125 5 131.9 4.6 3.5 RTRP-11AW1-2113 AX1-3113 150 6 159.0 4.6 4.6 RTRP-11AW1-2113 AX1-3113 200 8 208.8 5.5 7.4 RTRP-11AW1-2116 AX1-3116 250 10 262.9 7.0 12 RTRP-11AW1-2116 AX1-3116 300 12 313.7 8.3 17 RTRP-11AW1-2116 AX1-3116 350 14 337.6 9.0 19 RTRP-11AW1-2116 AX1-3116 400 16 385.8 10.3 25 RTRP-11AW1-2116 AX1-3116 450 18 433.8 11.5 32 RTRP-11AW1-2116 AX1-3116 500 20 482.1 12.8 39 RTRP-11AW1-2116 AX1-3116 600 24 578.6 15.4 56 RTRP-11AW1-2116 AX1-3116 700 28 700.0 18.7 75 RTRP-11AW1-2116 AX1-3116 750 30 750.0 20.0 93 RTRP-11AW1-2116 AX1-3116 800 32 800.0 21.4 102 RTRP-11AW1-2116 AX1-3116 900 36 900.0 24.0 132 RTRP-11AW1-2116 AX1-3116 1000 40 1000.0 26.9 165 RTRP-11AW1-2116 AX1-3116© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 7 of 28. Printed in The Netherlands.Ultimate collapse pressure Quick-Lock® dimensions Taper/Taper dimensions Ultimate collapse pressure (ultimate short term external failure pressure) at 21º C. Nominal Internal 2000M 2000M 7000M 7000M Pipe Pressure MDA IPD MDA IPD Size static*[mm] [inch] [bar] [bar] [bar] [bar] [bar] 25 1 16 491 491 714 714 40 1½ 16 160 160 239 239 50 2 16 95 95 141 141 80 3 16 29 29 44 44 100 4 16 31 31 43 43 125 5 16 16.5 16.5 23 23 150 6 16 9.7 9.7 13.5 13.5 200 8 16 10.3 10.3 10.3 10.3 250 10 16 10.7 10.7 10.7 10.7 300 12 16 10.5 10.5 10.5 10.5 350 14 16 10.7 10.7 10.7 10.7 400 16 16 10.7 10.7 10.7 10.7 450 18 16 10.5 10.5 10.5 10.5 500 20 16 10.6 10.6 10.6 10.6 600 24 16 10.7 10.7 10.7 10.7 700 28 16 10.8 10.8 10.8 10.8 750 30 16 10.7 10.7 10.7 10.7 800 32 16 10.8 10.8 10.8 10.8 900 36 16 10.7 10.7 10.7 10.7 1000 40 16 11.0 11.0 11.0 11.0 * Up to 93°C.Nominal Insertion Spigot Diameter Spigot Length Pipe Depth Min. Max. Min. Max.Size (Ds) Sd Sd L L [mm] [inch] [mm] [mm] [mm] [mm] [mm] 25 1 27 32.6 32.9 28.5 31.0 40 1½ 32 47.5 47.8 33.5 36.0 50 2 46 59.2 59.6 49.0 52.0 80 3 46 87.6 88.0 49.0 52.0 100 4 46 112.5 112.9 49.0 52.0 125 5 57 139.5 139.9 58.5 61.5 150 6 57 166.2 166.6 59.0 62.0 200 8 64 217.1 217.5 65.0 68.0 250 10 70 271.3 271.7 71.0 74.0 300 12 76 322.2 322.6 78.0 81.0 350 14 89 353.8 354.2 89.0 93.0 400 16 102 404.1 404.5 103.0 106.0 Dimensions for Quick-Lock Spigots for bonding HD Flanges. Dia of StraightSpigot [Sd] 450 18 111 455.8 500 20 111 506.6 600 24 127 608.2 700 28 152 736.3 750 30 165 788.4 800 32 178 840.5 900 36 163 943.4 1000 40 230 1051.4Dimensions for adhesive Taper spigots for adhesive Taper/Taper joints.Nominal Taper Insertion Nominal Dia of Pipe Angle Depth Spigot Spigot Size Nose Thickn. at NoseX Ds nose Sd [mm] [inch] [degrees] [mm] [mm] [mm] 450 18 2.5 114 4.6 443.0 500 20 2.5 127 5.0 492.2 600 24 3.5 178 3.8 586.3 700 28 1.75 178 6.4 712.9 750 30 1.75 178 4.2 758.4 800 32 1.75 178 8.9 817.8 900 36 1.75 203 5.6 911.3 1000 40 1.75 410 8.11016.3© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 8 of 28. Printed in The Netherlands.Span length Bondstrand 2000M.Nominal Single MDA Contininuous Single IPD ContinuousPipe Size Span* Span* Span* Span*[mm] [inch] [m] [m] [m] [m]25 1 2.6 3.3 2.4 3.040 1½ 2.9 3.7 2.7 3.450 2 3.1 4.0 2.9 3.780 3 3.5 4.5 3.3 4.2100 4 4.0 5.1 3.7 4.7125 5 4.3 5.4 4.0 5.0150 6 4.5 5.7 4.2 5.3200 8 5.1 6.5 4.8 6.1250 10 5.8 7.3 5.3 6.8300 12 6.3 8.0 5.8 7.4350 14 6.5 8.3 6.0 7.7400 16 7.0 8.8 6.4 8.2450 18 7.4 9.3 6.8 8.7500 20 7.7 9.8 7.2 9.1600 24 8.5 10.8 7.9 10.0700 28 9.3 11.8 8.6 11.0750 30 9.6 12.2 8.9 11.3800 32 10.0 12.7 9.2 11.7900 36 10.5 13.4 9.8 12.41000 40 11.1 14.1 10.3 13.1Bondstrand 7000M.MDA IPD25 1 2.5 3.3 2.4 3.040 1½ 2.9 3.8 2.7 3.450 2 3.1 4.1 2.9 3.780 3 3.5 4.5 3.3 4.2100 4 4.0 5.2 3.7 4.7125 5 4.3 5.6 4.0 5.0150 6 4.5 5.9 4.2 5.3200 8 5.0 6.5 4.7 5.9250 10 5.7 7.3 5.3 6.7300 12 6.2 8.0 5.7 7.3350 14 6.4 8.3 6.0 7.6400 16 6.9 8.8 6.4 8.1450 18 7.3 9.3 6.7 8.6500 20 7.7 9.8 7.1 9.0600 24 8.4 10.8 7.8 9.9700 28 9.3 11.8 8.6 10.9750 30 9.6 12.2 8.9 11.3800 32 9.9 12.7 9.2 11.7900 36 10.5 13.4 9.7 12.41000 40 11.1 14.1 10.3 13.0* Span recommendations are based on pipes filled with water having a density of 1000 kg/m3and include no provisions for weights caused by valves, flanges or other heavy objects.© Ameron 2007. FP 918 A 01/07 supersedes FP 918 09/06. Page 10of 28.Printed in The Netherlands.Elbows ANSI 45ºElbows ANSI 90ºshort radiusFilament-wound 90° elbows with integral Quick-Lock male ends.*Nominal Laying Maximum Average Pipe Length Working WeightSize (LL) Pressure[mm] [inch][mm] [bar] [kg]50 2 110 12 0.480 3 135 12 0.7100 4 160 12 1.0150 6 198 12 2.4200 8 224 12 3.9250 10 275 12 6.3300123001213.3* Also available with flanges.Filament-wound 45°elbows with integral Quick-Lock male ends.*Nominal Laying Maximum Average Pipe Length Working WeightSize (LL) Pressure[mm] [inch][mm] [bar] [kg]50 2 60 12 0.280 3 71 12 0.4100 4 97 12 0.9150 6 121 12 1.9200 8 134 12 3.9250 10 159 12 8.3300121861210.0* Also available with flanges.Elbows 22½ºEqual TeesQuick-LockFilament-wound 22½°elbows with integral Quick-Lock socket ends 300 12 76 152 16 10.4350 14 83 172 16 12.0400168919116 14.0Filament-wound equal Tee with integral Quick-Lock (1-16 inch) orTaper/Taper (18-40 inch) socket ends for adhesive bonding.6 286 400 143 200 16 6.78 356 484 178 242 16 10.010 432 572 216 286 16 18.012 508 660 254 330 16 29.014 534 712 267 356 16 37.016 584 788 292 394 16 56.018 648 876 324 438 16 69.0 20 712 966 356 483 16 92.024 838 1194 419 597 16 168.028 964 1320 482 660 16 285.030 1016 1372 508 686 16 337.032 1090 1446 545 723 16 459.036 1220 1626 610 813 16 581.01000 4014162236708111816686.0Reducing TeesStandardFabricatedFilament-wound standard and fabricated reducing tees with integral Quick-Lock (1-16 inch) socket ends for adhesive bonding.Nominal Laying Overall LayingOverall Maximum Average100x100x50 4x4x2 105 151 89 135 20 2.1100x100x80 4x4x3 105 151 98 144 20 2.3125x125x50 5x5x2 127 184 102 148 16 3.4125x125x80 5x5x3 127 184 111 157 16 4.0125x125x100 5x5x4 127 184 118 164 16 4.6200x200x150 8x8x6 178 242 168 225 16 11.4250x250x25 10x10x1 83 153 273 300 16 18.1250x250x40 10x10x1½ 100 170 273 305 16 21.0250x250x50 10x10x2 115 185 273 320 16 24.0 250x250x80 10x10x3 115 185 273 320 16 24.0250x250x100 10x10x4 216 286 184 230 16 14.8 250x250x125 10x10x5 216 286 194 251 16 15.2250x250x150 10x10x6 216 286 194 251 16 15.5250x250x200 10x10x8 216 286 203 267 16 16.5300x300x25 12x12x1 84 160 298 325 16 21.2 300x300x40 12x12x1½ 102 178 298 330 16 25.0 300x300x50 12x12x2 117 193 298 344 16 29.0 300x300x80 12x12x3 117 193 298 344 16 29.0 300x300x100 12x12x4 254 330 206 252 16 21.0300x300x150 12x12x6 254 330 219 276 16 22.0 300x300x200 12x12x8 254 330 229 293 16 23.0300x300x250 12x12x10 254 330 241 311 16 24.0350x350x25 14x14x1 81 170 314 341 16 24.0350x350x40 14x14x1½ 99 188 314 346 16 28.0350x350x50 14x14x2 114 203 314 361 16 31.0350x350x80 14x14x3 114 203 314 361 16 31.0350x350x100 14x14x4 114 203 314 361 16 31.0350x350x150 14x14x6 267 356 244 301 16 29.0350x350x200 14x14x8 267 356 254 318 16 30.0 350x350x250 14x14x10 267 356 267 337 16 32.0 350x350x300 14x14x12 267 356 279 355 16 34.0400x400x25 16x16x1 85 187 338 365 16 29.0400x400x40 16x16x1½ 103 205 338 370 16 33.0400x400x50 16x16x2 118 220 338 384 16 37.0400x400x80 16x16x3 118 220 338 384 16 37.0400x400x100 16x16x4 118 220 338 384 16 37.0400x400x150 16x16x6 292 394 264 321 16 37.0400x400x200 16x16x8 292 394 273 337 16 38.0400x400x250 16x16x10 292 394 283 353 16 41.0400x400x300 16x16x12 292 394 295 371 16 45.0400x400x350 16x16x14 292394 292 381 16 49.0Note: Regular numbers are filament wound tees; Italic numbers are fabricated tees; Filament-wound standard and fabricated reducing tees with integral.Reducing Tees Taper/Taper (18-40 inch) socket ends for adhesive bonding.Nominal Laying Overall Laying Overall Maximum AveragePipe Length Length Length Length Working Weight450x450x400 18x18x16 324 438 319 421 16 69.0500x500x25 20x20x1 88 215 382 409 16 35.0500x500x40 20x20x1½ 88 215 382 414 16 35.0500x500x50 20x20x2 88 215 382 428 16 36.0500x500x80 20x20x3 100 227 382 428 16 39.0500x500x100 20x20x4 113 240 382 428 16 43.0500x500x150 20x20x6 138 265 391 448 16 50.0500x500x250 20x20x10 356 483 344 414 16 77.0500x500x300 20x20x12 356 483 345 421 16 82.0500x500x350 20x20x14 356 483 343 432 16 85.0500x500x400 20x20x16 356 483 344 446 16 85.0500x500x450 20x20x18 356 483 350 464 16 89.0600x600x25 24x24x1 88 266 430 457 16 51.0600x600x40 24x24x1½ 88 266 430 462 16 51.0600x600x50 24x24x2 88 266 430 476 16 52.0600x600x80 24x24x3 100 278 430 476 16 56.0600x600x100 24x24x4 113 291 430 476 16 61.0600x600x150 24x24x6 138 316 439 496 16 69.0600x600x200 24x24x8 419 597 412 476 14 78.0600x600x250 24x24x10 419 597 386 456 16 85.0600x600x300 24x24x12 419 597 408 484 16 85.0600x600x350 24x24x14 419 597 394 483 16 101.0600x600x400 24x24x16 419 597 395 497 16 123.3600x600x450 24x24x18 419 597 413 527 16 137.0600x600x500 24x24x20 419 597 406 533 16 156.0700x700x25 28x28x1 88 266 491 518 16 59.0700x700x40 28x28x1½ 88 266 491 523 16 59.0700x700x50 28x28x2 88 266 491 537 16 59.0700x700x80 28x28x3 100 278 491 537 16 64.0700x700x100 28x28x4 113 291 491 537 16 70.0700x700x150 28x28x6 138 316 500 557 16 80.0700x700x350 28x28x14 482 660 490 579 16 147.0700x700x400 28x28x16 482 660 500 602 16 166.0700x700x450 28x28x18 482 660 500 614 16 189.0700x700x500 28x28x20 482 660 506 633 16 210.0700x700x600 28x28x24 482 660 506 684 16 252.0750x750x25 30x30x1 88 266 516 543 16 63.0750x750x40 30x30x1½ 88 266 516 548 16 63.0750x750x50 30x30x2 88 266 516 562 16 63.0750x750x80 30x30x3 100 278 516 562 16 69.0750x750x100 30x30x4 113 291 516 562 16 74.0750x750x150 30x30x6 138 316 525 582 16 85.0750x750x300 30x30x12 508 686 756 832 16 118.0750x750x350 30x30x14 508 686 722 811 16 157.0750x750x400 30x30x16 508 686 698 800 16 178.0750x750x450 30x30x18 508 686 488 602 16 202.0750x750x500 30x30x20 508 686 495 622 16 225.0750x750x600 30x30x24 508 686 481 659 16 270.0Note: Regular numbers are filament wound tees; Italic numbers are fabricated tees.Reducing Tees (C’tnd) StandardFabricated Filament-wound standard and fabricated reducing tees with integra l Taper/Taper (18-40 inch) socket ends for adhesive bonding.800x800x750 32x32x30 545 723 534 712 16 387.0 900x900x25 36x36x1 88 291 591 618 16 78.0 900x900x40 36x36x1½ 88 291 591 623 16 78.0 900x900x50 36x36x2 88 291 591 637 16 78.0 900x900x80 36x36x3 100 303 591 637 16 85.0 900x900x100 36x36x4 113 316 591 637 16 92.0 900x900x150 36x36x6 138 341 600 657 16 105.0 900x900x400 36x36x16 610 813 563 665 16 270.0 900x900x450 36x36x18 610 813 563 677 16 290.0 900x900x500 36x36x20 610 813 563 690 16 323.0 900x900x600 36x36x24 610 813 541 719 16 387.0 900x900x700 36x36x28 610 813 570 748 16 459.0 900x900x750 36x36x30 610 813 584 762 16 484.0 1000x1000x400 40x40x1 120 530 641 668 16 92.0 1000x1000x450 40x40x1½ 120 530 641 673 16 92.0 1000x1000x500 40x40x2 120 530 641 687 16 92.0 1000x1000x600 40x40x3 132 542 641 687 16 100.0 1000x1000x600 40x40x24 708 1118 593 771 16 457.0 1000x1000x700 40x40x28 708 1118 632 810 16 541.0 1000x1000x750 40x40x30 708 1118 633 811 16 571.0 1000x1000x800 40x40x32 708 1118 652 830 16 605.0 1000x1000x900 40x40x36 708 1118 652 855 16 634.0Note: Regular numbers are filament wound tees; Italic numbers are fabricated tees.250x250x50 10x10x2 115 185 322 16 25.6 250x250x80 10x10x3 115 185 323 16 26.3 300x300x25 12x12x1 84 160 329 16 22.3 300x300x40 12x12x1½ 102 178 334 16 26.1 300x300x50 12x12x2 117 193 348 16 30.2 300x300x80 12x12x3 117 193 349 16 30.9 350x350x25 14x14x1 81 170 344 16 24.3 350x350x40 14x14x1½ 99 188 349 16 28.4 350x350x50 14x14x2 114 203 363 16 32.7 350x350x80 14x14x3 114 203 369 16 33.4 350x350x100 14x14x4 114 203 364 16 34.2 400x400x25 16x16x1 85 187 369 16 29.1 400x400x40 16x16x1½ 103 205 374 16 33.8 400x400x50 16x16x2 118 220 388 16 38.5 400x400x80 16x16x3 118 220 389 16 39.2 400x400x100 16x16x4 118 220 389 16 39.9Note: Other sizes, or multiple size branched tees available on request. Please contact Ameron.500x500x80 20x20x3 100 227 433 16 41.4 500x500x100 20x20x4 113 240 433 16 45.9 500x500x150 20x20x6 138 265 454 16 54.8 600x600x25 24x24x1 88 266 460 16 51.9 600x600x40 24x24x1½ 88 266 467 16 52.0 600x600x50 24x24x2 88 266 480 16 53.0 600x600x80 24x24x3 100 278 481 16 58.2 600x600x100 24x24x4 113 291 481 16 63.4 600x600x150 24x24x6 138 316 502 16 73.7 700x700x25 28x28x1 88 266 521 16 59.3 700x700x40 28x28x1½ 88 266 527 16 59.3 700x700x50 28x28x2 88 266 541 16 60.5 700x700x80 28x28x3 100 278 542 16 66.5 700x700x100 28x28x4 113 291 542 16 72.6 700x700x150 28x28x6 138 316 563 16 84.5 750x750x25 30x30x1 88 266 546 16 63.2 750x750x40 30x30x1½ 88 266 552 16 63.4 750x750x50 30x30x2 88 266 566 16 64.4 750x750x80 30x30x3 100 278 567 16 70.8 750x750x100 30x30x4 113 291 567 16 77.1 750x750x150 30x30x6 138 316 588 16 89.8 800x800x25 32x32x1 88 266 571 16 66.9 800x800x40 32x32x1½ 88 266 576 16 67.2 800x800x50 32x32x2 88 266 590 16 68.1 800x800x80 32x32x3 100 278 590 16 74.9 800x800x100 32x32x4 113 291 590 16 81.6 800x800x150 32x32x6 138 316 610 16 94.9 900x900x25 36x36x1 88 291 621 16 78.3 900x900x40 36x36x1½ 88 291 627 16 78.6 900x900x50 36x36x2 88 291 641 16 79.6 900x900x80 36x36x3 100 303 642 16 87.0 900x900x100 36x36x4 113 316 642 16 94.4 900x900x150 36x36x6 138 341 663 16 109.2 1000x1000x25 40x40x1 120 530 672 16 92.3 1000x1000x40 40x40x1½ 120 530 677 16 92.6 1000x1000x50 40x40x2 120 530 691 16 93.7 1000x1000x80 40x40x3 132 542 692 16 103.0Note: Other sizes, or multiple size branched tees available on request. Please contact Ameron.Bushing Saddles 45º Laterals Filament-wound pipe saddles with stainless steel, 1/2 inch and 3/4 inchthreaded bushings.*Nominal Angle Saddle Saddle Maximum Average Required250 10 180 100 14 16 1.6 1 1 300 12 180 100 14 12 1.9 1 1 350 14 180 100 14 12 2.1 1 1 400 16 180 100 14 12 2.5 - 2 450 18 90 100 14 12 3.3 - 1 500 20 90 100 14 12 3.7 1 1 600 24 90 100 14 12 4.4 - 2* Consult Ameron for other type material, or other sized bushings.Filament-wound 45° laterals with integral Quick-Lock socking ends.Nominal Laying Overall Laying Overall Maximum Average Pipe Length Length Length Length Working Weight Size (LL1) (OL1) (LL2) (OL2) Pressure[mm] [inch] [mm] [mm] [mm] [mm] [bar] [kg] 50 2 64 110 203 249 16 1.6 80 3 76 122 254 300 16 3.0 100 4 76 122 305 351 16 3.9 125 5 89 146 337 394 16 5.8 150 6 89 146 368 425 16 6.8 200 8 114 178 445 509 16 12.0 250 10 127 197 521 591 12 21.0 300 12 140 216 622 698 12 30.0 350 14 140 229 622 711 12 39.0 400 16 140 242 622 724 12 54.0。

2023—2024学年度上学期高三年级十月联考化学试卷试卷满分：100分＊祝考试顺利＊注意事项：1答题前，先将自己的姓名、准考证号填写在试卷和答题卡上，并将准考证号条形码粘贴在答题卡上的指定位置。

2选择题的作答：每小题选出答案后，用2B铅笔把答题卡上对应题目的答案标号涂黑。

写在试卷、草稿纸和答题卡上的非答题区域均无效。

3非选择题的作答：用黑色签字笔直接答在答题卡上对应的答题区域内。

写在试卷、草稿纸和答题卡上的非答题区域均无效。

4考试结束后，请将本试卷和答题卡一并上交。

可能用到的相对原子质量：H1 N 14 0 16 F 19 Mg 24-S 32 K 39 Fe 56 Ni 59 一、选择题：本题共15小题，每小题3分，共45分。

在每小题给出的四个选项中，只有一项是符合题目要求的。

l．生活中处处有化学。

下列说法正确的是A.食用白糖的主要成分：庶糖B.水煤气的主要成分：甲烧C.84消毒液的主要成分：次氯酸钙D.植物油的主要成分：高级脂肪酸2.湖北大冶铁矿素有江南“聚宝盆”的美称。

下列说法正确的是A.生铁属于碳素钢B.，铁元素位千d区c.铁强化酱油中铁为单质 D.常用KSCN检验Fe2+3.2016年IUPAC将117号元素命名为础(Ts)。

下列关于帘Ts和帘Ts的说法正确的是A.二者互为同位素B.都含有117个中子C.含有不同的电子数D.分别含有176个和177个质子4.两种有机物的分子式均为C3压o,二者的沸点信息如下图所示。

：丙醇：91.2·c 下列说法错误的是A.二者互为同分异构体c.一氯代物均有4种甲乙酸：10.8-CB.碳原子均为sp3杂化D.丙醇分子间存在氢键化学试卷第1.页（共8页）5.制备过氧化锡晶体的原理为S产＋H心计8H20=Sr02·8比Ot+2H.，装置如下图所示。

下列说法错误的是A.该反应为氧化还原反应B.仪器X的作用是防倒吸C.氨气的作用是中和H+D.冰水混合液可减少Sr02·8比0分解6.设凡为阿伏加德罗常数的值。

pbs使用手册PBS（Portable Batch System）是一种用于管理和调度作业的软件系统，广泛应用于高性能计算和云计算环境。

以下是PBS使用手册的简要介绍：1. 作业提交：用户可以使用PBS命令行工具或脚本提交作业。

提交作业时，需要指定作业的名称、脚本文件、执行所需的资源等信息。

作业提交后，PBS会将作业放入队列中等待调度。

2. 作业调度：PBS使用作业调度器来决定作业的执行顺序。

调度器会根据作业的优先级、资源需求和可用资源的情况来选择合适的作业执行。

3. 作业执行：一旦作业被调度器选中，PBS会将作业分配到指定的计算节点上执行。

在作业执行期间，PBS会监控作业的运行状态，确保资源的正确使用和管理。

4. 作业管理：用户可以通过PBS命令行工具或Web界面查看作业的状态、资源使用情况、执行日志等信息。

用户还可以对作业进行控制，如暂停、恢复、杀死等操作。

5. 资源管理：PBS提供了一套完整的资源管理机制，包括对计算节点、存储设备和网络资源的管理。

用户可以通过PBS来申请和释放资源，以满足作业的资源需求。

6. 用户认证和权限管理：PBS支持用户认证和权限管理功能，以确保只有授权用户才能提交和管理作业。

用户需要使用有效的用户名和密码登录系统，并具有相应的权限来执行特定的操作。

7. 日志和监控：PBS提供了详细的日志记录和监控功能，以便用户了解作业的执行情况和系统的运行状态。

用户可以通过查看日志文件来获取作业的执行日志、系统事件等信息。

以上是PBS使用手册的简要介绍，具体的操作细节和配置选项可能因版本和实际应用而有所不同。

建议查阅具体版本的PBS文档或向专业人员咨询以获得更详细的信息和使用指导。

For the customer use onlyPI2EQX502TZHE SMA EVB User Guide IntroductionPericom Semiconductor’s PI2EQX502T is a low power, high performance 5.0 Gbps signal ReDriver specifically for the USB 3.0 protocol.The device provides programmable equalization and De-Emphasis to optimize performance over a variety of physical mediums by reducing Inter-Symbol Interference.PI2EQX502T supports two 100Ω Differential CML data I/O’s between the Protocol ASIC to a switch fabric, over cable, or to extend the signals across other distant data pathways on the user’s platform.This user guide describes how to use PI2EQX502TZHE SMA EVB for evaluation.Figure1 shows top view and bottom view of PI2EQX502TZHE SMA EVB.Figure1a. TOP view of PI2EQX502TZHE SMA EVBPericom Semiconductor Corp.For the customer use onlyFigure1b. Bottom view of PI2EQX502TZHE SMA EVBBoard Operationz Logical Block DiagramFigure2 shows the logical block diagram of PI2EQX502TZHE.Figure2. Logical Block Diagram of PI2EQX502TZHEPericom Semiconductor Corp.For the customer use only z Board Setting and Operation1) Power SupplyOn the EV board, there is one way for the power supply below.Two 3-Pin headers are for this 3.3V power and ground input.Figure3. Power Input for PI2EQX502TZHE SMA board2) Configuration ControlPI2EQX502TZHE provides pin control for EQ_A/B, DE_A/B and OS_A/B on EVB like in dark blue below.Figure4. Pin control for PI2EQX502TZHE SMA boardOn PI2EQX502TZHE EVB, Below are description and configuration tables for equalization, de-emphasis and swing control setting.Equalization SettingEQ_A and EQ_B are the selection pins for the equalization selection for ChA and ChB in Table2 below. EQ_A or EQ_B can be selected by 3pin headers for 0, open and 1 option to separately 3dB, 6dB and 9dB. N ote for 12dB, the user needs to hand-solder one 48kohm resistor between EQ_A/B and ground like Figure5.Pericom Semiconductor Corp.For the customer use onlyPericom Semiconductor Corp.Table2. Equalizer Configuration Selection Table for PI2EQX502TZHEFigure5. 48Kohm Resistor hand-soldered for 12dB selection of EQ_A/B on PI2EQX502TZHE SMA boardDe-emphasis Setting:DE_A and DE_B are the selection pins for the equalization selection for ChA and ChB in Table3 below. DE_A orDE_B can be selected by 3pin headers for 0, open and 1 option to separately 0dB, -3.5dB and -6dB.Table3. De-emphasis Configuration Selection Table for PI2EQX502TZHER=48KohmR=48KohmFor the customer use onlyPericom Semiconductor Corp.Swing Setting:OS_A and OS_B are the selection pins for the equalization selection for ChA and ChB in Table4 below. OS_A or OS_B can be selected by 3pin headers for 0(GND) and 1(VDD) option to separately 700mV and 1000mV.Table4. Swing Configuration Selection Table for PI2EQX502TZHE3) EVB Test ConnectionFigure6 is the test connection example for AI signal input and AO signal output.Figure6. Test connection with PI2EQX502TZHE SMA boardPower Supply for3.3V Power and GNDFor the customer use onlyPericom Semiconductor Corp.Appendix A: PCB SchematicAppendix B: PCB Stack-upFor the customer use only HistoryVersion 1.0 Original Version 2014/1/27Pericom Semiconductor Corp.。

The Large Displays are easy to configure and scale to virtually any engineering units with the push buttons on the front panel, or with a personal computer using the free configuration software and the optional Ethernet connectivity or Serial Communications.The Ethernet option allows the device to be connected on a standard Ethernet network and communicates using standard TCP/IP protocol. The Ethernet option (-C4EI) also includes RS485 (and RS422) Serial Communications. The serial communications option (-C24) includes both RS232 and RS485 (and RS422) on one instrument. It communicates with a straightforward ASCII communications protocol, as well as MODBUS protocol.Control FunctionsThe Universal Large Displays features a choice of two optional outputs: Form C SPDT (single pole double throw) mechanical relays (-3), Solid State Relays (-2), DC pulse (-4), and/or programmable analog output (-5) selectable as either a controlling function or as retransmission of the process value.The Universal Large Displays can control simple manual operation to ON-OFF and full Autotune PID control. (Selectable preset tune, adaptive tune, PID, PI, PD control modes.) The dual control outputs can be configured for a variety of independent control and alarm applications. The ramp-to-setpoint feature allows the user to define the rate of rise to setpoint, minimizing thermal shock to the load during start-up. Maximum ramp time: 99.59 (HH.MM), Soak: 00.00 to 99.59 (HH.MM), Damping: 1 to 8 in unit steps. Input types: 0 to 20 mA, 0 to 100 mV, 0 to 1 V and 0 to 10 Vdc. For applications that do not require PID control,Universal Large Displays controllers are available in a special model that offer simplified programming. The Universal Large Displays “Simplified Menu” model (specify -SM option) offers simplified programming. The menu flowchart is similar to programmable digital panel meters that are used for on/off control or alarms. (Please see the Universal Large Displays operator’s manuals for programming details.)Meters shown smallerthan actual size.Large DisplayMeters and ControllersThe Large Displays can handle a wide variety of signal inputs direct from transducer or process transmitters and offer multiple control output options and serial or Ethernet connectivity for logging the data.The “Universal Temperature+Process LargeDisplay ” (iLD-UTP) is designed for Thermocouples, RTD’s, and Process (DC) Voltage or Current. Ithandles TEN (10) thermocouple types: K, J, T, E, R, S, B, C, N, & J DIN.It works with a wide selection of RTD’s, both Pt. 0.00385 and 0.00392 curves for 100 Ω, 500 Ω, and 1000 Ω and it measures with 2, 3, or 4 wireconnections for the highest accuracy. This model also measures process voltage: 0 to 100 mV , 0 to 1V , 0 to 10V ranges and process current, 0 to 20 mA(4 to 20 mA) with built-in excitation of 24 Vdc standard.The “Universal Strain+Process Large Display ” (iLD-SP) handles a wide variety of DC voltage and current outputs from all common load cells, pressure transducers, and most any strain gagetype of transducer. The meter measures input ranges of 0 to 100 mV , -100 mV to 1V , 0 to 10V , 0 to 20 mA (4 to 20 mA) with built-in excitation of 5 Vdc and 10 Vdc standard. This model also features 10 point linearization enabling accurate measurements from a wide assortment of unique and nonlinear transducers.U U L and cUL Certified U B ig Bright LED 4-Digits U P rogram to Change Colors: RED, AMBER, GREEN U T emperature and Process Input Models U S train and Process Input Models U O ptional Relays, DC Pulse, and Analog Outputs for Alarm and Full PID Control U C ommunications Via Ethernet, RS232, RS485, and MODBUS ®U E mbedded Web Server U RoHS 2 Compliant57 and 101 mm (2.25 and 4")Displays Available!iLD-UTP and iLD-SP Series51Universal Temperature and Process Input (Model UTP)Accuracy: ±0.5°C temp; 0.03% reading processResolution: 1°/0.1°; 10 µV process Temperature Stability: RTD: 0.04°C/°CThermocouple @ 25°C (77°F):0.05°C/°C—cold junction compensation Process: 50 ppm/°CNMRR: 60 dB; CMRR: 120 dB A/D Conversion: Dual slopeReading Rate: 3 samples per second Digital Filter: ProgrammableDisplay : 4-digit, 7-segment LED 57.2 mm (2.25") or 101.6 mm (4.00") red, green and amber programmable colors for process variable, set point and temperature unitsInput Types: Thermocouple, RTD, analog voltage, analog currentThermocouple Lead Res: 100 Ω max Thermocouple Type (ITS 90): J, K, T , E, R, S, B, C, N, LRTD Input (ITS 68): 100/500/1000 Ω Pt sensor, 2-, 3- or 4-wire; 0.00385 or 0.00392 curveVoltage Input: 0 to 100 mV , 0 to 1 V , 0 to 10 VdcInput Impedance: 10 M Ω for 100 mV 1 M Ω for 1 or 10 VdcCurrent Input: 0 to 20 mA (5 Ω load)Configuration: Single-ended Polarity: UnipolarStep Response: 0.7 sec for 99.9%Decimal Selection: Temperature: None, 0.1Process: None, 0.1, 0.01 or 0.001Setpoint Adjustment: -1999 to 9999 cts Span Adjustment: 0.001 to 9999 cts Offset Adjustment: -1999 to 9999Excitation (Optional in Place of Communication): 24 Vdc @ 25 mAUniversal Strain and Process Input (Model SP)Accuracy: 0.03% reading Resolution: 10/1µVTemperature Stability: 50 ppm/°C NMRR: 60 dB; CMRR: 120 dB A/D Conversion: Dual slopeReading Rate: 3 samples per second Digital Filter: Programmable Input Types: Analog voltage, analog currentVoltage Input: 0 to 100 mVdc, -100 mVdc to 1 Vdc, 0 to 10 VdcInput Impedance: 10 M Ω for 100 mV; 1 M Ω for 1 V or 10 VdcCurrent Input: 0 to 20 mA (5 Ω load)Linearization Points: Up to 10 Linearization PointsConfiguration: Single-ended Polarity: UnipolarStep Response: 0.7 sec for 99.9%Decimal Selection: None, 0.1, 0.01 or 0.001Setpoint Adjustment: -1999 to 9999 cts Span Adjustment: 0.001 to 9999 cts Offset Adjustment: -1999 to 9999Excitation (Optional in Place of Communication):5 Vdc @ 40 mA; 10 Vdc @ 60 mACommunication OptionsEthernet: Standards compliance IEEE 802.3 10Base-TSupported Protocols: TCP/IP , ARP , HTTPGETRS232/RS422/RS485/MODBUS ®: Selectable from menu; both ASCII and MODBUS protocol selectable from menu; programmable 300 to 19.2 K baud;complete programmable setup capability; program to transmit current display,alarm status, minimum/maximum, actual measured input value and status RS485: Addressable from 0 to 199Connection: Screw terminals Control for UTP, SP Action: Reverse (heat) or direct (cool)Alarm 1 and 2 (Programmable)Operation: High/low, above/below, band, latch/unlatch, normally open/normally closed and process/deviation; front panel configurationsIsolationPower to Input/Output: 2300 Vac per 1 min test (RS232 or RS485, input or output)Between Inputs: 500 Vac per 1 min testGeneralPower: 100 to 240 Vac ±10%, 50/60 Hz 22.5 WEnvironmental Conditions: 0 to 40°C (32 to 104°F), 90% RH non-condensing Warm-Up to Rated Accuracy: 60 minutesProtection: NEMA 1 (IP65) front bezel DimensionsiLD24: 289 L x 137 W x 73 mm D (11.75 x 5.375 x 2.875")iLD44: 480 L x 211 W x 95 mm D (18.11 x 8.31 x 3.76")Factory Scaling (-FS) is available if you prefer the unit to be fully configured before shipment.Please provide your selections forOrdering Example: iLD24-UTP-33-C24, large 57.2 mm (2.25") 4-digit controller with temperature/process input, 2 relays and serial communication.Programmable Color Display The Large Display can be programmed to change colorsbetween RED , AMBER , and GREEN at any set point or alarm point. The Large Display has a wide range of signal inputs as well as control, alarm, and communication outputs including: RS232, RS485, MODBUS ®, and Ethernet. The device with anembedded Web Server can connect directly to Ethernet/Internet. Y ou can “see” your meter and control your process through a web browser over the Internet from halfway around the world. With the Large Display, you can also see your meter from a hundred feet.The Large Display can be mounted flush in a panel or surface mounted with the included brackets. The entire Large Display enclosure provides NEMA 1 protection.Configuration of the iLD-UTP or iLD-SP can be performed by using either -C24 or -C4EI options and the configuration software that is available on our website.2。

动态流变仪测聚合物复合材料中填料与基体间的相互作用2011011743 分1 黄浩同组实验者：刘念实验日期：2014-3-26一、实验目的1. 知道旋转流变仪的基本功能以及适用范围。

2．了解旋转流变仪的基本结构、工作原理。

3．掌握采用旋转流变仪测量聚合物的动态粘度的方法。

4. 掌握采用旋转流变仪测量聚合物与纳米片层测量微观相互作用的方法。

二、实验仪器Anton Paar Physica 301 旋转流变仪、空气压缩机、循环泵槽、不同比例的淀粉填充PBS 复合材料、铜铲、铜刷三、实验原理聚合物受外力作用时，会发生流动与变形，产生内应力。

流变学所研究的就是流动、变形与应力间的关系。

旋转流变仪是现代流变仪中的重要组成部分，它们依靠旋转运动来产生简单剪切流动，可以用来快速确定材料的粘性、弹性等各方面的流变性能。

旋转流变仪一般是通过一对夹具的相对运动来产生流动的。

引入流动的方法有两种：一种是驱动一个夹具，测量产生的力矩，这种方法最早是由Couette在1888年提出的，也称为应变控制型，即控制施加的应变，测量产生的应力；另一种是施加一定的力矩，测量产生的旋转速度，它是由Searle于1912年提出的，也称为应力控制型，即控制实际的应力，测量产生的应变。

实际用于粘度等流变性能测量的几何结构有同轴圆筒（Couette）、锥板和平行板等。

选择流变仪的测试模式一般可以分为稳态测试、瞬态测试和动态测试，区分它们的标准是应变或应力施加的方式。

本实验着重介绍动态测试模式，动态测试主要指对流体施加振荡的应变或应力，测量流体相应的应力或应变。

动态测试中，可以使用在被测材料共振频率下的自由振荡，或者采用在固定频率下的正弦振荡。

这两种方式都可用来测量粘度和模量，不同的是在固定频率下的正弦振荡测试在得到材料性能频率依赖性的同时，还可得到其性能的应变或应力依赖性。

在动态测试中，流变仪可以控制振动频率、振动幅度、测试温度和测试时间。

POWER MANAGEMENTApplicationsR eset ThresholdSuf f i x V olt ag e (V) L 4.63 M 4.38 J 4.00 T 3.08 S 2.93 R 2.63 Z 2.32The IMP811/IMP812 are low-power supervisors designed to monitor voltage levels of 2.5V,3.0V, 3.3V and 5.0V power supplies in low-power micro-processor (µP), microcontroller (µC) and digital systems. Each fea-tures a debounced manual reset input. The IMP811/812 are improved drop-in re-placements for the Maxim MAX811/812 with ex-tended temperature specifications to 125°C.A reset signal is issued if the power supply voltage drops below a preset threshold and is asserted for at least 140ms after the supply has risen above the reset threshold. The IMP811 has an active-low output RESET that is guaranteed to be in the correct state for VCC down to 1.1V. The IMP812 has an active-high output RESET. The reset comparator is de-signed to ignore fast transients on VCC.Low power consumption makes the IMP811/IMP812 ideal for use in portable and battery-operated equipment. Available in a compact 4-pin SOT143 package, the devices use minimal board space.Three voltage thresholds are available to support 2.5V to 5V systems:General Description• Improved Maxim MAX811/MAX812 replacement—Specified to 125°C • 6µA supply current• Monitor 5V,3.3V,3V and 2.5V supplies • Manual reset input• 140ms min. reset pulse width • Guaranteed over temperature• Active-LOW reset valid with 1.1V supply (IMP811)• Small 4-pin SOT-143 package • No external components• Power-supply transient-immune designKey Features- Computers and controllers - Embedded controllers - Battery operated systems - Intelligent instruments- Wireless communication systems - PDAs and handheld equipmentBlock DiagramV CCV CCIMP811 (IMP812)V CCGNDRESET ¯¯¯¯¯¯ InputGNDRESET¯¯¯¯¯¯ RESET ¯¯¯ MRPOWER MANAGEMENTAbsolute Maximum RatingsPin AssignmentsSOT143¯¯¯¯¯¯ (RESET ) RESETGNDV CCIMP811 (IMP812)MR¯¯¯ Ordering InformationP a c k a g e Mar king 2 P a r t N umber 1 R eset Threshold (V) T e mper ature R ang ePin-Pack a g e (XXX L o t Code)IMP811 Active LOW ResetIMP811LEUS/T 4.63 – 40°C to +125°C 4-SOT143AMXXX IMP811MEUS/T 4.38 – 40°C to +125°C 4-SOT143 ANXXX IMP811JEUS/T 4.00 – 40°C to +125°C 4-SOT143 AOXXX IMP811TEUS/T 3.08 – 40°C to +125°C 4-SOT143 APXXX IMP811SEUS/T 2.93 – 40°C to +125°C 4-SOT143 AQXXX IMP811REUS/T 2.63 – 40°C to +125°C 4-SOT143 ARXXX IMP811ZEUS/T 2.32 – 40°C to +125°C 4-SOT143 ZCXXX IMP812 Active HIGH ResetIMP812LEUS/T 4.63 – 40°C to +125°C 4-SOT143 ASXXX IMP812MEUS/T 4.38 – 40°C to +125°C 4-SOT143 ATXXX IMP812JEUS/T 4.00 – 40°C to +125°C 4-SOT143 AUXXX IMP812TEUS/T 3.08 – 40°C to +125°C 4-SOT143 AVXXX IMP812SEUS/T 2.93 – 40°C to +125°C 4-SOT143 AWXXX IMP812REUS/T 2.63 – 40°C to +125°C 4-SOT143 AXXXX IMP812ZEUS/T 2.32 – 40°C to +125°C4-SOT143ZDXXXNotes: 1. Tape and Reel packaging is indicated by the /T designation.2. Devices may also be marked with full part number: 811L, 812M etc. XXX refers to lot.Pin Terminal Voltage with Respect to GroundV CC . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 6.0V Operating Temperature Range . . . . . . . –40°C to 125°CRESET, RESET and MR . . . . . –0.3V to (V CC + 0.3V) Storage Temperature Range . . . . . . . . –65°C to 160°C Input Current at V CC and MR . . . . . .. . . . . . . . 20mA Lead Temperature (soldering, 10 sec) . . . . . 300°COutput Current: RESET or RESET . . . . . . . . . 20mA Rate of Rise at V CC . . . . . . . . . . . . . . . . .. . 100V/µsPower Dissipation (T A = 70°C) . . . . . . . . . . 320mW(Derate SOT-143 4mW/°C above 70°C)These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for pro-longed time periods may affect device reliability.¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯ ¯¯¯POWER MANAGEMENTElectrical CharacteristicUnless otherwise noted V CC is over the full voltage range, T A = –40°C to 125°C.Typical values at T A = 25°C, V CC = 5V for L/M/J devices, V CC = 3.3V for T/S devices and V CC = 3V for R devices, V CC =2.5V for Z devicesP a r a meterSymbol Conditions Min T ypMa U nits Input V oltage (V CC ) RangeV CC T A = 0°C to 70°C T A = – 40°C to 125°C 1.1 1.25.5 5.5 VSupply Current I CCT A = – 40°C to 85°C T A = – 40°C to 85°C T A = 85°C to 125°C T A = 85°C to 125°C V CC < 5.5V , L/M/J V CC < 3.6V , R/S/T/Z V CC < 5.5V , L/M/J V CC < 3.6V , R/S/T/Z 6 5 15 10 25 20 µAReset Threshold V TH L devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 4.54 4.50 4.40 4.63 4.72 4.75 4.86 VM devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 4.30 4.25 4.16 4.38 4.46 4.50 4.56 J devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 3.92 3.89 3.80 4.00 4.07 4.10 4.20 T devices T A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 3.03 3.00 2.92 3.08 3.14 3.15 3.23 S devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 2.88 2.85 2.78 2.93 2.98 3.00 3.08 R devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C 2.58 2.55 2.50 2.63 2.68 3.70 2.76 Z devicesT A = 25°CT A = – 40°C to 85°C T A = – 40°C to 125°C2.27 2.24 2.222.32 2.37 2.39 2.42 Reset Threshold Temp. Coefficient TC VTH30 ppm/°C V CC to Reset Delay V CC = V TH to (V TH - 125mV),L/M/J devices40 µs V CC = V TH to (V TH - 125mV),R/S/T/Z devices 20 Reset Active Timeout Period T A = – 40°C to 85°C T A = 85°C to 125°C 140 100 240560 840ms MR Minimum Pulse Width t MR 10 us MR Glitch ImmunityNote 3 100 ns MR to RESET Propagation Delayt MD Note 20.5usMR Input ThresholdV IH V CC >V TH(MAX),IMP811/812L/M/J 2.3 VV IL0.8V IH V CC >V TH(MAX),IMP811/812R/S/T/Z 0.7V CC V IL0.25V CCMR Pull-up Resistance102030K Ω¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯POWER MANAGEMENTLow RESET Output V oltage (IMP811)V OLV CC = V TH min., I SINK = 1.2mA, IMP811R/S/T/Z0.30.4 0.3 VV CC = V TH min., I SINK = 3.2mA, IMP811L/M/J V CC > 1.1V , I SINK = 50µAHigh RESET Output V oltage (IMP811) V OH V CC > V TH max., I SOURCE = 500µA, IMP811R/S/T/Z 0.8V CCV CC -1.5V V CC > V TH max., I SOURCE = 800µA, IMP811L/M/J Low RESET Output V oltage (IMP812) V OL V CC = V TH max., I SINK = 1.2mA, IMP812R/S/T/Z0.3 0.4 V V CC = V TH max., I SINK = 3.2mA, IMP812L/M/J High RESET Output V oltage (IMP812)V OH1.8V < V CC < V TH min., I SOURCE = 150µA0.8V CCVElectrical CharacteristicUnless otherwise noted V CC is over the full voltage range, T A = –40°C to 125°C.Typical values at T A = 25°C, V CC = 5V for L/M/J devices, V CC = 3.3V for T/S devices and V CC = 3V for R devices, V CC =2.5V for Z devicesNotes: 1. Production testing done at TA = 25°C. Over temperature specifications guaranteed by design only using six sigma design limits.2. RESET output is active LOW for the IMP811 and RESET output is active HIGH for the IMP812.3. Glitches of 100ns or less typically will not generate a reset pulse.Pin DescriptionsPin N u mberN a me Function 1 GND Ground2 (IMP811) RESET RESETis asserted LOW if V CC falls below the reset threshold and remains LOW for the 240ms typical reset timeout period (140ms minimum) after V CC exceeds the threshold.2 (IMP812)RESETRESET is asserted HIGH if V CC falls below the reset threshold and remains HIGH for the 240ms typical reset timeout period (140ms minimum) after V CC exceeds the threshold.3MR4 V CCPower supply input voltage (2.5V,3.0V,3.3V,5V)Manual Reset Input. A logic LOW on MR asserts RESET. RESET remains activeas long as MR is LOW and for 180ms after MR returns HIGH. The active low in-put has an internal 20k Ω pull-up resistor. The input should be left open if not used.It can be driven by TTL or CMOS logic or shorted to ground by a switch.. Related ProductsIMP809 IMP810 IMP811 IMP812 Max. Supply Current15µA 15µA 15µA 15µA Package Pins334 4 Manual RESET input ■ ■Package T ypeSOT -23 SOT -23 SOT -143 SOT -143Active-HIGH RESET output ■ ■Active-LOW RESET output■ ■¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯¯¯¯¯¯¯¯¯¯POWER MANAGEMENTTypical Performance CharacteristicsThe reset signal is asserted –LOW for the IMP811 and HIGH for the IMP812 – when the VCC signal falls below the threshold trip voltage and remains asserted for 140ms minimum after the VCC has risen above the threshold.Alogic low on MR asserts RESET LOW on the IMP811 and HIGH on the IMP812. MR is internally pulled high through a 20k Ω resistor and can be driven by TTL/CMOS gates or with open collector/drain outputs.MR can be left open if not used.MR may be connected to a normally-open switch connected to ground without an external debounce circuit.For added noise rejection, a 0.1μF capacitor from MR to Ground can be added.Figure 1. Reset Timing DiagramRESET Output OperationIn μP/μC systems it is important to have the processor begin operation from a known state or be able to return the system to a known state. A RESET output to a processor is provided to prevent improper op-eration during power supply sequencing or low voltage – brownout – conditions.The IMP811/812 are designed to monitor the system power supply voltages and issue a RESET signal when levels are out of range. RESET outputs are guaranteed to be active for VCC above 1.1V. When VCC exceeds the reset threshold, an internal timer keeps RESET active for the reset timeout period, after which RESET becomes inactive (HIGH for the IMP811 and LOW for the IMP812).V THActive ResetTimeout Period 140ms minimumIMP811IMP812 5V 0V5V 0V 5V 0VRESETRESETV CCActive Reset Timeout Period5V 0V MRReset Timing and Manual Reset (MR)¯¯¯ ¯¯¯¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯POWER MANAGEMENTTo ensure that logic inputs connected to the IMP811 RESET pin are in a known state when VCC isunder 1.1V, a 100k Ω pull-down resistor at RESET is needed. The value is not critical.A similar pull-up resistor to VCC is needed with the IMP812. If VCC drops below the reset threshold, RESET automatically becomes active. Alternatively, external circuitry or a human operator can initiate this condition using the Manual Reset (MR) pin. There is aninternal pullup on MR so it can be left open if it is not used. MR can be driven by TTL/CMOS logic or even an external switch, since it is already debounced. If the switch is at the end of a long cable, it might require a bypass (100nF) at the pin if noise pickup is a problem. Eight voltage thresholds are available to support 2.5V and 5V systems:Typical Performance CharacteristicsValid Reset with V CC under 1.1VR eset ThresholdSuf f i x V olt ag e (V) L 4.63 M 4.38 J 4.00 T 3.08 S 2.93 R 2.63 Z 2.32V CCPower SupplyGNDIMP812100k ΩRESET V CCPower SupplyGNDIMP811100k ΩRESETFigure 2. RESET Valid with VCC Under 1.1VFigure 3. RESET Valid with V CC Under 1.1VMRMR¯¯¯¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯ ¯¯¯POWER MANAGEMENTTypical Performance Characteristics(Continued)Negative V CC TransientsTypically short duration transients of 100mV amplitude and 20μs duration do not cause a false RESET. A 0.1μF capacitor at VCC increases transient immunity.Bi-directional Reset Pin InterfacingThe IMP811/812 can interface with µP/µC bi-directional reset pins by connecting a 4.7k Ω resistor in series with the IMP809/810 reset output and the µP/µC bi-directional reset pin.Figure 4. Bi-directional Reset Pin InterfacingPowerSupplyV CCIMP811RESETGNDBUF4.7k ΩBufferedRESETµC or µPRESETInputGNDBi-directional I/O Pin(Example: 68HC11)MR ¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯ ¯¯¯¯¯¯POWER MANAGEMENTMechanical DimensionsPlastic SOT-143 (4-Pin)Symbol InchesMillimetersMinMaxMinMaxA 0.035 0.045 0.900 1.150 A1 0.000 0.004 0.000 0.100 A2 0.035 0.041 0.900 1.050 b 0.012 0.020 0.300 0.500 c 0.003 0.006 0.080 0.150 D 0.110 0.118 2.800 3.000 d 0.008 TYP. E 0.047 0.055 1.200 1.400 E1 0.089 0.1002.250 2.550e 0.037 TYP0.950 TYPe1 0.071 0.0791.8002.000L 0.022 REF0.550 REFL1 0.012 0.020 0.300 0.500 θ0° 8°0° 8°0.200 YYP.POWER MANAGEMENTISO 9001 RegisteredDaily Silver IMP Microelectronics Co.,Ltd7 keda Road ,Hi-Tech Park,NingBo,Zhejiang,P.R.CPost Code:315040Tel:(086)-574-87906358Fax:(086)-574-87908866Email:****************.cn The IMP logo is a registered trademark of Daily Silver IMP. All other company and product names are trademarks of their respective owners @2015 Daily Silver IMP Printed in china Revision: FIssue Date: 28th.Aug.15 Type: Product。

Tech Talks LIVE Schedule –Presentation will begin shortlyFind Past Recorded Sessions at: https:///support/trainingFill out the survey for a chance to wina BG22Thunderboard!TopicDateBuilding a Proper Mesh Test Environment: How This Was Solved in Boston Thursday, July 2Come to your Senses with our Magnetic Sensor Thursday, July 9Exploring features of the BLE Security Manager Thursday, July 23New Bluetooth Mesh Light & Sensor Models Thursday, July 30Simplicity Studio v5 IntroductionThursday, August 6Long Range Connectivity using Proprietary RF Solution Thursday, August 13Wake Bluetooth from Deep Sleep using an RF SignalThursday, August 20Silicon Labs LIVE:Wireless Connectivity Tech Talks Summer SeriesWELCOMESilicon Labs LIVE:Wireless Connectivity Tech TalksSummer SeriesIntroduction to Simplicity Studio 5August 6th, 2020https:///products/development-tools/software/simplicity-studio/simplicity-studio-5What is Simplicity Studio 5?§Free Eclipse Based Development Environment§Designed to support Silicon Labs IoTPortfolio§Provides Access to Target Device-SpecifiedWeb & SDK Resources§Software & Hardware Configuration Tools§Integrated Development Environment (IDE)§Eclipse based, C/C++ IDE§GNU ARM Toolchain§Advanced Value Add Tools§Network Analysis, Code Correlated EnergyProfiling, Configuration Tools, etc.The Data Driving Simplicity Studio 5?Simplicity StudioGecko SDK Dev Guides, TutorialsAPI RMsRef Manuals,Datasheets, ErrataStacks, Gecko Platform,Examples, Demos,metadataHardware KitBoard IDSimplicity Studio 5 -LauncherOn the Welcome PageYou Can•Select Target Device •Start a New Project •Access Support Resources and EducationalPressing ‘Welcome’ onthe tool bar will return to Welcome page at any time.1. Welcome & Target SelectionThis is a “get started” section to help with device or board selection12342. Debug Adapters Area shows connected debug adapters including Silicon Lab kits, Segger, J-Link, etc…3. My ProductsEditable list of products you may wish to use as target devices 4. MenuMenu & Tool bar provide access to a number of functions and shortcutsLauncher Perspective -Overview1. General InformationGI card shows debugger,debugger mode, firmwareversions for adapter andsecurity, SDK12 342. Recommended QSGs Quick links to recommended quick start guides for selected product.3. BoardBoard shows which evaluation board is being used and provides easy access to its documentation.4. Target PartTarget part shows full part number and also provides easy access to its documentationLauncher Perspective –Example Projects1. Technology Filter Keyword Filter box and Technology Type check boxes let you dial into the example you are looking for.122. Resource ListResource list will show corresponding example projects that are intended for your selectedtechnology and target device.Launcher Perspective –Documentation1. Resource FilterKeyword Filter box andResource Type checkboxes let you dial into theresource you are lookingfor (Data Sheet, App Note,Errata, QSG, etc…).1232. Technology TypeTechnology check boxesnarrow your search basedon a give technology(Bluetooth, Bootloaders,Thread, Zigbee, etc…).3. ResourcesList of resources that willnarrow as you selectfilters (Data Sheet, AppNote, Errata, QSG, etc…).Launcher Perspective –Demos1. Demo FilterDemo Filter allows you to narrow your search of demos for your selected device.122. DemosList of Pre-compiled demos that are ready to be programmed into your selected device.Launcher Perspective –Compatible Tools1. Compatible ToolsLaunching pad for toolssuch as Hardware1Configurator, NetworkAnalyzer, Device Console,Energy Profiler, etc…Launcher Perspective –Tools –Pin Configuration ToolPin Configuration ToolSimplicity Studio 5 offers aPin Configuration Tool thatallows the user to easilyconfigure new peripheralsor change the propertiesof existing ones. Thegraphical view will differbased on the chip beingused.Simplicity Studio 5 -IDEIDE –Overview1. Tool Bar & MenuLaunching pad for tools 123452. Project ExplorerDirectory structure and allfiles associate with theproject.4. Editor & ConfiguratorsCode editing windows andconfigurators forproject/technologies.3. Debug AdaptersShows connecteddebuggers and EVKs5. Additional WindowsProblems, Search, CallHierarchy, ConsoleIDE –Project Configurator Overview1. Target & SDKAllows user to changedevelopment target andSDK.1232. Project DetailsCan change import mode& force generation.3. Project GeneratorsAllows user to modifywhat files are beinggenerated by projec tIDE –Project Configurator Software Components1. ComponentExpand components to see categories and sub-categories.1232. Selected Component View details of a given component. Gearindicates a configurable component. Check marks show installed components.3. Filters & KeywordsHelp you to search various component categoriesIDE –Configurators (GATT)1. GATT Configurator View, Add, Remove GATT Profiles, Services, Characteristics, and Descriptors122. GATT EditorAllows user to view & modify settings in the Profiles, Services, Characteristics and Descriptors within the GATT.IDE –Configurators (Editing the GATT)EDIT (Device Name)From GATT Configuratorclicking on an editableitem such as device namewill open up a newwindow allowing the userto see content that can beedited and several optionsfor that content that canbe selected/de-selected.Simplicity Studio 5 -MigrationSimplicity Studio -Developer Options*Bugfixes provided per software longevity commitment (https:///products/software/longevity-commitment )Developer ProjectExisting ProjectNew Project GSDK v2.7.x *Simplicity Studio 4*GSDK v3.x.x Simplicity Studio 5Secure VaultFinal Developer BinariesSS4/GSDK2.7x Continuance Option *MigrationToolkitProcess and availability varies by technologyGSDK v2.7.x *Simplicity Studio 4*SS5/GSDK3.x Upgrade OptionLIMITED SUPPORTSubject to longevity commitmentGS D K 2.x t o 3.x = M aj o r C h a n g e .Simplicity Studio –Project StructureBluetooth SDK v2.x Project StructureBluetooth SDK v3.x Project StructureProject Structure There is a change in project structure from GSDK v2.x to GSDK v3.x.It’s now much easier to see which file can be modified by the generator and it’s easier to find/identify the configuration files This is important because withGSDKv3.x many more files are generated by the addition of software components.Simplicity Studio –BGAPI CommandsBGAPI CommandBGAPI CommandsBGAPI Commandschange both theirname and theirstructure to make theerror checking andhandling of returnvalues simpler.Simplicity Studio –Changes to BGAPI CommandsChanges to BGAPI Commands With manycommands, renaming means only changing gecko_cmd_ to sl_bt_.Other functions have been renamed due to changes infunctionality, changed API class, or simply to make the functions more logical.Some API functions have been split into multiple ones while others have been merged.123Simplicity Studio 5 -DemoSimplicity Studio 5 -LinksSimplicity Studio –Useful LinksSimplicity Studio 5https:///products/development-tools/software/simplicity-studio/simplicity-studio-5 Simplicity Studio 5 User Guidehttps:///simplicity-studio-5-users-guide/latest/indexQuick Start Guide Bluetooth SDK v3.xhttps:///documents/public/quick-start-guides/qsg169-bluetooth-sdk-v3x-quick-start-guide.pdfTransitioning from Bluetooth SDK v2.x to v3.xhttps:///documents/public/application-notes/an1255-transitioning-from-bluetooth-sdk-v2-to-v3.pdfBluetooth SDK 3.0.0.2 Release Noteshttps:///documents/public/release-notes/bt-software-release-notes-3.0.0.2.pdfThe Largest Smart Home Developer EventS E P T E M B E R9 –1 0, 2 0 2 0Immerse yourself in two days of technical training designedespecially for engineers, developers and product managers.Learn how to"Work With" ecosystems including Amazon and Google and join hands-on classes on how tobuild door locks, sensors, LED bulbs and more.Don't miss out, register today!w o r k s w i t h.s i l a b s.c o mThank you…..Questions? 。