PD69104B 芯片回流焊曲线

回流焊PCB温度曲线讲解回流焊是一种常用的电子组装工艺，用于将电子元件焊接到印刷电路板（PCB）上。

在回流焊过程中，PCB需要经历一系列的温度变化，以确保焊点可靠连接。

下面将讲解回流焊温度曲线的各个阶段及其作用。

1. 预热阶段（Preheat Stage）：回流焊过程开始时，PCB需要从室温逐渐升温至预定温度。

预热阶段的作用是除去PCB上的水分和挥发性有机物，以避免在焊接过程中产生气泡和蒸汽。

通常，预热温度为100°C至150°C，持续时间为1至2分钟。

2. 热液相预热阶段（Thermal Soak Stage）：在预热阶段后，PCB会继续加热至更高的温度，通常为150°C至200°C。

这一阶段的目的是让整个PCB均匀达到焊接温度，以减少焊接过程中的热应力。

热液相预热阶段的持续时间通常为1至4分钟。

3. 焊接阶段（Reflow Stage）：当PCB达到焊接温度时，焊膏开始熔化，将电子元件与PCB焊接在一起。

焊接温度通常为220°C至245°C，具体取决于焊膏的特性。

焊接阶段的持续时间通常为1至3分钟。

4. 冷却阶段（Cooling Stage）：焊接完成后，PCB需要冷却到室温，以确保焊点的稳定性。

冷却阶段通常使用强制风冷却或自然冷却。

冷却时间因焊接设备和PCB的尺寸而异，一般为1至5分钟。

回流焊温度曲线中的每个阶段都有其特定的温度和时间要求，这是为了保证焊接质量和工艺稳定性。

通过控制这些参数，焊接过程中的温度变化可以最小化，从而减少因热应力引起的PCB变形和元件损坏的风险。

总结来说，回流焊温度曲线包括预热阶段、热液相预热阶段、焊接阶段和冷却阶段。

每个阶段都有其特定的温度和时间要求，以确保焊接质量和PCB的稳定性。

通过合理控制回流焊温度曲线，可以提高焊接过程的可靠性和稳定性，从而保证电子产品的性能和可靠性。

回流焊是一种广泛应用于电子制造业的关键工艺，它能够将电子元件精准地焊接到印刷电路板（PCB）上。

摘要随着半导体技术的迅速发展，电子产品的已进入各行各业，涉及航空航天、机械制造、电子商务等，可以说，我们大家的生活已无法离开电子产品。

可焊性测试是电子产品生产制造过程中检验产品可焊接性能的一种必要手段。

产品引线的焊接性能将直接影响到产品的使用，严重的焊接不良甚至会影响到整机的可靠性。

而且此类不良很多是间歇性的，有时会影响维修人员对故障的判断，造成一些不必要的损失。

本文着重介绍了各类可焊性测试方法在元器件生产中的实际应用，以及使用方法中的一些关键点。

通过在工作中的实际应用，结合标准的要点和产品的特点，在不违背标准的情况下，针对各类不同的产品，使用不同的测试方法进行检测，这样能更有效的反应产品的可焊接性能。

特别是针对一些短引脚、无引脚产品，如何使用合适的方法，甚至说使用更有说服力的润湿法来进行检测。

这些方法的研究，将有利于封装厂在生产过程中改进产品电镀品质的检测方法，能更快、更有效的发现产品的电镀缺陷，及时调整生产工艺的，提高产品质量，满足客户的需求。

关键词：可焊性；方法；标准；半导体元器件AbstractWith the rapid development of semiconductor technology, electronic products has entered into all walks of life, involved in aerospace, mechanical manufacturing, electronic commerce and so on, in other words, our life cannot leave the electronic products.Solderability test is a necessary mean to inspect the product solderability during the electronic product manufacturing process. The solderability of the lead will directly affect the product using; serious bad soldering may even affect the reliability of the machine. And such bad soldering is intermittent; sometimes it will affect maintenance personnel’s judgment for fault, causing some unnecessary loss.This article emphatically introduces the practical application of all kinds of solderability test methods in the production of components, and some key points in using the methods. Through practical application, combining the main points of the standard and the characteristics of the products, under the case of without violating the standard, for all kinds of different products, using different testing methods can reflect the solderability more effective. Especially for some short pin and no pin products, how to testby the right method or more persuasive wetting method? The research of these methods will be of conducive forpackaging factory to improve the detection method of improving products electroplating quality in the process of production, and can find plating defects of product faster and more effective to adjust the production technology, improve product quality, and meet customer demand timely.Keywords: Solderability, Methods, Standard, Semiconductor components目录目录摘要 (Ⅰ)Abstract (Ⅱ)第1章绪论 (1)1.1课题研究的目的和意义 (1)1.1.1课题背景 (1)1.1.2目的和意义 (2)1.2 国内外研究现状 (2)1.2.1 课题来源 (2)1.3 课题的主要研究内容 (4)第2章半导体元器件的可焊性描述 (6)2.1 可焊性描述 (6)2.2 测试可焊性的几种主要方法 (6)2.2.1 可焊性测试前处理 (7)2.2.2 助焊剂的使用 (9)2.2.3 焊料的使用 (10)2.2.4 槽焊法 (11)2.2.5 电烙铁法 (12)2.2.6润湿称量法 (13)2.3本章小结 (17)第3章小型短管脚产品使用润湿称量法测试 (18)3.1小型短管脚产品的定义 (18)3.2 设备介绍 (18)3.3 SOT-23产品的测试 (19)3.3.1 SOT-23封装介绍 (19)3.3.2 润湿称量法对SOT-23产品进行测试 (20)3.4本章小结 (22)第4章无外引脚产品的测试 (23)4.1 无外引脚产品介绍 (23)4.2 槽焊法测试 (24)4.3 润湿称量法测试 (25)4.4 本章小结 (26)第5章基板封装产品的测试 (27)5.1基板封装介绍 (27)5.2 槽焊法对基板封装进行测试 (27)5.3 电烙铁法进行补充测试 (29)5.4 本章小结 (29)结论 (30)江苏科技大学硕士论文参考文献 (31)致谢 (33)第1章绪论第1章绪论1.1 课题研究的目的和意义1.1.1课题背景1947年晶体管发明的同时，也开创了半导体封装的历史。

Silicon Lab公司的Si5395/94/92抖动衰减器组合了第四代DSPLL™和Multi-Synth™技术,提供了超低抖动(69fs),可用于高性能的应用如56G SerDes.所有的PLL元件集成在单片上,从而消除和分立解决方案有关的噪音耦合问题.器件级别J/K/L/M/E集成了基准以节省板的空间,提高系统可靠性,降低由温度梯度所引起的声发射噪声效应,而级别A/B/C/D/P则采用外接晶体(XTAL)或晶体振荡器(XO)基准.级别P的抖动为69fs RMS,级别E的抖动为71fs RMS.输入频率范围,差分为8 kHz 到 750 MHz, LVCMOS为8 kHz 到 250 MHz;而输出频率范围,差分为100Hz 到 1028 MHz, LVCMOS为100Hz 到 250 MHz.器件满足G.8262, E.8262.1 EEC标准.主要用在56G/112G PAM4 SerDes时钟,OTN多发探测仪和转发器,10/40/100/200/400G网络线路卡, 10/40/100/400 GbE同步以太网(ITU-TG.8262),医疗图像和测试测量.本文介绍了Si5395/94/92主要特性,简化框图和框图,典型56G SerDes应用电路和同步线路卡SyncE电路图以及评估板Si5394 EVB主要特性,功能框图和电路图与材料清单.The Si5395/94/92 Jitter attenuators combine fourth-generation DSPLL™ and Multi-Synth™ technologies to deliver ultra-low jitter (69 fs) for highperformance applications like 56G SerDes. They are used in applicationsthat demand the highest levelof integration and jitter performance. All PLL components are integrated on-chip,eliminating the risk of noise coupling associated with discrete solutions. Devicegrades J/K/L/M/E have anintegrated reference to save board space, improve systemreliability andreduces the effect of acoustic emissions noise caused bytemperatureramps. Grades A/B/C/D/P use an external crystal (XTAL) orcrystal oscillator(XO) reference.The Si5395/94/92 support free-run, synchronous and holdover modes as well as enhancedhitless switching, minimizing the phase transientsassociated when switching between input clocks. These devices areprogrammable via a serial interface with incircuit programmable non-volatile memory (NVM) so they always power up withaknown frequency configuration. Programming the Si5395/94/92 is easy with SiliconLabs’ ClockBuilderTM Pro software. Factory preprogrammed devices are also available.Si5395/94/92主要特性:• Generates any combination of outputfrequencies from any inputfrequency• Ultra low phase jitter:• 69 fs RMS (Grade P)• 71 fs RMS (Grade E)• 85 fs RMS (integer mode)• 100 fs RMS (fractional mode)• Enhanced hitless switching minimizes outputphase transients (0.2 ns typ)Silicon Lab Si5395 12路超低抖动时钟倍频器解决方案• Input frequency range• Differential: 8 kHz to 750 MHz• LVCMOS: 8 kHz to 250 MHz• Output frequency range• Differential: 100 Hz to 1028 MHz• LVCMOS: 100 Hz to 250 MHz• Meets G.8262, E.8262.1 EEC Standards• Status monitoring• Si5395: 4 input, 12 output• Si5394: 4 input, 4 output• Si5392: 4 input, 2 output• External reference: Grades A/B/C/D/P• Integrated reference: Grades J/K/L/M/E• Drop-in compatible with Si5345/44/42Si5395/94/92应用:• 56G/112G PAM4 SerDes clocking• OTN muxponders and transponders• 10/40/100/200/400G networking line cards• 10/40/100/400 GbE Synchronous Ethernet (ITU-T G.8262)• Medical imaging• Test and measurement 图1:Si5395/94/92框图图2:Si5395/94/92简化框图Si5395/94/92详细特性如下:• Generates any output frequency in any format from any inputfrequency • External XTAL or XO reference (A/B/C/D/P)• Integrated reference (J/K/L/M/E)• Ultra-low phase jitter of 69 fs (P-Grade)• Dynamic phase adjust• Input frequency range• Differential: 8 kHz–750 MHz• LVCMOS: 8 kHz–250 MHz• Output frequency range• Differential: 100 Hz to 1028 MHz• LVCMOS: 100 Hz to 250 MHz• Programmable jitter attenuation bandwidth: 0.1 Hz to 4 kHz • Meets requirements of:• ITU-T G.8262 (SyncE) EEC Options 1 and 2• ITU-T G.8262.1 (Enhanced SyncE) eEEC• Highly configurable outputs compatible with LVDS, LVPECL, LVCMOS, CML, and HCSL with programmable signal amplitude• Status monitoring (LOS, OOF, LOL)• Enhanced hitless switching for 8 kHz, 19.44 MHz, 25 MHz inputsand other frequencies• Locks to gapped clock inputs• Free-run and holdover modes• Drop-in compatible with Si5345/44/42• Optional zero delay mode• Fast-lock acquisition for low nominal bandwidths• Independent Frequency-on-the fly for each MultiSynth• DCO mode: as low as 0.001 ppb step size• Core voltage• VDD: 1.8 V ±5%• VDDA: 3.3 V ±5%• Independent output clock supply pins• 3.3 V, 2.5 V, or 1.8 V• Serial interface: I2C or SPI• In-circuit programmable with non-volatile OTP memory• ClockBuilder Pro software simplifies device configuration • Si5395: 4 input, 12 output• Grade A/B/C/D/P: 64-QFN 9×9 mm• Grade J/K/L/M/E: 64-LGA 9x9 mm• Si5394: 4 input, 4 output• Grade A/B/C/D/P: 44-QFN 7×7 mm• Grade J/K/L/M/E: 44-LGA 7x7 mm• Si5392: 4 input, 2 output• Grade A/B/C/D/P: 44-QFN 7×7 mm• Grade J/K/L/M/E: 44-LGA 7x7 mm• Temperature range: –40 to +85 ℃• Pb-free, RoHS-6 compliant图3:典型56G SerDes应用电路图4:同步线路卡SyncE电路图。

锡膏工艺设定与优化回流焊温度曲线详解锡膏工艺正确设定与优化回流焊温度曲线回流焊温度曲线与制程的匹配是炉后高直通率的保障回流焊是SMT 工艺的核心技术，PCB 上全部的电子元器件通过整体加热一次性焊接完成，电子厂SMT 生产线的质量掌握占确定重量的工作最终都是为了获得优良的焊接质量。

设定好温度曲线，就管好了炉子，这是全部PE 都知道的事。

很多文献与资料都提到回流焊温度曲线的设置。

对于一款产品、炉子、锡膏，如何快速设定回流焊温度曲线？这需要我们对温度曲线的概念和锡膏焊接原理有根本的生疏。

本文以最常用的无铅锡膏Sn96.5Ag3.0Cu0.5 锡银铜合金为例，介绍抱负的回流焊温度曲线设定方案和分析其原理。

如图一：图一SAC305 无铅锡膏回流焊温度曲线图图一所示为典型的SAC305 合金无铅锡膏回流焊温度曲线图。

图中黄、橙、绿、紫、蓝和黑6 条曲线即为温度曲线。

构成曲线的每一个点代表了对应PCB 上测温点在过炉时相应时间测得的温度。

随着时间连续的记录即时温度，把这些点连接起来，就得到了连续变化的曲线。

也可以看做PCB 上测试点的温度在炉子内随着时间变化的过程。

那么，我们把这个曲线分成4 个区域，就得到了PCB 在通过回流焊时某一个区域所经受的时间。

在这里，我们还要说明另一个概念“斜率①”。

用PCB 通过回流焊某个区域的时间除以这个时间段内温度变化确实定值，所得到的值即为“斜率”。

引入斜率的概念是为了表示PCB 受热后升温的速率，它是温度曲线中重要的工艺参数。

图中A、B、C、D 四个区段，分别为定义为A：升温区，B：预热恒温区〔保温区或活化区〕，C：回流焊接区〔焊接区或Reflow 区〕，D：冷却区。

连续深入解析个区段的设置与意义：一．升温区APCB 进入回流焊链条或网带，从室温开头受热到150℃的区域叫做升温区。

升温区的时间设置在60-90 秒，斜率掌握在2-4 之间。

此区域内PCB 板上的元器件温度相对较快的线性上升，锡膏中的低沸点溶剂开头局部挥发。

HT-69020NP-0, HT-69030NP-0 Duct Probe RHTransmitter Installation GuideIntroductionThe HT-69 Series Duct Probe Relative Humidity (RH)Transmitters use a highly accurate and reliable thermosetpolymer-based capacitance humidity sensor and state-of-the-art digital linearization and temperature-compensated circuitry to monitor humidity levels in a duct. The humidity sensor is encapsulated in a 60 micron HDPE filter at the end of a 9 in. (230 mm) stainless steel (S/S) probe and a compact enclosure.Figure 1: HT-69 Duct Probe RH Transmitter DimensionsFigure 2: Dimensions of the HT-69 Duct Probe RH Transmitter*241102556A*Part No. 24-11025-56 Rev. A2022-11-11MountingThe transmitter installs directly into any air duct with a minimum width or diameter of 10 in. (25.5 cm).-Select a suitable installation area in the middle of the duct wall.-To achieve the best reading, do not place in an area where air stratification may be present.-Mount the sensor at least 5 ft. (1.5 m) in either direction from elbows, dampers, filters, or other duct restrictions.-Avoid areas that expose the transmitter to vibrations or rapid temperature changes.To install the transmitter, complete the following steps:1.When you select a suitable spot, drill a 0.6 in. (15mm) to 0.75 in. (20 mm) hole for the probe.2.Slide the probe into the drilled hole until the enclosure is flush against the duct. The airflow direction is not important.3.Secure the enclosure to the duct with two No. 10 x 1 in. (25 mm) self-tapping screws (not provided).4.Tighten the screws until the enclosure is tight against the duct so that there is no movement of the enclosure. A foam gasket on the back of the enclosure provides a tight seal against any air leaks. See Step 1 in Figure 3.5.The enclosure includes a hinged cover with a latch.To open the cover, pull slightly on the latch on the right side of the enclosure. At the same time, pull on the cover as shown in Step 2 of Figure 3.6.A 0.5 in. NPT threaded connection hole is in the bottom of the enclosure. Screw the EMT or cable gland connector into the threaded connection holeuntil tight. See Step 3 in Figure 3.Note: Preferably use weatherproof EMT or cable gland fittings. The E-style enclosure includes 0.5 in. NPT to M16 thread adaptor and cable gland fitting.7.Make wire connections as shown in the wire diagram in Wiring .8.Swing the door closed until it securely latches. For added security, install the two provided screws in the integrated screw tabs. See Step 4 of Figure 3.Wiring•Deactivate the 24 VAC/DC power supply before you make all connections to the device to prevent electrical shock or equipment damage.•Use 14 AWG to 22 AWG shielded wiring for allconnections and do not locate the device wires in the same conduit with wiring that supplies inductive loads such as motors. Make all connections in accordance with national and local codes.•Pull at least 6 in. (15 cm) of wire into the enclosure,then complete the wiring connection according to the wire diagram for the applicable power supply and output signal type. See Figure 4.•Place the output switch in the required position to select the required signal output type (mA or VDC), as shown in Step 2 of Figure 4. The factory default setting is 4 mA to 20 mA.•If you select mA, no further output set up is required.If you select VOLT output as shown in Figure 5, place the voltage output switch to the required span position,that is 10 VDC = 0 VDC to 10 VDC. The factory default setting is 0 VDC to 10 VDC. See Step 1 of Figure 4.•Connect the DC positive or the AC voltage hot side to the PWR terminal. For voltage output or AC power,connect the supply common to the COM terminal.The device is reverse voltage-protected and does not operate if you connect it backwards. The device contains a half-wave power supply so the supplycommon is the same as the signal common. See Step 3of Figure 4.•The analog output is available on the OUT terminal.Check the controller Analog Input to determine the correct connection before you apply power as shown in Step 3 of Figure 4.Figure 3: Mounting the HT-69 Duct Probe RH TransmitterFigure 4: Wiring of the HT-60 Duct Probe TransmitterTechnical specificationsTable 1: HT-69020NP-0, HT-69030NP-0 Duct Probe RH Transmitter technical specificationsThe performance specifications are nominal and conform to acceptable industry standards. For application at conditions beyond these specifications, consult the local Johnson Controls office. Johnson Controls shall not be liable for damages resulting from misapplication or misuse of its products.Product warrantyThis product is covered by a limited warranty, details of which can be found at / buildingswarranty.Software termsUse of the software that is in (or constitutes) this product, or access to the cloud, or hosted services applicable to this product, if any, is subject to applicable end-user license, open-source software information, and other terms set forth at /techterms. Your use of this product constitutes an agreement to such terms. PatentsPatents: https://Single point of contactContact informationContact your local branch office: /locationsContact Johnson Controls: /contact-us© 2022 Johnson Controls. All rights reserved. All specifications and other information shown were current as of document revision and。

DATA SHEET Axial-Lead Glass Passivated Standard Recovery Rectifiers1N5400 thru 1N5408Lead mounted standard recovery rectifiers are designed for use in power supplies and other applications having need of a device with the following features:Features•High Current to Small Size•High Surge Current Capability•Low Forward V oltage Drop•V oid−Free Economical Plastic Package•Available in V olume Quantities•Plastic Meets UL 94 V−0 for Flammability•These are Pb−Free DevicesMechanical Characteristics:•Case: Epoxy, Molded•Weight: 1.1 Gram (Approximately)•Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable•Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds•Polarity: Cathode Indicated by Polarity Band*For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting T echniques Reference Manual, SOLDERRM/D.STANDARD RECOVERYRECTIFIERS50−1000 VOLTS3.0 AMPERESAXIAL LEADCASE 267−05STYLE 1A= Assembly Location1N540x= Device Numberx= 0, 1, 2, 4, 6, 7 or 8YY= YearWW= Work WeekG= Pb−Free PackageMARKING DIAGRAMA1N540xYYWW GGSee detailed ordering and shipping information on page 5 of this data sheet.ORDERING INFORMATION(Note: Microdot may be in either location)MAXIMUM RATINGSRating Symbol1N54001N54011N54021N54041N54061N54071N5408UnitPeak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRMV RWMV R501002004006008001000VNon−repetitive Peak Reverse Voltage V RSM10020030052580010001200V Average Rectified Forward Current(Single Phase Resistive Load,1/2 in. Leads, T L = 105°C)I O 3.0ANon−repetitive Peak Surge Current(8 ms Single Half−Sine−Wave)I FSM200 (one cycle)AOperating and Storage Junction Temperature Range T JT stg−65 to +150−65 to +175°CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.THERMAL CHARACTERISTICSCharacteristic Symbol Typ Unit Thermal Resistance, Junction−to−Ambient (PC Board Mount, 1/2 in. Leads)R q JA53°C/W ELECTRICAL CHARACTERISTICSCharacteristic Symbol Min Typ Max Unit Forward Voltage (I F = 3.0 A, T A = 25°C)v F−− 1.0VReverse Current (Rated DC Voltage) T A = 25°CT A = 100°C I R−−−−1050m AProduct parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.Ratings at 25°C ambient temperature unless otherwise specified.60 Hz resistive or inductive loads.For capacitive load, derate current by 20%.NOTE 1 — AMBIENT MOUNTING DATAFigure 1. Forward Voltagev F, INSTANTANEOUS VOLTAGE (V), I N S T A N T A N E O U S F O R W A R D C U R R E N T (A M P S )F Figure 2. Maximum Nonrepetitive Surge CurrentFigure 3. Maximum Current Derating, Lead,Various Lengthsi 40020030040NUMBER OF CYCLES5060708090100Figure 4. Maximum Current Derating, Ambient, PCBoard MountingT A, AMBIENT TEMPERATURE (°C)T L, LEAD TEMPERATURE (°C)I F S M , P E A K H A L F W A V E C U R R E N T (A )Figure 5. Forward Power Dissipation1614121086420I F(AV), AVERAGE FORWARD CURRENT (A)P F (A V ), A V E R A G E P O W E R D I S S I P A T I O N (W )I F (A V ), A V E R A G E F O R W A R D C U R R E N T (A )123456ORDERING INFORMATIONDevice Package Shipping†1N5400G Axial Lead*500 Units/Box1N5400RLG Axial Lead*1200/T ape & Reel1N5401G Axial Lead*500 Units/Box1N5401RLG Axial Lead*1200/T ape & Reel1N5402G Axial Lead*500 Units/Box1N5402RLG Axial Lead*1200/T ape & Reel1N5404G Axial Lead*500 Units/Box1N5404RLG Axial Lead*1200/T ape & Reel1N5406G Axial Lead*500 Units/Box1N5406RLG Axial Lead*1200/T ape & Reel1N5407G Axial Lead*500 Units/Box1N5407RLG Axial Lead*1200/T ape & Reel1N5408G Axial Lead*500 Units/Box1N5408RLG Axial Lead*1200/T ape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.*This package is inherently Pb−Free.SCALE 1:1CASE 267−05ISSUE G DATE 06/06/2000AXIAL LEADSTYLE 1:PIN 1.CATHODE (POLARITY BAND)2.ANODEDIM MIN MAX MIN MAXMILLIMETERSINCHESA0.2870.3747.309.50B0.1890.209 4.80 5.30D0.0470.051 1.20 1.30K 1.000---25.40---STYLE 2:NO POLARITYNOTES:1.DIMENSIONS AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.267-04 OBSOLETE, NEW STANDARD 267-05. MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theADDITIONAL INFORMATIONTECHNICAL PUBLICATIONS:Technical Library:/design/resources/technical−documentation onsemi Website: ONLINE SUPPORT: /supportFor additional information, please contact your local Sales Representative at /support/sales。