3360-5-14-80-00-00-08-0中文资料

Realize Your Potential华为技术有限公司华为 SRG3300系列业务路由网关产品详版彩页华为 SRG3300系列业务路由网关产品华为 SRG3300系列业务路由网关产品SRG3300系列业务路由网关适合在大中型企业担当核心业务路由网关，或者为大型企业的分支机构提供端到端的综合业务解决方案。

SRG3300系列强大的IP 路由能力，以及多业务融合能力、模块化可扩展系统架构，为企业提供随需而变的业务灵活性。

SRG3340• 转发性能：5Mpps• 固定接口：3*GE （2* Combo ）• 插槽：4*SIC + 2*WSIC + 2*XSIC• 外形尺寸（H x W x D ）：88.1mm x 442mm x 470mm• 转发性能：5Mpps~20Mpps• 固定接口：3*GE （2* Combo ）/4*GE Combo+ 2*10GE• 插槽：4*SIC + 2*WSIC + 4*XSIC• 外形尺寸（H x W x D ）：130.5mm x 442mm x 470mm产品概述SRG3300系列业务路由网关采用业界领先的高性能多核处理器以及成熟稳定的软件系统，并具备双主控能力，可以提供强大的业务转发能力和稳定可靠的网络体验。

SRG3300采用硬件加密技术，提供卓越的VPN 加解密性能；集成语音数字信号处理器（语音款型），融合了丰富的IP PBX 功能；强大的防火墙功能，可以有效抵御网络攻击、非法入侵等网络威胁；覆盖业界最广泛的有线和无线连接模式，可以灵活适用各种网络接入场景；系统强劲的性能，可以支撑企业多业务应用，满足多业务并发访问需求。

SRG3300系列包含以下几款设备：SRG3340、SRG3360，其外观如下：SRG3300系列业务路由网关可选择多种主控板，，主控均支持可插拔维护。

主控板的主要区别在转发性能和流量管理功能上。

SRU80和SRU200主控可支持硬件级TM （流量管理）功能，即通过硬件处理QoS 。

DISCLAIMER: Reasonable care has been taken in the preparation of this information, but FERRO EXTENDS NO WARRANTIES, MAKES NO REPRESENTATIONS AND ASSUMES NO RESPONSIBILITY AS TO ACCURACY OR SUITABILITY OF THIS INFORMATION OF THIS PRODUCT FOR ANY PURCHASER’S OR USER’S USE OR FOR ANY CONSEQUENCE OF ITS USE. FERRO DISCLAIMS ANY WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR ANY PARTICULAR USE . All statements, technical information and recommendations contained herein are based on Seller’s or Manufacturer’s test and the test of others, and are believed to be accurate, but no guarantee of Rear Silver Conductor Lead FreeDescription: PS 33-600 is a lead and cadmium free, pure silver conductor paste designed as a back contact for p+/p/n+ type silicon solar cells that use an aluminum back surface field (BSF). The conductor is compatible with all Ferro AL 53-series lead free aluminum pastes and has excellent solderability and adhesion when used with lead free solders.Typical PropertiesPS 33-600 Viscosity (Pa·s)1: 90–130 Solids Content: 73–76% Fineness of Grind: < 16/12 µm Dried Thickness: 15–20 µm Fired Thickness: 10–15 µmResistivity 2(milliohms/square): < 3.0Drying Profile 3: 250–300°C, < 60 secondsFiring 3810–940°C, < 1–3 seconds Recommended Thinner 0800All properties are target values and are not meant to represent product specificationsNotes: 1Viscosity as measured on Brookfield model HBT cone/plate viscometer; 9.6 reciprocal seconds, 1.565° cone, 25°C. 2Milliohms/sq. at 25µm. 3Recommended set points °C in infrared firing furnace.Product Advantages:• RoHS compliant 4• Lead and Cadmium free 5• Complete compatibility with lead free Alinks • Excellent solderability and adhesion when using lead free solders• Hot Melt and conventional printing versions availableDISCLAIMER: Reasonable care has been taken in the preparation of this information, but FERRO EXTENDS NO WARRANTIES, MAKES NO REPRESENTATIONS AND ASSUMES NO RESPONSIBILITY AS TO ACCURACY OR SUITABILITY OF THIS INFORMATION OF THIS PRODUCT FOR ANY PURCHASER’S OR USER’S USE OR FOR ANY CONSEQUENCE OF ITS USE. FERRO DISCLAIMS ANY WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR ANY PARTICULAR USE . All statements, technical information and recommendations contained herein are based on Seller’s or Manufacturer’s test and the test of others, and are believed to be accurate, but no guarantee of Rear Silver Conductor Lead FreeProcessing RecommendationsPrinting: It is recommended that the paste temperature be between 20–25°C prior to printing, and it is advisable to control the ambient room temperature within ± 2°C to ensure consistent printing results. The printing area should be clean and well-ventilated.Screen: 200–325 mesh screen with a 20–25 μm emulsion thickness is recommended.Drying: The ink can be dried in an Infrared or conventional dryer under a wide range of conditions. Inks are typically dried in an IR dryer with set points of 250–300°C in less than 60 seconds.Soldering: Recommended soldering conditions (ribbons) are 290°C for 96.5Sn/3.5Ag; and 220°C for 62Sn/36Pb/2Ag.Firing: An infrared fast process furnace with three or more firing zones and belt speeds of >200 inches per minute is highly recommended, although the product can be fired in a variety of furnaces with belt speeds >120 inches per minute. Optimum firing conditions must be established by the customer based on the cell configuration, thickness, and manufacturing process. Peak set point temperatures between 810–940°C with a dwell time above 700°C ranging from >1 to 3 seconds is typical. Compatibility: Ferro has tested this material according to the recommended processing conditions described here; however, it is imperative that customers evaluate the material in their manufacturing process and conditions to insure suitability for their intended use. Ferro technical personnel can help facilitate testing, and can assist with integration into customer manufacturing processes.Thinning: Thinning is not recommended because the paste is supplied at the correct viscosity for application. Contact your local Ferro Representative for appropriate solvent details, should thinning become necessary to replace solvent lost through evaporation.Paste Storage & Shelf Life: The paste should be stored in tightly capped containers in a cool (5–30°C) dry place away from direct sunlight. When properly stored, unopened material will have a shelf life of up to 6 months.Notes: 4Complies with EU Directives on Restriction of the use of Hazardous Substances (RoHS; 2002/95/EC) and Waste from Electrical and Electronic Equipment (WEEE;2002/96/EC). Current exemptions allow lead contained in the glass system of thick film materials used in electroniccomponents. In anticipation of future amendments and more stringent environmental regulations, Ferro continues to expand its range of Lead Free 5 materials. 5Initial product composition was certified by SGS laboratories to be below the detection level for lead and cadmium. This conductor paste is not routinely analyzed for lead and cadmium content and is not the basis for product specification or warranty.Rev. 08/09Vista, CA, USA Tsukuba, Japan Suzhou, China Hanau, Germany 760-305-1000 +81 29-889-2144 +86 512-62562258 +49 61-81594739。

计算机网络作业第一章（P39）1-15，假定网络的利用率达到了90%。

试估算一下现在的网络时延是它的最小值的多少倍？解：设网络利用率为U，网络时延为D，网络时延最小值为D = D0 / (1 - U) D / D0 = 101-17，收发两端之间的传输距离为1000 km，信号在媒体上的传播速率为2 × 10^8 m/s。

试计算以下两种情况的发送时延和传播时延：1）数据长度为10^7 bit，数据发送速率为100 kbit/s。

2）数据长度为10^3 bit，数据发送速率为1 Gbit/s。

从以上计算结果可得出什么结论？解：发送时延Ts = 数据帧长度（bit）/ 发送速率（bit/s）传播时延Tp = 信道长度（m）/ 电磁波在信道上的传播速度（m/s）1）Ts = 10^7 bit / 100 kbit/s = 100 s，Tp = 10^6 m / (2 ×10^8) m/s = 0.005 s2）Ts = 10^3 bit / 1 Gbit/s = 1 μs，Tp = 10^6 m / (2 × 10^8) m/s = 0.005 s结论：若数据长度大而发送速率低，则在总的时延中，发送时延往往大于传播时延。

但若数据长度短而发送速率高，则传播时延就可能是总时延中的主要成分1-19，1）长度为100字节的应用层数据交给传输层传送，需加上20字节的TCP首部。

再交给网络层传送，需加上20字节的IP首部。

最后交给数据链路层的以太网传送，加上首部和尾部共18字节。

试求数据的传输效率。

数据的传输效率是指发送的应用层数据除以所发送的总数据（即应用数据加上各种首部和尾部的额外开销）。

2）若应用层数据长度为1000字节，数据的传输效率是多少？解：1）100 / (100+20+20+18) = 63.3%2）1000 / (1000+20+20+18) = 94.5%1-29，有一个点对点链路，长度为50 km。

LED 短路保护波形 Vin=24VDC，L=47uH, Rs=0.30Ohm
June. 2012 P1.1
8
SI-EN Technology
SN3360
应用信息
通过外部电阻 RS设置普通模式下的输出电流 普通模式下的输出电流由接在 VIN 和 ISENSE 引脚 间的电阻RS决定： IOUT nom = 0.1/RS 下面表格给出了按照第一页典型电路连接时，几种 RS值对应的输出电流： RS (Ω)
June. 2012 P1.1
3
SI-EN Technology
SN3360
最大极限值(note2)
符号 VIN VISENSE VLX VADJ ILX Ptot TOP TST Tj MAX RθJA 参数 输入电压 ISENSE 电压 LX 输出电压 ADJ引脚输入电压 开关电流 功率损耗 芯片工作时的环境温度(Tj=Ta) 芯片存储时的环境温度 结温 热阻值 ESD（人体模型） 最大限定范围 -0.3V to +50V VIN+0.3V to VIN-5V（当VIN≥5V) VIN+0.3V to -0.3V(当VIN<5V) -0.3V to +50V -0.3V to +6V 1.5A@SOT89-5 and DFN-5 0.5W@SOT89-5 and DFN-5 -40 °C to 125°C -55 to 150°C 150°C 132°C/W@SOT89-5; 73°C/W@DFN-5 3KV
二极管和电阻可以抑制加在ADJ引脚上的由场效应 管漏源级寄生电容引起的大幅值的负脉冲。这个负脉冲 会导致错误的输出电流和芯片的工作不稳定。 关断模式 当ADJ引脚电压小于0.2V时,输出关闭。芯片进入待 机状态，此时芯片待机电流下降到120μA。 结构固有的 LED开路保护 如果LED与芯片连接的地方出现开路，电感就会与 芯片的LX引脚分离， 而避免其他升压结构会出现的损坏 开关管的问题。 输入电容的选择 应该选用低ESR的电容充当输入去耦电容，因为电 容的ESR会呈现为与电源串联的阻抗，降低系统效率。 这个去耦电容须为电感提供大的峰值电流和平滑电源输 入的电流纹波。 如果前级为直流电源，则电容量由电源纹波决定，