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i24 Product Technical White PaperRevision 3.0Release date: 2020-01Dear user:© Copyright Inspur 2017No part of this document may be replicated or modified and transmitted through any form or method without the prior written consent of Inspur.Note: Commercial contracts and terms apply to purchases of goods, services, or features from Inspur. All of some of the goods, services, or features mentioned in this document may not be within your scope of purchase of use. Unless agreed otherwise, Inspur will not indicate or imply any declarations or guarantees on the contents of this manual. Due to product upgrades or added details, the contents of this manual will be regularly updated. Unless agreed otherwise, this document shall only serve as a user manual. All descriptions, information, and suggestions shall not form any explicit or implicit guarantees.Inspur and "浪潮" are registered trademarks of Inspur Electronic Information Industry Co., Ltd.Windows is a registered trademark of Microsoft Corporation.Intel and Xeon are registered trademarks of Intel Corporation.Other trademarks belong to their respective registered companies.4008600011Technical servicenumber:Address: 1036 Langchao Rd., Jinan,Shandong, ChinaInspur Electronic InformationIndustry Co., Ltd.Postal code: 250101Contents1Product Overview (4)2Product features (5)3Logical architecture (7)4Product Introduction (8)4.1Internal View of Server Chassis (8)4.2Motherboard components (8)4.3Front panel (9)4.3.112*3.5 Front Panel Components (9)4.3.2Front Panel Controller (10)4.3.324*2.5 Front Panel Components (10)4.3.4Hard Drive (11)4.4Rear Panel (11)4.4.1Chassis and power supply (11)4.4.2Chassis components (12)4.5Hard drive backplanes (12)4.6PCIe adapter cards (13)4.7OCT/PHY cards (14)5System specifications (15)6Components and compatibility (18)6.1Processor (18)6.2Memory (19)6.3Storage (Realizing SAS/SATA mixing) (21)6.3.1SAS/SATA hard drive model (21)6.3.2 2.5” SSD hard drive (21)6.3.3U.2 NVMe SSD hard drives (21)6.3.4PCIe NVME SSD (22)6.3.5M.2 SSD (22)6.4RAID/SAS card (22)6.5Network Card (23)6.6HCA Card (23)6.7FC HCA Card (24)6.8Power Supply (24)6.9Operating system (24)7Configuration Options (25)8System management (26)9Certifications (29)10Support and services (30)11Description of New Technologies (31)11.1Intel scalable architecture (31)11.2Intel VROC technology (31)11.3QAT technology (31)11.4OCP Mezzanine Card (31)12Further Information (32)13Trademark (33)1 Product OverviewInspur Yingxin i24 is a next-generation, 2U4-node, and high-density server optimized for multiple applications. The 2U chassis supports 4* dual-path NS5162M5 nodes. Each node is connected to the chassis via a side card, and the nodes share a common power supply and cooling system. Equipped with a CMC+BMC dual management system, the i24 is able to support 2.5″ and 3.5″ hard drives and realize an all-flash configuration.The i24 perfectly features high-density, high-efficiency, high-reliability, and high-intelligence within its smaller footprint. It also has a higher compute density, sufficient storage space, and offers desirable scalability and management characteristics. As a result, it realizes energy conservation by means of spatial resources, energy efficiency, and deployment costs, which makes it the optimum solution for customers to reduce their total cost of ownership (TCO) of their data center.The i24 provides configuration solutions that cater more specifically to the requirements for computing, storage, and scaling in high-performance computing; cloud computing; super-integration; and distributed storage applications. It is suitable for infrastructure platform virtualization, high-performance computing, establishment of cloud platforms and industries based on high-performance computing (HPC) and hyper-converged infrastructure (HCI).Figure 1-1 i24 server overview2 Product featuresThe design concept of the i24 is based on increasing the server's compute density while maintaining sufficient storage space and product scalability performance. In so doing, it provides compute density optimization for high-performance computing and other applications. In addition, it also provides large capacity hard drive deployments while achieving storage optimization based on all-flash configurations for distributed storage applications. Therefore, the i24 is the optimum choice for high-performance computing, cloud computing, distributed architecture, and super-integrated architecture platforms applications.High density deployment, high performance, and high efficiency●The i24 deploys 4* dual-path nodes within a 2U space. This realizes a four-fold highercompute density than other 2U dual-path rackmount servers, thus enhancing the spatial usage efficiency of server rooms.●Each node supports 2* Intel® Xeon® scalable processors and supports up to TDP165W.●The entire server supports up to 24*2.5″ SAS/SATA/NVMe hard drives or 12*3.5″SAS/SATA hard drives, thus offering a large storage capacity. Each node contains 2*SATA M.2 hard drives for installing the operating system.●3*PCIe x16 slots can be configured in each node, allowing users to utilize more networkcard configuration solutions.High reliability, effortless management●As the modular nodes can be pulled out, the i24 achieves rapid deployment, increasesthe operation efficiency during node replacement and upgrading, and reduces room deployment time by more than 50%.● A unified power supply and cooling system is shared between each node, thus enhancingthe utilization efficiency of the power supply and fans. A configuration of 1+1 redundancy power supply and N+1 redundancy fans ensure the stable operation of the system and reduce the possible loss caused by server room or component malfunction.●The firmware is secured with encryption and digital signatures to prevent illegal write-ins.●The embedded hardware is equipped with encryption chips, which allows users toflexibly select their algorithm according to requirements.●The i24 also supports the BMC+CMC dual-management model, thus allowing users toeffortlessly achieve the unified management of the server's power supply and fans.Furthermore, users can check the regulatory information of each node through the remote management module.Advanced design, ultimate performance●The advanced fan cooling system of the i24 realizes an optimum operation environment.The comprehensive and optimized cooling system also achieves partitioned speed adjustment and proportional–integral–derivative (PID) smart speed adjustment and smart CPU frequency adjustment, so as to ensure a stable system operation.●The i24 supports multiple AEP storage configurations, enhances storage capacities,and the non-volatility of memory and data. In so doing, it enhances the data processing speeds and meets various application requirements.●Within an all-flash mode, the 24*NVMe hard drives can be configured in the entireserver. This offers users more input/output operations per second (IOPS), as well as faster caches and lower latencies.●The i24 also supports PHY/OCP/standard PCIe network cards, providing multiplenetwork connector options for users and offers more flexible network structure configuration solutions for users.3 Logical architectureEach NS5162M5 node features dual Intel® Xeon® Scalable processors and supports up to 16* DDR4 DIMMs.Processors are connected with two UPI interconnection links with transmission speeds of up to 10.4 GT/s.Each NS5162M5 node provides 3* PCIe x16 slots.CPU0 is connected with 2* PCIe riser cards through the PCIe bus and supports 2* PCIe slot expansion cards through the two PCIe riser cards.CPU0 and PCH are interconnected and enable the installation of a standard OCP card or a PHY card.Figure 3-1 NS5162M5 node logical architecture4 Product Introduction4.1 Internal View of Server ChassisFigure 4-1 i24M5 server chassis internal structure4.2 Motherboard componentsFigure 4-2 NS5162M5 motherboard components4.3 Front panel4.3.1 12*3.5 Front Panel ComponentsFigure 4-3 i24 server components*Please refer to 4.2.1 Rear view for the exact locations of nodes A, B, C, and D.4.3.2 Front Panel ControllerFigure 4-4 Front panel controller components4.3.3 24*2.5 Front Panel ComponentsFigure 4-5 i24 server front panel components4.3.4 Hard DriveFigure 4-6 Hard drive LED description4.4 Rear Panel4.4.1 Chassis and power supplyFigure 4-7 i24M5 server rear panel (1) structure4.4.2 Chassis componentsFigure 4-8 i24M5 server rear panel (2) structure4.5 Hard drive backplanesTable 4-5-1 3.5*12 backplane configurationNote:Since 3.5”*12 is a directly connected backplane, a RAID/SAS card is required when configuring a SAS hard drive in order to connect it with the onboard SATA controller.Table 4-5-2 2.5*24 backplane configurationTable 4-5-3 2.5*24 backplane configurationNote:Only supports 2.5”*24 NVME drives, does not support SATA/SAS4.6 PCIe adapter cardsFigure 4-9 X16 PCIe riser (left and right)Figure 4-10 X16 PCIe riser (left)Figure 4-11 X16 PCIe riser (left)4.7 OCT/PHY cardsFigure 4-11 OCP cardNote: Supports OCP A+B and OCP A+C; supports 10 G and 25 G OCP network cards.Figure 4-12 PHY cardNote: Supports 1G and 10G PHY cards.5 System specifications Table 5-1 System specificationsNote:1. Not all configurations support an operating temperature range of 5°C~35°C. A technicalreview is required for AEP DIMM support and 205W CPU support.2. Standard operating temperature●10°C~35°C at sea level (50°F~95°F). For every altitude increment of 305 m above sea level, thetemperature drops by 1.0°C (a 1.8°F drop per 1000 ft). The maximum operating altitude is 3050 m (10000 ft). Please keep away from direct sunlight. Maximum rate of change = 20°C/hr (36°F/hr). The operating altitude and maximum rate of change varies according to system configurations.●In the event of fan malfunction or operations above 30°C (86°F), the performance of the system maybe decreased.3. Operating temperature at scaled environments●With regard to certain approved configurations, the supported system entry range at sea level can be scaledto 5°C~10°C (41°F~50°F) and 35°C~45°C (95°F~104°F). At an elevation of 900~3050 m (2953~10000 ft), the temperature drops by 1.0°C for every altitude increment of 175 m (1.8°F per 574 ft).●With regard to certain approved configurations, the supported system entry range at sea level canbe scaled to 35°C~45°C (104°F~113°F). At an elevation of 900~3050 m (2953 ft~10000 ft), the temperature drops by 1.0°C for every altitude increment of 125 m (1.8°F per 410 ft).●The system performance may decrease when the system is operating in the scaling range or in theevent of fan malfunction.4. This text lists the weighted sound power level (LWAd) and the weighted sound pressure level(LpAm) of the product at an operating temperature of 23°C. The values were reported accordingto the ISO7779 (ECMA 74) noise measurement standards and ISO 9296 (ECMA 109). The listedsound levels can be used for general shipping configurations while other options may increase thevolume. Please contact your sales representative for more information.5. The sound levels shown here were measured according to specific test configurations. Thesound level will vary depending on system configuration. Values are subjected to changewithout notice and are for reference only.6. The sample (model) test assessments meet product specifications. This product or productseries are eligible to have appropriate compliance labels and declarations.7. All sound levels listed are for standard shipping configurations while other systemconfigurations may increase the volume.Table 5-2 Industry Standard Compliance6 Components and compatibilityUpdated on August 2019. Please consult with our technical support team for the latest compatibility configurations and product components not listed in this manual.6.1 ProcessorTable 6-1 Each node supports 2* Intel Xeon scalable processors6.2 MemoryThe i24 supports 8 DIMMs per CPU, and up to 16 DIMMs for dual CPUs. It also supports LRDIMM, RDIMM, and Intel®Optane™ DC continuous memory, as well as the following memory modes:●ECC (Error Correcting Code)●Memory mirroring●Memory rank sparing●SDDC (Single Device Data Correction)●ADDDC (Adaptive Double- Device Data Correction)●PPR (Power up-Post Package Repair)The same node does not support mixed memories from different memory types (RDIMM, LDRIMM) and different specifications (capacity, bit width, rank, and depth).Memory capacity can be maximized by installing two processors. When a single processor is used, the maximum memory capacity is halved.The DIMM slot layout and installation procedure is shown in the following figure:i24M5 can be configured to support up to 16* AEP memories, with 4* AEPs per node.The AEP memory sequence is as follows:Method 1 - CPU0 -C2D0, C5D0CPU1 - C2D0, C5D0Method 2 - CPU0 –C0D1, C3D1CPU1-C0D1, C3D1The following symmetrical sequences can be introduced into the bill of materials (BOM); a technical review is required for asymmetrical sequences and other specific sequences.1. 2*AEPs for a single CPU.2. 4*AEPs for dual CPUs.Note: AEP 128 GB is currently supported6.3 Storage (Realizing SAS/SATA mixing)The 124M5 supports the equal distribution of four nodes across the front hard drive and realizes the mixing of SAS/SATA hard drives in the entire server and in each node.6.3.1 SAS/SATA hard drive model6.3.2 2.5” SSD hard drive6.3.3 U.2 NVMe SSD hard drivesNote:The 3.5” hard drive model does not support NVME hard drives.6.3.4 PCIe NVME SSD6.3.5 M.2 SSDConcurrently supports software RAID and hardware RAID.Note: Software RAID achieves the RAID function through system software. Hardware RAID achieves the RAID function through RAID cards.6.4 RAID/SAS cardSupports one RAID or SAS card6.5 Network CardSupports one PHY /OCP card and two PCIe network cards (no restrictions).6.6 HCA CardSupports up to two cards (no restrictions)6.7 FC HCA CardSupports up to two cards (no restrictions)6.8 Power SupplyNote: Please adhere to the actual configurations and in accordance with the power input value specified on the label found on the host.6.9 Operating system7 Configuration Options●The 12* 3.5” hard drive chassis does not support NVME configuration.●The 24* NVME hard drive chassis does not support SAS/SATA configuration.●Please note the configuration requirements for the NS5162M5 node and the i24 chassis:The use of 5, 7, 9, 10, and 11 DIMMs for a single CPU (10, 14, 18, 20, 22 DIMMs for dual CPUs) is not recommended.8 System managementThe i24 integrates a next-generation BMC intelligent management system (ICM). This system is wholly developed by Inspur and complies with IPM2.0 standards, providing highly reliable and intelligent hardware monitoring and management functions. The Inspur BMC intelligent management system includes the following features:●Supports Intelligent Platform Management Interface (IPMI)●Supports keyboard, mouse, video, and text console redirection●Supports remote virtualization media●Supports Redfish protocol●Supports Simple Network Management Protocol (SNMP)●Supports BMC login through web browsers●The main specifications of the intelligent management system are as follows.Table 8-1 BMC intelligent management system specificationsTable 8-2 CMC intelligent management system specifications9 Certifications※Please contact our technical support for information on our latest certification. As of October 2019, the i24M5 has received the following certifications:DiscretionaryDiscretionaryMandatoryMandatoryDiscretionaryDiscretionaryMandatoryMandatoryMandatoryMandatory10 Support and services Global service hotline:●1-844-860-0011 (free)●1-646-517-4966 (DDI)●Service e-mail: ************************ Information required:●Name●Telephone no●e-mail●Product model●Product serial number●Problem description11 Description of New Technologies11.1 Intel scalable architectureIntel's next generation Xeon processor is based on Skylake architecture. The all-new on-chip interconnect mesh architecture topology replaces traditional interconnect ring architecture to improve CPU access delays and support higher memory bandwidth requirements. In addition, it offers lower power consumption, which allows it to operate at lower clock rates and at relatively lower voltages, thereby enhancing performance and energy efficiency. The overall performance of the Intel Xeon scalable processor is up to 1.65 times better than that of previous generation products, while its OLTP base load is up to 5 times more than that of current systems.11.2 Intel VROC technologyIntel VROC technology represents Virtual RAID on CPU, which provides enterprise RAID solutions based on NVME SSD. Its greatest advantage is that it is able to directly connect to the PCIe channels on Intel scalable processors, reducing the need for customized RAID HBA.11.3 QAT technologyIntel® QuickAssist technology (Intel® QAT) speeds up compute-intensive applications and the operations of applications. It provides a software-based foundation for security, authentication, and compression purposes, thus significantly increasing the performances and efficiencies of standard platform solutions. These features are detailed as follows: QAT enhances the throughput of applications in cloud computing, and adds hardware acceleration for network security, routing, storage, and big data applications, thereby maximizing CPU utilization.In terms of network, Intel® QAT speeds up SSL/TLS, thereby allowing encrypted communications with higher performances and higher platform application efficiencies in a secure network.In terms of big data, data blocks in the compressed file system supports faster analysis and achieves faster Hadoop operation time for big data operations. In so doing, QAT reduces processor requirements, completes tasks in a low-latency manner, and enhances the overall performance.11.4 OCP Mezzanine CardThe Open Compute Project (OCP) is an open-source server project designed for data centers, with the aim of sharing server and data center designs with higher efficiencies. As a member of the OCP, Inspur has designed a series of OCP Mezzanine cards that complies with OCP standards.12 Further InformationFor more information, please refer to the following websites:Our website provides troubleshooting resources and support for customers, as well as further information on our products, such as user manuals, drivers, and firmware.13 TrademarkInspur and the Inspur logo are registered trademarks of Inspur Electronic Information Industry Co., Ltd. All other trademarks and products mentioned in this document are properties of their respective owners.。

1. 安装准备1.1 系统环境本双机运行在VMware workstation上的2台VM，VMware Workstation版本为11.0.0 build-2305329，两台VM的信息如下：硬件环境图1：VM硬件信息1.2 网络配置IP 规划设置好的公网I P和私网IP信息如下：图2：公网和私网IP地址信息1．主机HA02 网络配置设置好的公网I P和私网IP信息如下：图3：公网和私网IP地址信息1.3 硬盘配置1．除了系统盘外，需要创建另外2种分区盘：镜像磁盘数据分区和c luster数据分区。

需要说明的是：镜像磁盘数据分区为NTFS分区或者FAT分区，cluster 数据分区需要是裸磁盘分区RAW格式。

分区如下：E 盘为数据分区.磁盘大小为10G，裸磁盘分区为30M。

镜像磁盘用于保证两台服务器数据同步，cluster数据分区用于双机通信。

现在重点演示cluster分区创建办法。

2.cluster分区方法：第一步，在磁盘2上单击右键，选择新建磁盘，如图4图4第二步，接着点击下一步，如图5，图5第三步，输入容量27M，点击下一步，如图6，图6第四步，指派盘符Q，点击一下步，如图7，图7第五步，接下来的步骤中，选择“不要格式化这个卷”选项，点击下一步，如图8所示，图8 第六步，选择完成，如图9图9 磁盘格式设置完成后的磁盘状况如图9显示图10由于H A01 和H A02 使用的是镜像磁盘，所以HA01 上磁盘划分好之后，在H A02 上进行相同配。

这样两台主机安装C luster 前的准备工作已全部完成,可以开始安装c luster。

2. BCP Express3.2安装和基础配置2.0 BCP Express3.2安装请分别在HA01服务器和HA02服务器上执行Inspur BCP Express 3.2的安装。

以下安装是以服务器HA01作为示范。

图11选择BCP-Express文件夹menu可执行文件双击安装图12单击选择BCP Windows版本13 单击BCP Windows版本开始安装图14点击下一步图15保持默认目录，选择下一步16点击安装图17保持默认端口图18镜像群集不需要设置过滤，保持默认，选择下一步图19 选择是，不进行过滤，单击下一步图20 选择登陆进行license授权图21 可以选择两种授权方式，我们选择第一种图22 选择复制类型即镜像型图23输入浪潮提供的信息进行授权图24 完成后选择[参照/删除],可看到所选L ICENSE 信息,或者点结束完成安装图25 点击完成重启电脑2.2 BCP Express3.2基础配置以下配置在客户端进行操作图26 输入IP，打开配置页面图27 启动配置向导图28确认启动配置向导图29群集命名图30 添加群集服务器图31 输入加入群集服务器ip图32 已经加入第二台服务器图33 设置镜像磁盘通信信息和公网私网ip信息图34 设置NP解决图35 添加组一般同一个应用服务为一个组，比如MS SQL，如果还需添加ORACLE，请另外添加一个组。

Inspur 2008 Raid卡报错firmware error导致死机重启问题故障现象系统运行中死机或重启，Raid卡日志中报错Fatal firmware error，类似如下：EVT#04215-08/13/14 1:45:02: 15=Fatal firmware error: Line 1480 in ../../raid/1078dma.cEVT#04216-08/13/14 1:45:02: 15=Fatal firmware error: Line 1480 in ../../raid/1078dma.c且报错时间和系统宕机时间相符故障原因研发分析与PCIE节能有关，导致2008imr Raid卡读取内存时发生错误。

在故障发生时刻，PCIE产生pciErrorInit，如下：pciErrorInt: iopIntStatus 2480【这是故障发生时刻的第一条打印】pciErrorInt: pciIntStatus = 00000000, blackEagleIntStatus 00002000In MonTask; Seconds from powerup = 0x000033da_MonTask: Online Controller Disabled00[0]: fp=c04467e0, lr=c085ea30- _MonTask+1a0[1]: fp=c0446920, lr=c0906b30- pciErrorInt+7c[2]: fp=c0446938, lr=c048ba18- dispatchIsrs+8c[3]: fp=c0446968, lr=c048bae0- external_IRQ+34[4]: fp=c0446980, lr=c048b074- wrapper__External_IRQ+74[5]: fp=c04469d0, lr=c04b7a24- TtyIdle+cc[6]: fp=c04471c8, lr=c04a8364- set_state+90[7]: fp=c0447208, lr=c04a8a7c- raid_task_idle_loop+20[8]: fp=c0447218, lr=c087bea4- raid_task+de4[9]: fp=c0447fd0, lr=c0908c7c- _main+18d8[10]: fp=c0447ff8, lr=c0801c0c- __start+bb4MonTask: line 621 in file ../../raid/1078main.cUIC_ER=9f200:c00031b, UIC_MSR=4000:8000002, MSR=21000, sp=c04467e0解决办法1、对于Windows 2008R2系统，修改电源选项--> 高级电源设置– >PCIE Express链接状态电源管理--> 改为关闭！或者升级OS到Windows 2008 R2 SP12、对于Linux系统，编辑/etc/grub.conf文件，在kernel一行最后添加pcie_aspm=off ，重启生效。

浪潮英信服务器服务常见问题咨询文档版本V1.2发布日期2022-08-05版权所有© 2021-2022浪潮电子信息产业股份有限公司。

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变更记录版本时间变更内容V1.0 2021-10-11 首版发布V1.1 2022-01-06 刷新格式V1.2 2022-08-05 •新增章节“1.1.5 9560-8i/16i RAID卡在BIOS下配置Firmware Device Order选项的方法”•更新“2 故障排查”目录1技术咨询类 (1)1.1BIOS/BMC相关咨询 (1)1.1.1设置Legacy启动模式 (1)1.1.2在BIOS中设置BMC管理IP地址 (1)1.1.3在BIOS中查看9361-8i RAID卡缓存信息 (5)1.1.49361-8i RAID卡在BIOS中配置RAID 5的方法 (7)1.1.59560-8i/16i RAID卡在BIOS下配置Firmware Device Order选项的方法 151.1.6如何获取以及升级BIOS/BMC (16)1.2操作系统驱动安装 (17)1.2.1RAID卡驱动下载 (17)2故障排查 (19)2.1常见硬件问题 (19)2.1.1开机不加电 (19)2.1.2加电无显示 (19)2.1.3前面板指示灯告警 (20)2.1.4开机后卡在自检或其它界面 (21)2.1.5电源模块指示灯不亮或亮琥珀色 (21)2.1.6硬盘指示灯异常 (22)2.1.7系统风扇噪音过大 (22)2.1.8服务器存在报警声 (23)2.1.9键盘、鼠标不可用 (23)2.1.10USB接口问题 (24)2.2常见系统软件问题 (24)2.2.1安装OS常见问题 (24)2.2.2PXE启动失败 (25)2.2.3内存容量显示异常 (26)2.2.4OS下网络异常 (26)1技术咨询类1.1BIOS/BMC相关咨询1.1.1设置Legacy启动模式进入“BIOS > Advanced > CSM Configuration”页面，将“CSM Support”设置为“Enabled”，然后修改“Boot option filter”设置为“legacy only”，“Option ROM execution”设置为“Auto”即可。

《管理沟通（二）》在线平时作业1-00001试卷总分:100 得分:100一、判断题 (共 25 道试题,共 100 分)1.自我暗示不属于自我沟通。

答案:错误2.危机沟通可以降低危机的冲击,并存在化危机为转机的可能。

答案:正确3.说服属于指导性沟通策略。

答案:正确4.演讲是一个双向沟通的过程。

答案:正确5.心灵相通是指交流双方采取支持的、坦诚的态度交换意见。

答案:正确6.谈判开始一定要先声夺人、这样才能占得先机。

答案:错误7.演讲是一个双向沟通的过程。

答案:正确8.创新型上司不喜欢约定时间，沟通时要使其参与到问题的解决中来。

答案:正确9.办公室的主要倾听障碍源有不平等造成的心理负担，紧张，他人或电话打扰。

答案:正确10.面谈过程一定是互有听和说的谈话。

答案:正确11.团队建设失败的主要原因是沟通不足。

答案:正确12.好的倾听者会寻找方法来克服倾听过程中潜在的障碍。

答案:正确13.讨论会中主要倾听障碍源有缺乏从大量散乱信息中发现闪光点的洞察力。

答案:正确14.沟通的可信度包括初始可信度和后天可信度。

答案:正确15.互联网使人们的沟通方式增加了许多渠道。

答案:正确16.倾听是认真地听、积极地听。

答案:正确17.手势也能在沟通中传递不同的信息。

答案:正确18.征询属于指导性沟通策略。

答案:错误19.电子邮件是传递私人信息的最好媒介。

答案:正确20.自我认知也称为自我意识,是对自己存在的觉察,包括对自己的行为和心理的认知。

答案:正确21.团队不同于群体。

答案:正确22.自我思考属于自我沟通的方式。

答案:正确23.自定义幻灯片深受演讲者推崇，文字视觉效果较生动。

答案:正确24.手势也能在沟通中传递不同的信息。

答案:正确25.演讲后接受提问容易失去听众的注意力。

答案:正确《管理沟通（二）》在线平时作业2-00001试卷总分:100 得分:100一、判断题 (共 25 道试题,共 100 分)1.沟通是企业和管理者重要的职责之一。