SN74AS136D中文资料

74系列芯片功能总汇1.基本逻辑门芯片：-74LS00：四输入与非门-74LS02：四输入与门-74LS04：六反相器门-74LS08：四输入与门-74LS32：四输入或门2.触发器芯片：-74LS74：双D触发器-74LS76：双JK触发器3.移位寄存器芯片：-74LS95：四位并行存储器-74LS164：八位串行输入并行输出移位寄存器4.计数器芯片：-74LS90：十进制计数器-74LS93：二进制计数器-74LS191：四位并行访问计数器5.译码器/编码器芯片：-74LS138：三到八译码器-74LS148：八到三译码器-74LS151：八输入多路选择器6.多路开关芯片：-74LS151：八输入多路选择器-74LS153：双四输入多路选择器-74LS157：四输入数据选择/多功能门7.模拟开关芯片：-74LS240：八位双向缓冲器-74LS541：八位缓冲/驱动器8.显示驱动芯片：-74LS47：BCD-七段LED显示驱动器9.存储器芯片：-74LS85：四位二进制比较器-74LS86：四输入异或门-74LS138：三到八译码器10.时序逻辑芯片：-74LS121：单稳态多谐振荡器-74LS123：可编程多谐振荡器-74LS125：四路三态缓冲器11.数据选择器/复用器芯片：-74LS151：八输入多路选择器-74LS153：双四输入多路选择器12.数据驱动器芯片：-74LS244：八位缓冲/驱动器13.时钟频率分频器芯片：-74LS390：双五位二进制分频器14.辅助功能芯片：-74LS368：八位全通滤波器-74LS393：双四位二进制计数器15.存储器扩展芯片：-74LS670：四位四进制加法器-74LS688：八位比较器/译码器16.控制器芯片：-74LS592：八位可移位输入存储器-74LS595：八位移位存储器这些仅仅是74系列芯片中的一小部分，并且还有许多其他功能的芯片未被列举出来。

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SNLS系列芯片名称74系列资料型号器件名称SN74LS00 四2输入端与非门SN74LS01 四2输入端与非门(OC)SN74LS02 四2输入端或非门SN74LS03 四2输入端与非门(OC)SN74LS04 六反相器SN74LS05 六反相器(OC)SN74LS06 六高压输出反相器(OC,30V)SN74LS07 六高压输出缓冲,驱动器(OC,30V)SN74LS08 四2输入端与门SN74LS09 四2输入端与门(OC)SN74LS10 三3输入端与非门SN74LS11 三3输入端与门SN74LS12 三3输入端与非门(OC)SN74LS13 双4输入端与非门SN74LS14 六反相器SN74LS15 三3输入端与门(OC)SN74LS16 六高压输出反相器(OC)SN74LS17 六高压输出缓冲,驱动器(OC)SN74LS19A HEX SCHMITT-TRIGGER INVERTERSSN74LS20 双4输入端与非门SN74LS21 双4输入端与门SN74LS22 双4输入端与非门(OC)SN74LS24A 施密特与非门/变换器SN74LS26 四2输入端高压输出与非缓冲器SN74LS27 三3输入端或非门SN74LS28 四2输入端或非缓冲器型号器件名称SN74LS30 8输入端与非门SN74LS31 HEX GENERATING DELAY LINESSN74LS32 四2输入端或门SN74LS33 QUAD 2-INPUT POSITIVE-NOR BUFFERS SN74LS37 QUAD 2-INPUT POSITIVE-NANDBUFFERSSN74LS38 QUAD 2-INPUT POSITIVE-NANDBUFFERSSN74LS40 双4输入端与非缓冲器SN74LS424线-10线译码器 SN74LS47BCD 七段译码,驱动器 SN74LS48BCD-TO-SEVEN-SEGMENT DECODERS/DRIVERS SN74LS49BCD-TO-SEVEN-SEGMENT DECODERS/DRIVERS SN74LS512路3-3输入,2路2-2输入与或非门 SN74LS544路2-3-3-2输入与或非门 SN74LS552路4-4输入与或非门 SN74LS56FREQUENCY DIVIDERS SN74LS57FREQUENCY DIVIDERS SN74LS68DUAL 4-BIT DECADE OR BINARY COUNTERS SN74LS69DUAL 4-BIT DECADE OR BINARY COUNTERS SN74LS73ADUAL J-K FLIP-FLOPS WITH CLEAR SN74LS74A双上升沿D 型触发器 SN74LS75QUAD BISTABLE LATCHES SN74LS76A单D 型触发器 SN74LS78A双D 型触发器 型号器件名称 SN74LS854位数值比较器 SN74LS86A四二进制原码/反码,0/1单元 SN74LS90DECADE COUNTER SN74LS918位移位寄存器 SN74LS92DIVIDE-BY-TWELVE DECADECOUNTER SN74LS934-BIT BINARY COUNTERS SN74LS95B4位移位寄存器 SN74LS96四2输入端与非门 SN74LS107A双 J-K 触发器 SN74LS109A4位移位寄存器 SN74LS112A双下降沿J-K 触发器 SN74LS114A双 J-K 触发器 SN74LS122RETRIGGERABLE MONOSTABLEMULTIVIBRATOR SN74LS123可重触发双稳态触发器 SN74LS125A四总线缓冲器 SN74LS126A四总线缓冲器 SN74LS132四2输入端与非门 SN74LS136QUAD 2-INPU T EXCLUSIVE-OR GATES 地址锁存,3线-8线译码器 3线-8线译码器 双2线-4线译码器SN74LS137SN74LS138SN74LS139ABCD-TO-DECIMAL DECODERS/DRIVERS 10线-4线优先编码器 8线-3线优先编码器 8选1数据选择器 双4选1数据选择器 双2线-4线译码器 双2线-4线译码器OC 四2选1数据选择器 四2选1数据选择器（反码输出） 十进制同步计数器4位二进制同步计数器 十进制同步计数器 4位二进制同步计数器 8位移位寄存器 8位移位寄存器 8位移位寄存器 4位二进制同步加/减计数器 4-BY-4 REGISTER FILES QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR 4位D 型寄存器 六上升沿D 型发器 四上升沿D 型触发器 4位算述逻辑单元/函数生器 DUAL CARRY-SAFE FULL ADDERS 十进制加/减计数器 4位二进制加/减计数器 十进制加/减计数器（双时钟） 4位二进制加/减计数器（双时钟） 4位双向移位寄存器 4位移位寄存器 50/30/100-MHZ 可预置二-五-十进制计数器二-八-十六进制计数器 双单稳态触器 16 X 4 同步先入，先出存储器 16X4 SYNCHRONOUS FIFO MEMORY 16 X 4同步先入，先出存储器（OC ） 八反相缓冲/线驱动/线接收器 八缓冲/线驱动/线接收器 四总线收发器 四总线收发器 八缓冲/线驱动/线接收器 八双向总线发送/接发器4线-7段译码/高压输出驱动器SN74LS248 4线-7段译码/驱动器 SN74LS145SN74LS147SN74LS148SN74LS151SN74LS153SN74LS155ASN74LS156SN74LS157SN74LS158SN74LS160A SN74LS161ASN74LS162ASN74LS163ASN74LS164SN74LS165ASN74LS166ASN74LS169BSN74LS170SN74LS171SN74LS173ASN74LS174SN74LS175SN74LS181SN74LS183SN74LS190SN74LS191SN74LS192SN74LS193SN74LS194ASN74LS195ASN74LS196SN74LS197SN74LS221SN74LS222ASN74LS224ASN74LS227SN74LS228SN74LS240SN74LS241SN74LS242SN74LS243SN74LS244SN74LS245SN74LS247SN74LS251 8选1数据选择器SN74LS253 双4选1数据选择器SN74LS257B 四2选1数据选择器SN74LS258B 四2选1数据选择器SN74LS259B 8位可寻址锁存器SN74LS261 2 BY 4 BIT PARALLEL BINARY MULTIPLIER SN74LS266 QUAD 2-INPUT EXCLUSIVE-NOR GATESSN74LS273 八D触发器SN74LS279A QUAD /S-/R LATCHESSN74LS280 9位奇偶产生器/校验器SN74LS283 4位二进制超位全加器SN74LS290 ASYNCHRONOUS DECADE COUNTERSSN74LS292 可编程频率分配器/数字定时器SN74LS293 4-BIT 二进制计数器SN74LS294 可编程频率分配器/数字定时器SN74LS295B 4-BIT RIGHT-SHIFT LEFT-SHIFT REGISTERS SN74LS297 DIGITAL PHASE-LOCKED-LOOP FILTERSSN74LS298 QUADRUPLE 2-INPUT MULTIPLEXERSSN74LS299 8位双向通用移位/存储寄存器SN74LS320 CRYSTAL-CONTROLLED OSCILLATORSSN74LS321 CRYSTAL-CONTROLLED OSCILLATORSN74LS322A 8-BIT SHIFT REGISTERS WITH SIGN EXTEND SN74LS323 UNIVERSAL SHIFT / STORAGE REGISTERSSN74LS348 8线-3线优先编码器SN74LS352 双4选1数据选择器/多路（复用）器SN74LS353 双4选1数据选择器/多路（复用）器SN74LS354 8选1数据选择器/多路（复用）器/寄存器SN74LS355 8选1数据选择器/多路（复用）器/寄存器（OC）SN74LS356 8选1数据选择器/多路（复用）器/寄存器SN74LS365A 六总线驱动器SN74LS366A 六反相总线驱动器SN74LS367A 六总线驱动器SN74LS368A 六反相总线驱动器SN74LS373 六D型锁存器SN74LS374 六上升沿D型触发器SN74LS375 QUAD BISTABLE LATCHESSN74LS377 六上升沿D型触发器SN74LS378 HEX D-TYPE FLIP-FLOPSSN74LS379 QUAD D-TYPE FLIP-FLOPS算术逻辑单元/函数发生器 算术逻辑单元/函数发生器 8 BY 1 TWO'S-COMPLEMENT MULTIPLIERS QUAD SERIAL ADDERS/SUBTRACTORS 四2输入端异或门 双十进制计数器 双4位二进制计数器 CASCADABLE SHIFT REGISTERS OCTAL STORAGE REGISTERS QUADRUPLE 2-INPUT MULTIPLEXERS 可再触发单稳态多频振荡器 双可再触发单稳态多频振荡器 QUAD TRIDIRECTIONAL BUS TRANSCEIVERS QUAD TRIDIRECTIONAL BUS TRANSCEIVERS QUAD TRIDIRECTIONAL BUS TRANSCEIVERS QUAD TRIDIRECTIONAL BUS TRANSCEIVERS BCD-TO-DECIMAL DECODERS/DRIVERS QUADRUPLE BUS TRANSCEIVERS QUADRUPLE BUS TRANSCEIVERS OCTAL BUFFERS WITH 3-STATE OUTPUTS OCTAL BUFFERS OCTAL BUFFERS OCTAL BUFFERS ASYNCHRONOUS DECADE COUNTERS 8三态缓冲器（反相） OCTAL BUFFERS AND LINE DRIVERS 8-BIT BINARY COUNTERS 8-BIT BINARY COUNTERS 8-BIT BINARY COUNTERS 8-BIT BINARY COUNTERS SERIAL-IN SHIFT REGISTERS SERIAL-IN SHIFT REGISTERS SERIAL-IN SHIFT REGISTERS SERIAL-OUT SHIFT REGISTERS SHIFT REGISTERS WITH INPUT LATCHES 8-BIT SHIFT REGISTERS MEMORY REFRESH CONTROLLERS MEMORY REFRESH CONTROLLERS MEMORY REFRESH CONTROLLERS OCTAL 2-INPUT MULTIPLEXED LATCHES OSN74LS381ASN74LS382ASN74LS384SN74LS385SN74LS386ASN74LS390SN74LS393SN74LS395A SN74LS396SN74LS399SN74LS422SN74LS423SN74LS440SN74LS441SN74LS442SN74LS444SN74LS445SN74LS446SN74LS449SN74LS465SN74LS466SN74LS467SN74LS468SN74LS490SN74LS540SN74LS541SN74LS590SN74LS591SN74LS592SN74LS593SN74LS594SN74LS595SN74LS596SN74LS597SN74LS598SN74LS599SN74LS600ASN74LS601ASN74LS603ASN74LS604SN74LS606CTAL 2-INPUT MULTIPLEXED LATCHES OCTAL 2-INPUT MULTIPLEXED LATCHES 八总线收发器 八总线收发器 八总线收发器 电压控制振荡器 双电压控制振荡器 双电压控制振荡器 DUAL VOLTAGE-CONTROLLED OSCILLATORS 电压控制振荡器 双电压控制振荡器 16位平行误差检测修正电路 OCTAL BUS TRANSCEIVERS OCTAL BUS TRANSCEIVERS OCTAL BUS TRANSCEIVERS OCTAL BUS TRANSCEIVER/IOL=48MA 3-STATE OCTAL BUS TRANSCEIVERS OCTAL BUS TRANSCEIVERS OCTAL BUS TRANSCEIVERS OCTAL BUS TRANSCEIVERS OCTAL BUS TRANSCEIVERS AND REGISTERS OCTAL BUS TRANSCEIVERS AND REGISTERS OCTAL BUS TRANSCEIVERS AND REGISTERS OCTAL BUS TRANSCEIVERS AND REGISTERS OCTAL BUS TRANSCEIVERS AND REGISTERS OCTAL BUS TRANSCEIVERS AND REGISTERS OCTAL BUS TRANSCEIVERS AND REGISTERS SYNCHRONOUS UP/DOWN DECADE COUNTERS 可预置同步加减二进制计数器 4-BY-4 REGISTER FILES 4位通用移位寄存器/锁存器 4位通用移位寄存器/锁存器 SERIAL-IN SHIFT REGISTERS SERIAL-OUT SHIFT REGISTERS 4-BIT PARALLEL BINARY ACCUMULATOR 8位二进制或BCD 大小比较器 8位二进制或BCD 大小比较器 8位二进制或BCD 大小比较器 8-BIT MAGNITUDE/IDENTITY COMPARATORS 8位二进制或BCD 大小比较器 八位数据等值比较器 十进制同步计数器 二进制同步计数器 4位二进制同步计数器SN74LS607 SN74LS620 SN74LS621 SN74LS623 SN74LS624 SN74LS625 SN74LS626 SN74LS627 SN74LS628 SN74LS629 SN74LS630 SN74LS638 SN74LS639 SN74LS640 SN74LS640-1 SN74LS641 SN74LS642 SN74LS644 SN74LS645 SN74LS646 SN74LS647 SN74LS648 SN74LS649 SN74LS651 SN74LS652 SN74LS653 SN74LS668 SN74LS669 SN74LS670 SN74LS671 SN74LS672 SN74LS673 SN74LS674 SN74LS681 SN74LS682 SN74LS684 SN74LS685 SN74LS686 SN74LS687 SN74LS688 SN74LS690 SN74LS691 SN74LS693SN74LS696 SN74LS697 SN74LS699 同步加/减计数器4位二进制同步加/减计数器4位二进制同步加/减计数器。

LOW POWER SCHOTTKYDevice Package Shipping SN74LS86N 14 Pin DIP 2000 Units/Box SN74LS86D14 PinSOIC D SUFFIX CASE 751A2500/T ape & ReelPLASTIC N SUFFIX CASE 646141141ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATIONASIA/PACIFIC: LDC for ON Semiconductor – Asia SupportPhone:303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)Toll Free from Hong Kong 800–4422–3781Email: ONlit–asia@JAPAN: ON Semiconductor, Japan Customer Focus Center4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549Phone: 81–3–5487–8345Email: r14153@Fax Response Line:303–675–2167。

74HC164D中文资料参数及应用74HC164D是一种晶体管技术的CMOS逻辑集成电路，具有具有8个直接想电装入的并行输入以及串行输出的功能。

它包含了一个8位移位寄存器以及一个并行输入与串行输出的移位寄存器。

在这篇文章中，我们将详细介绍74HC164D的参数和应用。

参数：1.供应电压范围：2V至6V。

这意味着74HC164D可以在宽范围的供应电压下工作，使得它非常适用于不同类型的电路设计。

2.输入电压范围：-0.5V至VCC+0.5V。

这意味着输入电压可以高于或低于供应电压，使得74HC164D非常灵活。

3.输出电压范围：与供应电压范围相同。

输出电压等于供应电压，这使得74HC164D非常易于与其他逻辑电路集成。

4.静态工作电流：3μA至20μA。

这是电路处于静止状态时的电流消耗，保持了低功耗设计的特点。

5.工作温度范围：-40°C至85°C。

这使得74HC164D非常适用于不同的环境温度条件下的应用。

应用：1.移位寄存器：由于74HC164D具有移位寄存器的功能，它可以在串行输入端输入数据，并在并行输出端输出数据。

这使得它非常适用于一些需要移位操作的应用，如数字显示器、数码管以及LED矩阵等。

2.级联应用：由于74HC164D具有并行输入和串行输出的特点，它可以与其他74HC164D级联使用，以扩展输出端口的数量。

这使得它非常适用于需要多个输出端口的应用，如显示控制器、LED显示屏控制等。

3.数据传输：由于74HC164D具有快速的数据传输能力，它可以用于数据传输的应用，如数据存储器、数据传输器等。

4.时序控制器：由于74HC164D具有移位寄存器和并行输入的特点，它可以用作时序控制器，以控制不同电路的时序操作。

这使得它非常适用于时序控制电路、时钟发生器等。

总结：74HC164D是一种常用的CMOS逻辑集成电路，具有多种参数和应用。

它可以在宽范围的供应电压下工作，具有灵活的输入和输出电压范围。

Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/00205BCA OBSOLETE CDIP J14TBD Call TI Call TIJM38510/00205BDA OBSOLETE CFP W14TBD Call TI Call TIJM38510/00205BDA OBSOLETE CFP W14TBD Call TI Call TIJM38510/07101BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/07101BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/07101BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/07101BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30102B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30102BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30102SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30102SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN5474J OBSOLETE CDIP J14TBD Call TI Call TISN5474J OBSOLETE CDIP J14TBD Call TI Call TISN54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7474DR OBSOLETE SOIC D14TBD Call TI Call TISN7474DR OBSOLETE SOIC D14TBD Call TI Call TISN7474N OBSOLETE PDIP N14TBD Call TI Call TISN7474N OBSOLETE PDIP N14TBD Call TI Call TISN7474N3OBSOLETE PDIP N14TBD Call TI Call TISN7474N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS74ADE4ACTIVE SOIC D1450Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS74ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS74AJ OBSOLETE CDIP J14TBD Call TI Call TISN74LS74AJ OBSOLETE CDIP J14TBD Call TI Call TISN74LS74AN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74AN ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS74AN3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74AN3OBSOLETE PDIP N14TBD Call TI Call TISN74LS74ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74ANE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS74ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS74ANSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74N3OBSOLETE PDIP N14TBD Call TI Call TIOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S74N3OBSOLETE PDIP N14TBD Call TI Call TISN74S74NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S74NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S74NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5474J OBSOLETE CDIP J14TBD Call TI Call TISNJ5474J OBSOLETE CDIP J14TBD Call TI Call TISNJ5474W OBSOLETE CFP W14TBD Call TI Call TISNJ5474W OBSOLETE CFP W14TBD Call TI Call TI SNJ54LS74AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS74AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS74AJ ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS74AW ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS74AW ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S74FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S74FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S74J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S74W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ54S74W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other 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常用74系列和CMOS 4000系列数字集成电路功能一览表常见数字逻辑器件中文注解74系列：：74LS00 TTL 2输入端四与非门74LS01 TTL 集电极开路2输入端四与非门74LS02 TTL 2输入端四或非门74LS03 TTL 集电极开路2输入端四与非门74LS04 TTL 六反相器74LS05 TTL 集电极开路六反相器74LS06 TTL 集电极开路六反相高压驱动器74LS07 TTL 集电极开路六正相高压驱动器74LS08 TTL 2输入端四与门74LS09 TTL 集电极开路2输入端四与门74LS10 TTL 3输入端3与非门74LS107 TTL 带清除主从双J-K触发器74LS109 TTL 带预置清除正触发双J-K触发器74LS11 TTL 3输入端3与门74LS112 TTL 带预置清除负触发双J-K触发器74LS12 TTL 开路输出3输入端三与非门74LS121 TTL 单稳态多谐振荡器74LS122 TTL 可再触发单稳态多谐振荡器74LS123 TTL 双可再触发单稳态多谐振荡器74LS125 TTL 三态输出高有效四总线缓冲门74LS126 TTL 三态输出低有效四总线缓冲门74LS13 TTL 4输入端双与非施密特触发器74LS132 TTL 2输入端四与非施密特触发器74LS133 TTL 13输入端与非门74LS136 TTL 四异或门74LS138 TTL 3-8线译码器/复工器74LS139 TTL 双2-4线译码器/复工器74LS14 TTL 六反相施密特触发器74LS145 TTL BCD—十进制译码/驱动器74LS15 TTL 开路输出3输入端三与门74LS150 TTL 16选1数据选择/多路开关74LS151 TTL 8选1数据选择器74LS153 TTL 双4选1数据选择器74LS154 TTL 4线—16线译码器74LS155 TTL 图腾柱输出译码器/分配器74LS156 TTL 开路输出译码器/分配器74LS157 TTL 同相输出四2选1数据选择器74LS158 TTL 反相输出四2选1数据选择器74LS16 TTL 开路输出六反相缓冲/驱动器74LS160 TTL 可预置BCD异步清除计数器74LS161 TTL 可予制四位二进制异步清除计数器74LS162 TTL 可预置BCD同步清除计数器74LS163 TTL 可予制四位二进制同步清除计数器74LS164 TTL 八位串行入/并行输出移位寄存器74LS165 TTL 八位并行入/串行输出移位寄存器74LS166 TTL 八位并入/串出移位寄存器74LS169 TTL 二进制四位加/减同步计数器74LS17 TTL 开路输出六同相缓冲/驱动器74LS170 TTL 开路输出4×4寄存器堆74LS173 TTL 三态输出四位D型寄存器74LS174 TTL 带公共时钟和复位六D触发器74LS175 TTL 带公共时钟和复位四D触发器74LS180 TTL 9位奇数/偶数发生器/校验器74LS181 TTL 算术逻辑单元/函数发生器74LS185 TTL 二进制—BCD代码转换器74LS190 TTL BCD同步加/减计数器74LS191 TTL 二进制同步可逆计数器74LS192 TTL 可预置BCD双时钟可逆计数器74LS193 TTL 可预置四位二进制双时钟可逆计数器74LS194 TTL 四位双向通用移位寄存器74LS195 TTL 四位并行通道移位寄存器74LS196 TTL 十进制/二-十进制可预置计数锁存器74LS197 TTL 二进制可预置锁存器/计数器74LS20 TTL 4输入端双与非门74LS21 TTL 4输入端双与门74LS22 TTL 开路输出4输入端双与非门74LS221 TTL 双/单稳态多谐振荡器74LS240 TTL 八反相三态缓冲器/线驱动器74LS241 TTL 八同相三态缓冲器/线驱动器74LS243 TTL 四同相三态总线收发器74LS244 TTL 八同相三态缓冲器/线驱动器74LS245 TTL 八同相三态总线收发器74LS247 TTL BCD—7段15V输出译码/驱动器74LS248 TTL BCD—7段译码/升压输出驱动器74LS249 TTL BCD—7段译码/开路输出驱动器74LS251 TTL 三态输出8选1数据选择器/复工器74LS253 TTL 三态输出双4选1数据选择器/复工器74LS256 TTL 双四位可寻址锁存器74LS257 TTL 三态原码四2选1数据选择器/复工器74LS258 TTL 三态反码四2选1数据选择器/复工器74LS259 TTL 八位可寻址锁存器/3-8线译码器74LS26 TTL 2输入端高压接口四与非门74LS260 TTL 5输入端双或非门74LS266 TTL 2输入端四异或非门74LS27 TTL 3输入端三或非门74LS273 TTL 带公共时钟复位八D触发器74LS279 TTL 四图腾柱输出S-R锁存器74LS28 TTL 2输入端四或非门缓冲器74LS283 TTL 4位二进制全加器74LS290 TTL 二/五分频十进制计数器74LS293 TTL 二/八分频四位二进制计数器74LS295 TTL 四位双向通用移位寄存器74LS298 TTL 四2输入多路带存贮开关74LS299 TTL 三态输出八位通用移位寄存器74LS30 TTL 8输入端与非门74LS32 TTL 2输入端四或门74LS322 TTL 带符号扩展端八位移位寄存器74LS323 TTL 三态输出八位双向移位/存贮寄存器74LS33 TTL 开路输出2输入端四或非缓冲器74LS347 TTL BCD—7段译码器/驱动器74LS352 TTL 双4选1数据选择器/复工器74LS353 TTL 三态输出双4选1数据选择器/复工器74LS365 TTL 门使能输入三态输出六同相线驱动器74LS365 TTL 门使能输入三态输出六同相线驱动器74LS366 TTL 门使能输入三态输出六反相线驱动器74LS367 TTL 4/2线使能输入三态六同相线驱动器74LS368 TTL 4/2线使能输入三态六反相线驱动器74LS37 TTL 开路输出2输入端四与非缓冲器74LS373 TTL 三态同相八D锁存器74LS374 TTL 三态反相八D锁存器74LS375 TTL 4位双稳态锁存器74LS377 TTL 单边输出公共使能八D锁存器74LS378 TTL 单边输出公共使能六D锁存器74LS379 TTL 双边输出公共使能四D锁存器74LS38 TTL 开路输出2输入端四与非缓冲器74LS380 TTL 多功能八进制寄存器74LS39 TTL 开路输出2输入端四与非缓冲器74LS390 TTL 双十进制计数器74LS393 TTL 双四位二进制计数器74LS40 TTL 4输入端双与非缓冲器74LS42 TTL BCD—十进制代码转换器74LS352 TTL 双4选1数据选择器/复工器74LS353 TTL 三态输出双4选1数据选择器/复工器74LS365 TTL 门使能输入三态输出六同相线驱动器74LS366 TTL 门使能输入三态输出六反相线驱动器74LS367 TTL 4/2线使能输入三态六同相线驱动器74LS368 TTL 4/2线使能输入三态六反相线驱动器74LS37 TTL 开路输出2输入端四与非缓冲器74LS373 TTL 三态同相八D锁存器74LS374 TTL 三态反相八D锁存器74LS375 TTL 4位双稳态锁存器74LS377 TTL 单边输出公共使能八D锁存器74LS378 TTL 单边输出公共使能六D锁存器74LS379 TTL 双边输出公共使能四D锁存器74LS38 TTL 开路输出2输入端四与非缓冲器74LS380 TTL 多功能八进制寄存器74LS39 TTL 开路输出2输入端四与非缓冲器74LS390 TTL 双十进制计数器74LS393 TTL 双四位二进制计数器74LS40 TTL 4输入端双与非缓冲器74LS42 TTL BCD—十进制代码转换器74LS447 TTL BCD—7段译码器/驱动器74LS45 TTL BCD—十进制代码转换/驱动器74LS450 TTL 16:1多路转接复用器多工器74LS451 TTL 双8:1多路转接复用器多工器74LS453 TTL 四4:1多路转接复用器多工器74LS46 TTL BCD—7段低有效译码/驱动器74LS460 TTL 十位比较器74LS461 TTL 八进制计数器74LS465 TTL 三态同相2与使能端八总线缓冲器74LS466 TTL 三态反相2与使能八总线缓冲器74LS467 TTL 三态同相2使能端八总线缓冲器74LS468 TTL 三态反相2使能端八总线缓冲器74LS469 TTL 八位双向计数器74LS47 TTL BCD—7段高有效译码/驱动器74LS48 TTL BCD—7段译码器/内部上拉输出驱动74LS490 TTL 双十进制计数器74LS491 TTL 十位计数器74LS498 TTL 八进制移位寄存器74LS50 TTL 2-3/2-2输入端双与或非门74LS502 TTL 八位逐次逼近寄存器74LS503 TTL 八位逐次逼近寄存器74LS51 TTL 2-3/2-2输入端双与或非门74LS533 TTL 三态反相八D锁存器74LS534 TTL 三态反相八D锁存器74LS54 TTL 四路输入与或非门74LS540 TTL 八位三态反相输出总线缓冲器74LS55 TTL 4输入端二路输入与或非门74LS563 TTL 八位三态反相输出触发器74LS564 TTL 八位三态反相输出D触发器74LS573 TTL 八位三态输出触发器74LS574 TTL 八位三态输出D触发器74LS645 TTL 三态输出八同相总线传送接收器74LS670 TTL 三态输出4×4寄存器堆74LS73 TTL 带清除负触发双J-K触发器74LS74 TTL 带置位复位正触发双D触发器74LS76 TTL 带预置清除双J-K触发器74LS83 TTL 四位二进制快速进位全加器74LS85 TTL 四位数字比较器74LS86 TTL 2输入端四异或门74LS90 TTL 可二/五分频十进制计数器74LS93 TTL 可二/八分频二进制计数器74LS95 TTL 四位并行输入\\输出移位寄存器74LS97 TTL 6位同步二进制乘法器CMOS CD4000系列：CD4000 双3输入端或非门+单非门 TICD4001 四2输入端或非门 HIT/NSC/TI/GOLCD4002 双4输入端或非门 NSCCD4006 18位串入/串出移位寄存器 NSCCD4007 双互补对加反相器 NSCCD4008 4位超前进位全加器 NSCCD4009 六反相缓冲/变换器 NSCCD4010 六同相缓冲/变换器 NSCCD4011 四2输入端与非门 HIT/TICD4012 双4输入端与非门 NSCCD4013 双主-从D型触发器 FSC/NSC/TOSCD4014 8位串入/并入-串出移位寄存器 NSCCD4015 双4位串入/并出移位寄存器 TICD4016 四传输门 FSC/TICD4017 十进制计数/分配器 FSC/TI/MOTCD4018 可预制1/N计数器 NSC/MOTCD4019 四与或选择器 PHICD4020 14级串行二进制计数/分频器 FSCCD4021 08位串入/并入-串出移位寄存器 PHI/NSC CD4022 八进制计数/分配器 NSC/MOTCD4023 三3输入端与非门 NSC/MOT/TICD4025 三3输入端或非门 NSC/MOT/TICD4026 十进制计数/7段译码器 NSC/MOT/TICD4027 双J-K触发器 NSC/MOT/TICD4028 BCD码十进制译码器 NSC/MOT/TICD4029 可预置可逆计数器 NSC/MOT/TICD4030 四异或门 NSC/MOT/TI/GOLCD4031 64位串入/串出移位存储器 NSC/MOT/TICD4032 三串行加法器 NSC/TICD4033 十进制计数/7段译码器 NSC/TICD4034 8位通用总线寄存器 NSC/MOT/TICD4035 4位并入/串入-并出/串出移位寄存 NSC/MOT/TI CD4038 三串行加法器 NSC/TICD4040 12级二进制串行计数/分频器 NSC/MOT/TICD4041 四同相/反相缓冲器 NSC/MOT/TICD4042 四锁存D型触发器 NSC/MOT/TICD4043 4三态R-S锁存触发器("1"触发) NSC/MOT/TI CD4044 四三态R-S锁存触发器("0"触发) NSC/MOT/TI CD4046 锁相环 NSC/MOT/TI/PHICD4047 无稳态/单稳态多谐振荡器 NSC/MOT/TICD4048 4输入端可扩展多功能门 NSC/HIT/TICD4049 六反相缓冲/变换器 NSC/HIT/TICD4050 六同相缓冲/变换器 NSC/MOT/TICD4051 八选一模拟开关 NSC/MOT/TICD4052 双4选1模拟开关 NSC/MOT/TICD4053 三组二路模拟开关 NSC/MOT/TICD4054 液晶显示驱动器 NSC/HIT/TICD4055 BCD-7段译码/液晶驱动器 NSC/HIT/TICD4056 液晶显示驱动器 NSC/HIT/TICD4059 “N”分频计数器 NSC/TICD4063 四位数字比较器 NSC/HIT/TICD4066 四传输门 NSC/TI/MOTCD4067 16选1模拟开关 NSC/TICD4068 八输入端与非门/与门 NSC/HIT/TI CD4069 六反相器 NSC/HIT/TICD4070 四异或门 NSC/HIT/TICD4071 四2输入端或门 NSC/TICD4072 双4输入端或门 NSC/TICD4073 三3输入端与门 NSC/TICD4075 三3输入端或门 NSC/TICD4076 四D寄存器CD4077 四2输入端异或非门 HITCD4078 8输入端或非门/或门CD4081 四2输入端与门 NSC/HIT/TICD4082 双4输入端与门 NSC/HIT/TICD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器 NSC/MOT/ST CD4094 8位移位存储总线寄存器 NSC/TI/PHI CD4095 3输入端J-K触发器CD4096 3输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器 NSC/MOT/TICD4099 8位可寻址锁存器 NSC/MOT/STCD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器 NSC\\TICD40107 双2输入端与非缓冲/驱动器 HAR\\TICD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动 STCD40147 10-4线编码器 NSC\\MOTCD40160 可预置BCD加计数器 NSC\\MOTCD40161 可预置4位二进制加计数器 NSC\\MOTCD40162 BCD加法计数器 NSC\\MOTCD40163 4位二进制同步计数器 NSC\\MOTCD40174 六锁存D型触发器 NSC\\TI\\MOTCD40175 四D型触发器 NSC\\TI\\MOTCD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) NSC\\TI CD40193 可预置4位二进制加/减计数器 NSC\\TICD40194 4位并入/串入-并出/串出移位寄存 NSC\\MOT CD40195 4位并入/串入-并出/串出移位寄存 NSC\\MOT CD40208 4×4多端口寄存器CMOS CD4500系列CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐) CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器。

元器件交易网SN54ALS136, SN54AS136, SN74ALS136, SN74AS136QUADRUPLE 2-INPUT EXCLUSIVE-OR GATESWITH OPEN-COLLECTOR OUTPUTS元器件交易网SN54ALS136, SN54AS136, SN74ALS136, SN74AS136QUADRUPLE 2-INPUT EXCLUSIVE-OR GATESWITH OPEN-COLLECTOR OUTPUTSUNITUNIT V OL V TEST CONDITIONS PARAMETER PARAMETER UNITnsns Y YSN54ALS136, SN74ALS136 QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES WITH OPEN-COLLECTOR OUTPUTS SDAS162 – MARCH 1984–REVISED OCTOBER 1988元器件交易网UNITUNITTEST CONDITIONS PARAMETER PARAMETER UNITnsns Y YSN54AS136, SN74AS136QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES WITH OPEN-COLLECTOR OUTPUTS 元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1996, Texas Instruments Incorporated。

Philips SemiconductorsProduct specificationTriacs BT136S series Dlogic levelGENERAL DESCRIPTIONQUICK REFERENCE DATAPassivated,sensitive gate triacs in a SYMBOL PARAMETERMAX.UNIT plastic envelope suitable for surface mounting,intended for use in general BT136S -600D purpose bidirectional switching and V DRM Repetitive peak off-state 600V phase control applications.These I T(RMS)voltages4A devices are intended to be interfaced I TSMRMS on-state current25Adirectly to microcontrollers,logic Non-repetitive peak on-state currentintegrated circuits and other low power gate trigger circuits.PINNING - SOT428PIN CONFIGURATIONSYMBOLLIMITING VALUESLimiting values in accordance with the Absolute Maximum System (IEC 134).SYMBOL PARAMETERCONDITIONSMIN.MAX.UNIT -600V DRM Repetitive peak off-state -600V voltagesI T(RMS)RMS on-state current full sine wave; T mb ≤ 107 ˚C-4A I TSMNon-repetitive peak full sine wave; T j = 25 ˚C prior to on-state current surge t = 20 ms -25A t = 16.7 ms -27A I 2t I 2t for fusingt = 10 ms- 3.1A 2s dI T /dtRepetitive rate of rise of I TM = 6 A; I G = 0.2 A;on-state current after dI G /dt = 0.2 A/µstriggeringT2+ G+-50A/µs T2+ G--50A/µs T2- G--50A/µs T2- G+-10A/µs I GM Peak gate current -2A V GM Peak gate voltage -5V P GM Peak gate power -5W P G(AV)Average gate power over any 20 ms period-0.5W T stg Storage temperature -40150˚C T jOperating junction -125˚Ctemperature查询BT136S series D供应商THERMAL RESISTANCESSYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNITRth j-mb Thermal resistance full cycle-- 3.0K/W junction to mounting base half cycle-- 3.7K/WRth j-a Thermal resistance pcb (FR4) mounted; footprint as in Fig.14-75-K/W junction to ambientSTATIC CHARACTERISTICSTj= 25 ˚C unless otherwise statedSYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNITI GT Gate trigger current VD= 12 V; IT= 0.1 AT2+ G+- 2.05mAT2+ G-- 2.55mAT2- G-- 2.55mAT2- G+- 5.010mAI L Latching current VD= 12 V; IGT= 0.1 AT2+ G+- 1.610mAT2+ G-- 4.515mAT2- G-- 1.210mAT2- G+- 2.215mAI H Holding current VD= 12 V; IGT= 0.1 A- 1.210mAVT On-state voltage IT= 5 A- 1.4 1.70VVGT Gate trigger voltage VD= 12 V; IT= 0.1 A-0.7 1.5VVD= 400 V; IT= 0.1 A; Tj= 125 ˚C0.250.4-VI D Off-state leakage current VD= VDRM(max); Tj= 125 ˚C-0.10.5mADYNAMIC CHARACTERISTICSTj= 25 ˚C unless otherwise statedSYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNITdVD /dt Critical rate of rise of VDM= 67% VDRM(max); Tj= 125 ˚C;-5-V/µs off-state voltage exponential waveform; RGK= 1 kΩt gt Gate controlled turn-on ITM= 6 A; VD= VDRM(max); IG= 0.1 A;-2-µs time dIG/dt = 5 A/µsFig.9. Normalised holding current I H (T j )/ I H (25˚C),versus junction temperature T j .Fig.12. Typical, critical rate of rise of off-state voltage,dV D /dt versus junction temperature T j .-505010015000.511.522.53Tj / CIH(Tj)IH(25C)0501001501101001000Tj / CdVD/dt (V/us)MECHANICAL DATANotes1. Plastic meets UL94 V0 at 1/8".DEFINITIONSDATA SHEET STATUSDATA SHEET PRODUCT DEFINITIONSSTATUS1STATUS2Objective data Development This data sheet contains data from the objective specification forproduct development. Philips Semiconductors reserves the right tochange the specification in any manner without noticePreliminary data Qualification This data sheet contains data from the preliminary specification.Supplementary data will be published at a later date. PhilipsSemiconductors reserves the right to change the specification withoutnotice, in ordere to improve the design and supply the best possibleproductProduct data Production This data sheet contains data from the product specification. PhilipsSemiconductors reserves the right to make changes at any time inorder to improve the design, manufacturing and supply. Changes willbe communicated according to the Customer Product/ProcessChange Notification (CPCN) procedure SNW-SQ-650ALimiting valuesLimiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application informationWhere application information is given, it is advisory and does not form part of the specification.Philips Electronics N.V. 2001All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.1 Please consult the most recently issued datasheet before initiating or completing a design.2 The product status of the device(s) described in this datasheet may have changed since this datasheet was published. The latest information is available on the Internet at URL .。

74ls42中文资料目录74LS42简介 (1)使用条件 (1)详细介绍 (2)74LS42简介74LS42可以将输入的4位二进制数转换为十进制数输出。

由于输出的十进制数的范围为0-9，输入的二进制数的范围也是0-9，与4位BCD码的表示范围相同，因此也可以将74LS42称作BCD-十进制译码器，即将BCD码转换为十进制数。

使用条件在使用该芯片时，最好在如下的条件下使用：详细介绍该芯片的外观如图1所示，该芯片共16个引脚。

逻辑电路如图2所示。

其中12-15引脚为输入引脚，1-7,9-11为输出引脚。

图2未标注的16引脚为VCC，8引脚为GND。

该芯片的工作方式为，将12-15（即A-D）引脚输入的二进制数转换为十进制数，并在该十进制数对应的输出引脚编号上输出低电平，其余输出引脚输出高电平。

例如输入的二进制数为1001B，则11号引脚输出低电平，其余输出引脚输出低电平。

输入与输出具体关系见下表。

输入引脚输出引脚D C B A0123456789L L L L L H H H H H H H H HL L L H H L H H H H H H H HL L H L H H L H H H H H H HL L H H H H H L H H H H H H从上表可以看出，当输入的二进制数的范围在0-9时，该芯片的输出端总会有一个引脚是低电平。

但是当输入数据大于9之后，输出端不输入任何数据，即输出引脚都为高电平。

输出引脚的驱动能力为高电平10个单位TTL负载，低电平5个单位TTL负载。

（1个单位高电平TTL负载为40uA，低电平TTL负载为1.6mA）。

中华人民共和国国家职业卫生标准（GBZ 2-2002）工作场所有害因素职业接触限值Occupational Exposure Limit for Hazardous Agents in the Workplace说明PC-TWA 时间加权平均容许浓度（8小时）。

PC-MAC 最高容许浓度，指在一个工作日内任何时间都不应超过的浓度。

PC-STEL 短时间接触容许浓度（15分钟）。

* 表1：数值系根据“超限系数”推算；表2：粉尘TWA的接触上限值。

** 表1：“其他粉尘”指不含有石棉且游离SiO2含量低于10%，不含有毒物质，尚未制订专项卫生标准的粉尘。

总粉尘指直径为40mm的滤膜，按标准粉尘测定方法采样所得的粉尘。

呼尘呼吸性粉尘，指按呼吸性粉尘采样方法所采集的可进入肺泡的粉尘粒子，其空气动力学直径均在7.07μｍ以下，空气动力学直径5μｍ粉尘粒子的采样效率为50%。

表1工作场所空气中有毒物质容许浓度(mg/m3)No 中文名（CAS No.）英文名MAC TWA *STEL1. 安妥(86-88-4) Antu -- 0.3 0.9*2. 氨(7664-41-7) Ammonia -- 20 303. 2-氨基吡啶（皮）（504-29-0）2-Aminopyridine(skin) -- 2 5*4. 氨基磺酸铵（7773-06-0）Ammonium sulfamate -- 6 15*5. 氨基氰（420-04-2）Cyanamide -- 2 5*6. 奥克托今（2691-41-0）Octogen -- 2 47. 巴豆醛（4170-30-3）Crotonaldehyde 12 -- --8. 百菌清（1897-45-6）Chlorothalonile 1 -- --9. 倍硫磷（皮）（55-38-9）Fenthion(skin) -- 0.2 0.310. 苯（皮）（71-43-2）Benzene(skin) -- 6 1011. 苯胺（皮）（62-53-3）Aniline(skin) -- 3 7.5*12. 苯基醚（二苯醚）（101-84-8）Phenyl ether -- 7 1413. 苯硫磷（皮）（2104-64-5）EPN（skin) -- 0.5 1.5*14. 苯乙烯（皮）（100-42-5）Styene(skin) -- 50 10015. 吡啶（110-86-1）Pyridine -- 4 10*16. 苄基氯（100-44-7）Benzyl chloride 5 -- --17. 丙醇（71-23-8）Propyl alcohol -- 200 30018. 丙酸（70-09-4）Propionic acid -- 30 60*19. 丙酮（67-64-1）Acetone -- 300 45020. 丙酮氰醇（按CN计）（皮）（75-86-5）Acetone cyanohydrin(skin) as CN 3 -- --21. 丙烯醇（皮）（107-18-6）Allyl alcohol(skin) -- 2 322. 丙烯腈（皮）（107-13-1）Acrylonitrile(skin) -- 1 223. 丙烯醛（107-02-8）Acrolein 0.3 -- --24. 丙烯酸（皮）（79-10-7）Acrylic acid(skin) -- 6 15*25. 丙烯酸甲酯（皮）（96-33-3）M ethyl acrylate(skin) -- 20 40*26. 丙烯酸正丁酯（141-32-2）n-Butyl acrylate -- 25 50*27. 丙烯酰胺（皮）（79-06-1）Acrylamide(skin) -- 0.3 0.9*28. 草酸（144-62-7）Oxalic acid -- 1 229. 抽余油（60～220℃）Raffinate（60～220℃）-- 300 450*30. 臭氧（10028-15-6）Ozone 0.3 -- --31. 滴滴涕（DDT）（50-29-3）Dichlorodiphenyltrichloroethane(DDT) -- 0.2 0.6*32. 敌百虫（52-68-6）Trichlorfon -- 0.5 133. 敌草隆（330-54-1）Diuron -- 10 25*34. 碲化铋（按Bi2Te3计）（1304-82-1）Bismuth telluride，as Bi 2 Te3-- 5 12.535. 碘（7553-56-2）Iodine 1 -- --36. 碘仿（75-47-8）Iodoform -- 10 25*37. 碘甲烷（皮）（74-88-4）Methyl iodide(skin) -- 10 25*38. 叠氮酸和叠氮化钠（7782-79-8；26628-22-8）叠氮酸蒸气叠氮化钠Hydrazoic acid and sodium azideHydrazoic acid vaporsodium azide0.20.3--------39. 丁醇（71-36-3）Butyl alcohol -- 100 200*40. 1,3-丁二烯(106-99-0) 1,3-Butadiene -- 5 12.5*41. 丁醛（123-72-8）Butyladehyde -- 5 1042. 丁酮（78-93-3）Methyl ethyl ketone -- 300 60043. 丁烯（25167-67-3）Butylene -- 100 200*44. 对苯二甲酸（100-21-0）Terephthalic acid -- 8 1545. 对硫磷（皮）（56-38-2）Parathion(skin) -- 0.05 0.146. 对特丁基甲苯（98-51-1）p-Tert-butyltoluene -- 6 15*47. 对硝基苯胺（皮）（100-01-6）p-Nitroaniline(skin) -- 3 7.5*48. 对硝基氯苯/二硝基氯苯（皮）（100-00-5/25567-67-3）p-Nitrochlorobenzene/Dinitrochlorobenzene(skin)-- 0.6 1.8*49. 多次甲基多苯基多异氰酸酯（57029-46-6）Polymetyhlene polyphenylisocyanate(PMPPI)-- 0.3 0.550. 二苯胺（122-39-4）Diphenylamine -- 10 25*51. 二苯基甲烷二异氰酸酯（101-68-8）Diphenylmethane diisocyanate -- 0.05 0.152. 二丙二醇甲醚（皮)（34590-94-8）Dipropylene glycolmethyl ether(skin) -- 600 90053. 2-N-二丁氨基乙醇（皮）（102-81-8）2-N-Dibutylaminoethanol(skin) -- 4 10*54. 二恶烷（皮）（123-91-1）1,1,4-Dioxane(skin) -- 70 140*55. 二氟氯甲烷（75-45-6）Chlorodifluoromethane -- 3500 5250*56. 二甲胺（124-40-3）Dimethylamine -- 5 1057. 二甲苯（全部异构体）（1330-20-7；95-47-6；108-38-3）Xylene(all isomers) -- 50 100 58. 二甲苯胺（皮）（121-69-7） Dimethylanilne(skin) -- 5 1059. 1,3-二甲基丁基醋酸酯（仲-乙酸己酯）(108-84-9) 1,3-Dimethylbutylacetate(sec-hexylacetate)-- 300 450*60. 二甲基二氯硅烷（75-78-5）Dimethyl dichlorosilane 2 -- --61. 二甲基甲酰胺（皮）（68-12-2）D imethylformamide(DMF)(skin) -- 20 40*62. 3,3-二甲基联苯胺（皮）（119-93-7）3,3-Dimethylbenzidine(skin) 0.02 -- --63. 二甲基乙酰胺（皮）（127-19-5）D imethyl acetamide(skin) -- 20 40*64. 二聚环戊二烯（77-73-6）Dicyclopentadiene -- 25 50*65. 二硫化碳（皮）（75-15-0）Carbon disulfide(skin) -- 5 1066. 1,1-二氯-1-硝基乙烷（594-72-9）1,1-Dichloro-1-nitroethane -- 12 24*67. 二氯苯对二氯苯（106-46-7）邻二氯苯（95-50-1）Dichlorobenzenep-Dichlorobenzeneo-Dichlorobenzene----30506010068. 1,3-二氯丙醇（皮）（96-23-1）1,3-Dichloropropanol(skin) -- 5 12.5*69. 1,2-二氯丙烷（78-87-5）1,2-Dichloropropane -- 350 50070. 1,3-二氯丙烯（皮）（542-75-6）1,3-Dichloropropene(skin) -- 4 10*71. 二氯代乙炔（7572-29-4）Dichloroacetylene 0.4 -- --72. 二氯二氟甲烷（75-71-8）Dichlorodifluoromethane -- 5000 7500*73. 二氯甲烷（75-09-2）Dichloromethane -- 200 300*74. 1,2-二氯乙烷（107-06-2）1,2-Dichloroethane -- 7 1575. 1,2-二氯乙烯（540-59-0）1,2-Dichloroethylene -- 800 1200*76. 二缩水甘油醚（2238-07-5）Diglycidyl ether -- 0.5 1.5*77. 二硝基苯（全部异构体）（皮）（582-29-0；99-65-0；100-25-4）Dinitrobenzene(all isomers)(skin) -- 1 2.5*78. 二硝基甲苯（皮）（25321-14-6）D initrotoluene(skin) -- 0.2 0.6*79. 4,6-二硝基邻苯甲酚（皮）（534-52-1）4,6-Dinitro-o-cresol(skin) -- 0.2 0.6*80. 二氧化氮（10102-44-0）Nitrogen dioxide -- 5 1081. 二氧化硫（7446-09-5）Sulfur dioxide -- 5 1082. 二氧化氯（10049-04-4）Chlorine dioxide -- 0.3 0.883. 二氧化碳（124-38-9）Carbon dioxide -- 9000 1800084. 二氧化锡（按Sn计）（1332-29-2）Tin dioxdie,as Sn -- 2 5*85. 2-二乙氨基乙醇（皮）（100-37-8）2-Diethylaminoethanol(skin) -- 50 100*86. 二乙撑三胺（皮）（111-40-0）D iethylene triamine(skin) -- 4 10*87. 二乙基甲酮（96-22-0）Diethyl ketone -- 700 90088. 二乙烯基苯（1321-740-0）Divinyl benzene -- 50 100*89. 二异丁基甲酮（108-83-8）Diisobutyl ketone -- 145 218*90. 二异氰酸甲苯酯（TDI）（584-84-9）Toluene-2,4-diisocyanate(TDI) -- 0.1 0.291. 二月桂酸二丁基锡（皮）（77-58-7）Dibutyltin dilaurate(skin) -- 0.1 0.292. 钒及其化合物（按V计）（7440-62-6）五氧化二钒烟尘钒铁合金尘Vanadium and compounds,as VVanadium pentoxide fume、dustFerrovanadium alloy dust----0.0510.15*2.5*93. 呋喃（110-00-9）Furan -- 0.5 1.5*94. 氟化氢（按F计）（7664-39-3）H ydrogen fluoride,as F 2 -- --95. 氟化物（不含氟化氢）（按F计）Fluorides(except HF),as F -- 2 5*96. 锆及其化合物（按Zr计）（7440-67-7）Zirconium and compounds,as Zr -- 5 1097. 镉及其化合物（按Cd计）（7440-43-9）Cadmium and compounds,as Cd -- 0.01 0.0298. 汞(7439-97-6)金属汞（蒸气）有机汞化合物（皮）（按Hg 计）MercuryElement mercury(vapor)Mercury organic compounds(skin)as Hg -- -- 0.02 0.01 0.04 0.03 99. 钴及其氧化物（按Co 计）（7440-48-4）Cobalt and oxides,as Co--0.050.1100. 光气（75-44-5）Phosgene0.5 -- -- 101. 癸硼烷（皮）（17702-41-9） Decaborane(skin) -- 0.25 0.75 102. 过氧化苯甲酰（94-36-0）Benzoyl peroxide -- 5 12.5* 103. 过氧化氢（7722-84-1）Hydrogen peroxide -- 1.5 3.75* 104. 环己胺（108-91-8）Cyclohexylamine -- 10 20 105. 环己醇（皮）（108-93-0）Cyclohexanol(skin) -- 100 200* 106. 环己酮（皮）（108-94-1）Cyclohexanone(skin) -- 50 100* 107. 环己烷（110-82-7）Cyclohexane -- 250 375* 108. 环氧丙烷（75-56-9）Propylene Oxide-- 5 12.5* 109. 环氧氯丙烷（皮）（106-89-8）Epichlorohydrin(skin)-- 1 2 110. 环氧乙烷（75-21-8）Elthylene oxide -- 2 5* 111. 黄磷（7723-14-0）Yellow phosphorus --0.050.1112. 茴香胺（皮）邻茴香胺（皮）（90-04-0）对茴香胺（皮）（104-94-9）Anisidine(skin)o-Anisidine(skin) p-Anisidine(skin)-- --0.5 0.51.5* 1.5* 113. 己二醇（107-41-5）Hexylene glycol100 -- -- 114. 1,6-己二异氰酸酯（822-06-0）H examethylene diisocyanate -- 0.03 0.15* 115. 己内酰胺（105-60-2）Caprolactam -- 5 12.5* 116. 2-己酮（皮）（591-78-6）2-Hexanone(skin) -- 20 40 117. 甲醇（皮）（67-56-1）Methanol(skin) --2550 118. 甲拌磷（皮）（298-02-2）Thimet(skin) 0.01 -- -- 119. 甲苯（皮）（108-88-3）Toluene(skin)-- 50 100 120. N -甲苯胺（皮）（100-61-8） N-Methyl aniline(skin) -- 2 5* 121. 甲酚（皮）（1319-77-3）Cresol(skin)-- 10 25* 122. 甲基丙烯腈（皮）（126-98-7）M ethylacrylonitrile(skin) -- 3 7.5* 123. 甲基丙烯酸（79-41-4）Methacrylic acid -- 70 140* 124. 甲基丙烯酸甲酯（80-62-6）Methyl methacrylate -- 100 200* 125. 甲基丙烯酸缩水甘油酯（106-91-2）Glycidyl methacrylate5----126. 甲基肼（皮）（60-34-4）Methyl hydrazine(skin) 0.08 -- -- 127. 甲基内吸磷（皮）（8022-00-2）M ethyl demeton(skin)--0.20.6*128. 18-甲基炔诺酮（炔诺孕酮）（6533-00-2）18-Methyl norgestrel -- 0.5 2 129. 甲硫醇（74-93-1）Methyl mercaptan -- 1 2.5* 130. 甲醛（50-00-0）Formaldehyde 0.5 -- -- 131. 甲酸（64-18-6）Formic acid -- 10 20 132. 甲氧基乙醇（皮）（109-86-4）2-Methoxyethanol(skin) -- 15 30* 133. 甲氧氯（72-43-5）Methoxychlor -- 10 25* 134. 间苯二酚（108-46-3）Resorcinol -- 20 40* 135. 焦炉逸散物（按苯溶物计）Coke oven emissions,as benzene solubematter-- 0.1 0.3* 136. 肼（皮）（302-01-2）Hydrazine(skin) -- 0.06 0.13 137. 久效磷（皮）（6923-32-4）Monocrotophos(skin) -- 0.1 0.3* 138. 糖醇（98-00-0）Furfuryl alcohol -- 40 60 139. 糖醛（皮）（98-01-1）Furfural(skin) -- 5 12.5* 140. 考的松（53-06-5）Cortisone -- 1 2.5*141. 苛性碱氢氧化钠1310-73-2氢氧化钾1310-58-3 Caustic alcaliSodium hydroxidePotassium hydroxide22--------142. 枯草杆菌蛋白酶Subtilisins -- 15ng/m330ng/m3 143. 苦味酸（88-89-1）Picric acid -- 0.1 0.3* 144. 乐果（皮）（60-51-5）Rogor(skin) -- 1 2.5* 145. 联苯（92-52-4）Biphenyl -- 1.5 3.75* 146. 邻苯二甲酸二丁酯（84-74-2）D ibutyl phthalate -- 2.5 6.25* 147. 邻苯二甲酸酐（85-44-9）Phthalic anhydride 1 -- -- 148. 邻氯苯乙烯（2038-87-47）o-Chlorostyrene -- 250 400149. 邻氯苄叉丙二腈（皮）（2698-41-1）o-Chlorobenzylidenemalononitrile(skin)0.4 -- --150. 邻仲丁基苯酚（皮）（89-72-5）o-sec-Butylphenol(skin) -- 30 60* 151. 磷胺（皮）（13171-21-6）Phosphamidon(skin) -- 0.02 0.06* 152. 磷化氢（7803-51-2）Phosphine 0.3 -- -- 153. 磷酸（7664-38-2）Phosphoric acid -- 1 3 154. 磷酸二丁基苯酯（皮）（2528-36-1）Dibutyl phenyl phosphate(skin) -- 3.5 8.75* 155. 硫化氢（7783-06-4）Hydrogen sulfide 10 -- -- 156. 硫酸钡（按Ba计）（7727-06-0）Barium sulfate,as Ba -- 10 25* 157. 硫酸二甲酯（皮）（77-78-1）D imethyl sulfate(skin) -- 0.5 1.5* 158. 硫酸及三氧化硫（7664-93-9）Sulfuric acid and sulfur trioxide -- 1 2159. 硫酸氟（2699-79-8）Sulfuryl fluoride -- 20 40 160. 六氟丙酮（皮）（684-16-2） Hexafluoroacetone(skin) -- 0.5 1.5* 161. 六氟丙烯（116-15-4）Hexafluoropropylene -- 4 10* 162. 六氟化硫（2551-62-4）Sulfur hexafluoride -- 6000 9000* 163. 六六六（608-73-1）Hexachlorocyclohexane -- 0.3 0.5 164. γ-六六六（58-89-9）γ-Hexachlorocyclohexane -- 0.05 0.1 165. 六氯丁二烯（皮）（87-68-3）H exachlorobutadine(skin) -- 0.2 0.6* 166. 六氯环戊二烯（77-47-4）Hexachlorocyclopentadiene -- 0.1 0.3* 167. 六氯萘（皮）（1335-87-1）Hexachloronaphthalene(skin) -- 0.2 0.6* 168. 六氯乙烷（皮）（67-72-1）Hexachloroethane(skin) -- 10 25* 169. 氯（7782-50-5）Chlorine 1 -- -- 170. 氯苯（108-90-7）Chlorobenzene -- 50 100* 171. 氯丙酮（皮）（78-95-5）Chloroacetone(skin) 4 -- -- 172. 氯丙烯（107-05-1）Allyl chloride -- 2 4 173. 氯丁二烯（皮）（126-99-8） Chloroprene(skin) -- 4 10* 174. 氯化铵烟（12125-02-9）Ammonium chloride fume -- 10 20 175. 氯化苦（76-06-2）Chloropicrin 1 -- -- 176. 氯化氢及盐酸（7647-01-0）Hydrogen chloride and chlorhydric acid 7.5 -- -- 177. 氯化氰（506-77-4）Cyanogen chloride 0.75 -- -- 178. 氯化锌烟（7646-85-7）Zinc chloride fume -- 1 2 179. 氯甲甲醚（107-30-2）Chloromethyl methyl ether 0.005 -- -- 180. 氯甲烷（74-87-3）Methyl chloride -- 60 120 181. 氯联苯（54%氯）（皮）（11097-69-1）Chlorodiphenyl (54%Cl)(skin) -- 0.5 1.5* 182. 氯萘（皮）（90-13-1）Chloronaphthalene(skin) -- 0.5 1.5* 183. 氯乙醇（皮）（107-07-3）Ethylene chlorohydrin(skin) 2 -- -- 184. 氯乙醛（107-20-0）Chloroacetaldehyde 3 -- -- 185. 氯乙烯（75-01-4) Vinyl chloride -- 10 25* 186. α-氯乙酰苯（532-27-4）α-Chloroacetophenone -- 0.3 0.9* 187. 氯乙酰氯（皮）（79-04-9）Chloroacetyl chloride(skin) -- 0.2 0.6 188. 马拉硫磷（皮）（121-75-5） Malathion(skin) -- 2 5* 189. 马来酸酐（108-31-6）Maleic anhydride -- 1 2 190. 吗啉（皮）（110-91-8）Morpholine(skin) -- 60 120*191. 煤焦油沥青挥发物（按苯溶物计）（65996-93-2）Coal tar pitch volatiles,as Benzenesoluble matters-- 0.2 0.6*192. 锰及其无机化合物（按MnO 2计）（7439-96-5）Manganese and inorganic compounds,as MnO2-- 0.15 0.45*193. 钼及其化合物（Mo 计）（7439-98-7）钼，不溶性化合物可溶性化合物Molybdeum and compounds,as Mo Molybdeum and insoluble compounds Soluble compounds-- --6 415* 10*194. 内吸磷（皮）（8065-48-3）Demeton(skin) -- 0.05 0.15* 195. 萘（91-20-3）Naphthalene -- 50 75 196. 2-萘酚（2814-77-9）2-Naphthol -- 0.25 0.5 197. 萘烷（91-17-8）Decalin -- 60 120* 198. 尿素（57-13-6）Urea--510199. 镍及其无机化合物（按Ni 计）（7440-02-0）金属镍与难溶性镍化合物可溶性镍化合物Nickel and inorganic compounds,as NiNickel and isoluble compounds Soluble compounds-- -- 1 0.52.5* 1.5*200. 铍及其化合物（按Be 计）（7440-41-7）Beryllium and compounds,as Be--0.0005 0.001201. 偏二甲基肼（皮）（57-14-7）U nsymmetric dimethylhydrazine(skin) -- 0.5 1.5*202. 铅及无机化合物（按Pb 计）（7439-92-1）铅尘铅烟Lead and inorganic Compounds,as Pb Lead dust Lead fume0.05 0.03 -- ---- --203. 氢化锂（7580-67-8）Lithium hydride -- 0.025 0.05 204. 氢醌（123-31-9）Hydroquinone -- 1 2 205. 氢氧化铯（21351-79-1）Cesium hydroxide -- 2 5* 206. 氰氨化钙（156-62-7）Calcium cyanamide-- 1 3 207. 氰化氢（按CN 计）（皮）（74-90-8）Hydrogen cyanide,as CN(skin)1----208. 氰化物（按CN 计）（皮）（460-19-5）Cyanides,as CN(skin) 1 -- --209. 氰戊菊酯（皮）（51630-58-1）Fenvalerate(skin) -- 0.05 0.15* 210. 全氟异丁烯（382-21-8）Perfluoroisobutylene 0.08 -- -- 211. 壬烷（11-84-2）Nonane-- 500 750* 212. 溶剂汽油Solvent gasolines -- 300 450* 213. n-乳酸正丁酯（138-22-7）n-Butyl lactate -- 25 50* 214. 三次甲基三硝基胺（黑索今）（121-82-4）Cyclonite(RDX)--1.53.75*215. 三氟化氯（7790-91-2）Chlorine trifluoride 0.4 -- --216. 三氟化硼（7637-07-2）Boron trifluoride 3 -- -- 217. 三氟甲基次氟酸酯Trifluoromethyl hypofluorite 0.2 -- -- 218. 三甲苯磷酸酯（皮）（1330-78-5）Tricresyl phosphate(skin) -- 0.3 0.9*219. 1,2,3-三氯丙烷（皮）（96-18-4）1,2,3-Trichloropropane(skin) -- 60 120* 220. 三氯化磷（7719-12-2）Phosphorus trichloride -- 1 2 221. 三氯甲烷（67-66-3）Trichloromethane -- 20 40* 222. 三氯硫磷（3982-91-0）Phosphorous thiochloride 0.5 -- -- 223. 三氯氢硅（10025-28-2）Trichlorosilane 3 -- -- 224. 三氯氧磷（10025-87-3）Phosphorus oxychloride -- 0.3 0.6 225. 三氯乙醛（75-87-6）Trichloroacetaldehyde 3 -- -- 226. 1,1,1-三氯乙烷（71-55-6）1,1,1-trichloroethane -- 900 1350* 227. 三氯乙烯（79-01-6）Trichloroethylene -- 30 60* 228. 三硝基甲苯（皮）（118-96-7）Trinitrotoluene(skin) -- 0.2 0.5229. 三氧化铬、铬酸盐、重铬酸盐（按Cr计）（7440-47-3）Chromium trioxide、chromate、dichromate,as Cr-- 0.05 0.15*230. 三乙基氯化锡（皮）（994-31-0）Triethyltin chloride(skin) -- 0.05 0.1 231. 杀螟松（皮）（122-14-5）Sumithion(skin) -- 1 2 232. 砷化氢（胂）（7784-42-1）Arsine 0.03 -- -- 233. 砷及其无机化合物（按As计）(7440-38-2)Arsenic and inoganic compounds,as As -- 0.01 0.02 234. 升汞（氯化汞）（7487-94-7）M ercuric chloride -- 0.025 0.075* 235. 石腊烟（8002-74-2）Paraffin wax fume -- 2 4236. 石油沥青烟（按苯溶物计）（8052-42-4）Asphalt(petroleum)fume,as benzenesoluble matter-- 5 12.5*237. 双（巯基乙酸）二辛基锡（26401-97-8）Bis(marcaptoacetate)dioctyltin -- 0.1 0.2 238. 双丙酮醇（123-42-2）Diacetone alcohol -- 240 360* 239. 双硫醒（97-77-8）Disulfiram -- 2 5* 240. 双氯甲醚（542-88-1）Bis(chloromethyl)ether 0.005 -- -- 241. 四氯化碳（皮）（56-23-5）Carbon tetrachloride(skin) -- 15 25 242. 四氯乙烯（127-18-4）Tetrachloroethylene -- 200 300* 243. 四氢呋喃（109-99-9）Tetrahydrofuran -- 300 450* 244. 四氢化锗（7782-65-2）Germanium tetrahydride -- 0.6 1.8* 245. 四溴化碳（558-13-4）Carbon tetrabromide -- 1.5 4 246. 四乙基铅（按Pb计）（皮）Tetraethyl lead,as Pb(skin) -- 0.02 0.06*（78-00-2）247. 松节油（8006-64-2）Turpentine-- 300 450* 248. 铊及其可溶性化合物（按TI 计）（皮）（7440-28-0）Thalium and soluble compounds,asTI(skin) ----0.050.1249. 钽及其氧化物（按Ta 计）（7440-25-7）Tantalum and oxide,as Ta-- 5 12.5*250. 碳酸钠（纯碱）（3313-92-6）Sodium carbonate -- 3 6 251. 羰基氟（353-50-4）Carbonyl fluoride--510 252. 羰基镍（按Ni 计）（13463-39-3）N ickel carbonyl,as Ni 0.002 -- -- 253. 锑及其化合物（按Sb 计）（7440-36-0）Antimony and compounds,as Sb--0.51.5*254. 铜（按Cu 计）（7440-50-8）铜尘铜烟Copper,as CuCopper dust Copper fume-- -- 1 0.2 2.5* 0.6* 255. 钨及其不溶性化合物(按W 计)（7440-33-7）Tungsten and insoluble compounds,as W --510256. 五氟氯乙烷（76-15-3）Chloropentafluoroethane -- 5000 7500* 257. 五硫化二磷（1314-80-3）Phosphorus pentasulfide -- 1 3 258. 五氯酚及其钠盐（皮）（87-86-5）Pentachlorophenol and sodium salts(skin)--0.30.9*259. 五羰基铁（按Fe 计）（13463-40-6）Iron pentacarbonyl,as Fe -- 0.25 0.5260. 五氧化二磷（1314-56-3）Phosphorus pentoxide 1 -- -- 261. 戊醇（71-41-0）Amyl alcohol -- 100 200* 262. 戊烷（109-66-0）Pentane-- 500 1000 263. 硒化氢（按Se 计）（7783-07-5）H ydrogen selenide,as Se -- 0.15 0.3 264. 硒及其化合物（按Se 计）（除外六氟化硒、硒化氢）（7782-49-2）Selenium and compounds, as Se(excepthexafluoride,hydrogen selenide)--0.10.3*265. 纤维素（9004-34-6）Cellulose-- 10 25* 266. 硝化甘油（皮）（55-63-0）Nitroglycerine(skin) 1 -- -- 267. 硝基苯（皮）（98-95-3）Nitrobenzene(skin) -- 2 5* 268. 1-硝基丙烷(108-03-2) 1-Nitropropane -- 90 180* 269. 2-硝基丙烷（79-46-9）2-Nitropropane-- 30 60* 270. 硝基甲苯（全部异构体）（皮）（88-72-2；99-08-1；99-99-0）Nitrotoluene,(all isomers)(skin)--1025*271. 硝基甲烷（75-52-5）Nitromethane--50100*272. 硝基乙烷（79-24-3）Nitroethane -- 300 450* 273. 辛烷（111-65-9）Octane -- 500 750* 274. 溴（7726-95-6）Bromine -- 0.6 2 275. 溴化氢（10035-10-6）Hydrogen bromide 10 -- -- 276. 溴甲烷（皮）（74-83-9）Methyl bromide(skin) -- 2 5* 277. 溴氰菊酯（52918-63-5）Deltamethrin -- 0.03 0.09* 278. 氧化钙（1305-78-8）Calcium oxide -- 2 5* 279. 氧化乐果（皮）（1113-02-6）O methoate(skin) -- 0.15 0.45* 280. 氧化镁烟（1309-48-4）Magnesium oxide fume -- 10 25* 281. 氧化锌（1314-13-2）Zinc oxide -- 3 5 282. 液化石油气（68476-85-7）Liqufied petroleum(L.P.G.) -- 1000 1500 283. 一甲胺（甲胺）（74-89-5）Monomethylamine -- 5 10 284. 一氧化氮（10102-43-9）Nitric oxide(Nitrogen monooxide) -- 15 30*285. 一氧化碳（630-08-0）非高原高原海拔2000米～海拔>3000米Carbon monoxidenot in high altitude areain high altitude area2000m～>3000m--201520----30----286. 乙胺（75-04-7）Ethylamine -- 9 18 287. 乙苯（100-41-4）Ethyl benzene -- 100 150 288. 乙醇胺（141-43-5）Ethanolamine -- 8 15 289. 乙二胺（皮）（107-15-3）Ethylenediamine(skin) -- 4 10 290. 乙二醇（107-21-1）Ethylene glycol -- 20 40 291. 乙二醇二硝酸酯（皮）（628-96-6）Ethylene glycol dinitrate(skin) -- 0.3 0.9* 292. 乙酐（108-24-7）Acetic anhydride -- 16 32* 293. N-乙基吗啉（皮）（100-74-3）N-Ethylmorpholine(skin) -- 25 50* 294. 乙基戊基甲酮（541-85-5）Ethyl amyl ketone -- 130 195* 295. 乙腈（75-05-8）Acetonitrile -- 10 25* 296. 乙硫醇（75-08-1）Ethyl mercaptan -- 1 2.5* 297. 乙醚（60-29-7）Ethyl ether -- 300 500 298. 乙硼烷（12987-45-7）Diborane -- 0.1 0.3* 299. 乙醛（75-07-0）Acetaldehyde 45 -- -- 300. 乙酸（64-19-7）Acetic acid -- 10 20 301. 乙酸（2-甲氧基乙基酯）（皮）（110-49-6）2-Methoxyethyl acetate(skin) -- 20 40*302. 乙酸丙酯（109-60-4）Propyl acetate -- 200 300 303. 乙酸丁酯（123-86-4）Butyl acetate -- 200 300 304. 乙酸甲酯（79-20-9）Methyl acetate -- 100 200Amyl acetate(all isomers) -- 100 200 305. 乙酸戊酯（全部异构体）（628-63-7）306. 乙酸乙烯酯（108-05-4）Vinyl acetate -- 10 15 307. 乙酸乙酯（141-78-6）Ethyl acetate -- 200 300 308. 乙烯酮（463-51-4）Ketene -- 0.8 2.5 309. 乙酰甲胺磷（皮）（30560-19-1）Acephate(skin) -- 0.3 0.9* 310. 乙酰水杨酸（阿司匹林）Acetylsalicylic acid(aspirin) -- 5 12.5* （50-78-2）311. 2-乙氧基乙醇（皮）（110-80-5）2-Ethoxyethanol(skin) -- 18 362-Ethoxyethyl acetate(skin) -- 30 60* 312. 2-乙氧基乙基乙酸酯（皮）（111-15-9）Yttrium and compounds(as Y) -- 1 2.5* 313. 钇及其化合物（按Y计）（7440-65-5）314. 异丙铵（75-31-0）Isopropylamine -- 12 24 315. 异丙醇（67-63-0）Isopropyl alcohol(IPA) -- 350 700 316. N-异丙基苯胺（皮）（768-52-5）N-Isopropylaniline(skin) -- 10 25* 317. 异稻瘟净（皮）（26087-47-8）Kitazine o-p(skin) -- 2 5 318. 异佛尔酮（78-59-1）Isophorone 30 -- --Isophorone diisocyante(IPDI) -- 0.05 0.1 319. 异佛尔酮二异氰酸酯（4098-71-9）320. 异氰酸甲酯（皮）（624-83-9）M ethyl isocyanate(skin) -- 0.05 0.08 321. 异亚丙基丙酮（141-79-7）Mesityl oxide -- 60 100Indium and compounds,as In -- 0.1 0.3 322. 铟及其化合物（按In计）（7440-74-6）323. 茚（95-13-6）Indene -- 50 100* 324. 正丁胺（皮）（109-73-9）n-butylamine 15 -- -- 325. 正丁基硫醇（109-79-5）n-butyl mercaptan -- 2 5*n-butyl glycidyl ether -- 60 120* 326. 正丁基缩水甘油醚（2426-08-6）327. 正庚烷（142-82-5）n-Heptane -- 500 1000 328. 正己烷（皮）（110-54-3）n-Hexane(skin) -- 100 180 329. 重氮甲烷（334-88-3）Diazomethane -- 0.35 0.7表2工作场所空气中粉尘容许浓度（mg/m3）序号中文名CAS No.英文名TWA *STEL1. 白云石粉尘总尘呼尘Dolomite dust Total dust Respirable dust8 4 10 8 2. 玻璃钢粉尘（总尘）Fiberglass reinforced plastic dust(total)363. 茶尘（总尘）Tea dust(total) 2 34. 沉淀SiO 2(白炭黑）（112926-00-8）（总尘）Precipitated silica dust(total) 5105. 大理石粉尘（1317-65-3）总尘呼尘Marble dust Total dust Respirable dust 8 4 10 8 6. 电焊烟尘（总尘）Welding fume(total)4 6 7. 二氧化钛粉尘（13463-67-7）（总尘）Titanium dioxide dust(total) 8 10 8. 沸石粉尘（总尘）Zeolite dust(total)5 10 9. 酚醛树酯粉尘（总尘）Phenolic aldehyde resin dust(total) 610 10. 谷物粉尘（游离SiO 2含量<10%)(总尘）Grain dust(free SiO2<10%)(total)4811. 硅灰石粉尘（13983-17-0）（总尘）Wollastonite dust(total) 5 1012. 硅藻土粉尘（61790-53-2）游离SiO 2含量<10%（总尘）Diatomite dust free SiO2<10%（total)6 1013. 滑石粉尘（游离SiO 2含量<10%)(14807-96-6) 总尘呼尘Talc dust(free SiO 2<10%)Total dust Respirable dust3 14 2 14. 活性炭粉尘（64365-11-3）（总尘）Active carbon dust(total)5 10 15. 聚丙烯粉尘（总尘）Polypropylene dust(total) 510 16. 聚丙烯腈纤维粉尘（总尘）Polyacryonitrile fiber dust(total) 24 17. 聚氯乙烯粉尘（9002-86-2）（总尘）Polyvinyl chloride(PVC)dust(total)5 1018. 聚乙烯粉尘（9002-88-4）（总尘）Polyethylene dust(total)51019. 铝、氧化铝、铝合金粉尘（7429-90-5）铝、铝合金（总尘）氧化铝（总尘）Dust of aluminium, aluminium oxideand aluminium alloysAluminium,aluminium alloys(total) Aluminium oxide(total)3 44 620. 麻尘（亚麻、黄麻和苎麻）（游离SiO2含量 <10%)(总尘）亚麻黄麻苎麻Flax,jute and remine dusts(free SiO2 <10%)(total)FlaxJuteRamie1.52334621. 煤尘（游离SiO2含量<10%)总尘呼尘Coal dust(free SiO2<10%)Total dustRespirable dust42.563.522. 棉尘（总尘）Cotton dust(total) 1 323. 木粉尘（总尘）Wood dust(total) 3 524. 凝聚SiO2粉尘总尘呼尘Condensed silica dustTotal dustRespirable dust1.50.53125. 膨润士粉尘（1302-78-9）（总尘）Bentonite dust(total) 6 1026. 皮毛粉尘（总尘）Fur dust(total) 8 1027. 人造玻璃质纤维玻璃棉棉粉尘（总尘）矿渣棉粉尘（总尘）岩棉粉法（总尘）Man-made vitrious fiberFibrous glass dust(total)Slag wool dust(total)Rock wool dust(total)33355528. 桑蚕丝尘（总尘）Mulberry silk dust(total) 8 1029. 砂轮磨尘（总尘）Grinding wheel dust(total) 8 1030. 石膏粉尘（10101-41-4）总尘呼尘Gypsum dustTotal dustRespirable dust8410831. 石灰石粉尘（1317-65-3）总尘呼尘Limestone dustTotal dustRespirable dust8410832. 石棉纤维及含有10%以上石棉的粉尘（1332-21-4）总尘纤维Asbestos fibre and dustsContaining>10%asbestosTotal dustAsbestos fibre0.80.8f/ml1.51.5f/ml33. 石墨粉尘（7782-42-5）总尘呼尘Graphite dustTotal dustRespirable dust426334. 水泥粉尘（游离SiO2含量<10%)总尘呼尘Cement dust(free SiO2<10%)Total dustRespirable dust41.56235. 炭黑粉尘（1333-86-4）（总尘）Carbon black dust(total) 4 836. 碳化硅粉尘（409-21-2）总尘呼尘Silicon carbide dustTotal dustRespirable dust8410837. 碳纤维粉尘（总尘）Carbon fiber dust(total) 3 638. 矽尘（14808-60-7）总尘含10%～50%游离SiO2的粉尘含10%～80%游离SiO2粉尘含80%以上游离SiO2粉尘呼尘含10%～50%游离SiO2含50%～80%游离SiO2含80%以上游离SiO2Silica dustTotal dustContaining 10%～50% free SiO2Containing 50%～80% free SiO2Containing >80% free SiO2Respirable dustContaining 10%～50% free SiO2Containing 50%～80% free SiO2Containing >80% free SiO210.70.50.70.30.221.51.01.00.50.339. 稀土粉尘（游离SiO2 含量 <10%)（总尘）Rare-earth dust (freeSiO2<10%)(total) 2.5540. 洗衣粉混合尘Detergent mixed dust 1 241. 烟草尘（总尘）Tobacco dust (total) 2 342. 萤石混合性粉尘（总尘）Fluorspar mixed dust (total) 1 243. 云母粉尘（12001-26-2）总尘呼尘Mica dustTotal dustRespirable dust21.54344. 珍珠岩粉尘（93763-70-3）总尘呼尘Perlite dustTotal dustRespirable dust8410845. 蛭石粉尘（总尘）Vermiculite dust(total) 3 546. 重晶石粉尘（7727-43-7）（总尘）Barite dust (total) 5 1047. ** 其他粉尘Particles not otherwise regulated 8 10。

AYCopyright © 2016Texas Instruments IncorporatedProductFolderSample &BuyTechnicalDocuments Tools &SoftwareSupport &CommunityAn IMPORTANT NOTICE at the end of this data sheet addresses availability,warranty,changes,use in safety-critical applications,intellectual property matters and other important disclaimers.PRODUCTION DATA.SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016SN74LS07Hex Buffers and Drivers With Open-Collector High-Voltage Outputs1Features•Convert TTL Voltage Levels to MOS Levels •High Sink-Current Capability •Input Clamping Diodes Simplify System Design•Open-Collector Driver for Indicator Lamps and Relays2Applications•AV Receivers•Audio Docks:Portable•Blu-ray Players and Home Theaters •MP3Players or Recorders•Personal Digital Assistants (PDA)•Power:Telecom/Server AC/DC Supply:Single Controller:Analog and Digital•Solid-State Drives (SSD):Client and Enterprise •TVs:LCD,Digital,and High-Definition (HDTV)•Tablets:Enterprise •Video Analytics:Server•Wireless Headsets,Keyboards,and Mice3DescriptionThese hex buffers and drivers feature high-voltage open-collector outputs to interface with high-level circuits or for driving high-current loads.They are also characterized for use as buffers for driving TTL inputs.The SN74LS07devices have a rated output voltage of 30V.The maximum sink current is 40mA.These circuits are compatible with most TTL families.Inputs are diode-clamped to minimize transmission-line effects,which simplifies design.Typical power dissipation is 140mW,and average propagation delay time is 12ns.Device Information (1)PART NUMBER PACKAGE (PINS)BODY SIZE (NOM)SN74LS07D SOIC (14)8.65mm ×3.90mm SN74LS07DB SSOP (14) 6.20mm ×5.30mm SN74LS07N PDIP (14)19.30mm ×6.35mm SN74LS07NSSO (14)10.30mm ×5.30mm(1)For all available packages,see the orderable addendum atthe end of the data sheet.Logic Diagram (Positive Logic)2SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments IncorporatedTable of Contents1Features ..................................................................12Applications ...........................................................13Description .............................................................14Revision History .....................................................25Pin Configuration and Functions . (36)Specifications .........................................................46.1Absolute Maximum Ratings......................................46.2ESD Ratings..............................................................46.3Recommended Operating Conditions.......................46.4Thermal Information..................................................46.5Electrical Characteristics...........................................56.6Switching Characteristics..........................................56.7Typical Characteristics..............................................57Parameter Measurement Information ..................68Detailed Description . (7)8.1Overview...................................................................78.2Functional Block Diagram.. (7)8.3Feature Description...................................................78.4Device Functional Modes (7)9Application and Implementation (8)9.1Application Information..............................................89.2Typical Application. (8)10Power Supply Recommendations .......................911Layout . (10)11.1Layout Guidelines.................................................1011.2Layout Example. (10)12Device and Documentation Support (11)12.1Documentation Support........................................1112.2Community Resource............................................1112.3Trademarks...........................................................1112.4Electrostatic Discharge Caution............................1112.5Glossary................................................................1113Mechanical,Packaging,and OrderableInformation (11)4Revision HistoryNOTE:Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision C (February 2004)to Revision D Page•Added Device Information table,ESD Ratings table,Feature Description section,Device Functional Modes ,Application and Implementation section,Power Supply Recommendations section,Layout section,Device andDocumentation Support section,and Mechanical,Packaging,and Orderable Information section .....................................1•Deleted SN54LS07and SN74LS17from the data sheet because they are obsolete and no longer supplied......................1•Deleted Ordering Information table (1)1A VCC1Y 6A 2A 6Y 2Y 5A 3A 5Y 3Y 4A GND4Y3SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated 5Pin Configuration and FunctionsD,DB,N,or NS Packages 14-Pin SOIC,SSOP,PDIP,SOTop ViewPin FunctionsPINI/O DESCRIPTION 11A I Input 121Y O Output 132A I Input 242Y O Output 253A I Input 363Y O Output 37GND —Ground pin 84Y O Output 494A I Input 4105Y O Output 5115A I Input 5126Y O Output 6136A I Input 614V CC—Power pin4SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions .Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to GND.(3)This is the maximum voltage that should be applied to any output when it is in the off state.6Specifications6.1Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)MINMAX UNIT V CC Supply voltage 7V V I Input voltage (2)7V V O Output voltage (2)(3)30V T J Operating virtual junction temperature 150°C T stg Storage temperature–65150°C(1)JEDEC document JEP155states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.2ESD RatingsVALUEUNIT V (ESD)Electrostatic dischargeHuman-body model (HBM),per ANSI/ESDA/JEDEC JS-001(1)±2000VCharged-device model (CDM),per JEDEC specification JESD22-C101(2)±1000(1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.See the TI application report,Implications of Slow or Floating CMOS Inputs ,SCBA004.6.3Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)(1)MINNOMMAX UNIT V CC Supply voltage 4.7555.25V V IH High-level input voltage 2V V IL Low-level input voltage 0.8V V OH High-level output voltage 30V I OL Low-level output current 40mA T A Operating free-air temperature070°C(1)For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics application report,SPRA953.6.4Thermal InformationTHERMAL METRIC (1)SN74LS07UNITD (SOIC)DB (SSOP)N (PDIP)NS (SO)14PINS14PINS 14PINS 14PINS R θJA Junction-to-ambient thermal resistance 85.297.450.282.8°C/W R θJC(top)Junction-to-case (top)thermal resistance 43.549.837.540.9°C/W R θJB Junction-to-board thermal resistance 39.744.53041.4°C/W ψJT Junction-to-top characterization parameter 10.916.522.312.4°C/W ψJB Junction-to-board characterization parameter39.44429.941.1°C/W12345678910010203040506070t P L H (n s )Temperature (ƒC)C0035SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated (1)For conditions shown as MIN or MAX,use the appropriate value specified under recommended operating conditions.(2)I OL =40mA6.5Electrical Characteristicsover recommended operating free-air temperature range (unless otherwise noted)PARAMETER TEST CONDITIONS (1)MINTYPMAX UNIT V IK V CC =MIN,I I =–12mA–1.5V I OH V CC =MIN,V IH =2V V OH =30V 0.25mA V OL V CC =MIN,V IL =0.8V I OL =16mA 0.4V I OL =MAX (2)0.7I I V CC =MAX,V I =7V 1mA I IH V CC =MAX,V I =2.4V 20µA I IL V CC =MAX,V I =0.4V –0.2mA I CCH V CC =MAX 14mA I CCL V CC =MAX45mA6.6Switching CharacteristicsV CC =5V,T A =25°C (see Figure 2)PARAMETER FROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH AYR L =110Ω,C L =15pF610nst PHL19306.7Typical CharacteristicsFigure 1.t PLH vs.Temperaturett LOAD CIRCUITFOR 3-STATE OUTPUTSHigh-LevelPulseLow-LevelPulseVOLTAGE WAVEFORMSPULSE DURATIONSInputOut-of-PhaseOutput (see Note D)3 V0 VV OLV OH V OH V OL In-Phase Output (see Note D)VOLTAGE WAVEFORMS PROPAGATION DELAY TIMESV Test PointFrom Output Under TestC (see Note LOAD CIRCUITFOR OPEN-COLLECTOR OUTPUTSLOAD CIRCUITFOR 2-STATE TOTEM-POLE OUTPUTS (see Note B)V LFrom Output Under TestTest (see Note B)V CCFrom Output Under Test (see Note S1S23 V3 V0 V 0 VVOLTAGE WAVEFORMS SETUP AND HOLD TIMESTiming InputData Input3 V0 VOutput Control (low-level enabling)Waveform 1(see Notes Cand D)Waveform 2(see Notes Cand D)≈1.5 V V OH −0.5 V V OL + 0.5 V≈1.5 V VOLTAGE WAVEFORMSENABLE AND DISABLE TIMES,3-STATE OUTPUTS6SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated7Parameter Measurement InformationA.C L includes probe and jig capacitance.B.All diodes are 1N3064or equivalent.C.Waveform 1is for an output with internal conditions such that the output is low,except when disabled by the output control.Waveform 2is for an output with internal conditions such that the output is high,except when disabled by the output control.D.S1and S2are closed for t PLH ,t PHL ,t PHZ ,and t PLZ ;S1is open and S2is closed for t PZH ;S1is closed and S2is open for t PZL .E.Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.F.All input pulses are supplied by generators having the following characteristics:PRR ≤1MHz,Z O ≈50Ω,t r ≤1.5ns,t f ≤2.6ns.G.The outputs are measured one at a time,with one input transition per measurement.Figure 2.Load Circuits and Voltage WaveformsAYCopyright © 2016Texas Instruments IncorporatedInputV CCOutputGNDCopyright © 2016,Texas Instruments Incorporated7SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated 8Detailed Description8.1OverviewThe outputs of the SN74LS07device are open-collector and can be connected to other open-collector outputs to implement active-low wired-OR or active-high wired-AND functions.The maximum sink current for the SN74LS07is 40mA.Inputs can be driven from 2.5-V,3.3-V (LVTTL),or 5-V (CMOS)devices.This feature allows the use of this device as translators in a mixed-system environment.Resistor values shown are nominal.Figure 3.Schematic (Gate)8.2Functional Block Diagram8.3Feature Description•Allows for up translation–Inputs accept voltages to 5.25V –Outputs accept voltages to 30V •High Sink-Current Capability –Up to 40mA8.4Device Functional ModesTable 1lists the functions of this device.Table 1.Function TableINPUT AOUTPUT YH Hi-Z LLCopyright © 2016, Texas Instruments Incorporated8SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated9Application and ImplementationNOTEInformation in the following applications sections is not part of the TI component specification,and TI does not warrant its accuracy or completeness.TI’s customers are responsible for determining suitability of components for their purposes.Customers should validate and test their design implementation to confirm system functionality.9.1Application InformationThe SN74LS07device is a high-drive,open-drain CMOS device that can be used for a multitude of buffer-type functions.It can produce 40mA of drive current at 5V.Therefore,this device is ideal for driving multiple inputs.The inputs are 5.25-V tolerant and outputs are 30-V tolerant.9.2Typical ApplicationMultiple channels of the SN74LS07device can be used to create a positive AND logic function,as shown in Figure 4.Additionally,the SN74LS07device can be used to drive an LED by sinking up to 40mA,which may be more than the previous stage can sink.Figure 4.Typical Application Diagram9.2.1Design RequirementsEnsure that the inputs are in a known state as defined by V IH and V IL noted in Recommended Operating Conditions ,or else the outputs may be in an unknown state.9.2.2Detailed Design Procedure 1.Recommended Input Conditions–For specified high and low level,see V IH and V IL in Recommended Operating Conditions .–Inputs are overvoltage tolerant allowing them to go as high as 5.25V.2.Recommend Output Conditions–Load currents must not exceed 40mA per output.–Outputs must not be pulled above 30V.1313.213.413.613.81414.214.414.614.815010203040506070t P H L (n s )Temperature (ƒC)C0049SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated Typical Application (continued)9.2.3Application CurveFigure 5.t PHL vs Temperature10Power Supply RecommendationsThe power supply can be any voltage between the minimum and maximum supply voltage rating indicated in Recommended Operating Conditions .Each V CC pin must have a good bypass capacitor to prevent power disturbance.For devices with a single supply,TI recommends a 0.1-µF capacitor;if there are multiple V CC pins,then TI recommends either a 0.01-µF or 0.022-µF capacitor for each power pin.It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise.A 0.1-µF and a 1-µF capacitor are commonly used in parallel.The bypass capacitor must be installed as close to the power pin as possible for best results.V ccInputOutputInputOutput10SN74LS07SDLS021D–MAY1990–REVISED Product Folder Links:SN74LS07Submit Documentation Feedback Copyright©1990–2016,Texas Instruments Incorporated 11Layout11.1Layout GuidelinesWhen using multiple bit logic devices,inputs must never float.In many cases,functions or parts of functions of digital logic devices are unused,for example,when only two inputs of a triple-input AND gate are used or only3of the4buffer gates are used.Such input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states.Figure6specifies the rules that must be observed under all circumstances.All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating.The logic level that must be applied to any particular unused input depends on the function of the device.Generally they are tied to GND or V CC,whichever makes more sense or is more convenient.It is generally acceptable to float outputs,unless the part is a transceiver.11.2Layout Exampleyout DiagramSN74LS07 SDLS021D–MAY1990–REVISED APRIL201612Device and Documentation Support12.1Documentation Support12.1.1Related DocumentationFor related documentation see the followign:Implications of Slow or Floating CMOS Inputs,SCBA00412.2Community ResourceThe following links connect to TI community resources.Linked contents are provided"AS IS"by the respective contributors.They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™Online Community TI's Engineer-to-Engineer(E2E)Community.Created to foster collaboration among engineers.At ,you can ask questions,share knowledge,explore ideas and helpsolve problems with fellow engineers.Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.12.3TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.12.4Electrostatic Discharge CautionThese devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.12.5GlossarySLYZ022—TI Glossary.This glossary lists and explains terms,acronyms,and definitions.13Mechanical,Packaging,and Orderable InformationThe following pages include mechanical,packaging,and orderable information.This information is the most current data available for the designated devices.This data is subject to change without notice and revision of this document.For browser-based versions of this data sheet,refer to the left-hand navigation.PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.Addendum-Page 1(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS07DR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)SN74LS07DR SOIC D142500367.0367.038.0MECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001DB (R-PDSO-G**)PLASTIC SMALL-OUTLINE4040065/E 12/0128 PINS SHOWNGage Plane8,207,400,550,950,253812,9012,302810,50248,50Seating Plane9,907,903010,509,900,385,605,00150,2214A 28120166,506,50140,05 MIN 5,905,90DIMA MAX A MIN PINS **2,00 MAX 6,907,500,65M 0,150°–ā8°0,100,090,25NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion not to exceed 0,15.D.Falls within JEDEC MO-150IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA(INCLUDING DATASHEETS),DESIGN RESOURCES(INCLUDING REFERENCE DESIGNS),APPLICATION OR OTHER DESIGN ADVICE,WEB TOOLS,SAFETY INFORMATION,AND OTHER RESOURCES“AS IS”AND WITH ALL FAULTS,AND DISCLAIMS ALL WARRANTIES,EXPRESS AND IMPLIED,INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products.You are solely responsible for(1)selecting the appropriate TI products for your application,(2)designing,validating and testing your application,and(3)ensuring your application meets applicable standards,and any other safety,security,or other requirements.These resources are subject to change without notice.TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource.Other reproduction and display of these resources is prohibited.No license is granted to any other TI intellectual property right or to any third party intellectual property right.TI disclaims responsibility for,and you will fully indemnify TI and its representatives against,any claims, damages,costs,losses,and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale(/legal/termsofsale.html)or other applicable terms available either on or provided in conjunction with such TI products.TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2019,Texas Instruments Incorporated。

功能框图10537-001REFERENCEAD964514VINA+AVDDDRVDD1414VINB+VINB–D0A+14D0B+VINA–VCM D1A+D1B+AGNDD0A–D1A–D0B–D1B–DCO+DCO–FCO+FCO–14-BIT PIPELINEADC14-BIT PIPELINEADCP L L , S E R I A L I Z E R A N D D D R L V D S D R I V E R SSERIAL PORT INTERFACE 1 TO 8CLOCK DIVIDERSCLK/DFS SDIO/PDWNCSB CLK+CLK–图1.双通道、14位、80 MSPS/125 MSPS串行LVDS 1.8 V 模数转换器AD9645特性1.8 V 电源供电低功耗：每通道122 mW(125 MSPS)，功率选项可调整 SNR = 74 dBFS(至Nyquist 频率) SFDR = 91 dBc (70 MHz)DNL = ±0.65 LSB(典型值)；INL = ±1.5 LSB(典型值)串行LVDS(ANSI-644，默认)、低功耗，缩小范围选项(类似于 IEEE 1596.3)650 MHz 全功率模拟带宽 2 V p-p 输入电压范围 串行端口控制全芯片及单一通道省电模式 灵活的位定向内置生成及用户自定义数字测试码 时钟分频器可编程输出时钟与数据对准 可编程输出分辨率 待机模式应用通信分集无线电系统 多模式数字接收器GSM 、EDGE 、W-CDMA 、LTE 、CDMA2000、WiMAX 、 TD-SCDMA I/Q 解调系统 智能天线系统 宽带数据应用 电池供电仪表 手持式示波器便携式医疗成像和超声设备 雷达/LIDAR概述AD9645是一款双通道、14位、80 MSPS/125 MSPS 模数转换器(ADC)，内置片内采样保持电路，专门针对低成本、低功耗、小尺寸和易用性而设计。

Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)5962-88698012A ACTIVE LCCC FK 201TBD Call TI Call TI 5962-8869801EA ACTIVE CDIP J 161TBD Call TI Call TI 5962-8869801FA ACTIVE CFP W 161TBD Call TI Call TISN54ALS193AJ ACTIVE CDIP J 161TBDA42N / A for Pkg TypeSN74ALS193AD ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS193ADE4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS193ADG4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS193ADR ACTIVE SOIC D 16Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS193ADRE4ACTIVE SOIC D 16Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS193ADRG4ACTIVE SOIC D 16Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS193AN ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74ALS193ANE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74ALS193ANSR ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS193ANSRE4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS193ANSRG4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54ALS193AFK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54ALS193AJ ACTIVE CDIP J 161TBD A42N / A for Pkg Type SNJ54ALS193AWACTIVECFPW161TBDA42N / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.芯天下--/(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54ALS193A, SN74ALS193A :•Catalog: SN74ALS193A•Military: SN54ALS193ANOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 2芯天下--/TAPE AND REELINFORMATION*All dimensionsare nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74ALS193ADR SOIC D 160330.016.4 6.510.3 2.18.016.0Q1SN74ALS193ANSRSONS162000330.016.48.210.52.512.016.0Q1PACKAGE MATERIALS INFORMATION16-Aug-2012Pack Materials-Page 1芯天下--/*Alldimensions are nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)SN74ALS193ADR SOIC D 160333.2345.928.6SN74ALS193ANSRSONS162000367.0367.038.0PACKAGE MATERIALS INFORMATION16-Aug-2012Pack Materials-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. 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