MURS120T3G 系列规格书推荐

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MX30控制服务器诺瓦COEX控制器嵌入式软件V1.0（内嵌在MX30中）规格书更新记录简介MX30是西安诺瓦星云科技股份有限公司（以下简称“诺瓦星云”）全新控制系统COEX系列下的一款二合一控制服务器，集视频处理和控制功能于一体，具有丰富的视频输入接口（HDMI 2.0、HDMI 1.4、DP 1.1、3G-SDI），10路输出网口和2路10G光纤接口，支持全新的视觉管理平台VMP，为用户提供更好的操控体验。

认证CE、FCC、IC、UKCA、PSE。

若该产品无所销往国家或地区的相关认证，请第一时间联系诺瓦星云确认或处理，否则，如造成相关法律风险，客户需自行承担或诺瓦星云有权进行追偿。

特性输入输出●多种视频输入接口−1×HDMI 2.0（带环路输出）−1×HDMI 1.4（带环路输出）−1×DP 1.1−2×3G-SDI（带环路输出）●10bit/8bit视频源输入●3种输出接口−10×千兆网口，最大带载650万像素−2×10G光口−1×SPDIF数字音频接口●3种控制接口−1×Genlock同步信号输入（带环路输出）−2×Ethernet以太控制网口−1×AUX辅助接口高级特性●3个独立图层支持最多添加3个图层，并按照Z序优先级调整。

●画面缩放支持4种画面缩放模式，包括自定义、点对点、幕布平铺和铺满屏幕。

●颜色校准支持对黑白和RGB三基色衍生的12路标准颜色进行色相、饱和度和明度的精准调节。

●HDR−支持HDR10，符合SMPTE ST 2084 / SMPTE ST 2086标准。

−支持HLG。

●全灰阶校正配合诺瓦星云高精度校正系统和C3200科学级相机，为每一级灰阶生成其专属的校正系数，保障每一级灰阶的均匀性，显著提升显示屏画质。

●延迟−支持低延迟，并可实现低延迟不减带载。

独立主控模式下，控制器端0帧延迟（小于1ms），视频控制器模式下，控制器端1帧延迟。

产品选型指南2018.10 CM-181022-SD V13.0宇视行业宇视科技V13.0版本号 V13.0宇视科技（Uniview）为全球公共安全和智能交通的解决方案提供商，以可视、智慧、物联产品技术为核心的引领者。

我们自2011年12月独立运营以来，沿承深厚的IT技术积累、坚持全面的开放合作，以不断创新、不断超越为路径，2017年进入全球市场前6位（IHS 2018），快速行进在通往全球视频监控领域领导者的路上。

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目前我们在中国30个省/市设立了办事机构，全球合作伙伴覆盖145个国家和地区，为客户提供近距离高品质的服务，为合作伙伴提供高效优质的支持。

客户导向、简单公正、合作创新、持续改进，我们持续践行十六字的企业文化、宇视工业党之魂。

我们探索和实践『视无界，智以恒』的品牌理念，对世界精准洞察现实、把握趋势，为客户提供智慧的辅助判断，步步为营达到事业新高度。

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智联物联-ZR1000系列3G4G两口路由器-规格书简介ZR1000系列3G/4G无线路由器是一种物联网无线通信路由器，支持国际通用标准的FDD-LTE、TDD-LTE、WCDMA(HSPA+)、CDMA2000(EVDO)、TD-Scdma3G/4G移动宽带网络制式，为用户提供方便快速的高速网络传输功能。

该系列产品采用高性能的32位专业网络通信处理器，以嵌入式实时操作系统为软件支撑平台，为用户提供安全，高速，稳定可靠的3G/4G无线路由网络，并支持2个以太网RJ45接口和通信串口。

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工业级设计采用高性能工业级无线模块采用高性能工业级32位MIPS处理器低功耗，发热量低，速度快，稳定性高支持挂耳安装采用板金冷轧钢外壳供电电源：7.5V~32V DC支持标准工业级推杆式SIM/USIM卡设计稳定可靠采用软硬件看门狗及多级链路检测机制，具备故障自动检测、自动恢复能力，保证设备稳定可靠运行多重设备自检机制，确保链路畅通和告警?各接口ESD防护，防止静电冲击具备4G网络信号指示灯，分三级显示现场信号强度网络特性链路实时监控支持VPDN专网卡、APN物联网卡、众多运营商普通手机流量卡支持串口DTU功能，Modbus协议。

支持QOS，支持UPnP支持UDP数据广播中继支持端口转发平台远程管理设备在线监控远程流量监控远程参数配置远程重启和日志查询远程设备升级功能特性支持4G LTE网络，向下兼容3G和2G支持有线和4G负载均衡或备份，自动切换?支持1X WAN，1X LAN或2X LAN，可自由配置切换支持WiFi，支持IEEE802.11b/g/n提供标准RS-232/485串口，支持串口DTU（数据传输终端）功能支持硬件WDT，提供防掉线机制，确保数据终端永远在线支持多种VPN协议（GRE、PPTP、L2TP、IPSec、openVPN、N2N）协议?支持DHCP、DDNS、防火墙、NAT、以及DMZ 主机等功能支持ICMP、TCP、UDP、Telnet、SSH、FTP、HTTP、HTTPS 等网络协议支持SNMP管理协议支持定时重启扩展功能支持扩展高精度独立GPS定位功能【可选】?支持国外频段【可选】支持Wi-Fi强制广告推送功能【可选】支持专网版1.4G频段，1.8G频段【可选】ZR1000系列3G/4G无线路由器产品规格书产品特点ZR1000系列接口图背面板前面板供电?标准电源：DC 12V/1A 外形特性?外壳：板金冷轧钢外壳?外形尺寸：100×95×25mm重量：约260g 其他参数CPU ：650MHz ?Flash/RAM ：16MB/128MB ?工作温度：-30~+70℃?存储温度：-40~+85℃相对湿度：<95%无凝结4G 无线参数无线模块：工业级无线模块标准及频段：FDD-LTE （Band1/3/5丨B1/3/5/7/8/20丨B2/4/5/12/13/17/25/26）TDD-LTE （Band38、Band39、Band40、Band41）HSPA （850/900/1900/2100MHz ）/GSM850/900/1800/1900MHz EV-DO （800MHz ）、TD-Scdma （Band34、Band39）理论带宽：FDD/TDD LTE:上行50Mbps/下行100Mbps |HSPA+:上行5.76Mbps/下行21Mbps |EVDO ：上行1.8Mbps/下行3.1Mbps 功耗：2.3W 接收灵敏度：-108dBmWiFi 无线参数标准及频段带宽：支持IEEE802.11b/g/n 标准，支持150M 或300M （可选）安全加密：支持WEP 、WPA 、WPA2等多种加密方式发射功率：16-17dBm （11g ），18-20dBm （11b ）15dBm (11n )接收灵敏度：<-72dBm@54Mpbs接口类型LAN ：1个LAN 口，自适应MDI/MDIX ，内置电磁隔离保护WAN ：1个WAN 口（可修改为LAN 口），自适应MDI/MDIX ，内置电磁隔离保护工业接口：1个通信RS485/RS232接口，适用于本身带有RS485/232接口的采集设备指示灯：具有1X “PWR ”、1X “WAN ”、1X “LAN ”、1X “NET ”指示灯其中“NET ”灯为三级闪烁灯，闪烁频率对应信号值强弱天线接口：1个标准SMA 天线接口（3G/4G ），1个标准SMA 的WiFi 天线接口，1个标准SMA 的Aux/GPS/WiFi 预留天线接口，特性阻抗50欧SIM/USIM 接口：标准工业级抽屉式SIM/USIM 卡接口，1.8V/3V 自动检测电源接口：7.5V~32V ，内置电源瞬间过压保护Reset 复位按钮：通过按此键10秒可将设备的参数配置恢复为出厂值产品规格组网示意图附：接口接线说明产品选型列表注：●支持-不支持○可选ZR1000WCDMA 标准版EV-DO 标准版4GLTE-5标准版4GLTE-7标准版客户定制版WAN/LAN ●●●●○LAN ●●●●○HSPA+●-●●○EV-DO -●-●○TD-Scdma --●●○FDD-LTE --●●○TDD-LTE --●●○WiFi-802.11N ●●●●○RS232●●●●○RS485○○○○○参考型号：ZR1621SZR1921S ZR1521S ZR1721S。

mura160t3g结构-回复中括号内的内容为"mura160t3g结构"，这是一个电子元器件型号。

MURA160T3G是一款二极管碳化硅超快恢复二极管。

本文将以这个元器件的结构为主题，逐步解释其构造和工作原理。

一、电子元器件简介MURA160T3G是一款高速恢复二极管，用于高频电路和开关电源中。

它具有较低的反向恢复时间和较高的工作频率，能够快速、稳定地传输高频信号。

下面将详细介绍MURA160T3G的结构。

二、MURA160T3G的结构MURA160T3G结构主要由以下组成部分构成：1. 碳化硅芯片：MURA160T3G使用碳化硅作为主要材料，这种材料具有高温稳定性和高电压抗击穿能力，能够在高温、高压环境下保持良好的电特性。

2. 异质结：该二极管的结构采用异质结，即在芯片的两侧形成不同的材料结构，使得电子流动时能够形成电势差，实现二极管的整流功能。

3. 金属接线：芯片的上下两侧通过金属接线与外部电路连接，以提供外部电源和信号的输入与输出。

三、MURA160T3G的工作原理MURA160T3G的工作原理是利用碳化硅材料的特性以及异质结的形成来实现电流的整流和控制。

其工作过程如下：1. 正向偏置：当外部电源的正极连接到MURA160T3G的阳极（anode），负极连接到阴极（cathode）时，形成了正向偏置电压。

2. 电子流动：此时，电流开始从阳极流向阴极，过程中碳化硅芯片的特性使得电子能够高速流动，并且在异质结处发生整流效应。

3. 反向阻止：当外部电源的极性发生变化，即正极连接到阴极，负极连接到阳极时，二极管的异质结将会形成较高的电阻，阻止电流继续流动，实现反向阻断的功能。

4. 高速恢复：MURA160T3G作为超快速恢复二极管，具有较低的反向恢复时间。

这意味着当电源极性发生变化，二极管能够快速从反向导通状态恢复到正向导通状态，提供更快速的信号传输能力。

四、应用领域MURA160T3G广泛应用于高频电路和开关电源，特别是在需要快速信号传输和高频开关的应用中。

Entry-level Arm-based 64-bit ComputersDual-core, 2-GB RAMCompact Dual-core, 2-GB RAM Built-in LTEValue-added Arm-based 64-bit ComputersQuad-core, 4-GB RAMQuad-core, 4-GB RAM5G/CAN/serial IsolationBuilt-in LTEMoxa Industrial LinuxMoxa's Debian-based industrial-grade stable Linux distribution for long-term projectsFeatures and Benefits5Debian-based distribution that can use all standard Debian packages5Developed as per IEC 62443-4-1 and compliant with IEC 62443-4-2 industrialcybersecurity standards (Moxa Industrial Linux 3 Secure)5Long-term support until 2027 for Moxa Industrial Linux 1 and 2031 for MoxaIndustrial Linux 35Wireless connection management utility with automatic network keep alive andfailover5Ready-to-use APIs and library to ease access to hardware and I/O interfaces5Crash-free robust file system5Over-the air (OTA) software updatesWireless-ready Arm-based 32-bit Computers Built-in cellular or Wi-Fi module, RF type approvals, and carrier approvalsBuilt-in LTE Cat.1Built-in LTECat.1 and Wi-FiBuilt-in LTECat.1 and Wi-FiBuilt-in LTECat.4 with Wi-Fi expansion1. Wireless module is built-in. Refer to the Wireless Connection and Expansion Modules section for details.2. Wireless module must be purchased separately. Refer to the Wireless Connection and Expansion Modules section for details.1 mPCIe for cellular/Wi-Fi1 mPCIe forcellular/Wi-Fi1 mPCIe forcellular/Wi-Fi1 mPCIe forcellular/Wi-Fi1 mPCIe for cellular 1mPCIe for Wi-Fi1 mPCIe forcellular/Wi-FiArm-based 32-bit Computers With Wireless Options Flexibility to add cellular or Wi-Fi capability when needed1. Wireless module must be purchased separately. Refer to the Wireless Connection and Expansion Modules section for details.1 LAN,1 serial2 LAN 2 LAN,2 serial2 LAN,2 serial2 LAN,4 serial2 LAN,4 serial2 LAN,1 serial2 LAN,2 serial3 LAN,8 serialStandard Arm-based 32-bit Computers Low power consumption and small form factorWireless Connectivity and Expansion Modules* Details of cellular and Wi-Fi support with a list of wireless accessory models* Antennas must be purchased separatelyLast updated: Aug. 15, 2023. All specifications are subject to change without notice.。

MC-1200Seriesx86fanless,wide-temperature industrial computerFeatures and Benefits•3Mini-PCIe sockets for Wi-Fi,3G,LTE,GPS,and mSATA expansion modules•7th Gen Intel®Core™processor(Kaby Lake U)•2built-in DDR4memory slots;total capacity up to32GB•ATEX and IECEx Zone2compliance•Built-in TPM2.0module•Variety of interfaces:2serial ports,2Giga LANs,3USB3.0(type A)portsCertificationsIntroductionThe MC-1200Series computers are built around a7th Gen Intel®Celeron®or Intel®Core™i3,i5,or i7processor and come with1HDMI display port,3USB3.0ports,2gigabit LAN ports,and23-in-1RS-232/422/485serial ports.The MC-1200is equipped with a2.5”HDD/SSD slot and a built-in TPM2.0module.Additional value and convenience is provided through a modular design with three independent slots for flexible system integration and expansion. Users have the option to add a variety of different communications modules,including Wi-Fi,3G,LTE,GPS,and mSATA expansion modules.With UL Class1Division2,ATEX and IECEx Zone2compliance,the MC-1200is sure to deliver stable and reliable system operation for oil and gas applications.Class1Division2(C1D2)is a certification issued to products that allow them to be used in potentially hazardous environments. Examples of hazardous work settings include locations where flammable or explosive gasses,certain chemicals,airborne fibers,or vapors could be excessive under abnormal circumstances.Class1Division2(C1D2)certification indicates that a device is deemed safe to operate in specific hazardous environments under abnormal circumstances.This means that in a worst case scenario,the MC-1200computer will not ignite the substances around it causing a fire,explosion, or other catastrophe.The MC-1200is designed to operate reliably in extreme conditions,such as continuous exposure to low or high temperatures,humidity,high vibration,and power surges,making them perfect for heavy industry,solar grid,water/wastewater,oil and gas,and transportation applications. Proactive Monitoring FunctionMoxa Proactive Monitoring is a small-footprint,resource-friendly,easy-to-use utility that allows users to track a number of system parameters. Users can view the current parameter values for these key parts by simply clicking on the icons corresponding to the parameters in the user er-defined key part indicators(KPIs)are used to monitor the computer’s key parts.Visible and/or audio alerts are triggered automatically via relay and SNMP traps when these KPIs exceed their preset threshold values,making it extremely convenient for operators to avoid system downtime by setting up predictive maintenance tasks well in advance.AppearanceSpecificationsComputerCPU MC-1220-KL7-T-S:Intel®Core™i7-7600U Processor(4M Cache,up to3.90GHz)MC-1220-KL5-T-S:Intel®Core™i5-7300U Processor(3M Cache,up to3.50GHz)MC-1220-KL1-T-S:Intel®Celeron®Processor3965U(2M Cache,2.20GHz)MC-1220-KL5-T:Intel®Core™i5-7300U Processor(3M Cache,up to3.50GHz) Storage Slot mSATA slots x1,SATA3.0,internal mini-PCIe socketSystem Memory Slot SODIMM DDR4slot x2,up to32GB max.Supported OS Linux Debian9,64-bit,kernel4.9(optional via CTOS)Windows10Enterprise LTSC180964-bit(optional via CTOS)Graphics Controller MC-1220-KL7-T-S:Intel®HD Graphics620MC-1220-KL5-T-S:Intel®HD Graphics620MC-1220-KL1-T-S:Intel®HD Graphics610MC-1220-KL5-T:Intel®HD Graphics620Computer InterfaceVideo Input HDMI x1,up to3840x2160resolution at30HzUSB3.0USB3.0hosts x3,type-A connectorsButtons Reset buttonSerial InterfaceConnector DB9maleSerial Standards RS-232/422/485(software selectable)Serial Ports2x RS-232/422/485Flow Control RTS/CTS,XON/XOFFBaudrate50bps to115.2kbpsESD Protection4kV contact,8kV airEthernet InterfaceMagnetic Isolation Protection 1.5kV(built-in)10/100/1000BaseT(X)Ports(RJ45connector)2LED IndicatorsSystem Power x1Serial2per port(Tx,Rx)Serial SignalsRS-232TxD,RxD,RTS,CTS,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDPhysical CharacteristicsInstallation Wall mounting(with optional kit),DIN-rail mounting Housing MetalDimensions134x60.4x120mm(5.28x2.38x4.72in)Weight Product only:1.40kg(0.63lb)DeclarationGreen Product RoHS,CRoHS,WEEEPower ParametersPower Button ON/OFF(rear panel)Reset buttonInput Voltage9to36VDCEnvironmental LimitsStorage Temperature-40to75°C(-40to185°F)Operating Temperature-40to70°C(-40to158°F)Ambient Relative Humidity5to95%(non-condensing)Shock IEC60068-2-27Standards and CertificationsSafety UL60950-1,UL62368-1,EN60950-1,EN62368-1EMC EN55032/35,CISPR32,FCC Part15B Class A ReliabilityAlert Tools Built-in RTC(real-time clock)with lithium battery backup WarrantyWarranty Period3yearsDetails See /warrantyPackage ContentsDevice1x MC-1200Series computer Installation Kit1x DIN-rail kit Documentation 1x quick installation guide1x warranty card DimensionsOrdering InformationModel Name CPU Memory TPM 2.0Optional OS Storage(mSATA)LAN/Serial Ports SSD/HDD Slots USB 3.0Ports Interface Expansion Operating Temp MC-1220-KL7-T-S Intel®Core™i7-7600U8GB ✓16GB 2/2133x mPCIe -40to 70°C MC-1220-KL5-T-S Intel®Core™i5-7300U8GB ✓16GB 2/2133x mPCIe -40to 70°C MC-1220-KL1-T-S Intel®Celeron®3965U8GB ✓16GB 2/2133x mPCIe -40to 70°C MC-1220-KL5-T Intel®Core™i5-7300U 8GB –16GB 2/2133x mPCIe -40to 70°C©Moxa Inc.All rights reserved.Updated Jun 29,2020.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

Electromagnetic BuzzersPin terminalWithout oscillator circuitSD seriesIssue date:February 2013•All specifications are subject to change without notice.•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specificElectromagnetic Buzzers Pin Terminal SD SeriesSD1209T3-A1, SD1209T5-A1, SD1209TT-A1(Applicable to automobile) / ø12mm TYPE FEATURES •These high reliability electromagnetic buzzers are applicable to automobile equipment.•Compact, pin terminal type electromagnetic buzzer with 2048Hz output.•Pin type terminal construction enables direct mounting onto printed circuit boards.APPLICATIONSClocks, travel watches, keyboards, toys, various alarms of automo-bile equipment.SHAPES AND DIMENSIONS FREQUENCY CHARACTERISTICS Around 2000HzSD160701, SD160709 / ø16mm TYPE FEATURES•These are thin-type electromagnetic buzzers with a height of only 7mm. They provide output over a relatively wide band, making them suitable for music.•Pin type terminal construction enables direct mounting onto printed circuit boards.APPLICATIONST ravel watches, keyboards, handy-type equipment, toys.FREQUENCY CHARACTERISTICS Around 4000HzSHAPES AND DIMENSIONSSPECIFICATIONS•Please ask us for details which is designed another operating rated frequency.Conformity to RoHS DirectiveSPECIFICATIONS•Please ask us for details which is designed another operating rated frequency.Part No.SD1209T3-A1SD1209T5-A1SD1209TT -A1Rated voltage Eo-p(V)3512Operating voltage Eo-p(V) 1 to 4 3 to 6 6 to 15Drive conditions:Rated voltage, square wave form [duty 50%]Frequency(Hz)204820482048Sound pressure(dB(A)/10cm)min.808085Current Io-p(mA)max.10060100DC resistance(Ω)typ.3090120Terminal construction Pin terminal Pin terminal Pin terminalOperating temperature range –40 to +85°C Storage temperature range –40 to +85°CPart No.SD160701SD160709Rated voltage Eo-p(V)35Operating voltage Eo-p(V) 1 to 5 3 to 9Drive conditions:Rated voltage, square wave form [duty 50%]Drive frequency(Hz)40964096Sound pressure(dB(A)/10cm)min.8080Current Io-p(mA)max.6070DC resistance(Ω)typ.5070T erminal construction Pin terminal Pin terminal Operating temperature range –10 to +70°C Storage temperature range–20 to +80°C•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specificSD1614T5-B1, SD1614TT-B1 / ø16mm TYPE FEATURES•These low-cost electromagnetic buzzers are suited to a wide range of applications.•Pin type terminal construction enables direct mounting onto printed circuit boards.APPLICATIONSOffice equipment, electronic games, toys, home appliances, key-boards.FREQUENCY CHARACTERISTICS Around 2000HzSHAPES AND DIMENSIONSSPECIFICATIONS•Please ask us for details which is designed another operating rated frequency.•Products with 5mm terminal pitch are also available. Please substitute -B1 at the end of part number to -A1 in this case.SD1614TT-B3M(Applicable to automobile) / ø16mm TYPE FEATURES•These high reliability electromagnetic buzzers are applicable to automobile equipment.•Pin type terminal construction enables direct mounting onto printed circuit boards.APPLICATIONSVarious alarms of automobile equipment.FREQUENCY CHARACTERISTICS Around 2000HzSHAPES AND DIMENSIONSSPECIFICATIONS•Please ask us for details which is designed another operating rated frequency.•Products with 5mm terminal pitch are also available. Part No.: SD1614TT -A5MPart No.SD1614T5-B1SD1614TT -B1Rated voltage Eo-p(V)512Operating voltage Eo-p(V) 3 to 6 6 to 15Drive conditions: Rated voltage, square wave form [duty 50%]Drive frequency(Hz)20482048Sound pressure(dB(A)/10cm)min.8585Current Io-p(mA)max.80100DC resistance(Ω)typ.70120T erminal construction Pin terminal Pin terminal Operating temperature range –10 to +70°C Storage temperature range–20 to +80°CPart No.SD1614TT -B3M Rated voltage Eo-p(V)12Operating voltage Eo-p(V) 6 to 15Drive conditions: Rated voltage, square wave form [duty 50%]Drive frequency(Hz)2048Sound pressure(dB(A)/10cm)min.85Current Io-p(mA)max.100DC resistance(Ω)typ.120T erminal construction Pin terminal Operating temperature range –40 to +85°C Storage temperature range–40 to +85°CSD1614T5-B5M(Applicable to automobile) / ø16mm TYPE FEATURES•These high reliability electromagnetic buzzers are applicable to automobile equipment.•Pin type terminal construction enables direct mounting onto printed circuit boards.APPLICATIONSVarious alarms of automobile equipment.FREQUENCY CHARACTERISTICS Around 2000HzSHAPES AND DIMENSIONSSPECIFICATIONS•Please ask us for details which is designed another operating ratedfrequency.Part No.SD1614T5-B5M Rated voltage Eo-p(V)5Operating voltage Eo-p(V) 3 to 6Drive conditions: Rated voltage, square wave form [duty 50%]Drive frequency(Hz)2048Sound pressure(dB(A)/10cm)min.85Current Io-p(mA)max.80DC resistance( )typ.70T erminal construction Pin terminal Operating temperature range –40 to +85°C Storage temperature range–40 to +85°CSAFETY PRECAUTIONS FOR USING TDK ELECTROMAGNETIC BUZZERPlease be sure to read the specifications of TDK Electromagnetic Buzzer(hereinafter referred to as “the buzzer”) before use.•Please pay sufficient attentions to the warnings for safe designing when using the buzzer.Incorrect usage may cause smoke or fire.•Do not make sound on the buzzer when it is close to ears. Listening to the buzzer when it is close to ears, or continuant lis-tening to it for an extended period, may result in hearing disor-ders.Thoroughly warn consumers not to turn on the sound when the buzzer is close to ears.•Do not exceed the rated operation voltage range when using the buzzer.If it is exceeded beyond the rated operation voltage, a built-in coil may generate heat, resulting in deterioration of the coil, which may cause a drop in sound pressure or a change in the terminal resistance value.If a rare short circuit occurs due to heat generated in the built-in coil, a large electrical current flows to the equipment used, pos-sibly causing it to emit smoke or fire.•The buzzer is a magnetic type sounder.Do not use it for any other purpose than a sound generation.•Do not use the buzzer in other than atmospheric air.•Do not use the buzzer in the following environments (excluding cases in which countermeasures are taken).•Corrosive gases (Cl2, NH3, SOx, NOx, etc.)•Places to be exposed to dust.•Places where rain, fog, salt water, and the like will get on the buzzer.•After installing the buzzer when designing an apparatus, confirm that there are no abnormalities by performing a reliability evaluation test.•Do not exceed the rated operating temperature range when using the buzzer.•Do not use for an extended period at relative humidity in excess of 90% (maximum wet-bulb temperature of 38°C).•When using the buzzer for a safety device or warning device, take all surest measures such as providing a safety circuit or the joint use of another sounder with equivalent characteristics in order to prevent accidents.•The buzzer may be influenced by electromagnetic waves, voltage changes, and ripple voltage.Check the buzzer in the mounted condition, and take measures such as safety circuits, shielding, etc.•If the buzzer is molded or secured by adhesives, thermal expansion stresses from the mold or adhesive agent may cause deterioration in a soldered terminal part.Before molding or securing an adhesive, consider the type, amount, hardening conditions, adhesive properties, etc., of the sealing material, and confirm the reliability.•Do not apply vibrations or shocks (such as dropping) larger than the specified.•Do not bend the terminal pin when soldering to install on a circuit board.•Do not apply larger than the specified force to the terminal pin.•Do not apply force to the terminal pin at high temperatures (when soldering).•When soldering a terminal pin, perform the soldering in clean conditions without contamination or rust in order to avoid poor connections.•When performing dip soldering directly for installing on a printed circuit board, be careful so that smoke from the flux, or other foreign materials, will not get into the sound emission hole.•Do not clean(excluding products that can be cleaned).•With regards to devices in which the consumers can touch the buzzer, thoroughly warn consumers not to put foreign materials (such as needles, hairpins, garbage, etc.) into the sound emission hole.•As the buzzer uses a coil, it has an inductive load.Protect the drive circuit by putting the diodes in parallel into the buzzer.•Do not reconfigure the buzzer.•Sound pressure changes depending on the shape of the part to be installed in a device, or the installation location.Check the buzzer in the mounted condition.•The buzzer has polarities.When installing, be careful not to make a mistake with the polar-ities. Incorrect polarities will cause the following irregularities.•Without circuit type: Differences in sound pressure will becreated.•With circuit type: No sound will be generated.•Frequencies other than the rated frequency will change the characteristics (sound pressure), and may cause wide unevenness.•As the buzzer uses a magnet, it generates a surrounding magnetic field.When designing a device, etc., confirm that there are no irregu-larities due to the magnetic field.•The characteristics of the buzzer may change because of the influence of an outside magnetic field.Check the buzzer in the mounted condition, and take measures such as shielding, etc.•Because of deterioration or damage, maintain in rated storage temperature range, avoid environments where there are sudden temperature changes, direct sunlight, corrosive gases and dust, and store wrapped in order to avoid applying stresses.RECOMMENDED OPERATING CIRCUIT EXAMPLE。

产品选型手册Product Selection Manual 2022.1101(Company Profile)公司发展历程0304深圳市美浦森半导体有限公司 2014年成立,总部位于深圳,是一家专业功率半导体元器件设计公司。

公司产品包括中大功率场效应管( 高中低压全系列产品, Trench MOSFET/SGT MOSFET /Super Junction MOSFET / Planar MOSFET),SiC 二极管、SiC MOSFET 等系列产品。

美浦森半导体在深圳/上海设有研发中心, 主要研发人员在产品研发和生产制程方面都具有丰富的行业经验, 平均行业经验在15年以上。

在深圳建立有半导体功率器件测试和应用实验室,主要负责产品的设计验证、参数测试、可靠性验证、系统分析、失效分析等,承担美浦森产品的研发质量验证。

目前,美浦森半导体MOSFET 和碳化硅系列产品在LED 电源、PD 电源、PC 和服务器电源、光伏逆变、UPS 、充电桩、智能家居、BLDC 、BMS 、小家电等领域得到广泛应用。

创新 高效 热爱 持续是美浦森半导体的核心价值; 用创新实现突破, 是公司不断前进的动力源泉。

专业于MOSFET 器件领域的拓展, 运用创新的电路设计和国际同步的研发技术, 成功研发出新一代MOSFET 系列产品, 产品相关性能达到行业领先水平。

我们始终坚持不断创新、不断突破, 始终保持产品第一、技术第一、服务第一的行业领先地位, 全心全意做好产品的开发与用户的极限体验 。

功率器件实验室&应用实验室投资2000万人民币兴建器件分析实验室和应用实验室, 负责美浦森产品的设计验证，品质监控和客户的技术支持。

2022年“美浦森实验室”将扩充至800平方, 并正在申请国家CNAS 认证实验室资格。

产品设计验证\产品性能比对\动静态参数测试\极限参数测试1可靠性验证\失效分析\产品品质监控2系统应用分析\系统性能验证3KEYENCE 显微镜KEYSIGHT 功率器件分析仪JUNO 直流参数测试系统ISPEC 高温反偏实验系统TEKTRONIX 功率器件动态测试仪STATEC 测试系统碳化硅全系6寸生产线升级结束, 碳化硅MOS 正式批量接单中低压Trench/SGT MOS 批量出货.超结MOS E7系列产品开始批量出货, RSP 参数超越竞品系列产品; 成立深圳器件测试及可靠性实验室、产品应用实验室.650V SiCDIODE 系列产品面市推广, 并大批量出货；1200V SiCDIODE 研发成功, 进入批量阶段; 碳化硅MOS 验证成功.2014年深圳市美浦森半导体有限公司成立，同年正式推广“美浦森”品牌MOS 系列产品.高压MOSFET (VDMOS )0605高压MOSFET (VDMOS )高压MOSFET 命名方式126245公司简称封装形式3额定电流P :TO -220F :TO -220F H:TO-247W:TO-3PD:D-Pak(TO-252)U:I-Pak(TO-251)B:D2-Pak(TO-263) I:I2-Pak(TO-262)沟道极性N:N-channel P:P-channel电压系数(x10)芯片工艺C:MOS C-FETU:MOS U-FET S:MOS S-FETUZ:MOS U-FET+ESD (Z: Zener diode)超结MOSFET (SJMOS )0708超结MOSFET 命名方式126245公司简称封装形式3额定电压P :TO -220 F :TO -220F H:TO-247W:TO-3P D:D-Pak(TO-252)U:I-Pak(TO-251)B:D2-Pak(TO-263)I :I2-Pak(TO-262)L :DFN8X8Rds (on )缩写Rds (on )数值单位：m 芯片工艺SJ:MOS SJ-FETE7:MOS E7-FET E7D:MOS FRDΩ超结产品特点Trr 时间缩短: 反向恢复时间快Qg 电荷小: 开关速度快，开关损耗小Rds (on )值小: 通态阻抗小，通态损耗小PKG体积小: 同等功率规格下封装小，有利于功率密度的提高超结MOSFET (SJMOS )27快恢复二极管(FRD)中低压MOSFET (MV/LV MOS )0910碳化硅二极管(SiC Diode)中低压命名方式126245公司简称封装形式3MOSFET电流值（1-3位数字）P:TO-220 F:TO-220FH:TO-247 W:TO-3PD:D-Pak(TO-252)U:I-Pak(TO-251)B:D2-Pak(TO-263)I :I2-Pak(TO-262)S:SOP-8 T:TSSOP-8M:DFN5X6 N:DFN3X3L:DFN8X8V:SOT-23沟通极性MOSFET电压值（2-3位数字)芯片工艺N:N-NchannelP:P-channelL:N-channel+P-channelD:Dual N-channelE:Dual P-channelT:普通Trench MOSFETG:Split Gate TrenchMOSFET27版本号只有一个版本时此为空，带ESD产品此位为K中低压MOSFET(MV/LV MOS)111213开关时间快，开关损耗小恢复时间短，Trr恢复时间短，趋近于零o工作结温高，工作温度可达到175C 以上击穿电压高，产品电压最高可达6000W 以上碳化硅MOSFET (SiC MOS )碳化硅MOSFET 命名方式5431212公司简称封装形式P :TO -220 F:TO -220F H:TO-247-3L W :TO -3P D:D-Pak(TO-252)U:I-Pak(TO-251)B:D2-Pak(TO-263)I : I2-Pak(TO-262)K: TO-247-4L453Rds(on)数值 单位: m 电压系数(X10)芯片工艺Ω碳化硅材料特点14碳化硅二极管命名方式1245公司简称封装形式3额定电流P :TO -220 F :TO -220FH:TO-247 L :DFN8X8D:D-Pak(TO-252)U:I-Pak(TO-251)B:D2-Pak(TO-263)M:DFN5x67S: SO-7N: 内绝缘工艺电压系数(X10)芯片工艺V1:JBS G1: MPS1:2Pin2P :TO -2202F :TO -220F 2H:TO-2472B:D2-Pak 2I:I2-Pak2:3Pin 2Chip2TP :TO -2202TW :TO -3P 2TH: TO-2473:2Pin 2ChipR :TO -220RF :TO-220F RH :TO -2474:3Pin 1Chip。

Key Features & Benefits:Notes:Project:Date:

Catalog #:

ITEM#ESL-MUR-150W-330ESL-MUR-150W-340ESL-MUR-150W-350ESL-MUR-150W-330-HVESL-MUR-150W-340-HVESL-MUR-150W-350-HVEFFICACY(lm/W)127130133127130133DLC QPLN/APREMIUM PADDSX8SPREMIUM PXWZ8WQDN/APREMIUM PJTJMV3APREMIUM P5CUQWCA

WATTS150W150W150W150W150W150WLUMENOUTPUT19,00519,51019,94019,00519,51019,940KELVIN3000K4000K5000K3000K4000K5000KCRI>75>75>75>75>75>75

Catalog Data:

03/01/2018

Power: 150 WattsInput Voltage: 120-277 VAC, 180-528 VACInput Current @120V: 1.25AInput Current @277V: 0.54AInput Current @480V: 0.312AOperating Temperature: -40°F to 176°F (-40°C to 80°C)Non-Dimmable Driver Dimensions - (LxWxH): 8.97" x 2.7" x 1.53"0-10v Dimmable Driver Dimensions - (LxWxH): 8.97" x 2.7" x 1.53"High Voltage Driver Dimensions - (LxWxH): 9.64" x 2.7" x 1.53"0-10v Dimmable High Voltage Driver Dimensions - (LxWxH): 9.64" x 2.7" x 1.53"Driver SpecificationsTechnical Specifications:Lumen Output: Up to 19,940 LumensE󰁏cacy (lm/W): Up to 133 Lumens per WattKelvin: 3000K, 4000K, 5000KCRI: >75Rated Life (hrs): 100,000 HoursIES Classification: Fixture DependantDimensions (LxWxH): 8.6" x 5.7" x 2.5" Weight Without Driver (lbs): 1.7

MURS220T3Preferred DeviceSurface MountUltrafast Power RectifiersIdeally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system.•Small Compact Surface Mountable Package with J−Bend Leads •Rectangular Package for Automated Handling•High Temperature Glass Passivated Junction•Low Forward V oltage Drop(0.77 V olts Max @ 2.0 A, T J = 150°C)Mechanical Characteristics:•Case: Epoxy, Molded•Weight: 95 mg (approximately)•Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable•Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds•Shipped in 12 mm Tape and Reel, 2500 units per reel •Polarity: Polarity Band Indicates Cathode Lead •Marking: U2D•Pb−Free Package is AvailableMAXIMUM RATINGSMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.U2DULTRAFAST RECTIFIERS2 AMPERES200 VOLTSDevice Package Shipping†ORDERING INFORMATIONMURS220T3SMB2500/T ape & Reel SMBCASE 403APreferred devices are recommended choices for future use and best overall value.MARKINGDIAGRAMU2D = Specific Device Code†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.MURS220T3G SMB(Pb−Free)2500/T ape & ReelTHERMAL CHARACTERISTICSELECTRICAL CHARACTERISTICSFigure 1. Typical Forward VoltageV F, INSTANTANEOUS VOLTAGE (VOLTS)3.00.010.030.020.20.1102.00.70.30.050.55.0, I N S T A N T A N E O U S F O R W A R D C U R R E N T (A M PS )F0.071.07.0I 0.30.50.11.0100.010.70.91.11.3V F , INSTANTANEOUS VOLTAGE (VOLTS)I F Figure 2. Maximum Forward Voltage, I N S T A N T A N E O U S F O R W A R D C U R R E N T (A M P S )0.40.60.81.01.23.02.05.07.00.20.70.30.50.030.020.050.07V R , REVERSE VOLTAGE (VOLTS)604010012040800.0080.0040.0020.80.40.2204.02.08.0I R 20802001601801400.080.040.02, R E V E R S E C U R R E N T ( A )m * The curves shown are typical for the highest voltage device in thevoltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied V R is sufficiently below rated V R .V R , REVERSE VOLTAGE (VOLTS)200.11.00.0110100406080100120140160180200I R , R E V E R S E C U R R E N T ( A )m Figure 3. Typical Reverse Current*Figure 4. Maximum Reverse CurrentT C , CASE TEMPERATURE (°C)1.02.03.04.05.0I F (A V )06.07.08.09.010V R , REVERSE VOLTAGE (VOLTS)0105.0152520503530C , C A P A C I T A N C E (p F )Figure 5. Typical CapacitanceFigure 6. Current Derating, Case0.51.02.03.04.05.00 1.01.52.0 2.5I F(AV), AVERAGE FORWARD CURRENT (AMPS)P F (A V )Figure 7. Power Dissipation4540, A V E R A G E P O W E R D I S S I P A T I O N (W A T T S ), A V E R A G E F O R W A R D C U R R E N T (A M P S )PACKAGE DIMENSIONSNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.DIM MIN MAX MIN MAX MILLIMETERSINCHESA 0.1600.180 4.06 4.57B 0.1300.150 3.30 3.81C 0.0750.095 1.90 2.41D 0.0770.083 1.96 2.11H 0.00200.00600.0510.152J 0.0060.0120.150.30K 0.0300.0500.76 1.27P 0.020 REF 0.51 REF S 0.2050.2205.21 5.59SMB DO−214AA CASE 403A−03ISSUE Dǒmm inchesǓSCALE 8:1*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。

Product OverviewThe silicon carbide(SiC)power MOSFET product line from Microsemi increases the performance over siliconMOSFET and silicon IGBT solutions while lowering the total cost of ownership for high-voltage applications.The MSC017SMA120S device is a1200V,17mΩSiC MOSFET in a TO-268(D3PAK)package.FeaturesThe following are key features of the MSC017SMA120S device:•Low capacitances and low gate charge•Fast switching speed due to low internal gate resistance(ESR)•Stable operation at high junction temperature,T J(max)=175°C•Fast and reliable body diode•Superior avalanche ruggedness•RoHS compliantBenefitsThe following are benefits of the MSC017SMA120S device:•High efficiency to enable lighter,more compact system•Simple to drive and easy to parallel•Improved thermal capabilities and lower switching losses•Eliminates the need for external freewheeling diode•Lower system cost of ownershipApplicationsThe MSC017SMA120S device is designed for the following applications:•PV inverter,converter,and industrial motor drives•Smart grid transmission and distribution•Induction heating and welding•H/EV powertrain and EV charger•Power supply and distributionThis section shows the specifications of the MSC017SMA120S device.Absolute Maximum RatingsThe following table shows the absolute maximum ratings of the MSC017SMA120S device.Table1•Absolute Maximum RatingsSymbolParameterRatingsUnitV DSSDrain source voltageV1200Continuous drain current at T C=25°CI DA100Continuous drain current at T C=100°C71I DM280Pulsed drain current1V GSGate-source voltage23to–10VTotal power dissipation at T C=25°CP D357WLinear derating factor3.33W/°CNote:1.Repetitive rating:pulse width and case temperature limited by maximum junction temperature. The following table shows the thermal and mechanical characteristics of the MSC017SMA120S device. Table2•Thermal and Mechanical CharacteristicsCharacteristicMinSymbolTypMaxUnitRθJCJunction-to-case thermal resistance0.280.42°C/W Operating junction temperatureT J–55175°CT STG–55150Storage temperatureT LSoldering temperature for10seconds(1.6mm from case)300WtPackage weight0.14ozg4.0Electrical PerformanceThe following table shows the static characteristics of the MSC017SMA120S device.T J =25°C unless otherwise specified.Table 3•Static CharacteristicsUnit MaxTypMin Test Conditions CharacteristicSymbol V 1200V GS =0V,I D =100µA Drain-source breakdown voltage V (BR)DSS mΩ2217.6V GS =20V,I D =40A Drain-source on resistance 1R DS(on)V 2.71.9V GS =V DS,I D =4.5mA Gate-source threshold voltage V GS(th)mV/°C –4.6V GS =V DS ,I D =4.5mA Threshold voltage coefficient ΔV GS(th)/ΔT J µA100V DS ,=1200V,V GS =0V Zero gate voltage drain currentI DSS500V DS =1200V,V GS =0V T J =125°CnA±100V GS =20V/–10VGate-source leakage currentI GSSNote:1.Pulse test:pulse width <380µs,duty cycle <2%.The following table shows the dynamic characteristics of the MSC017SMA120S device.T J =25°C unless otherwise specified.Table 4•Dynamic CharacteristicsUnit MaxTyp MinTest Conditions Characteristic Symbol pF5280V GS =0V,V DD =1000V V AC =25mV,ƒ=1MHzInput capacitanceC iss 12Reverse transfer capacitance C rss 265Output capacitance C oss nC249V GS =–5V/20V,V DD =800V I D =40ATotal gate charge Q g 63Gate-source charge Q gs 32Gate-drain charge Q gd ns52V DD =800V,V GS =–5V/20V,I D =50A,R g(ext)=4.0Ω,Turn-on delay time t d(on)21Voltage fall time t f Freewheeling diode =MSC017SMA120S (V GS =–5V)49Turn-off delay timet d(off)UnitMax Typ Min Test Conditions Characteristic Symbol 16Voltage rise time t r µJ1677Turn-on switching energy E on 395Turn-off switching energy E off ns49V DD =800V,V GS =–5V/20V,I D =50A,R g(ext)=4.0ΩTurn-on delay time t d(on)19Voltage fall time t f Freewheeling diode =MSC050SDA120B49Turn-off delay time t d(off)14Voltage rise time t r µJ1329Turn-on switching energy E on 429Turn-off switching energy E off Ω0.71f =1MHz,25mV,drain short Equivalent series resistance ESR µs 3V DS =960V,V GS =20V Short circuit withstand time SCWT mJ3500V DS =150V,I D =30AAvalanche energy,single pulseE ASThe following table shows the body diode characteristics of the MSC017SMA120S device.T J =25°C unless otherwise specified.Table 5•Body Diode CharacteristicsUnit MaxTyp MinTest Conditions Characteristic Symbol V 3.5I SD =40A,V GS =0V Diode forward voltageV SDV 3.9I SD =40A,V GS =–5Vns40I SD =50A,V GS =–5V,Drive Rg =4ΩReverse recovery time t rr nC 490Reverse recovery charge Q rr V DD =800V,dl/dt =–2500A/µsA22Reverse recovery currentI RRMTypical Performance CurvesThis section shows the typical performance curves of the MSC017SMA120S device.Figure2•Drain Current vs.V DS Figure1•Drain Current vs.V DSFigure4•Drain Current vs.V DS Figure3•Drain Current vs.V DSFigure5•RDS(on)vs.Junction TemperatureFigure6•Gate Charge CharacteristicsFigure8•I D vs.V DS3rd Quadrant Conduction Figure7•Capacitance vs.Drain-to-Source VoltageFigure10•Switching Energy Eon vs.V DS&I D Figure9•I D vs.V DS3rd Quadrant ConductionFigure11•Switching Energy Eoff vs.V DS&I DFigure12•Switching Energy vs.R gFigure13•Switching Energy vs.TemperatureFigure14•Switching Energy Eon vs.V DS&I DFigure16•Switching Energy vs.R gFigure15•Switching Energy Eoff vs.V DS&I DFigure17•Threshold Voltage vs.Junction Temp.Figure18•Forward Safe Operating AreaFigure19•Maximum Transient Thermal ImpedanceThis section shows the package specification of the MSC017SMA120S device.Package Outline DrawingThe following figure illustrates the TO-268package outline of the MSC017SMA120S device.Figure20•Package Outline DrawingThe following table shows the TO-268dimensions and should be used in conjunction with the package outline drawing.Table6•TO-268DimensionsSymbolMin(mm)Min(in.)Max(mm)Max(in.)4.90A5.100.1930.201B15.850.63816.200.624C18.7019.100.7520.7361.00D1.250.0490.03913.80E14.000.5510.543F13.300.5240.53513.60Min(mm)Min(in.)Max(mm)G2.700.1060.1142.90H1.151.450.0570.045I1.950.0772.210.087J0.940.0550.0371.40K2.400.1060.0942.70L0.400.0240.600.016M1.450.0630.0571.60N0.000.0070.180.00012.40O12.700.4880.500P5.45BSC(nom.)0.215BSC(nom.)GateTerminal1DrainTerminal2SourceTerminal3DrainTerminal4Microsemi's product warranty is set forth in Microsemi's Sales Order Terms and rmation contained in this publication is provided for the sole purpose of designing with and using Microsemi rmation regarding device applications and the like is provided only for your convenience and may be superseded by updates.Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi.It is your responsibility to ensure that your application meets with your specifications.THIS INFORMATION IS PROVIDED "AS IS."MICROSEMI MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,WRITTEN OR ORAL,STATUTORY OR OTHERWISE,RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY ,PERFORMANCE,NON-INFRINGEMENT,MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.IN NO EVENT WILL MICROSEMI BE LIABLE FOR ANY INDIRECT,SPECIAL,PUNITIVE,INCIDENTAL OR CONSEQUENTIAL LOSS,DAMAGE,COST OR EXPENSE WHATSOEVER RELATED TO THIS INFORMATION OR ITS USE,HOWEVER CAUSED,EVEN IF MICROSEMI HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE.TO THE FULLEST EXTENT ALLOWED BY LAW,MICROSEMI’S TOTAL LIABILITY ON ALL CLAIMS IN RELATED TO THIS INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES,IF ANY ,YOU PAID DIRECTLY TO MICROSEMI FOR THIS e of Microsemi devices in life support,mission-critical equipment or applications,and/or safety applications is entirely at the buyer’s risk,and the buyer agrees to defend and indemnify Microsemi from any and all damages,claims,suits,or expenses resulting from such use.No licenses are conveyed,implicitly or otherwise,under any Microsemi intellectual property rights unless otherwisestated.Microsemi2355W.Chandler Blvd.Chandler,AZ 85224USAWithin the USA:+1(480)792-7200Fax:+1(480)792-7277 ©2020Microsemi andits corporate affiliates.All rights reserved.Microsemi and the Microsemi logo aretrademarks of Microsemi Corporation and itscorporate affiliates.All other trademarks andservice marks are the property of theirrespective owners.Microsemi Corporation,a subsidiary of Microchip Technology Inc.(Nasdaq:MCHP),and its corporate affiliates are leading providers of smart,connected and secure embedded control solutions.Their easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market.These solutions serve more than 120,000customers across the industrial,automotive,consumer,aerospace and defense,communications and computing markets.Headquartered in Chandler,Arizona,the company offers outstanding technical support along with dependable delivery and quality.Learn more at .050-7781|October 2020|Preliminary11050-7781MSC017SMA120S Datasheet RevisionA Legal。

Taurus SeriesMultimedia PlayersT 3Specifications Document V ersion:V1.3.2Document Number:NS120100345Copyright © 2018 Xi’an NovaStar Tech Co., Ltd. All Rights Reserved.No part of this document may be copied, reproduced, extracted or transmitted in any form or by any means without the prior written consent of Xi’an NovaStar Tech Co., Ltd.Trademarkis a trademark of Xi’an NovaStar Tech Co., Ltd.Statementi T3 SpecificationsTable of ContentsTable of ContentsTable of Contents ............................................................................................................................ ii 1 Overview .. (1)1.1 Introduction (1)1.2 Application (1)You are welcome to use the product of Xi’an NovaStar Tech Co., Ltd. (hereinafter referred to as NovaStar). This document is intended to help you understand and use the product. For accuracy and reliability, NovaStar may make improvements and/or changes to this document at any time and without notice. If you experience any problems in use or have any suggestions, please contact us via contact info given in document. We will do our best to solve any issues, as well as evaluate and implement any suggestions.2 Features (3)2.1 Synchronization mechanism for multi-screen playing (3)2.2 Powerful Processing Capability (3)2.3 Omnidirectional Control Plan (3)2.4 Dual-Wi-Fi Mode ..........................................................................................................................................42.4.1 Wi-Fi APMode .......................................................................................................................................... 52.4.2 Wi-Fi Sta Mode .. (5)2.4.3 Wi-Fi AP+Sta Mode (5)2.5 Redundant Backup (6)3 Hardware Structure (7)3.1 Appearance (7)3.2 Dimensions (9)4 Software Structure (10)4.1 System Software (10)4.2 Related Configuration Software (10)5 Product Specifications ................................................................................................................ 116 Audio and Video Decoder Specifications (13)6.1 Image (13)6.1.1 Decoder (13)6.1.2 Encoder (13)6.2 Audio (14)6.2.1 Decoder (14)6.2.2 Encoder (14)6.3 Video (15)6.3.1 Decoder (15)6.3.2 Encoder (16)iiT3 Specifications 1 Overview1 Overview 1.1 IntroductionTaurus series products are NovaStar's second generation of multimedia playersdedicated to small and medium-sized full-color LED displays.T3 of the Taurus series products (hereinafter referred to as “T3”) feature followingadvantages, better satisfying users’ requirements:●Loading capacity up to 650,000 pixels●Synchronization mechanism for multi-screen playing●Powerful processing capability●Omnidirectional control plan●Dual-Wi-Fi mode ●Redundant backup Note:If the user has a high demand on synchronization, the time synchronization module isrecommended. For details, please consult our technical staff.In addition to solution publishing and screen control via PC, mobile phones and LAN,the omnidirectional control plan also supports remote centralized publishing andmonitoring.1.2 ApplicationTaurus series products can be widely used in LED commercial display field, such asbar screen, chain store screen, advertising machine, mirror screen, retail storescreen, door head screen, on board screen and the screen requiring no PC.Classification of Taurus’ application cases is shown in Table 1-1. Table1 OverviewT3 Specifications2 Features 2.1 Synchronization mechanism for multi-screen playingThe T3 support switching on/off function of synchronous display.When synchronous display is enabled, the same content can be played on differentdisplays synchronously if the time of different T3 units are synchronous with oneanother and the same solution is being played.2.2 Powerful Processing CapabilityThe T3 feature powerful hardware processing capability:● 1.5 GHz eight-core processor●Support for H.265 4K high-definition video hardware decoding playback●Support for 1080P video hardware decoding● 2 GB operating memory●8 GB on-board internal storage space with 4 GB available for users2.3 Omnidirectional Control Plan●More efficient: Use the cloud service mode to process services through a uniformplatform. For example, VNNOX is used to edit and publish solutions, andNovaiCare is used to centrally monitor display status.●More reliable: Ensure the reliability based on active and standby disasterrecovery mechanism and data backup mechanism of the server.●More safe: Ensure the system safety through channel encryption, data fingerprintand permission management.●Easier to use: VNNOX and NovaiCare can be accessed through Web. As long asthere is internet, operation can be performed anytime and anywhere.●More effective: This mode is more suitable for the commercial mode ofadvertising industry and digital signage industry, and makes informationspreading more effective.2.4 Dual-Wi-Fi ModeThe T3 have permanent Wi-Fi AP and support the Wi-Fi Sta mode, carryingadvantages as shown below:●Completely cover Wi-Fi connection scene. The T3 can be connected to throughself-carried Wi-Fi AP or the external router.●Completely cover client terminals. Mobile phone, Pad and PC can be used to login T3 through wireless network.●Require no wiring. Display management can be managed at any time, havingimprovements in efficiency.T3’s Wi-Fi AP signal strength is related to the transmit distance and environment.Users can change the Wi-Fi antenna as required.2.4.1 Wi-Fi AP ModeUsers connect the Wi-Fi AP of a T3 to directly access the T3. The SSID is “AP + thelast 8 digits of the SN”, for example, “AP10000033”, and the default password is “”.Configure an external router for a T3 and users can access the T3 by connecting theexternal router. If an external router is configured for multiple T3 units, a LAN can becreated. Users can access any of the T3 via the LAN.2.4.2 Wi-Fi Sta Mode2.4.3 Wi-Fi AP+Sta ModeIn Wi-Fi AP+ Sta connection mode, users can either directly access the T3 or accessinternet through bridging connection. Upon the cluster solution, VNNOX andNovaiCare can realize remote solution publishing and remote monitoring respectivelythrough the Internet.2.5Redundant BackupT3 support network redundant backup and Ethernet port redundant backup.●Network redundant backup: The T3 automatically selects internet connectionmode among wired network or Wi-Fi Sta network according to the priority.●Ethernet port redundant backup: The T3 enhances connection reliability throughactive and standby redundant mechanism for the Ethernet port used to connectwith the receiving card.T3 Specifications3 Hardware Structure 3.1 AppearanceFigure 3-1 Appearance of T3Note: All product pictures shown in this document are for illustration purpose only.Actual product may vary.Table 3-1 Connectors and buttons of the T3Name DescriptionWiFi-STA Wi-Fi Sta antenna portWiFi-AP Wi-Fi AP antenna portSYS CLOUDRUN FPGA status indicatorSame as the signal indicator status of the sending card:Note: All product pictures shown in this document are for illustration purpose only.Actual product may vary.Table 3-2 Indicators of the T3T3 SpecificationsThe total thickness (board thickness + thickness of the components on the front andback side) is no greater than 25.0mm.Unit of the dimension chart is “mm”. Ground connection is enabled for location hole(GND).T3 Specifications 4 Software Structure4 Software Structure4.1 System Software●Android operating system software●Android terminal application software●FPGA programNote: The third-party applications are not supported.4.2 Related Configuration SoftwareTable 4-1 Related configuration softwareViPlex ExpressNovaLCTT3 Specifications5 Product Specifications5Product Specifications8 GB on-board with 4 GBListDimensions Packing informationmension s ( H ×W×D )5 Product SpecificationsAntennaAntenna extension mastT3 SpecificationsAudio and Video Decoder6.1.2 EncoderType Codec Supported Image SizeMaximum Data RateRemarks JPEGJPEG Baseline96×32 pixels~8176×8176 pixels90Mpixels/Second JFIF 1.02 N/A6Type Codec Supported Image Size Container RemarksJPEGJFIF1.02JPG, JPEGNot SupportNon-interleaved Scan Software support SRGB JPEG Software support Adobe RGB JPEGBMP BMP No Restriction BMP N/A GIF GIF No RestrictionGIF N/A PNG PNG No Restriction PNG N/A WEBPWEBPNo RestrictionWEBPN/A48 × 48 p ixels~8176 × 8176 pixel sSpecifications6.1 Image6.1.1 Decoder6.2 AudioOGG, OGA8KHZ~48AMR-NB 2HZ~ 48 16.3 VideoH.264.6.3.2 EncoderMOV, 3GPM bps。

产品说明书1206贴片NPN光敏三极管PT1206BS ⏹描述PT1206BS是一款高速高灵敏度小型贴片NPN型光敏三极管1206封装，采用黑色环氧材料封装，产品适用于红外线的感光。

⏹特点●快速响应●高感光灵敏度●无铅环保●符合RoHS和REACH标准⏹应用●微型开关●计数器和分拣机●位置传感器●编码器●红外传感应用系统发射集集电极集电极标识建议回流焊焊盘尺寸注: 1. 所有尺寸单位位毫米(括号内单位为英寸) 2. 未标明误差的精度为± 0.2毫米(.008英寸) 3. 建议的焊盘尺寸仅供参考 请根据实际需要进行修改⏹封装尺寸⏹极限参数(Ta=25℃)参数名称符号参考值单位集电极-发射极电压V CEO 30V 发射极-集电极电压V ECO 5V 集电极电流Ic 20mA 焊接温度*1Tsol 260℃工作温度Topr -20~+85℃存储温度Tstg-40~+85℃说明:*1:焊接时间≦5seconds.Ambient Temperature Ta(°C)C o l l e c t o r P o w e rD i s s i p a t i o n (m W )40100020406080100-20-406080201008060200600Wavelength(nm)R e l a t i v e S p e c t r a l S e n s i t i v i t y (%)Ta=25°40700800900100011001200⏹光电参数(Ta=25℃)参数名称符号最小典型最大单位测试条件频谱范围λ0.5730--1100nm 感光峰值波长λP --940--nm 集电极–发射极击穿电压BV CEO30----V Ic=100μA,Ib=0发射极-集电极击穿电压BV ECO5----V Ic=100μA,Ib=0集电极暗电流I CEO ----100nA V CE =20V,H=0mw/cm2集电极-发射极饱和电压V CE （S ）---0.4V Ic=2mA,I B =100μA 集电极电流I C (on)0.10.6--mAEe=1mW/cm2,V CE =5V 直流电流放大倍数H FE 1000--1800V CE =5V,IC=2mA 上升/下降时间t r /t f--15/15μS V CE =5V,I C =1mA R L =1000Ω⏹特性曲线图图.1集电极耗散功率与环境温度图.2相对频谱灵敏度300Ambient Temperature Ta(°C)R e l a t i v e C o l l e c t o r C u r r e n t (%)40608060100160Vce=5V204080120140Ee=1mW/cm 21020507025Ambient Temperature (°C)C o l l e c t o rD a r k C u r r e n t IC E O(n A )50751000.1110100Vce=20V 0.1Irradiance Ee(mW/cm )C o l l e c t o r C u r r e n t I c (m A )1100.01101010101010-1-2-3Vce=5VT =25 Ca °20Collector-Emitter Voltage V CE (V)C o l l e c t o r C u r r e n t I c (m A )12340.51.01.52.02.53.03.5Ee=0.5mW/cm2Ee=0.75mW/cm2Ee=1.0mW/cm2Ee=1.25mW/cm2Ee=1.5mW/cm2图.3相对集电极电流与环境温度图.4集电极电流与辐照度图.5集电极暗电流与环境温度图.6集电极电流与集射电压注: 1. 所有尺寸单位为毫米(英寸)发射极集电极注: 1. 所有尺寸单位为毫米(英寸)2. 未注明误差的尺寸为 ± 0.1mm(.004")⏹包装尺寸图⏹载带尺寸图（数量：3000个/盘）注意事项:1.我公司保留更改产品材料和以上说明书的权利，更改以上产品说明书恕不另行通知。

P/N: 1802012004013 *1802012004013*MC-1200 SeriesQuick Installation GuideVersion 3.0, September 2020Technical Support Contact Information/supportMoxa Americas:Toll-free: 1-888-669-2872 Tel: 1-714-528-6777 Fax: 1-714-528-6778 Moxa China (Shanghai office): Toll-free: 800-820-5036 Tel: +86-21-5258-9955 Fax: +86-21-5258-5505 Moxa Europe:Tel: +49-89-3 70 03 99-0 Fax: +49-89-3 70 03 99-99 Moxa Asia-Pacific:Tel: +886-2-8919-1230 Fax: +886-2-8919-1231 Moxa India:Tel: +91-80-4172-9088 Fax: +91-80-4132-10452020 Moxa Inc. All rights reserved.OverviewThe MC-1200 Series computers are built around a 7th Gen Intel® Celeron® or Intel® Core™ i3, i5, or i7 CPU and come with 1 HDMI display port, 3 USB 3.0 ports, 2 gigabit LAN ports, and 2 3-in-1 RS-232/422/485 serial ports. The MC-1200 is equipped with a 2.5”HDD/SSD slot and a built-in TPM 2.0 module.Additional value and convenience is provided through a modular design with three independent slots for flexible system integration and expansion. Users have the option to add a variety of different communications modules, including Wi-Fi, 3G, LTE, GPS, and mSATA expansion modules.The MC-1200 is designed to operate reliably in extreme conditions, such as continuous exposure to low or high temperatures, humidity, high vibration, and power surges, making them perfect for heavy industry, solar grid, water/wastewater, oil and gas, and transportation applications.Package ChecklistBefore installing the MC-1200, verify that the package contains the following items:•MC-1200 embedded computer•Terminal block to power jack converter•DIN-rail mounting kit•Quick installation guide (printed)•Warranty cardPlease notify your sales representative if any of the above items are missing or damaged.Panel LayoutThe panel layouts of the MC-1200 are shown in the following illustrations:Front ViewTop ViewBottom ViewLED IndicatorsThe following table describes the function of the LED indicators located on the front panel of the MC-1200:LED Name StatusDescriptionPowerGreenPower is on and computer isfunctioning normally OffPower is offStorage 1 (mSATA)Yellow Blinking: Data transmission Off No data transmission.LAN 1/2(on connectors)GreenSteady On: 100 Mbps Ethernet link Blinking: Data is being transmitted YellowSteady On: 1000 Mbps Ethernet linkBlinking: Data is being transmitted Off10 Mbps Ethernet link or LAN is notconnectedTx 1/2Green Blinking: Data is being transmitted. Off No connectionRx 1/2Yellow Blinking: Data is being transmitted. Off No connectionInstalling the MC-1200DIN-rail MountingThe MC-1200 comes with a DIN-rail mounting kit. To install the DIN-rail mounting kit, do the following: STEP 1:Use the 4 screws included with thekit to attach the DIN-rail mountingbracket to the MC-1200’s rearpanel and tighten the screws tosecure the bracket to the MC-1200.STEP 2:Insert the top of the DIN rail intothe slot just below the upper hookof the DIN-rail mounting kit.STEP 3:Press the MC-1200 towards theDIN rail until it snaps into place.Removal:STEP 1:Pull down the latch on themounting kit with a screwdriver.STEP 2 & 3:Slightly pull the MC-1200 forwardand lift it up to remove it from theDIN rail.For the specifications of the DIN-rail mounting screws, refer tothe illustration on the right andadhere to these values to securethe DIN-rail bracket to the rearpanel of the computer.Wall MountingThe MC-1200 can be installed on a wall by using the optional wall-mounting kit. The wall-mounting kit must be purchased separately.STEP 1:Use three screws for each bracket and attach the brackets to the rear of the MC-1200.Refer to the figure on the right for the specifications of the screws used to attach the mounting brackets.STEP 2:Use two screws per bracket to attach the MC-1200 to a wall or cabinet. Note:Mounting the MC-1200 to a wall requires four screws. Use the MC-1200 computer, with the optional wall-mounting brackets attached, as a guide to mark the correct locations of the screws on the wall.The heads of the screws should be less than 6.0 mm in diameter, and the shafts should be less than 3.5 mm in diameter as shown in the figure on the right. Do not drive the screws in all the way; leave a space of about 2 mm to allow room for sliding the wall-mounting bracket between the wall and the screws.Connector DescriptionPower ConnectorUse an LPS (9-36 VDC) or Class 2 power cord to connect to the MC-1200's terminal block to power jack converter and then turn on the power. If the power is supplied properly, the Power LED will light up. The OS is ready when the Power LED glows a solid green.Grounding the MC-1200 Grounding and wire routing help limit the effects of noise due to electromagnetic interference (EMI). Run the groundconnection from the grounding screw (M4) to the grounding surface prior to connecting the power as shown in the illustration on the right.Terminal BlockTerminal block (JP1)—R/C (XCFR2, XCFR8), socket soldered on to the PWB, DINKLE ENTERPRISE CO., LTD, type 2EHDRM, rated 300 V, 15 A, 105°C. Mating with plug type 2RSDAM, 2ESDPM, 2ESDPLM or 2ESDVM, rated 300 V, 15 A, 105°C. The plug-half connection is secured byscrews; suitable for 12 to 24 AWG wire size, secured on plug by screws with a torque value of 0.5 N-m (4.4253 lb-in).Ethernet PortsThe 10/100/1000 Mbps Ethernet ports use RJ45 connectors. Pin 10/100 Mbps1000 Mbps 1 ETx+ TRD(0)+ 2 ETx- TRD(0)- 3 ERx+ TRD(1)+ 4 – TRD(2)+ 5 – TRD(2)- 6 ERx- TRD(1)- 7 – TRD(3)+ 8–TRD(3)-Serial PortsThe serial ports use DB9 connectors. Each port can be configured by software as a RS-232, RS-422, or RS-485 port. The pin assignments for the ports are shown below: Pin RS-232 RS-422RS-485 (4-wire) RS-485 (2-wire)1DCD TxDA(-) TxDA(-)– 2 RxD TxDB(+) TxDB(+) –3 TxD RxDB(+) RxDB(+) DataB(+)4 DTR RxDA(-) RxDA(-) DataA(-)5 GND GND GND GND6 DSR – – –7 RTS – – – 8CTS– – –USIM SlotThe MC-1200 has two USIM slots for 3G/LTE wireless Internetconnections. Each slot supports dual USIM cards. To install a USIM card, gently remove the outer cover on the bottom panel, and then insert the USIM card into the slot. USB HostsThe MC-1200 has 3 USB 3.0 Type-A connectors located on the front panel. The ports support keyboard and mouse devices, and can also be used to connect a flash disk for storing large amounts of data. HDMI ConnectorThe MC-1200 has an HDMI connector located on the front panel, allowing users to connect to an audio or video device.Installing Communications ModulesThe MC-1200 Series comes with three sockets for installing various communications modules. Unfasten the screws on the right side of the computer and remove the cover to find the locations of these sockets as shown below:Installing the mSATA ModuleInsert the mSATA module into thesocket and tighter the two screwson the mSATA module to secure it.Installing the Wi-Fi ModuleThe MC-1200 comes with two sockets for users to install up to two Wi-Fi/cellular modules for wireless communication.Wi-Fi Module PackageThe contents of the Wi-Fi module package are shown below:Follow these steps to install the Wi-Fi module in the MC-1200.1.Attach the Wi-Fi module to themounting plate with twoscrews.2.Remove the transparentplastic and the blue cover onboth sides of the thermal padand then place it on the topheat sink. Also, remove theblue cover on the heat sink.3.Place the heat sink with thethermal pad at the center ofthe wireless module socket. 4.Insert the Wi-Fi module (withthe mounting plate) into thesocket and fasten the twoblack screws on the mountingplate to secure it.5.Attach one end of the Wi-Fiantenna cable to theconnector on the Wi-Fi moduleand the insert the other end(with the threaded connectionring) through the antennamounting hole on the frontpanel of the computer.Remove the protection coveron the mounting hole beforeyou do so.6.Insert the locking washerthrough the threadedconnection ring and hold itagainst the front panel.Secure the antenna connectorin place by tightening a nutonto the threaded protectionring.7. Connect the Wi-Fi antenna tothe connector on the front panel.8. Use this method to connectanother Wi-Fi antenna, if necessary.9. Reattach the right side coveron to the computer and fasten the screws to secure it.Installing the Cellular ModuleThe MC-1200 comes with two sockets for users to install up to two Wi-Fi/cellular modules for wireless communication. Cellular Module PackageThe contents of the Wi-Fi module package are shown below:Follow these steps to install the cellular module in the MC-1220. 1. Remove thetransparent plastic and the blue covers on both sides of the thermal pad and then place it on top of the heat sink. Also, remove the blue cover on the heat sink.2. Place the heat sinkwith the thermal pad at the center of the cellular module socket.3. Insert the cellularmodule in the socket and fasten the two black screws on the module to secure it.4. There are threeconnectors on the cellular module: a GPS antennaconnector and two cellular antenna connectors.5. Attach one end of thecellular antennacable to a connector on the cellular module and theinsert the other end (with the threaded connection ring)through the antenna mounting hole on the front panel of the computer. Remove theprotection cover on the mounting hole before you do so.6. Insert the lockingwasher through the threaded connection ring and hold it against the front panel. Secure the antenna connector in place by tightening a nut onto thethreaded protection ring.7. Connect the cellularantenna to theconnector provided on the front panel. 8. Use this method toconnect anothercellular antenna and the GPS antenna, if necessary.9. Reattach the rightside cover on to the computer and fasten the screws to secure it.Installing SIM CardsFollow these steps to install SIM cards for a cellular module. 1. Remove the screws onthe bottom panel of the computer and remove the cover. You will see four SIM card slots.2. Insert a card into theSIM 1 slot. Make sure you insert the card in the right direction as indicated in the image beside the slot.3. Insert the other cardinto the SIM 2 slot, if necessary.4. Replace the computercover and secure it by fastening the screws.Switching Between the Wireless Module SocketAs there are two wireless module sockets and you can install the Wi-Fi or the cellular module in either of the sockets, a DIP switch is provided to enable selection of the Wi-Fi or cellular module installed. The DIP switch is located below the mSATA socket as shown in the following illustration.The DIP switch operation is explained below:Status Switch 1 Switch 2 ONWi-FiWi-Fi OFF (default)CellularCellularFor example, if you have installed a Wi-Fi module in the first socket, you need to turn the DIP switch 1 to the ON status.ATEX and IECEx DetailsModelsMC-1220-KLX-T-YYYY (X = 0-9; Y = A-Z, 0-9, dash or blank, if without Y, dash can be blank) (for marketing purpose only and no impact safety related constructions and critical components)Rating 9 to 36 VDC, 8 AATEXInformationII 3 GDEMKO20 ATEX 2386X Ex nA nC T4 GcAmbient Range: -40°C ≤ Tamb ≤ +70°C Rated Cable Temp.≥ 130°C IECExCertificate No.IECEx UL 20.0069X。

MM 32 FMM 32 SPINMM 32 PMM 32 L MM 32 W通用高性能微控制器产品电机与电源专用微控制器产品超精简型微控制器产品低功耗高安全微控制器产品无线微控制器产品公司概况｜Company Overview灵动微电子成立于2011年，是中国本土领先的通用32位MCU产品及解决方案供应商。

灵动微电子的MCU 产品以MM32为标识，基于Arm Cortex-M系列内核，自主研发软硬件和生态系统。

目前已量产200多款型号，累计交付超2亿颗，在本土通用32位MCU公司中位居公司介绍灵动产品家族前列。

客户涵盖智能工业、汽车电子、通信基建、医疗健康、智慧家电、物联网、个人设备、手机和电脑等应用领域。

灵动微电子是中国为数不多的同时获得了Arm-KEIL、IAR、SEGGER国际权威组织官方支持的本土MCU公司，并建立了独立、完整的通用MCU生态体系，可以为客户提供从硬件芯片到软件算法、从参考方案到系统设计的全方位支持。

灵动微电子的MM32系列有5大家族：面向通用高性能MCU市场领域MM 32 F提供开放式的无线平台MM 32 W专用于电机和电源应用MM 32 SPIN支持超精简定制化需求MM 32 P覆盖低功耗、安全应用场景MM 32 L01公司概况｜Company OverviewMM32 产品组合｜MM32 MCU Product Portfolio02MM32 产品组合｜MM32 MCU Product PortfolioMM32F通用系列MM32L低功耗系列MM32W无线系列MM32SPIN电机与电源系列全新MM32｜New MM32全新MM32系列是灵动微电子于2020年推出的新一代通用MCU平台，旨在为客户提供更高性能、更低功耗、更高可靠性、稳定性和健壮性的微控制器。

全新MM32硬件上与经典MM32全兼容，保留了2.0-5.5V 宽压供电设计。

- 高性能Arm Cortex-M0 （高达96MHz）和 Arm Cortex-M3- Flash: 16KB - 512KB, SRAM: 2KB - 128KB - 不同系列之间引脚兼容，提供 20/32/48/ 64/100/144 多种引脚和封装形式产品特点MM32F 系列是灵动微电子新一代 MM32系列中率先升级推出的通用高性能MCU 平台。