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Designation:A 780/A 780M –09Standard Practice forRepair of Damaged and Uncoated Areas of Hot-Dip Galvanized Coatings 1This standard is issued under the fixed designation A 780/A 780M;the number immediately following the designation indicates the year of original adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.A superscript epsilon (´)indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1.Scope*1.1This practice describes methods that may be used to repair damaged hot-dip galvanized coatings on hardware,structural shapes,and other products fabricated prior to hot-dip galvanizing,and uncoated areas remaining after initial hot-dip galvanizing.The damage may be the result of welding or cutting (flame),in which case the coating will be damaged predominantly by burning.This practice can also be used to repair hot-dip galvanized coatings damaged by excessively rough handling during shipping or erection.Requirements concerning the renovation of uncoated areas remaining after initial hot-dip galvanizing are contained within the applicable material specification.1.2This practice describes the use of low melting point zinc alloy repair rods or powders made specifically for this purpose,the use of paints containing zinc dust,and the use of sprayed zinc (metallizing).1.3The extent of repair shall be limited to an area mutually agreeable to the contracting parties.Similarly,contracting parties shall agree to the repair method to be used.1.4This specification is applicable to orders in either inch-pound units (as A 780)or in SI units (as A 780M).Inch-pound units and SI units are not necessarily exact equivalents.Within the text of this specification and where appropriate,SI units are shown in brackets.Each system shall be used independently of the other without combining values in any way.1.5This standard does not purport to address the safety problems,if any,associated with its use.It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.2.Referenced Documents 2.1ASTM Standards:2A 902Terminology Relating to Metallic Coated Steel Prod-uctsD 520Specification for Zinc Dust Pigment2.2Society for Protective Coatings (SSPC)Documents:3SSPC-PA2Measurement of Dry Paint Thickness with Mag-netic GagesSSPC-SP2Hand Tool CleaningSSPC-SP5/NACE No.1White Metal Blast Cleaning SSPC-SP10/NACE No.2Near-White Blast Cleaning SSPC-SP11Power Tool Cleaning to Bare Metal3.Terminology3.1Definitions —For definitions of terms used in this practice,refer to Terminology A 902.4.Materials4.1Properties —The material used for repairs shall have the following characteristics:4.1.1One application of the material shall provide a coating thickness of at least 2.0mils (50.8µm).4.1.2The applied coating shall provide barrier protection and shall preferably be anodic to steel.4.1.3Application of the coating material shall be possible under shop or field conditions.4.2Types —There are three types of material that possess the required properties and may be used to repair damaged galvanized coatings,as follows:1This practice is under the jurisdiction of ASTM Committee A05on Metallic-Coated Iron and Steel Products and is the direct responsibility of Subcommittee A05.13on Structural Shapes and Hardware Specifications.Current edition approved May 1,2009.Published May 2009.Originally approved in st previous edition approved in 2006as A 780–01(2006).2For referenced ASTM standards,visit the ASTM website,,or contact ASTM Customer Service at service@.For Annual Book of ASTM Standards volume information,refer to the standard’s Document Summary page on the ASTM website.3Available from Society for Protective Coatings (SSPC),4024th St.,6th Floor,Pittsburgh,PA 15222-4656,.*A Summary of Changes section appears at the end of this standard.Copyright ©ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959,UnitedStates.4.2.1Zinc-Based Solders—Zinc alloy solders are to be used for repairs.The most common types of solders are zinc-cadmium,zinc-tin-lead,and zinc-tin-copper alloys.Zinc-cadmium and zinc-tin-lead alloys have liquidus temperatures in the ranges from518to527°F(270to275°C)and446to500°F (230to260°C),respectively.(The liquidus temperature is that temperature above which an alloy is completely molten.)The zinc-tin-copper alloys have a liquidus temperature in the range from660to670°F(349to354°C),but they are applied while in a semisolid state in the preferred application temperature range from480to570°F(250to300°C).The solders can be used in rod form or as powders.Annex A1describes the use of zinc-based solders.4.2.2Paints Containing Zinc Dust—These are usually based on organic binders,pre-mixed and formulated specifi-cally for use on steel surfaces.Paints containing zinc dust,with concentrations of zinc dust in the range of65to69%or above 92%in the driedfilm,are considered equally effective for the repair of damaged galvanized coatings.The repair paint to be used shall be selected by the galvanizer,unless the purchaser specifies a particular concentration or paint system.Corrosion resistance and service performance are very dependent on the properties of the paint system,the extent of surface prepara-tion,and skills of individual applicators.Annex A2describes the use of paints containing zinc dust.Specification D520 describes the zinc dust component of these paints.4.2.3Sprayed Zinc—This method involves the application of a zinc coating by spraying the surface to be repaired with droplets of molten metal using wire or ribbon,or powder processes.Annex A3describes the use of sprayed zinc.4.3For further information,reference may be made to the papers,procedures,and specifications in Refs.(1)through(4) (see list of references at the end of this practice).5.Keywords5.1coatings—zinc;galvanized coating repair;galvanized coatings;touch-up;zinc coating repair;zinc coatingsANNEXES(Mandatory Information)A1.REPAIR USING ZINC-BASED ALLOYSA1.1Clean the surface to be reconditioned using a wire brush,a light grinding action,or mild blasting.To ensure that a smooth reconditioned coating can be effected,surface prepa-ration shall extend into the surrounding,undamaged galva-nized coating.A1.2If the area to be reconditioned includes welds,first remove all weldflux residue and weld spatter(of a size that cannot be removed by wire brushing or blast cleaning)by mechanical means,such as chipping,grinding,or power scaling,etc.A1.3Preheat the cleaned area to be reconditioned to at least 600°F(315°C).Do not overheat the surface beyond750°F (400°C),nor allow the surrounding galvanized coating to be burned.Wire brush the surface to be reconditioned during preheating.Pre-flux,if necessary.A1.4Rub the cleaned,preheated area with the repair stick to deposit an evenly distributed layer of the zinc alloy.When powdered zinc alloys are used,sprinkle the powder on the cleaned,preheated surface and spread out with a spatula or similar tool.The thickness of the applied coating shall be as agreed upon between the contracting parties.A1.5When the repair has been effected,removeflux residue by rinsing with water or wiping with a damp cloth. A1.6Take thickness measurements with either a magnetic, electromagnetic,or eddy-current gage to ensure that the applied coating is as specified.A2.REPAIR USING PAINTS CONTAINING ZINC DUSTA2.1Preparation of the damaged surface will be influenced by the type of paint selected and the anticipated service conditions.Experience shows that in general,organic zinc-rich systems are tolerant of marginal surface preparation.Most organic paints containing zinc dust are not critical of climatic or atmospheric conditions for curing.The following general guidelines shall apply:A2.1.1Surfaces to be reconditioned with paints containing zinc dust shall be clean,dry,and free of oil,grease,preexisting paint,and corrosion by-products.A2.1.2Where anticipated,field service conditions include immersion,blast clean the surface in accordance with SSPC-SP10/NACE No.2near white metal.For less criticalfield exposure conditions,clean the surface to bare metal,in accordance with SSPC-SP11,as a minimum.Where circum-stances do not allow blast or power tool cleaning,it is permissible to hand tool areas clean in accordance with SSPC-SP2.To ensure that a smooth reconditioned coatingcanbe effected,surface preparation shall extend into the undam-aged galvanized coating.The method and extent of surface preparation shall be mutually agreeable to the contracting parties.A2.1.3If the area to be reconditioned includes welds,first remove all weld flux residue and weld spatter (of a size that cannot be removed by wire brushing or blast cleaning)by mechanical means,such as chipping,grinding,or power scaling,etc.A2.1.4Spray or brush-apply the paints containing zinc dust to the prepared area.Apply the paint as in accordance with themanufacturer’s printed instructions in a single application employing multiple passes to achieve a dry film thickness to be agreed upon between the contracting parties.Allow adequate curing time before subjecting repaired items to service condi-tions in accordance with the manufacturer’s printed instruc-tions.A2.1.5Take thickness measurements with either a mag-netic,electromagnetic,or eddy-current gage to ensure that the applied coating is as specified in accordance with SSPC-PA2.A3.REPAIR USING SPRAYED ZINC (METALLIZING)A3.1Surfaces to be reconditioned by zinc metallizing shall be clean,dry and free of oil,grease,and corrosion products.A3.2If the area to be reconditioned includes welds,first remove all flux residue and weld spatter of a size or type that cannot be removed by blast cleaning by mechanical means,that is,chipping,etc.A3.3Blast clean the surface to be reconditioned in accor-dance with SSPC-SP5/NACE No.1,white metal.A3.4To ensure that a smooth reconditioned coating can be effected,surface preparation shall be extended into the sur-rounding undamaged galvanized coating.A3.5Apply the coating to the clean and dry surface bymeans of metal-spraying pistols fed with either zinc wire or zinc powder.Apply the sprayed coating as soon as possible after surface preparation and before visible deterioration of the surface has occurred.A3.6The surface of the sprayed coating shall be of uniform texture,free of lumps,coarse areas,and loosely adherent particles.A3.7The nominal thickness of the sprayed zinc coating shall be previously agreed upon between the contracting parties.A3.8Take thickness measurements with either a magnetic,electromagnetic,or eddy-current gage to ensure that the applied coating is as specified.REFERENCES(1)Van Eijnsbergen,J.F.H.,et al,“Reconditioning Damaged Galvanized Surfaces,’’6th International Conference on Hot Dip Galvanizing,Interlaken,June 1961,pp.128–141.(2)SSPC-Paint-20,“Zinc Rich Coatings,Type I Inorganic,Type II Organic,’’Steel Structures Painting Council,4400Fifth Ave.,Pitts-burgh,PA 15213,1979.(3)MIL-P-21035(Ships),Military Specification,“Paint,High Zinc Dust Content,Galvanizing Repair,’’Amendment 1,ernment Printing Office,Washington,DC,1970.(4)“Recommended Practices for Fused Thermal Sprayed Deposits,’’American Welding Society,Inc.,550N.W.LeJeune Rd.,Miami,FL 33135,1975.SUMMARY OF CHANGESCommittee A05has identified the location of selected changes to this standard since the last issue (A 780–01(2006))that may impact the use of this standard.(May 1,2009)(1)Revised 1.4and changed designation to make standard applicable in bothunits.ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentioned in this ers of this standard are expressly advised that determination of the validity of any such patent rights,and the risk of infringement of such rights,are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed everyfive years and if not revised,either reapproved or withdrawn.Your comments are invited either for revision of this standard or for additional standards and should be addressed to ASTM International Headquarters.Your comments will receive careful consideration at a meeting of the responsible technical committee,which you may attend.If you feel that your comments have not received a fair hearing you should make your views known to the ASTM Committee on Standards,at the address shown below.This standard is copyrighted by ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA19428-2959, United States.Individual reprints(single or multiple copies)of this standard may be obtained by contacting ASTM at the above address or at610-832-9585(phone),610-832-9555(fax),or service@(e-mail);or through the ASTM website ().。

氟橡胶热缩管介绍由氟橡胶和高分子弹性体经辐射改性制成，可长期在高温下使用，耐柴油、航空燃油、耐高温流体。

可用于军工车辆、高铁动车、舰船设备或商用线缆终端、分离结合处等的防护。

特点耐油耐溶剂高阻燃、柔软富有弹性收缩温度：90℃～170℃使用温度：-65℃～200℃热缩倍率：2:1环保标准：RoHS标准颜色：黑色技术指标性能指标测试方法/条件拉伸强度≥8.2MPa ASTM D 638断裂伸长率≥250% ASTM D 638热老化后断裂伸长率≥200% 250℃×168h阻燃性15秒内自熄ASTM D 2671纵向收缩率-10%～+10% ASTM D 2671热冲击无裂纹、无滴落300℃×4h击穿强度≥7.9kV/mm ASTM D 2671体积电阻率≥109Ω.cm ASTM D 876结构示意图规格表全缩后尺寸（mm）标准包装规格供货内径D(mm)内径d 壁厚w (米/盘) Φ2.4 ≥2.4 ≤1.2 0.51±0.08 200Φ3.2 ≥3.2 ≤1.6 0.76±0.13 100 Φ4.8 ≥4.8 ≤2.4 0.89±0.18 50 Φ6.4 ≥6.4 ≤3.2 0.89±0.18 50 Φ9.5 ≥9.5 ≤4.8 0.89±0.18 50 Φ12.7 ≥12.7 ≤6.4 0.89±0.18 50 Φ19.1 ≥19.1 ≤9.5 1.07±0.21 30 Φ25.4 ≥25.4 ≤12.7 1.25±0.30 30 Φ38.1 ≥38.1 ≤19.1 1.40±0.38 30 Φ50.8 ≥50.8 ≤25.4 1.65±0.43 30 注：可按要求订制特殊尺寸及包装。

笔记本电池充电接口定义问题最简单使用后背接口，只要连接4根线：电源、地线、SCL、SDA（笔记本电池接口处的“电池连接”认证脚2和1脚要连好，SCL、SDA是I2C总线的两根线）。

连接了这些线以后，笔记本即可与电池通讯、充电、放电、正常使用。

A230电池接口详细解释：1：地线2：电池连接确认脚此脚功能是告诉主机，电池连接上了。

方法是将2脚连接到1脚，笔记本就知道电池已经连上。

SDA（DATA，或作D）此脚是I2C总线的数据线。

4：SCL（CLOCK，或作C）7关于第5脚，测量了一下笔记本这端接口第5脚的确是接地。

但电池这端的第5脚测起来却有10V电压。

估计是电池下拉端口，告诉电池已经连接到笔记本，还有电池端的第6脚也有5V电压。

估计电池本身对保护板也有供电。

或者是充电状态指示电平。

[同意下拉的说法，如果接地了，不应该是充电状态指示电平吧？6：+5V:如果电池连接到了主机，主机会将稳压后的正5伏输出一路给电池保护电路使用，此路电流很小，只够电池保护板使用。

不同的笔记本电池设计的不一样，供给电池保护电路的+5V一般有三种：第一种是5V稳压电路在电池内，这是比较常见的设计，带检电钮和电量指示灯的一般是这种；第二种是电池供电给主机，主机将稳压后的5V再输出给电池，A230就属于这一种；第三种是电池保护电路在笔记本电脑主机中，电池内部只有一个I2C的EEPROM，还有温度等传感器传输到主机，电池内没有保护电路和大功率开关管。

7：空脚!8：电池电源脚此脚连接电池输出与主机，充、放电均通过此接口。

笔记本电池接口定义,通讯问题电源正负极pins,通讯pin,id识别pin,控制pin等等你如果是用BQ2060做的,是双线通讯协议,一般来说,接口PIN以下几脚是必须有的:1.PACK+(电池的输出正极)2.PACK-(电池的输出负极)3.SDA(系统数据)4.SCL(系统时钟)还有一些根据不同的电池是可选的,如NTC(热敏电阻)ID(识别电阻端子)一般来说,每个型号的电池接口定义是不一样的,但相同品牌电脑电池的接口基本是类似的,并且接口定义顺序也大概相同.xx100笔记本电池接口定义xx100笔记本电池接口定义:电池接口向上,从电池腹面由左往右分别为GND,SMBC,SMBD,TH,B/I,ID,B+拆下电池测量只有GND与B/I接口有5V电压,接通GND与B/I接口,测量GND与B+能得到电池电压!SMBC,SMBD分别为与笔记本数据通讯的时钟和数据引脚,TH为电池温度引脚,ID本人还未搞懂是什么用途,从充电到放电和待机都没发现有什么电压变化.同型号的电池接口都不一样,但总的来说都包含:正负级,SMData,SMClk,Ts,等]使用现成的专用芯片,如最流行的BQ系列芯片:BQ2060A,BQ2083,BQ2085,BQ204，有的电池将充电部分做到电池里面去了,如COMPAQ笔记本电脑的不少电池都是如此.xx笔记本电池!!!笔记本电池通通通!!!笔者因主持研发笔记本电池测试系统(即所谓的电池老化柜),感觉在学习和实践中都走了弯路,浪费了不少时间和精力,故此想写点什么,也许可以帮助后来者省却一点弯路.第一个误区是直奔锂电池原理.实际上很少有将原理讲得透彻的资料,即使将清楚了,初学者也大都看不透彻.那么,先想想什么好呢?一块电池,根本作用还是给电脑供电.所以最基本的想法是将一节的电芯(cell)串在一起,就象将几节电池串在一起给手电筒供电一样,确实,笔记本电池里就是将几节电池串在一起的.当然,要是如此简单就没有什么好说的了.现在的笔记本电池都是所谓智能(smartbattery)的了,她能告诉电脑:我现在还剩余多少容量,现在的电压是多少,电流是多少,按现在的放电速率我还能用多长时间,我是否该充电了,充电应该用多大的电流、电压,充电是否充过头了,放电是否放过头了,温度是否过高,等等.电池要提供这些所谓的智能信息,就要在电池中增加一个电路.这个电路通常都使用现成的专用芯片,如最流行的BQ系列芯片:BQ2060A,BQ2083,BQ2085,BQ2040等,这些芯片检测流入和流出电芯的电流,算出上面所谓的智能信息.这个电路还要增加一个功能:保护功能.上面说了电路能检测出充电是否充过头了,放电是否放过头了.既然知道充过头了,就要使充电电源充不到电芯上去;放电放过头了,就要切断电芯对外放电.温度过高了,就要是电池停下来.这就是所谓的保护功能.最后一个功能就是通讯,电池准备了这些信息,总要发送出去吧.所以通讯少不了.按上所说,通常的电池其实主要是检测部分,能检测出来信息,保护功能实现自然简单,无非是开关而已.当然有的电池将充电部分做到电池里面去了,如COMPAQ笔记本电脑的不少电池都是如此.所以,初学者可以先学习具体的电池检测芯片,如BQ2060A,(注意,不要从BQ2050开始,理解了BQ2060A,回过头来才好理解BQ2050.")先不必看BQ2060是如何检测那些智能信息的,先看BQ2060都检测出了哪些信息?这些检测出来的信息存放在什么地方了?在BQ2060的DATASHEET中,有个Table3."bq2060Registerfunctions,这里存放了BQ2060检测出来智能信息的.这些信息就是所谓的SmartBatteryData(智能电池数据),它们都被定义成标准了(见SmartBatteryDataSpecfication).BQ2050中检测出来的信息没有这么丰富,它不符合这个标准.BQ2040,BQ2083,BQ2085都符合这个标准,检测出来的信息也是这些.下面解释一下BQ2060检测出来信息的意思.1、静态信息:静态信息不是检测出来的,而是生产厂家自己写进去的,它一般写在24C01中,BQ2060从24C01中读到它自己里面去.ManufactureDate,ManufactureName,DeviceName,Devicechemistry,Specificatio nInfo,DesignVoltage,DesignCapacity,RemaingCapacityAlarm, RemaingTimeAlarm, BatteryMode.这些信息不言自明.2、"动态信息:动态信息中有些是检测出来的,有些是纯粹计算出来的,目的就是免去用户自己计算了.检测的:Voltage,Current,Temperature,AverageCurrent,RemaingCapacity,FullChargeCapa city,BatteryStatus.计算的:RelativeStateOfCharge,AbsoluteStateOfCharge,RunTimeToEmpty,AverageTimeT oEmpty,AverageTimeToFull,CycleCount..信息ChargingVoltage,ChargingCurrent告诉充电器应该用多大的充电电流给它充电,在多大的电压处应该变成恒压充电.AtRate, AtRateTimeToFull, AtRateTimeToEmpty, AtRateOK纯粹是帮用户计算信息用的.3、每个厂家的特定信息:标准SmartBattery Data Specfication之外的一些信息.这些信息只有5项,不同厂家不一样,对于BQ2060就是VCELL1-4和PackConfigureation.对于BQ2085,PackConfigureation的意义就和BQ2060不大一样.4、ManufactureAccess,标准SmartBatteryDataSpecfication之外,厂家特定的操作,如BQ2060的Seal,读写EEPROM,Calibration等,都是通过它来完成的.具体每一项信息的意义论坛中有人翻译了BQ2060的DATASHEET,在此不在重复.BQ2060是如何检测那些智能信息的呢?简单地说,将是将一个电阻串接到电芯上,检测流过这个电阻上的电流的大小就可以知道充了多少电,放了多少电.充电充的是电荷、放电放的也是电荷,所以检测电流就知道充了多少电,放了多少电.至于电压、温度的检测更简单了,用的A/D转换就可以,BQ2060中就是这样做的.BQ2060检测到信息后就要作出一些判断,如温度是否高了,我是否该充电了,充电应该用多大的电流、电压,充电是否充过头了,放电是否放过头了.电池无论如何也不知道多高温度属于高了,多大电流是过流了,所以,人为地先设定个标准,这样电池就可以判断了.这些标准生产厂家就放在24C01中,BQ2083,BQ2085放在它们自身的DATAFLASH中了.而BQ2050则是死设定,厂家智能用外围的电阻,电容等硬件设定,它不用EEPROM或DATA FLASH,比较死板.(其实BQ2050的功能简单多了,好多判断都没有.)检测到异常情况,BQ2060就可简单地向外发个出发电平,以关断充电或放电开关,这样保护功能就简单地实现了.实际上,大都用BQ2060的电池没有使用BQ2060提供的保护功能,而是另外加了芯片做保护,如M14."另加的芯片和BQ2060自然有些功能是重复的,但没办法,谁让另加芯片了呢.下面就是通讯方式问题,SMBUS其实就是I2C的子集,主要是时序上比I2C要求严格些.若你不写程序,简单地将SMBUS混同I2C就可以了.当你看懂了BQ2060,不要以为所有的电量检测芯片都是如此,BQ2060是与标准Smart Battery Data Specfication兼容的芯片,即所谓的SBSV1."1-Campliant,其实BQ2050就不兼容这个标准.BQ2050提供的信息少了不少,通讯方式也不同(DQ).COMPAQ Evo系列电脑的电池就是采用BQ2050H的,所以要增加PIC来增加一些功能.(当然里面还有充电功能.)还有比较流行的芯片是M37516 + 4494,这个方案比较原始,M37516就是个通用的MCU,其实用PIC、AVR等好多MCU都可以代替,它的特点就是有A/D,PWM,I2C接口.在M37516中写程序,实现BQ2060的功能,自然就可以不用BQ2060了.当然用M37516写程序来实现肯定没有使用专用芯片简单.使用M37516的电池可以是SBS V1."1-Campliant,也可以不是的.很多电池既使用了PIC,又使用了BQ2060,或BQ20等,这多数是厂家故弄玄虚.如果它也是使用SMBUS接口,很可以省掉PIC的.还有个电池解密问题,即unseal问题,BQ2060因为外接EEPROM,所以unseal 总是能实现的,虽然比较麻烦,但总是可以的,而BQ则几乎不可能,除非你知道厂家设置的unseal密码,否则,写程序用枚举方法解密一块电池要小一年时间.很多OEM电池厂家都想将就电池改写数据就以就充新地买.还有电池检测(老化)问题.检测设备有检测电芯级的,有检测电池板级的.经过前者检测出来的电池即使是合格的,但实际上电池也可能是不合格的,因为电板可能有问题而没有被检测出来.而经过后者检测出合格的电池,才是真正合格的电池.大多数电池不用时你也可以直接在电池接口处测量到电压,而有的电池不接到电脑上你是测量不到电压,即所谓的电池没有打开,如COMPAQ Evo系列.在此解释一下Capacity Relearn.其实电池的relearn-cycle或Conditioning-cycle都是充放电过程,Calibration就是充放电过程.这个过程如下:1、"先将电池充满.2、放电放完(这个过程中不能有充电)3、再充满电.CapacityRelearn就是重新确定FCC.因为在过程1的结束,BQ2060将DCR`复位为0,在过程2中DCR从0开始不断增加,当放电结束时,用DCR更新FCC.在BQ2060的DATASHEEET中将这个过程说得比较难懂,而BQ2050中说得比较清楚.下次再聊聊笔记本电池的充电问题.免费提供ATMEGA406笔记本电池方案,可以用在山寨笔记本和各品牌的替代电池,同时解决IBM、dell带数字认证的问题!!!需要请联系:笔记本电池接口上的:C,D,S.P是啥意思+,-是电池输出的正极与负极, D是数据线,C是时钟线,T是有一电阻与-连接.松下笔记本电池采用三菱M37516的方案.很多公司采用BQ系列方案基本功能：具有过充、过放、过流、过温、休眠和通迅协议等功能。

Application ReportSLUA304 - January 2004 bq2083 and bq2085 Board Offset Characterization andCompensationPortable Power Products/Battery ManagementABSTRACTThe bq208x (bq2083, bq2084, and bq2085) products are high-precision advanced gasgauge products for battery monitoring and management. Because the current signal ismeasured through a small sense resistor (< 20 mΩ) to minimize power loss, compensationfor the ADC input offset is critical for the accuracy of the measurement. This application notediscusses common issues associated with board offset characterization, data analysis, anddata flash configuration. The article uses bench data in the step by step description. Layoutguidelines for low board offset are discussed at the end of the article.1The Need for Board Offset CompensationThe sigma delta ADC of bq208x, used as a coulomb counter (CC), integrates battery current to report important battery status, such as remaining capacity, state of charge, current, and learned full capacity. The current signal is small due to the small sense resistor used in series withbatteries. For example, 10-mA current produces only 100 µV across a 10-mΩ sense resistor.Therefore, offset (internal and external) to the IC all need to be calibrated and compensated.Failure to compensate offset can result in an inaccurate current and battery capacity report. For example, gas gauge (GG) can falsely report current and capacity change (more thanself-discharge) when the battery pack is removed from the system or has no load attached.The bq208x automatically calibrates internal CC offset each time the device enters the sleepmode. During calibration, bq208x places an internal short across the differential current inputs and measures the CC output. The resulting offset value is saved in the data flash forcompensation. See application note SLVA148 for a detailed description.Board offset is system-level offset, often caused by component mismatch and noise coupling.Like any other offset, board offset varies from system to system and has dependency ontemperature. Board offset needs to be characterized in the product development phase. Thenumber of boards and measurement samples should be of sufficient quantity to adequatelyrepresent the distribution of board offset. Data analysis yields programming values for Digital Filter (DF 0x2C) and Board Offset (DF 0xd7 in bq2084 and DF 0xC6 in bq2083/5).1SLUA3043bq2083 and bq2085 Board Offset Characterization and Compensation VPACKGNDbq2931XVBAT VCCVREGVDDVSS Pack+Pack−Bat+Bat−bq208xFigure 2.Measuring Board Offset With Power on Bat+ and Bat– IntroducesError From IC Operation CurrentVPACKGNDVBAT VCCVREGVDDVSS Pack−Bat+Bat−bq208xPack+bq2931XFigure 3.Powering ICs From Pack+ and Pack– Allows theIC Current to Bypass the Sense ResistorSLUA3044bq2083 and bq2085 Board Offset Characterization and CompensationIt is also recommended to take at least 10 boards for board-offset characterization, and make at least 5 measurement samples on each board. Of course, more samples always yield better data quality. Table 1 is an example of offset collected from bq2083/bq29311 gas gauge board using EVSW. As the data shows, there are variations from board to board, and even on repeated measurements on each board. The average of all the numbers is calculated and programmed into Board Offset data flash location.Table 1.Example of Data From Bench Characterization of Board Offset12345TOTAL AVERAGE112148147551121113−37634 6.837−4−314721 4.24−6−362320.45121680945961617911197214.47111010135499.88103014330692763119 3.810315164134610.2Totalσ6.14TOTAL AVERAGE7.56In addition to the mean value, the standard deviation of the board offset also needs to becalculated to cover the variance of the offset. Standard deviation (σ) is a statistic measurement of how spread out the distribution is. It is defined as s 2+S (x *m )2nwhere µ is the mean and n is the number of samples. Microsoft Excel uses function stdev() to calculate standard deviation. Input all the numbers into this function.Digital Filter, also referred to as Deadband , is a programmable parameter in bq208x to prevent false signal detection with no charge or discharge current through the sense resistor. Gas gauge does not measure charge or discharge counts below this threshold. This threshold needs to be selected based on the standard deviation of the board offset. So, how do we link the standard deviation to the program value of Digital Filter ?Typically, offset distribution can be described as Gaussian distribution, shown in Figure 4. The Y axis represents the probability density function, and x is the offset measurement with meannormalized to 0. The peak value of the distribution occurs when X = mean value. It is also shown that the probability of the offset having values in a certain range is just equal to the area under the curve of Figure 4 in that range. Our interest is how to program the Digital Filter threshold so that the probability of having offset outside the range is statistically small. Table 2 provides the area outside the number of σ. For example, if the Digital Filter uses 6x σ, the probability of counting capacity due to board offset is equal to 4.3 ppm. The adopted industry-wide standard for quality control is 6σ and therefore is recommended in this case. Using the data in Table 1 as an example, the Digital Filter = 6.14 x 0.584 µV x 6 = 21.5 µV.SLUA3045bq2083 and bq2085 Board Offset Characterization and Compensation For current reporting, bq2083/5 has a fixed 3-mA deadband, while bq2084 has a programmable data flash location Current Deadband (DF 0x7b). To avoid reporting current when there is no load, the 6σ value divided by the sense resistor needs to be less than the current deadband. For a 10−m Ω sense resistor, the 6σ needs to be less than 30 µV.−3s −2s−s0s2s3sX.00135.0214.1359.3413.3413.1359.0214.00135f g (X)Gaussian or “Normal”DistributionFigure 4.Gaussian Distribution FunctionTable 2.Area Outside +K σ Represents the Probability of |x| Greater than K σK AREA OUTSIDE +K s10.31720.04630.00364.3ppm3Layout to Minimize Board OffsetPCB layout plays a critical role in reducing board offset and its variants. The most important component is the decoupling capacitor on Vdda/Vssa. As shown in Table 3, removing the Vdda capacitor increases the offset mean by 5 times, and standard deviation by almost 3 times.Although it may be the worst case scenario, bad component selection and/or bad layout can make the capacitor disappear from the circuit for high-frequency noise. To make the decoupling capacitor effective, the ESR (equivalent series resistor) and ESL (equivalent series inductance)need to be small. Ceramic capacitors usually meet this requirement. For high-frequency noise, it is beneficial to parallel a small capacitor, such as 68 pF, with a large-value capacitor like 0.1 µF,since a small-value capacitor has better high-frequency performance. On the layout side, the designer usually pays greater attention to shorting the trace between the decoupling capacitor and Vdd. The connection between the capacitor and Vss is often neglected, although it is equally important, and needs to follow the same guidelines. The bottom line is that ac impedance between the Vdds and Vssa needs to be minimized in order to reduce noise coupling.SLUA3046bq2083 and bq2085 Board Offset Characterization and CompensationTable 3.Removing the Decoupling Capacitor Increases the Board Offset and its VarianceEVM 12345678910Mean Board #19891110987888.78Board #24473856894 6.00Mean7.25σ6.38Vdda cap removed 12345678910Mean Board #1−28−34−26−32−37−30−32−30−33−27−30.9Board #2−40−43−42−30−37−41−24−36−45−44−38.2Mean−34.55σ6.38The routing between the current sense inputs and sense resistor also requires carefulconsideration. The key is to prevent any differential signal coupling into the current sense line.The following guidelines need to be followed.1.Ensure that the current-sense leads to bq208x are good Kelvin connections.2.Keep the three current-sense decoupling capacitors (C16, C18, and C23 in Figure 5) arevery close to bq208x.3.If the current-sense leads are long, ensure that the 100-Ω resistors (R20 and R21 inFigure 5) are near the IC in a symmetrical pattern with the three capacitors.4.Route the signals from the sense resistor as a differential pair. Use the same length andnumber of vias for each line.To SR1R130.020 W 1 WSense ResistorC160.1 m FR20100 WR21100 WC180.1 m FC200.1 m FC230.1 m FTo SR2Figure 5.Recommended Decoupling Circuit for Current Sense Lines4ConclusionBoard offset is a common issue in gas gauge design. However, bq208x products provideautomatic compensation for its effect, and the value can be programmed for individual design.The bench characterization can yield reliable data for the data flash program. A thoughtful layout provides an even further preventive measure in minimizing the board offset. If the offset still remains an issue, consider checking the CC offset and ADC offset calibration procedure,covered in application note SLVA148.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. 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版权所有© 2009上海艾为电子技术有限公司I 2C 接口，4线电阻式触摸屏控制器特性y 4线电阻式触摸屏控制器 y I 2C 接口：标准模式（100kHz），快速模式（400kHz） y 压力检测y 可编程8bit 或12bit 精度 y 工作电压：2.5V～3.6V y ESD 保护：±8KV(HBM) yMSOP-10L 封装应用y 手机 y MP3/PMP y GPSy数码相框概要AW2083是一款支持I 2C 接口的4线电阻式触摸屏控制器。

芯片内置12位SAR ADC，用户可以通过寄存器设置来选择8bit 或12bit 精度。

AW2083集成驱动阻性触摸屏的低导通电阻开关。

AW2083采用MSOP-10L 封装，额定的工作范围为-40℃至+85℃。

引脚分布及标识图Y+X-X+3PENIRQN CAD0SDA VDD GND1245810976Y-SCL AW2083AW2083 俯视图（MSOP-10L ）AW2083XY器件标识（MSOP-10L ）AW2083-AW2083MPR XY-生产跟踪码图 1 AW2083引脚分布俯视图版权所有© 2009上海艾为电子技术有限公司典型应用图VIO图 2 AW2083应用图订购信息产品型号 工作温度范围 封装形式 器件标识 发货形式 AW2083MPR-40℃～85℃MSOP-10L AW2083卷带包装 3000 片/盘绝对最大额定值(注1)参数 描述电源电压VDD -0.3V to 3.6V 最大功耗（PDmax，package@ T A=40℃） 610mW封装热阻θJA180℃/W环境温度 -40℃ to 85℃ 最大结温T JMAX150℃存储温度T STG-65℃ to 150℃ 引脚温度（焊接10秒） 260℃ESD范围（注2）HBM（人体静电模式） ±8KVLatch-up测试标准：JEDEC STANDARD NO.78B DECEMBER 2008 +IT：500mA -IT：-500mA注1:如果器件工作条件超过上述各项极限值，可能对器件造成永久性损坏。

1INTRODUCTION1.1FEATURES1.2APPLICATIONS1.3DESCRIPTION•Battery Fuel Gauge for 1-Series Li-Ion •Smartphones Applications•PDAs•Resides on System Main Board•Digital Still and Video Cameras –Works With Embedded or Removable •Handheld TerminalsBattery Packs •MP3or Multimedia Players•Two Varieties–bq27500:Uses PACK+,PACK–,and T Battery Terminals–bq27501:Works With Battery ID Resistor in Battery PackThe Texas Instruments bq27500/01system-side Li-Ion battery fuel gauge is a microcontroller •Microcontroller Peripheral Provides:peripheral that provides fuel gauging for single-cell –Accurate Battery Fuel GaugingLi-Ion battery packs.The device requires little system –Internal Temperature Sensor for System microcontroller firmware development.The Temperature Reportingbq27500/01resides on the system main board,and –Battery Low Interrupt Warning manages an embedded battery (non-removable)or a –Battery Insertion Indicator removable battery pack.–Battery ID Detection–96Bytes of Non-Volatile Scratch-Pad The bq27500/01uses the patented Impedance FLASHTrack™algorithm for fuel gauging,and provides information such as remaining battery capacity •Battery Fuel Gauge Based on Patented (mAh),state-of-charge (%),run-time to empty (min.),Impedance Track™Technologybattery voltage (mV),and temperature (°C).–Models the Battery Discharge Curve for Accurate Time-to-Empty Predictions Battery fuel gauging with the bq27500requires only –Automatically Adjusts for Battery Aging,PACK+(P+),PACK–(P–),and Thermistor (T)Battery Self-Discharge,andconnections to a removable battery pack or Temperature/Rate Inefficienciesembedded battery.The bq27501works with –Low-Value Sense Resistor (10m Ωor Less)identification resistors in battery packs to gauge •I 2C™Interface for Connection to System batteries of different fundamental chemistries and/or Microcontroller Portsignificantly different rated capacities.•12-Pin 2,5-mm ×4-mm SON PackageTYPICAL APPLICATIONPlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.Impedance Track is a trademark of Texas Instruments.I 2C is a trademark of Philips Electronics.PRODUCTION DATA information is current as of publication date.Copyright ©2007–2008,Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas Instruments standard warranty.Production processing does not necessarily include testing of all parameters.Contents1INTRODUCTION..........................................4.1DATA COMMANDS..................................1.1FEATURES........................................... 4.2DATA FLASH INTERFACE.........................1.2APPLICATIONS...................................... 4.3MANUFACTURER INFORMATION BLOCKS......1.3DESCRIPTION....................................... 4.4ACCESS MODES...................................2DEVICE INFORMATION.................................4.5SEALING/UNSEALING DATA FLASH..............2.1AVAILABLE OPTIONS............................... 4.6DATA FLASH SUMMARY...........................2.2PIN DIAGRAMS......................................5FUNCTIONAL DESCRIPTION........................2.3TERMINAL FUNCTIONS............................. 5.1FUEL GAUGING....................................3ELECTRICAL SPECIFICATIONS......................5.2IMPEDANCE TRACK™VARIABLES...............3.1ABSOLUTE MAXIMUM RATINGS................... 5.3DETAILED DESCRIPTION OF DEDICATED PINS.3.2RECOMMENDED OPERATING CONDITIONS...... 5.4TEMPERATURE MEASUREMENT.................3.3DISSIPATION RATINGS............................. 5.5OVERTEMPERATURE INDICATION...............5.6CHARGING AND CHARGE-TERMINATION3.4POWER-ON RESET..................................INDICATION.........................................3.5INTERNAL TEMPERATURE SENSORCHARACTERISTICS................................. 5.7POWER MODES....................................3.6HIGH-FREQUENCY OSCILLATOR.................. 5.8POWER CONTROL.................................3.7LOW-FREQUENCY OSCILLATOR.................. 5.9AUTOCALIBRATION................................3.8INTEGRATING ADC(COULOMB COUNTER)6APPLICATION-SPECIFIC INFORMATION..........CHARACTERISTICS.................................6.1BATTERY PROFILE STORAGE AND SELECTION3.9ADC(TEMPERATURE AND CELL6.2APPLICATION-SPECIFIC FLOW AND CONTROL.MEASUREMENT)CHARACTERISTICS.............7COMMUNICATIONS3.10DATA FLASH MEMORY CHARACTERISTICS...................................................................3.11I2C-COMPATIBLE INTERFACE COMMUNICATION7.1I2C INTERFACE.....................................TIMING CHARACTERISTICS........................8REFERENCE SCHEMATICS..........................4GENERAL DESCRIPTION..............................8.1SCHEMATIC........................................2Contents Submit Documentation Feedback2DEVICE INFORMATION2.1AVAILABLE OPTIONS2.2PIN DIAGRAMSBAT V SSSRN SRPV CC BAT_GD SDA SCLBAT_LOW TSBI/TOUTBAT V SSV CC BAT_LOW TS BI/TOUTNCSRN SRPBAT_GD SDA SCLRID 2.3TERMINAL FUNCTIONSTAPE and FIRMWARE COMMUNICATIONPART NUMBER PACKAGE (2)T AREEL VERSION (1)FORMATQUANTITY bq27500DRZR 3000V1.06bq27500DRZT 250bq27500DRZR-V100300012-pin,2,5-mm ×4-mmV1.08–40°C to 85°CI 2CSONbq27500DRZT-V100250bq27501DRZR 3000V1.08bq27501DRZT250(1)Ordering the device with the latest firmware version is recommended.To check the fiirmware revision and Errata list see SLUZ015(2)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI website at .TERMINALTYPE (1)DESCRIPTIONbq27500bq27501NAME PIN NO.PIN NO.BAT 44I Cell-voltage measurement input.ADC inputBattery-good indicator.Active-low by default,though polarity can be configured through BAT_GD 1212O the [BATG_POL]of Operation Configuration .Open-drain outputBattery-low output indicator.Active-high by default,though polarity can be configured BAT_LOW 11O through the [BATL_POL]in Operation Configuration .Push-pull outputBattery-insertion detection input.Power pin for pack thermistor network.ThermistorBI/TOUT 22I/O multiplexer control pin.Open-drain I/e with pullup resistor >1M Ω(1.8M Ωtypical).NC 9––No connection (bq27500)RID –9I Resistor ID input (bq27501).Analog input with current sourcing capabilitiesSlave I 2C serial communications clock input line for communication with system (master).SCL 1111I Open-drain I/e with 10-k Ωpullup resistor (typical).Slave I 2C serial communications data line for communication with system (master).SDA 1010I/O Open-drain I/e with 10-k Ωpullup resistor (typical).Analog input pin connected to the internal coulomb counter where SRN is nearest the SRN 88IA System V SS connection.Connect to 5-m Ωto 20-m Ωsense resistor.Analog input pin connected to the internal coulomb counter,where SRP is nearest the SRP 77IA PACK–connection.Connect to 5-m Ωto 20-m Ωsense resistor.TS 33IA Pack thermistor voltage sense (use 103AT-type thermistor).ADC input V CC 55P Processor power input.Decouple with 0.1-µF capacitor,minimum.Device ground.Electrically connected to the IC exposed thermal pad (do not use thermal V SS 66Ppad as primary ground.Connect thermal pad to Vss via a PCB trace).(1)I =Digital input,O =Digital output,I/O =Digital input/output,IA =Analog input,P =Power connectionSubmit Documentation Feedback DEVICE INFORMATION 33ELECTRICAL SPECIFICATIONS3.1ABSOLUTE MAXIMUM RATINGS3.2RECOMMENDED OPERATING CONDITIONSover operating free-air temperature range (unless otherwise noted)(1)PARAMETERVALUE UNIT V CC Supply voltage range–0.3to 2.75V V IOD Open-drain I/O pins (BI/TOUT,SDA,SDL,BAT_GD)–0.3to 6VV BAT BAT input pin–0.3to 6V I Input voltage range to all other pins (TS,SRP,SRN,RID [bq27501only],NC –0.3to V CC +0.3V [bq27500only])Human-body model (HBM),BAT pin 1.5ESD kV Human-body model (HBM),all other pins 2T A Operating free-air temperature range –40to 85°C T F Functional temperature range –40to 100°C T stg Storage temperature range–65to 150°C(1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.T A =25°C,V CC =2.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYP MAX UNIT V CC Supply voltage2.42.5 2.6V Fuel gauge in NORMAL mode.I CC Normal operating-mode current 100µA I LOAD >Sleep Current Fuel gauge in SLEEP mode.I SLP Low-power storage-mode current 15µA I LOAD <Sleep CurrentFuel gauge in HIBERNATE mode.I HIB Hibernate operating-mode current 1µA I LOAD <Hibernate Current V OL Output voltage,low (SDA,BAT_LOW,I OL =0.5mA 0.4V BI/TOUT)V OH(PP)Output voltage,high (BAT_LOW)I OH =–1mAV CC –0.5V External pullup resistor connected to V OH(OD)Output voltage,high (SDA,SCL,BI/TOUT)V CC –0.5VV CCInput voltage,low (SDA,SCL)–0.30.6V IL Input voltage,low (BI/TOUT)BAT INSERT CHECK MODE active –0.30.6VInput voltage,high (SDA,SCL) 1.26V IH(OD)Input voltage,high (BI/TOUT)BAT INSERT CHECK MODE active1.26C IN Input capacitance (SDA,SCL,BI/TOUT)35pF V A1Input voltage range (TS,RID [bq27501only])V SS –0.1252V V A2Input voltage range (BAT)V SS –0.1255V V A3Input voltage range (SRP,SRN)V SS –0.1250.125V t PUCDPower-up communication delay250ms ELECTRICAL SPECIFICATIONS 4Submit Documentation Feedback3.3DISSIPATION RATINGS3.4POWER-ON RESET3.5INTERNAL TEMPERATURE SENSOR CHARACTERISTICS3.6HIGH-FREQUENCY OSCILLATOR3.7LOW-FREQUENCY OSCILLATORT A ≤40°C DERATING FACTORPACKAGE R θJA POWER RATINGT A >40°C12-pin DRZ (1)482mW5.67mW/°C176°C/W(1)This data is based on using a four-layer JEDEC high-K board with the exposed die pad connected to a Cu pad on the board.The board pad is connected to the ground plane by a 2-×2-via matrix.T A =–40°C to 85°C,typical values at T A =25°C and V BAT =3.6V (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYP MAX UNIT V IT+Positive-going battery voltage input at V CC 2.09 2.2 2.31V V HYSHysteresis voltage45115185mVT A =–40°C to 85°C,2.4V <V CC <2.6V;typical values at T A =25°C and V CC =2.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMINTYP MAXUNIT G TEMPTemperature sensor voltage gain–2mV/°CT A =–40°C to 85°C,2.4V <V CC <2.6V;typical values at T A =25°C and V CC =2.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMINTYP MAXUNIT f OSC Operating frequency 2.097MHzT A =0°C to 60°C–2%0.38%2%f EIO Frequency error (1)(2)T A =–20°C to 70°C –3%0.38%3%T A =–40°C to 85°C–4.5%0.38%4.5%t SXO Start-up time (3)2.55ms(1)The frequency error is measured from 2.097MHz.(2)The frequency drift is included and measured from the trimmed frequency at V CC =2.5V,T A =25°C.(3)The start-up time is defined as the time it takes for the oscillator output frequency to be within ±3%of typical oscillator frequency.T A =–40°C to 85°C,2.4V <V CC <2.6V;typical values at T A =25°C and V CC =2.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYP MAXUNIT f LOSC Operating frequency 32.768kHzT A =0°C to 60°C–1.5%0.25% 1.5%f LEIO Frequency error (1)(2)T A =–20°C to 70°C –2.5%0.25% 2.5%T A =–40°C to 85°C–4%0.25%4%t LSXO Start-up time(3)500µs(1)The frequency drift is included and measured from the trimmed frequency at V CC =2.5V,T A =25°C.(2)The frequency error is measured from 32.768kHz.(3)The start-up time is defined as the time it takes for the oscillator output frequency to be within ±3%of typical oscillator frequency.Submit Documentation Feedback ELECTRICAL SPECIFICATIONS 53.8INTEGRATING ADC (COULOMB COUNTER)CHARACTERISTICS3.9ADC (TEMPERATURE AND CELL MEASUREMENT)CHARACTERISTICS3.10DATA FLASH MEMORY CHARACTERISTICS3.11I 2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICST A =–40°C to 85°C,2.4V <V CC <2.6V;typical values at T A =25°C and V CC =2.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYPMAX UNIT V SR Input voltage range (V SR =V (SRN)–V (SRP))–0.1250.125V t SR_CONV Conversion time Single conversion1s Resolution 1415bits V SR_OS Input offset10µV INL Integral nonlinearity error ±0.007±0.034%FSR Z SR_IN Effective input resistance (1)2.5M ΩI SR_LKG Input leakage current(1)0.3µA(1)Specified by design.Not tested in production.T A =–40°C to 85°C,2.4V <V CC <2.6V;typical values at T A =25°C and V CC =2.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYPMAXUNIT V ADC_IN Input voltage range –0.21V t ADC_CONV Conversion time 125ms Resolution 1415bits V ADC_OS Input offset1mV Effective input resistance (TS,RID Z ADC18M Ω[bq27501only])(1)bq27500/1not measuring cell voltage 8M ΩZ ADC2Effective input resistance (BAT)(1)bq27500/1measuging cell voltage100k ΩI ADC_LKG Input leakage current (1)0.3µA(1)Specified by design.Not tested in production.T A =–40°C to 85°C,2.4V <V CC <2.6V;typical values at T A =25°C and V CC =2.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMIN TYPMAXUNIT t ONData retention (1)10Years Flash-programming write cycles (1)20,000Cycles t WORDPROG Word programming time (1)2ms I CCPROG Flash-write supply current (1)510mA(1)Specified by design.Not production testedT A =–40°C to 85°C,2.4V <V CC <2.6V;typical values at T A =25°C and V CC =2.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMINTYPMAXUNIT t r SCL/SDA rise time 1µs t f SCL/SDA fall time 300ns t w(H)SCL pulse duration (high)4µs t w(L)SCL pulse duration (low) 4.7µs t su(STA)Setup for repeated start 4.7µs t d(STA)Start to first falling edge of SCL 4µs t su(DAT)Data setup time250nsELECTRICAL SPECIFICATIONS 6Submit Documentation FeedbackI2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS(continued)T A=–40°C to85°C,2.4V<V CC<2.6V;typical values at T A=25°C and V CC=2.5V(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNITReceive mode0t h(DAT)Data hold time nsTransmit mode300t su(STOP)Setup time for stop4µst(BUF)Bus free time between stop and start 4.7µsf SCL Clock frequency10100kHzt BUSERR Bus error time-out17.321.2sFigure3-1.I2C-Compatible Interface Timing DiagramsSubmit Documentation Feedback ELECTRICAL SPECIFICATIONS74GENERAL DESCRIPTIONThe bq27500/1accurately predicts the battery capacity and other operational characteristics of a single Li-based rechargeable cell.It can be interrogated by a system processor to provide cell information,such as state-of-charge(SOC),time-to-empty(TTE)and time-to-full(TTF).Information is accessed through a series of commands,called Standard Commands.Further capabilities are provided by the additional Extended Commands set.Both sets of commands,indicated by the general format Command(),are used to read and write information contained within the bq27500/1control and status registers,as well as its data flash mands are sent from system to gauge using the bq27500/1I2C serial communications engine,and can be executed during application development,pack manufacture,or end-equipment operation.Cell information is stored in the bq27500/1in non-volatile flash memory.Many of these data flash locations are accessible during application development.They cannot be accessed directly during end-equipment operation.Access to these locations is achieved by either use of the bq27500/1 companion evaluation software,through individual commands,or through a sequence of data-flash-access commands.To access a desired data flash location,the correct data flash subclass and offset must be known.The bq27500/1provides96bytes of user-programmable data flash memory,partitioned into three32-byte blocks:Manufacturer Info Block A,Manufacturer Info Block B,and Manufacturer Info Block C.This data space is accessed through a data flash interface.For specifics on accessing the data flash,see Section4.3,Manufacturer Information Blocks.The key to the high-accuracy fuel gauging prediction of the bq27500/1is Texas Instruments'proprietary Impedance Track™algorithm.This algorithm uses cell measurements,characteristics,and properties to create state-of-charge predictions that can achieve less than1%error across a wide variety of operating conditions and over the lifetime of the battery.The bq27500/1measures charge/discharge activity by monitoring the voltage across a small-value series sense resistor(5mΩto20mΩ,typ.)located between the system Vss and the battery PACK–terminal.When a cell is attached to the bq27500/1,cell impedance is computed,based on cell current,cell open-circuit voltage(OCV),and cell voltage under loading conditions.The bq27500/1must use an NTC thermistor Semitec103AT for temperature measurement,or can also be configured to use its internal temperature sensor.The bq27500/1uses temperature to monitor the battery-pack environment,which is used for fuel gauging and cell protection functionality.To minimize power consumption,the bq27500/1has several power modes:NORMAL,SLEEP, HIBERNATE,and BAT INSERT CHECK.The bq27500/1passes automatically between these modes, depending upon the occurrence of specific events,though a system processor can initiate some of these modes directly.More details can be found in Section5.7,Power Modes.NOTEFORMATTING CONVENTIONS IN THIS DOCUMENT:Commands:italics with parentheses and no breaking spaces,e.g.,RemainingCapacity().Data flash:italics,bold,and breaking spaces,e.g.,Design CapacityRegister bits and flags:brackets and italics,e.g.,[TDA]Data flash bits:brackets,italics and bold,e.g.,[LED1]Modes and states:ALL CAPITALS,e.g.,UNSEALED mode.8Submit Documentation Feedback GENERAL DESCRIPTION4.1DATA COMMANDS4.1.1STANDARD DATA COMMANDSThe bq27500/1uses a series of2-byte standard commands to enable system reading and writing of battery information.Each standard command has an associated command-code pair,as indicated in Table4-1.Because each command consists of two bytes of data,two consecutive I2C transmissions must be executed both to initiate the command function,and to read or write the corresponding two bytes of data.Additional options for transferring data,such as spooling,are described in Section7,I2C Interface.Standard commands are accessible in NORMAL operation.Read/write permissions depend on the active access mode,SEALED or UNSEALED(for details on the SEALED and UNSEALED states,see Section4.4,Access Modes).Table4-1.Standard CommandsNAME COMMAND CODE UNITS SEALED ACCESS UNSEALED ACCESS Control()CNTL0x00/0x01N/A R/W R/WAtRate()AR0x02/0x03mA R/W R/W AtRateTimeToEmpty()ARTTE0x04/0x05Minutes R R/W Temperature()TEMP0x06/0x070.1K R R/WVoltage()VOLT0x08/0x09mV R R/WFlags()FLAGS0x0a/0x0b N/A R R/W NominalAvailableCapacity()NAC0x0c/0x0d mAh R R/W FullAvailableCapacity()FAC0x0e/0x0f mAh R R/W RemainingCapacity()RM0x10/0x11mAh R R/W FullChargeCapacity()FCC0x12/0x13mAh R R/W AverageCurrent()AI0x14/0x15mA R R/W TimeToEmpty()TTE0x16/0x17Minutes R R/W TimeToFull()TTF0x18/0x19Minutes R R/W StandbyCurrent()SI0x1a/0x1b mA R R/W StandbyTimeToEmpty()STTE0x1c/0x1d Minutes R R/W MaxLoadCurrent()MLI0x1e/0x1f mA R R/W MaxLoadTimeToEmpty()MLTTE0x20/0x21Minutes R R/W AvailableEnergy()AE0x22/0x23mWh R R/W AveragePower()AP0x24/0x25mW R R/W TimeToEmptyAtConstantPower()TTECP0x26/0x27Minutes R R/WReserved RSVD0x28/0x29N/A R R/W CycleCount()CC0x2a/0x2b Counts R R/W StateOfCharge()SOC0x2c/0x2d%R R/WSubmit Documentation Feedback GENERAL DESCRIPTION94.1.1.1Control():0x00/0x01Issuing a Control()command requires a subsequent2-byte subcommand.These additional bytes specify the particular control function desired.The Control()command allows the system to control specific features of the bq27500/1during normal operation and additional features when the bq27500/1is in different access modes,as described in Table4-2.Table4-2.Control()SubcommandsCNTL SEALEDCNTL FUNCTION DESCRIPTIONDATA ACCESSCONTROL_STATUS0x0000Yes Reports the status of DF checksum,hibernate,IT,etc. DEVICE_TYPE0x0001Yes Reports the device type(eg:"bq27500")FW_VERSION0x0002Yes Reports the firmware version on the device typeHW_VERSION0x0003Yes Reports the hardware version of the device typeEnables a data flash checksum to be generated andDF_CHECKSUM0x0004Noreports on a readRESET_DATA0x0005Yes Returns reset dataReserved0x0006No Not to be usedPREV_MACWRITE0x0007Yes Returns previous MAC command codeReports the chemical identifier of the Impedance Track™CHEM_ID0x0008YesconfigurationBOARD_OFFSET0x0009No Forces the device to measure and store the board offset CC_INT_OFFSET0x000a No Forces the device to measure the internal CC offset WRITE_OFFSET0x000b No Forces the device to store the internal CC offsetSET_HIBERNATE0x0011Yes Forces CONTROL_STATUS[HIBERNATE]to1CLEAR_HIBERNATE0x0012Yes Forces CONTROL_STATUS[HIBERNATE]to0SEALED0x0020No Places the bq27500/1in SEALED access modeIT_ENABLE0x0021No Enables the Impedance Track™algorithmIF_CHECKSUM0x0022No Reports the instruction flash checksumCAL_MODE0x0040No Places the bq27500/1in calibration modeRESET0x0041No Forces a full reset of the bq27500/14.1.1.1.1CONTROL_STATUS:0x0000Instructs the fuel gauge to return status information to control addresses0x00/0x01.The status word includes the following information.Table4-3.CONTROL_STATUS Bit DefinitionsFlags()bit7bit6bit5bit4bit3bit2bit1bit0 High byte–FAS SS CSV CCA BCA––Low byte–HIBERNATE–SLEEP LDMD RUP_DIS VOK QENFAS=Status bit indicating the bq27500/1is in FULL ACCESS SEALED state.Active when set.SS=Status bit indicating the bq27500/1is in SEALED state.Active when set.CSV=Status bit indicating a valid data flash checksum has been generated.Active when set.CCA=Status bit indicating the bq27500/1coulomb counter calibration routine is active.Active when set.BCA=Status bit indicating the bq27500/1board calibration routine is active.Active when set.HIBERNATE=Status bit indicating a request for entry into HIBERNATE from SLEEP mode.True when set.Default is0.SLEEP=Status bit indicating the bq27500/1is in SLEEP mode.True when set.LDMD=Status bit indicating the bq27500/1Impedance Track™algorithm is using constant-power mode.True when set.Default is0 (constant-current mode).RUP_DIS=Status bit indicating the bq27500/1Ra table updates are disabled.Updates disabled when set.VOK=Status bit indicating the bq27500/1voltages are okay for Qmax.True when set.QEN=Status bit indicating the bq27500/1Qmax updates enabled.True when set.10Submit Documentation Feedback GENERAL DESCRIPTION4.1.1.1.2DEVICE_TYPE:0x0001Instructs the fuel gauge to return the device type to addresses0x00/0x01.4.1.1.1.3FW_VERSION:0x0002Instructs the fuel gauge to return the firmware version to addresses0x00/0x01.4.1.1.1.4HW_VERSION:0x0003Instructs the fuel gauge to return the hardware version to addresses0x00/0x01.4.1.1.1.5DF_CHECKSUM:0x0004Instructs the fuel gauge to compute the checksum of the data flash memory.Once the checksum has been calculated and stored,CONTROL_STATUS[CVS]is set.The checksum value is written and returned to addresses0x00/0x01(UNSEALED mode only).The checksum is not calculated in SEALED mode;however,the checksum value can still be read.4.1.1.1.6RESET_DATA:0x0005Instructs the fuel gauge to return the reset data to addresses0x00/0x01,with the low byte(0x00)being the number of full resets and the high byte(0x01)the number of partial resets.4.1.1.1.7PREV_MACWRITE:0x0007Instructs the fuel gauge to return the previous command written to addresses0x00/0x01.4.1.1.1.8CHEM_ID:0x0008Instructs the fuel gauge to return the chemical identifier for the Impedance Track™configuration to addresses0x00/0x01.4.1.1.1.9BOARD_OFFSET:0x0009Instructs the fuel gauge to compute the coulomb counter offset with internal short and then without internal short applied across the SR inputs.The difference between the two measurements is the board offset. After a delay of approximately32seconds,this offset value is returned to addresses0x00/0x01and written to data flash.The coulomb counter offset is also written to data flash.The CONROL STATUS [BCA]is also set.The user must prevent any charge or discharge current from flowing during the process. This function is only available when the fuel gauge is UNSEALED.When SEALED,this command only reads back the board-offset value stored in data flash.4.1.1.1.10CC_INT_OFFSET:0x000AInstructs the fuel gauge to compute the coulomb counter offset with internal short applied across the SR inputs.The offset value is returned to addresses0x00/0x01after a delay of approximately16seconds. This function is only available when the fuel gauge is UNSEALED.When SEALED,this command only reads back the CC_INT_OFFSET value stored in data flash.4.1.1.1.11WRITE_OFFSET:0x000BControl data of0x000b causes the fuel gauge to write the coulomb counter offset to data flash.4.1.1.1.12SET_HIBERNATE:0x0011Instructs the fuel gauge to force the CONTROL_STATUS[HIBERNATE]bit to1.This allows the gauge to enter the HIBERNATE power mode after the transition to SLEEP power state is detected.The [HIBERNATE]bit is automatically cleared upon exiting from HIBERNATE mode.4.1.1.1.13CLEAR_HIBERNATE:0x0012Instructs the fuel gauge to force the CONTROL_STATUS[HIBERNATE]bit to0.This prevents the gauge from entering the HIBERNATE power mode after the transition to the SLEEP power state is detected.It can also be used to force the gauge out of HIBERNATE mode.4.1.1.1.14SEALED:0x0020Instructs the fuel gauge to transition from the UNSEALED state to the SEALED state.The fuel gauge must always be set to the SEALED state for use in end equipment.4.1.1.1.15IT_ENABLE:0x0021This command forces the fuel gauge to begin the Impedance Track™algorithm,sets the active UpdateStatus n location to0x01and causes the[VOK]and[QEN]flags to be set in the CONTROL_STATUS register.[VOK]is cleared if the voltages are not suitable for a Qmax update.Once set,[QEN]cannot be cleared.This command is only available when the fuel gauge is UNSEALED.4.1.1.1.16IF_CHECKSUM:0x0022This command instructs the fuel gauge to compute the instruction flash checksum.In UNSEALED mode, the checksum value is returned to addresses0x00/0x01.The checksum is not calculated in SEALED mode;however,the checksum value can still be read.4.1.1.1.17CAL_MODE:0x0040This command instructs the fuel gauge to enter calibration mode.This command is only available when the fuel gauge is UNSEALED.4.1.1.1.18RESET:0x0041This command instructs the fuel gauge to perform a full reset.This command is only available when the fuel gauge is UNSEALED.4.1.1.2AtRate():0x02/0x03The AtRate()read-/write-word function is the first half of a two-function command set used to set the AtRate value used in calculations made by the AtRateTimeToEmpty()function.The AtRate()units are in mA.The AtRate()value is a signed integer,with negative values interpreted as a discharge current value.The AtRateTimeToEmpty()function returns the predicted operating time at the AtRate value of discharge.The default value for AtRate()is zero and forces AtRate()to return65,535.Both the AtRate()and AtRateTimeToEmpty()commands must only be used in NORMAL mode.4.1.1.3AtRateTimeToEmpty():0x04/0x05This read-word function returns an unsigned integer value of the predicted remaining operating time if the battery is discharged at the AtRate()value in minutes with a range of0to65,534.A value of65,535 indicates AtRate()=0.The fuel gauge updates AtRateTimeToEmpty()within1s after the system sets the AtRate()value.The fuel gauge automatically updates AtRateTimeToEmpty()based on the AtRate() value every1s.Both the AtRate()and AtRateTimeToEmpty()commands must only be used in NORMAL mode.4.1.1.4Temperature():0x06/0x07This read-word function returns an unsigned integer value of the temperature in units of0.1K measured by the fuel gauge and has a range of0to6,553.5K.4.1.1.5Voltage():0x08/0x09This read-word function returns an unsigned integer value of the measured cell-pack voltage in mV with a range of0to6,000mV.4.1.1.6Flags():0x0a/0x0bThis read-word function returns the contents of the fuel-gauge status register,depicting the current operating status.。

2笔记本电池芯片解锁工具技术客户资料笔记本电池解锁设备技术资料一览表SBW（Smart battery workshop）SBW 是一款来自俄罗斯的专业笔记本电池芯片解锁软件，称的上是先驱级的专业解锁软件了。

它主要针对早期的（及一些二、三线品牌笔记本电池的）单片机程序的电池保护电路的EEPROM 的数据进行读写，而更改电池的内部数据；是笔记本电池维修行家必备的解锁工具。

设备由硬件和软件两部分组成，如下图：技术参数： 技术参数详细参数 硬件设备硬件主体、并行口连接线、芯片低座8片、通讯口连线、包装。

通讯接口计算机Centronics 接口（并行接口） 设备功率 800mA×5V （采用USB 供电）适用芯片BQ2040/24C01/01NBQ2040/24C02/02MBQ2060/24C01/01NBQ2060/24C02/02MBQ2063/24C01BQ2063/24C02BQ2092/24C01M37515/ S29L220 (SL220)PIC16C63A/24C01 (用于 COMPAQ Armada M300, E500, M700, Evo 以及其他型号) 不支持智能电池系统M37516/AK6480A (80AF) (80AM) (80AR)AS355D/S29L394A (SL394) ( IBM ThinkPad T20..23)AS358D/S29L394A (SL394)AS372D/S29L394A (SL394) (IBM ThinkPad R31 以及其他型号)M37516/S29L220 (SL220)M37516/93C56 (Dell D600 D800 M500以及其他型号)M37515/24C01/01M (IBM ThinkPad 390, Acer （宏基）以及其他型号) M37516/24C01/01M (IBM ThinkPad 390 以及其他型号)M37517/SL194 (Sumsung 三星电池以及其他品牌)PS331/25LC040PS334/25LC040PS401 (内部包含FLASH ROM)PS402 (内部包含FLASH ROM)BQ2083 (内部包含FLASH ROM)BQ2084 (内部包含FLASH ROM)BQ2085 (内部包含FLASH ROM)BQ8011/24C01/01NToshiba 24C046*M37516的部分固件号，本软件暂不支持笔记本电池解锁设备技术资料一览表EV2300EV2300 是美国德州TI公司专为自己的BQ20XX系列电量管理芯片开发的集芯片开发与芯片编程的专用工具，主要支持BQ2060、BQ2083、BQ2084、BQ2085、BQ20Z70、BQ20Z75、BQ20Z85、BQ20Z90、BQ20Z95等TI电池管理芯片。

鞍钢硅钢片牌号鞍钢硅钢片是一种特殊的冷轧硅钢片，广泛应用于电力工业领域。

根据不同的用途和要求，鞍钢硅钢片被分为多种牌号，每种牌号都有其独特的性能和特点。

本文将介绍鞍钢硅钢片的常用牌号及其应用领域。

一、牌号介绍1. B23R080、B23R085这两种牌号的鞍钢硅钢片具有较低的矫顽力和磁导率，适用于制作分布式变流器、进口变压器、物流输电设备等。

其低矫顽力和磁导率能够有效降低能源损耗，提高设备的效率，广泛应用于电力工业。

2. B23P090、B23P095B23P090和B23P095是鞍钢硅钢片的高矫顽力牌号，具有较高的矫顽力和磁导率。

这两种牌号的硅钢片适用于高效率电机、变压器、汽车发电机等领域。

其高矫顽力能够提高设备的工作效率，减少能源损耗。

3. B27P095、B27P100B27P095和B27P100是鞍钢硅钢片的超高矫顽力牌号，具有极高的矫顽力和磁导率。

这两种牌号的硅钢片适用于高效率和超高效率电机、变压器等领域。

其超高矫顽力使得设备能够在更小的尺寸下实现更高的输出功率，适用于对空间要求较高的场合。

4. B50A470、B50A600B50A470和B50A600是鞍钢硅钢片的高导磁饱和感应强度牌号，具有较高的矫顽力和导磁饱和感应强度。

这两种牌号的硅钢片适用于高功率电机、大型发电机等领域。

其高导磁饱和感应强度能够提供更高的磁场密度和磁通量，使得设备具有更高的输出功率。

二、应用领域1. 电力工业鞍钢硅钢片广泛应用于电力工业领域，用于制作变压器、电机、发电机等电力设备。

通过选择不同的牌号，可以满足不同设备对磁导率、矫顽力和导磁饱和感应强度的要求，提高设备的效率和性能。

2. 新能源领域随着新能源技术的不断发展，鞍钢硅钢片在新能源领域也有广泛的应用。

例如，用于制作风力发电机和太阳能发电设备中的电机。

高效率的硅钢片能够提高发电设备的转化效率，降低能源消耗。

3. 交通运输鞍钢硅钢片还被广泛应用于交通运输领域，用于制作汽车发电机、电动车电机等。

Smart battery workshop使用说明3.7已经购买完整版适配器的,请查看适配器使用说明/bbs/a/a.asp?B=100&ID=7821.连接好适配器2.安装演示版软件：全部按照默认形式安装即可，安装后重启电脑,确认计算机并口打开且设置I/O address 为378,Mode:ECP或者EPP(设置在BIOS具体办法查看计算机使用说明书.)如果没有按照这个设置,会引起软件提示:”Adapter ok”但是无法使用等问题3.把笔记本电脑电池线路板与电芯连线断开，取下线路板上的EEPROM芯片按照如下说明插入sbw适配器的对应区域内:位置支持的器件1区24C01A24C02A24C04A24C046(8DIP8SOIC＠)01N02M(MSOP)2区25XX040(8DIP.8SOIC@)3区93C6X P93C6XSN(8DIP)93C6XST(8TSSOP#)S-29L130ADFE S-29L220ADFE(93C56)S-29L330ADFE(8SOIC@)S-29L130AFS S-29L220AFS(93C56)S-29L330AFS(8SSOP#)AK93C45AV AK93C55AV AK93C65AV AK93C75AV(8TSSOP#)S-29190ADPX S-29290ADPX S-29390ADPX(8DIP)4区S-29L194ADFE S-29L294ADFE S-29L394ADFE(8SOIC@)S-29L194AFS S-29L294AFS S-29L394AFS(8SSOP#)AK6420AM AK6440AM AK6480AM(8SSOP#)BR9010BR9020BR9040(8SOIC@)5区AK6420AF AK6440AF AK6480AF(8SOIC@)BR9010F BR9010FV BR9020F BR9040F(8SOIC@)AK93C45AF AK93C55AF AK93C65AF(8SOIC@)S-29190AFJX S-29290AFJX S-29390AFJX(8SOIC@)S-29L130AFE S-29L220AFE S-29L330AFE(8SOIC@)注意：1、有@的需要SOIC适配器支持，有#要有SSOP/TSSOP适配器支持2、使用的时候，适配器上只能有一个元件。