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iiE -'%: GYJ17.1057X(�±t: Obere Wank 1, 87484 Nesselwang, Germany)� � jE!Jlt3t:�$ (�$h.��)� -'% � � TMT121/127/128 -*�tllJf.i 11 *� � Ex nA II C T4-T6 Ge00 *$ UQ -'% 141000000GB 3836.1-2010, GB 3836.8-2014� ftVi � llt iiE 0* iiE � fi $& Wh 2017 � 2 .Fl 22 f3 � 2022 � 2 .Fl 21 B� 51 1. ��f�m 51��I»im*iiE� 1l11i!fo2. iiE�t.Ifij-%J§g� "x" �a,ijf"�1t���1�m���i!f, r*.J�m*iiE�1l11i!fo3. m-%m�iJta,ijm*iiE�1l11i!fo4. It ����J&m*iiE�1l11i!fo5. *iiE�li5'Jlt1�mT.'�l�wr�wr;li�,}tf)(.* (�#I) ��lH}i'iJ (�±t: �#lI�Il!I!R�!l!Ia:p�465-%) �f"l't.Jli5'Jm-%f"�o:tt!!.il: : ..t. jfiHP' m 3i: R& 103�JIlß!.IiQ: 200233 1XX.I!.il:: www.nepsLo r Emai l:****************��: +8621 643681801{,Ji: +8621 64844580EXPLOSION PROTECTIONCERTIFICATE OF CONFORMITYCert NO.GY J17.1057XThis is to certify that the productTemperatllre transmitter (DIN raH)manufactured by Endress + Hauser Wetzer GmbH + Co. KG(Address:Obere Wank 1,87484 Nesselwang, Gerrnany)which model is TMT1211127/128 SeriesEx marking Ex nAlIC T4�T6 Geproduct standard /drawing number 14 1000000has been inspected and certified by NEPSI, end that it conformsto GB 3836.1-2010,GB 3836.8-2014This Approval shall remain in force until 2022.02.21Remarks I.Conditions for safe use are specified in the attachment(s) to this certificate.2.Symbol "X" placed after the certification number denotes specific conditions of use,which are specified in the attachment(s) to this certificate.3.Model designation is specified in the attachment(s) to this certificate.4.Safe parameters specified in the attachment(s) to this certificate.5.This certificate is also applicable for the product with the same type manufactured byEndress+Hauser Wetzer (Suzhou) Co., Ltd. (address: Su Hong Zhong Lu No.465,S u z hou-S I P, China)DirectorThis Certificate is valid for products com patible with the d ocuments and sam p ies alJproved by NEPSI.103 Cao Bao Road Shanghai 200233, China Email:**************.cnTel: +862164368180Fax: +8621 64844580Editlon05�*�tt�tt��.*�����M National Supervision and Inspection Centre forExplosion Protection and Safety of Instrumentation (GYJ17.1057X) (Attachment I )GY J17.1 057X�lIit�iiEffi"{tt I1'1'1 }ßl1i&\;ltfr+ ;;:Wri� '§'j �tz: ß'.JTMT121/127/128�3i�1Mdt5V!:1l� c ��j L:t:�) , � I� �� 1x..g�1x�Il1J��:i:%-l.'����ft�(NEPSIH:ft��, �B:ifTJ�f5Ff1t:GB3836.1-2010 ;l�HFtl:l:;f:LJ't�1:gf)7J\.: &-1.r J.ill.):g�*GB3836.8-2014 ;/;!!Ht'l"tPfm �8:gß7t: U,I "n"FJD�J5il�HF;:tEx nA II C T4�T6 Ge, �J5;tiif*hLE�GY J17.1 057Xo;;$: iLE.=p; iA PT I'('.J F���. #Ht P�I T :iTEMP pCP DIN rail TMT 121-20iTEMP RTD DIN rail TMT 127-20iTEMP TC DIN rail TMT 128-20X�: O*��.��.��� .•• ffi��, W�F��mm��o-. F 5it:tc:i:�ffl *f��{tfA#�W�T:;;$:F�10f�*�fi;J, :tIJJUh1tmn�·�N:t:�fr�B:�GB4208-2008N\lJEFI J IP54�Lt. JitittJ"J!: GB3836.1-201 o tnGB3836.8-2014!?f*ß'.Jjr:J't/!=' 0=,F5it�fflr±f!.J.}Ji1, FRn1!fmJf:Ijß�ffiU�t D�JJnBjJiJB���:�l5tmfJl J T4 T5 T6jb9=:q��11ü\.15t -40'C-+85'C -40'C -+65 'c -40'C-+50'C2. FRr,I'F11jt Ft!, Itlli15J: 8�35Vde o3. 7t� B� fm!t l}[ 5e�..g� j r :rMfr�}1±fuftltd T, IJI)h 1!f m n�' @04.m����ff�.���F�ß'.J��$$#, @��F���ft��M*�ff�� ���., ����m.tl��m���ß'.J��o5. F� 1'F1:t:�. 1!ft8tD�fu�)� @If.1J F,f�r1!f Fl-J���. GB3836.13-2013 "!it1=tt:q� lJ't �13gß7t:&�B�1Itll. fft11t. 1��tDi:&jjl[" GB3836.15-2000 ".tt:'t1/-"t#Pf l�t8� �1Jl� t1115$7t: m:;�ft:f:hfifi��:t:� ctNJrI!#;jl') " GB3836.16-2006 ".tH1�1*Pfjjt ffllt�i&1k-�16tfll5}: t:h���ß'.J��t D�tt�J� o}.lnr�#;!tr) " RGB50257-2014 "�I1�i&.�(GY J 17.1 057X)�,it!J)t rJJf iE2mU � r &, �JjJ )'L I<: *it :r5< fln NE P SI iA riJ-B� )( 1�: j9i �4 �F ; 3 � � tt Jt� rp ßY � j> {Q. J5 r JU r*J � :a) N EPS I -!A nJt;F$ (�ltIJ;lIil-*itiiE b) c )�)]-;lI il-*it iiE -'%d ) 1t J-FJ Jf jjHfm &(Attachment I )�*�{)(�{)(��1I��lI{r1f�%M National Supervision and Inspection Centre forExplosion Protection and Safety of Instrumentation(GYJ17.1057X) (Attachment I )Attachment I to GYJ17.1057X1.TMT121 /127/128 series Temperature transmitter (DIN rail), manufactured by Endress+Hauser Wetzer GmbH + CO.KG, has been certified by National Supervision and Inspection Center for Explosion Protection and Safety of Instrumentation (NEPSI). The product accords with following standards:G83836.1-2010 Explosive atmospheres-Part 1: Equipment-General requirementsG83836.8-2014 Explosive atmospheres-Part 8: Equipment protection by type of protection "n"The Ex marking is Ex nA TI C T 4-T6 Gc, its certificate number is GY J17.1 057X.Type approved in this certificate is shown as the following:iTEMP PCP DIN rail TMT121-2DiTEMP RTD DIN rail TMT127-2DiTEMP TC DIN rail TMT128-2Do indicates type of connection, sensor, meauring range and ete.Refer to instruction manual for the details.2. Special Conditions for Safe UseThe suffix "X" placed after the certificate number indicates that this product is subject to special conditions for safe use, that is:When using this head type product, it shall be installed in the enclosure which IP degree is at least IP54 according to G84208-2008, and meet the relative requirements of G83836.1-201 0 and G83836.8-2014.3. Conditions for Safe Use3.1 The relationship between ambient temperature range and the temperature class is shown as folIows:Temperature class T4 T5 T6Ambient temperature range -40"C-+85"C -40"C-+65"C -40"C-+50"C3.2 Electrical data: 8-35 Vdc.3.3 The external earth connection facility of the whole product shall be connected reliably.3.4 The user shall not change the configuration in order to maintain/ensure the explosion protection performance of the equipment. Any change may impair safety.3.5 For installation, use and maintenance of this product, the end user shall observe the instruction manual and the following standards:Page 1 of 2(GY J17.1 057X) (Attachment I )GB50257-2014 "Code for construction and acceptance of electric device for explosion atmospheres and fire hazard electrical equipment installation engineering".GB3836.13-2013 "Explosive atmospheres-Part 13:Equipment repair, overhaul and reclamation".G B3836.15-2000 "Electrical apparatus for explosive gas atmospheres-Part 15:Electrical installations inhazardous area (other than mines)".GB3836.16-2006 "Electrical apparatus for explosive gas atmospheres-Part 16:lnspection and maintenance of electrical installation (other than mines)".4. Manufacturer's Responsibility4.1 Conditions for safe use, as specified above, should be included in the documentation the user is provided with. 4.2 Manufacturing should be done according to the documentation approved by NEPSI.4.3 Nameplate should include these contents listed below:1) NEPSl logo @2) Ex marking3) certificate number4) ambient temperature5) electrical dataPage 2 01 2。
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SMIA 1.0 Part 5: Camera Characterisation SpecificationDISCLAIMERThe contents of this document are copyright © 2004 Nokia Corporation, ST Microelectronics NV and their licensors. All rights reserved. You may not copy, modify nor distribute this document without prior written consent by Nokia and ST. No license to any Nokia’s, ST’s or their licensor’s intellectual property rights are granted herein.YOU ACKNOWLEDGE THAT THIS SMIA SPECIFICATION IS PROVIDED "AS IS" AND NEITHER NOKIA, ST NOR THEIR LICENSORS MAKE ANY REPRESENTATIONS OR WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR THAT THIS SMIA SPECIFICATION OR ANY PRODUCT, SOFTWARE APPLICATION OR SERVICE IMPLEMENTING THIS SMIA SPECIFICATION WILL NOT INFRINGE ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADEMARKS OR OTHER RIGHTS. THERE IS NO WARRANTY BY NOKIA, ST OR BY ANY OTHER PARTY THAT THE FUNCTIONS CONTAINED IN THIS SMIA SPECIFICATION WILL MEET YOUR REQUIREMENTS.LIMITATION OF LIABILITY. IN NO EVENT SHALL NOKIA, ST OR THEIR EMPLOYEES, LICENSORS OR AGENTS BE LIABLE FOR ANY LOST PROFITS OR COSTS OF PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, PROPERTY DAMAGE, PERSONAL INJURY, LOSS OF PROFITS, INTERRUPTION OF BUSINESS OR FOR ANY SPECIAL, INDIRECT, INCIDENTAL, ECONOMIC, COVER, PUNITIVE, OR CONSEQUENTIAL DAMAGES, HOWEVER CAUSED AND WHETHER ARISING UNDER CONTRACT, TORT, NEGLIGENCE, OR OTHER THEORY OF LIABILITY ARISING OUT OF THIS SMIA SPECIFICATION, EVEN IF NOKIA, ST OR THEIR LICENSORS ARE ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN THE EVENT THAT ANY EXCLUSION CONTAINED HEREIN SHALL BE HELD TO BE INVALID FOR ANY REASON AND NOKIA, ST OR THEIR LICENSORS BECOMES LIABLE FOR LOSS OR DAMAGE THAT MAY LAWFULLY BE LIMITED, SUCH LIABILITY SHALL BE LIMITED TO U.S.$50.Specifications mentioned in this publication are subject to change without notice.This document supersedes and replaces all versions previously supplied.HistoryVersion Date Author Status Notes1.0 30-June-04 Nokia and ST ApprovedTable of contentsSCOPE (11)1.Definitions (12)1.1Arrays (12)1.2Standard Parameters (13)1.2.1Raw Bayer Image Data (13)1.2.2Green (Red) Raw Bayer (13)1.2.3Region of Interest (ROI) (13)1.3Function Descriptions (15)1.3.1AV_IMAGE(#1, ..., #F) (15)1.3.2COLUMN_AV(#) (15)1.3.3CONVOLUTION(#1,#2) (16)1.3.4Extract Colour Plane - GREENRED (16)1.3.5LOG10(x) (16)1.3.6Local Deviation (16)1.3.7MAX(#) (16)1.3.8MEAN(#) (16)1.3.9MIN(#) (16)1.3.10Regression Analysis (17)1.3.11RMS(#) (17)1.3.12ROI(a,b;x,y;#) (17)1.3.13ROW_AV(#) (17)1.3.14STDEV(#) (17)2.Pre-Processing (18)2.1Data Pre-Processing (18)2.2Image Pre-Processing (18)2.2.1Introduction (18)2.2.2Kernel Kern k (18)2.2.3Error Detection (19)2.2.4Defect Correction (19)3.Test Equipment and Environmental Requirements (20)3.1General (20)3.2Illumination Specification (20)3.3Environmental Specification (20)3.4Electrical Specification (21)3.4.1Analogue Supply (21)3.4.2Digital Supply (21)4.Default Configuration (22)4.1Default Camera Configuration (22)4.1.1Default Electrical Conditions (22)4.1.2Camera Register Settings (22)4.1.3Default Environmental Conditions (22)4.1.4Default Lighting Conditions (22)4.2Default Characterisation Configuration (23)4.2.1Darkroom Set Up (23)4.2.2Mobile Device Equivalence Model (24)5.Characterisation Test Methods (25)5.1Dynamic Range (25)5.1.1Description (25)5.1.2Test Conditions (25)5.1.3Analysis (25)5.2Vertical Fixed Pattern Noise (26)5.2.1Description (26)5.2.2Test Conditions (27)5.2.3Analysis (27)5.3Horizontal Fixed Pattern Noise (28)5.3.1Description (28)5.3.2Test Conditions (28)5.3.3Analysis (29)5.4Temporal Noise (30)5.4.1Description (30)5.4.2Test Conditions (30)5.4.3Analysis (30)5.5Column Noise (31)5.5.1Description (31)5.5.2Test Conditions (31)5.5.3Analysis (32)5.6Row Noise (33)5.6.1Description (33)5.6.2Test Conditions (33)5.6.3Analysis (34)5.7Frame to Frame Flicker (35)5.7.1Description (35)5.7.2Test Conditions (35)5.7.3Analysis (35)5.8Dark Signal (36)5.8.1Description (36)5.8.2Test Conditions (36)5.8.3Analysis (36)5.9Dark Signal Non-uniformity (37)5.9.1Description (37)5.9.2Test Conditions (37)5.9.3Analysis (37)5.10Power Supply Rejection Ratio (38)5.10.1Description (38)5.10.2Test Conditions (39)5.10.3Analysis (40)5.11Signal to Noise Ratio (41)5.11.1Description (41)5.11.2Test Conditions (41)5.11.3Analysis (42)5.12Sensitivity (43)5.12.1Description (43)5.12.2Test Conditions (43)5.12.3Analysis (44)5.13Maximum Illumination (45)5.13.1Description (45)5.13.2Analysis (45)5.14Minimum Illumination (46)5.14.1Description (46)5.14.2Test Conditions (46)5.14.3Analysis (46)5.15Module Response Non-Linearity (47)5.15.1Description (47)5.15.2Test Conditions (48)5.15.3Analysis (49)5.16Photo-Response Non-Uniformity (50)5.16.1Description (50)5.16.2Test Conditions (50)5.16.3Analysis (51)5.17Relative Illumination (52)5.17.1Description (52)5.17.2Test Conditions (52)5.17.3Analysis (52)5.18Spatial Frequency Response (53)5.18.1Description (53)5.18.2Test Conditions (54)5.18.3Analysis (54)5.19Image Sharpness Measurement (56)5.19.1Description (56)5.19.2Test conditions (58)5.19.3Analysis (59)5.20TV Distortion (61)5.20.1Description (61)5.20.2Test Conditions (62)5.20.3Analysis (62)5.21Field of View (64)5.21.1Description (64)5.21.2Test Conditions (64)5.21.3Analysis (65)5.22Colour Accuracy (66)5.22.1Description (66)5.22.2Test Conditions (66)5.22.3Conversion of Data into CIELAB (67)5.22.4Conversion from sRGB into XYZ 1931 CIE (Tristimulus) Values (69)5.22.5Conversion from XYZ 1931 CIE (Tristimulus) Values to CIELAB (70)5.22.6Calculation of Colour/Hue Accuracy from L*a*b* (CIELAB) Data (70)5.22.7Pseudo Code for the Analysis Process (71)5.23Image Lag (74)5.23.1Description (74)5.23.2Test Conditions (74)5.23.3Analysis (75)5.24Veiling Glare (76)5.24.1Description (76)5.24.2Test Conditions (77)5.24.3Analysis (78)References (79)Appendix A- Default Test Conditions (80)Appendix B- Test Charts (81)Appendix C– Possible Trial-and-Error Image Lag Test Method (82)List of tablesTable 1: Acronyms (ix)Table 2: Definitions (ix)Table 3: ECR (x)Table 4: Bayer Matrix Orientation (13)Table 5: Standard ROIs (14)Table 6: Example ROI Dimensions (14)Table 7: Illumination Specification (20)Table 8: Environmental Specification (20)Table 9: Analogue Supply Specification (21)Table 10: Digital Supply Specification (21)Table 11: Default Electrical Conditions (22)Table 12: Default Environmental Conditions (22)Table 13: Default Lighting Conditions (22)Table 14: Dynamic Range Test Conditions (25)Table 15: Vertical Fixed Pattern Noise Test Conditions (27)Table 16: Horizontal Fixed Pattern Noise Test Conditions (28)Table 17: Temporal Noise Test Conditions (30)Table 18: Column Noise Test Conditions (31)Table 19: Row Noise Test Conditions (33)Table 20: Frame to Frame Flicker Test Conditions (35)Table 21: Dark Signal Test Conditions (36)Table 22: Dark Signal Non-Uniformity Test Conditions (37)Table 23: Power Supply Rejection Ratio Test Conditions (39)Table 24: Electrical Test Conditions (40)Table 25: Signal to Noise Ratio Test Conditions (41)Table 26: Sensitivity Test Conditions (43)Table 27: Minimum Illumination Test Conditions (46)Table 28: Module Response Non-Linearity Test Conditions (48)Table 29: Photo-Response Non-Uniformity Test Conditions (50)Table 30: Relative Illumination Test Conditions (52)Table 31: SFR Test Conditions (54)Table 32: Image Sharpness ROIs (57)Table 33: Image Sharpness Test Kernel (58)Table 34: Image Sharpness Test Conditions (58)Table 35: TV Distortion Test Conditions (62)Table 36: FOV Test Conditions (64)Table 37: Colour Accuracy Test Conditions (66)Table 38: Image Lag Test Conditions (74)Table 39: Veiling Glare Test Conditions (77)Table 40 - Default Test Conditions (80)List of figuresFigure 1: Taking a sub-matrix (12)Figure 2 - Measurement ROIs (15)Figure 3: Default Darkroom Set Up (23)Figure 4: Electrical Schematic of Mobile Device Equivalence Model (24)Figure 5: Image Sharpness ROIs For Example Chart (57)Figure 6: Distorted image of a square, showing pincushion distortion (61)Figure 7: Colour Test Image Capture Set Up (67)Figure 8: Colour Accuracy Process (68)Figure 9: Bayer Data to sRGB Conversion (68)Figure 10: Veiling Glare Measurement Set-up schematic (77)Figure 11: Image Lag Frame Acceptability (82)Acronyms Abbreviations and Definitions:Functional descriptions can be found in section 1.3.CCP Compact Camera PortCCI Camera Control InterfaceEMC Electro Magnetic CompatibilityEMI Electro Magnetic InterferenceFE Frame EndFps Frames per secondFS Frame StartFSD Full Scale DeflectionI2C Inter ICbusIF InterfaceIO Input/OutputLSB Least Significant ByteLVDS Low Voltage Differential SignallingMbps Megabits per secondMSB Most Significant ByteOECF Opto-Electronic Conversion FunctionPSRR Power Supply Rejection RatioRH Relative HumidityRO Read OnlyROI Region of InterestRW Read/WriteSCK System ClockSFR Spatial Frequency ResponseSMIA Standard Mobile Imaging ArchitectureSubLVDS Sub-Low Voltage Differential SignallingSVGA Super Video Graphics Array (800x600)VGA Video Graphics Array (640x480)Table 1: AcronymsFull scale deflection Taken to be the maximum pixel output minus the minimum pixeloutput (pedestal). Note that the maximum pixel output might notbe 2n-1 and the minimum pixel output is unlikely to be 0. Integration time Integration is the time in seconds between pixel reset and read. Optical axis Line through the centres of curvature of the surfaces of the opticalsystem.Pedestal Fixed offset used to compensate for black level of the cameramodule. The pedestal value is the offset from 0 codes to therequired black level.Table 2: DefinitionsPREFACESpecification Supersedes Earlier DocumentsThis document contains the SMIA Characterisation specification.Following publication of the SMIA Standard, there may be future approved errata and/or approved changes to the standard prior to the issuance of another formal revision.Incorporation of Engineering Change Requests (ECRs)The following ECRs have been incorporated into this version of the specification:ECR DESCRIPTIONTable 3: ECRSCOPEThis document describes the tests which are used to characterise the performance of a SMIA camera. In general, a test plan will be used to define the number of samples to be used for each test, and any deviations from the test methods and test conditions described in this specification.The document is arranged as follows:-• Chapter 1 Definitions. This provides standard definitions which are used throughout the document. These include array nomenclature, image data formats and function descriptions.• Chapter 2 Pre-Processing. This includes descriptions of data manipulation steps that are used prior to calculations on captured image data.• Chapter 3 Test Equipment and Environmental Requirements. This defines the capabilities of the equipment and environment required to make the measurements.• Chapter 4 Default Configuration. This describes the default camera configuration & physical darkroom set up for tests, and electrical schematic. Specific settings which deviate from the defaults are defined in each test method description.• Chapter 5 Characterisation Test Methods. This includes descriptions of each of the individual test methods. A standard template is used for each method, with the following parts:- o Overview of the test objective.o Formal description of the calculations required and the physical set up.o Table to define the test conditions (illumination, environmental, electrical, camer settings, capture method and pre-processing).o Pseudo code to describe the analysis required, using functions defined in the “Definitions” chapter.• Appendix A describes the default environmental, electrical supply and analogue gain test conditions at which each characterisation test is conducted. These should be used where a specific test plan has not been provided.• Appendix B provides information on suitable test charts for various tests, and references to the electronic versions.• Additional appendices are used for supplementary information .This specification includes descriptions for 24 characterisation tests. Additional tests for depth of focus, flare, ghosting, out of scene image artifacts, infra red response, blemish and EMC will be added to a future release of this specification.Nokia & ST Confidential Page 11 of 83Nokia & ST ConfidentialPage 12 of 831. DefinitionsCare should be taken to avoid loss of precision, for example due to rounding errors when performing calculations or by reducing the bit depth of the data.1.1 ArraysIn this document a generic array is a collection of values ordered in a 2-dimensional matrix. AThe size of is written where m is the number of columns and n is the number of rows. When the number of elements in the array is needed as a quantity, size may also be used as a function: . A n m ×mn A size =)(An individual value in may be referred to as an element, entry, item, member, pixel, position, value, etc. The value occurring on the i A th row and in the j th column of is written . The top left value is while the bottom right value is A ),(j i A )0,0(A )1,1(−−n m A . The sum of a matrix is the sum of all its elements: .∑∑−=−==101),()(m i n j j i A A sum A sub-array can be described using sets of values, e.g. )2,2(j i A B = where andrepresents an array one quarter the size of and taking it’s values from the 2m i <≤20n j <≤20A nd , 4th , 6thetc rows and 2nd , 4th , 6th etc columns. This is illustrated in Figure 1.a b c d e f …g h i j k la c e … m n o p q r …m o qs t u v w xy aa ac … y z aa ab acadB=: : ae af ag ah ai aj … A= :::Figure 1: Taking a sub-matrixFor convenience we also define the mean of an array as )()()()(A size A sum A A A mean ===µ, thevariance of an array as ∑∑−=−=−−=1012)),((1)(1)var(m i n j A j i A A size A . and the standard deviation of an array as )var()()(A A A std ==σ.Nokia & ST ConfidentialPage 13 of 831.2 Standard Parameters1.2.1 Raw Bayer Image DataThe precise data format of an SMIA compatible image is already given in the SMIA Functional Specification and consists of a single bit depth Bayer pixel array, with size where m and n are both even numbers. A n m ×Using this image data the following types of image arrays are required for the Optical Characterisation measurements.1.2.2 Green (Red) Raw BayerGreen (Red) Raw Bayer contains the visible Green pixels data from each row containing Green and Red Bayer pixels. This array can be written )2,2()(q j p i A A GR G ++= where m i <≤20,, and n j <≤20p and depend upon the alignment of the Bayer matrix as shown in the tablebelow.qFirst Bayer column contains blue pixelsFirst Bayer column contains red pixelsFirst Bayer row contains red pixelsp = 0, q = 0 p = 0, q = 1 First Bayer row contains blue pixelsp = 0, q = 1p = 1, q = 1Table 4: Bayer Matrix Orientation1.2.3 Region of Interest (ROI)A Region Of Interest (ROI) is a continuous sub-array of the form where and. For a given process one or more ROIs may be defined with algorithms being run just onthe ROI sub-arrays instead of on the whole data set. ),(j i A 21x i x ≤≤21y j y ≤≤Some standard ROIs are defined in Table 5.Nokia & ST ConfidentialPage 14 of 83Description of location Area relative to )(GR G A Sub-array of with size )(GR G A n m ×Range for columnsRange for rowsROI (1)Geometric centre 5⅓% *),()(j i A GR Gi k m ≤−12/ 12/1−+≤k m **j k n ≤−12/ 12/1−+≤k n **ROI (2)Geometric centre 1% ),()(j i A GR G 120/1120/9−≤≤m i m 120/1120/9−≤≤n j nROI (3)Upper left 1% ),()(j i A GR G 110/0−≤≤m i 110/0−≤≤n j ROI (4)Lower left 1% ),()(j i A GR G 110/9−≤≤m i m 110/0−≤≤n j ROI (5)Upper right 1% ),()(j i A GR G 110/0−≤≤m i 110/9−≤≤n j n ROI (6)Lower right1%),()(j i A GR G110/9−≤≤m i m110/9−≤≤n j nTable 5: Standard ROIs1.2.3.1 Example ROI DimensionsExample ROI dimensions are shown in Table 6.Module type Green-Red Bayer pixel dimensionsROI () dimensions)1(ROI ROI () dimensions)6,5,4,3,2(ROI SMIA VGA(640 x 480) 320 x 240 64 x 6432 x 24 SMIA SVGA(800 x 600)400 x 300 80 x 8040 x 30Table 6: Example ROI Dimensions*If this is less then 64x64 pixels then area is defined as 64 x 64 pixels**where 5/)3/(1mn k =Nokia & ST ConfidentialPage 15 of 831.2.3.2 Measurement Locations)(n iFigure 2 - Measurement ROIs1.3 Function Descriptions1.3.1 AV_IMAGE(#1, ..., #F)Takes a number of frames, F, to produce a composite image containing the average values for each pixel.Thus if A = AV_IMAGE(A 1, A 2, …, A F ) then ∑==Fk kj i A Fj i A 1),(1),( for each i,j where 0 ≤ i < m ,0 ≤ j < n .1.3.2 COLUMN_AV(#)Takes the column averages for a frame and outputs a row vector.Thus if C = COLUMN_AV(A) then ∑−==1),(1)(N j j i A n i C for each i where 0 ≤ i < m .Nokia & ST ConfidentialPage 16 of 831.3.3 CONVOLUTION(#1,#2)Convolves two arrays to produce a fresh array with the output being placed at the position in array #1 coincident with centre entry of the array #2.Thus if A is an m x n matrix, K is a r x s matrix (where r = 2u+1 and s = 2v+1), and B = CONVOLUTION(A, K) then for each i,j where 0 ≤ i < m , 0 ≤ j < n .∑∑−=−=++++=u u g vvh h v g u K h j g i A j i B ),(),(),(In cases when i + u < 0 or i + u ≥ m , and/or j + v < 0 or j + v ≥ n the kernel array K overhangs the edge of the array A and so A(i + g, j + h) is undefined for some values of g and h . In such cases define a sub-array C of A asC = A(e, f) where max(0, i - u) ≤ e ≤ min(m - 1, i + u) and max(0, j - v) ≤ f ≤ min(n - 1, j + v)and use A(i + g, j + h) = mean(C) when i + g < 0 or i + g ≥ m , and/or j + h < 0 or j + h ≥ n . 1.3.4 Extract Colour Plane - GREENREDThus GREENRED(A) = A G(GR) as defined in section 1.2.2. 1.3.5 LOG10(x)Logarithm to the base 10.1.3.6 Local DeviationThis takes the deviation of a point from the average of its locality.The local standard deviation is defined by∑∑−=−=⋅−⋅=1012,11M i N j j i local local N M δσ ,where()⎟⎟⎠⎞⎜⎜⎝⎛−⎟⎟⎠⎞⎜⎜⎝⎛⋅−+⋅−=∑∑+−=+−=j i K i K i n K j K j m m n j i ji local p p K p ,,2,,1121δ given p i,j is the pixel value at (i,j) and K is the locality parameter. For most cameras the localityparameter can be set to K = 5, which yields an average over 120 pixels for the locality. When dealing with pixels at the edge of the array, for calculation purposes the pixels outside the array assume the value of the average of those inside the array and the locality. 1.3.7 MAX(#)Finds the maximum entry value in an array.1.3.8 MEAN(#)Finds the mean of the entry values in an array, i.e. MEAN(A) = mean(A) as defined in section 1.1. 1.3.9 MIN(#)Finds the minimum entry value in an array.Nokia & ST ConfidentialPage 17 of 831.3.10 Regression AnalysisSome methods give rise to a set of pairs of measured values (x 1,y 1), (x 2,y 2), …, (x n ,y n ). We can draw a best fit straight line y=mx+c through these points using the Gaussian method of least squares by setting m and c as follows.Let∑==n i i x n x 11 and ∑==n i iy n y 11. Also let∑=−−−=n i i i xy y y x x n s 1))((11 and ∑=−−=n i i x x n s 1221)(11. Then21s s m xy= and x m y c −=.1.3.11 RMS(#)Finds the root mean squared of array. Thus ∑∑−=−==1012),()(1)(m i n j j i A A size A RMS , where size(A) is defined in section 1.1.1.3.12 ROI(a,b;x,y;#)ROI extracts a region of interest of size (a,b) with top left coordinates (x,y) from an array and outputs the ROI as a new arrayThus ROI(a,b;x,y;A) = A(x + i, y + j) for each i,j where 0 ≤ i < a , 0 ≤ j < b . 1.3.13 ROW_AV(#)Takes the row averages for a frame and outputs a column vector.Thus if R = ROW_AV(A) then ∑−==1),(1)(m i j i A m j R for each j where 0 ≤ j < n . 1.3.14 STDEV(#)Finds the standard deviation of an array's entry values. Note that this is always the sample standard deviation σn-1 and this is the quantity referred to as standard deviation in the text, i.e. STDEV(A) = std(A) as defined in section 1.1.Nokia & ST ConfidentialPage 18 of 832. Pre-Processing2.1 Data Pre-ProcessingThe SMIA Functional Specification describes the format of the data output by SMIA cameras, and should be used to correctly unpack the captured image data.Additionally, it describes Data Pedestal. Each characterisation test method in section 5 states whether the data pedestal should be subtracted from the unpacked data. Data pedestal subtraction is performed by subtracting the pedestal from each pixel value, clipping to zero if the original pixel value is less than the pedestal.Thus if A = Pedestal_Offset_Subtraction(F) then A(i, j) = F(i, j ) - p if F(i, j ) >p otherwise A(i, j) = 0, for each i,j where 0 ≤ i < m , 0 ≤ j < n , and where p is the pedestal value in codes.2.2 Image Pre-Processing2.2.1 IntroductionIn normal use, a camera module can be expected to operate with a large amount of digital signal processing to remove errors and enhance the overall image quality. As a SMIA camera module is characterised using raw Bayer data a certain amount of low-level error detection and defect correction is necessary for the majority of tests.We use a measurement Kernel of size (see Section 2.2.2), which traverses each image pixel in the image array from top left through to bottom right. The default value of k is 1. The result of this convolution creates a corrected image data array (see Sections 2.2.3, 2.2.4) based on the value of the central pixel of the Kernel compared to its surrounding pixels. If a pixel is close to the edge of the array its Kernel may extend past the array boundaries. In such cases the value of the corresponding pixel in the corrected array is set to the value of the pixel in the original array. This new corrected array is then used for later analysis. k Kern k 2.2.2 Kernel Kern kThe kernel of size used in section 2.2 is a square array of size with equal weightings on for each entry (i.e. all entries in the kernel parameter of the convolution are set to 1). k Kern k 1212+×+k kOther kernels are also used elsewhere in the text and are described explicitly when required.Given an array , the kernel of the pixel is the sub-array whereand A ),(y x A ),()),((j i A y x A Kern k =k x i k x +≤≤−k y j k y +≤≤−.Nokia & ST ConfidentialPage 19 of 832.2.3 Error DetectionThe purpose of this routine is to detect pixels defects on the image by recording the difference between the local pixel value and the kernel mean. This may be used at a later date for blemish test method, but is currently not used.k K For each pixel let , let ),(y x A )),((y x A Kern Kern k =1)(),()(−−=Kern size y x A Kern sum aThen create a new array with ected errors A det _a y x A y x A ected errors −=),(),(det _.2.2.4 Defect CorrectionThe purpose of this correction routine is to remove the effects of large pixels defects on the images by setting any pixel with a value that is +/-15% of FSD deviation from the Kernel mean (Kern ).For each pixel let , let ),(y x A )),((y x A Kern Kern k =1)(),()(−−=Kern size y x A Kern sum aand create a new array where if corrected defect A _15.0)),((×<−FSD a y x A abs thenotherwise ),(),(_y x A y x A corrected defect =a y x A corrected defect =),(_.3. Test Equipment and Environmental Requirements3.1 GeneralAll test results should state the measurement accuracy achieved with the measurement equipment used. The following sections specify the capability of the equipment required to make the measurements, not the actual measurement conditions.3.2 Illumination SpecificationIllumination type TungstenHalogenTungstenD65 D75 DiffuseColour temperature 3200-3400K2500-3000K6500K 7500K2500-3400KType TungstenhalogenTungstenDaylightFluorescentFluorescentTungsten ortungstenhalogenElectrical SupplyFrequency DC DC 20 – 100kHz 20 – 100kHzIntensity range atchart10 - 2000 Lux1 - 2000 Cd/m2> 100 Lux> 100 Lux > 100 Lux> 50 Lux atdiffuserAngle of incidence of eachlight source (with respect to chart) 45º 45º 45º 45ºDiffuseUniformity ofillumination atchart± 5% ± 5% ± 5% ± 5% ± 2%Table 7: Illumination SpecificationAdditionally, the “Dark” condition is defined as one in which no detectable light (< 1mLux) can reach the camera. It is recommended that a double shielding approach is taken. For instance, the camera is covered by a black cap and blackout cloth in a darkroom.3.3 Environmental SpecificationParameter Value Tolerance UnitsTemperature rangeMinimum Maximum -30+70± 1%± 1%°C°CHumidity <70 ± 5% % RHTable 8: Environmental SpecificationNokia & ST Confidential Page 20 of 833.4 Electrical Specification3.4.1 Analogue SupplyParameter Minimum Typical Maximum UnitsVoltsVoltage 0.0 2.8 5.0 DCCurrent(Resistive) +/-50 mATable 9: Analogue Supply Specification3.4.2 Digital SupplyParameter Minimum Typical Maximum UnitsVoltsVoltage 0.0 1.8 5.0 DCCurrent(Resistive) +/-50 mATable 10: Digital Supply SpecificationNokia & ST Confidential Page 21 of 834. Default Configuration4.1 Default Camera Configuration4.1.1 Default Electrical ConditionsParameter Value Tolerance UnitsReference Analogue supply (VANA) 2.8 ± 0.1 DC Volts SMIA Functional SpecificationModulation OFFDigital supply (VDIG) 1.8 ± 0.1 DC Volts SMIA Functional SpecificationModulation OFFExternal Clock (EXTCLK) SMIA Functional SpecificationFrequency 13.0 ±0.1 MHzLevel V DIG- VoltsTable 11: Default Electrical Conditions4.1.2 Camera Register SettingsThe SMIA camera shall be reset before each Characterisation test is performed so that the camera registers contain the default data defined in the SMIA Functional Specification.Additionally, the camera registers should be configured for• 13MHz External Clock, unless specified in the test plan• Analogue gain specified for the test• Digital gain specified for the test• Integration time required for the test• Frame Rate required for the test• Other camera-specific registersThe default frame rate is the lesser of 15fps or the maximum achievable frame rate.Information on the register settings used for each test should be supplied with the test results.4.1.3 Default Environmental ConditionsParameter Value Tolerance UnitsTemperature23 ±2 °CHumidity <70 %RHTable 12: Default Environmental Conditions4.1.4 Default Lighting ConditionsParameter ValueTolerance UnitsIlluminationType Intensity at chartUniformity Tungsten Halogen300± 5%----Lux-Table 13: Default Lighting ConditionsNokia & ST Confidential Page 22 of 83。
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LED驱动控制专用电路---HT1628一、概述HT1628是一种带键盘扫描接口的LED（发光二极管显示器）驱动控制专用电路，内部集成有MCU数字接口、数据锁存器、LED高压驱动、键盘扫描等电路。
本产品性能优良，质量可靠。
二、特性说明�采用功率CMOS工艺�多种显示模式（10段×7位～13段×4位）�键扫描（10×2bit）�辉度调节电路（占空比8级可调）�串行接口（CLK，STB，DI/O）�振荡方式：RC振荡�内置上电复位电路�封装形式：SOP28三、内部功能框图：四、管脚定义：管脚功能定义：五、显示寄存器地址和显示模式：该寄存器存储通过串行接口从外部器件传送到HT1628的数据，地址分配如下：六、键扫描和键扫数据寄存器：为10×3bit，如下所示：键扫数据储存地址如下所示，用读指令读取，读从低位开始：七、指令说明：指令用来设置显示模式和LED驱动器的状态。
在STB下降沿后由DIN输入的第一个字节作为一条指令。
如果在指令或数据传输时STB被置为高电平，串行通讯被初始化，并且正在传送的指令或数据无效（之前传送的指令或数据保持有效）。
（1）显示模式设置：该指令用来设置选择段和位的个数（4～7位，10～13段）。
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上电时，设置模式为4位，14段。
（2）数据设置：该指令用来设置数据写和读（3）地址设定：该指令用来设置显示寄存器的地址。
如果地址设为0EH或更高，数据被忽略，直到有效地址被设定。
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八、串行数据传输格式：数据接收（写数据）数据读取：因为DOUT管脚为N管开漏输出，所以该脚要连接一个外部上拉电阻（1KΩ到10KΩ）**：读取数据时，从串行时钟CLK的第8个上升沿开始设置指令到CLK下降沿读数据之间需要一个等待时间tWAIT(最小1μS)。
Fiery XF 7© 2018 Electronics For Imaging, Inc. 此产品的《法律声明》适用于本出版物中的所有信息。
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