Optical sensing and APDS-9900 sharing Jan 2011
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*3-9900.090*Signet 9900 Transmitter3-9900.090 Rev. H 08/17English® instruments,, Conductivity/Resistivity,® Signal Converter required, sold separately). Panel MountOperating InstructionsField Mount® SensorFlow515*/8510*, 525*, 2000,2100, 2507, 2536*/8512*,2537, 2540*, 2551, 2552pH/ORP2724-2726 with 2750*/27512734-2736 with 2750*/27512756-WTx–2757-WTx with3719 and 2750*/27512764-2767 with 2750*/27512774-2777 with 2750*/2751Conductivity/Resistivity, Salinity2819-2823 with2850 or Cond/Res Module2839-2842 with2850 or Cond/Res ModuleLevel, Temperature, Pressure2250*, 2350*, 2450*Turbidity4150 requires 8058Dissolved Oxygen2610-41 direct to 99002610-31 requires 8058* Can be run on Loop Power(see NOTE on page 11)• English• Deutsch• Français• Español• Italiano• 中文29900 Transmitter39900 Transmitter3-9900.393 Relay Module 49900 Transmitter59900 Transmitter69900 Transmitter79900 Transmitter89900 Transmitter99900 Transmitter109900 Transmitter119900 Transmitter129900 Transmitter139900 Transmitter149900 TransmitterTechnical Notes:• The cable length from the 8058 to the 9900 must not exceed 60 m (200 ft).• When using the 8058-2, connect the loop source to Channel 1 input ONLY .• See the 8058 manual for more information.Wiring for:Signet 8058 i-Go™4-20 mA to S L ConverterO u t p u t S 3LDATA GND SHLD V+8058-1close-upBlackRed ShieldWhite 8058-19900 S 3L Inputs08058-27 8 9N/C S L DATA3close-up8058-2DATA GND V+SHLD BLACKWHITE RED 9900 S 3L InputsTechnical Notes:• Use three conductor shielded cable for sensor cable splices up to 305 m (1000 ft) max.• Maintain cable shield through cable splice.• Route sensor cable away from AC power lines.• Connect the silver (shield) wire to earth ground in case of EMI noise interference.Technical Notes:• The 2850 has no SHIELD wire.• To work correctly with the 9900, the 2850 must be set for the custom cell constant or the actual probe cell constant and the 9900 set for a 1.0 cell constant.Wiring for:* 2551-XX-21, -41Display Magmeter2250235024502551*2750/27512850Black Red ShieldWhite V+DATA GND SHLD 9900 S 3L InputsNOTE: The 2850 has no SHIELD wire.159900 Transmitter169900 Transmitter179900 Transmitter189900 Transmitter199900 Transmitter209900 TransmitterKeypad FunctionsThe four buttons of the keypad are used to navigate display modes according to the descriptions in this table. Notice that the function of each button may change depending on the display mode.3sEditInput EditSaves ChangesInput Edit Choices(Password may be required)or ororSelect another Menu ItemReturn to View Mode+2x+OrThis basic operating procedure repeats throughout the 9900 program:1. Press ENTER for 3 seconds to enter MENU mode.2. Press ► to move to the desired menu then press ENTER to select it. (Password may be required.)3. Press ▲ or ▼ to select the desired menu item for editing.4. Press ► to edit the value/selection.5. Press ENTER to store the new value/selection.6. Press ▲ or ▼ to select another menu item if desired. Repeat steps 3-5 as required.7. Press ▲+▼ to select a different menu to edit. Repeat steps 2-5 as required.8. When fi nished editing all menus, press ▲+▼ again to return to normal operation.The menu is constructed in a loop, so you can move forward and backward to select an item. After any item is saved (by pressing ENTER), the display will return to the previous menu.System Setup: Menu NavigationINPUT MenuThis is the normal display and does not time out.。
安捷伦科技推出采用微型ChipLED表面封装的经济型环境亮度传感器该器件可控制手机和便携式产品的LCD 显示屏背光,为照明应用提供开关控制2005 年5 月18 日,中国北京–安捷伦科技公司(Agilent Technologies, 纽约证券交易所上市代号:A) 日前宣布,为手机、消费电子、商用和工业产品提供一款新型模拟输出环境亮度传感器。
安捷伦APDS-9002 传感器采用微型ChipLED 无铅表面封装,它是业内体积最小的器件之一,产品尺寸仅为2.00mm x 1.25 mm x 0.80 mm。
其紧凑的封装缩小了电路板空间,从而可以实现外形更薄、功能更丰富的产品。
安捷伦环境亮度传感器为PDA、笔记本电脑、便携式DVD 播放机、MP3 播放机、便携式摄像机和数码相机及手机提供了理想的节电解决方案。
它们还可以用来控制室内和室外照明灯、路灯及电子标志和信号灯的开关。
安捷伦科技公司半导体产品事业部中国及香港地区总经理李艇先生说,“我们新推出的ChipLED 亮度传感器满足了一系列的应用需求,包括对价格和尺寸非常敏感的手机应用。
袖珍型传感器不但提高了性能,还明显地改善了当前由电池供电的产品所日益关注的功耗问题。
”与安捷伦以前推出的HSDL-9001 亮度传感器相比,APDS-9002 进一步改善了性能,包括保证在2.4 V - 5.5 V 扩展电压范围内工作,其工作温度范围也扩大至-40℃到+85℃。
安捷伦创新的环境亮度传感器采用人眼仿真检测环境亮度,然后把信号传送给手机,以便在需要时打开显示屏的背光和键盘灯。
新型传感器可检测周围环境的亮度水平,并通过提供高度线性的成比例输出,来调节显示屏或键盘的背光。
如果周围光线充足,设计人员提供的逻辑控制可以关闭背光,以减少电池充电的时间或更换电池的次数。
安捷伦环境亮度传感器的性能要优于硅光电二极管亮度检测的解决方案,因为其频谱响应的尖峰值与人眼的波长相同。
传感器也同样适应从自然的阳光到荧光、传统的白炽灯和卤素灯等不同的光源。
LASER INTERFEROMETER GRAVITATIONAL WAVE OBSERVATORY LIGO Laboratory / LIGO Scientific CollaborationLIGO-E960050-v4 Advanced LIGO12 Nov 2009 see DCC record for approvalLIGO Vacuum Compatible Materials ListD. Coyne (ed.)Distribution of this document:LIGO Science CollaborationThis is an internal working noteof the LIGO Project.California Institute of Technology LIGO Project – MS 18-341200 E. California Blvd.Pasadena, CA 91125Phone (626) 395-2129Fax (626) 304-9834E-mail:*****************.edu Massachusetts Institute of Technology LIGO Project – NW17-161175 Albany StCambridge, MA 02139Phone (617) 253-4824Fax (617) 253-7014E-mail:*************.eduLIGO Hanford Observatory P.O. Box 1970Mail Stop S9-02Richland WA 99352Phone 509-372-8106Fax 509-372-8137LIGO Livingston ObservatoryP.O. Box 940Livingston, LA 70754Phone 225-686-3100Fax 225-686-7189/CHANGE RECORDRevisionDateAuthority DescriptionA30 Jul 1996Initial Release Initial ReleaseB/v1 5 Apr 2004DCNE030570-01 Added approved materials for initial LIGO, clarified the designation "presently used", or "provisional" materials, added independent approval for Initial LIGO and AdvancedLIGO approval.v2 9 Sep 2009See DCC record ∙ Removed distinction between initial and advanced LIGO for approval∙ Made an explicit notation in the materials list if the use of a material is restricted (or not)∙ Moved a number of materials from the provisionally approved to the approved list, although in some cases with restrictions (e.g. carbon steel, Sm-Co, Nd-Fe-B, Vac-Seal, copper, Tin-Lead solder, etc.) and removed the provisional list from the document∙ Added a number of materials to the approved list, although in some cases with restrictions (e.g. adhesives,aluminum bronze, etc.) ∙ Added a few materials to the explicitly excluded list, e.g.aluminum alloy 7000 series, brass (aka manganese bronze), free-machining grades of stainless steel (303, 303S, 303Se) except as small fasteners, etc. ∙ Added a number of references∙ Added a section on general restrictions on materials (e.g. no castings, material certifications are always required, only the grades and sources called out for the polymers are permitted, etc.)∙ Most outgassing rate values remain blank in the materials list (pending)v3 16 Sep 2009 See DCCrecord∙ Added SEI-ISI actuators to approved list∙ Clarified that no castings refers to metals only∙ Added exception for the use of grinding to prepare the leads for in-vacuum photodiodes ∙ Added numbers to the rows of the approved materials list for easier reference∙ Added the grade and source for PEEK and carbon-loaded PEEKV4 12 Nov 2009See DCC record ∙ Explicitly added the Ferritic Stainless Steels (400 series) to the approved materials list. Of high vapor pressureelements, these alloys have 0.06% P max and 0.15% S max, which is well under the 0.5% max allowed inLIGO-L080072-00 [Ref. b )7]TABLE OF CONTENTS1Introduction (4)2Scope (4)3Nomenclature and Acronyms (4)4Ultra-High Vacuum Material Concerns (5)5Vacuum Requirements (5)6Procedure for Qualifying New Materials (6)7VRB wiki Log (6)8General Restrictions (6)9Approved Materials (7)10Explicitly Rejected Materials (20)11References for the approved materials table (20)LIST OF TABLESTable 1: Approved Construction Materials (8)1 IntroductionAll items to be installed inside LIGO Observatory vacuum systems must be on the "approved materials" list (components and materials).2 ScopeThe materials listed herein are those which are intended for use in vacuum. Materials used for items which are temporarily inside a LIGO vacuum system, but do not reside in vacuum (e.g. alignment fixtures, installation tooling, etc.) are not restricted to this material list. These items (referred to as "Class B"1 as opposed to "Class A" items which remain in the vacuum system) must comply with LIGO cleanliness standards and must not leave residues of non-vacuum compatible materials (e.g. hydrocarbon lubricants).3 Nomenclature and AcronymsLIGOAdL AdvancedADP Ammonium Di-hydrogen Phosphate [(NH4)H2PO4]AES Auger Electron SpectroscopyAMU Atomic Mass UnitFTIR Fourier Transform Infrared SpectroscopyHC HydrocarbonsLIGOInL InitialKDP Potassium Di-hydrogen Phosphate [KH2PO4]LIGO Laser Interferometer Gravitational Wave ObservatoryOFHC Oxygen Free High-Conductivity CopperNEO Neodymium Iron BoronPFA Perfluoroalkoxy fluoropolymer (Du Pont)PTFE Polytetrafluorethylene (Du Pont)PZT Lead-Zirconate-TitanateRTV Room Temperature Vulconizing Silicone elastomerSIMS Stimulated Ion Mass SpectroscopyUHV Ultra High VacuumVRB LIGO Vacuum Review BoardXPS X-ray Photoelectric Spectroscopy1 Betsy Bland (ed.), LIGO Contamination Control Plan, LIGO-E09000474 Ultra-High Vacuum Material ConcernsThere are two principal concerns associated with outgassing of materials in the LIGO vacuum system:a)Outgassing increases the gas load (and column density) in the system and consequently mayeither compromise the interferometer phase noise budget or require higher pumping capacity. Reduction with time, whether 1/t (range of adsorption energies) or 1/sqrt(t) (diffusion followed by desorption) is important and the particular gas species (whether condensable or non-condensable) is critical. Even inherently compatible, low outgassing materials (e.g. 6061 aluminum alloy) will contribute to the gas load (especially if not properly cleaned and/or copious amounts are installed into the vacuum system). However, the most significant risk is likely to be from materials which have inherently high outgassing rates (e.g. water outgassing from flouroelastomers such as Viton® and Flourel®).The literature is most useful in providing total and water outgassing rates. Since in LIGO, there is a special problem of larger phase noise sensitivity to (and concern of optical contamination from) heavy hydrocarbons, where possible, the hydrocarbon outgassing or surface contamination information should be provided.b)Outgassing is a potential source of contamination on the optics with the result of increasedoptical losses (scatter and absorption) and ultimately failure due to heating. The amount of outgassing is less important than the molecular species that is outgassed. Little is known of the most important contamination sources or the mechanisms that lead to the optical loss(e.g., UV from second harmonic generation, double photon absorption photoeffect, simplemolecular decomposition in the optical fields leaving an absorbing residue, etc.).In the approved materials list, one column entry indicates whether the listed material has the potential for (is suspected of) being a significant contributor as regards a) or b) or both.5 Vacuum RequirementsAn allocation of high molecular weight hydrocarbon outgassing budget to assemblies within the AdL UHV is given in LIGO-T0400012. However, this document is in need of revision (a) to reflect the pumping capacity of the beam tube (which reduces the requirements considerably), and (b) to more accurately reflect the evolved AdL configuration.An allocation of total gas load for AdL has not been made as yet. With the elimination of the significant amount of Flourel® flouroelastomer in InL (spring seats, parts of the InL seismic isolation system), the water load will decrease dramatically. However, recent calculations3 of test mass damping due to residual gas suggest that this may not be sufficient. We will need to achieve a total pressure of 10-9 torr or less in proximity to each test mass. A total gas load budget/estimate will be created.The limits on optical loss due contamination are < 1 ppm/yr absorption and < 4 ppm/yr scatter loss2 D. Coyne, Vacuum Hydrocarbon Outgassing Requirements, LIGO-T0400013 N. Robertson, J. Hough, Gas Damping in Advanced LIGO Suspensions, LIGO-T0900416-v1for any test mass (TM), high reflectance (HR), surface4.6 Procedure for Qualifying New MaterialsA request to qualify a new material or component/assembly should be addressed to the LIGO Chief Engineer or the LIGO Vacuum Review Board with a justification regarding the need for the new material and an estimate of the amount of material required. Materials can only be added to the "approved" list after extensive testing in accordance with the document "LIGO Vacuum Compatibility, Cleaning Methods and Procedures"5.7 VRB wiki LogThis revision captures all relevant LIGO Vacuum Review Board (VRB) decisions as of the date of this release. For more recent direction not yet captured in a revision of this document, see the LIGO VRB wiki log (access restricted to LSC members).8 General Restrictions1)Material certifications are required in every case.2)Only the grades called out3)Only the grades and sources called out for the polymers (unless otherwise noted).4)All polymers are restricted (even if approved). The use of an approved polymer in a newapplication must be approved. Despite the fact that some polymer materials are approved for use, these materials should be avoided if possible and used sparingly, especially if used in proximity to LIGO optics.5)Special precautions must be taken for adhesives. Often the shelf life for adhesives islimited. All adhesives should be degassed as part of the preparation procedure. Extreme care must be taken when mixing multi-part adhesives, to insure that the proper ratio is used and accurately controlled.6)No metal castings, including no aluminum tooling plate.7)All surfaces are to be smooth (preferably ≤ 32 micro inches Ra). All metal surfaces areideally machined.8)All machining fluids must be fully synthetic (water soluble, not simply water miscible) andfree of sulfur, chlorine, and silicone.9)No bead or sand blasting is permitted.4 G. Billingsley et. al., Core Optics Components Design Requirements Document, section 4.2.2.6 of LIGO-T080026-00. The timescale for accumulation (i.e. the time span between in situ re-cleaning of the test mass optics) has been chosen here to be 1 year. It is possible that a somewhat shorter time span could be accommodated.5 D. Coyne (ed.), LIGO Vacuum Compatibility, Cleaning Methods and Qualification Procedures, LIGO-E96002210)No grinding is permitted (due to potential contamination from the grinding wheel matrix),except for (a) grinding maraging steel blades to thickness6 and (b) photodiode lead end preparation for pin sockets.11)Parts should be designed and fabricated to provide venting for enclosed volumes12)For design applications where dimensional control is extremely important or tolerances areexceedingly tight, it is the responsibility of the design engineer to (a) establish a basis for baking parts at temperatures lower than the default temperatures (defined in LIGO-E960022), and (b) get a waiver for a lower temperature bake from the LIGO Vacuum Review Board.13)All materials must be cleaned with appropriate chemicals and procedures (defined in LIGO-E960022) and subsequently baked at “high temperature”. The appropriate temperature is defined in LIGO-E960022. Typical hold duration at temperature is 24 hours. The preferred bake is in a vacuum oven so that the outgassing rate can be shown to be acceptable by Residual Gas Assay (RGA) measurement with a mass spectrometer. If the part is too large to be placed in a vacuum oven, then it is air baked (or dry nitrogen baked) and then its surface cleanliness is established by FTIR measurement.14)Welding, brazing, soldering have special restrictions and requirements7 defined in LIGO-E0900048.15)For commercially produced components with potentially many materials used in theconstruction, a detailed accounting of all of the materials and the amounts used must be submitted for review. It may be necessary for some components to get certifications (per article or serial number) of the materials employed in their manufacture, so that material substitutions by the manufacturer are visible to LIGO.9 Approved MaterialsThe following Table lists materials which are approved for use in all LIGO vacuum systems. In many cases the materials are restricted to a particular application. Use of the material for another application must be approved by either the LIGO Chief Engineer or the LIGO Vacuum Review Board. References for the approved materials list table are given in the last section.6 C. Torrie et. al., Manufacturing Process for Cantilever Spring Blades for Advanced LIGO, LIGO-E09000237 C. Torrie, D. Coyne, Welding Specification for Weldments used within the Advanced LIGO Vacuum System, LIGO-E0900048LIGO LIGO-E960050-v410 Explicitly Rejected Materials1)Alkali metals2)Aluminum alloy 7000 series: due to the high zinc content3)Brass (aka manganese bronze): due to high zinc content4)Cadmium or zinc plating on metal parts: Cadmium and zinc have prohibitively high vapourpressures. Crystalline whiskers grow on cadmium, can cause short circuits.5)Delrin™ or similar polyacetal resin plastics: Outgassing products known to contaminatemirrors.6)Dyes7)Epoxy Tra-Bond 2101: outgassing was measured by LIGO to be too high (note that this isnot a low outgassing epoxy formulation)8)Inks9)Manganese bronze (aka brass): due to high zinc content10)Oils and greases for lubrication11)Oilite™ or other lubricant-impregnated bearings12)Oriel MotorMike™ actuators filled with hydrocarbon oil, not cleanable13)Palladium14)Soldering flux15)Stainless Steel, free-machining grades (303, 303S, 303Se): allowable only as smallhardware components (nuts, bolts, washers), due to high sulfur or selenium content16)RTV Type 61517)Tellurium11 References for the approved materials table1.Dayton, B.B. (1960) Trans. 6th Nat. Vacuum Congress; p 1012.Schram, A. (1963) Le Vide, No 103, p 553.Holland, Steckelmacher, Yarwood (1974) Vacuum Manual4.Lewin, G. (1965) Fundamentals of Vacuum Science and Technology, p 725.Coyne, D., Viton Spring Seat Vacuum Bake Qualification, LIGO-T970168-00, 10 Oct 1997.6.Coyne, D., Allowable Bake Temperature for UHV Processing of Copper Alloys, LIGO-T0900368-v2, 11 Aug 2009.7.Worden, J., Limits to high vapor pressure elements in alloys, LIGO- L080072-00, 12 Sep 2008.8.Coyne, D., VRB Response to L070131-00: Unacceptability of 7075 Aluminum Alloy in theLIGO UHV?,LIGO-, LIGO-L070132-00, 11 Nov 2008.20LIGO LIGO-E960050-v49.Worden, J., VRB response to L080042-00, Is 303 stainless steel acceptable in the LIGOVacuum system?, LIGO-L080044-v1, 12 Jan 2009.10.Worden, J., VRB response to nickel-phosphorous plating issues , LIGO-L0900024-v1, 20 Feb2009.11.Torrie, C. et. al., Manufacturing Process for Cantilever Spring Blades for Advanced LIGO,LIGO-E0900023-v6, 23 Jun 2009.12.Worden, J., VRB Response to Flourel/Viton O-ring questions, LIGO-L070086-00, 12 Oct2007.13.Coyne, D. (ed), LIGO Vacuum Compatibility, Cleaning Methods and Qualification Procedures,LIGO- E96002214.Process Systems International, Inc., Specification for Viton Vacuum Bakeout, LIGO VacuumEquipment - Hanford and Livingston, LIGO- E960159-v1, 18 Dec 1996.15.Coyne, D., Component Specification: Material, Process, Handling and Shipping Specificationfor Fluorel Parts, LIGO-E970130-A, 17 Nov 1997.16.Process Systems International, Inc., WA Site GNB Valve Modification Report Update (PSIV049-1-185) and LA Mid Point Valve O-Ring Specification, LIGO-C990061-00, 21 Jan 1999.17.Process Systems International, Inc., Vacuum Equipment: O Ring Specification, Rev. 06, LIGO-E960085-06, 7 Jan 1997.18.ASTM, Standard Specification for Steel Wire, Music Spring Quality, A 228/A 228M – 07.19.Worden, J., Re: L0900002-v1: VRB request: all SmCo magnets UHV compatible?, LIGO-L0900011-v1, 3 Feb 2009.20.C. Torrie, et. al., Summary of Maraging Steel used in Advanced LIGO, LIGO-T090009121。
北京大学联合安捷伦科技使用93000测试系统测试国内规模最大、自主知识产权的CPU系统芯片
佚名
【期刊名称】《电子工业专用设备》
【年(卷),期】2003(32)6
【摘要】北京大学微处理器研究开发中心和全球领先的半导体测试解决方案提供商安捷伦科技(NYSE:A)2003年10月31日在北京联合宣布,具有完全自主知识产权的北大众志CPU已经在安捷伦93000系统级芯片系列测试系统上成功进行量产测试。
【总页数】1页(P38-38)
【关键词】自主知识产权;NYSE;规模;提供商;国内;量产;北京大学微处理器研究开发中心;安捷伦科技;系统芯片;系统级芯片
【正文语种】中文
【中图分类】TN402;F407.63
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因版权原因,仅展示原文概要,查看原文内容请购买。
2.性能要求2.1.功能2.1.1.分析仪应具有ID卡信息读取功能;2.1.2.具备数据显示功能:用分析仪测试后,可查询检测结果;2.1.3.具有打印功能;2.1.4.分析仪具备开机自检功能;2.1.5.分析仪应具备数据接口:LIS接口,传输协议为UDP,存储格式为文本格式;2.1.6.分析仪应具备用户访问控制:采用基于角色的访问控制(R B A C:R o l e-B a s e d Access Control)方法,分为管理员和普通用户两个级别,普通用户权限:只能访问本用户的测试数据;管理员权限:可访问所有用户的测试数据。
2.2.性能2.2.1.重复性批内测量重复性,CV≤10%。
2.2.2.稳定性仪器开机处于稳定工作状态后第4h、第8h的测试结果处于稳定工作状态时的测试结果的相对偏倚量,σ≤±8%。
2.2.3.线性相关性在不小于2个数量级的浓度范围内,线性相关系数(r)≥0.97。
2.2.4.准确性检测偏差,△n≤±15%。
2.3.外观与结构2.3.1.分析仪外形应平整,表面不应有明显的凹凸痕、划痕、裂纹、变形、霉斑、锋棱、毛刺。
表面镀层不应起泡、龟裂和脱落。
2.3.2.分析仪外表的各处文字、符号应完整,标记应清晰、准确、牢固。
2.3.3.分析仪的紧固件连接应可靠、不得有松动。
2.3.4.分析仪的运动部件应平稳,不应有卡滞、突跳。
2.4.安全要求应符合GB4793.1-2007、GB4793.9-2013和YY0648-2008中适用章条的要求。
2.5.环境试验要求分析仪的环境试验应符合GB/T14710-2009中气候环境试验Ⅰ组、机械环境试验Ⅱ组和表1的规定;运输试验和对电源的适应能力分别符合GB/T14710-2009中4 章、5章的规定。
2.6.电磁兼容要求应符合GB/T18268.1-2010和GB/T18268.26-2010中适用章条的要求。
apds9930原理
APDS9930是一种数字环境光和接近传感器,其工作原理是通
过发射红外光和检测接收到的反射红外光来测量环境光的强度和物体的接近程度。
APDS9930使用红外发射二极管发射红外光,并使用四个光敏
元件(红色,绿色,蓝色和红外线)来检测接收到的光信号。
利用各个光敏元件的敏感程度与环境光的波长特性不同的特点,可以将接收到的光信号转换为数字信号。
其工作原理可以概括为以下几个步骤:
1. 发射红外光:APDS9930通过红外发射二极管发射红外光。
2. 接收反射红外光:发射的红外光会遇到周围物体并发生反射,APDS9930通过红外敏感元件接收到反射光。
3. 处理光信号:APDS9930通过内置的光敏元件将接收到的红
外光转换为电信号,并将其放大和滤波处理。
4. 转换为数字信号:经过处理后,APDS9930将得到的光电信
号转换为数字信号,这些数字信号表示环境光强度和物体的接近程度。
5. 输出结果:APDS9930可以通过数字接口将测量结果输出给
外部设备,例如微控制器或电脑。
APDS9930是一种常用于自动亮度调节、触摸屏、近距离探测
等应用的传感器,具有高精度、低功耗等特点。
产品名称:黑白B超规格/型号:DP-9900全数字台式单位:台品牌:迈瑞产地:深圳Coldfire 处理器应用ColdFire 嵌入式微处理器,运算速度提高5倍,带来成像质量完美飞跃五大成像技术五项领先成像技术集中应用,图像质感清晰呈现[DBF 全数字波束形成]全数字超声诊断仪的核心技术,实现图像获取、处理过程的全数字转化,保证图像不失真,边缘清晰[RDA 实时动态孔径成像]接收孔径随着回波的深度实时动态地连续的变化,保证了远近场具有均匀一致的高分辨率[DFS 数控动态频率扫描]宽频带探头多频率同时发射,接收时系统内的数字化自适应带通滤波器,根据检查部位深浅差异,自动选择最佳的接收频率,有效地解决了分辨率和穿透力之间的矛盾,在同一幅图像上实现了最佳分辨率和最高穿透力[DRA 实时动态声束变迹]随深度连续地抑制旁瓣,有效降低背景噪声,获得最高信噪比,实现高清晰度图像[DRF 实时逐点动态接收聚焦]最理想的接收聚焦技术,大大改善了远近场的图像颗粒均匀度和提高整场组织的分辨率,获得高质量的二维图像特殊的分析软件[中国人群公式]最适合中国人群的产科分析软件,精确推算胎儿胎龄和预产期胎儿生理评分:客观的、量化的评价晚期妊娠胎儿宫内窘迫发生可能性,为临床制定处理方案提供参考[PSAD测定]更为准确的评估前列腺疾患脱机诊断可在患者离机状态下对保留的动态图像数据进行第二次论断所必须的分析测量,后处理放大、操作IP 功能6种参数优化组合,8种设置,集成于一键调节,使复杂的图像调节变得轻松、简单升级功能提供系统升级平台,最新版本软件以磁盘方式存贮,用户只需点击系统升级,系统将自动更新软件,保证系统的先进性独特的断面图分析对临床诊断非常有意义的分析软件工具,将使得超声诊断进入量化过程内置数字化图像管理系统图像资料以数字化存储在机器内,无任何失真,方便图像资料的管理存储大容量电影回放手动和自动两种方式可选,使您能轻松捕获最理想的图像中文界面(英文可选)方便用户操作,提高工作效率和减少培训时间检查条件预置功能检查时只需选中相应的检查模式键,系统即进入最佳的检查状态友好操作导航系统提供操作同步帮助信息,使复杂的操作变得轻松自如。
APDS-9900 and APDS-9901 Digital Proximity and Ambient Light Sensor Data SheetDescriptionThe APD S-9900/9901 provides digital ambient light sensing (ALS), IR LED and a complete proximity detection system in a single 8 pin package. The proximity function offers plug and play detection to 100 mm (without front glass) thus eliminating the need for factory calibration of the end equipment or sub-assembly. The proximity detection feature operates well from bright sunlight to dark rooms. The wide dynamic range also allows for operation in short distance detection behind dark glass such as a cell phone. In addition, an internal state machine provides the ability to put the device into a low power mode in between ALS and proximity measurements providing very low average power consumption. The ALS provides a photopic response to light intensity in very low light condition or behind a dark faceplate.The APD S-9900/9901 is particularly useful for display management with the purpose of extending battery life and providing optimum viewing in diverse lighting con-ditions. D isplay panel and keyboard backlighting can account for up to 30 to 40 percent of total platform power. The ALS features are ideal for use in notebook PCs, LCD monitors, flat-panel televisions, and cell phones.The proximity function is targeted specifically towards near field proximity applications. In cell phones, the proximity detection can detect when the user positions the phone close to their ear. The device is fast enough to provide proximity information at a high repetition rate needed when answering a phone call. This provides both improved “green” power saving capability and the added security to lock the computer when the user is not present. The addition of the micro-optics lenses within the module, provide highly efficient transmission and reception of infrared energy which lowers overall power dissipation.Ordering InformationPart Number Packaging QuantityAPDS-9900Tape & Reel2500 per reelAPDS-9901Tape & Reel2500 per reel FeaturesALS, IR LED and Proximity Detector in an Optical Module • Ambient Light Sensing (ALS)– Approximates Human Eye Response– Programmable Interrupt Function with Upper and Lower Threshold– Up to 16-Bit Resolution– High Sensitivity Operates Behind Darkened Glass– Up to 1,000,000:1 Dynamic Range• Proximity Detection– Fully Calibrated to 100 mm Detection– Integrated IR LED and Synchronous LED Driver– Eliminates “Factory Calibration” of Prox– Covers a 2000:1 Dynamic Range• Programmable Wait Timer– Wait State Power – 70 µA Typical– Programmable from 2.72 ms to > 6 Sec• I2C Interface Compatible– Up to 400 kHz (I2C Fast-Mode)– Dedicated Interrupt Pin• Sleep Mode Power - 2.5 µA Typical• Small Package L3.94 x W2.36 x H1.35 mm Applications• Cell Phone Backlight Dimming• Cell Phone Touch-screen Disable• Notebook/Monitor Security• Automatic Speakerphone Enable• Automatic Menu Pop-up• Digital Camera Eye Sensor7 - SCL6 - GND5 - LED A8 - VDD 1 - SDA2 - INT3 - LDR4 - LED KFunctional Block DiagramINT LED ADetailed DescriptionThe APD S-9900/9901 light-to-digital device provides on-chip Ch0 and Ch1 diodes, integrating amplifiers, AD Cs, accumulators, clocks, buffers, comparators, a state machine and an I2C interface. Each device combines one Ch0 photodiode (visible plus infrared) and one Ch1 infra-red-responding (IR) photodiode. Two integrating ADCs si-multaneously convert the amplified photodiode currents to a digital value providing up to 16-bits of resolution. Upon completion of the conversion cycle, the conversion result is transferred to the Ch0 and CH1 data registers. This digital output can be read by a microprocessor where the illuminance (ambient light level) in Lux is derived using an empirical formula to approximate the human eye response. Communication to the device is accomplished through a fast (up to 400 kHz), two-wire I2C serial bus for easy con-nection to a microcontroller or embedded controller. The digital output of the APDS-9900/9901 device is inherent-ly more immune to noise when compared to an analog interface.The APDS-9900/9901 provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value is exceeded, the interrupt pin is asserted and remains asserted until cleared by the controlling firmware. The interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a light intensity or proximity value. An interrupt is generated when the value of an ALS or proximity conversion exceeds either an upper or lower threshold. Additionally, a pro-grammable interrupt persistence feature allows the user to determine how many consecutive exceeded thresholds are necessary to trigger an interrupt. Interrupt thresholds and persistence settings are configured independently for both ALS and proximity.Proximity detection is fully provided with an 850 nm IR LED. An internal LED driver (LDR) pin, is jumper connected to the LED cathode (LED K) to provide a factory calibrated proximity of 100 +/- 20 mm. This is accomplished with a proprietary current calibration technique that accounts for all variances in silicon, optics, package and most impor-tantly IR LED output power. This will eliminate or greatly reduce the need for factory calibration that is required for most discrete proximity sensor solutions. While the APDS-9900/9901 is factory calibrated at a given pulse count, the number of proximity LED pulses can be programmed from 1 to 255 pulses, which will allow greater proximity distances to be achieved. Each pulse has a 16 µs period.I/O Pins ConfigurationPIN NAME TYPE DESCRIPTION1SDA I/O I2C serial data I/O terminal – serial data I/O for I2C.2INT O Interrupt – open drain.3LDR I LED driver for proximity emitter – up to 100 mA, open drain.4LEDK O LED Cathode, connect to LDR pin in most systems to use internal LED driver circuit5LEDA I LED Anode, connect to V BATT on PCB6GND Power supply ground. All voltages are referenced to GND.7SCL I I2C serial clock input terminal – clock signal for I2C serial data.8V DD Power Supply voltage.Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)†Parameter Symbol Min Max Units Test ConditionsPower Supply voltage V DD 3.8V[1]Digital voltage range-0.5 3.8VDigital output current I O-120mAStorage temperature range Tstg-4085°C†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.Note:1. All voltages are with respect to GND.Recommended Operating ConditionsParameter Symbol Min Typ Max UnitsOperating Ambient Temperature T A-3085°CSupply voltage V DD 2.5 3.0 3.6VSupply Voltage Accuracy, V DD-3+3%total error including transientsLED Supply Voltage V BATT 2.5 4.5VAvailable OptionsPart Number Interface DescriptionAPDS-9901I2C VBUS = VDD InterfaceAPDS-9900I2C 1.8V VBUS InterfaceOperating Characteristics, V DD = 3 V, T A = 25° C (unless otherwise noted)Parameter Symbol Min Typ Max Units Test ConditionsSupply current [1]I DD175250µA Active (ATIME=0xdb, 100ms)70Wait Mode2.5 4.0Sleep ModeINT SDA output low voltage V OL00.4V 3 mA sink current00.6 6 mA sink current Leakage current, SDA, SCL, INT pins I LEAK-55µALeakage current, LDR pin I LEAK10µASCL, SDA input high voltage V IH0.7 V BUS1.25V APDS-9901APDS-9900SCL, SDA input low voltage, V IL0.3 V BUS0.54V APDS-9901APDS-9900Oscillator frequency fosc705750795kHz PON = 1Note:1. The power consumption is raised by the programmed amount of Proximity LED Drive during the 8 us the LED pulse is on. The nominal andmaximum values are shown under Proximity Characteristics. There the I DD supply current is I DD Active + Proximity LED Drive programmed value. ALS Characteristics, V DD = 3 V, T A = 25° C, Gain = 16, AEN = 1 (unless otherwise noted)Parameter Channel Min Typ Max Units Test ConditionsDark ALS ADC count value Ch0015counts Ee = 0, AGAIN = 120x,ATIME = 0xDB(100ms)Ch1015ALS ADC Integration TimeStep Size2.58 2.72 2.90ms ATIME = 0xffALS ADC Number ofIntegration Steps1256stepsFull Scale ADC Counts per Step1023countsFull scale ADC count value65535counts ATIME = 0xC0ALS ADC count value Ch0400050006000countsλp = 640 nm, Ee = 56 µW/cm2,ATIME = 0xF6 (27 ms), GAIN = 16xCh1790Ch0400050006000λp = 850 nm, Ee = 79 µW/cm2,ATIME = 0xF6 (27 ms), GAIN = 16xCh12800ALS ADC count value ratio: Ch1/Ch0 10.815.820.8%λp = 640 nm, ATIME = 0xF6 (27 ms) 415668λp = 850 nm, ATIME = 0xF6 (27 ms)Irradiance Responsivity: Re Ch029.1Counts per(µW/ cm2)λp = 640 nm, ATIME = 0xF6 (27 ms) Ch1 4.6Ch022.8λp = 850 nm, ATIME = 0xF6 (27 ms) Ch112.7Gain scaling, relative to 1x gain setting -55%8x -5516x -55120xNotes:1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible 640 nm LEDs and infrared850 nm LEDs are used for final product testing for compatibility with high-volume production.2. The 640 nm irradiance Ee is supplied by an AlInGaP light-emitting diode with the following characteristics: peak wavelength = 640 nm and spectralhalfwidth ½ = 17 nm.3. The 850 nm irradiance Ee is supplied by a GaAs light-emitting diode with the following characteristics: peak wavelength = 850 nm and spectralhalfwidth ½ = 40 nm.4. The specified light intensity is 100% modulated by the pulse output of the device so that during the pulse output low time, the light intensity is atthe specified level, and zero otherwise.Proximity Characteristics, V DD = 3 V, T A = 25° C, PGAIN = 1, PEN = 1 (unless otherwise noted)Parameter Min Typ Max Units Test ConditionsI DD Supply current – LDR Pulse On3mAADC Conversion Time Step Size 2.72ms PTIME = 0xffADC Number of Integration Steps1steps PTIME = 0xffFull Scale ADC Counts1023counts PTIME = 0xffProximity IR LED Pulse Count0255pulsesProximity Pulse Period16.3µsProximity Pulse – LED On Time7.2µsProximity LED Drive100 mA PDRIVE = 0I SINK Sink current @ 600 mV,LDR Pin50PDRIVE = 125PDRIVE = 212.5PDRIVE = 3Proximity ADC count value, no object100LED driving 8 pulses, PDRIVE = 0, open view(no glass) and no reflective object above themodule.Proximity ADC count value, 100 mm distance object 416520624counts Reflecting object – 73 mm x 83 mm Kodak90% grey card, 100mm distance, LED driving8 pulses, PDRIVE = 0, open view (no glass)above the module.IR LED Characteristics, V DD = 3 V, T A = 25CParameter Min Typ Max Units Test Conditions Forward Voltage, V F 1.4 1.5V I F = 20 mA Reverse Voltage, V R 5.0V I R = 10 µA Radiant Power, P O 4.5mW I F = 20 mA Peak Wavelength, λP850nm I F = 20 mA Spectrum Width, Half Power, Δλ40nm I F = 20 mA Optical Rise Time, T R20ns I FP = 100 mA Optical Fall Time, T F20ns I FP = 100 mAWait Characteristics, V DD = 3 V, T A = 25° C, Gain = 16, WEN = 1 (unless otherwise noted) Parameter Min Typ Max Units Test Conditions Wait Step Size 2.72ms WTIME = 0xff Wait Number of Step1256stepsCharacteristics of the SDA and SCL bus lines, V DD = 3 V, T A = 25° C (unless otherwise noted)†Parameter SymbolSTANDARD-MODE FAST-MODEUnits Min.Max.Min.Max.SCL clock frequency f SCL01000400kHz Hold time (repeated) START condition.After this period, the first clock pulse is generatedt HD;STA 4.0–0.6–µs LOW period of the SCL clock t LOW 4.7– 1.3–µs HIGH period of the SCL clock t HIGH 4.0–0.6–µs Set-up time for a repeated START condition t SU;STA 4.7–0.6–µs Data hold time t HD;DAT0–0–ns Data set-up time t SU;DAT250–100–ns Rise time of both SDA and SCL signals t r20100020300ns Fall time of both SDA and SCL signals t f2030020300ns Set-up time for STOP condition t SU;STO 4.0–0.6–µs Bus free time between a STOP and START condition t BUF 4.7– 1.3–µs Capacitive load for each bus line C b–400–400pF Noise margin at the LOW level for each connecteddevice (including hysteresis)V nL0.1V BUS–0.1V BUS–VNoise margin at the HIGH level for each connecteddevice (including hysteresis)V nH0.2V BUS–0.2V BUS–V †Specified by design and characterization; not production tested.SDASCLSCLSDAFigure 1. I2C Bus Timing Diagram0.030040050060070080090010001100WAVELENGTH (nm)N O R M A L I Z E D R E S P O N S I T I V I T YCh 0Ch 10.20.40.60.81.01.20100020003000400050006000700080009000010002000300040005000600070008000Meter LUXA v g S e n s o r L U X02004006008001000120014001600030060090012001500Meter LUXA v g S e n s o r L U X00.020.040.060.080.100.010.020.030.040.050.060.070.080.090.1Meter LUXA v g S e n s o r L U X0.80.91.01.12.42.6 2.83 3.2 3.4 3.6 3.8VDD (V)N O R M A L I Z E D I D D @ 3V 25°C0.80.91.01.11.2-60-40-20020*********TEMPERATURE (°C)N O R M A L I Z E D I D D @ 3V1.1-100-80-60-40-20020406080100ANGLE (DEG)N O R M A L I Z E D R E S P O N S I T I V I T Y0.00.10.20.30.40.50.60.70.80.91.0Figure 2. Spectral ResponseFigure 3a. ALS Sensor LUX vs. Meter LUX using Fluorescent LightFigure 3b. ALS Sensor LUX vs. Meter LUX using Incandescent LightFigure 3c. ALS Sensor LUX vs. Meter LUX using Low Lux Fluorescent LightFigure 4a. Normalized IDD vs. VDDFigure 4b. Normalized IDD vs. TemperatureFigure 5. Normalized ALS Response vs. Angular DisplacementPRINCIPLES OF OPERATIONSystem State MachineThe APD S-9900/9901 provides control of ALS, proximity detection and power management functionality through an internal state machine. After a power-on-reset, the device is in the sleep mode. As soon as the PON bit is set, the device will move to the start state. It will then continue through the Prox, Wait and ALS states. If these states are enabled, the device will execute each function. If the PON bit is set to a 0, the state machine will continue until all conversions are completed and then go into a low power sleep mode.Figure 6. Simplified State DiagramCh0 and Ch1 DiodesConventional silicon detectors respond strongly to infrared light, which the human eye does not see. This can lead to significant error when the infrared content of the ambient light is high (such as with incandescent lighting) due to the difference between the silicon detector response and the brightness perceived by the human eye.This problem is overcome in the APDS-9900/9901 through the use of two photodiodes. One of the photodiodes, referred to as the Ch0 channel, is sensitive to both visible and infrared light while the second photodiode is sensitive primarily to infrared light. Two integrating ADCs convert the photodiode currents to digital outputs. The CH1DATA digital value is used to compensate for the effect of the infrared component of light on the CH0DATA digital value. The ADC digital outputs from the two channels are used in a formula to obtain a value that approximates the human eye response in units of Lux.ALS OperationThe ALS engine contains ALS gain control (AGAIN) and two integrating analog-to-digital converters (AD C) for the Ch0 and Ch1 photodiodes. The ALS integration time (ALSIT) impacts both the resolution and the sensitivity of the ALS reading. Integration of both channels occurs simultaneously and upon completion of the conversion cycle, the results are transferred to the Ch0 and CH1 data registers (CDATAx and IRDATAx). This data is also referred to as channel “count”. The transfers are double-buffered to ensure that invalid data is not read during the transfer. After the transfer, the device automatically moves to the next state in accordance with the configured state machine.Figure 7. ALS OperationNOTE: In this document, the nomenclature uses the bit field name in italics followed by the register number and bit number to allow the user to easily identify the register and bit that controls the function. For example, the power on (PON) is in register 0, bit 0. This is represented as PON (r0:b0).The ALS Timing register value (ATIME) for programming the integration time (ALSIT) is a 2’s complement values. The ALS Timing register value can be calculated as follows:ATIME = 256 – ALSIT / 2.72 msInversely, the integration time can be calculated from the register value as follows:ALSIT = 2.72 ms * (256 – ATIME)For example, if a 100 ms integration time is needed, the device needs to be programmed to:ATIME = 256 – (100 / 2.72) = 256 – 37 = 219 = 0xDBConversely, the programmed value of 0xC0 would correspond to:ALSIT = (256 – 0xC0) * 2.72 =64 * 2.72 = 172 ms.Note: 2.72 ms can be estimated as 87 / 32. Multiply by 87 the shift by 5 bits.Calculating ALS LuxDefinition:CH0DATA = 256 * CDATAH (r0x15) + CDATAL (r0x14)CH1DATA = 256 * IRDATAH (r0x17) + IRDATAL (r0x16)IAC = IR Adjusted CountLPC = Lux per CountALSIT = ALS Integration Time (ms)AGAIN = ALS GainDF = Device Factor, DF = 52 for APDS-9900/9901GA = Glass (or Lens) Attenuation FactorB, C, D – CoefficientsLux Equation:IAC1 = CH0DATA – B x CH1DATAIAC2 = C x CH0DATA – D x CH1DATAIAC = Max (IAC1, IAC2, 0)LPC = GA x DF / (ALSIT × AGAIN)Lux = IAC x LPCCoefficients in open air:GA = 0.48B = 2.23C = 0.7D = 1.42Sample Lux Calculation in Open AirAssume the following constants:ALSIT = 400AGAIN = 1LPC = GA x DF / (ALSIT × AGAIN)LPC = 0.48 x 52 / (400 x 1)LPC = 0.06Assume the following measurements:CH0DATA = 5000CH1DATA = 525Then:IAC1 = 5000 – 2.23 x 525 = 3829IAC2 = 0.7 x 5000 – 1.42 x 525 = 2755IAC = Max(3829, 2755, 0) = 3829Lux:Lux = IAC X LPCLux = 3829 X 0.06Lux = 230Note: please refer to application note for coefficient GA, B, C and D calculation with window.Recommend ALS OperationsFigure 8. Gain and Integration Time to Lux without IRWith the programming versatility of the integration time and gain, it can be difficult to understand when to use the different modes. Figure 8 shows a log-log plot of the Lux vs. integration time and gain with a spectral factor of unity and no IR present.The maximum illuminance which can be measured is ~10k Lux with no IR present. The intercept with a count of 1 shows the resolution of each setting. The Lux values in the table increase as the SF increases (spectral attenu-ation increases). For example, if a 10% transmissive glass is used, the Lux values would all be multiplied by 10. The Lux values in the table decrease as the IR Factor decreases. For example, with a 10% IR Factor, which corresponds to a strong incandescent light, the Lux value would need to be divided by 10.There are many factors that will impact the decision on which value to use for integration time and gain. One of the first factors is 50/60 Hz ripple rejection for fluorescent lighting. The programmed value needs to be multiples of 10/8.3 ms or the half cycle time. Both frequencies can be rejected with a programmed value of 50 ms (ATIME = 0xED). With this value, the resolution will be 1.3 Lux per count. If higher resolution is needed, a longer integration time may be needed. In this case, the integration time should be programmed in multiples of 50.The light level is the next determining factor for config-uring device settings. Under bright conditions, the count will be fairly high. If a low light measurement is needed, a higher gain and/or longer integration time will be needed. As a general rule, it is recommended to have a Ch0 channel count of at least 10 to accurately apply the Lux equation. The digital accumulation is limited to 16 bits, which occurs at an integration time of 173 ms. This is the maximum recommended programmed integration time before increasing the gain. (150 ms is the maximum to reduce the fluorescent ripple.)Proximity DetectionProximity sensing uses an internal IR LED light source to emit light which is then viewed by the integrated light detector to measure the amount of reflected light when an object is in the light path. The amount of light detected from a reflected surface can then be used to determine an object’s proximity to the sensor. The APDS-9900/9901 is factory calibrated to meet the requirement of proximity sensing of 100+/- 20 mm, thus eliminating the need for factory calibration of the end equipment. When the APDS-9900/9901 is placed behind a typical glass surface, the proximity detection achieved is around 25 to 40 mm, thus providing an ideal touch-screen disable.The APD S-9900/9901 has controls for the number of IR pulses (PPCOUNT), the integration time (PTIME), the LED drive current (PDRIVE) and the photodiode configuration (PDIODE). At the end of the integration cycle, the results are latched into the proximity data (PDATA) register.The LED drive current is controlled by a regulated current sink on the LDR pin. This feature eliminates the need to use a current limiting resistor to control LED current. The LED drive current can be configured for 12.5 mA, 25 mA, 50 mA, or 100 mA. For higher LED drive requirements, an external P type transistor can be used to control the LED current. The number of LED pulses can be programmed to a value of 1 to 255 pulses as needed. Increasing the number of LED pulses at a given current will increase the sensor sen-sitivity. Sensitivity grows by the square root of the number of pulses. Each pulse has a 16 µS period.The proximity integration time (PTIME) is the period of time that the internal AD C converts the analog signal to a digital count. It is recommend that this be set to a minimum of PTIME = 0xFF or 2.72 ms.Figure 9. Proximity IR LED WaveformIRLED PulsesSubtract Add IR +0.010.1110100100010000CountsL U XOptical Design ConsiderationsThe APDS-9900/9901 simplifies the optical system design by eliminating the need for light pipes and improves system optical efficiency by providing apertures and package shielding which will reduce crosstalk when placed in the final system. By reducing the IR LED to glass surface crosstalk, proximity performance is greatly improved and enables a wide range of cell phone applications utilizing the APD S-9900/9901. The module package design has been optimized for minimum package foot print and short distance proximity of 100 mm typical. The spacing between the glass surface and package top surface is critical to controlling the crosstalk. If the package to top surface spacing gap, window thickness and transmittance are met, there should be no need to add additional com-ponents (such as a barrier) between the LED and photo-diode. Thus with some simple mechanical design imple-mentations, the APDS-9900/9901 will perform well in the end equipment system.APDS-9900/9901 Module Optimized design parameters • Window thickness, t ≤ 1.0 mm • Air gap, g ≤ 0.5 mm• Assuming window IR transmittance 90%The APDS-9900/9901 is available in a low profile package that contains optics which provides optical gain on botht the LED and the sensor side of the package. The device has a package Z height of 1.35 mm and will support air gap of < = 0.5 mm between the glass and the package. The assumption of the optical system level design is that glass surface above the module is < = to 1.0 mm.By integrating the micro-optics in the package, the IR energy emitted can be reduced thus conserving the precious battery life in the application.The system designer has the ability to optimize their designs for slim form factor Z height as well as improve the proximity sensing, save battery power and disable the touch screen in a cellular phone.Plastic/Glass WindowWindows Thickness, tFigure 10. Proximity DetectionFigure 11a. PS Output vs. Distance, at Various Pulse number (LED drive Current). No glass in front of the module, 18% Kodak Grey Card.Figure 11b. PS Output vs. Distance, at Various Pulse number (LED drive Current). No glass in front of the module, 90% Kodak Grey Card.P S C O U N TDISTANCE (cm)P S C O U N TDISTANCE (cm)InterruptsThe interrupt feature of the APD S-9900/9901 simplifies and improves system efficiency by eliminating the need to poll the sensor for a light intensity or proximity value. The interrupt mode is determined by the PIEN or AIEN field in the ENABLE register.The AP S-9900/9901 implements four 16-bit-wide interrupt threshold registers that allow the user to define thresholds above and below a desired light level. For ALS, an interrupt can be generated when the ALS Ch0 data (CDATA) exceeds the upper threshold value (AIHTx) or falls below the lower threshold (AILTx). For proximity, an interrupt can be generated when the proximity data (PDATA) exceeds the upper threshold value (PIHTx) or falls below the lower threshold (PILTx).To further control when an interrupt occurs, the APD S-9900/9901 provides an interrupt persistence feature. This feature allows the user to specify a number of conversion cycles for which an event exceeding the ALS interrupt threshold must persist (APERS) or the proximity interrupt threshold must persist (PPERS) before actually generating an interrupt. Refer to the register descriptions for details on the length of the persistence.Figure 12. Programmable InterruptState DiagramThe following shows a more detailed flow for the state machine. The device starts in the sleep mode. The PON bit is written to enable the device. If the PEN bit is set, the state machine will step through the proximity states of proximity accumulate and then proximity AD C con-version. As soon as the conversion is complete, the state machine will move to the following state.If the WEN bit is set, the state machine will then cycle through the wait state. If the WLONG bit is set, the wait cycles are extended by 12x over normal operation. When the wait counter terminates, the state machine will step to the ALS state.When AEN bit is set, the state machine will step through the ALS states of ALS accumulate and then ALS ADC con-version. In this case, a minimum of 1 integration time step should be programmed. The ALS state machine will continue until it reaches the terminal count at which point the data will be latched in the ALS register and the interrupt set, if enabled.Power ManagementPower consumption can be controlled through the use of the wait state timing since the wait state consumes only 70 µA of power. The following shows an example of using the power management feature to achieve an average power consumption of 158 µA of current with 4 – 100 mA pulses of proximity detection and 50 ms of ALS detection.Figure 13. Extended State DiagramStep: 2.72 msTime: 2.72 ms – 696 ms Minimum – 2.72 msStep: 32.64 msTime: 32.64 ms – 8.35 s Minimum – 32.64 msFigure 14. Power Consumption Calculations Avg = ((0.032 x 100) + (2.72 x 0.175) + (47 x 0.070) + (50 x 0.175)) ÷ 100 = 158 µAExample: 100 ms Cycle Time State Duration (ms) Current (mA)Prox Accum (LED On)Prox ADC WAIT ALS 0.064 (0.032)2.7247501000.1750.0700.175。
你好.. 上电自检序列的SP。
991.117991.127992.117992.127992.227安装在面板9900控制器见10.2电线连线见10.1你好.. 上电自检序列的SP。
洛伊错误第2步的左零指示灯闪无传感器指示注意选择按钮只调整九个人口众多闪烁的数字传感器(显示绿色)步骤3按“要选择2〜K型传感器的选择:(全表见8)9900微处理器为基础的CAL温度控制器提供了一个建立最低精确控制,先进的自整定控制算法的曲调所有五个参数的自动。
简单设置以下步骤通常是足够的,专门的应用程序可能需要9900本手册全面覆盖的功能。
查看设置点减少增加第4步第8步按下进入编程模式功能对右0闪烁Autotuned parometers自动调谐范围自动输入:比例bandGain 0.5 - 2G的〜crange lntegral timeReset 0.2 - 43.5分10 - 255秒微分时间我的R〜吃DAC的方法控制0.5 - 9.0 ×增益比例周期时间按进入传感器的显示屏显示到内存的过程,例如环境温度0.8 - 819秒步骤9按更改为选项选择选项0左闪烁计算为安全起见,但需要接受人工海水6第5步按下以显示设定点第10步,按“同时选择选项1 SLEP指令自动调谐6按住按增加”设置点步骤11按下开始于图自动调谐。
1自动调谐的AT自动调谐铂(一键调整)选择选项2日2步用于微调设定点在困难的应用10。
有用的,如果设置点或热条件大大改变。
杜里,吴冲太平洋将出现一些调整。
如果这是不可接受的,暂时减少设定点。
太平洋DAG的曲调,除了上述比例周期时间重新计算,但需要手动接受所列porameterster1P输出开启和温度升高的控制器现在工厂的PID设置操作:道具带二,五支柱衍生时间20秒5分25秒Integra DAC的方法controll5AT和过程温度交替显示在自动调谐Stod太平洋tUfling的PID自动调谐计算值调整运行后看到6两种类型的自动调谐,以确保提供的各种应用的最佳控制进入新的PID值为了达到最佳效果,请使用正常设置ooint开D负载条件开始自动调谐与负载首席运营官升(100输出功率)图。
D-ILA Projector“JVC Projector Calibration Software 11”INSTRUCTIONSAbout the marks being used in this manualrefers to as explanations/instructions for DLA-NX9 series.refers to as explanations/instructions for DLA-NX5 series.Items without markings are for all models.“JVC Projector Calibration Software” is a tool that enables you to use the projector in an optimal condition at all times with the use of a commercially available optical sensor.ⅥCalibration FeatureBy performing a precise calibration with easy procedures in optimizing the projected images, which changes depending on the installation conditions, such as installation position of the main unit, lens shift/zooming position, you can enjoy high-quality images that are suitable for the installation conditions. Y ou can also maintain the projector in an optional state by correcting distortions, such as those in the color balance, which are caused by the prolonged use of the projector.ⅥEnvironment SettingsAdjusts the video settings according to the installation environment to minimize any influence on the image quality by objects, such as white walls or indirect illumination.ⅥImport/Export Image Quality Adjustment DataEnables you to save the image setting data to a PC from the projector, or imported from a PC to the projector via the LAN terminal.ⅥGamma Data Adjustment FeatureAllows you to adjust the gamma curve of the projector according to your preference.*“JVC Projector Calibration Software” is designed to adjust gamma and color display by changing the settings of the projector.*Please note that setting of the projector is changed by using this software.●Projectors that support calibrationModels supported:DLA-NX9 series: DLA-NX9, DLA-NX7, DLA-N11, DLA-N8, DLA-N7, DLA-RS3000, DLA-RS2000DLA-NX5 series: DLA-NX5, DLA-N6, DLA-N5, DLA-RS1000●PC (computer)●LAN cable●Optical sensorModels supported:Spyder5ELITE/PRO by Datacolori1 Pro2 by X-Rite*Spyder5ELITE/PRO sensor is required when using the Environment Settings feature.To make use of this software, your hardware and software must meet the following specifications.*1When using Windows 8 and Windows 10, install .NET Framework 3.5 SP1 or enable the function from the Control Panel. For details on how to install, refer to the Microsoft website.ⅥCautionThe above requirements do not guarantee that this software will work on your computer.Macintosh systems are not supported.1Install the software on your PC (P . 3)2Connect the main unit and your PC via LAN cable 3Projector and PC Setup (P. 4)4Start up the software (P. 7)5Connect the optical sensor 6Calibration (P. 8)PC (Computer)OS supported Windows 7 (32-bit, 64-bit)Windows 8 (32-bit, 64-bit)Windows 10 (32-bit, 64-bit)Memory 1 GB or more HDD256 MB or moreRequired functions.NET Framework 3.0 / 3.5 *1USB port LAN portInstalling the SoftwareⅥPre-installation CheckࡗBefore starting the installation, ensure that no program is running.ࡗDuring installation or calibration, set the PC to the administrator mode, and disable the screen mode and energy-saving mode of the PC.ࡗDo not connect the optical sensor to the PC before installing the driver.ⅥInstalling SoftwareDouble-click the download file “JVC_PJ_Calibration**_en_v***.zip” to start installation. Download the file to a directory, and unzip the file.The following file is created.●“JVC_PJ_Calibration**_v***.msi”Double-click “JVC_PJ_Calibration**_v***.msi” to start installation.1“Welcome to the JVC Projector Calibration Software Setup Wizard” window appears. Click the [Next] button. 2“Select installation Folder” window appears. You can proceed to the next step with the destination unchanged, or designate a folder if necessary.3“Confirm installation” window appears. Click the [Next] button.4After installation is complete, an “Installation complete” window appears. Click the [Close] button to exit the wizard. Check to ensure that short-cut icons are automatically created both in the Start menu and on theDesktop.ⅥCaution*This software does not run on its own. To run the program, you need to connect the optical sensor to a PC via USB cable, and the PC to a projector via LAN cable.ⅥInstalling the Optical Sensor DriverInstall the driver of the optical sensor to be used.Do not run the software supplied with the optical sensor when using this calibration software.Connect the projector to a PC via LAN cable.Set the TCP/IP for the PC and “Network” of the projector.●Network Settings of the ProjectorOpen the “Network” item under the “Function” tab in the menu.Set “DHCP Client” to “Off”.Set the “IP Address” of the projector to an address different from that of the PC.Example: PC[192 168 0 1 ]Projector[192 168 0 2 ]Set “Subnet Mask” and “Default Gateway” of the projector to the samevalues as the PC.Example: Subnet Mask[255 255 255 0 ]Default Gateway[192 168 0 254 ]After pressing “Set”, press OK to apply new settings.*For details on the PC settings, refer to the instruction manual of the PC. Procedures for setting up Windows7 are described in P. 19.*If the DHCP server is running on the PC that is directly connected to the projector, set “DHCP Client” to “Off”, and then press “Set”.Projector and PC SetupConnect the projector to a network connection device (hub, etc.) via LAN cable. Open the “Network” item under the “Function” tab in the menu.“Set”. Acquisition of the IP address starts automatically.“Subnet Mask”, and “Default Gateway” to the designated values.After pressing “Set”, press OK to apply new settings.*For details on the PC settings, refer to the instruction manual of the PC. Procedures for setting up Windows7 are described in P. 19.*related books.*the network to be connected.*DHCP server is allowed, consult your network administrator.ⅥPrecautions Prior to Use of Calibration•Calibrated result might be different from the factory default data, depending on the operating environment.•During calibration, set the PC to the administrator mode, and disable the screen mode and energy-saving mode of the PC.•After turning on the power of the projector, set to the Picture Mode for performing calibration. Start calibration after waiting for about 30 minutes.•Make sure the brightness of the ambient light in the room is the same as that of the operating environment where the projector is used.•Do not cast a strong ambient light directly on the screen.•Set the “ECO Mode” of the projector to “Off” when the calibration software isrunning.•Do not use the remote control and the operation panel when the calibration software is running.•Do not set to the HIDE mode when the calibration software is running.•The calibration does not work when displaying 3D image.•Calibration does not work when Color Profile has been set to Off. Set to other Color Profile before performing the calibration.•Calibration does not work when Lens Aperture has been set to “Auto 1” or “Auto 2”. Set the lens aperture to "Manual" before performing the calibration.•If an error message is prompted while using the calibration software, close the application and restart the projector. Wait at least 5 minutes before restarting.•If the application is ended due to the error message while backup, importing or exporting is in progress, restart the PC, and perform the operations again.*Upon saving the data after performing calibration, a backup file will be saved automatically to the folder selected in “Setting”. All data of the projector set prior to this process will be overwritten.Double-click the “JVC Projector Calibration software” icon on the Desktop.ⅷ12*Upon saving the data after performing calibration, a backup file will be saved automatically to the selected folder.File name “Serial No._Set Picture mode_Y ear-Month-Date-Time.cbd”Note that the factory default data will be saved as “Serial No._init_Y ear-Month-Date-Time.cbd”. Be careful not to delete this file.3Be sure to click the "OK" button at the bottom right to save the settings before proceeding to the next step.ⅥRecovering Backup Data1Click the “IMPORT” button.2Select the backup data file from the folder, and click “Open”.3The backup data is imported to the projector.Starting up the SoftwareClick(*1) Calibration Type - Gamma+ColorCalibrate gamma and color.- GammaCalibrate gamma only.- ColorCalibrate color only - Log onlyLog the current status.1234*The Profile Name being created and saved won’t be displayed when Custom 1 to 6 is selected, but shown as Custom 1 to 6 instead.*Click the “<<” button to go back to the previous screen if Picture Mode does not appear. Proceed to this screen again.*Filter is set automatically in accordance to the Picture Mode and the Color Profile.*Set to the actual Picture Mode for image viewing before performing calibration. However, even if another Picture Mode has been selected, the calibration result for Color is reflected when the settings of Aperture, Lamp Power and Filter are the same.Calibration ProcedureClickClickClick after installingClick after settingDouble-Click5Calibration in progress.While calibration is in progress, make sure that the surrounding light does not fluctuate.Otherwise, it may affect the calibration results.*Noise may appear on the screen when data writing is in progress.6The results for each Calibration Type are displayed.GammaCalibration results are shown in a white line.The state before calibration is performed is shown in a blue line.The green line represents Gamma 2.2.ColorCalibration results are shown in a white line.The state before calibration is performed is shown in a blue line.The pink line indicates the color gamut of Rec. 709.The chromaticity of each color is indicated using x-y coordinates.*The Profile Name being created and saved won’t be displayed when Custom 1 to 6 is selected, but shown as Custom 1 to 6 instead.Color TempThe chromaticity of the color temperature for each gray level is indicated by ● of the respective gray levels.The red circle indicates the intended chromaticity xy ± 0.01.7Save the results if these are in order.Click the “SAVE” button.After saving is complete, below message is displayed.Click “OK” (to return to the top menu).To exit without saving the result, click (to return to the topmenu).ⅥCautionWhen i1 Pro2 is used, the calibration result includes the characteristics of the screen.It is recommended to set the Screen Adjust function of the projector to off after calibration.GammaColorColor TempClickUse this feature to create a color profile that contains the color space, color temperature, and gamma information.1Click the “Create” button.2Create a color profile.Select a Color Space and a Color T emp setting from the pull-down menu.Y ou can also enter a numerical value directly.After Information is displayed, follow the instructions to select a Filter Type.Filter Type selection is not necessary. (Fixed at Normal)Select a Gamma setting from the pull-down menu.3Enter a profile name.(Not more than 10 one-byte ASCII characters. Extension of the created profile is “prof”.)Click the “START” button after entering the profile name.*To apply the color profile data to the projector, import it to the projector by using the Import feature.Enter a file name and click “Save”.You can enter the name of the creator in “Author”.To exit, click (to return to the top menu).Creating a Color ProfileClickInformationProfile NameClickUse this feature to adjust the gamma data.1Click the “Gamma Data Adjustment” button.2Select the custom gamma table to be adjusted.3Select the gamma setting value to be set as the base value.4Select the color to be adjusted.5Use the mouse to adjust the gamma curve.Adjustment can also be made using the scroll bars at the bottom left.6Click the “SAVE” button to save the newly created gamma data on the PC.7After the adjustment is complete, click(to return to the top menu).Gamma Data Adjustment ProcedureClickCustom Gamma TableGamma Setting Gamma Curve AdjustmentColorScroll BarUse this feature to save/import picture quality setting data, or to import color profiles or gamma data.1Click the “Import/Export” button.ⅥImport/Export Picture Data ●Export ProcedureA Click the pull-down menu, and select “Picture Data (*.jpd)”.B Double-click the Picture Mode (User 1 to 6), and select the Picture Mode (User 1 to 6) to be exported from the pull-down menu. Click the “EXPORT” button.*Click the “<<” button to go back to the previous screen if Picture Mode does not appear. Proceed to this screen again.C Select the destination for saving, and save the file after specifying the file name. (Extension “.jpd” is added upon saving the file.)To exit, click(to return to the top menu).●Import ProcedureA Click the pull-down menu, and select “Picture Data (*.jpd)”.Import/Export ProcedureClickClickDouble-ClickClickClickB Double-click the Picture Mode (User 1 to 6), and select thePicture Mode (User 1 to 6) to be imported from the pull-downmenu. Click the “IMPORT” button.*Click the “<<” button to go back to the previous screen if Picture Mode does not appear. Proceed to this screen again.C Select the file (***.jpd) from the location where it is stored.D Click the “START” button.To exit, click (to return to the top menu).ⅥImport Color ProfileA Click the pull-down menu, and select “Color Profile (*.prof)”.B Double-click the Color Profile (Custom 1 to 6), and select theColor Profile (Custom 1 to 6) to be imported from the pull-downmenu.C Click the “IMPORT” button.Double-ClickClickClick ClickDouble-ClickClickD Select the file (***.prof) from the location where it is stored.E Click the “START” button.To exit, click (to return to the top menu).ⅥImport Gamma DataA Click the pull-down menu, and select “Gamma Data (*.jgd)”.B Double-click Gamma (Custom 1 to 3), and select the Gamma(Custom 1 to 3) to be imported from the pull-down menu.C Click the “IMPORT” button.D Select the file (***.jgd) from the location where it is stored.Click ClickDouble-ClickClickE Click the “START” button.To exit, click (to return to the top menu).ClickEnvironment SettingsClickClickambient light, place the optical sensorwhere light from the projector does notsame time, make sure the ambient lightClick6After installation is complete, click the “>>” button.7Enter a Screen Size (width across corner, inch) and Viewing Distance, and click the “START” button.8The recommended settings are displayed.Picture T one -W Dark Level Bright Level ColorTo view images in these settings, click the “AFTER” button. The recommended setting is applied to the projector.To save these settings, press the button while the “BEFORE” button is displayed on the screen.To restore to the original settings, click the “BEFORE” button.The settings of the projector will be restored to the original settings.If the settings are inappropriate, take the measurements again.To exit, click(to return to the top menu).ClickClickScreen SizeViewing DistanceRecommended Settings1Return to the top menu, and click the “EXIT” button.ⅥWhen the following messages are displayedIf you encounter with the following messages, follow the instructions being explained in the following:Exiting the SoftwareMessage Solution (Details)Error in detecting the model.Go back to the previous screen and check the input signal. After that,proceed to the error message screen.*This software can only be used on compatible models.Could not set up the LAN connection. Please try again.Proceed to the setting screen from the top menu and check the LAN connection by clicking the “CHECK” button.If “NG” is displayed, perform the LAN setting again.Click1Click the “Start” button on the lower left corner of the desktopscreen, and select “Control Panel”.If the screen on the right is displayed, select “Small Icon (S)” from “View by:”. => Proceed to 2).2Select “Network and Sharing Center” when the screen on theright is displayed.3Select “Local Area Network”. (Or, select “Wireless NetworkConnection” if the connection is made by the wireless LAN.)4Select “Properties”.5After choosing “Internet Protocol Version 4 (TCP/Ipv4)”, select“Properties”.6Proceed to 7) for LAN connection via router and complete thesetup in 11).Proceed to 12) if the projector and PC are directly connected by LAN cable and complete the setup in 15).7Check the boxes for “Obtain an IP address automatically” and “Obtain DNS server address automatically”.=> Click “OK”, and then close all the windows by clicking the “x”button.8Turn on the power of the projector.Select “MENU” => “Function” => “Network”, and proceed to 9). 9Set “DHCP Client” to “On”After choosing “Set”, select “Yes” in “Apply network setting?”10Write down the value in “IP Address” (192 168 0 2 in the example) after returning to the screen in 9).11Start the “JVC Projector Calibration Software” on your PC, andselect “Setting” on the right side of the screen.Enter the value from 10) in the “IP address” field on the screen on the right.Click “CHECK”. If “OK” appears on the right of the button, complete the setting by clicking the “OK” button at the bottom right corner.12Check “Use the following IP address:”. Enter the values shown onthe right in the “IP address”, “Subnet Mask” and “DefaultGateway” fields. Check “Use the following DNS serveraddresses:” to enter the value shown on the right in the“Preferred DNS server:” field.=> Click “OK”, and then close all the windows by clicking the “x”button.13Turn on the projector.Select “MENU” => “Function” => “Network”, and proceed to 14). 14Set “DHCP Client” to “Off”.Enter the values shown on the right in the “IP Address”, “Subnet Mask” and “Default Gateway” fields.After choosing “Set”, select “Yes” in “Apply network setting?”15Start the “JVC Projector Calibration Software” on your PC, and select “Setting” on the right side of the screen.Enter the value in the “IP address” field on the screen on the right.Click “CHECK”. If “OK” appears on the right of the button, complete the setting by clicking the “OK” button at the bottom right corner.The specifications of this product is subject to change without prior notice.21Trademarks●Spyder and SpyderPro are either registered trademarks or trademarks of Datacolor in the United States and other countries.●i1 is either registered trademark or trademark of X-Rite in the United States and other countries.●Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and other countries.●Other company names and product names mentioned in this instruction manual are trademarks and/or registered trademarks of the respective companies.© 2018 JVCKENWOOD Corporation 1018NOH-SW-XX。
OPTICAL MODULENETWORK CABLESRECOMMENDED OPTIONSWIRELESS BRIDGEAGGREGATION & CORE ETHERNET SWITCHINDUSTRIAL POE ETHERNET SWITCH≤ 100-ch IPCTypeModel Aggregation switchDS-3E0524TFAccess switch DS-3E01(3)xxP-E(B)Access switchDS-3E01(3)xxP-E/M(B)Access switch DS-3E05xxP-E Access switch DS-3E05xx-EOptical moduleHK-SFP-1.25G-1310-DF-MM100-ch < IPC ≤ 300-chTypeModel Aggregation switch DS-3E2528Access switch DS-3E13xxP-E Access switch DS-3E01(3)xxP-E(B)Access switch DS-3E05xxP-E Access switch DS-3E05xx-E Optical moduleHK-SFP-1.25G-20-1310HK-SFP-1.25G-20-1550300-ch < IPC ≤ 500-chType Model Core switch DS-3E3756TF Core switch DS-3E3740Aggregation switchDS-3E2528Access switch DS-3E23xxP-E Access switch DS-3E05xxP-E Access switch DS-3E01(3)xxP-E(B)Optical moduleHK-SFP-1.25G-20-1310HK-SFP-1.25G-20-1550ModelImageDescriptionHK-SFP-1.25G-20-1310TX 1310 nm/1.25G, RX 1550 nm/1.25G, LC, single mode and single fiber, 20 km, 0~70°C, SFPHK-SFP-1.25G-20-1550TX 1550 nm/1.25G, RX 1310 nm/1.25G, LC, single mode and single fiber, 20 km, 0~70°C, SFPHK-SFP-1.25G-1310-DF-MMTX 1310 nm/1.25G, RX 1310 nm/1.25G, LC, Multi mode and duplex fiber, 1 km, 0~70°C, SFPHK-SFP-1.25G-20-1310-DF TX 1310 nm/1.25G, RX 1310 nm/1.25G, LC, Single mode and duplex fiber, 20 km, 0~70°C, SFPHK-SFP+-10G-20-1270TX 1270 nm/10G, RX 1330 nm/10G, LC, single mode and single fiber, 20 km, 0~70°C, SFP+HK-SFP+-10G-20-1330TX 1330 nm/10G, RX 1270 nm/10G, LC, single mode and single fiber, 20 km, 0~70°C, SFP+Outdoor wireless bridgeElevator wireless bridgeModelDS-3WF01C-2N/ODS-3WF02C-5N/ODS-3WF03CDS-3WF0AC-2NTDS-3WF01C-2NDescriptionSupports point-to-point &point-to-multipoint;Range up to 3 km; 802.11 b/g/n, Built-in 12 dBiantenna up to 150 Mbps; Output power 27 dBm; Angle Horizontal: 60° Vertical: 30°; IP65;Supports point-to-point & point-to-multipoint; Range up to 5 km; 802.11 a/n, Built-in 10 dBi 2×2 MIMO antenna up to 300 Mbps; Output power 24 dBm; Angle Horizontal: 60° Vertical: 16°; IP65;Supports point-to-point & point-to-multipoint; Range up to 15 km; 802.11a/n, Built-in 15dBi 2×2 MIMO antenna with 300 Mbps; Output power 27 dBm; Angle Horizontal: 40° Vertical: 15°; IP65;Supports point-to-point, distance 100 m; IEEE 802.11b/g/n, Built-in 8dBi antenna; Output power 20 dBm; Angle Horizontal: 60° Vertical: 30°; Working temperature: -30 ~65°C; Plug and play, no initial setting;Supports point-to-point, distance 500 m; IEEE 802.11b/g/n, Built-in 6dBi antenna; Output power 27 dBm; Angle Horizontal: 65° Vertical: 60°; Working temperature: -30 ~65°C;Plug and play, no initial setting;ModelDS-1LN5E-SDS-1LN6-UUDS-1LN5E-E/EDS-1LN6-UE-WDescriptionUTP CAT 5E, 305 meters Core diameter: 0.5 mm Solid copper,CM,grayUTP CAT 6, 305 meters Core diameter: 0.565 mm Solid copper, CM, orangeUTP CAT 5E, 305 meters Core diameter: 0.45 mm Solid copper, CMX,grayUTP CAT 6, 305 meters, Core diameter: 0.53 mm Solid copper, CM,whiteModelDS-3E0524TFDS-3E2528DS-3E3740DS-3E3756TFManagement Unmanaged Full-managed Full-managed Full-managed Ports12 × Gigabit RJ45 ports 12 × Gigabit SFP ports24 × Gigabit RJ45 ports 4 × Gigabit SFP ports32 × Gigabit RJ45 ports 8 × 10G SFP+ ports24 × Gigabit RJ45 ports 24 × Gigabit SFP ports 8 × 10G SFP+ portsPacket Forwarding Rate 35.7 Mpps 42 Mpps 136 Mpps 136 Mpps Switching Capacity 48 Gbps 56 Gbps 224 Gbps 256 GbpsMAC Address Table 16 K 8 K64 K64 KManagement Mode -Console, Telnet, SSH2.0, Web, SNMP v1/v2/v3, TFTP, RMONOther Software Features-STP, VLAN, Mirroring, IGMP Snoopingand IGMP v1/v2, L2/L3/L4 ACL, LACP,EAPS, ERPSSTP, VLAN, Mirroring, IGMP Snooping and IGMP v1/v2, L2/L3/L4 ACL, LACP, EAPS,Operating Temperature -5°C~50°C0°C~45°C0°C~45°C0°C~45°C Dimension (440 × 186.5 × 44.5) mm (440 × 230 × 45) mm (442.5 × 315 × 44) mm (442.5 × 350 × 44) mmPower SupplyModelELG-150-48AImageOutput Voltage 48 VRated Current 3.13 ARated Power 150 WOperating Temperature-40~90°CIP Rating IP65AccessoryOptional accessory for industrial PoEswitchIndustrial switchModelDS-3T0306PDS-3T0310PManagement UnmanagedUnmanagedPorts 4 × 10/100 Mbps PoE RJ45 ports2 × Gigabit uplink SFP ports 8 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit uplink SFP ports PoE Standards IEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atPoE Budget≤ 120 W ≤ 240 W Packet Forwarding Rate 3.6 Mpps 4.2 Mpps Switching Capacity 8.8 Gbps 8.8 Gbps MAC Address Table 4 K 4 K Surge Protection 2 KV 2 KV Operating Temperature -40°C~75°C -40°C~75°C Dimension(155 × 130 × 42) mm(170 × 156 × 42) mmUNMANAGED NON-POE ETHERNET SWITCHUNMANAGED POE ETHERNET SWITCHMANAGED POE ETHERNET SWITCHUNMANAGED SWITCHIEEE 802.3bt Standard Hi-PoE, Max. 90 W for One PortIEEE 802.3bt standard Hi-PoE port provides max. 90 W power supply for high power devices such as domes.Up to 300 m Long Range PoE TransmissionBased on all series of camera tests with Hikvisionnetwork cables, up to 300 m long range PoE transmission is provided.Intelligent PoE ManagementWhen the power supply exceeds the limit, PoE ports intelligently manage the power supply, which extends the switch lifetime.4/8-Core Adaptive Power Supply with Less Power Loss8-core power supply reduces the power loss on cables.6KV Surge Protection to Improve Reliability in Harsh EnvironmentThe built-in surge protection device protects the switch from the sudden lightning surge in harsh environment.Design for Video TransmissionVIP port ensures important data transmission when network congestion occurs.Hi-PoE SwitchesModelDS-3E0106HP-EDS-3E0310HP-EPorts1 × 10/100 Mbps Hi-PoE port 3 × 10/100 Mbps PoE ports2 × 10/100 Mbps RJ45 ports 1 × 10/100 Mbps Hi-PoE port 7 × 10/100 Mbps PoE ports 2 × Gigabit RJ45 ports PoE Standards Port 1: IEEE 802.3af, IEEE 802.3at, IEEE802.3btPorts 2 to 4: IEEE 802.3af, IEEE 802.3atPort 1: IEEE 802.3af, IEEE 802.3at, IEEE802.3btPorts 2 to 8: IEEE 802.3af, IEEE 802.3atPoE Budget 60 W 110 W Max. port PoE power Port 1: 60 W Ports 2 to 4: 30 W Port 1: 90 W Ports 2 to 8: 30 W PoE Extend Mode Max. 300 m, Port 1-4Max. 300 m, Port 1-8Packet Forwarding Rate 0.893 Mpps 4.166 Mpps Switching Capacity 1.2 Gbps 5.6 Gbps MAC Address Table 2 K 16 K Surge Protection 6 KV 6 KV Operating Temperature-10°C~55°C -10°C~55°CDimension(145 × 25.6 × 68.45) mm(217.6 × 27.8 × 103.35) mm10/100 Mbps SwitchesModelDS-3E0105P-E/M(B)DS-3E0109P-E/M(B)DS-3E0318P-E/M(B)DS-3E0326P-E/M(B)DS-3E0105P-E(B)DS-3E0109P-E(C)DS-3E0318P-E(B)DS-3E0326P-E(B)Ports4 × 10/100 Mbps PoE RJ45 ports 1 × 10/100 Mbps uplink RJ45 port8 × 10/100 Mbps PoE RJ45 ports 1 × 10/100 Mbps uplink RJ45 port16 × 10/100 Mbps PoE RJ45 ports 1 × Gigabit uplink RJ45 port 1 × Gigabit uplink SFP port 24 × 10/100 Mbps PoE RJ45 ports1 × Gigabit uplink RJ45 port1 × Gigabit uplink SFP port4 × 10/100 Mbps PoE RJ45 ports1 × 10/100 Mbps uplink RJ45 port8 × 10/100 Mbps PoE RJ45 ports1 × 10/100 Mbps uplink RJ45 port16 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit comb ports (2 RJ45 Ports and 2 SFP Ports)24 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit comb ports (2 RJ45Ports and 2 SFP Ports)PoE Standards IEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atPoE Budget35 W60 W130 W230 W60 W115 W 230 W370 WPoE Extend Mode Max.300 m, Port 1-4Max. 300 m, Port 1-8Max. 300 m, Port 9-16Max. 300 m, Port 17-24Max 300 m, Port 1-4Max 300 m, Port 1-8Max. 300 m, Port 9-16Max. 300 m, Port 17-24Packet Forwarding Rate0.744 Mpps 1.34 Mpps 5.36 Mpps 6.55 Mpps 0.74 Mpps 1.34 Mpps 5.36 Mpps 6.55 Mpps Switching Capacity1 Gbps 1.8 Gbps 7.2 Gbps 8.8 Gbps 1 Gbps 1.8 Gbps 7.2 Gbps 8.8 Gbps MAC Address Table 1 K 2 K 4 K 4 K 1 K 2 K 4 K 4 K Surge Protection 6 KV 6 KV 6 KV 6 KV 6 KV 6 KV 6 KV 6 KV Operating Temperature-10°C~55°C -10°C~55°C -10°C~55°C -10°C~55°C -10°C~55°C -10°C~55°C -10°C~55°C -10°C~55°C Dimension(105 × 27.6 × 83.1)mm(170 × 27.6 × 93.1) mm(266 × 44.5 × 220.8) mm(335 × 44.5 × 226) mm(105 × 27.6 × 83.1) mm(170 × 27.6 × 93.1) mm(440 × 44 × 220.8) mm(440 × 44 × 220.8) mmGigabit SwitchesModel DS-3E0505P-EDS-3E0510P-EDS-3E0518P-EDS-3E0526P-EPorts4 × Gigabit PoE RJ45 ports1 × Gigabit RJ45 port 8 × Gigabit PoE RJ45 ports 1 × Gigabit RJ45 port 1 × Gigabit SFP port 16 × Gigabit PoE RJ45 ports 1 × Gigabit RJ45 port 1 × Gigabit SFP port 24 × Gigabit PoE RJ45 ports 1 × Gigabit RJ45 port 1 × Gigabit SFP port PoE Standards IEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atPoE Budget60 W 110 W 230 W 370 W Packet Forwarding Rate 7.44 Mpps 14.88 Mpps 26.784 Mpps 38.688 Mpps Switching Capacity 10 Gbps 20 Gbps 36 Gbps 52 Gbps MAC Address Table 2 K 4 K 8 K 8 K Surge Protection6 KV 6 KV 6 KV 6 KV Operating Temperature-10°C~55°C -10°C~55°C-10°C~55°C -10°C~55°C Dimension(105 × 27.6 × 83.1) mm(217.6 × 27.8 × 108.55) mm(440 × 44 × 220.8) mm(440 × 44 × 220.8) mmModel DS-3E0105D-EDS-3E0108D-EDS-3E0505D-EDS-3E0508D-EDS-3E0508-EDS-3E0516-EDS-3E0524-EPorts 5 × 10/100 Mbps RJ45 ports 8 × 10/100 Mbps RJ45 ports 5 × Gigabit RJ45 ports 8 × Gigabit RJ45 ports 8 × Gigabit RJ45 ports 16 × Gigabit RJ45 ports 24 × Gigabit RJ45 portsSwitching Capacity 1 Gbps 1.6 Gbps 10 Gbps 16 Gbps 16 Gbps 32 Gbps 48 GbpsPacket Forwarding Rate 0.744 Mpps 1.1904 Mpps 7.44 Mpps 11.904 Mpps 11.9 Mpps 23.8 Mpps 35.7 MppsMAC Address Table 1 K 1 K 2 K 4 K 4 K 8 K 8 KSurge Protection ---- 4 KV 4 KV 4 KVOperating Temperature 0°C~40°C 0°C~40°C 0°C~40°C 0°C~40°C 0°C~40°C 0°C~40°C 0°C~40°CDimension (82 × 52 × 22.4) mm (124 × 59 × 23.2) mm (92.8 × 65.8 × 22.8) mm (142 × 90 × 23) mm (186.7 × 106.7 × 33.3) mm (440 × 178.8 × 44) mm (440 × 178.8 × 44) mmModel DS-3E1310P-EDS-3E1318P-EDS-3E1326P-EDS-3E2310PDS-3E2318PDS-3E2326PDS-3E2510PDS-3E2528PManagement Web-managed Web-managed Web-managed Full-managed Full-managed Full-managed Full-managed Full-managed Ports 8 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit comb ports (2 RJ45 Ports and 2 SFP Ports)16 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit comb ports (2 RJ45 Ports and 2 SFP Ports)24 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit comb ports (2 RJ45 Ports and 2 SFP Ports)8 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit comb ports (2 RJ45 Ports and 2 SFP Ports)16 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit comb ports (2 RJ45 Ports and 2 SFP Ports)24 × 10/100 Mbps PoE RJ45 ports 2 × Gigabit comb ports (2 RJ45Ports and 2 SFP Ports)8 × Gigabit PoE RJ45 ports 2 × Gigabit SFP ports 24 × Gigabit PoE RJ45 ports 4 × Gigabit SFP ports PoE Standards IEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atIEEE 802.3af, IEEE802.3atPoE Budget 123 W 230 W370 W125 W 300 W 380 W 125 W 380 W PoE Extend Mode Max. 250 m, Port 1-8Max. 250 m, Port 1-16Max. 250 m, Port 1-24-----Packet Forwarding Rate 1.34 Mpps 5.36 Mpps 6.55 Mpps 5.6 Mpps 8.4 Mpps 9.6 Mpps 15 Mpps 42 Mpps Switching Capacity5.4 Gbps 7.2 Gbps 8.8 Gbps 10 Gbps 21.2 Gbps 22.8 Gbps 20 Gbps 56 Gbps MAC Address Table 4 K4 K4 K8 K8 K8 K8 K8 KManagement Mode SNMP v1/v2, WEB managementConsole, Telnet, SSH2.0, Web, SNMP v1/v2/v3, TFTP, RMONOther Software Features STP, VLAN, Mirroring, IGMP Snooping and IGMP v1/v2STP, VLAN, Mirroring, IGMP Snooping and IGMP v1/v2, L2/L3/L4 ACL, LACP, EAPS, ERPSSurge Protection 4 KV 4 KV 4 KV 4 KV 4 KV 4 KV 4 KV 4 KV Operating Temperature 0°C~40°C 0°C~40°C 0°C~40°C 0°C~40°C 0°C~40°C 0°C~40°C 0°C~45°C 0°C~45°C Dimension(294 × 165.8 × 44) mm(440 × 285 × 43) mm(440 × 285 × 43) mm(280 × 179 × 45) mm(440 × 232 × 44) mm(440 × 232 × 44) mm(280 × 179 × 45) mm(440 × 232 × 45) mm。
Data SheetCisco DCM Series D9900 Digital Content Manager TranscoderToday’s IPTV channel lineup requirements are growing rapidly with the dual drivers of increased standard and high-definition channels and a need for reduced cost of ownership. The Cisco® DCM Series D9900 Digital Content Manager (DCM) Transcoder is a high-density MPEG-2 to H.264 video conversion platform capable of processing a high number of video streams in a compact form factor with low power usage over cost-effective Ethernet links. The DCM Series D9900 Transcoder provides IP-centric headend distributors the ability to convert MPEG-2 compressed MPTS or SPTS to H.264 SPTS or MPTS. With the flexibility of ASI, IP or ATSC off-air inputs and ASI or IP outputs, the DCM Series D9900 Transcoder can be placed at multiple points in the content acquisition subsystem. Converting up to 48 standard definition channels from MPEG-2 to H.264 in a 2RU appliance allows for IP-centric headends processing of a 250 channel line-up in less than one rack.Based on the industry proven track record of the DCM Series D9900, the transcoder plug-in cards for the DCM provides for the next generation of IP-centric headend deployments large and small with high reliability and excellent video quality. The DCM Series D9900 MPEG Transcoder conforms to the Network Equipment Building Standards (NEBS).Figure 1. Cisco DCM Series D9900 TranscoderKey Benefits∙Dense MPEG-2 to H.264 transcoding for IPTV HE and cable video over DOCSIS® applications∙Can be housed in existing DCM chassis and coexists with existing DCM cards (requires Compact Flash upgrade to 16 GB)∙Up to 48 SD / 12 HD channels in 2RU chassis∙Process both SD and HD in the same chassis∙Can be combined with other DCM functionality, e.g., DVB scrambling, BISS-1 (de)scrambling, FEC∙ASI or IP I/O and interface conversion∙ATSC off-air RF input card option∙Satellite reception for digital turnaround applications∙Descrambling via DVB-CI Conditional Access Modules∙PSI/SI/PSIP processor∙Input error monitoring∙Advanced redundancy schemes maximizing up-time∙Low power consumption∙Flexible modular configuration∙Future-proof against changing system requirements∙Seamless IP video networks integration∙Excellent transcoded video quality∙Picture-in-picture (PIP) outputs∙Dolby Digital (AC-3) and MPEG-1 Layer II to HE-AAC audio transcoding∙Audio and metadata pass-throughPhysical ConfigurationThe DCM Series D9900 Transcoder comes in a compact 2RU chassis with hot-swappable and redundant power supplies and can be configured with up to four plug-in cards. The unit can be configured with up to three transcoder modules, which can transcode up to 16 standard definition channels. The DCM Series D9900 Transcoder can use the standard DCM ASI interface card to connect directly to the ASI outputs of satellite receivers, and/or it can be housed with the standard DCM GbE interface card for IP reception and/or streaming. The DVB DRD Satellite Reception and Decryption card adds high density DVB-S and DVB-S2 reception capabilities and Common Interface decryption functionality. For receiving off-air ATSC terrestrial signals, the unit can be fitted with up to 3 high-density 8-VSB input cards.The ASI cards have 10 ASI ports and support full ASI rates allowing freedom in system design. All ASI ports can be individually configured as input or output, and all ASI ports support MPTS and SPTS streams. The GbE I/O cards support four GbE ports via SFP connectors, with the card having a total throughput of 2 Gbps in and 2 Gbps out. The GbE ports support MPTS and SPTS streams.The DCM Series D9900 Transcoder can be fitted with co-processor cards to support advanced MPEG processing functions like DVB Simulcrypt compliant scrambling.Each 8-VSB input card can simultaneously receive up to 8 RF channels and can fully benefit from DCM’s MPEG pro cessing functionality.The 2RU chassis can host up to 3 DRD Satellite Reception and Decryption that provides 12 RF inputs for the reception of DVB-S and DVB-S2 signals and 12 DVB-CI common interface slots for descrambling using CAM modules.Programs from any input can be descrambled, which allows highly efficient and dense configurations.TranscodingFollowing today’s rapidly growing IPTV channel lineup requirements, the DCM Series D9900 performs high density MPEG-2 to H.264 video transcoding and supports optional audio transcoding from AC-3 and MPEG-1 Layer II to HE-AAC. It is capable of processing a high numberof both SD and HD video streams, supporting 1080i and 720p formats at up to full HD resolution. It is designed to support numerous advanced features like closed caption handling, PIP, audio, and metadata pass-through. Functionality of the transcoding modules is enabled via software licenses, allowing operators to scale and grow to meet their needs.Grooming and RemultiplexingThe DCM Series D9900 Transcoder supports advanced demultiplexing and remultiplexing capabilities including advanced PSI and descriptor handling capabilities. PSI, SI, and PSIP tables can be regenerated and played out, changing dynamically according to input changes and configurations. Integration with Continuum® DVP SI-Server allows customized PSI/SI situations to be addressed.Furthermore, it supports extensive transport stream and program analysis, including program-level bit rate measurements on both incoming and outgoing streams. This allows operators to easily configure the content into logical outgoing program groups. Every version also includes monitoring of many TR 101 290 errors.The high processing power of the DCM Series D9900 Transcoder is designed to meet evolving architectures for certain future applications.Conditional AccessThe built-in scrambler allows easy integration with several Conditional Access (CA) systems. Integrating multiple CA systems at the same time is possible through the Simulcrypt interface. The DCM Series D9900 Transcoder also supports BISS-1 scrambling to secure satellite or IP transmission links. It also provides BISS-1 descrambling functionality for remote locations that need to receive BISS-1 encrypted video streams over secured primary distribution links.ATSC Off-air ReceptionThe state-of-the art 8-VSB input card allows four or eight RF channels to be received simultaneously depending on the chosen hardware version. Each RF input is licensed and can be configured independently to provide full flexibility. After reception, each received transport stream can use all other DCM processing functionality and allows operators to build a flexible solution.Satellite Reception and DVB-CI DescramblingFor digital turn-around distribution applications, the Dense Receiver and Decrypter (DRD) card receives DVB-S and DVB-S2 satellite signals on all inputs simultaneously.Each of the DVB-CI slots on a card can descramble satellite feeds and programs from any input, including ASI and GbE, allowing a more efficient use of the Conditional Access Modules (CAMs).Redundancy and ReliabilityThe DCM Series D9900 Transcoder has been designed to help operators configure highly reliable networks. The DCM Series D9900 Transcoder supports hot-swappable and redundant power supplies and hot-swappable cooling fans. The DCM Series D9900 Transcoder can be configured in a hot 1:1 configuration to support maximum up-time with minimum switch-over interruption. To maximize service availability, the DCM Series D9900 Transcoder also offers port, transport stream, and service redundancy.High-Quality Video Transmission over IP NetworksAs IP is becoming more and more the transport network of choice, advanced functionality is required to maximize quality of service. The DCM Series D9900 Transcoder’s extensive set of IP over GbE features, including extensive protocol support and Forward Error Correction (Pro-MPEG COP3 release 2 / SMPTE-2022 FEC) functionality, allow for seamless integration with these IP networks.Security FunctionsToda y’s IP attack profiles cover operating systems, networks, applications, and protocols. These attacks can cause hours or days of downtime, affecting availability of resources and creating serious breaches in data confidentiality and integrity. Depending on the level of the attack and the type of information compromised, the consequences vary in degree from mildly annoying to completely debilitating, and the cost of troubleshooting and recovery can become considerable. To cope with the increased complex and open nature of the IP network environment, the DCM Series D9900 Transcoder is designed with robust and comprehensive security features.User Interface and ManagementThe DCM Series D9900 Transcoder is controlled via an easy and intuitive GUI. To keep things simple, there is no software to load on the user’s computer. The GUI of the DCM Series D9900 Transcoder is a HTML-based user interface that can be opened using Microsoft® Internet Explorer 7.0 and 8.0 or Firefox 3.5 and 3.6. The GUI supports simple program provisioning through drag-and-drop functionality. The interface provides detailed information to the user, showing the DCM Series D9900 Transcoder configuration, input and output bit rate measurements, transport stream alarms, and other information. For easy access to content details, sorting of program information can be performed on various program criteria, including input and output ports, bit rates, and program names. The general-purpose inputs on the chassis allow for triggering of service backup or digital program insertion.For integrated network monitoring and control, the DCM Series D9900 Transcoder is integrated with the ROSA® Network Management and Control (NMC) system. All functionality available via the HTML interface is available with the ROSA control system..FeaturesInterfaces∙Up to 30 ASI interface ports (10 ASI ports per ASI I/O card)◦SPTS and MPTS supported◦User-configurable as input or output on a per-port basis◦Each ASI port supports up to 213 Mbps data rate◦Connector type: BNC∙Up to 12 GbE ports (four ports per GbE I/O card)◦SPTS and MPTS supported◦Unicast and multicast support◦Protocols supported: 802.3, Ethernet, VLAN, RTP, UDP, IP, ARP, ICMP, IGMPv2 / v3◦Port configurations: 2+2 backup or 2 inputs + 2 outputs◦Quality of Service: Diffserv/TOS 802.1p◦FEC according to Pro-MPEG COP3 release 2 (COP3R2)/SMPTE-2022◦Low latency dejitter option◦Connector type: SFP interfaces∙Up to 24 ATSC 8-VSB RF input ports◦ 4 and 8 RF input version available◦Each RF input is enabled via software licensing◦ATSC A/74 tested◦Supports reception of MPTS and SPTS∙Up to 12 DVB-S and DVB-S2 RF input ports◦ 2 and 4 RF satellite input versions available◦Each RF input is enabled via software licensing◦Supports reception of single and multi-stream signals∙Up to 12 Common Interface slots for CAMs◦ 2 and 4 CI slot versions available◦Supports all major Conditional Access Modules (CAM)◦Supports descrambling of programs from any inputTranscoding∙Up to 48 SD or 12 HD channels in 2RU chassis∙Up to 96 stereo pairs transcoding of AC-3 or MPEG-1 Layer II to HE-AAC∙Support of audio and metadata pass-through∙Closed caption handling∙Integrated PIP support∙Transcoding features enabled through software licenses on a per program basisRemultiplexing∙PID filtering / remapping on each input∙PID tracking∙Auxiliary PID synchronization with video∙Remultiplexing of services and components∙Content routing from any input to any output portMonitoring∙Error monitoring on each input∙Input and output bit rate measurements∙Graphical bit rate viewer showing transrater group bit ratesRedundancy∙1:1 redundant configuration supported∙1:1 GbE port backup supported∙ASI, GbE port and GbE port pair mirroring∙Input service and transport stream redundancyExtended PSI-SI Capabilities∙Dynamic PSI/SI regeneration∙PSI/SI playout carousel∙Import of PSI/SI tables according to DVB Simulcrypt∙PSI descriptor editing capabilities∙Built-in PSI/SI viewer∙Pass-through and regeneration of PSIP tablesSystem∙10 Gbps internal processing throughput with 8 Gbps of I/O capability∙User hot-swappable power supplies and fans∙Redundant load-sharing power supplies, supports both AC and DC power supplies ∙Configuration settings stored on Compact Flash card (transferable to cold standby unit)Management∙SNMP traps∙ROSA management∙Easy control using web browser∙Ethernet interface for communication with management system and web browser∙IPsec∙General-purpose inputsProduct SpecificationsTable 1. Product SpecificationsNotes:1. SFP Module not included.2. Input level range for channel 2: -20 to -79 dBm at ambient temperature.Figure 2. Cisco DCM Series D9900 Transcoder Rear Panel with AC and DC power supply, 1 GbE card, and 3 Transcoder cardsOrdering InformationTable 2. Ordering Information Cisco DCM Series D9900 ComponentsTable 3. Ordering Information SFP Plug-ins (see Note)Note: All Class 1 SFP plug-ins are according to IEC 60825-1 (1997) Amendment 2 (2001).Data SheetService and SupportUsing the Cisco Lifecycle Services approach, Cisco and its partners provide a broad portfolio of end-to-end services and support that can help increase your network's business value and return on investment. This approach defines the minimum set of activities needed by technology and by network complexity to help you successfully deploy and operate Cisco technologies and optimize their performance throughout the lifecycle of your network.For More InformationTo learn more about this product, contact your local account representative.To subscribe to receive end-of-life/end-of-sale information, go to/cisco/support/notifications.html.Manage your network with ROSA service and element management. Get faster mean-time-to-repair, increased uptime, and management that evolves as you provision your networks.US toll-free 1-800-722-2009. EMEA +32 56 445 445. /go/rosa.Cisco and the Cisco logo are trademarks or registered trademarks of Cisco and/or its affiliates in the U.S. and other countries. A listing of Cisco's trademarks can be found at /go/trademarks.DOCSIS is a registered trademark of Cable Television Laboratories, Inc.Other third party trademarks mentioned are the property of their respective owners.The use of the word partner does not imply a partnership relationship between Cisco and any other company. (1009R)Specifications and product availability are subject to change without notice.© 2009-2011 Cisco and/or its affiliates. All rights reserved.Cisco Systems, Inc.800 722-2009 or 678 277-1120 Part Number 7017813 Rev FAugust 2011。
安捷伦系列芯片简介安捷伦和安华高安捷伦科技(NYSE:A)是由美国惠普公司战略重组分立而成的,其业务重点包括通信、电子及化学分析与生命科学。
1999 年11月18日, 安捷伦科技以代码“A”在纽约股票交易所挂牌上市。
虽然在除了光学传感之外的领域里,安捷伦也取得了巨大的成就。
但是对于广大玩家来说,大家提起安捷伦(AGILENT),还是首先想起它作为世界上最著名的鼠标用光学/激光感应器材的生产厂家。
的确,在上世纪90年代和本世纪初的这段时间里,安捷伦几乎是高档光电/激光鼠标芯片的代名词,作为安捷伦历史悠久的合作伙伴,在上世纪末,在MS和安捷伦勾搭上之前,LOGITECH几乎是垄断了高端外设的市场。
而在山的那一边,那条叫RAZER的小蛇,当时连牙还没有长全呢~在2005年8月,投资公司Kohlberg Kravis Roberts & Co.会同风险投资商Silver Lake Partners,以26.6亿美的价格并购了安捷伦科技。
并购后,新成立了公司A V AGO,也就是现在大家所说的安华高,并且号称全球最大的非上市独立半导体公司。
Avago Technologies 拥有5,500多种系列产品,主要应用于无线和有线通信、工业、汽车、消费电子及存储和计算机等广阔的应用领域和终端市场。
它在光电耦合器、红外线收发器、光通信器件、打印机ASIC、光学鼠标传感器和运动控制编码器等领域一直保持市场前3名的领导地位。
通过并购,安华高遗传了安捷伦全部的研发能力和市场网络,并且将其在光电鼠标处理芯片上的技术优势地位继续延续。
在下面的文章中,在介绍产品的时候,我决定仍然使用安捷伦这个名字,也当作是对它的一个怀念和敬意吧首先补充一点小知识,有关激光引擎和光学引擎的激光引擎和光学引擎的区别~~~从原理上来讲是类似的,但是由于激光是相干光~ 所以具有比LED光源更好的特性~ 安捷伦自己的描述是这样的A, LED光学引擎的原理示意图B,激光引擎的原理示意图C, 激光比LED引擎的优越性D, 激光可支持更多的表面激光引擎可以支持的表面包括:纸,木材,包装纸,粗斜纹棉布,棉布,榻榻米(!),地毯(!),金属,瓷砖,塑料,福米卡塑料(!?),网格(!!!)LED引擎可以支持的表面包括:纸,木材,包装纸,粗斜纹棉布,棉布,纯黑表面安捷伦到目前为止,所出产的鼠标应用方案如下:LED光学引擎系列型号系列描述ADNS-2030 无线系列低功率光学传感器,为无线应用优化ADNS-2051 有线系列中频光学传感器,为有线/无线应用ADNS-2610 有线(小型封装)入门级,小型封装光学传感器,为普通鼠标应用ADNS-2620 有线(小型封装)入门级,小型封装光学传感器,性能提高ADNS-3040 无线系列超低功率光学传感器,为无线应用优化ADNS-3060 有线系列高性能光学传感器ADNS-3080 游戏系列高分辨率光学传感器,为游戏应用ADNS-3530 MINI系列 MINI系列低功率,芯片-基板-LED整合设计光学传感器,为无线应用设计ADNS-3550 MINI系列 MINI系列低功率,芯片-基板-LED整合设计光学传感器,为无线应用设计ADNS-5000 有线系列基于LED的导航传感器ADNS-5020-EN 有线(小型封装)小型封装光学传感器,较入门级性能有所提高ADNS-5030 无线(小型封装)低功率,小型封装光学传感器,为无线应用设计ADNS-5050 有线系列性能提升的基于LED的导航传感器LaserStream 激光引擎系列型号系列描述ADNS-6000 有线系列高性能激光鼠标传感器ADNS-6010 游戏系列高分辨率激光鼠标传感器,为游戏设计ADNS-6090 专业游戏系列增强型游戏级激光传感器ADNS-6530 MINI系列 MINI系列低功率,芯片-基板-LED一体化设计激光传感器,为无线应用设计ADNS-7010 休闲游戏系列休闲型游戏级激光传感器ADNS-7050 无线系列低功率激光传感器ADNS-7530 无线系列整合型,入门级,小型封装激光传感器ADNS-7550 有线系列整合型,入门级,小型封装激光传感器目前,以LOGI为主的厂家,包括MS等,以及国产的双飞燕等,均广泛使用安捷伦的芯片进行一下总结:作为业界的领袖企业,安捷伦(安华高)的芯片发展,也代表这整个业界的技术发展方向。