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英文字母开头的课程：ALGOL语言ALGOL LanguageBASIC ＆FORTRAN 语言BASIC Language ＆FORTRAN LanguageBASIC 语言BASIC LanguageBASIC 语言及应用BASIC Language ＆ApplicationC 语言C LanguageC++程序设计C++ Program DesigningCAD 概论Introduction to CADCAD/CAM CAD/CAMCET—4 College English Test (Band 4）CET—6 College English Test （Band 6）COBOL语言COBOL LanguageCOBOL语言程序设计COBOL Language Program DesigningC与UNIX环境C Language ＆Unix EnvironmentC语言科学计算方法Scientific Computation Method in CC语言与生物医学信息处理C Language ＆Biomedical Information ProcessingdBASE Ⅲ课程设计Course Exercise in dBASE ⅢFORTRAN 77 语言FORTRAN 77 LanguageFORTRAN语言FORTRAN LanguageFoxBase程序设计FoxBase ProgrammingHopf代数Hopf AlgebraHopf代数与代数群量子群Hopf Algebra , Algebraic Group and Qua ntum GroupIBM—PC/XT Fundamentals of Microcomputer IBM—PC/XTIBM—PC微机原理Fundamentals of Microcomputer IBM-PCIBM汇编及高级语言的接口IBM Assembly ＆its Interfaces with Advanced Programming LanguagesInternet与Intranet技术Internet and Intranet TechnologyLSI设计基础Basic of LSI DesigningOS/2操作系统OS/2 Operation SystemPASCAL大型作业PASCAL Wide Range WorkingPASCAL课程设计Course Exercise in PASCALPASCAL语言PASCAL LanguagePC机原理Principle of PCUnix编程环境Unix Programming EnvironmentUnix操作系统分析Analysis of Unix SystemVLSI的EDA技术EDA Techniques for VLSIVLSI技术与检测方法VLSI Techniques & Its ExaminationVLSI设计基础Basis of VLSI DesignWindows系统Windows Operation SystemX光分析X-ray AnalysisX射线金属学X-Ray ＆MetallographyX射线与电镜X—ray ＆Electric MicroscopeZ—80汇编语言程序设计Z—80 Pragramming in Assembly LanguagesB开头的课程：板壳非线性力学Nonlinear Mechanics of Plate and Shell板壳理论Plate Theory ，Theory of Plate and Shell板壳力学Plate Mechanics办公自动化Office Automatization办公自动化系统毕业设计Office Automatization Thesis办公自动化系统设计Office Automatization Design半波实验Semiwave Experiment半导体变流技术Semiconductor Converting Technology半导体材料Semiconductor Materials半导体测量Measurement of Semiconductors半导体瓷敏元件Semiconductor Porcelain—Sensitive Elements半导体光电子学Semiconductor Optic Electronics半导体化学Semiconductor Chemistry半导体激光器Semiconductor Laser Unit半导体集成电路Semiconductor Integrated Circuitry半导体理论Semi—conductive Theory半导体器件Semiconductor Devices半导体器件工艺原理Technological Fundamentals of Semiconductor Device半导体器件课程设计Course Design of Semiconductor Devices半导体物理Semiconductor Physics半导体专业Semi-conduction Specialty半导体专业实验Specialty Experiment of Semiconductor半群理论Semi—group Theory保健食品监督评价Evaluation and Supervision on Health Food s保险学Insurance保险学Insurance报告文学专题Special Subject On Reportage报刊编辑学Newspaper ＆Magazine Editing报刊选读Selected Readings of Newspaper & Magazine报纸编辑学Newspaper Editing泵与风机Pumps and Fans泵与水机Pumps & Water Turbines毕业论文Graduation Thesis毕业设计Graduation Thesis毕业实习Graduation Practice编译方法Compilation Method编译方法Methods of Compiling编译技术Technique of Compiling编译原理Fundamentals of Compiling, Principles of Compiler编译原理课程设计Course Design of Compiling变电站的微机检测Computer Testing in Transformer Substation变电站的微机检测与控制Computer Testing ＆Control in Transformer Substation变分法与张量Calculus of Variations ＆Tensor变分学Calculus of Variations变流技术Semiconductor Converting Technology变质量系统热力学与新型回转压Variable Quality System Thermal Mechanics & NeoRo 表面活性剂化学及应用Chemistry and Application of Surfactant表面活性物质Surface Reactive Materials并行处理Parallel Processing并行处理与并行程序设计Parallel Processing and Parallel Programming并行算法Parallel Algorithmic波谱学Spectroscopy, Wave Spectrum波谱学实验Spectroscopic Experiment薄膜光学Film Optics薄膜物理Thin Film Physics不育症的病因学Etiology of InfertilityC开头的课程：材料的力学性能测试Measurement of Material Mechanical Performance材料化学Material Chemistry材料力学Mechanics of Materials财税法规与税务会计Laws and Regulations of Finance and Taxes财务案例分析Case Analysis of Finance Management财务案例分析Case Analysis of Financial Management财务报告分析Analysis of Financial Statement财务成本管理Financial Cost Management财务管理Financial Management, Financial Cost Management财务管理与分析Financial Management and Analysis财务会计Financial Accountancy财政学Public Finance财政与金融Finance ＆Banking财政与税收Finance & Revenue财政与税收理论Theories on Public Finance and Tax Revenue财政与信贷Finance & Credit操作系统Disk Operating System （DOS）操作系统课程设计Course Design in Disk Operating System操作系统与编译原理Disk Operating System & Fundamentals of Compiling操作系统原理Fundamentals of Disk Operating System，Principles of Operating System 测量技术基础Foundation of Measurement Technology测量原理与仪器设计Measurement Fundamentals ＆Meter Design测试技术Testing Technology测试与信号变换处理Testing ＆Signal Transformation Processing策波测量技术Technique of Whip Wave Measurement策略管理Strategic Management产品学Production产业经济学Industrial Economy产业组织Industrial Organization产业组织学Industrial Organization Technology常微分方程Ordinary Differential Equations场论Field Theory超导磁体及应用Superconductive Magnet ＆Application超导及应用Superconductive ＆Application超高真空科学与技术Science and Technology of Ultrahigh Vacuum 60超精密加工和微细加工Super—Precision ＆Minuteness Processing超精微细加工Super-Precision & Minuteness Processing超声及应用Supersonics Application成本会计Cost Accounting成像原理与技术Principles & Technique of Imaging成组技术Grouping Technique城市规划原理Fundamentals of City Planning城市社会学Urban Sociology程控数字交换Program Controlling of Digital Exchange程序设计Program Designing程序设计方法学Methodology of Programming，Methods of Programming 程序设计及算法语言Program Designing & Algorithmic Language程序设计语言Programming Language齿轮啮合原理Principles of Gear Connection冲击测量及误差Punching Measurement ＆Error冲压工艺Sheet Metal Forming Technology抽象代数Abstract Algebra初等数学Primary Mathematics传坳概论Introduction to Pass Col传动概论Introduction to Transmission传感技术Sensor Technique传感技术及应用Sensor Technique ＆Application传感器及应用Sensors ＆Application传感器与检测技术Sensors & Testing Technology传感器原理Fundamentals of Sensors传感器原理及应用Fundamentals of Sensors ＆Application传热学Heat Transfer船舶操纵Ship Controlling船舶电力系统Ship Electrical Power System船舶电力系统课程设计Course Exercise in Ship Electrical Power System船舶电气传动自动化Ship Electrified Transmission Automation船舶电站Ship Power Station船舶动力装置Ship Power Equipment船舶概论Introduction to Ships船舶焊接与材料Welding & Materials on Ship船舶机械控制技术Mechanic Control Technology for Ships船舶机械拖动Ship Mechanic Towage船舶建筑美学Artistic Designing of Ships船舶结构Ship Structure船舶结构力学Structural Mechanics for Ships船舶结构与制图Ship Structure & Graphing船舶静力学Ship Statics船舶强度与结构设计Designing Ship Intensity ＆Structure船舶设计原理Principles of Ship Designing船舶推进Ship Propelling船舶摇摆Ship Swaying船舶摇摆与操纵Ship Swaying ＆Manipulating船舶振动Ship Vibration船舶阻力Ship Resistance船体建造工艺Ship—Building Technology船体结构Ship Structure船体结构图Ship Structure Graphing船体结构与制图Ship Structure ＆Graphing船体振动学Ship Vibration船体制图Ship Graphing船用电器设备Marine Electrical Equipment创造心理学Creativity Psychology词汇学Lexicology磁测量技术Magnetic Measurement Technology磁传感器Magnetic Sensor磁存储设备设计原理Fundamental Design of Magnetic Memory Equipment 磁记录Magnetographic磁记录技术Magnetographic Technology磁记录物理Magnetographic Physics磁路设计与场计算Magnetic Path Designing & Magnetic Field Calculati磁盘控制器Magnetic Disk Controler磁性材料Magnetic Materials磁性测量Magnetic Measurement磁性物理Magnetophysics磁原理及应用Principles of Catalyzation & Application催化原理Principles of CatalysisD开头的课程：大电流测量Super—Current Measurement大电源测量Super—Power Measurement大机组协调控制Coordination ＆Control of Generator Networks大跨度房屋结构Large-Span House structure大型锅炉概况Introduction to Large-V olume Boilers大型火电机组控制Control of Large Thermal Power Generator Networks大型数据库原理与高级开发技术Principles of Large—Scale Data—Bas e and Advanced Development Technology大学德语College German大学俄语College Russian大学法语College French大学日语College Japanese大学生心理学Psychology Introduction大学物理College Physics大学物理实验Experiment of College Physics大学英语College English大学语文College Chinese大众传播学Mass Media代数几何Algebraic Geometry代数几何Algebraic Geometry代数曲面Algebraic Surfaces代数图论Algebraic Graph Theory代数拓扑Algebraic Topology代数学Algebra代用燃料Substitute Fuel代用运放电路Simulated Transmittal Circuit单片机与接口技术Mono—Chip Computers ＆Interface Technique单片机原理Fundamentals of Mono-Chip Computers单片机原理及应用Fundamentals of Mono—Chip Computers ＆Applications弹塑性力学Elastic—Plastic Mechanics弹性波Elastic Waves弹性力学Elastic Mechanics，Theory of Elastic Mechanics弹性元件的理论及设计Theory and Design of Elastic Element蛋白质结构基础Principle of Protein Structure蛋白质生物化学技术Biochemical Technology of Protein当代国际关系Contemporary International Relationship当代国外社会思维评价Evaluation of Contemporary Foreign Social Thought当代文学Contemporary Literature当代文学专题Topics on Contemporary Literature当代西方哲学Contemporary Western Philosophy当代戏剧与电影Contemporary Drama ＆Films当代资本主义经济Contemporary Capitalist Economy党史History of the Party导波光学Wave Guiding Optics德育Moral Education等离子体工程Plasma Engineering低频电子线路Low Frequency Electric Circuit低温测试技术Cryo Testing Technique低温传热学Cryo Conduction低温固体物理Cryo Solid Physics低温技术原理与装置Fundamentals of Cryo Technology & Equipment低温技术中的微机原理Priciples of Microcomputer in Cryo Technology低温绝热Cryo Heat Insulation低温气体制冷机Cryo Gas Refrigerator低温热管Cryo Heat Tube低温设备Cryo Equipment低温生物冻干技术Biological Cryo Freezing Drying Technology低温生物学原理与应用Principle ＆Application of Cryobiology低温实验技术Cryo Experimentation Technology低温物理导论Cryo Physic Concepts低温物理概论Cryo Physic Concepts低温仪表及测试Cryo Meters ＆Measurement低温原理Cryo Fundamentals低温原理与设备Cryo Fundamentals & Equipment低温制冷机Cryo Refrigerator低温中的微机应用Application of Microcomputer in Cryo Technology低温装置Cryo Equipment低噪声电子电路Low—Noise Electric Circuit低噪声电子设计Low—Noise Electronic Designing低噪声放大与弱检Low—Noise Increasing ＆Decreasing低噪声与弱信号检测Detection of Low Noise ＆Weak Signals地基基础课程设计Course Design of Groundsill Basis地理Geography第二次世界大战史History of World War II典型计算机分析Classical Computer Analysis电测量技术Electric Measurement Technology电厂计算机控制系统Computer Control System in Power Plants电磁测量实验技术Electromagnetic Measurement Experiment & Technology 电磁场计算机Electromagnetic Field Computers电磁场理论Theory of Electromagnetic Fields电磁场数值计算Numerical Calculation of Electromagnetic Fields电磁场与电磁波Electromagnetic Fields ＆Magnetic Waves电磁场与微波技术Electromagnetic Fields & Micro—Wave Technology电磁场中的数值方法Numerical Methods in Electromagnetic Fields电磁场中的数值计算Numerical Calculation in Electromagnetic Fields电磁学Electromagnetics电动力学Electrodynamics电镀Plating电分析化学Electro—Analytical Chemistry电工材料Electrical Materials电工测量技术基础Measurement Technology of Electrical Engineering电工测试技术基础Testing Technology of Electrical Engineering电工产品学Electrotechnical Products电工电子技术基础Electrical Technology ＆Electrical Engineering电工电子学Electronics in Electrical Engineering电工基础Fundamental Theory of Electrical Engineering电工基础理论Fundamental Theory of Electrical Engineering电工基础实验Basic Experiment in Electrical Engineering电工技术Electrotechnics电工技术基础Fundamentals of Electrotechnics电工实习Electrical Engineering Practice电工实验Experiment of Electrical Engineering电工实验技术基础Experiment Technology of Electrical Engineering电工学Electrical Engineering电工与电机控制Electrical Engineering ＆Motor Control电弧电接触Electrical Arc Contact电弧焊及电渣焊Electric Arc Welding ＆Electroslag Welding电化学测试技术Electrochemical Measurement Technology电化学工程Electrochemical Engineering电化学工艺学Electrochemical Technology电机Motor电机测试技术Motor Measuring Technology电机电磁场的分析与计算Analysis & Calculation of Electrical Motor &电机电磁场的数值计算Calculation of Electrical Motor ＆Electromagnetic Fields 电机电磁场理论Theory of Electrical Moto ＆Electromagnetic Fields电机电器与供电Motor Elements and Power Supply电机矩阵分析法Analysis of Electrical Motor Matrix电机课程设计Course Exercise in Electric Engine电机绕组理论Theory of Motor Winding电机绕组理论及应用Theory ＆Application of Motor Winding电机设计Design of Electrical Motor电机瞬变过程Electrical Motor Change Processes电机统一理论Theory of Electrical Motor Integration电机学Electrical Motor电机学及控制电机Electrical Machinery Control & Technology电机与拖动Electrical Machinery & Towage电机原理Principle of Electric Engine电机原理与拖动Principles of Electrical Machinery & Towage电机专题Lectures on Electric Engine电接触与电弧Electrical Contact & Electrical Arc电介质物理Dielectric Physics电镜Electronic Speculum电力电子电路Power Electronic Circuit电力电子电器Power Electronic Equipment电力电子器件Power Electronic Devices电力电子学Power Electronics电力工程Electrical Power Engineering电力企业管理Management of Electrical Enterprise电力生产技术Technology of Electrical Power Generation电力生产优化管理Optimal Management of Electrical Power Generation电力拖动Electric Traction电力拖动基础Fundamentals for Electrical Towage电力拖动控制系统Electrical Towage Control Systems电力拖动与电气控制Electrical Towage ＆Electrical Control电力系统Power Systems电力系统电源最优化规划Optimal Planning of Power Source in a Power System电力系统短路Power System Shortcuts电力系统分析Power System Analysis电力系统规划Power System Planning电力系统过电压Hyper-V oltage of Power Systems电力系统继电保护原理Power System Relay Protection电力系统经济分析Economical Analysis of Power Systems电力系统经济运行Economical Operation of Power Systems电力系统可靠性Power System Reliability电力系统可靠性分析Power System Reliability Analysis电力系统课程设计Course Design of Power Systems电力系统无功补偿及应用Non-Work Compensation in Power Systems ＆Applicati 电力系统谐波Harmonious Waves in Power Systems电力系统优化设计Optimal Designing of Power Systems电力系统远动Operation of Electric Systems电力系统远动技术Operation Technique of Electric Systems电力系统运行Operation of Electric Systems电力系统自动化Automation of Electric Systems电力系统自动装置Power System Automation Equipment电力系统最优规划Optimal Planning in Power System电力装置课程设计Course Design of Power Equipment电力装置与系统Power Equipment ＆System电路测量与实验Circuit Measurement & Experiment电路测试技术Circuit Measurement Technology电路测试技术基础Fundamentals of Circuit Measurement Technology电路测试技术及实验Circuit Measurement Technology ＆Experiments电路分析基础Basis of Circuit Analysis电路分析基础实验Basic Experiment on Circuit Analysis电路分析实验Experiment on Circuit Analysis电路和电子技术Circuit and Electronic Technique电路基本理论Basis Theory of Circuitry电路及电子线路CAD Circuitry CAD电路理论Theory of Circuit电路理论基础Fundamental Theory of Circuit电路理论实验Experiments in Theory of Circuct电路设计与测试技术Circuit Designing & Measurement Technology电气测量技术Electrical Measurement Technology电气传动Electrified Transmission电气控制技术Electrical Control Technology电器设计Electrical Appliances Designing电器学Electrical Appliances电器与控制Electrical Appliances ＆Control电生理技术基础Basics of Electricphysiological Technology电视传感器图象显示Television Sensor Graphic Display电视接收技术Television Reception Technology电视节目Television Programs电视节目制作Television Program Designing电视新技术New Television Technology电视新闻Television News电视原理Principles of Television电网调度自动化Automation of Electric Network Management电学实验Electrical Experiment电影艺术Art of Film Making电站微机检测控制Computerized Measurement ＆Control of Power Statio电子材料与元件测试技术Measuring Technology of Electronic Material and Element电子材料元件Electronic Material and Element电子材料元件测量Electronic Material and Element Measurement电子测量与实验技术Technology of Electronic Measurement ＆Experiment电子测试Electronic Testing电子测试技术Electronic Testing Technology电子测试技术与实验Electronic Testing Technology ＆Experiment电子测试实验Electronic Testing Experiment电子测试与实验技术Electronic Testing Technology & Experiment电子机械运动控制技术Technology of Electronic Mechanic Movement Control电子技术Technology of Electronics电子技术腐蚀测试中的应用Application of Electronic Technology in Erosion Measurement 电子技术基础Basic Electronic Technology电子技术基础与实验Basic Electronic Technology ＆Experiment电子技术课程设计Course Exercise in Electronic Technology电子技术实验Experiment in Electronic Technology电子技术综合性设计实验Experiment in Electronic Technology电子理论实验Experiment in Electronic Theory电子商务Electronic Commerce电子系统的ASIC技术ASIC Design Technologies电子显微分析Electronic Micro—Analysis电子显微镜Electronic Microscope电子线路Electronic Circuit电子线路的计算机辅助设计Computer Associate Design of Electronic Circuit电子线路课程设计Course Design of Electronic Circuit电子线路设计与测试技术Electronic Circuit Design & Measurement Technology电子线路设计与测试实验Electronic Circuit Design & Measurement Experiment电子线路实验Experiment in Electronic Circuit电子学Electronics电子学课程设计Course Design of Electronics电子照相技术Electronic Photographing Technology雕塑艺术欣赏Appreciation of Sculptural Art调节原理Principles of Regulation调节装置Regulation Equipment动力机械CAD Dynamical Machine CAD动力学Dynamics动态规划Dynamic Programming动态无损检测Dynamic Non—Destruction Measurement动态信号Dynamic Signal动态信号分析与仪器Dynamic Signal Analysis ＆Apparatus动物病害学基础Basis of Animal Disease动物免疫学Animal Immunology动物生理与分子生物学Animal Physiology and Molecular Biochemistry 动物学Zoology动物遗传工程Animal Genetic Engineering毒理遗传学Toxicological Genetics断裂力学Fracture Mechanics断裂疲劳力学Fatigue Fracture Mechanics锻压测试技术Forging Testing Technique锻压工艺Forging Technology锻压机械液压传动Hydraulic Transmission in Forging Machinery锻压加热设备Forging Heating Equipment锻压设备专题Lectures on Forging Press Equipments锻压系统动力学Dynamics of Forging System锻造工艺Forging Technology锻造加热设备Forging Heat Equipment对外贸易保险International Trade Insurance对外贸易地理International Marketing Geography对外贸易概论Introduction to International Trade对外贸易运输International Trade Transportation多层网络方法Multi-Layer Network Technology多复变函数Analytic Functions of Several Complex Variables多媒体计算机技术Multimedia Computer Technology多媒体技术Multimedia Technology多目标优化方法Multipurpose Optimal Method多项距阵Multi—Nominal Matrix多元统计分析Multivariable StatisticsF开头的课程：发电厂Power Plant发电厂电气部分Electric Elements of Power Plants发电厂电气部分与动力部分Electric Elements ＆Dynamics of Power Plants发电厂电气部分与热力设备Electric Elements & Thermodynamics Equipment of Power Plants 发电厂计算机控制Computer Control in Power Plant发酵工程Zymolysis Engineering发育生物学原理与实验技术Principle and Experimental Technology of Development发展经济学Evolutive Economics法理学Nomology法律基础Fundamentals of Law法学概论An Introduction to Science of Law法学基础Fundamentals of Science of Law翻译Translation翻译理论与技巧Theory & Skills of Translation反不正当经济法Anti-malfeasance Economic Law泛读Extensive Reading泛函分析Functional Analysis泛函分析Functional Analysis房屋建筑学Architectural Design ＆Construction房屋建筑学课程设计Course Design of House Architecture仿真与辅助设计Simulation & Computer Aided Design放射生物学Radiation Biology放射学Radiology非电量测量Non—Electricity Measurement非金属材料Non—Metal Materials非线性采样系统Non—Linear Sampling System非线性方程组的数值解法Numerical Methods for No—linear System s of Equations非线性光学Nonlinear Optics非线性规划Non—Linear Programming非线性控制理论Non—Linear Control Theory非线性双曲型守恒律解的存在性The Existence of Solutions for Non -linear Hyperbolic Conservation Laws非线性物理导论Introduction to Nonlinear Physics非线性振荡Non-Linear Oscillation非线性振动Nonlinear Vibration废水处理工程Technology of Wastewater Treatment废水处理与回用Sewage Disposal and Re—use沸腾燃烧Boiling Combustion分布式计算机系统Distributed Computer System / Distributed System分布式系统与分布式处理Distributed Systems and Distributed Processing分离科学Separation Science分析化学Analytical Chemistry分析化学实验Analytical Chemistry Experiment分析力学Analytic Mechanics分析生物化学Analytical Biochemistry分析生物化学Analytical Biochemistry分子病毒学Molecular Virology分子进化工程Engineering of Molecular Evolution分子生物学Molecular Biology分子生物学技术Protocols in Molecular Biology分子遗传学Molecular Genetics风机调节Fan Regulation风机调节。
课程名称的英文翻译on Health Food s保险学Insurance保险学Insurance报告文学专题Special Subject On Reportage报刊编辑学Newspaper & Magazine Editing报刊选读Selected Readings of Newspaper & Magazine报纸编辑学Newspaper Editing泵与风机Pumps and Fans泵与水机Pumps & Water Turbines毕业论文Graduation Thesis毕业设计Graduation Thesis毕业实习Graduation Practice编译方法Compilation Method编译方法Methods of Compiling编译技术Technique of Compiling编译原理Fundamentals of Compiling, Principles of Compiler编译原理课程设计Course Design of Compiling 变电站的微机检测Computer Testing in Transformer Substation变电站的微机检测与控制Computer Testing & Control in Transformer Substation变分法与张量Calculus of Variations & Tensor 变分学Calculus of Variations变流技术Semiconductor Converting Technology变质量系统热力学与新型回转压Variable Quality System Thermal Mechanics & NeoRo表面活性剂化学及应用Chemistry and Application of Surfactant表面活性物质Surface Reactive Materials并行处理Parallel Processing并行处理与并行程序设计Parallel Processing and Parallel Programming并行算法Parallel Algorithmic波谱学Spectroscopy, Wave Spectrum波谱学实验Spectroscopic Experiment薄膜光学Film Optics薄膜物理Thin Film Physics不育症的病因学Etiology of InfertilityC开头的课程材料的力学性能测试Measurement of Material Mechanical Performance材料化学Material Chemistry材料力学Mechanics of Materials财税法规与税务会计Laws and Regulations of Finance and Taxes财务案例分析Case Analysis of FinanceManagement财务案例分析Case Analysis of Financial Management财务报告分析Analysis of Financial Statement 财务成本管理Financial Cost Management财务管理Financial Management, Financial Cost Management财务管理与分析Financial Management and Analysis财务会计Financial Accountancy财政学Public Finance财政与金融Finance & Banking财政与税收Finance & Revenue财政与税收理论Theories on Public Finance and Tax Revenue财政与信贷Finance & Credit操作系统Disk Operating System (DOS)操作系统课程设计Course Design in Disk Operating System操作系统与编译原理Disk Operating System & Fundamentals of Compiling操作系统原理Fundamentals of Disk Operating System, Principles of Operating System测量技术基础Foundation of Measurement Technology测量原理与仪器设计Measurement Fundamentals & Meter Design测试技术Testing Technology测试与信号变换处理Testing & Signal Transformation Processing策波测量技术Technique of Whip Wave Measurement策略管理Strategic Management产品学Production产业经济学Industrial Economy产业组织Industrial Organization产业组织学Industrial Organization Technology常微分方程Ordinary Differential Equations场论Field Theory超导磁体及应用Superconductive Magnet & Application超导及应用Superconductive & Application超高真空科学与技术Science and Technology of Ultrahigh Vacuum 60超精密加工和微细加工Super-Precision & Minuteness Processing超精微细加工Super-Precision & Minuteness Processing超声及应用Supersonics Application成本会计Cost Accounting成像原理与技术Principles & Technique of Imaging成组技术Grouping Technique城市规划原理Fundamentals of City Planning 城市社会学Urban Sociology程控数字交换Program Controlling of Digital Exchange程序设计Program Designing程序设计方法学Methodology of Programming, Methods of Programming程序设计及算法语言Program Designing & Algorithmic Language程序设计语言Programming Language齿轮啮合原理Principles of Gear Connection冲击测量及误差Punching Measurement & Error冲压工艺Sheet Metal Forming Technology抽象代数Abstract Algebra初等数学Primary Mathematics传坳概论Introduction to Pass Col传动概论Introduction to Transmission传感技术Sensor Technique传感技术及应用Sensor Technique & Application传感器及应用Sensors & Application传感器与检测技术Sensors & Testing Technology传感器原理Fundamentals of Sensors传感器原理及应用Fundamentals of Sensors & Application传热学Heat Transfer船舶操纵Ship Controlling船舶电力系统Ship Electrical Power System船舶电力系统课程设计Course Exercise in Ship Electrical Power System船舶电气传动自动化Ship Electrified Transmission Automation船舶电站Ship Power Station船舶动力装置Ship Power Equipment船舶概论Introduction to Ships船舶焊接与材料Welding & Materials on Ship 船舶机械控制技术Mechanic Control Technology for Ships船舶机械拖动Ship Mechanic Towage船舶建筑美学Artistic Designing of Ships船舶结构Ship Structure船舶结构力学Structural Mechanics for Ships船舶结构与制图Ship Structure & Graphing船舶静力学Ship Statics船舶强度与结构设计Designing Ship Intensity & Structure船舶设计原理Principles of Ship Designing船舶推进Ship Propelling船舶摇摆Ship Swaying船舶摇摆与操纵Ship Swaying & Manipulating 船舶振动Ship Vibration船舶阻力Ship Resistance船体建造工艺Ship-Building Technology船体结构Ship Structure船体结构图Ship Structure Graphing船体结构与制图Ship Structure & Graphing船体振动学Ship Vibration船体制图Ship Graphing船用电器设备Marine Electrical Equipment创造心理学Creativity Psychology词汇学Lexicology磁测量技术Magnetic Measurement Technology 磁传感器Magnetic Sensor磁存储设备设计原理Fundamental Design of Magnetic Memory Equipment磁记录Magnetographic磁记录技术Magnetographic Technology磁记录物理Magnetographic Physics磁路设计与场计算Magnetic Path Designing & Magnetic Field Calculati磁盘控制器Magnetic Disk Controler磁性材料Magnetic Materials磁性测量Magnetic Measurement磁性物理Magnetophysics磁原理及应用Principles of Catalyzation & Application催化原理Principles of CatalysisD开头的课程大电流测量Super-Current Measurement大电源测量Super-Power Measurement大机组协调控制Coordination & Control of Generator Networks大跨度房屋结构Large-Span House structure 大型锅炉概况Introduction to Large-Volume Boilers大型火电机组控制Control of Large Thermal Power Generator Networks大型数据库原理与高级开发技术Principles of Large-Scale Data-Bas e and Advanced Development Technology大学德语College German大学俄语College Russian大学法语College French大学日语College Japanese大学生心理学Psychology Introduction大学物理College Physics大学物理实验Experiment of College Physics大学英语College English大学语文College Chinese大众传播学Mass Media代数几何Algebraic Geometry代数几何Algebraic Geometry代数曲面Algebraic Surfaces代数图论Algebraic Graph Theory代数拓扑Algebraic Topology代数学Algebra代用燃料Substitute Fuel代用运放电路Simulated Transmittal Circuit单片机与接口技术Mono-Chip Computers & Interface Technique单片机原理Fundamentals of Mono-Chip Computers单片机原理及应用Fundamentals of Mono-Chip Computers & Applications弹塑性力学Elastic-Plastic Mechanics弹性波Elastic Waves弹性力学Elastic Mechanics, Theory of Elastic Mechanics弹性元件的理论及设计Theory and Design of Elastic Element蛋白质结构基础Principle of Protein Structure 蛋白质生物化学技术Biochemical Technology of Protein当代国际关系Contemporary International Relationship当代国外社会思维评价Evaluation of Contemporary Foreign Social Thought当代文学Contemporary Literature当代文学专题Topics on Contemporary Literature当代西方哲学Contemporary Western Philosophy当代戏剧与电影Contemporary Drama & Films当代资本主义经济Contemporary Capitalist Economy党史History of the Party导波光学Wave Guiding Optics德育Moral Education等离子体工程Plasma Engineering低频电子线路Low Frequency Electric Circuit 低温测试技术Cryo Testing Technique低温传热学Cryo Conduction低温固体物理Cryo Solid Physics低温技术原理与装置Fundamentals of Cryo Technology & Equipment低温技术中的微机原理Priciples of Microcomputer in Cryo Technology低温绝热Cryo Heat Insulation低温气体制冷机Cryo Gas Refrigerator低温热管Cryo Heat Tube低温设备Cryo Equipment低温生物冻干技术Biological Cryo Freezing Drying Technology低温生物学原理与应用Principle & Application of Cryobiology低温实验技术Cryo Experimentation Technology低温物理导论Cryo Physic Concepts低温物理概论Cryo Physic Concepts低温仪表及测试Cryo Meters & Measurement 低温原理Cryo Fundamentals低温原理与设备Cryo Fundamentals & Equipment低温制冷机Cryo Refrigerator低温中的微机应用Application of Microcomputer in Cryo Technology低温装置Cryo Equipment低噪声电子电路Low-Noise Electric Circuit低噪声电子设计Low-Noise Electronic Designing低噪声放大与弱检Low-Noise Increasing & Decreasing低噪声与弱信号检测Detection of Low Noise & Weak Signals地基基础课程设计Course Design of Groundsill Basis地理Geography第二次世界大战史History of World War II典型计算机分析Classical Computer Analysis 电测量技术Electric Measurement Technology 电厂计算机控制系统Computer Control System in Power Plants电磁测量实验技术Electromagnetic Measurement Experiment & Technology电磁场计算机Electromagnetic Field Computers电磁场理论Theory of Electromagnetic Fields 电磁场数值计算Numerical Calculation ofElectromagnetic Fields电磁场与电磁波Electromagnetic Fields & Magnetic Waves电磁场与微波技术Electromagnetic Fields & Micro-Wave Technology电磁场中的数值方法Numerical Methods in Electromagnetic Fields电磁场中的数值计算Numerical Calculation in Electromagnetic Fields电磁学Electromagnetics电动力学Electrodynamics电镀Plating电分析化学Electro-Analytical Chemistry电工材料Electrical Materials电工测量技术基础Measurement Technology of Electrical Engineering电工测试技术基础Testing Technology of Electrical Engineering电工产品学Electrotechnical Products电工电子技术基础Electrical Technology & Electrical Engineering电工电子学Electronics in Electrical Engineering电工基础Fundamental Theory of Electrical Engineering电工基础理论Fundamental Theory of Electrical Engineering电工基础实验Basic Experiment in Electrical Engineering电工技术Electrotechnics电工技术基础Fundamentals of Electrotechnics 电工实习Electrical Engineering Practice电工实验Experiment of Electrical Engineering 电工实验技术基础Experiment Technology of Electrical Engineering电工学Electrical Engineering电工与电机控制Electrical Engineering & Motor Control电弧电接触Electrical Arc Contact电弧焊及电渣焊Electric Arc Welding & Electroslag Welding电化学测试技术Electrochemical Measurement Technology电化学工程Electrochemical Engineering电化学工艺学Electrochemical Technology电机Motor电机测试技术Motor Measuring Technology电机电磁场的分析与计算Analysis & Calculation of Electrical Motor &电机电磁场的数值计算Calculation of Electrical Motor & Electromagnetic Fields电机电磁场理论Theory of Electrical Moto & Electromagnetic Fields电机电器与供电Motor Elements and Power Supply电机矩阵分析法Analysis of Electrical Motor Matrix电机课程设计Course Exercise in Electric Engine电机绕组理论Theory of Motor Winding电机绕组理论及应用Theory & Application of Motor Winding电机设计Design of Electrical Motor电机瞬变过程Electrical Motor Change Processes电机统一理论Theory of Electrical Motor Integration电机学Electrical Motor电机学及控制电机Electrical Machinery Control & Technology电机与拖动Electrical Machinery & Towage电机原理Principle of Electric Engine电机原理与拖动Principles of Electrical Machinery & Towage电机专题Lectures on Electric Engine电接触与电弧Electrical Contact & Electrical Arc电介质物理Dielectric Physics电镜Electronic Speculum电力电子电路Power Electronic Circuit电力电子电器Power Electronic Equipment电力电子器件Power Electronic Devices电力电子学Power Electronics电力工程Electrical Power Engineering电力企业管理Management of Electrical Enterprise电力生产技术Technology of Electrical Power Generation电力生产优化管理Optimal Management of Electrical Power Generation电力拖动Electric Traction电力拖动基础Fundamentals for Electrical Towage电力拖动控制系统Electrical Towage Control Systems电力拖动与电气控制Electrical Towage & Electrical Control电力系统Power Systems电力系统电源最优化规划Optimal Planning of Power Source in a Power System电力系统短路Power System Shortcuts电力系统分析Power System Analysis电力系统规划Power System Planning电力系统过电压Hyper-Voltage of Power Systems电力系统继电保护原理Power System Relay Protection电力系统经济分析Economical Analysis of Power Systems电力系统经济运行Economical Operation of Power Systems电力系统可靠性Power System Reliability电力系统可靠性分析Power System Reliability Analysis电力系统课程设计Course Design of Power Systems电力系统无功补偿及应用Non-Work Compensation in Power Systems & Applicati电力系统谐波Harmonious Waves in Power Systems电力系统优化设计Optimal Designing of Power Systems电力系统远动Operation of Electric Systems电力系统远动技术Operation Technique of Electric Systems电力系统运行Operation of Electric Systems电力系统自动化Automation of Electric Systems电力系统自动装置Power System Automation Equipment电力系统最优规划Optimal Planning in Power System电力装置课程设计Course Design of Power Equipment电力装置与系统Power Equipment & System 电路测量与实验Circuit Measurement & Experiment电路测试技术Circuit Measurement Technology电路测试技术基础Fundamentals of Circuit Measurement Technology电路测试技术及实验Circuit Measurement Technology & Experiments电路分析基础Basis of Circuit Analysis电路分析基础实验Basic Experiment on Circuit Analysis电路分析实验Experiment on Circuit Analysis电路和电子技术Circuit and Electronic Technique电路基本理论Basis Theory of Circuitry电路及电子线路CAD Circuitry CAD电路理论Theory of Circuit电路理论基础Fundamental Theory of Circuit 电路理论实验Experiments in Theory of Circuct电路设计与测试技术Circuit Designing & Measurement Technology电气测量技术Electrical Measurement Technology电气传动Electrified Transmission电气控制技术Electrical Control Technology电器设计Electrical Appliances Designing电器学Electrical Appliances电器与控制Electrical Appliances & Control电生理技术基础Basics of Electricphysiological Technology电视传感器图象显示Television Sensor Graphic Display电视接收技术Television Reception Technology 电视节目Television Programs电视节目制作Television Program Designing电视新技术New Television Technology电视新闻Television News电视原理Principles of Television电网调度自动化Automation of Electric Network Management电学实验Electrical Experiment电影艺术Art of Film Making电站微机检测控制Computerized Measurement & Control of Power Statio电子材料与元件测试技术Measuring Technology of Electronic Material and Element 电子材料元件Electronic Material and Element 电子材料元件测量Electronic Material and Element Measurement电子测量与实验技术Technology of Electronic Measurement & Experiment电子测试Electronic Testing电子测试技术Electronic Testing Technology电子测试技术与实验Electronic Testing Technology & Experiment电子测试实验Electronic Testing Experiment电子测试与实验技术Electronic Testing Technology & Experiment电子机械运动控制技术Technology of Electronic Mechanic Movement Control电子技术Technology of Electronics电子技术腐蚀测试中的应用Application of Electronic Technology in Erosion Measurement 电子技术基础Basic Electronic Technology电子技术基础与实验Basic Electronic Technology & Experiment电子技术课程设计Course Exercise in Electronic Technology电子技术实验Experiment in Electronic Technology电子技术综合性设计实验Experiment in Electronic Technology电子理论实验Experiment in Electronic Theory 电子商务Electronic Commerce电子系统的ASIC技术ASIC Design Technologies电子显微分析Electronic Micro-Analysis电子显微镜Electronic Microscope电子线路Electronic Circuit电子线路的计算机辅助设计Computer Associate Design of Electronic Circuit电子线路课程设计Course Design of Electronic Circuit电子线路设计与测试技术Electronic Circuit Design & Measurement Technology电子线路设计与测试实验Electronic Circuit Design & Measurement Experiment电子线路实验Experiment in Electronic Circuit 电子学Electronics电子学课程设计Course Design of Electronics 电子照相技术Electronic Photographing Technology雕塑艺术欣赏Appreciation of Sculptural Art 调节原理Principles of Regulation调节装置Regulation Equipment动力机械CAD Dynamical Machine CAD动力学Dynamics动态规划Dynamic Programming动态无损检测Dynamic Non-Destruction Measurement动态信号Dynamic Signal动态信号分析与仪器Dynamic Signal Analysis & Apparatus动物病害学基础Basis of Animal Disease动物免疫学Animal Immunology动物生理与分子生物学Animal Physiology and Molecular Biochemistry动物学Zoology动物遗传工程Animal Genetic Engineering毒理遗传学Toxicological Genetics断裂力学Fracture Mechanics断裂疲劳力学Fatigue Fracture Mechanics锻压测试技术Forging Testing Technique锻压工艺Forging Technology锻压机械液压传动Hydraulic Transmission in Forging Machinery锻压加热设备Forging Heating Equipment锻压设备专题Lectures on Forging Press Equipments锻压系统动力学Dynamics of Forging System 锻造工艺Forging Technology锻造加热设备Forging Heat Equipment对外贸易保险International Trade Insurance对外贸易地理International Marketing Geography对外贸易概论Introduction to International Trade对外贸易运输International Trade Transportation多层网络方法Multi-Layer Network Technology多复变函数Analytic Functions of Several Complex Variables多媒体计算机技术Multimedia Computer Technology多媒体技术Multimedia Technology多目标优化方法Multipurpose Optimal Method 多项距阵Multi-Nominal Matrix多元统计分析Multivariable StatisticsF开头的课程发电厂Power Plant发电厂电气部分Electric Elements of Power Plants发电厂电气部分与动力部分Electric Elements & Dynamics of Power Plants发电厂电气部分与热力设备Electric Elements & Thermodynamics Equipment of Power Plants 发电厂计算机控制Computer Control in Power Plant发酵工程Zymolysis Engineering发育生物学原理与实验技术Principle and Experimental Technology of Development发展经济学Evolutive Economics法理学Nomology法律基础Fundamentals of Law法学概论An Introduction to Science of Law法学基础Fundamentals of Science of Law翻译Translation翻译理论与技巧Theory & Skills of Translation 反不正当经济法Anti-malfeasance Economic Law泛读Extensive Reading泛函分析Functional Analysis泛函分析Functional Analysis房屋建筑学Architectural Design & Construction房屋建筑学课程设计Course Design of House Architecture仿真与辅助设计Simulation & Computer Aided Design放射生物学Radiation Biology放射学Radiology非电量测量Non-Electricity Measurement非金属材料Non-Metal Materials非线性采样系统Non-Linear Sampling System 非线性方程组的数值解法Numerical Methods for No-linear System s of Equations非线性光学Nonlinear Optics非线性规划Non-Linear Programming非线性控制理论Non-Linear Control Theory非线性双曲型守恒律解的存在性The Existence of Solutions for Non -linear Hyperbolic Conservation Laws非线性物理导论Introduction to Nonlinear Physics非线性振荡Non-Linear Oscillation非线性振动Nonlinear Vibration废水处理工程Technology of Wastewater Treatment废水处理与回用Sewage Disposal and Re-use沸腾燃烧Boiling Combustion分布式计算机系统Distributed Computer System / Distributed System分布式系统与分布式处理Distributed Systems and Distributed Processing分离科学Separation Science分析化学Analytical Chemistry分析化学实验Analytical Chemistry Experiment分析力学Analytic Mechanics分析生物化学Analytical Biochemistry分析生物化学Analytical Biochemistry分子病毒学Molecular Virology分子进化工程Engineering of Molecular Evolution分子生物学Molecular Biology分子生物学技术Protocols in Molecular Biology分子遗传学Molecular Genetics风机调节Fan Regulation风机调节.使用.运转Regulation, Application & Operation of Fans风机三元流动理论与设计Tri-Variant Movement Theory & Design of Fans风能利用Wind Power Utilization风险投资分析Analysis of Risk Investment服务业营销Service Industry Marketing辅助机械Aided Machine腐蚀电化学实验Experiment in Erosive Electrochemistry复变函数Complex Variables Functions复变函数与积分变换Functions of Complex Variables & Integral Transformation复合材料结构力学Structural Mechanics of Composite Material复合材料力学Compound Material Mechanics 傅里叶光学Fourier OpticsG开头的课程概率论Probability Theory概率论与数理统计Probability Theory & Mathematical Statistics概率论与随机过程Probability Theory & Stochastic Process概率与统计Probability & Statistics钢笔画Pen Drawing钢的热处理Heat-Treatment of Steel钢结构Steel Structure钢筋混凝土Reinforced Concrete钢筋混凝土及砖石结构Reinforced Concrete & Brick Structure钢砼结构Reinforced Concrete Structure钢砼结构与砌体结构Reinforces Structure and Monsary Structure钢砼课程设计Reinforced Concrete Course Design钢砼设计Experiment of Reinforced Concrete Structure高层建筑基础Tall Building Foundation高层建筑基础设计Designing bases of High Rising Buildings高层建筑结构设计Designing Structures of High Rising Buildings高等材料力学Advanced Material Mechanics高等代数Advanced Algebra高等发光分析Advanced Luminescence Analysis高等分析化学Advanced Analytical Chemistry高等工程力学Advanced Engineering Mechanics高等光学Advanced Optics高等环境微生物Advanced Environmental Microorganism高等教育管理Higher Education Management 高等教育史History of Higher Education高等教育学Higher Education高等量子力学Advanced Quantum Mechanics 高等生物化学Advanced Biochemistry高等数理方法Advanced Mathematical Method 高等数学Advanced Mathematics高等数值分析Advanced Numeric Analysis高等土力学Advanced Soil Mechanics高等无机化学Advanced Inorganic Chemistry 高等有机化学Advanced Organic Chemistry高电压测试技术High-Voltage Test Technology 高电压技术High-Voltage Technology高电压技术与设备High-Voltage Technology and Device高电压绝缘High-Voltage Insulation高电压实验High-Voltage Experiment高分子材料High Polymer Material高分子材料及加工High Polymer Material & Porcessing高分子化学High Polymer Chemistry高分子化学实验High Polymer Chemistry Experiment高分子化学与物理Polymeric Chemistry and Physics高分子物理High Polymer Physics高分子物理实验High Polymer Physics Experiment高级程序设计语言的设计与实现Advanced Programming Language's Design & Implementation高级管理信息系统Advanced Management Information 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Experimentation高压实验设备测量High-Voltage Experimentation Equipment Measurement高压试验技术High-Voltage Experimentation Technology工厂电气设备Electric Equipment of Plants工厂供电Factory Electricity Supply工程材料的力学性能测试Mechanic Testing of Engineering Materials工程材料及热处理Engineering Material and Heat Treatment工程材料学Engineering Materials工程测量Engineering Surveying工程测量实习Engineering Measuring Practice 工程测试技术Engineering Testing Technique 工程测试实验Experiment on Engineering Testing工程测试信息Information of Engineering Testing工程测试与信号处理Engineering Testing & Signal Processing工程地质Engineering Geology工程动力学Engineering Dynamics工程概论Introduction to Engineering工程概预算Project Budget工程经济学Engineering Economics工程静力学Engineering Statics工程力学Engineering Mechanics工程热力学Engineering Thermodynamics工程数学Engineering Mathematics工程项目概预算Engineering Project Estimate & Budget工程项目评估Engineering Project Evaluation 工程优化方法Engineering Optimization Method工程运动学Engineering Kinematics工程造价管理Engineering Cost Management 工程制图Graphing of Engineering工业产品学Industrial 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Affairs国民经济核算National Economic Accounting 国民经济计划National Economical Planning国外社会学理论Overseas Theories of Sociology 过程(控制)调节装置Process(Control) Adjustment Device过程调节系统Process Adjustment System过程控制Process Control过程控制调节装置Process Control & Regulation Equipment过程控制系统Process Control System过程原理Principle of Process过电压及数值计算Hyper-Voltage & Numeric CalculationH开头的课程海商法Law of Maritime Commerce海洋测量Ocean Surveying海洋工程概论Introduction to Ocean Engineering海洋开发技术Ocean Development Technology 海洋生物学Marine Biology海洋资源利用与开发Utilization & Development of Ocean Resources函数分析Functional Analysis汉语Chinese汉语与写作Chinese & Composition汉语语法研究Research on Chinese Grammar 汉语语言文学Chinese Linguistics & Literature 汉字信息处理技术Technology of Chinese。
The 2470 High Voltage SourceMeter® Source Measure Unit (SMU) Instrument brings advanced Touch, Test, Invent® technology right to your fingertips. It combines an innovative graphical user interface (GUI) with capacitive touchscreen technology to make testing intuitive and minimize the learning curve to help engineers and scientists learn faster, work smarter, and invent easier. With its 1100 V and 10 fA capability, the 2470 is optimized for characterizing and testing high voltage, low leakage devices, materials, and modules, such as silicon carbide (SiC), gallium nitride (GaN), power MOSFETs, transient suppression devices, circuit protection devices, power modules, batteries, and much more. Thesenew capabilities, combined with Keithley’s decades of expertise in developing high precision, high-accuracy SMU instruments, make the 2470 a “go-to instrument” for high-voltage source and low-current measurement applications in the lab and in the test rack.Key Features• Wide coverage up to 1100 V / 1 A DC 20 W max.• 10 fA measure resolution• 0.012% basic measure accuracy with 6½-digit resolution• Five-inch, high resolution capacitive touch screen GUI • Source and sink (4-quadrant) operation• SCPI and TSP® scripting programming modes• TSP-Link for multi-channel I-V testing• Front panel input banana jacks; rear panelhigh-voltage input triaxial connections• Built-in context-sensitive help• Front-panel USB 2.0 memory I/O port for transferring data, test scripts, and test configurationsDatasheetA Tektronix CompanyDatasheet2Learn Faster; Work Smarter; Invent EasierThe 2470 features a five-inch, full-color, high resolution touchscreen that supports intuitive operation, helps operators become familiar with the instrument quickly, and optimizes overall speed and productivity. A simple icon-based menu structure reduces the number of steps required to configure a test by as much as 50 percent and eliminates the cumbersome multi-layer menu structures typically used on soft-key instruments. Built-in, context-sensitive help supports intuitive operation and minimizes the need to review a separate manual. These capabilities, combined with the 2470’s high versatility, simplify its operation in both basic and advanced measurementapplications, regardless of the user’s previous experience in working with SMU instruments.All-in-One SMU InstrumentThe 2470, Keithley’s fourth generation of SourceMeter SMUs, leverages the proven capabilities of the original 2410 High Voltage SourceMeter SMU Instrument. SMU instruments offer a highly flexible, four-quadrant voltage and current source/load coupled with precision voltage and current measurements. This all-in-one instrument has the capabilities of a:• Precision power supply with V and I readback • True current source• Digital multimeter (DCV, DCI, ohms, and power with 6½-digit resolution)• Precision electronic load • Trigger controller2470 main home screen.2470 icon-based menu.2470 power envelope. 32470 Graphical SourceMeter ® SMU Instrument Data SheetOnline USB 2.0memory I/OFront/rear input selectorRotary navigation/control knobEase of Use Beyond the TouchscreenIn addition to its five-inch color touchscreen, the 2470 front panel offers a variety of features that enhance its speed, user-friendliness, and learnability, including a USB 2.0 memory I/O port, a HELP key, a rotary navigation/control knob, a front/rear input terminal selector button, and banana jacks for basic bench applications. The USB 2.0 memory port simplifies storing test results and instrument configurations, uploading test scripts into the instrument, and installing system upgrades. All front-panel buttons are backlit to enhance visibility in low-light environments. Four Quick Setup modes simplify instrument setup. With one touch, the instrument can be quickly configured for various operating modes without the need to configure the instrument indirectly for this operation.Comprehensive Built-in ConnectivityRear panel access to rear-input connectors, remote control interfaces (GPIB, USB 2.0, and LXI/Ethernet), a D-sub 9-pin digital I/Oport (for internal/external trigger signals and handler control), instrument interlock connector, and TSP-Link ® connectors make it simple to configure multiple instrument test solutions and eliminate the need to invest in additional adapter accessories.2470 front panel with high-resolution, capacitive touchscreen.Rear panel connections are optimized for signal integrity and speed system setup.One-touch Quickset modes speed measurement setups and minimize the time to measurements.EthernetDigital I/O TSP-Link GPIBInterlockUSBDatasheet4Convert Raw Data to InformationA full graphical plotting window converts raw data and displays it immediately as useful information, such as semiconductor I-V curves and waveforms. Using the 2470’s Sheet view, test data can also be displayed in tabular form. The instrument supports exporting data to a spreadsheet for further analysis, dramatically improving productivity for research, benchtop testing, device qualification, and debugging.Built-in data display, charting, and spreadsheet export functions simplify converting test results into useful information.TriggerFlow ® Building Blocks for Instrument Control and ExecutionThe 2470 incorporates Keithley’s TriggerFlow triggering system, which provides user control of instrument execution. TriggerFlow diagrams are created in much the same way that flow charts are developed, using four building blocks:• Wait – Waits for an event to occur before the flow continues • Branch – Branches when a condition has been satisfied• Action – Initiates an action in the instrument, for example, measure, source, delay, set digital I/O, etc.• Notify – Notifies other equipment that an eventhas occurredTriggerFlow building blocks allow creating triggering models that range from very simple to highly complex.A TriggerFlow model using a combination of these building blocks can be created from the front panel or by sending remote commands. With the TriggerFlow system, users can build triggering models from very simple to complex with up to 255 block levels. The 2470 also includes basic triggering functions, including immediate, timer, and manual triggering. 52470 Graphical SourceMeter ® SMU Instrument Data SheetUnmatched System Integration and Programming FlexibilityWhen a 2470 is configured into a multi-channel I-V test system, its embedded Test Script Processor (TSP ®)allows it to run test scripts, so users can create powerful measurement applications with significantly-reduced development times. TSP technology also offers channel expansion without a mainframe. Keithley’s TSP-Link ® channel expansion bus can connect multiple 2470s and other TSP instruments, including Keithley’s other graphical SourceMeter instruments (2450, 2460, 2461), Keithley’s DMM7510, DMM6500, and DAQ6510 graphical multimeters, Series 2600B System SourceMeter SMU instruments, and Series 3700A Switch/Multimeter systems, in a master-subordinate configuration that operates as one integrated system. The TSP-Link expansion bus supports up to 32 units per GPIB or IP address, making it easy to scale a system to fit an application’s particular requirements.Parallel Test CapabilityThe TSP technology in the 2470 supports testing multiple devices in parallel to meet the needs of device research, advanced semiconductor lab applications, and even high throughput production test. This parallel testing capability allows each instrument in the system to run its own complete test sequence, creating a fully multi-threaded test environment. The number of tests that can be run in parallel on a graphical SourceMeter can be as high as the number of instruments in the system.Typical ApplicationsIdeal for current/voltage characterization and functional test of a wide range of today’s modern electronics and devices, including:• Devices–Power semiconductors and materials: SiC, GaN, power MOSFETs, power diodes –IGBT–Thyristors, SCRs–Transient suppression devices –Circuit protection devices: TVS, MOVs, fuses, etc. –Connectors, switches, relays –Power management modules –Batteries • Tests–I-V characterization –Forward voltage –Breakdown voltage –Leakage current –Isolation –Hi-Pot–Dielectric withstandingThe 2470 is the ideal addition to your development bench for designing today’s high power devices and components.Characterize transistors with multiple SMU instruments on wafer or packaged transistorsDatasheet6Instrument Control Start-up SoftwareKickStart instrument control/start-up software enables users to start making measurements in minutes without programming. In most cases, users merely need to make some quick measurements, graph the data, and store the data to disk for later analysis in software environments such as Excel. KickStart offers:• Instrument configuration control to perform I-V characterization • Native X-Y graphing, panning, and zooming • Spreadsheet/tabular viewing of data• Saving and exporting of data for further analysis • Saving of test setups• Screenshot capturing of graphs • Annotating of tests• Command line dialog for sending and receiving data • HTML help• GPIB, USB 2.0, Ethernet complianceSimplified Programming with Ready-to-Use Instrument DriversFor those who prefer to create their own customized application software, native National Instruments LabVIEW ® drivers, and IVI-C and IVICOM drivers are available at /keithley.KickStart start-up software lets users be ready to make measurements in minutes.2470 Graphical SourceMeter® SMU Instrument Data SheetSpecificationsVoltage Specifications1, 2Current Specifications1, 2Notes1. Speed = 1 PLC.2. All specifications are guaranteed with output ON.3. Accuracies apply to 2-wire and 4-wire modes when properly zeroed. For the 200 mV and 1 A ranges, the voltage burden may exceed the specification in 2-wire mode.4. Maximum display and programmming ranges are 5% overrange for voltage, except for the 1000 V range, which is 10% overrange (1100 V), and 5% overrange for current (for example,1.05 A on the 1 A range).5. For sink mode, accuracy is ±(0.15% + offset × 4) except for 1 A range, accuracy is: ± (1.5% + offset × 8).6. Rear-panel triaxial connections only.Resistance Measurement Accuracy (Local Or Remote Sense)7, 8, 97Datasheet8Temperature Coefficient ± (0.15 × accuracy specification)/°C 0 °C to 18 °C and 28 °C to 50 °CSource Current, Measure Resistance ModeTotal uncertainty = I source accuracy + V measure accuracy (4-wire remote sense)Source Voltage, Measure Resistance ModeTotal uncertainty = V source accuracy + I measure accuracy (4-wire remote sense)Guard Output Impedance ≥ 300 Ω typicalNotes7. Speed = 1 PLC.8. All specifications are guaranteed with output ON.9. Accuracies apply to 2-wire and 4-wire modes when properly zeroed.10. Measure resolution 6.5 digits.11. Source readback enabled; offset compensation on.12. Source current, measure resistance or source voltage, measure resistance only.13. Rear-panel triaxial connections only.Supplemental SpecificationsOverrange 105% of range for 200 mV to 200 V, source and measure ranges; 110% of range for 1000 V, source and measure rangesRegulationVoltage Line: 0.01% of rangeLoad: 0.01% of range + 100 µV Current Line: 0.01% of rangeLoad: 0.01% of range + 100 pA Source LimitsVoltage Source Current Limit Bipolar current limit set with a single valueMinimum value is 10% of range Current Source Voltage Limit Bipolar voltage limit set with a single valueMinimum value is 10% of rangeVoltage Limit/Current Limit AccuracyAdd 0.3% of range and ±0.02% of reading to base specification OvershootVoltage Source < 0.1% typicalStep size = Full scale, resistive load, 20 V range, 10 mA current limit Current Source < 0.1% typicalStep size = Full scale, resistive load of 10 kΩ, 1 mA range, 20 V voltage limitRange Change Overshoot Overshoot into a fully resistive 100 kΩ load, 10 Hz to 20 MHz bandwidth, adjacent ranges: 250 mV typical Output Settling Time Time required to reach within 0.1% of final value: 20 V range, 100 mA current limit: < 200 µs typical Maximum Slew Rate 14 0.2 V/µs, 200 V range, 100 mA limit into a 2 kΩ load (typical) 0.5 V/µs, 1000 V range, 10 mA limit into a 100 kΩ load (typical)Overvoltage Protection User-selectable values, 10% tolerance; factory default = none Voltage Source Noise 10 Hz to 20 MHz (RMS): 4 mV typical into a resistive load Common Mode Voltage 250 V DCCommon Mode Isolation> 1 GΩ, < 1000 pFNotes14. High capacitance mode off.2470 Graphical SourceMeter® SMU Instrument Data Sheet Noise Rejection (typical)Load ImpedanceNormal Mode 20 nF typicalHigh-Capacitance Mode Stable into 1 μF typical (specification only valid for ranges ≥100 μA)Maximum Voltage Drop Between Force and Sense Terminals5 VMaximum Sense Lead Resistance 1 MΩ for rated accuracySense Input Impedance > 10 GΩGuard Offset Voltage < 300 µV typicalSystem Measurement Speeds 15Reading rates (readings per second) typical for 60 Hz (50 Hz), script (TSP) programmedReading rates (readings per second) typical for 60 Hz (50 Hz), SCPI programmed16Notes15. Reading rates applicable for voltage or current measurements, autozero off, autorange off, filter off, binary reading format, and source readback off.16. SCPI programming mode.9Datasheet10General Characteristics(Default mode unless specified)Factory Default Standard Power-Up SettingSCPI mode Source Output ModesFixed DC levelMemory/configuration list (mixed function) Stair (linear and logarithmic)Memory Buffer >5,000,000 readings with selected measured values and timestamp Real-Time Clock Lithium battery backup (more than 3 years of battery life)Remote Interfaces GPIB: IEEE Std 488.1 compliant; supports IEEE Std 488.2 common commands and status model topology USB device (rear panel, type B): 2.0 full-speed USBTMCUSB host (front panel, type A): USB 2.0, support for flash drives, FAT32Ethernet: RJ-45 connector, 10/100 BT IP Configuration Static or DHCPExpansion Interface The TSP-Link ® expansion interface allows TSP-enabled instruments to trigger and communicate with each otherLXI Compliance LXI version 1.4 Core 2011TSP Mode Embedded Test Script Processor (TSP) accessible from any host interface DisplayFive-inch capacitive touch, color TFT WVGA (800 × 480) with LED backlight Input Signal Connections Front: Banana. Rear: High-voltage triaxial Programmability SCPI or TSP command sets Interlock Active high-inputDigital I/OLines: Six input/output, user-defined, for digital I/O or triggeringConnector: 9-pin female D Input Signal Levels: 0.7 V (maximum logic low), 3.7 V (minimum logic high) Input Voltage Limits: –0.25 V (absolute minimum), +5.25 V (absolute maximum) Maximum Source Current: +2.0 mA at > 2.7 V (per pin)Maximum Sink Current: –50 mA at 0.7 V (per pin, solid-state fuse protected)5 V Power Supply Pin: Limited to 500 mA at > 4 V (solid-state fuse protected)Handler: User-definable start of test, end of test, four category bits CoolingForced air, variable speedOvertemperature Protection Internally sensed temperature overload puts instrument in standby mode Power Supply 100 VRMS to 240 VRMS, 50 Hz or 60 Hz (automatically detected at power up)VA Rating 220 VA maximumAltitude Maximum 2000 meters (6562 feet) above sea level EMC Conforms to European Union EMC DirectiveSafety NRTL listed to UL61010-1 and UL61010-2-30; conforms to European Union Low Voltage Directive RoHS Conforms to European Union Restriction on Hazardous Substances Directive Vibration MIL -PRF-28800F Class 3 Random Warm upOne hour to rated accuracies2470 Graphical SourceMeter® SMU Instrument Data SheetDimensions With handle and bumpers: 106 mm × 255 mm × 425 mm (4.18 in. high × 10.05 in. wide × 16.75 in. deep)Without handle and bumpers: 88 mm × 213 mm × 403 mm (3.46 in. high × 8.39 in. wide × 15.87 in. deep) Weight With handle and bumpers: 4.54 kg (10 lb)Without handle and bumpers: 4.08 kg (9.0 lb)Environment Operating: 0 °C to 50 °C, 70% relative humidity up to 35 °C; derate 3% relative humidity/°C, 35 °C to 50 °C Storage: –25 °C to 65 °CPollution Category: 2SourceMeter® is a registered trademark of Keithley Instruments LLC. All other trademarks are the property of their respective owners. Supplied Accessories8608 High Performance Test LeadsUSB-B-1 USB Cable, Type A to Type B, 1 m (3.3 ft)CS-1616-3 Safety Interlock Mating Connector17469460X TSP-Link/Ethernet Cable2470 QuickStart GuideTest Script Builder Software (available at )LabVIEW and IVI Drivers (available at )Available AccessoriesTest Leads and Probes8605 High Performance Modular Test Leads8606 High Performance Modular Probe Kit8608 High Performance Test LeadsCables, Connectors, AdaptersTRX-1100V-BAN HV Triax to Banana Adapter. Converts the 4 triax connectors on the rear panel to 5 banana jacksTRX-1100V-* 3-slot HV Low Noise Triax Cable (0.5 m, 1 m, 2 m, 3 m lengths available)8607 2-wire, 1000 V Banana Cables, 1 m (3.3 ft)CS-1616-3 Safety Interlock Mating ConnectorCommunication Interfaces & Cables7007-1 Shielded GPIB Cable, 1 m (3.3 ft)7007-2 Shielded GPIB Cable, 2 m (6.6 ft)17469460X TSP-Link Ethernet CableKPCI-488LPA IEEE-488 Interface for PCI BusKUSB-488B IEEE-488 USB-to-GPIB Interface AdapterUSB-B-1 USB Cable, Type A to Type B, 1 m (3.3 ft)11Datasheet12Triggering and Control2450-TLINK DB-9 to Trigger Link Connector Adapter 8501-1 Trigger Link Cable, DIN-to-DIN, 1 m (3.3 ft.)8501-2Trigger Link Cable, DIN-to-DIN, 2 m (6.6 ft.)Rack Mount Kits4299-8 Single Fixed Rack Mount Kit 4299-9 Dual Fixed Rack Mount Kit4299-10 Dual Fixed Rack Mount Kit. Mount one 2450 and one Series 26xxB4299-11Dual Fixed Rack Mount Kit. Mount one 2450 and one Series 2400, Series 2000, etc.Available Services2470-3Y-EW 1-year factory warranty extended to 3 years from date of shipment 2470-5Y-EW 1-year factory warranty extended to 5 years from date of shipment C/2470-3Y-17025 KeithleyCare ® 3 Year ISO 17025 Calibration Plan C/2470-3Y-DATA KeithleyCare 3 Year Calibration w/Data Plan C/2470-3Y-STD KeithleyCare 3 Year STD Calibration Plan C/2470-5Y-17025 KeithleyCare 5 Year ISO 17025 Calibration Plan C/2470-5Y-DATA KeithleyCare 5 Year Calibration w/Data Plan C/2470-5Y-STD KeithleyCare 5 Year STD Calibration Plan C/NEW DATA Calibration Data for New UnitsC/NEW DATA ISOISO-17025 Calibration Data for New UnitsOrdering Information24701000 V, 1 A, 20 W SourceMeter SMU InstrumentWarranty InformationWarranty SummaryThis section summarizes the warranties of the 2470. For complete warranty information, refer to theTektronix warranty page at https:///service/warranties/warranty-2. Any portion of the product that is not manufactured by Keithley is not covered by this warranty and Keithley will have no duty to enforce any other manufacturer’s warranties.Hardware WarrantyKeithley warrants the Keithley manufactured portion of the hardware for a period of one year from defects in materials or workmanship; provided that such defect has not been caused by use of the Keithleyhardware which is not in accordance with the hardware instructions. The warranty does not apply upon any modification of Keithley hardware made by the customer or operation of the hardware outside the environmental specifications.Software WarrantyKeithley warrants for the Keithley produced portion of the software or firmware will conform in all material respects with the published specifications for a period of ninety (90) days; provided the software is used on the product for which it is intended in accordance with the software instructions. Keithley does not warrant that operation of the software will be uninterrupted or error-free, or that the software will be adequate for the customer’s intended application. The warranty does not apply upon any modification of the software made by the customer.2470 Graphical SourceMeter® SMU Instrument Data Sheet13Contact Information:Australia* 1 800 709 465Austria 00800 2255 4835Balkans, Israel, South Africa and other ISE Countries +41 52 675 3777Belgium* 00800 2255 4835Brazil +55 (11) 3759 7627Canada 180****9200Central East Europe / Baltics +41 52 675 3777Central Europe / Greece +41 52 675 3777Denmark +45 80 88 1401Finland +41 52 675 3777France* 00800 2255 4835Germany* 00800 2255 4835Hong Kong 400 820 5835India 000 800 650 1835Indonesia 007 803 601 5249Italy 00800 2255 4835Japan 81 (3) 6714 3010Luxembourg +41 52 675 3777Malaysia 180****5835Mexico, Central/South America and Caribbean 52 (55) 56 04 50 90Middle East, Asia, and North Africa +41 52 675 3777The Netherlands* 00800 2255 4835New Zealand 0800 800 238Norway 800 16098People’s Republic of China 400 820 5835Philippines 1 800 1601 0077Poland +41 52 675 3777Portugal 80 08 12370Republic of Korea +82 2 565 1455Russia / CIS +7 (495) 6647564Singapore 800 6011 473South Africa +41 52 675 3777Spain* 00800 2255 4835Sweden* 00800 2255 4835Switzerland* 00800 2255 4835Taiwan 886 (2) 2656 6688Thailand 1 800 011 931United Kingdom / Ireland* 00800 2255 4835USA 180****9200Vietnam 12060128* European toll-free number. If notaccessible, call: +41 52 675 3777Find more valuable resources at Copyright © Tektronix. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes thatin all previously published material. Specification and price change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. All other trade namesreferenced are the service marks, trademarks or registered trademarks of their respective companies.060719.SBG 1KW-61523-0。
Eaton 278480Eaton Moeller® series PKZM01 Motor-protective circuit-breaker,660 V 690 V: 1.1 kW, Ir= 1 - 1.6 A, IP20 PKZM01-1,6General specificationsEaton Moeller® series PKZM01 Motor-protective circuit-breaker278480401508278480593 mm90 mm45 mm0.292 kgCECSA Class No.: 3211-05UL Category Control No.: NLRV VDE 0660CSAULUL 60947-4-1CSA-C22.2 No. 60947-4-1-14 UL File No.: E36332CSA File No.: 165628IEC/EN 60947-4-1IEC/EN 60947CSAUL PKZM01-1,6Product Name Catalog NumberEANProduct Length/Depth Product Height Product Width Product Weight Certifications Model Code1.6 A2 x (1 - 6) mm², ferrule to DIN 462281 x (1 - 6) mm², ferrule to DIN 46228Is the panel builder's responsibility. The specifications for the switchgear must be observed.25 °C0.55 kWMeets the product standard's requirements.Is the panel builder's responsibility. The specifications for the switchgear must be observed.Does not apply, since the entire switchgear needs to be evaluated.1.6 A (3 contacts in series), DC-5 up to 250V1.6 A, AC-3 up to 440 V10 mm40 °C50 kAMeets the product standard's requirements.40 °C25 A eaton-manual-motor-starters-characteristic-characteristic-curve-008.eps eaton-manual-motor-starters-characteristic-characteristic-curve-006.epsDA-DC-00004884.pdfDA-DC-00004914.pdfETN.PKZM01-1,6IL122023ZUIL03407011ZIL122012ZUIL03402034ZDA-CD-pkzm01DA-CS-pkzm01Rated operational current for specified heat dissipation (In) Terminal capacity (flexible with ferrule)10.11 Short-circuit ratingAmbient operating temperature (enclosed) - minRated operational power at AC-3, 380/400 V, 50 Hz10.4 Clearances and creepage distances10.12 Electromagnetic compatibility10.2.5 LiftingSwitching capacityStripping length (main cable)Ambient operating temperature (enclosed) - maxRated short-circuit breaking capacity Icu at 400 V AC 10.2.3.1 Verification of thermal stability of enclosures Ambient storage temperature - minAdjustment range undelayed short-circuit release - max 10.8 Connections for external conductors Characteristic curve Declarations of conformity eCAD modelGuide utenteIstruzioni di installazione mCAD modelIs the panel builder's responsibility.Assigned motor power at 575/600 V, 60 Hz, 3-phase0.75 HPProtectionFinger and back-of-hand proof, Protection against direct contact when actuated from front (EN 50274)Actuator typePush buttonRated operational power at AC-3, 440 V, 50 Hz0.55 kWAmbient operating temperature - max55 °CRated operational power at AC-3, 220/230 V, 50 Hz0.25 kWClimatic proofingDamp heat, constant, to IEC 60068-2-78Damp heat, cyclic, to IEC 60068-2-30Device constructionBuilt-in device fixed built-in techniqueFeaturesPhase-failure sensitivity (according to IEC/EN 60947-4-1, VDE 0660 Part 102)Lifespan, electrical50,000 operations (at 400V, AC-3)Static heat dissipation, non-current-dependent Pvs0 WElectrical connection type of main circuitScrew connection10.9.3 Impulse withstand voltageIs the panel builder's responsibility.Number of polesThree-poleAmbient operating temperature - min-25 °C10.6 Incorporation of switching devices and componentsDoes not apply, since the entire switchgear needs to be evaluated.10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Mounting positionCan be snapped on to IEC/EN 60715 top-hat rail with 7.5 or15 mm height.Rated uninterrupted current (Iu)1.6 ATripping characteristicOverload trigger: tripping class 10 AShort-circuit release24.8 A, Irm, Setting range max.Basic device fixed 15.5 x Iu, Trip Blocks± 20% tolerance, Trip blocks10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Heat dissipation per pole, current-dependent Pvid1.79 WOperating frequency25 Operations/hProduct categoryMotor protective circuit breakerOverload release current setting - min1 AEquipment heat dissipation, current-dependent Pvid5.36 WHeat dissipation capacity Pdiss0 WRated operational current (Ie)1.6 AAssigned motor power at 460/480 V, 60 Hz, 3-phase0.75 HPSuitable forAlso motors with efficiency class IE3Branch circuit: Manual type E if used with terminal, or suitable for group installations, (UL/CSA)Internal resistance700 mΩTemperature compensation-25 - 55 °C, Operating range≤ 0.25 %/K, residual error for T > 40°-5 - 40 °C to IEC/EN 60947, VDE 0660Terminal capacity (solid)1 x (1 - 6) mm²2 x (1 - 6) mm²Rated frequency - min50 HzShort-circuit current60 kA DC, up to 250 V DC, Main conducting pathsPower loss5.36 W10.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Lifespan, mechanical50,000 Operations (Main conducting paths)Terminal capacity (solid/stranded AWG)18 - 10Overload release current setting - max1.6 A10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Overvoltage categoryIIIDegree of protectionTerminals: IP00IP20Rated frequency - max60 HzSwitch off techniqueThermomagneticAmbient storage temperature - max80 °CAdjustment range undelayed short-circuit release - min25 APollution degree310.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Rated impulse withstand voltage (Uimp)6000 V ACConnectionScrew terminals10.10 Temperature riseThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.FunctionsPhase failure sensitiveMotor protectionTightening torque1.7 Nm, Screw terminals, Main cableRated operational voltage (Ue) - min690 VAssigned motor power at 230/240 V, 60 Hz, 1-phase0.1 HP10.2.2 Corrosion resistanceMeets the product standard's requirements.10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Shock resistance25 g, Mechanical, according to IEC/EN 60068-2-27, Half-Eaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. Tutti i diritti riservati. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediasinusoidal shock 10 ms690 V Max. 2000 mRated operational voltage (Ue) - max Altitude。
BAS70-07®June 1999 - Ed: 2ASMALL SIGNAL SCHOTTKY DIODEVERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE EXTREMELY FAST SWITCHING SURFACE MOUNTED DEVICE FEATURES AND BENEFITSLow turn-on and high breakdown voltage diodes intended forultrafast switching and UHF detectors in hybrid mi-cro circuits. Packaged in SOT-143, this device is intended for surface mounting. Its dual inde-pendent diodes configuration makes it very inter-esting for applications where high integration is searched.DESCRIPTIONSOT-143Symbol ParameterValue Unit V RRM Repetitive peak reverse voltage 70V I F Continuous forward current 15mA I FSM Surge non repetitive forward current tp = 10ms 1A P tot Power Dissipation (note 1)T amb = 25°C310mW T stg Storage temperature range- 65 to +150°C Tj Maximum operating junction temperature *150°C TLMaximum temperature for soldering during 10s260°CNote 1: Ptot is the total dissipation of both diodes.ABSOLUTE RATINGS (limiting values)K1K2A1A2K1A1K2A2Symbol ParameterValue Unit R th (j-a)Junction to ambient (*)400°C/W(*) Mounted on epoxy board with recommended pad layout.THERMAL RESISTANCE * :dPtot dTj< 1Rth (j −a ) thermal runaway condition for a diode on its own heatsink1/4Symbol Tests Conditions Tests Conditions Min.Typ.Max.Unit V F *Forward voltage dropTj = 25°CI F = 1 mA 410mV I F = 10 mA 750mV I F = 15 mA1V V BR Breakdown voltage Tj = 25°C I R = 10 µA 70VI R **Reverse leakage currentTj = 25°CV R = 50 V 200nA V R = 70 V10µASTATIC ELECTRICAL CHARACTERISTICS Symbol Parameters Tests Conditions Min.Typ.Max.Unit C Junction capacitance V R = 1 V F = 1 MHz 2pF t rr Reverse recovery time I F = 10 mA Irr = 1 mA I R = 10 mA R L = 100 Ω5ns τEffective carrier lifetimeI F = 5 mA Krakauer method100psDYNAMIC CHARACTERISTICS (Tj = 25 °C)010203040506070800.000.020.040.060.080.100.120.140.160.18PF(av)(W)IF(av) (mA)δ= 0.2δ= 0.5δ= 1δ= 0.05δ= 0.1Tδ=tp/TtpFig.1 : Average forward power dissipation versus average forward current.2550751001251501020304050607080IF(mA)Tamb(°C)Fig.2 : Continuous forward current versus ambient temperature.Pulse test:* tp = 380 µs, δ < 2%** tp = 5 ms, δ < 2%BAS70-072/41E-31E-21E-11E+00.000.050.100.150.200.250.30IM(A)T a=50°CT a=25°CT a=100°Ct(s)I Mtδ=0.5Fig.3 : Non repetitive surge peak forward current versus overload duration (maximum values).5101520253035404550556065701E-31E-21E-11E+01E+1IR(µA)Tj=25°CTj=100°CVR(V)Fig.5 : Reverse leakage current versus reverse voltage applied (typical values).1E-31E-21E-11E+01E+11E+20.010.101.00Zth(j-a)/Rth(j-a)tp(s)Tδ=tp/Ttpδ= 0.1δ= 0.2δ= 0.5Single pulseFig.4 : Relative variation of thermal impedance junction to ambient versus pulse duration (alumine substrate 10mm x 8mm x 0.5mm).2550751001251E-21E-11E+01E+11E+2IR(µA)VR=70VTj(°C)Fig.6 : Reverse leakage current versus junction temperature (typical values).1101000.11.02.0VR(V)C(pF)F=1MHz Tj=25°CFig.7 : Junction capacitance versus reverse voltage applied (typical values).0.00.20.40.60.8 1.0 1.2 1.4 1.6 1.8 2.01E-41E-31E-27E-2IFM(A)Tj=100°C T ypical valuesTj=25°C Maximum valuesTj=25°C T ypical valuesVFM(V)Fig.8 : Forward voltage drop versus forward current.BAS70-073/4Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-proval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved.STMicroelectronics GROUP OF COMPANIESAustralia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - MalaysiaMalta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.PACKAGE MECHANICAL DATA SOT-143ALCD EHe2bb1e1A1REF.DIMENSIONSMillimeters Inches Min.Max.Min.Max.A0.8 1.20.03140.0472A10.010.1270.00040.005b 0.350.60.0140.024b10.550.950.0220.037C 0.0850.20.0030.008D 2.8 3.040.110.12E 1.21.40.0470.055e11.90 Typ.0.075 Typ.e20.2 Typ.0.008 Typ.H2.12.640.0830.103L0.55 Typ.0.022 Typ.FOOTPRINT DIMENSIONS (millimeters)Type Marking Package Weight Base qty Delivery mode BAS70-07D99SOT-1430.01g.3000Tape & reelMARKING1.920.952.251.10.650.2BAS70-074/4。
常用汽车英文缩写Quattro-全时四轮驱动系统Tiptronic-轻触子-自动变速器Multitronic-多极子-无级自动变速器ABC-车身主动控制系统DSC-车身稳定控制系统VSC-车身稳定控制系统TRC-牵引力控制系统TCS-牵引力控制系统ABS-防抱死制动系统ASR-加速防滑系统BAS-制动辅助系统DCS-车身动态控制系统EBA-紧急制动辅助系统EBD-电子制动力分配系统EDS-电子差速锁ESP-电子稳定程序系统HBA-液压刹车辅助系统HDC-坡道控制系统HAC-坡道起车控制系统DAC-下坡行车辅助控制系统A-TRC--车身主动循迹控制系统SRS-双安全气囊SAHR-主动性头枕GPS-车载卫星定位导航系统i-Drive--智能集成化操作系统Dynamic.Drive-主动式稳定杆R-直列多缸排列发动机V-V型汽缸排列发动机B-水平对置式排列多缸发动机WA-汪克尔转子发动机W-W型汽缸排列发动机Fi-前置发动机（纵向）Fq-前置发动机（横向）Mi-中置发动机（纵向）Mq-中置发动机（横向）Hi-后置发动机（纵向）Hq-后置发动机（横向）OHV-顶置气门，侧置凸轮轴OHC-顶置气门，上置凸轮轴DOHC-顶置气门，双上置凸轮轴CVTC-连续可变气门正时机构VVT-i--气门正时机构VVTL-i--气门正时机构V-化油器ES-单点喷射汽油发动机EM-多点喷射汽油发动机SDi-自然吸气式超柴油发动机TDi-Turbo直喷式柴油发动机ED-缸内直喷式汽油发动机PD-泵喷嘴D-柴油发动机（共轨）DD-缸内直喷式柴油发动机缸内直喷式发动机（分层燃烧/均质燃烧）TA-Turbo（涡轮增压）NOS-氧化氮气增压系统MA-机械增压FF-前轮驱动FR-后轮驱动Ap-恒时全轮驱动Az-接通式全轮驱动ASM 动态稳定系统AYC主动偏行系统ST-无级自动变速器AS-转向臂QL-横向摆臂DQL-双横向摆臂LL-纵向摆臂SL-斜置摆臂ML-多导向轴SA-整体式车桥DD-德迪戎式独立悬架后桥VL-复合稳定杆式悬架后桥FB-弹性支柱DB-减震器支柱BF-钢板弹簧悬挂SF-螺旋弹簧悬挂DS-扭力杆GF-橡胶弹簧悬挂LF-空气弹簧悬挂HP-液气悬架阻尼HF-液压悬架QS-横向稳定杆S-盘式制动Si-内通风盘式制动T-鼓式制动SFI-连续多点燃油喷射发动机FSI-直喷式汽油发动机PCM - 动力控制模块~EGR -废气循环再利用BCM - 车身控制模块~ICM - 点火控制模块~MAP - 空气流量计ST-无级自动变速器FF-“前置引擎前轮驱动”FR-“前置引擎后轮驱动”RR-“后置引擎后轮驱动”。
Characteristic / Test ConditionsDrain-Source Breakdown Voltage (V GS = 0V, I D = 250µA)On State Drain Current 2 (V DS > I D(on) x R DS(on) Max, V GS = 10V)Drain-Source On-State Resistance 2 (V GS = 10V, 0.5 I D[Cont.])Zero Gate Voltage Drain Current (V DS = V DSS , V GS= 0V)Zero Gate Voltage Drain Current (VDS = 0.8 V DSS , V GS = 0V, T C = 125°C)Gate-Source Leakage Current (V GS = ±30V, V DS = 0V)Gate Threshold Voltage (V DS = V GS , I D = 1.0mA)050-5519 R e v CMAXIMUM RATINGSAll Ratings: T C = 25°C unless otherwise specified.Symbol V DSS I D I DM V GS V GSM P D T J ,T STGT L IAR E AR E ASParameterDrain-Source VoltageContinuous Drain Current @ T C = 25°C Pulsed Drain Current 1Gate-Source Voltage Continuous Gate-Source Voltage Transient Total Power Dissipation @ T C = 25°C Linear Derating FactorOperating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec.Avalanche Current 1 (Repetitive and Non-Repetitive)Repetitive Avalanche Energy 1Single Pulse Avalanche Energy 4UNIT Volts AmpsVolts Watts W/°C°C Amps mJSTATIC ELECTRICAL CHARACTERISTICSSymbol BV DSS I D(on)R DS(on)I DSS I GSS V GS(th)UNIT Volts AmpsOhms µA nA VoltsMIN TYP MAX 200560.04525250±10024APT20M45SVR20056224±30±403002.4-55 to 15030056301300APT20M45SVR200V56A 0.045ΩCAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.USA405 S.W. Columbia StreetBend, Oregon 97702-1035Phone: (541) 382-8028FAX: (541) 388-0364EUROPEAvenue J.F. Kennedy Bât B4 Parc Cadéra NordF-33700 Merignac - FrancePhone: (33)557921515FAX: (33)556479761APT Website - Power MOS V ® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect,increases packing density and reduces the on-resistance. Power MOS V ®also achieves faster switching speeds through optimized gate layout.•Faster Switching •100% Avalanche Tested •Lower Leakage•Surface Mount D 3PAK PackagePOWER MOS V ®Symbol I S I SM V SD t rr Q rrDYNAMIC CHARACTERISTICSSymbol C iss C oss C rss Q g Q gs Q gd t d(on)t r t d(off)t fTest ConditionsV GS = 0V V DS = 25V f = 1 MHz V GS = 10V V DD = 0.5 V DSS I D = I D[Cont.] @ 25°CV GS = 15V V DD = 0.5 V DSS I D = I D[Cont.] @ 25°CR G = 1.6ΩMINTYPMAX40504860980137530045013019530455580122414284370714UNITpFnC ns APT20M45SVRCharacteristic Input Capacitance Output CapacitanceReverse Transfer Capacitance Total Gate Charge 3Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise TimeTurn-off Delay Time Fall Time050-5519 R e v CCharacteristic / Test Conditions Continuous Source Current (Body Diode)Pulsed Source Current 1 (Body Diode)Diode Forward Voltage 2 (V GS = 0V, I S = -I D[Cont.])Reverse Recovery Time (I S = -I D[Cont.], dl S /dt = 100A/µs)Reverse Recovery Charge (I S = -I D[Cont.], dl S /dt = 100A/µs)SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICSUNIT Amps Volts ns µCMINTYPMAX562241.32803.51Repetitive Rating: Pulse width limited by maximum junction3See MIL-STD-750 Method 3471temperature.4Starting T j = +25°C, L = 0.83mH, R G = 25Ω, Peak I L= 56A2Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%APT Reserves the right to change, without notice, the specifications and information contained herein.THERMAL CHARACTERISTICSSymbol R θJC R θJAMINTYPMAX0.4240UNIT °C/WCharacteristic Junction to Case Junction to AmbientZ θJ C , T H E R M A L I M P E D A N C E (°C /W )10-510-410-310-210-1 1.010RECTANGULAR PULSE DURATION (SECONDS)FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION0.50.10.050.010.0050.001V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)FIGURE 2, TYPICAL OUTPUT CHARACTERISTICS FIGURE 3, TYPICAL OUTPUT CHARACTERISTICSV GS , GATE-TO-SOURCE VOLTAGE (VOLTS)I D , DRAIN CURRENT (AMPERES)FIGURE 4, TYPICAL TRANSFER CHARACTERISTICS FIGURE 5, R DS (ON) vs DRAIN CURRENTT C , CASE TEMPERATURE (°C)T J , JUNCTION TEMPERATURE (°C)FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE T J , JUNCTION TEMPERATURE (°C)T C , CASE TEMPERATURE (°C)FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURER D S (O N ), D R A I N -T O -S O U R C E O N R E S I S T A N C E I D , D R A I N C U R R E N T (A M P E R E S )I D , D R A I N C U R R E N T (A M P E R E S )I D , D R A I N C U R R E N T (A M P E R E S )(N O R M A L I Z E D )V G S (T H ), T H R E S H O L D V O L T A G E B V D S S , D R A I N -T O -S O U R C E B R E A K D O W N R D S (O N ), D R A I N -T O -S O U R C E O N R E S I S T A N C EI D , D R A I N C U R R E N T (A M P E R E S )(N O R M A L I Z E D )V O L T A G E (N O R M A L I Z E D)255075100125150-50-250255075100125150-50-250255075100125150APT20M45SVR100806040201.61.41.21.00.81.151.101.051.000.950.901.21.11.00.90.80.70.61008060402010080604020060504030201002.52.01.51.00.50.0050-5519 R e v CV DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)V DS , DRAIN-TO-SOURCE VOLTAGE (VOLTS)FIGURE 10, MAXIMUM SAFE OPERATING AREAFIGURE 11, TYPICAL CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE Q g , TOTAL GATE CHARGE (nC)V SD , SOURCE-TO-DRAIN VOLTAGE (VOLTS)FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGEFIGURE 13, TYPICAL SOURCE-DRAIN DIODE FORWARD VOLTAGEV G S , G A T E -T O -S O U R C E V O L T A G E (V O L T S )I D , D R A I N C U R R E N T (A M P E R E S )I D R , R E V E R S E D R A I N C U R R E N T (A M P E R E S )C , C A P A C I T A N C E (p F )APT20M45SVR3001005010512016128410,0005,0001,000500100300100501051050-5519 R e v CAPT's devices are covered by one or more of the following U.S.patents:4,895,8105,045,9035,089,4345,182,2345,019,5225,262,3365,256,5834,748,1035,283,2025,231,4745,434,0955,528,058Dimensions in Millimeters (Inches)and Leads are PlatedSource D 3PAK Package Outline。
120W AdaptorDemo Board Manual(OB2203 + OB6563)Key FeaturesPFC is shut down when system goes to standbyStandby power less than 0.29W under 240V AC no loadHigh efficiency more than 87.7% under normal line with full loadOCP with line compensationProgrammable soft start Precise OVP Low components count Meet EN55022 EMI Pass 4kV surge test Pass 15kV/8kV ESD testOn -B ri g ht co n f i de nt i a l toCh a r mr i chIndex1Adaptor Module Specification................................................................................................................................4 1.1 Input Characteristics...................................................................................................................................4 1.2 Output Characteristics................................................................................................................................4 1.3 Performance Specifications........................................................................................................................4 1.4 Soft Start.....................................................................................................................................................4 1.5 Protection Features.....................................................................................................................................5 1.6 Environments..............................................................................................................................................5 1.7 Dielectric withstand....................................................................................................................................5 1.8 Insulation....................................................................................................................................................5 1.9 Leakage current..........................................................................................................................................5 1.10 Printed circuit board...................................................................................................................................5 1.11 EMI.............................................................................................................................................................5 2 Adaptor Module Information. (6)2.1 Schematic...................................................................................................................................................6 2.2 PCB Gerber File.........................................................................................................................................8 2.3 Bill of material............................................................................................................................................9 2.4 Transformer Design..................................................................................................................................11 2.4.1 Transformer Specification.......................................................................................................................11 2.4.2 Transformer Winding data......................................................................................................................11 2.4.3 Boost Inductor Specicfication.................................................................................................................12 2.4.4 Boost Inductor Winding data..................................................................................................................12 2.5 Adaptor Module Snapshot........................................................................................................................12 3 Performance Evaluation. (14)3.1 Input Characteristics.................................................................................................................................15 3.1.1 Input Normal Characteristics....................................................................................................................15 3.1.2 Input current and Standby power..............................................................................................................16 3.1.3 Efficiency..................................................................................................................................................16 3.2 Output Characteristics..............................................................................................................................17 3.2.1 Line Regulation & Load Regulation.........................................................................................................17 3.2.2 Ripple & Noise..........................................................................................................................................17 3.2.3 Overshoot & Undershoot..........................................................................................................................18 3.2.4 Dynamic Test............................................................................................................................................19 3.2.5 Time Sequence..........................................................................................................................................20 3.3 Protections................................................................................................................................................22 3.3.1 Over Current Protection (OCP).................................................................................................................22 3.3.2 Over V oltage Protection (OVP).................................................................................................................22 3.3.3 Short Circuit Protection.............................................................................................................................22 3.4 EMI Test...................................................................................................................................................23 3.4.1 Conducted EMI Test ...............................................................................................................................23 3.4.2 Radiation EMI Test.................................................................................................................................23 3.5 ESD Test...................................................................................................................................................25 3.6 Lighting Test.............................................................................................................................................26 4 Other important waveform (27)On -B ri g ht co n f i de nt i a l toCh a r mr i ch4.1 Vdd, FB, Sense& Gate wave form at no load/25% load/50% load/full load............................................27 4.2MOSFET VDS wave,Output diode V AK waveform at full load,start/normal/output short (28)FiguresRipple & Noise waveform....................................................................................................................................18 Overshoot and Undershoot waveform..................................................................................................................19 Dynamic waveform...............................................................................................................................................20 Time Sequence waveform.....................................................................................................................................21 Vdd,FB,Sense&Gate waveform............................................................................................................................27 MOSFET VDS,CS&V AK start waveform............................................................................................................28 MOSFET VDS,CS&V AK normal operation waveform.......................................................................................28 MOSFET VDS,CS&V AK output short waveform (30)TablesTable 1 Input current at full load...........................................................................................................................16 Table 2 Standby power at no load with LED (with PFC)......................................................................................16 Table 3 Efficiency with PFC part..........................................................................................................................16 Table 4 Line Regulation & Load Regulation........................................................................................................17 Table 5 Ripple & Noise measure results...............................................................................................................17 Table 6 Overshoot/undershoot measurement results.............................................................................................18 Table 7 Output voltage under dynamic test...........................................................................................................20 Table 8 Turn-on delay /hold-up/Rise time/Fall time measurement results............................................................20 Table 9 OCP value vs. input voltage.....................................................................................................................22 Table 10 OVP test result........................................................................................................................................22 Table 11 SCP test result.. (23)On -B ri g ht co n f i de nt i a l toCh a r mr i ch1 Adaptor Module SpecificationModel number:OBPD120W-H240ARev.：011.1 Input CharacteristicsAC input voltage rating 100Vac ~ 240Vac AC input voltage range 90Vac ~ 264Vac AC input frequency range 47Hz ~ 63Hz25A maximum at 115V AC Inrush current at 25°C50A maximum at 230V ACInput current1.56 A rms max.1.2 Output CharacteristicsOutput V oltage 19.0V Output Tolerance ±5% Min. load current 0AMax. load current6.3A1.3 Performance SpecificationsMax. Output Power 120WStandby Power <0.5W @ 240V/50Hz, no loadEfficiency>85% @ normal line, full load , including power loss in input filters Line Regulation<1% Load Regulation<5% Ripple (Po: 10 to 90%) <350 mVpp Noise (F<640KHz) <200mVppHold up Time 16.7m Sec. Min. @100Vac with full loadTurn on Delay Time2 Sec. Max. @100Vac with full load1.4 Soft StartSettling time <15ms to within 1% at nominal loadOvershoot<3%On -B ri g ht co n f i de nt i a l toCh a r mr i ch1.5 Protection FeaturesShort circuit Protection Output shut down with automatic recovery Over V oltage Protection <25VOver Current ProtectionOutput shut down with automatic recovery. The protection functionwill be enabled if output current exceeds 110%~140% of rated outputcurrent.1.6 EnvironmentsOperating Temperature 0 to+40℃℃ Operating Humidity 20% to 90% R.H. Storage Temperature -40 to +60℃℃Storage Humidity0% to 95% R.H.1.7 Dielectric withstandThe power supply shall withstand for 1 minute without breakdown by the application of a 60Hz 1500V AC voltageapplied between both input line and ground (10mA DC cut-off current). Main transformer shall similarly withstand3000Vac applied between both primary and secondary windings for a minimum of one minute.1.8 InsulationThe insulation resistance should be not less than 30 MOHM after applying of 500VDC for 1 minute1.9 Leakage currentThe AC leakage current is less than 3.5mA when the power supply connects to 264V/50Hz AC input voltage.1.10 Printed circuit boardTechnology Single sided FR2Dimensions134mm(L), 88mm(W) and 40mm(H)1.11 EMIMeet international standardsOn -B ri g ht co n f i de nt i a l toCh a r mr i chOri g ht co n f i de nt i a l toCh a r mr i cPWM Part:On -B ri g ht co n f i de nt i a l toCh a r mr i ch2.2 PCB Gerber FileOn -B ri g ht co n f i de nt i a l toCh a r mr i chOOOB2203 Demo Board Manual (OBPD120W_Adapter)Transformer Winding dataWinging Material Start Finish N1 Φ0.45*2 2UEW 不断线 TAPE TAPE W=10mm (Y) 3 Copper Copper W =9mm P =0.02mm 5 4 TAPE TAPE W=10mm (Y) N2 Φ0.60*2 三层绝缘线 TAPE TAPE W=10mm (Y) 7 Copper Copper W 9mm P 0.02mm 5 8 TAPE TAPE W=10mm (Y) N3 Φ0.12*3 2UEW 间绕 TAPE TAPE W=10mm (Y) N1’ 0.45*2 2UEW TAPE TAPE W=10mm (Y) 13 Copper Copper 9mm P 0.02mm 5 14 TAPE TAPE W=10mm (Y) 三层绝缘线16 N40.20*1 三层绝缘线17 TAPE TAPE W=10mm (Y) 18 Copper Copper W 9mm P 0.02mmOri g ht co nf i de t i ChBoost inductor Winding dataWinging Material Start N1Φ0.20*10 利兹线TAPE TAPE W=10mm (Y)N2Φ0.20*1 2UEWTAPE TAPE W=10mm (Y)Adaptor Module SnapshotO rightconfidentohOn -B ri g ht co n f i de nt i a l toCh a r m r i chOOOmraOR&N waveform@90Vac input with no load R&N waveform@90Vac input with full loadR&N waveform@264Vac input with no load R&N waveform@264Vac input with full load3.2.3 Overshoot & UndershootOf i de nt i al toCh a r mr i chOvershoot waveform@90Vac input with full load Overshoot waveform @90Vac input with no loadOvershoot waveform @264Vac input with full load Overshoot waveform @264Vac input with no loadUndershoot waveform @264V ac input with full load3.2.4 Dynamic TestA dynamic loading with low set at 1.26 A lasting for 10mS and high set at 5.0A lasting for 50mS is added tooutput. The ramp is set at 0.125A/uS at transient. All data was measurement at PCB end.On -B ri g ht co n f i de nt i al toCh a r mr i chDynamic waveform @90Vac input Dynamic waveform @132Vac inputDynamic waveform @180Vac input Dynamic waveform @264Vac input3.2.5 Time SequenceOg ht co n f i de nt i a l toCh a r mrTurn on waveform @90Vac input with full load Turn on waveform @264Vac input with full loadHold up waveform @90Vac input with full load Hold up waveform @264Vac input with full loadRise waveform @90Vac input with full load Rise waveform @264Vac input with full loadO-B ri g ht co n f i de nt i a l toCh a r mr i chFall waveform @90Vac with full load Fall waveform @264Vac with full loadProtections O CharmrichOht co n f i de nt i a l toChOn -B ri g ht co n f i de nt i a l toCh a r mr i ch3.5 ESD TestOn -B ri g ht co n f i de nt i a l toCh a r mr i ch3.6 Lighting TestOn -B ri g ht co n f i de nt i a l toCh a r mr i ch4 Other important waveform4.1 Vdd, FB, Sense& Gate wave form at no load/25% load/50% load/fullload.Vdd,FB,Sense&Gate wave form@90Vac; no load Vdd,FB,Sense&Gate wave form@90Vac; 25% loadVdd,FB,Sense&Gate wave form@90Vac; 50% load Vdd,FB,Sense&Gate wave form@90Vac; full loadVdd,FB,Sense&Gate wave form@264Vac; no load Vdd,FB,Sense&Gate wave form@264Vac; 25% loadOn -B ri g ht co nf i de nt i a l toCh ar mr i chVdd,FB,Sense&Gate wave form@264Vac; 50% load Vdd,FB,Sense&Gate wave form@264Vac; full load4.2 MOSFET VDS wave, CS wave and Output diode V AK waveform at fullload, start/normal/output short4.2.1 VDS ,CS & V AK start waveformVDS ,CS & V AK start waveform@90Vac; full load VDS ,CS & V AK start waveform@264Vac; full load4.2.2 VDS ,CS & V AK normal waveformVDS ,CS & V AK normal waveform@90Vac; full load VDS ,CS & V AK normal waveform@90Vac; 2.4A loadOn -B ri g ht co nf i de nt i a l toCh a r mr i chVDS ,CS & V AK normal waveform@90Vac; 1.65A load VDS ,CS & V AK normal waveform@90Vac; 1.45A loadVDS ,CS & V AK normal waveform@90Vac; 1.2A load VDS ,CS & V AK normal waveform@264Vac; full loadVDS ,CS & V AK normal waveform@264Vac; 3.0A load VDS ,CS & V AK normal waveform@264Vac; 2.0A loadOn -B ri g ht co n f i de nt i a l toCh a r mr i chVDS ,CS & V AK normal waveform@264Vac; 1.6A load VDS ,CS & V AK normal waveform@264Vac; 1.4A load4.2.3 VDS ,CS & V AK output short waveformVDS ,CS & V AK output short waveform@90Vac; full load VDS ,CS & V AK output short waveform@264Vac; full loadDisclaimerOn-Bright Electronics reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its documents, products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.This document is under copy right protection. Non of any part of document could be reproduced, modified without prior written approval from On-Bright Electronics.On -B ri g ht co n f i de nt i a l toCh a r mr i ch。
DESCRIPTIONLTM4700Single 100A µModule Regulator with Digital Power System ManagementDemonstration circuit 2702A-B is a single output, dual phases, high efficiency, high density, µModule regulator with 4.5V to 16V input range. The output voltage is adjust-able from 0.5V to 1.8V and it can supply 100A maximum load current. The demo board has a LTM4700 µModule regulator , which is a dual 50A or single 100A step-down regulator with digital power system management. Please see LTM4700 data sheet for more detailed information.DC2702A-B powers up to default settings and produces power based on configuration resistors without the need for any serial bus communication. This allows easy evalu-ation of the DC/DC converter . To fully explore the extensive power system management features of the part, downloadAll registered trademarks and trademarks are the property of their respective owners.BOARD PHOTOthe GUI software LTpowerPlay ® onto your PC and use L TC’s I 2C/SMBus/PMBus dongle DC1613A to connect to the board. L TpowerPlay allows the user to reconfigure the part on-the-fly and store the configuration in EEPROM, view telemetry of voltage, current, temperature and fault status.GUI DownloadThe software can be downloaded from: L TpowerPlay For more details and instructions of L TpowerPlay, please refer to L TpowerPlay GUI for LTM4700 Quick Start Guide.Design files for this circuit board are available .Figure 1. Single Output LTM4700/DC2702A-B Demo CircuitDEMO MANUAL DC2702A-B QUICK START PROCEDUREDemonstration circuit 2702A-B is easy to set up to evalu-ate the performance of the LTM4700EY. Refer to Figure 2 for the proper measurement equipment setup and follow the procedure below.1. With power off, connect the input power supply to V IN (4.5V – 16V) and GND (input return).2. Connect the 1.0V output load between V OUT0 and GND (Initial load: no load).3. Connect the DVMs to the input and outputs. Set default jumper position: JP1: ON; JP2: ON; JP3: ON.4. Turn on the input power supply and check for the proper output voltages. V OUT0 should be 1.0V ±0.5%.5. Once the proper output voltages are established, adjust the loads within the operating range and observe the output voltage regulation, ripple voltage and other parameters.6. Connect the dongle and control the output voltages from the GUI. See “L TpowerPlay GUI for the LTM4700 Quick Start Guide” for details.Note: Internal bias circuit is enabled when V IN >7V and JP3 is ON.Note: When measuring the output or input voltage rip-ple, do not use the long ground lead on the oscilloscope probe. See Figure 3 for the proper scope probe technique. Short, stiff leads need to be soldered to the (+) and (–) terminals of an output capacitor. The probe’s ground ring needs to touch the (–) lead and the probe tip needs to touch the (+) lead.PERFORMANCE SUMMARY Specifications are at T A = 25°CPARAMETER CONDITIONS VALUEInput Voltage Range 4.5V to 16VOutput Voltage, V OUT0V IN = 4.5V to 16V, I OUT0 = 0A to 100A 0.5V to 1.8V, Default: 1.0V Maximum Output Current, I OUT0V IN = 4.5V to 16V, V OUT0 = 0.5V to 1.8V100ATypical Efficiency V IN = 12V, V OUT0 = 1.0V, I OUT0 = 100A88.7% (See Figure 5) Default Switching Frequency350kHzMAXIMUM OUTPUT CURRENT NUMBER OF OUTPUTS NUMBER OF LTM4700 µModuleREGULATORS ON THE BOARD DEMO BOARD NUMBER50A21DC2702A-A 100A11DC2702A-B 200A12DC2784A-A 300A13DC2784A-B 400A14DC2784A-CDEMO MANUAL DC2702A-BQUICK START PROCEDUREFigure 2. Proper Measurement Equipment SetupFigure 3. Measuring Output Voltage RippleDEMO MANUAL DC2702A-B Figure 5. Efficiency vs Load Current at V OUT0 = 1V, f SW = 350kHz (RUNP is ON)QUICK START PROCEDUREConnecting a PC to DC2702A-BYou can use a PC to reconfigure the power managementfeatures of the LTM4700 such as: nominal V OUT , mar-gin set points, OV/UV limits, temperature fault limits, sequencing parameters, the fault log, fault responses, GPIOs and other functionalities. The DC1613A dongle may be plugged when V IN is present.Figure 4. Demo Setup with PCEfficiency vs Load Current at V O = 1.0V, f SW = 350kHz= 6V IN= 12VDEMO MANUAL DC2702A-BQUICK START PROCEDUREDC2702A-B F07V OUT0 (20MHz BW) [5mV/DIV]Figure 6. Output Voltage V OUT0 vs Load Current (V OUT0 = 1.0V)Figure 7. Output Voltage Ripple at V IN = 12V, V OUT0 = 1.0V, I OUT0 = 100ADEMO MANUAL DC2702A-BQUICK START PROCEDUREFigure 8. Thermal at V IN = 12V, V OUT0 = 1.0V, I OUT0 = 100A, T A = 25°C, No AirflowDEMO MANUAL DC2702A-BLTpowerPlay is a powerful Windows based develop-ment environment that supports Analog Devices power system management ICs and μModules, including the LTM4675, LTM4676, LTM4677, LTM4678, LTC3880, LTC3882 and LTC3883. The software supports a variety of different tasks. You can use L TpowerPlay to evaluate Analog Devices ICs by connecting to a demo board sys-tem. L TpowerPlay can also be used in an offline mode (with no hardware present) in order to build a multichip configuration file that can be saved and reloaded at a later time. LTpowerPlay provides unprecedented diagnostic and debug features. It becomes a valuable diagnostic tool during board bring-up to program or tweak the power management scheme in a system, or to diagnose power issues when bringing up rails. L TpowerPlay utilizes theLTPOWERPLAY SOFTWARE GUIFigure 9. L TpowerPlay Main InterfaceDC1613A USB-to-SMBus controller to communicate with one of many potential targets, including the LTM4675, LTM4676, LTM4677, LTM4678, LTC3880, LTC3882, LTC3883’s demo system, or a customer board. The soft-ware also provides an automatic update feature to keep the software current with the latest set of device drivers and documentation. The L TpowerPlay software can be downloaded from: L TpowerPlayTo access technical support documents for Analog Devices Digital Power Products visit the L TpowerPlay Help menu. Online help also available through the LTpowerPlay.DEMO MANUAL DC2702A-B LTPOWERPLAY QUICK START PROCEDUREThe following procedure describes how to use L TpowerPlay to monitor and change the settings of LTM4700.1. Download and install the L TpowerPlay GUI.2. Launch the L TpowerPlay GUI.a. The GUI should automatically identify the DC2702A-B. The system tree on the left hand side should look like this:b. A green message box shows for a few seconds in the lower left hand corner, confirming that LTM4700 is communicating:c. In the tool bar, click the “R” (RAM to PC) icon to read the RAM from the LTM4700. This reads the configuration from the RAM of LTM4700 and loads it into the GUI.d. If you want to change the output voltage to a different value, like 0.8V. In the Config tab, type in 0.8 in the VOUT_COMMAND box, like this:Then, click the “W” (PC to RAM) icon to write these reg-ister values to the LTM4700. After finishing this step, you will see the output voltage will change to 0.8V.If the write is successful, you will see the following message:e. You can save the changes into the NVM. In the tool bar, click “RAM to NVM” button, as following:f. Save the demo board configuration to a (*.proj) file. Click the Save icon and save the file. Name it whatever you want.DEMO MANUAL DC2702A-B PARTS LISTITEM QTY REFERENCE PART DESCRIPTION MANUFACTURER/PART NUMBER Required Circuit Components118COUT1, COUT2, COUT3, COUT4,COUT5, COUT6, COUT7, COUT8,COUT9, COUT10, COUT14, COUT15,COUT16, COUT18, COUT19, COUT20,COUT21, COUT22CAP., 330μF, X6S, 4V, 20%, 1210TAIYO YUDEN, AMK325AC6337MM-P21CIN1CAP., 180μF, ALUM. POL Y., 25V, 20%, 8mm ×12mm SMD, E12PANASONIC, 25SVPF180M 31C15CAP., 6800pF, X7R, 50V, 5%, 0603AVX, 06035C682JAT2A48CIN2, CIN3, CIN4, CIN5, CIN6, CIN7,CIN8, CIN9CAP., 22μF, X5R, 25V, 10%, 1210AVX, 12103D226KAT2AMURATA, GRM32ER61E226KE15LTAIYO YUDEN, TMK325BJ226KM-PTAIYO YUDEN, TMK325BJ226KM-T53C21, C22, C24CAP., 1μF, X5R, 25V, 10%, 0603AVX, 06033D105KAT2ANIC, NMC0603X5R105K25TRPF 61C23CAP., 1μF, X7R, 25V, 10%, 0805AVX, 08053C105KAT2A71C26CAP., 0.1μF, X5R, 16V, 10%, 0603AVX, 0603YD104KAT2ANIC, NMC0603X5R104K16TRPF 82C27, C28CAP., 0.01μF, X7R, 25V, 5%, 0603AVX, 06033C103JAT2A91C33CAP., 22μF, X5R, 6.3V, 20%, 0603MURATA, GRM188R60J226MEA0D 102Q1, Q2XSTR., MOSFET, N-CH, 40V, TO-252 (DPAK)VISHAY, SUD50N04-8M8P-4GE3 111Q3XSTR., MOSFET, P-CH, 20V, 5.9A, TO-236(SOT23-3)VISHAY, SI2365EDS-T1-GE31215R10, R11, R12, R13, R14, R15, R16,R18, R19, R24, R52, R77, R94, R95,R106RES.,10k, 5%, 1/10W, 0603, AEC-Q200NIC, NRC06J103TRFPANASONIC, ERJ3GEYJ103VVISHAY, CRCW060310K0JNEA134R25, R32, R69, R70RES., 10Ω, 1%, 1/10W, 0603NIC, NRC06F10R0TRFPANASONIC, ERJ3EKF10R0VROHM, MCR03EZPFX10R0VISHAY, CRCW060310R0FKEAYAGEO, RC0603FR-0710RL142R30, R31RES., 2.43k, 1%, 1/10W, 0603, AEC-Q200NIC, NRC06F2431TRFPANASONIC, ERJ3EKF2431VVISHAY, CRCW06032K43FKEA 152R50, R51RES., 30Ω, 1%, 1W, 2512, AEC-Q200VISHAY, CRCW251230R0FKEG 161R53RES., 0.01Ω, 1%, 1/2W, 2010, SENSE, AEC-Q200VISHAY, WSL2010R0100FEA172R72, R73RES., 4.99k, 1%, 1/10W, 0603, AEC-Q200NIC, NRC06F4991TRFPANASONIC, ERJ3EKF4991VVISHAY, CRCW06034K99FKEA 181R78RES., 15.8k, 1%, 1/10W, 0603, AEC-Q200NIC, NRC06F1582TRFPANASONIC, ERJ3EKF1582VVISHAY, CRCW060315K8FKEA 191R90RES., 0.001Ω, 1%, 1W, 2010, HP METAL,SENSE, AEC-Q200VISHAY, WSL20101L000FEA18201U1IC, DUAL 50A POP PSM MODULE, BGA15mm × 22mm × 7.82mmANALOG DEVICES, LTM4700EY#PBFDEMO MANUAL DC2702A-BPARTS LISTITEM QTY REFERENCE PART DESCRIPTION MANUFACTURER/PART NUMBER211U2IC, MEMORY, EEPROM, 2KBIT (256mm × 8mm),TSSOP-8, 400kHz MICROCHIP, 24LC025-I/ST MICROCHIP, 24LC025T-I/STAdditional Demo Board Circuit Components10C1, C2, C14, C16, C17, C29, C31, C32CAP., OPTION, 060320D1, D2DIODE, OPTION, SOD-323 30R3, R8, R26, R27, R61, R62, R64, R67,R68, R74, R75, R83, R88, R89, R93RES., OPTION, 0603416R9, R28, R29, R33, R35, R38, R41, R63,R65, R66, R91, R92, R96, R97, R98, R99RES., 0Ω, 1/10W, 0603, AEC-Q200NIC, NRC06ZOTRFVISHAY, CRCW06030000Z0EA55R48, R100, R101, R102, R103RES., 0Ω, 3/4W, 2010, AEC-Q200NIC, NRC50ZOTRFPANASONIC, ERJ12ZY0R00UVISHAY, CRCW20100000Z0EF 60R49RES., OPTION, 201070R82RES., OPTION, 120680R104, R105RES., OPTION, 0805Hardware126E1, E2, E3, E4, E5, E6, E8, E9, E10,E11, E12, E13, E14, E15, E16, E17,E18, E19, E20, E21, E22, E23, E24,E25, E26TEST POINT, TURRET, 0.064", MTG. HOLE MILL-MAX, 2308-2-00-80-00-00-07-023JP1, JP2CONN., HDR, MALE, 1mm × 3mm × 2mm,VERT, STR, THTWURTH ELEKTRONIK, 6200031112131J1CONN., SHROUDED HDR, MALE, 2 × 6, 2mm,VERT, STR, THTFCI, 98414-G06-12ULF43J2, J3, J4CONN., RF, BNC, RCPT JACK,5-PIN, STR,THT, 50ΩAMPHENOL RF, 112404 56J5, J6, J7, J8, J9, J10STUD, FASTENER, #10-32s PENNENGINEERING, KFH-032-10ET 612J5, J6, J7, J8, J9, J10NUT, HEX, STEEL, ZINC PLATE, 10-32KEYSTONE, 470576J5, J6, J7, J8, J9, J10RING, LUG, CRIMP, #10, NON-INSULATED,SOLDERLESS TERMINALSKEYSTONE, 820586J5, J6, J7, J8, J9, J10WASHER, FLAT, STEEL, ZINC PLATE, OD:0.436 [11.1]KEYSTONE, 470391J11CONN., HDR, MALE, 2 × 7, 2mm, R/A THT MOLEX, 0877601416MOLEX, 877601416101J12CONN., HDR, FEMALE, 2 × 7, 2mm, R/A THT SULLINS CONNECTOR SOLUTIONS,NPPN072FJFN-RC114MH1, MH2, MH3, MH4STANDOFF, NYLON, SNAP-ON, 0.50"WURTH ELEKTRONIK, 702935000 123XJP1, XJP2CONN., SHUNT, FEMALE, 2 POS, 2mm WURTH ELEKTRONIK, 60800213421SCHEMATIC DIAGRAM11Rev. 0SCHEMATIC DIAGRAM12Rev. 013Rev. 0Information furnished by Analog Devices is believed to be accurate and reliable. However , no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.SCHEMATIC DIAGRAM14Rev. 0ANALOG DEVICES, INC. 202005/20ESD CautionESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. 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中央监控系统常用语名词 ( 术语 )序号英文简写英文中文0 SCADA Supervisory Control And Data Acquisition 监视控制和数据采集1 BMCS Building Management and cantrol System 楼宇管理及控制系统2 FMCS Facility Management and cantrol System 设备管理及控制系统3 CCMS Central control and Monitoring System 中央监控系统4 EMCS Energy Management and Control System 能源节约管理控制系统5 BAS Building Automation System 大楼管理系统6 SA Security Automation 安全系统7 PA Parking Automation 停电系统8 FA Fire Automation 消防系统9 HA Home Automation 住家安全系统10 OA Office Automation 办公室安全系统11 CA Com Munication Automation 通讯系统1 ACCESSORIES 附件\配件2 ACCURACY 精准度3 ACTUATOR 驱动器4 AHU Air Handlind Unit 一般空调箱5 AI Analog Input 模拟输入6 AO Analog Output 模拟输出7 Applications 用途8 AQ 水柱9 AUTO 自动10 AUX 辅助接点11 BA(S) Building Automation (System) 中央监控(系统)12 BAUD RATE 通信速率13 BOILER 锅炉14 BTU METER 热量计(英热单位)15 BV Butterfly Valve 蝶阀16 CAV BOX 固定风量箱17 CFM Cubic Flow Minute 空气流量(每分钟立方英呎)18 CHILLER 冰水(主机)19 CHP Chiller Pump 冰水泵20 CHR Chiller Return 冰水回水端21 CHS Chiller Supply 冰水送水端22 CLOSE OFF PRESSURE 关断压力23 COOLING COiL(C/C) 冷却盘管24 COOLING TOWER(C/T) 冷却水塔25 COOLING WATER 冷却水26 COMPRESSOR 压缩机27 CONDENSER (COND) 冷凝器28 CONVERTER 变换器CUB Centrol UTILITY Building29 CT 比流器30 CWP Condenser Water Pump 冷却水泵31 CWS 冷却水送水端32 CWR 冷却水回水端33 DIGITAL 数字34 DAMPER 风门35 DDC Direct Ditital Control 直接数字控制器36 DEMAND 需量37 DEW POINT (DP) 露点温度38 DI Digital Input 数字输入39 DIRECT ACTING (DA) 正动作40 DIVERTING VALVE 分流阀41 DO Digital Output 数字输出42 DPS Differential Pressure Switch 差压开关(一般指风压/滤网)43 DRY COLL 干式盘管44 DRY CONTACT 干接点45 DRY BULB TEMP 干球温度46 DX Direct Expansion 直膨47 ELECTRONIC 电子数字型显示48 E/P RELAY Electrical/Pneumatic Relay 电/气继电器（ON/OFF)49 E/P TRANSDUCER 电/气传讯器（比例对应输出）50 EA Exhaust Air 排气51 ENERGY 能量52 ENTHALPY 焓值53 EVAPORATE(EVAP) 蒸发器54 FAN 风车（扇）55 F/C Fan Coil Unit 小型送风机56 FAN POWER BOX 小型送风终端箱57 FEATURE 特长58 FFU Fan Filter Unit 风车滤网箱组59 FLOATING CONTROL 浮动式控制60 FLOW METER (FM) 流量计61 FLOW SWITCH (FS) 流量开关62 FOUR PIPE 四管排式（指双管送水）冷/热共存63 FREQUENCY 频率64 GP Gross Profit 毛利65 GPM Gallon Per Minute 每分钟通过阀的液体流量以加仑计算66 HEADER 集水(风)头67 HOT WATER 热水68 HEATER 电热(器、丝)69 HEPA FILTER 高效率滤网70 HG 水银柱71 HP Hourse Power 马力72 HUIMIDITY 湿度73 HVAC Heating Ventilation Air Conditioning 空气调节(空调)74 HWR Hot Water Refurn 热水回水端75 HWS Hot Water Supply 热水送水端76 I/F Inter Face 接口器77 I/O SUMMARY Input/ Output SUMMARY 输入/输出点数表78 INPUT 输入79 INTERFACE 接口80 INTERLOCK 连锁控制81 INVERTER(VFD) 变频器82 IP 防水等级83 KVA 视在功率84 KVAR 虚功率85 KW 实功率86 KWH 千瓦时87 LCD Liquid Crystal Display 液晶显示88 LED Liquid Electrical Disday 电子数字型显示89 LPM Liter Per Minute 每分钟公升(水流量)90 MERCURY 温度计\水银柱91 MADC 直流微安培92 MANUAL 手动93 MAU Maker-UP Air Unit 外气经过处理后送出恒温/恒湿之空调箱装设94 MIXING VALVE 混合式阀95 MMC 低压盘及马达控制中心96 MODE 模式97 N Natural 电流(中性线)98 OA Outside Air 外气99 OPTION 选择100 OUTPUT 输出101 PACKAGE 箱型机102 PAHU 外气(一次侧)空调箱103 PF 功率因子104 PID Proportional Integral Derivative 比例/积分/微分105 PLC programing Logic Control 可程控器106 POWER CONSUMPITON 耗电量107 POWER SUPPLY 供电108 PRESSURE 压力109 PROTOCOL 通信语言110 PSI 磅/平方吋(压力)111 PSYCHROMETRIC 空气线图112 PT 比压器113 PULSE CONSTANT 脉衡常数114 RECORDERS 记录115 RETURN AIR 回风116 RESET 复置模式117 RESISTER 电阻118 RETURN 回流119 REVENUE 收入(出货后才有的收入)120 REVERSE ACTING(RA) 反动作121 REVISE 修正122 RELAY 继电器123 RH Relative Humidity 相对湿度124 RPM Run Per Minute 转速(每分钟)125 RTD 电阻体感测组件126 SUPPLY AIR SA 送风127 SCOOPE 范围128 SCR Silicon Controlled Rectifiers 无段加热控制器scrubber 排气的水洗129 SD Smoke Detector 侦烟传感器130 SELECT 选择131 SERIES 系列132 SET POINT 设定点133 SETUP 初始设定模式134 SOLENOLD VALVE 电磁阀135 SP Static Pressure 静压136 SPDT 单刀双投式137 SPEC Specifications 规范(格)138 SPST 单刀单投式139 STEP CONTROL 阶段控制140 SUMMARY 一般量测集141 SUPPLY 送出(供应)142 SWITCHING POWER SUPPLY 交换式电源供应器143 TEMPERATURE 温度144 THERMISTER 热电阻145 THERMOCOUPLE 热敏电偶146 THERMOSTAT 温度传感器147 THREE WAY 三通148 TIME DELAY 时间延迟149 TRAINING (教育)训练150 TRANSDUCER 转换器151 TRANSFORMER 变压器152 TRANSMITTER 信号传送(讯)器153 TWO PIPE 二管排式(指单管送水)154 TWO WAY 二通155 ULTRASONIC 超音波156 UPS 不断电系统157 VALVE 阀158 VAV BOX 可变风量箱159 VDO 直流电压160 WATT 瓦特161 W-CELL 中效率滤网162 WET BULB TEMP 湿球温度163 WIRING TERMINALS 接线端子164 WDPS Water Diff Pressure Switch 水差压开关165 ZP ZONE PUMP 区域泵(二次泵)166 P/DP差压(压力表)167 T温度差。
Abstract— With the advancement of semiconductor technology, solid state transformer (SST) with high voltage fast switching SiC power devices is becoming a valid option to replace the conventional transformers in power substation. In this paper, a 270 kVA solid state transformer based on 10kV SiC Power MOSFET has been proposed. The two stages of SST, five-level Vienna rectifier and five-level DC/DC converter are specifically designed and simulated in closed loop. The analysis of device losses is performed based on the device characteristics. A design of high frequency transformer is presented as well. The simulation results together with the loss analysis verify the functionality and feasibility of SST.Index Terms—Solid state transformer, SiC power devicesI. I NTRODUCTIONs the interface between the transmission and distribution, electric power substations are currently requiring 60Hz transformers for voltage transformation. However, these conventional copper-and-iron based transformers possess some undesirable properties including bulky size, regularly required maintenance and power quality susceptibility. These disadvantages are becoming more of concerns nowadays.With the rapid development of SiC material, SiC devices become a viable option even at high voltages while still maintaining the high switching speed. Therefore, it is possible to apply high frequency PWM converters in electric power transmission and distribution applications that are traditionally not feasible with slower silicon bipolar devices. Enabled by high voltage SiC device, solid-state transformer (SST) with high frequency power electronics converter is becoming an alternative to replace the conventional transformers.The main purpose of solid-state transformer is to convert ac to ac for step-up or step-down with a function same as that of a conventional transformer[1-2]. The solid-state transformer consists of an AC/DC rectifier, a DC/DC converter, a high frequency transformer and a DC/AC inverter. The traditional 60 Hz transformer is replaced by a high frequency transformer plus solid state devices, which is the key to achieve size and weight reduction.SST has several advantages over traditional power transformers. Unlike the conventional 60Hz transformer, whose power factor depends on the load, the AC/DC rectifier stage of SST acts as a front-end power factor correction device, which enables the unity power factor to the power grid. Besides, SST is not susceptible to voltage sag or swell in the power system because there is a DC link between the AC/DC rectifier and DC/AC inverter. The DC bus voltage can be kept almost constant regardless of system voltage change. Furthermore, due to the energy stored in the DC link capacitors, the SST is capable of sustaining the output power for a few cycles even in the case of power outage. Meanwhile, the SST automatically operates like a circuit breaker or current limiter because it can limit the current through proper control of the DC/AC converter, or it can trip based on standard I2t curve if the DC/AC converter is designed with proper capacity. These advantages are much less understood by the electric power companies hence significant research is needed to demonstrate these capability and advantages at a meaningful power level.The basic configuration of a proposed 270 kVA SST is shown in Fig.1, which consists of a high voltage high frequency AC/DC rectifier that converts 60Hz, 13.8 kV AC to 24 kV DC bus, a high voltage high frequency DC-DC converter that converts 24 kV to 750V DC bus and a voltage source inverter (VSI) that inverts 750V DC to 60 Hz, 480V AC. The 270 kVA SST unit is envisioned as a building block for construction a much larger 2.7 MVA SST.In this paper, simulation study of the rectifier and the DC/DC converter are performed to demonstrate the functionality and feasibility of the SST. In order to realize the high frequency Rectifier and DC/DC converter with bus voltage as high as 24 kV, high voltage power devices with low conduction and switching losses are needed. 10 kV SiC MOSFET and PIN or JBS diodes are currently being developed by a number of organizations [3-5]. Based on the device characteristics obtained from physics model simulation, the conduction losses and switching losses are analyzed for the devices of the rectifier and the DC-DC converter as well.Fig. 1. Basic configuration of Solid State TransformerII. S IMULATION STUDY AND L OSS A NALYSIS OF R ECTIFIEROne of the significant superiorities of SST over traditional transformer is that the power factor is no longer dependent on the load characteristic but can be maintained at unity power factor. The rectifier converts the three-phase AC voltage into a270 kV A Solid State Transformer Based on10 kV SiC Power DevicesTiefu Zhao, Liyu Yang, Jun Wang, Alex Q. Huang Semiconductor Power Electronics Center, North Carolina State University, Raleigh, NC 27695, USA ADC output while maintaining good power factor at the input side.Vienna rectifier has been proposed in recent years [6-7]. The circuit diagram is shown in Fig. 2 (a) with S a , S b and S c being gate-controlled two-directional switches. The voltage stress for S a , S b and S c is only half of the total output voltage. In order to use 10kV SiC MOSFET in SST, the 24kV DC bus is divided into five levels. A modified five level ViennaRectifier is shown in Fig. 2(b).(a)(b)Fig. 2. Circuit Diagram of Basic Vienna Rectifier(a) and Circuit Diagram of Five-level Vienna Rectifier (b).Simulation circuit has been implemented in Saber and one-cycle control [8] is used for the five-level Vienna Rectifier. Fig. 3 shows the simulation waveform of the output voltage and the input phase voltage and phase current. The input voltage and current are in phase, which results in a unitypower factor.Fig. 3. Simulation results of Five-level Vienna RectifierThe conduction losses and switching losses of the 10kV SiC MOSFETs and 10kV PiN diodes are analyzed based on device simulations performed on devices with similar structure as those being manufactured by Cree Inc. The calculation is based on the following conditions: V IN =60Hz, 13.8 kV AC, V DC =24kV, P OUT =270kW, f sw =20kHz, MOSFET die area = 4mm*4mm and Diode die area = 4mm*4mm.The results are listed in Table I.TABLE I --- L OSS ANALYSIS OF F IVE -LEVEL V IENNA R ECTIFIERConduction Loss Switching Loss Total LossS_a1 or S_a217.9W 681.7W 699.6W D_ap orD_an*13.9W*4 29.9W*4 43.8W*4 D_a1 to D_a84.9W 29.9W 34.8W * (each has four PiN diodes in series to sustain 24kV)As can be seen from the table, except the switching loss of the MOSFET, all other losses are low and easy to handle. The MOSFET switching losses could be further reduced if more MOSFETs are parallel, or the switching frequency is lower. The simulation results and loss calculation shows the Vienna rectifier is a good option for the rectifier stage of solid state transformer.III. S IMULATION STUDY AND L OSS A NALYSIS OFF IVE -L EVEL DC/DC C ONVERTER After the 13.8kV AC voltage is rectified to a 24kV five-level DC output, the DC/DC converter and high frequency transformer are needed to step down the voltage to 750V DC. Then the voltage source inverter serves as the final stage to inverts 750V DC to 60 Hz, 480V AC.A novel ZVS five-level DC/DC converter is proposed in this section. The circuit diagram and the gating signals are shown in Fig. 4. Likewise, five levels are chosen in order to support a high input voltage of 24 kV using 10 kV SiC MOSFET. The difference between the proposed structure and the basic neutral-point-clamped (NPC) multilevel converter is the inclusion of three flying capacitors C s1, C s2 and C s3. These additional capacitors enable the operation of ZVS for the main switches with phase shift control [9-10].The five-level DC/DC converter is operated in eleven stages by phase shifting switch S1-S8 as shown in Fig.4 (b). For instance, during [t 0-t 1], switches S5, S6, S7 and S8 are ON, and the input power is delivered to the output. During [t 1-t 2], S8 is turned off, so the voltage across S8 rises to the voltage of C4 (6kV). Meanwhile the voltage across S1 has to decrease to 0 due to the clamping effect of C1-C4 and Cs3. Then S1 could be turned on after its voltage reduces to 0, so the ZVS turn-on of S1 is achieved. The other switches S2, S3, S6-S8 are turned on and off in the same manner, however S4 and S5 are a little different as discussed below.(a)(b)Fig. 4. Five-level DC/DC converter: Circuit Diagram (a) and Gate signal timing scheme and waveforms (b). (The top four rows are the gate signals for the eight MOSFETs, V pri is the voltage of the node between S 4 and S 5 with respect to the ground, I pri is the primary current of the transformer, and I Dr1 and I Dr2 are the current flowing through the two secondary diodes, respectively.)To verify the working principle and performance of theproposed converter and demonstrate the viability of 10kV SiC power devices for operation at 20 kHz, the five-level converter is simulated using Saber circuit simulator. A SPICE model for the SiC MOSFET and the level one model for the PIN diodeare developed by the authors and implemented in Saber. Themain simulation parameters are V in =24kV, V out =750V, P out =270kW, f sw =20kHz, phase shift=1.5-4us, dead time=1us, turns ratio = 24:2:2 and L r =130uH.Fig. 5 shows the ZVS operation of the switches. During turn-on time, V DS(s1) falls down before I d(s1) rises up, so the turn on for S 1/S 8 is ZVS. Likewise, the waveforms verify the ZVS operation for S 2/S 7 and S 3/S 6. However, V DS(s4) falls down after I d(s4) rises up, so it is a hard turn-on for S 4/S 5. But if the value of the resonant inductor is increased, it is possible to realize soft switching for S 4 and S 5 as well because more energy is stored in the resonant inductor. So the proposed phase shift pattern for five-level DC/DC converter ensures six switches S1-S3, S6-S8 operating with ZVS turn-on, whereas the middle two switches S4, S5 may lose ZVS under light load condition.Fig. 5. Simulation waveforms showing ZVS operation (Time scale = 20us/div) (From top down, voltage and current for Switch S4, S3, S2 and S1 respectively)Due to the ZVS turn-on of most switches, the losses in the SiC MOSFET and diodes are significantly reduced compared to hard-switched converters. Table II summarizes the losses of the MOSFETs at an output power of 270 kW. The major losses are the turn-on loss of switch S4 and S5, while the other MOSFETs and diodes losses are much less significant. Therefore, the losses are still low enough that conventional thermal management (water, air) can be used to cool the 10 kV SiC MOSFET/diode module.TABLE II --- C ALCULATED MOSFET LOSSES IN THE 270 K W DC/DCCONVERTERIV. C LOSED LOOP SIMULATION OF F IVE -LEVEL V IENNA RECTIFIER AND DC/DC CONVERTER To verify the functionality of the system, the closed loop control for both Vienna Rectifier and DC/DC converter are designed respectively. The control block is shown in Fig.6.In five-level Vienna Rectifier, one-cycle control [8] is employed. The closed loop controller is to regulate the outputDC bus voltage (24kV) and maintain the unity power factor at the input.For the five-level DC/DC converter, the phase shift control is used to regulate the output DC voltage under different output load conditions. First the difference between the output voltage V DC and the reference voltage is compared. Then the phase shift angle is adjusted to regulate the output voltage according to this voltage error.Fig. 6. Control block of the DC/DC converterFig. 7 is the close loop simulation result taken into account different load conditions. The load is changing from 100% (P out =270kW) to 150% at 20ms, then from 150% to 100% at 25ms, from 100% to 30% at 30ms. It can be seen from the simulation waveforms that the output voltage can be regulated at 750V at different load conditions by adjusting the phaseshift.Fig. 7. Five-level converter closed loop simualtion under different output loadconditions (Top trace: load current, 200A/div; second top trace: load voltage,500V/div; third top trace: transformer primary current: 50A/div; bottom trace: the voltage of the node between S4 and S5, 10kV/div). (Time scale=2.5ms/div)Fig. 8 shows the simulation results with the disturbance ofsingle phase voltage sag. The magnitude of input phase A voltage changes from 100% in the 1st cycle to 80% in the 2nd and 3rd cycles. Phase B and C voltages are normal. During the voltage sag, the rectifier output voltage varies a little around 24kV, but the five-level converter output can be stabilized at 750V and the input current still maintains a good power factor.Fig. 8. Closed loop simualtion under input voltage sag(Top trace: Input phase A voltage, 10kV/div; second top trace: Input phase B voltage, 10kV/div; third top trace: Input phase C voltage, 10kV/div; fourth top trace: Five-level DC/DC converter output voltage, 250V/div; fifth top trace: Viennia rectifier output voltage, 6kV/div; bottom trace: three phase input current, 5A/div). (Time scale=10ms/div)The simulation results illustrate solid state transformer is not susceptible to both source and load disturbance. The voltage sage ride-through characteristic protects load from input voltage sags and greatly enhances the power quality. V. H IGH FREQUENCY HIGH POWER TRANSFORMER DESIGNThe high frequency high power transformer is an indispensable component to step down the voltage. In the proposed SST, the transformer is smaller in size and lighter in weight compared to the line-frequency power transformer in conventional substations. As shown in Fig.9, the estimated core size significantly decreases as the frequency increases. To demonstrate these advantages, a 20 KHz/270 kW high powertransformer is designed so that the size and weight can be estimated. The main design parameters for this transformer are determined and listed in Table III.Fig.9 Transformer core size frequency relationship [11]TABLE III---D ESIGN P ARAMETERS OF THE T RANSFORMERCore Area 146cm2 Turns ratio:Np: Ns1:Ns224:2:2Core PartNumber Toroidal core T60004-L2160-W758Primary winding Reynolds HVinsulation wire,P/N 178-9824, 5in parallel.Number ofCores31Secondary winding Copper plate,2mm thick,60mm wideApproximatedVolume950*180*180(mm3)Core Material VITROPERM500F ApproximatedWeight55(Kg)The approximated volume and the weight exclude those of the supporting mechanical parts and the enclosure. However, from these data, the high frequency high power transformer is small in volume and light in weight. Further discussion on transformer design could be found in [12].VI. C ONCLUSIONSSST has the advantages of smaller size, unity power factor, voltage sag ride through capability, current limiting function and circuit breaker function. In this paper, a 270 kVA solid state transformer using 10kV SiC Power MOSFET has been proposed. Vienna rectifier is employed in the rectifier stage, which enables the SST a unity power factor. A novel ZVS five-level DC-DC converter is proposed. By employing a phase shift control, the five-level DC-DC converter allows ZVS soft-switching operation for most of the main devices. This significantly reduces the turn-on loss of the MOSFETs and improves the overall efficiency. Simulation results verify the functionality and feasibility of the Rectifier and DC/DC converter stage. Furthermore, based on the device characteristics from physics simulation, the devices losses are calculated. The losses are low enough that conventional thermal management (water, air) can be used to cool the 10kV SiC MOSFET/diode module. The above simulation results and loss analysis justify that solid state transformer with 10kV SiC power devices is a valid option to replace the conventional transformer in power substation.VII. A CKNOWLEDGMENTSupports from DARPA and Cree Inc. are gratefully acknowledged.VIII. R EFERENCES[1] E. R. Ronan, S. D. Sudhoff, S. F. Glover and D. L. Galloway, “A PowerElectronic-Based Distribution Transformer”, IEEE Transactions on Power Delivery, vol. 17, pp. 537 - 543 , April 2002.[2]Jih-Sheng Lai, A. Maitra, A. Mansoor and F. Goodman, “MultilevelIntelligent Universal Transformer for Medium Voltage Applications”, Conference Record of Industry Applications Conference, Fourtieth IASAnnual Meeting. vol. 3, pp: 1893 – 1899, Oct, 2005.[3]S. -H Ryu, A. Agarwal, S. Krishnaswami, et al., “Development of 10 kV4H-SiC Power DMOSFETs”, Mat. Sci. Form, vol. 457-460, pp. 1385-1388, 2004. [4]R. Singh, K.G Irvine, D.C.Capell, et al. “Large Area, Ultra-high Voltage4H-SiC p-i-n Rectifiers” IEEE Transactions on Electron Devices, vol.49, pp. 2308-2316. 2002.[5]M.K. Das, J.J. Sumakeris, B.A. Hull, et al. “High power, drift-free 4H-SiC PiN diodes”, Proceedings of IEEE Lester Eastman Conference on High Performance Devices, pp. 236 – 240, Aug. 2004[6]J. W. Kolar, H. Ertl and F. C. Zach, “Design and experimentalinvestigation of a three-phase high power density high efficiency unity power factor PWM (VIENNA) rectifier employing a novel integrated power semiconductor module”, Conference Proceedings of Eleventh Annual Applied Power Electronics Conference and Exposition, APEC '96, vol.2, pp. 514 – 523, 1996[7]J. W. Kolar, U. Drofenik and F. C. Zach. “VIENNA rectifier II-a novelsingle-stage high-frequency isolated three-phase PWM rectifier system”, IEEE Transactions on Power Electronics. vol. 46, No. 4, pp. 674-691.Aug, 1999.[8]Chongming Qiao and K. M. Smedley. “Three-phase unity-power-factorstar-connected switch (VIENNA) rectifier with unified constant-frequency integration control”, IEEE Transactions on Power Electronics.vol. 18. No. 4. pp 952-957. Jul, 2003[9]Peter M. Barbosa, Francisco Canales, J. M. Burdio and Fred C. Lee. “AThree-Level Converter and Its Application to Power Factor Correction.”IEEE Transactions on Power Electronics. vol. 20. No. 6. pp 1319-1327.Nov, 2005.[10]Francisco Canales, “Novel DC/DC Converters for High-PowerDistributed Power Systems”, Ph.D. dissertation, Virginia Polytechnic Institute and State University, Blacksburg, Virginia. July, 2003[11]L. Heinemann, “An actively cooled high power, high frequencytransformer with high insulation capability”, Proceedings of APEC 2002, Vol. 1, pp. 352-357, March 2002[12]Liyu Yang, Tiefu Zhao, Jun Wang and Alex Huang, “Design andAnalysis of a 270 kW DC/DC Converter for Solid State Transformer Using 10 kV SiC Power Devices”, The 38th IEEE Power Electronics Specialist Conference 2007 (to be published)。
