下载文档原格式
A.Features重要特性♦Smaller size saves board space and cost超小尺寸、节约空间和成本♦Resettable circuit protection自恢复保护、免维护♦Fast time-to-trip动作时间快♦Low resistance低内阻值♦Surface mount packaging for automated assembly贴片式封装，方便自动化生产♦Lead-free and compliant with the European Union RoHS Directive2002/95/EC 符合欧州ROHS无铅环保要求B.Application应用范围Polymer Resettable Fuse for over-current,over-temperature and short-circuit protection 可恢复保险丝用于过流、温度和线路短路保护♦Computer motherboards计算机主板♦IEEE1394PortsIEEE1394通讯接口♦USB hub,ports and peripheralsUSB交换机及外围设备♦Phones电话设备♦Data communication数据交换机♦Modems/Ethernet/LAN调制解调器/以太网C.General Description简要概述Polymer resettable fuse are made of polymeric PTC materials which is a matrix of自恢复保险丝是聚合物高分子材料通过特殊工艺而成，polymer containing dispersed conductive particles.Generally,the device has a very高分子粒子按一定的规律排列，自恢复保险丝器件有低内阻low resistance.If an over-current happened,as a response to the damage current,当电路中电流突然增大时，the resistance will immediately increase to very high,reducing the current of the器件将会在短时间内阻值升到高阻状态、高分子膨胀circuit to a safe value that the loading can carry.Once fault to the circuit is weed out从而起到减少过电流；and power is recuperated,the polymer will deflate itself,the device will reset and is 一旦故障排除后，高分子将会恢复正常规则排序。
(a) RoHS Compliant & Halogen Free(b) Applications: All high-density boards(c) Product Features: Small surface mountable, Solid state, Faster time to trip thanstandard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.10A~1.10A (e) Maximum Voltage: 6V~24V DC(f) Temperature Range : -40℃ to 85℃2. Agency RecognitionUL : File No. E211981TÜV: File No. R500905563. Electrical Characteristics (23℃)H I T =Trip current-minimum current at which the device will always trip at 23℃ still air. V MAX =Maximum voltage device can withstand without damage at it rated current.(I MAX )I MAX = Maximum fault current device can withstand without damage at rated voltage (V MAX ).Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. R MIN =Minimum device resistance at 23℃ prior to tripping.R 1MAX =Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristicsTermination pad materials: Pure Tin4.FSMD Product Dimensions (Millimeters)6. Typical Time-To-Trip at 23℃Tim e -t o -t r i p (S )7. Material SpecificationTerminal pad material: Pure TinSoldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 38. Part Numbering and Marking SystemPart Numbering System Part Marking SystemS M D □ □ □ - □ □ - 0805 F □Warning: electrical arcing and/or flame.-PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. 甲、 -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the deviceperformance. A = SMD010-0805 / SMD010-24-0805 B = SMD020-0805 C = SMD035-0805 D = SMD050-0805 / SMD050-9-0805 E = SMD075-0805 F = SMD100-0805 G= SMD110-0805Current Rating Part Identification Logo Example Voltage Rating9. Pad Layouts 、Solder Reflow and Rework RecommendationsThe dimension in the table below provide the recommended pad layout for each SMD 0805 deviceNote 1: All temperatures refer to of the package,measured on the package body surface.Reflow Profile。
贴片电阻的功率是指通过电流时由于焦耳热电阻产生的功率。
可根据焦耳定律算出：P=I2 R。
额定功率：是指在某个温度下最大允许使用的功率，通常指环境温度为70°C时的额定功率。
额定电压：可以根据以下公式求出额定电压。
额定电压(V)＝√额定功率(W)× 标称阻值(Ω)最高工作电压：允许加载在贴片电阻两端的最高电压。
贴片电阻的封装与功率、电压关系如下表：图1 (-55 ~+125)功率及环境温度降额曲线图图2 (-55 ~+155)功率及环境温度降额曲线图注意事项：•设计和使用贴片电阻时，最大功率不能超过其额定功率，否则会降低其可靠性。
•一般按额定功率的70%降额设计使用。
•也不能超过其最大工作电压，否则有击穿的危险。
•一般按最高工作电压的75%降额设计使用。
•当环境温度超过70°C，必须按照降额曲线图(图1,图2)降额使用。
我们俗称的封装是指英制。
规格书//电容规格书.pdf贴片电阻常见封装有9种，用两种尺寸代码来表示。
一种尺寸代码是由4位数字表示的EIA(美国电子工业协会)代码，前两位与后两位分别表示电阻的长与宽，以英寸为单位。
我们常说的0603封装就是指英制代码。
另一种是米制代码，也由4位数字表示，其单位为毫米。
下表列出贴片电阻封装英制和公制的关系及详细的尺寸：英制(inch ) 公制(mm)长(L)(mm)宽(W)(mm)高(t)(mm)a(mm)b(mm)02010603 0.60±0.050.30±0.050.23±0.050.10±0.050.15±0.0504021005 1.00±0.100.50±0.100.30±0.100.20±0.100.25±0.1006031608 1.60±0.150.80±0.150.40±0.100.30±0.200.30±0.2008052012 2.00±0.201.25±0.150.50±0.100.40±0.200.40±0.2012063216 3.20±0.201.60±0.150.55±0.100.50±0.200.50±0.201210 322 3.20±0. 2.50±0.0.55±0.0.50±0.0.50±0.Note：我们俗称的封装是指英制。
The SMD0805Series PTC provides surface mount over-current protection for applications where space is at a premium and reset table protection is desired.◆RoHS compliant,Lead-Free and Halogen-Free ◆Fast time-to-trip◆Compact design saves board space ◆Agency recognition:UL ◆Low-profileAlmost anywhere there is a low voltage power supply,up to 16V and a load to be protected,including:◆Computer mother board,B hub ◆PDAs &Charger,Analog &digital line card ◆Digital cameras,Disk drivers,CD-ROMs ◆USB peripherals ◆Power ports◆General electronicsPartNumberIhold (A)I trip (A)V max (Vdc)I max (A)P dtyp.(W)Maximum TimeTo Trip ResistanceCurrent (A)Time (Sec.)R min (Ω)R max (Ω)SMD0805-0100.100.30151000.500.50 1.50 1.000 6.000SMD0805-0200.200.5091000.508.000.020.650 3.500SMD0805-0350.350.7561000.508.000.100.250 1.200SMD0805-0500.50 1.0061000.508.000.100.1500.085SMD0805-0750.75 1.506400.608.000.200.0900.385SMD0805-1001.01.9561000.608.000.300.0600.230I hold =Hold current:maximum current device will pass without tripping in 25°C still air.I trip =Trip current:minimum current at which the device will trip in 25°C still air.V max =Maximum voltage device can withstand without damage at rated current (I max )I max =Maximum fault current device can withstand without damage at rated voltage (V max )P dtyp.=Power dissipated from device when in the tripped state at 25°C still air.R min =Minimum resistance of device in initial (un-soldered)state.R max =Maximum resistance of device in initial (un-soldered)state.R 1max =Maximum resistance of device at 25°C measured one hour after tripping.Caution:Operation beyond the specified rating may result in damage and possible arcing and flame.Part NumberAmbient Operation Temperature-40°C-20°C0°C25°C40°C 50°C 60°C 70°C 85°CHold Current (A)SMD0805-0100.140.120.110.10.80.70.60.50.3SMD0805-0200.280.250.230.200.170.140.120.100.07SMD0805-0350.470.440.390.350.300.270.240.200.14SMD0805-0500.680.620.550.500.400.370.330.290.23SMD0805-075 1.000.900.790.750.630.570.530.410.34SMD0805-1001.351.251.151.000.820.740.650.550.42A=SMD0805-010B=SMD0805-020C=SMD0805-035D=SMD0805-050E=SMD0805-075F=SMD0805-100Part MarkingXPart Identification1Example1= SMD0805-010 2= SMD0805-020 3= SMD0805-035 5= SMD0805-050 7= SMD0805-075 0= SMD0805-100Profile FeaturePb-Free Assembly Average Ramp-Up Rate (T S max to T P ) 3°C/second max. Preheat :Temperature Min (T S min) Temperature Max (T S max) Time (T S min to T S max) 150°C 200°C60-180 seconds Time maintained above: Temperature(TL) Time (tL)217°C60-150 seconds Peak/Classification Temperature(T P ): 260°C Time within 5°C of actual peak: Temperature20-40 seconds Ramp-down Rate:6°C/ second max. Time 25°C to Peak Temperature8 minutes max.Note: All temperatures refer to of the package, measured on the package body surface.Solder reflowDue to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.1.Recommended max past thickness > 0.25mm.2.Devices can be cleaned using standard methods and aqueous solvent.3.Rework use standard industry practices.4.Storage Environment : < 30℃/ 60%RHCaution:1.If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.2.Devices are not designed to be wave soldered to the bottom side of the board.Soldering ParametersRamp-downPreheatCritical Zone T L to T PTime to peak temperature(t 25℃ to peak)T PT L T S(max)T S(min)25T e m p e r a t u r eRamp-upTimeA B C DeviceNominalNominal Nominal 0805 Series1.201.001.50The dimension in the table below provide the recommended pad layout for each SMD0805 devicePart Numbering Pa c k ag ingPad Layouts Unit: mmTerminal pad material Pure TinSoldering CharacteristicsMeets EIA specification RS 186-9E, ANSI/J-std-002 Category 3Material Specifications010SMD0805Product nameSMD ：surface mount deviceHold Current 0.10ATape & Reel Quantity5,000 pcs/reelABCDEPart NumberMin.Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD0805-010 2.00 2.20 1.20 1.50 0.50 1.00 0.20 0.60 0.10 0.45 SMD0805-020 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-035 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-050 2.00 2.20 1.20 1.50 0.30 0.60 0.20 0.60 0.10 0.45 SMD0805-075 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.60 0.10 0.45 SMD0805-1002.002.201.201.500.501.100.200.600.100.45Dimensions Unit: mmu Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.u PPTC device are intended for occasional over-current protection. Application for repeated over-current condition and/or prolonged trip are not anticipated.uAvoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.WarningTape and Reel SpecificationsDirection of Feed0.33 (8.4)0.512(13.0)Arbor Hole Diameter7.0 (177.8)0.212 (5.4)0.157 (4.0) 0.059(1.5)Diameter Cover tape0.314 (8.0)0.157 (4.0)Dimensions are in inches(and millimeters)。
1210表示1210、1812表示1812、10表示1210、12表示2512。
K －表示温度系数为100PPM,102－5％精度阻值表示法：前两位表示有效数字，第三位表示有多少个零，基本单位是Ω，102＝10000Ω＝1KΩ。
1002是1％阻值表示法：前三位表示有效数字，第四位表示有多少个零，基本单位是Ω，1002＝100000Ω＝10KΩ。
J －表示精度为5％、F－表示精度为1％。
T －表示编带包装1：0402(1/16W) 2:0603(1/10W) 3:0805(1/8W) 4:1206(1/4W) 5:1210(1/3W) 6:2010(1/2W) 7:2512(1W)1206 20欧1/4 *4 5欧1w120无极性电容以0805、0603两类封装最为常见；0805具体尺寸：2.0×1.25×0.51206具体尺寸：3.0×1.50×0.5贴片电容以钽电容为多，根据其耐压不同，又可分为A、B、C、D四个系列，具体分类如下：类型封装形式耐压A 3216 10VB 3528 16VC 6032 25V 尺寸：L:6.0 w3.2D 7343 35V贴片钽电容的封装是分为A型（3216），B型（3528），C型（6032），D型（7343），E型（7845）。
贴片电容正负极区分一种是常见的钽电容，为长方体形状，有“-”标记的一端为正；另外还有一种银色的表贴电容，想来应该是铝电解。
上面为圆形，下面为方形，在光驱电路板上很常见。
这种电容则是有“-”标记的一端为负。
发光二极管：颜色有红、黄、绿、蓝之分，亮度分普亮、高亮、超亮三个等级，常用的封装形式有三类：0805、1206、1210二极管：根据所承受电流的的限度，封装形式大致分为两类，小电流型（如1N4148）封装为1206，大电流型（如IN4007）暂没有具体封装形式，只能给出具体尺寸：5.5 X 3 X 0.5电容：可分为无极性和有极性两类:无极性电容下述两类封装最为常见，即0805、0603；有极性电容也就是我们平时所称的电解电容，一般我们平时用的最多的为铝电解电容，由于其电解质为铝，所以其温度稳定性以及精度都不是很高，而贴片元件由于其紧贴电路版，所以要求温度稳定性要高，所以贴片电容以钽电容为多，根据其耐压不同，贴片电容又可分为A、B、C、D四个系列，具体分类如下：类型封装形式耐压A 3216 10VB 3528 16VC 6032 25VD 7343 35V贴片钽电容的封装是分为A型（3216），B型（3528），C型（6032），D型（7343），E型（7845）。
SMD 贴片元件的封装尺寸贴片元件的封装尺寸【SMD 贴片元件的封装尺寸贴片元件的封装尺寸】】公制：3216——2012——1608——1005——0603——0402英制：1206——0805——0603——0402——0201——01005注意注意：：0603有公制，英制的区分公制0603的英制是英制0201，英制0603的公制是公制1608还要注意1005与01005的区分，1005也有公制，英制的区分英制1005的公制是公制2512公制1005的英制是英制0402像在ProtelDXP(Protel2004)及以后版本中已经有SMD 贴片元件的封装库了，如CC1005-0402：用于贴片电容，公制为1005，英制为0402的封装 CC1310-0504：用于贴片电容，公制为1310，英制为0504的封装 CC1608-0603：用于贴片电容，公制为1608，英制为0603的封装CR1608-0603：用于贴片电阻，公制为1608，英制为0603的封装，与CC16-8-0603尺寸是一样的，只是方便识别。
【贴片电阻规格贴片电阻规格、、封装封装、、尺寸尺寸】】 英制 (inch) 公制(mm) 长(L) (mm) 宽(W) (mm) 高(t) (mm) a (mm) b (mm) 0201 0603 0.60±0.05 0.30±0.05 0.23±0.05 0.10±0.05 0.15±0.05 0402 1005 1.00±0.10 0.50±0.10 0.30±0.10 0.20±0.10 0.25±0.10 0603 1608 1.60±0.15 0.80±0.15 0.40±0.10 0.30±0.20 0.30±0.20英制 (inch) 公制(mm) 长(L) (mm) 宽(W) (mm) 高(t) (mm) a (mm) b (mm) 0805 2012 2.00±0.20 1.25±0.15 0.50±0.10 0.40±0.20 0.40±0.20 1206 3216 3.20±0.20 1.60±0.15 0.55±0.10 0.50±0.20 0.50±0.20 1210 3225 3.20±0.20 2.50±0.20 0.55±0.10 0.50±0.20 0.50±0.20 1812 4832 4.50±0.20 3.20±0.20 0.55±0.10 0.50±0.20 0.50±0.20 2010 5025 5.00±0.20 2.50±0.20 0.55±0.10 0.60±0.20 0.60±0.20 2512 6432 6.40±0.20 3.20±0.20 0.55±0.10 0.60±0.20 0.60±0.20国内贴片电阻的命名方法：1、5%精度的命名：RS-05K102JT2、1％精度的命名：RS-05K1002FTR －表示电阻S －表示功率0402是1/16W、0603是1/10W、0805是1/8W、1206是1/4W、 1210是1/3W、1812是1/2W、2010是3/4W、2512是1W。
型号额定电压 额定电流外型尺寸 通过认证 资料下载2920SMD 自复保险丝15~60V0.3~3.0A7.3 ×5.0mmUL TUVPtc2920-1.PDF29 20 英寸 1812SMD 自复保险丝10~40V0.1~2.6A4.6 ×3.0mmUL TUVPTC1812-1.PDF PTC1812-2.PDF18 12 英寸 1206SMD 自复保险丝6V0.35~1.5A3.2×1.6mmUL TUV PTC1206-1.PDF PTC1206-2.PDF12 06 英寸0805SMD 自复保险丝6~15V0.1~0.75A2.0×1.2mmUL TUVPTC0805-1.PDF PTC0805-2.PDF系列外型尺寸1206 系列贴片保险丝3.2*1.6mm 0.12*0.06 英寸0603 系列贴片保险丝 1.6*0.8mm 0.06*0.03 英寸0402 系列贴片保险丝 1.0*0.5mm 0.01*0.005 英寸2410 系列贴片保险丝 6.8*2.7mm 0.24*0.10 英寸型号额定电压额定电流外型尺寸(mm)通过认证资料下载20N 速断型250V/125V 0.1∽20AΦ2.7*7.2 UL/CSA/PSE20N.pdf20T.pdf 20T 延时型250V/125V0.1∽7.0AΦ2.7*7.2 UL/CSA/PSEMCR.pdf MCR 速断型125V0.062∽10AΦ3.1*7.5UL/CSAR251 速断型125V0.062∽15AΦ2.4*7.2 UL/CSA r251-253.pdf型号额定电压额定电流外型尺寸(mm)通过认证资料下载SR5 圆柱型250V 1∽5A Φ8.4*7.6 UR/VDE/CCC SR5.pdfSS5.pdf SS5 方型250V1∽5A Φ8.6*7.6*4 UR/CCCmet.pdf MET 圆柱型250V0.04∽6.3AΦ8.4*7.6UR/VDE/CCCMST 方型250V0.04∽6.3AΦ8.6*7.6*4 UR/VDE/CCC mst.pdfU30系列自恢复保险丝 耐压 30VG16系列自恢复保险丝 耐压 16VS 系列自恢复保险丝 耐压 6-16V BR 系列自恢复保险丝 耐压 125V R250系列自恢复保险丝 耐压 250V原理说明 参数说明：保持电流（Ih ）：25℃静止空气环境中不触发电阻突越的最高电流。
各封装电阻封装电阻是电子元器件中常见的一种电阻元件。
常见的封装电阻的尺寸和形状各不相同，可以根据不同的应用需求进行选择。
一、SMD封装电阻：SMD封装电阻是表面贴装器件，适用于小型电路板的制造。
常见的SMD封装电阻有0201、0402、0603、0805、1206等尺寸。
其中，尺寸代表了电阻组件的尺寸，如0201代表该电阻的长度为0.02英寸、宽度为0.01英寸。
这些小尺寸的电阻适用于需要高密度元件布局的电路板。
二、贴片封装电阻：贴片封装电阻与SMD封装电阻类似，可以直接贴装在电路板上。
常见的贴片封装电阻有0805、1206、1210、1812、2010等尺寸。
与SMD封装电阻相比，贴片封装电阻的尺寸较大，适用于需要较高功率承载和需要手动焊接的应用场景。
三、插装封装电阻：插装封装电阻的引脚设计为直插型，适用于通过插孔或插接器与电路板相连的应用。
常见的插装封装电阻有电解铝电容、晶振、单片机、继电器等器件。
插装封装电阻与贴片封装电阻相比，具有更高的功率承载能力，适用于需要高功率电阻的应用。
四、网络封装电阻：网络封装电阻是由多个电阻连接在一起组成的。
常见的网络封装电阻有二联、三联、四联等不同组合方式。
网络封装电阻能够实现不同组合方式的电阻值和精度，适用于需要多个电阻分配的应用场景。
它们广泛应用于模拟电路中的分压电路、滤波电路，数字电路中的电平转换、阻抗匹配等。
五、可调封装电阻：可调封装电阻也称为可变电阻或可调电阻，可以通过外部操作改变电阻值。
可调封装电阻通常有旋转式、滑动式和数字式三种类型。
它们常用于电子设备中的电流、电压调节、音量、亮度控制等应用。
封装电阻通常由电阻材料、封装材料和焊接引脚组成。
不同的封装类型和尺寸适用于不同的应用需求，设计者需要根据具体的电路设计来选择合适的封装电阻。
除了常见的封装类型外，还有一些特殊的封装电阻，如高温阻焊电阻、射频电阻等，它们在特定的应用场景中具有特殊的性能优势。
0805封装尺寸/0402封装尺寸/0603封装尺寸/1206封装尺寸(转载）电子元器件2010-09-08 21:21:48 阅读672 评论0 字号：大中小订阅封装尺寸与功率关系：0201 1/20W0402 1/16W0603 1/10W0805 1/8W1206 1/4W封装尺寸与封装的对应关系0402=1.0mmx0.5mm0603=1.6mmx0.8mm0805=2.0mmx1.2mm1206=3.2mmx1.6mm1210=3.2mmx2.5mm1812=4.5mmx3.2mm2225=5.6mmx6.5mm贴片电阻电容常见封装有9种（电容指无级贴片），有英制和公制两种表示方式。
英制表示方法是采用4位数字表示的EIA(美国电子工业协会)代码，前两位表示电阻或电容长度，后两位表示宽度，以英寸为单位。
我们常说的0805封装就是指英制代码。
实际上公制很少用到，公制代码也由4位数字表示，其单位为毫米，与英制类似。
封装尺寸规格对应关系如下表：封装尺寸与功率有关通常如下：关于电容的封装除了上面的贴片封装外，对无极性电容，其封装模型还有RAD类型，例如“RAD-0.1”“RAD-0.2”等，后缀数字表示封装模型中两个焊盘间的距离，单位为英寸。
有极的电解电容的封装模型为RB类型，例如从“RB-.2/.4”到“RB-.5/.10”，其后缀的第一个数字表示封装模型中两个焊盘间的距离，第二个数字表示电容外形的尺寸，单位为也是英寸。
电阻：RES1，RES2，RES3，RES4；封装属性为axial系列无极性电容：cap;封装属性为RAD-0.1到rad-0.4电解电容：electroi;封装属性为rb.2/.4到rb.5/1.0电位器：pot1,pot2；封装属性为vr-1到vr-5二极管：封装属性为diode-0.4(小功率)diode-0.7(大功率)三极管：常见的封装属性为to-18（普通三极管）to-22(大功率三极管)to-3(大功率达林顿管)电源稳压块有78和79系列；78系列如7805，7812，7820等79系列有7905，7912，7920等常见的封装属性有to126h和to126v整流桥：BRIDGE1,BRIDGE2: 封装属性为D系列（D-44，D-37，D-46）电阻：AXIAL0.3-AXIAL0.7其中0.4-0.7指电阻的长度，一般用AXIAL0.4瓷片电容：RAD0.1-RAD0.3。
0805封装尺寸/0402封装尺寸/0603封装尺寸/1206封装尺寸(转载）电子元器件2010-09-08 21:21:48 阅读672 评论0 字号：大中小订阅封装尺寸与功率关系：0201 1/20W0402 1/16W0603 1/10W0805 1/8W1206 1/4W封装尺寸与封装的对应关系0402=1.0mmx0.5mm0603=1.6mmx0.8mm0805=2.0mmx1.2mm1206=3.2mmx1.6mm1210=3.2mmx2.5mm1812=4.5mmx3.2mm2225=5.6mmx6.5mm贴片电阻电容常见封装有9种（电容指无级贴片），有英制和公制两种表示方式。
英制表示方法是采用4位数字表示的EIA(美国电子工业协会)代码，前两位表示电阻或电容长度，后两位表示宽度，以英寸为单位。
我们常说的0805封装就是指英制代码。
实际上公制很少用到，公制代码也由4位数字表示，其单位为毫米，与英制类似。
封装尺寸规格对应关系如下表：封装尺寸与功率有关通常如下：关于电容的封装除了上面的贴片封装外，对无极性电容，其封装模型还有RAD类型，例如“RAD-0.1”“RAD-0.2”等，后缀数字表示封装模型中两个焊盘间的距离，单位为英寸。
有极的电解电容的封装模型为RB类型，例如从“RB-.2/.4”到“RB-.5/.10”，其后缀的第一个数字表示封装模型中两个焊盘间的距离，第二个数字表示电容外形的尺寸，单位为也是英寸。
电阻：RES1，RES2，RES3，RES4；封装属性为axial系列无极性电容：cap;封装属性为RAD-0.1到rad-0.4电解电容：electroi;封装属性为rb.2/.4到rb.5/1.0电位器：pot1,pot2；封装属性为vr-1到vr-5二极管：封装属性为diode-0.4(小功率)diode-0.7(大功率)三极管：常见的封装属性为to-18（普通三极管）to-22(大功率三极管)to-3(大功率达林顿管)电源稳压块有78和79系列；78系列如7805，7812，7820等79系列有7905，7912，7920等常见的封装属性有to126h和to126v整流桥：BRIDGE1,BRIDGE2: 封装属性为D系列（D-44，D-37，D-46）电阻：AXIAL0.3-AXIAL0.7其中0.4-0.7指电阻的长度，一般用AXIAL0.4瓷片电容：RAD0.1-RAD0.3。
C ustomer:·Technical Data Sheet PN:XGS-PB2012UB-02 For:IF=20mAContents1.Features2.Applications3.Package dimensions4.Absolute maximum rating5.Electrical optical characteristics6.BIN range7.Package label8.Soldering pad dimensions9.Soldering conditions10.Package tape specifications11.T ypical electro-optical characteristics curves12.Reliability test items and conditions13.Cautions14.Note◆F eatures:Compatible with automatic placement equipmentCompatible with reflow solder processLow power consumption and wide viewing angleThis product doesn’t contain restriction Substance, comply ROHS standard.◆A pplications:Automotive and TelecommunicationFlat backlight for LCD ,switch and symbol in telephone and faxGeneral use for indicators◆P ackage Dimensions:Unit:mmTolerenc e±0.1Electrodes: Ag Plating◆A bsolute Maximum Rating （Ta=25℃）* I FP condition: pulse width ≤1ms ,duty cycle ≤1/10◆E lectrical Optical Characteristics（Ta=25℃）Notes: 1.Tolerance of Luminous Intensity ±10%2.Tolerance of Dominant Wavelength ±2nm3.Tolerance of Forward Voltage ±0.05V4.Luminous Intensity is measured by XGSLED’s equipment on bare chips◆ Soldering Pad Dimensions:◆ S oldering Conditions (Maximum allowable soldering conditions)Reflow soldering profile<Pb-free solder>Time• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering.• After soldering,do not warp the circuit board.T e m p e r a t u r e◆ P ackage Tape Specifications: (3000 pcs/Reel)Reel Lead Min.60mm No LEDs5 Reels in one Box10 Boxes in one Carton◆ T ypical Electro-Optical Characteristics Curves ：Forward Current Vs Ambient Temperature5040302010100250Forward Current Vs Relative Luminosity204060801001020304050Ambient Temperature Ta (° C)Forward Current (mA)200 15010050 Relative Luminosity VsAmbient TemperatureIf=15mA-50° -60°-70°-80°-90°-40°-30°-20°-10°0°10°20°30°40°50°60°70°80°90° 0 0204060801001.00.50.5Radiation Angle1.0Ambient Temperature Ta (° C)R e l a t i v e L u m i n o s i t y (%)F o r w a r d C u r r e n t (m A )R e l a t i v e L u m i n o s i t y (%)◆Reliability(1)Test Items and Conditions(2)C riteria of judging the damage◆C autions1、PackageWhen moisture is absorbed into the package it may vaporize and expand during soldering. There is apossibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package.2、StorageBefore opening the package: The LEDs should be kept at 5~30°C and 60%RH or less. The LEDs should be used within a year.After opening the package: The LED must be used within 24 hours, else should be kept at 5~30℃and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.If the LEDs have exceeded the storage time, baking treatment should be performed more than 24hours at 60±5°C.3、Soldering IronEach terminal is to the tip of soldering iron temperature less than 300℃ for 3 seconds within once inless than the soldering iron capacity 25 W.Leave two seconds and more internals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.4、RepairingRepairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.5、The LED electrode sections are comprised of a gold plated. The gold surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible.6、Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.◆Notes:1、Above specification may be changed without notice. We will reserve authority on material change for above specification.2 、When using this product, please observe the absolute maximum ratings and the instructions for the specification sheets. We assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets.。
The SMD0805 Lead(Pb) Free Series, a polymer-based Positive Temperature Coefficient (PTC) device to protect electrical circuits against overcurrent conditions with resettable feature, is fully compatible with current industrial standards.The new designed SMD0805 Lead(Pb) Free Series provides surface mount overcurrent protection with superior performance that is compliant with RoHS Directive 2002/95/EC.Application: The SMD0805 Lead(Pb) Free Series is ideal for computers and peripherals and can be applied to almost anywhere there is a low voltage power supply and a load to be protected.The solder plated termination is designed to meet or exceed solderability specifications and provide excellent solder joint inspectability.Agency Approval: UL/CSA File No. E201431TÜVCertificate # R9956421 ELECTRICAL CHARACTERISTICSMaximum Time To Trip ResistanceAgency ApprovalPart NumberI hold (A)I trip (A) V max (Vdc) I max (A)P d max.(W) Current (A) Time (Sec.)R min (Ω)R typ (Ω) R 1max (Ω)SMD0805P010TF SMD0805P020TF SMD0805P035TF SMD0805P050TF SMD0805P075TF SMD0805P100TF0.100.200.350.500.751.000.30 0.50 0.75 1.00 1.50 1.95 15 9 6 6 6 64040404040400.50.50.50.50.60.60.50 8.00 8.00 8.00 8.00 8.00 1.50 0.02 0.10 0.10 0.20 0.30 1.0000.6500.2500.1500.0900.0603.500 2.000 0.750 0.500 --- --- 6.000 3.500 1.200 0.850 0.350 0.210 UL/CSA/TÜV UL/CSA/TÜV UL/CSA/TÜV UL/CSA/TÜV UL/CSA/TÜV UL/CSA/TÜV Note: I hold = Hold current: maximum current device will pass without tripping in 20℃ still air.I trip = Trip current: minimum current at which the device will trip in 20℃ still air. V max = Maximum voltage device can withstand without damage at rated current (I max ) I max = Maximum fault current device can withstand without damage at rated voltage (V max ) P d = Power dissipated from device when in the tripped state at 20℃ still air. R min = Minimum resistance of device in initial (un-soldered) state. R typ = Typical resistance of device in initial (un-soldered) state.R 1max = Maximum resistance of device at 20℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Recognitions: UL, CSA, TÜV recognized.◎Specifications are subject to change without notice.How to Select a Polymer PTC fuse:(1) Determine the following operating parameters for the circuits:(A) Normal Operating Current (I hold)(B) Maximum Circuit V oltage (V max)(C) Maximum Interrupt Current (I max)(D) Normal Operating Temperature (min℃/max℃)(2) Select the device form factor and dimension suitable for the application:Surface Mount Device (SMD Series)Radial Leaded Device (RLD Series)Axial Leaded Strap Device (STD Series)Other Custom-designed Device (Disc/Chip)(3) Compare the maximum ratings for V max and I max of the PTC device withthe circuit in application and make sure that the circuit’s requirement does not exceed the device ratings.(4) Check that the PTC device’s trip time (time-to-trip) will protect the circuit.(5) Verify that the circuit operating temperatures are within the PTC device’snormal operating temperature range.(6) Verify the performance and suitability of the chosen PTC device in theapplication.THERMAL DERATING CURVE FOR SMD0805 SERIES-40.000.0040.0080.00120.00Device Ambient Temperature ()℃0.0050.00100.00150.00200.00P e r c e n t a g e o f R a t e d C u r r e n tTHERMAL DERATING CHART FOR SMD0805 SERIES – Ihold (Amps)Ambient Operation TemperatureModel -40℃ -20℃ 0℃ 23℃40℃50℃60℃ 70℃ 85℃SMD0805P010TF 0.14 0.12 0.110.100.080.070.060.05 0.03SMD0805P020TF 0.28 0.25 0.230.200.170.140.120.10 0.07SMD0805P035TF 0.47 0.44 0.390.350.300.270.240.20 0.14SMD0805P050TF 0.68 0.62 0.550.500.400.370.330.29 0.23SMD0805P075TF 1.00 0.90 0.790.750.630.570.530.41 0.34SMD0805P100TF 1.35 1.25 1.10 1.000.820.740.650.55 0.42A VERAGE TIME-CURRENT CURVE FOR SMD0805 SERIESA:SMD0802P010TF T B:SMD0805P020TFC:SMD0805P035TF 0. D:SMD0805P050TF E:SMD0805P075TF F:SMD0805P100TF0.10 1.0010.00Fault Current (Amp.)0.01101.0010.00100.00i m e t o T r i p (S e c .)ABCDEFSOLDER REFLOWRECOMMENDED CONDITIONSCondition Reflow Peak Temp/Time 245℃≧ 5 Sec≧220℃30 Sec ~ 60 Sec Preheat 160℃~ 190℃60 Sec ~ 90 Sec Storage Condition 0℃~35℃, ≦70%RHRecommended reflow methods: IR, vapor phase oven, hot air oven, N 2 environment for lead-free Devices are not designed to be wave soldered to the bottom side of the board. Recommended maximum paste thickness is 0.25mm (0.010 inch)Devices can be cleaned using standard industry methods and solvents.Note: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.SOLDER PAD LAYOUTS(Dimension in mm) FIGUREPHYSICAL DIMENSIONS (mm)A B CDE Part NumberMin. Max.Min. Max.Min. Max.Min. Min.Max.SMD0805P010TF 2.00 2.20 1.20 1.50 0.55 1.000.20 0.100.45 SMD0805P020TF 2.00 2.20 1.20 1.50 0.55 1.000.20 0.100.45 SMD0805P035TF 2.00 2.20 1.20 1.50 0.45 0.750.20 0.100.45 SMD0805P050TF 2.00 2.20 1.20 1.50 0.75 1.250.20 0.100.45 SMD0805P075TF 2.00 2.20 1.20 1.50 0.75 1.250.20 0.150.45 SMD0805P100TF 2.00 2.20 1.20 1.50 0.80 1.800.20 0.150.45 ENVIRONMENTAL SPECIFICATIONSOperating/StorageTemperature-40℃ to +85℃Maximum Device SurfaceTemperature in Tripped State125℃Passive Aging +85℃, 1000 hours ±5% typical resistance change Humidity Aging +85℃, 85%R.H. 1000 hours ±5% typical resistance change Thermal Shock MIL-STD-202 Method 107G+85℃/-40℃20 times -30% typical resistance changeSolvent Resistance MIL-STD-202, Method 215 No change Vibration MIL-STD-883C, Method 2007.1, Condition A No change PHYSICAL SPECIFICATIONSTerminal Material Gold-Plated Copper orSolder-Plated Copper (Solder Material: Tin(Sn) or others)Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.Packaging 8 mm tape on 7 inch reel per EIA-481-1 (equivalent to IEC286, part 3)3000 devices per reel for P050TF5000 devices per reel for P075TFFor the others: 4000 devices per reel◎ Specifications are subject to change without notice.TAPE SPECIFICATIONS: EIA-481-1 REEL DIMENSIONS: EIA-481-1P010TF, P020TF, P035TFP050TF,P075TF, P100TFW 8.0+/-0.10 8.0+/-0.10 8.0+/-0.10 8.0+/-0.10 H 12.0+/-0.05 F 3.5+/-0.05 3.5+/-0.05 3.5+/-0.05 3.5+/-0.05 W 9.0+/-0.5 E 1 1.75+/-0.10 1.75+/-0.10 1.75+/-0.10 1.75+/-0.10 D Ø60+0.5 D 0 1.55+/-0.05 1.55+/-0.05 1.55+/-0.05 1.55+/-0.05F Ø13.0+/-0.2 D 1 1.0 (min)1.0 (min)1.0 (min)1.0 (min)C Ø178+/-1.0 P 0 4.0+/-0.10 4.0+/-0.10 4.0+/-0.10 4.0+/-0.10 H 1 11+/-0.5 P 1 4.0+/-0.10 4.0+/-0.10 4.0+/-0.10 4.0+/-0.10 W 1 2.2+/-0.5 P 2 2.0+/-0.05 2.0+/-0.05 2.0+/-0.05 2.0+/-0.05 W 2 3.0+0.5 A 0 1.45+/-0.10 1.42+/-0.10 1.65+/-0.10 1.65+/-0.10 W 3 4.0+0.5 B 0 2.30+/-0.10 2.24+/-0.10 2.35+/-0.10 2.35+/-0.10 W 4 5.5+0.5T 0.25+/-0.10 0.20+/-0.10 0.20+/-0.10 0.25+/-0.10 (mm)K 0 0.74+/-0.10 1.04+/-0.10 1.05+/-0.10 1.50+/-0.10 Leader min . 390 390 390 390 Trailer min.160 160 160 160(mm)PART NUMBERING SYSTEMSMD0805 P □□□TFF: Lead-freeVersionMultilayerThicknessCurrent RatingPolytronics Symbolinch) Device1/100Length/Width(Unit:Dimensions:Surface Mount Device。
Artikelnummer / part number :823 50 120 101Datum / Date :2006-10-15Bezeichnung :description :0805 ESD SuppressorSMD size:0805A Mechanische Abmessungen / dimensions :SIZE(Unit : mm)B Elektrische Eigenschaften / electrical properties :TECHNICAL DATAWorking Max. ClampingTyp.Leakage ESD Pulse ESD Voltage Voltage Voltage Clamp. V Current Withstandair dischargeDC V(*1)V (*2)µA (*3)kV (*4)pF Spezifikation für Freigabe / specification for releasePart NumberKunde / customer :CapacitanceROHS Compliant823 50 120 1011250-1-+/-15100* 1 Max. Clamping Voltage at 8/20 waveformand 1 A pulse current Capacitance tolerance:+/-30%* 2 Typ. Clamping Voltage per 8 kV ESD contact discharge methodCapacitance measured at:1MHz* 3 Leakage Current at max operating voltage, the max leakage current was measured at reliability test * 4. ESD Typ. Withstands Voltage design and method guarantee this propertyWAVE FORMESD LEVEL IEC61000-4-2Severity Level Air DischargeDirect Discharge1 2 kV 2 kV 2 4 kV4 kV 38 kV 6 kV 415 kV 8 kV 5Special SpecialREFERENCE DATA Response timeT rise <1ns Operating ambientg temperature -40～+85℃Storage temperature -50～+125℃Max. temperature solder 260/10s℃OTHER DATA BodyZnO End termination Ag/Ni/Sn PackagingReelComplies with Standard IEC61000-4-2Procedure Solgel MarkingNoneD-74638 Waldenburg · Max-Eyth-Straße 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Würth Elektronik eiSos GmbH & Co.KG - Radialex departmentArtikelnummer / part number :823 50 120 101Bezeichnung :description :0805 ESD SuppressorSMD size:0805C Lötpad / soldering spec. :RECOMMENDED SOLDER PAD LAYOUT (Unit : mm)1 - The solder paste shall be printed in a thickness of 150 to 200µm.2 - The SIR test of the solder paste shall be done （Based on JIS-Z-3284）3 - IR reflow Pb Free Process suggestin profile (Based on J-STD-020-C):Spezifikation für Freigabe / specification for releaseKunde / customer :Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure that the element is notSoldering recommend paste is Sn 96.5/Ag 3.5- Preheat1.The temperature rising speed is suggested to be 2~3℃/s.2.Appropriate preheat time will be from 60 to 120 seconds.3.Temp. maintain at 175 +/-25°C 120 seconds. - Heating1.Careful about sudden rise in temperature as it may worsen the solder ability.2.Set the peak temperature in 235℃10-20s or 260°C 3-10s.- Cooling1.Ramp down rate 6°C/s max.※Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace4 - Hand Soldering ProcessPreheating 150°CTemperature of soldering iron tip 380°C max. 3 to 5 secThe Varistorrs shall be cooled gradually at room ambient temperature5 - Ultrasonic cleaningFor preventing failures or damages. Frequency 29MHz max - radied Power 20W/l max - Period 5mn maxsubjected to a thermal gradient steeper than 3 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre- heating to within 175 degrees of the solders peak temperature is essential to minimize thermal shock.Time (mn)T e m p e r a t u r e (°C )7525Time (mn)T e m p e r a t u r e (°C )2507510012515017520022501:00:002502:00:0003:00:0004:00:00Peak Temp.260°C (3 to 10sec)Preheat.175°C 150sec max.275D-74638 Waldenburg · Max-Eyth-Straße 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Würth Elektronik eiSos GmbH & Co.KG - Radialex departmentArtikelnummer / part number :823 50 120 101Bezeichnung :description :0805 ESD SuppressorSMD size:0805D Rollenspezifikation / tape and reel specification :1 - Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be usedto reel the carrier tape.2 - The adhesion of the heat-sealed cover tape shall be 40 ﹢20/ ﹣15grams.3 - Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be conected in the head of taping for the operator to handle.(Unit : mm)Spezifikation für Freigabe / specification for releaseKunde / customer:TAPE SPECIFICATION(Unit : mm)Würth Elektronik eiSos GmbH & Co.KG - Radialex departmentD-74638 Waldenburg · Max-Eyth-Straße 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Artikelnummer / part number :823 50 120 101Bezeichnung :description :0805 ESD SuppressorSMD size:0805D Rollenspezifikation / tape and reel specification :(Unit : mm)Spezifikation für Freigabe / specification for releaseKunde / customer :REEL DIMENSION(Unit : mm)QUANTITY PER PACKING UNIT Freigabe erteilt /Kunde / customergeneral release:JP. PENLOU Update Clamping Voltage 06-10-15Datum / dateUnterschrift / signature JP. PENLOU High Temperature Load06-07-31Würth ElektronikJP. PENLOU New P/N06-06-02JP. PENLOU Operating temp. Range 05-11-30JP. PENLOULead free soldering 05-11-04Geprüft / checked 2006-07-31Kontrolliert / approved JP. PenlouName Änderung / modificationDatum / dateWürth Elektronik eiSos GmbH & Co.KG - Radialex departmentD-74638 Waldenburg · Max-Eyth-Straße 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400。
The SMD0805Series PTC provides surface mount over-current protection for applications where space is at a premium and reset table protection is desired.◆RoHS compliant,Lead-Free and Halogen-Free ◆Fast time-to-trip◆Compact design saves board space ◆Agency recognition:UL ◆Low-profileAlmost anywhere there is a low voltage power supply,up to 16V and a load to be protected,including:◆Computer mother board,B hub ◆PDAs &Charger,Analog &digital line card ◆Digital cameras,Disk drivers,CD-ROMs ◆USB peripherals ◆Power ports◆General electronicsPartNumberIhold (A)I trip (A)V max (Vdc)I max (A)P dtyp.(W)Maximum TimeTo Trip ResistanceCurrent (A)Time (Sec.)R min (Ω)R max (Ω)SMD0805-0100.100.30151000.500.50 1.50 1.000 6.000SMD0805-0200.200.5091000.508.000.020.650 3.500SMD0805-0350.350.7561000.508.000.100.250 1.200SMD0805-0500.50 1.0061000.508.000.100.1500.085SMD0805-0750.75 1.506400.608.000.200.0900.385SMD0805-1001.01.9561000.608.000.300.0600.230I hold =Hold current:maximum current device will pass without tripping in 25°C still air.I trip =Trip current:minimum current at which the device will trip in 25°C still air.V max =Maximum voltage device can withstand without damage at rated current (I max )I max =Maximum fault current device can withstand without damage at rated voltage (V max )P dtyp.=Power dissipated from device when in the tripped state at 25°C still air.R min =Minimum resistance of device in initial (un-soldered)state.R max =Maximum resistance of device in initial (un-soldered)state.R 1max =Maximum resistance of device at 25°C measured one hour after tripping.Caution:Operation beyond the specified rating may result in damage and possible arcing and flame.Part NumberAmbient Operation Temperature-40°C-20°C0°C25°C40°C 50°C 60°C 70°C 85°CHold Current (A)SMD0805-0100.140.120.110.10.80.70.60.50.3SMD0805-0200.280.250.230.200.170.140.120.100.07SMD0805-0350.470.440.390.350.300.270.240.200.14SMD0805-0500.680.620.550.500.400.370.330.290.23SMD0805-075 1.000.900.790.750.630.570.530.410.34SMD0805-1001.351.251.151.000.820.740.650.550.42A=SMD0805-010B=SMD0805-020C=SMD0805-035D=SMD0805-050E=SMD0805-075F=SMD0805-100Part MarkingXPart Identification1Example1= SMD0805-010 2= SMD0805-020 3= SMD0805-035 5= SMD0805-050 7= SMD0805-075 0= SMD0805-100Profile FeaturePb-Free Assembly Average Ramp-Up Rate (T S max to T P ) 3°C/second max. Preheat :Temperature Min (T S min) Temperature Max (T S max) Time (T S min to T S max) 150°C 200°C60-180 seconds Time maintained above: Temperature(TL) Time (tL)217°C60-150 seconds Peak/Classification Temperature(T P ): 260°C Time within 5°C of actual peak: Temperature20-40 seconds Ramp-down Rate:6°C/ second max. Time 25°C to Peak Temperature8 minutes max.Note: All temperatures refer to of the package, measured on the package body surface.Solder reflowDue to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.1.Recommended max past thickness > 0.25mm.2.Devices can be cleaned using standard methods and aqueous solvent.3.Rework use standard industry practices.4.Storage Environment : < 30℃/ 60%RHCaution:1.If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.2.Devices are not designed to be wave soldered to the bottom side of the board.Soldering ParametersRamp-downPreheatCritical Zone T L to T PTime to peak temperature(t 25℃ to peak)T PT L T S(max)T S(min)25T e m p e r a t u r eRamp-upTimeA B C DeviceNominalNominal Nominal 0805 Series1.201.001.50The dimension in the table below provide the recommended pad layout for each SMD0805 devicePart Numbering Pa c k ag ingPad Layouts Unit: mmTerminal pad material Pure TinSoldering CharacteristicsMeets EIA specification RS 186-9E, ANSI/J-std-002 Category 3Material Specifications010SMD0805Product nameSMD ：surface mount deviceHold Current 0.10ATape & Reel Quantity5,000 pcs/reelABCDEPart NumberMin.Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD0805-010 2.00 2.20 1.20 1.50 0.50 1.00 0.20 0.60 0.10 0.45 SMD0805-020 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-035 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-050 2.00 2.20 1.20 1.50 0.30 0.60 0.20 0.60 0.10 0.45 SMD0805-075 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.60 0.10 0.45 SMD0805-1002.002.201.201.500.501.100.200.600.100.45Dimensions Unit: mmu Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.u PPTC device are intended for occasional over-current protection. Application for repeated over-current condition and/or prolonged trip are not anticipated.uAvoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.WarningTape and Reel SpecificationsDirection of Feed0.33 (8.4)0.512(13.0)Arbor Hole Diameter7.0 (177.8)0.212 (5.4)0.157 (4.0) 0.059(1.5)Diameter Cover tape0.314 (8.0)0.157 (4.0)Dimensions are in inches(and millimeters)。
