软硬结合板简介及关键参数介绍

Chill roll
Vaccum Chamber
Plating Cu Sputter metal PI film
PI film
Target
壓合法 (Lamination)
PAA
Heater
Copper foil
Copper foil TPI PI film
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Material Introduction
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Material Introduction
4.全球 FCCL廠商 3L FCCL / 2L FCCL概況
Manufacturer
ARISAWA TORAY
Adhesive type
● ●
Adhesiveless type
◎
Nippon Steel(新日鐵)
NIKKAN Nippon Mektron(NOK) UBE(宇部興產) Mitsui Chemical(三井化學) Dupont(杜邦) 3M THINFLEX(台虹)
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Design Rule
Trace and component pad at transition zone:
UMT Standard
1 2 3 4 5 6 7 8 9 e d d d c a b b b SMT pad (edge of pad) to board edge spacing Shield can (edge of ground) to board edge spacing Ground plane to board edge spacing Power plane to board edge spacing Trace (edge of trace) to board edge spacing Micro-via (edge of pad) to board edge spacing Plated through hole (edge of pad) to board edge spacing Non plated through hole to board edge spacing (no pad) Buried via (edge of pad) to board edge spacing Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex Rigid/Flex 400um 300um 300um 300um 400um 400um 400um 300um 400um
聚亞醯胺樹脂(Polymide,PI)熱聚合後仍保一定柔軟與彈性，同時在很寬的操作範圍下有不 錯電氣特性故最常使用。
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Material Introduction
2.聚亞醯胺基材種類
依軟板結構分為兩大類 1.有接著劑三層軟板基材(3L FCCL) 2.無接著劑二層軟板基材(2L FCCL) 兩者分屬不同製造過程，製造方式與材料特性不同。3L應用在大宗軟板產品， 2L 用在較高階軟板製作上，例：軟硬複合板、COF。 ＊高尺寸安定需求 ＊高密度線路需求 ＊耐化性需求 ＊電氣特性需求 ＊耐燃性需求 ＊環保需求
CVL: Cover layer
Stiffener: FR4/PI/Stainless base Reinforcement Low flow Prepreg: Resin scale flow lower than normal type BS: Bonding Sheet SF: Silver Foil (EMI shielding)
3.2L-FCCL製造方式與比較
方法 銅箔選擇性 銅箔厚度 雙面板製造性 接著特性 生產性 基板透明性 成本 生產廠商代表 塗佈法(Casting) ED,RA 薄銅(<9um) 有良率問題 較複雜與困難 優 優 尚可(有改善空間) 低 Nippon Steel （新日鐵） 濺鍍法(Sputtering) 限ED 可自由控制厚度 相對容易 尚可 差 優 高 Sumitomo Metal (住友） 壓合法(Laminate) ED,RA 薄銅(<9um) 有良率問題 相對容易 優 尚可 優 中 Ube (宇部興業)
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Content:
Baidu Nhomakorabea Material Introduction Design rule Standard Process Flow Open Discussion
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Design Rule
A. Working Panel Size
Popular Working Panel Size
Mechanical design for flex radius:
Punch with hard die requirement, UMT suggest to place radius 0.50mm. (Change from right angle to radius. Only UV laser cutting can make it right angle.)
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I
Milling path
Rigid/Flex
1.00mm
0.80mm
H I Rigid PCB G
F
Flex area
Rigid PCB
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Design Rule
Mechanical design at transition zone:
Item Design Issue UMT Standard Guideline 1.00mm 2.00mm UMT Advanced Guideline 0.80mm 1.50mm
Release paper Adhesive
PET film
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Material Introduction
EMI material 1.‧Silver film
Structure
Ex: SF-PC5000
Remark
SF-PC1000(32um) SF-PC5000(22um) SF-PC5500(22um)
18X20 inch 457.2 x 508 mm
B
PCB
PCB
C
Length Y C
A
PCB
PCB
* PCB with 1. G/F Design 2. Impedance coupon
MIN. C * Inch 0.3~1.0 0.3~1.0 0.3~1.0 0.3~1.0 0.3~1.0 mm 7.62~25.4 7.62~25.4 7.62~25.4 7.62~25.4 7.62~25.4
S1 S2
Minimum "S1" bending to board edge distance minimum flexible area (edge of FPC) to board edge spacing
Rigid area S1 S2 Flexible area
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Design Rule
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Material Introduction
Bonding material 1.‧PP 1.‧BS
Prepreg Bonding sheet
Structure ◎PP
Epoxy & Glass fiber
Remark
Non-flow or Low-flow PP
◎BS
Thickness:15um, 25um, 40um
Rigid-Flex Presentation
Content:
Material Introduction Design rule Standard Process Flow Open Discussion
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Material Introduction
1.軟板基材薄膜種類
聚脂樹脂(Polyester,PET)-尺寸熱安定性不如 PI Aramid纖維布-高吸水性，單價及使用性並不理想 強化型介電材料 –撓曲性較差且供應者與使用者不多 氟素樹脂膜-無法在高溫下維持尺寸的穩定
2-2.品目型號說明
各家標示項目不盡相同，
以台虹3L-FCCL為例：
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Material Introduction
3.2L-FCCL製造方式與比較
Production Method 塗佈法 (Casting)
PAA Heater
Copper foil
Cross-Section
PAA
濺鍍法 (Sputtering)
Width X MIN. C mm 2.54 2.54 2.54 2.54 2.54
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Optimized Panel Utilization
Design Rule
Optimized. Array Size
Panel type Panel size
4.4212“x4.6” (77%) 4.4212“x4.8” (76%) 4.4212“x5.1” (76%) 3.517“x4.6” (77%) 3.517“x4.8” (76%) 3.517“x5.1” (76%) 4.4212“x3.425” (77%) 4.4212“x3.675” (77%) 4.4212“x3.925” (78%) 3.517“x2.72” (76%) 3.517“x2.92” (76%) 3.517“x3.12” (77%)
UMT Advanced
300um 200um 200um 200um 250um 300um 300um 200um 300um
Board edge
Board edge
Flex Area
c
Board edge
Board edge
b
a
Board edge
d Flex Area
Flex Area e
Board edge
16“X19.685”
17“X19.685”
18“X19.685”
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Design Rule
Flex area Rigid Area
Rigid Area
Transition Zone
L1 L2 L3 L4
NF Prepreg NF Prepreg FCCL NF Prepreg
L5 L6
NF Prepreg
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Design Rule
Mechanical design at transition zone:
UMT Standard 10 11 12 F G H Adhesive squeeze out Minimum flex width Flex outline radius Rigid/Flex Flex Flex 0.80mm 2.00mm 1000um UMT Advanced 0.50mm 1.00mm 500um
● 表量產
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● ● ● ● ● ● ● ●
◎ 表小量產、試產或送樣中 8 資料來源：JMS；工研院IEK-ITIS計劃(2004/3)
Material Introduction
CVL
Cover lay
Structure
Remark
1.Protect circuit
2.Isolation
PI film Adhesive Release paper
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Design Rule
Terms & Definition:
Partial CVL Plus II- stack via
FCCL
Component on flex Squeeze out (from Low flow Prepreg)
FCCL: Flex Copper Clad Laminate
COPPER Adhesive PI 銅箔基板 (FCCL)
＊以單面板為例 3L-FCCL 2L-FCCL
COPPER
PI
銅箔基板 (FCCL)
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Material Introduction
2-1.聚亞醯胺薄膜簡介
聚亞醯胺薄膜(Polyimide,簡稱 PI)，外觀呈黃棕色，是由芳香族的雙酐類
及雙胺類合成聚亞醯胺酸高分子(簡稱PAA)，之後經高溫熱化脫水形成。
B. Usable area , Border (A, B) and Routing Path (C)
Structure type PCB (1 press) PCB (2 press) HDI (1 press) HDI (2 press) HDI (≧3 press) MIN. A Inch 0.47 0.55 0.55 0.65 0.75 mm 11.43 13.97 13.97 16.51 19.05 MIN. B Inch 0.65 0.70 0.70 0.80 1.00 mm 16.51 17.78 17.78 20.32 25.4 0.1 0.1 0.1 0.1 0.1 Inch