CiTRANS R845产品描述

SPECIFICATIONSUSB-8451 OEMThis user guide describes how to use the National Instruments USB-8451 OEM I 2C/SPI communication device.The NI USB-8451 OEM is a full-speed USB 2.0 device that provides I 2C and SPI connectivity with eight SPI chip selects and eight general-purpose DIO channels.Dimensional DrawingsFigure 1 shows a top view of the USB-8451 OEM. Figure 2 shows the front and rear dimensions.Figure 1. USB-8451 OEM Dimensions (Top View)2.26 in. (57.4 mm)1.78 in. (45.2 mm)1.61 in. (40.8 mm)1.45 in. (36.7 mm)1.37 in. (34.7 mm)0.89 in. (22.7 mm)0.48 in. (12.2 mm)–0.18 in. (–4.6 mm)0.00 in. (0.0 mm)2.13 in. (54.1 mm)1.13 in. (28.7 mm)0.13 in. (3.3 mm)2.65 in. (67.3 mm)2.41 in. (61.2 mm)2.04 in. (51.8 mm)1.66 in. (42.2 mm)0.125 in. (3.18 mm) Diameter0.00 in. (0.0 mm)0.33 in. (8.3 mm)–0.03 in. (–0.8 mm)0.18 in. (4.5 mm)0.45 in. (11.5 mm)Figure 2. USB-8451 OEM Dimensions (Front and Rear Views) Block DiagramFigure3 shows key functional components of the USB-8451 OEM.Figure 3. Device Block DiagramRefer to the Safety Guidelines section of this document for important safetyinformation.Installing Software and HardwareInstall the software provided with the USB-8451 OEM. Install the USBdevice and cables. Refer to the NI-845x Software and HardwareInstallation Guide for more information.USB-8451 OEM I/O Connector and CableUse any 34-pin female IDC (ribbon) cable to connect to the IDC connectoron the USB-8451 OEM.Table1 lists the pin assignments and signal names for the IDC connector.Table 1. Pin Assignments© National Instruments Corporation3USB-8451 OEM SpecificationsSignal DescriptionsTable2 describes the signals available on the I/O connectors.Table 2. Signal DescriptionsSignal Name Direction DescriptionSPI CS <0..7>Output Chip Select Signals—Outputs used to select the desiredSPI peripheral device.SPI MOSI (SDO)Output Master Output Slave Input—SPI communicationsignal to slave device.SPI MISO (SDI)Input Master Input Slave Output—SPI communicationsignal from slave device.SPI CLK (SCLK)Output SPI Clock—SPI output clock signal to slave devicescapable of clock rates up to 12 MHz.I2C SDA Input orOutputI2C Serial Data—Data signal for I2C communication.I2C SCL Output I2C Clock—I2C clock signal to slave devices capable ofclock rates up to 250 kHz.P0.<0..7>Input orOutput Digital I/O Signals—You can individually configure each signal as an input or output. You can configure the port for open-drain or push-pull output.*+5 V Output+5 V—The voltage source provided by the USB host.The voltage is nominally 5 V, but varies from system tosystem.GND—Ground—The reference for the digital signals and the+5VDC supply.NC—No Connect—Do not connect any signals to thisterminal.* If you configure the DIO port for open-drain output, you must supply pull-up resistors to V cc (3.3 or 5 V). The resistor value must not be lower than 1 kΩ.USB-8451 OEM Digital I/OThe USB-8451 OEM has eight single-ended digital lines, P0.<0..7>.Static DIOEach USB-8451 OEM DIO line can be individually programmed as a staticDI or DO line. You can use static DIO lines to monitor or control digitalsignals. All samples of static DI lines and updates of DO lines are softwaretimed.Digital Output InformationThe default configuration of the USB-8451 OEM DIO port is push-pull,allowing 3.3 V operation. You can add an external pull-up resistor (Rp) toachieve 5V operation, as shown in Figure4. Do not use a pull-up resistorof less than 1 kΩ.Figure 4. Example of Connecting External User-Provided Resistor© National Instruments Corporation5USB-8451 OEM SpecificationsUSB-8451 OEM Specifications Digital I/O CircuitryFigure 5 shows P0.<0..7> connected to example signals configured as digital inputs and digital outputs. Refer to Figure 5 for some common examples of connections of DIO lines with standard circuits.Figure 5. Example of Connecting a LoadCautionExceeding the maximum input voltage ratings or maximum output ratings, whichare listed in the Specifications section, can damage the USB device and the computer. National Instruments is not liable for any damage resulting from such signal connections.1P0.0 configured as an open-drain digital output driving a LED2P0.4 configured as a digital input receiving a TTL signal from a gated invertor 3P0.7 configured as a digital input receiving a 0 V or 5V signal from a switchshare the SPI MISO, SPI MOSI, and SPI CLK signals. Each peripheral hasits own CS signal for addressing it.Figure 6. SPI Interface to Three Peripherals© National Instruments Corporation7USB-8451 OEM SpecificationsI2C bus share the SDA and SCL signals. SDA and SCL must be pulled upexternally. Refer to the I2C specification to select the correct resistor valuesfor your bus.Figure 7. I2C Interface to Two PeripheralsI/O ProtectionEach DIO, SPI, and SPI CS signal is protected against overvoltage,undervoltage, and overcurrent conditions, as well as ESD events. However,you should avoid these fault conditions by using the following guidelines:•If you configure a line as an output, do not connect it to any externalsignal source, ground signal, or power supply.•If you configure a line as an output, understand the currentrequirements of the load connected to these signals. Do not exceed thespecified current output limits of the USB-8451 OEM.•If you configure a line as an input, do not drive the line with voltagesoutside of its normal operating range.USB-8451 OEM © National Instruments Corporation 9USB-8451 OEM Specifications•Treat the USB-8451 OEM as you would treat any static sensitive device. Always properly ground yourself and the equipment when handling the USB device or connecting to it.CautionTake special care with respect to the I 2C SDA and SCL lines. To allow for externalpull-ups, the circuit protection has been removed. Do not exceed the specified voltages for these signals.Power-On StatesAt system startup and reset, the hardware sets all DIO lines tohigh-impedance inputs. The USB-8451 OEM does not drive the signal high or low.+5 V Power SourceThe USB-8451 OEM supplies a nominal 5 V from two pins, one on each screw terminal block. The voltage source is provided by the USB host. The voltage is nominally 5 V, but varies from system to system. Refer to the Specifications section for more information about USB bus power specifications. This source can be used to power external components.NoteWhile the device is in USB suspend, the output is disabled.CautionWhen using the 5 V source, understand the current requirements of the loadconnected. Do not exceed the specified current output limits of the USB Vbus.SpecificationsThe following specifications are typical at 25 °C, unless otherwise noted.Digital I/O and Chip SelectsNumber of linesP0.<0..7>.........................................8CS <0..7>. (8)Direction control....................................Input or output,software selectable Output driver type..................................Push-pull (active drive) oropen-drain (DIO only), softwareselectableUSB-8451 OEM Specifications Absolute voltage range...........................–0.5 to 5.8 V with respect to GND Power-on state........................................Input (high impedance)Digital logic levels SPI InterfaceSignalsSPI MOSI (SDO).............................Output SPI MISO (SDI)..............................InputSPI CLK (SCLK)............................Output (12 MHz max)Supported clock rates..............................48 kHz, 50 kHz, 60 kHz, 75 kHz,80 kHz, 96 kHz, 100 kHz, 120kHz, 125 kHz, 150 kHz, 160kHz, 200 kHz, 240 kHz, 250kHz, 300 kHz, 375 kHz, 400kHz, 480 kHz, 500 kHz, 600kHz, 750 kHz, 800 kHz, 1MHz, 1.2 MHz, 1.5 MHz,2MHz, 2.4MHz, 3 MHz, 4 MHz, 6 MHz, 12 MHz Output driver type...................................Push-pull (active drive)Absolute voltage range...........................–0.5 to 5.8 V with respect to GND Power-on state........................................Input (high impedance)LevelMin Max Units InputInput low voltage Input high voltage Input leakage current–0.32.0—0.85.850V V µA OutputOutput low voltage (I = 8.5 mA)Output high voltagePush-pull (active drive), I = –8.5 mA Open-drain (DIO only)—2.0V cc *0.83.5V cc *V V V* V cc refers to the pull-up voltage you select.© National Instruments Corporation 11USB-8451 OEM Specifications Digital logic levelsI 2C InterfaceSignalsSDA ................................................Output/InputSCL.................................................Output (250 kHz max)Supported clock rates.............................32 kHz, 40 kHz, 50 kHz, 64 kHz,80kHz, 100 kHz, 125 kHz,160kHz, 200 kHz, 250 kHzOutput driver type..................................Open-drainAbsolute voltage range...........................–0.5 to 5.8 V with respect to GNDPower-on state........................................Input (high impedance)Digital logic levelsNote This interface is compatible with both I 2C and SMBus devices.Bus InterfaceUSB specification ..................................Full-speed (12 Mb/s)LevelMin Max Units InputInput low voltage Input high voltageInput leakage current–0.32.0—0.85.850V V µA OutputOutput low voltage (I = 8.5 mA)Output high voltagePush-pull (active drive), I = –8.5 mA —2.00.83.5V V LevelMin Max Units OutputOutput low voltage (I = 8.5 mA)Output high voltageOpen-drain with external pull-up resistor—2.00.8—V VExternal Voltage+5 V outputVoltage............................................4.10 V min, 5.25 V maxCurrent.............................................230 mA maxPower RequirementsUSB4.10 to5.25 VDC.............................80 mA typical, 500 mA maxUSB Suspend...................................300µA standby mode,500µA maxPhysical CharacteristicsDimensionsWithout connectors..........................6.35 cm × 8.51 cm × 2.31 cm(2.50 in. × 3.35 in. × 0.91 in.)With connectors...............................8.18 cm × 8.51 cm × 2.31 cm(3.22 in. × 3.35 in. × 0.91 in.)I/O B series B receptacle,(2)16position (screw terminal)plug headersScrew-terminal wiring............................16 AWG to 28 AWG copperconductor wire with 10 mm(0.39in.) of insulation strippedfrom the endTorque for screw terminals.....................0.22 to 0.25 N · m(2.0to2.2lb· in.)Weight....................................................84 g (3 oz)SafetyStandardsThe USB-8451 OEM is designed to meet the requirements of the followingstandards of safety for electrical equipment for measurement, control,and laboratory use:•IEC 61010-1, EN 61010-1•UL 61010-1•CAN/CSA-C22.2 No. 61010-1USB-8451 OEM © National Instruments Corporation 13USB-8451 OEM SpecificationsNote For UL and other safety certifications, refer to the product label, or visit/certification , search by model number or product line, and click theappropriate link in the Certification column.Overvoltage ProtectionConnect only voltages that are within these limits.Channel-to-COM (one channel).............± 30V max,Measurement Category IChannels-to-COM(one port, all channels)...........................± 8.9 V max,Measurement Category IMeasurement Category I is for measurements performed on circuits notdirectly connected to the electrical distribution system referred to asMAINS voltage. MAINS is a hazardous live electrical supply system thatpowers equipment. This category is for measurements of voltages fromspecially protected secondary circuits. Such voltage measurements includesignal levels, special equipment, limited-energy parts of equipment,circuits powered by regulated low-voltage sources, and electronics.CautionDo not use this module for connection to signals or for measurements withinMeasurement Categories II, III, or IV .Hazardous LocationsThe USB-8451 OEM is not certified for use in hazardous locations.EnvironmentalThe USB-8451 OEM device is intended for indoor use only.Operating temperature(IEC 60068-2-1 and IEC 60068-2-2).....0 to 45 °COperating humidity(IEC 60068-2-56)...................................10 to 90% RH, noncondensingMaximum altitude..................................2,000 m (at 25°C ambienttemperature)Storage temperature(IEC 60068-2-1 and IEC 60068-2-2).....–40 to 85 °CUSB-8451 OEM Specifications Storage humidity(IEC 60068-2-56) ..................................5 to 90% RH, noncondensingPollution Degree (IEC 60664) (2)Electromagnetic CompatibilityEmissions................................................EN 55011 Class A at 10 mFCC Part 15A above 1 GHzImmunity ................................................Industrial levels perEN 61326:1997 + A2:2001,Table 1EMC/EMI...............................................CE, C-Tick, and FCC Part 15(Class A) CompliantNote For EMC compliance, operate this device with shielded cabling.CE ComplianceThis product meets the essential requirements of applicable EuropeanDirectives, as amended for CE marking, as follows:Low-Voltage Directive (safety)..............73/23/EECElectromagnetic CompatibilityDirective (EMC).....................................89/336/EECNoteRefer to the Declaration of Conformity (DoC) for this product for any additionalregulatory compliance information. To obtain the DoC for this product, visit/certification , search by model number or product line, and click theappropriate link in the Certification column.Safety GuidelinesThe following section contains important safety information that you mustfollow when installing and using the USB-8451 OEM.Do not operate the USB-8451 OEM in a manner not specified in thisdocument. Misuse of the device can result in a hazard. You can compromisethe safety protection built into the device if the device is damaged in anyway. If the device is damaged, contact National Instruments for repair.Do not substitute parts or modify the device except as described in thisdocument. Use the device only with the chassis, modules, accessories, andcables specified in the installation instructions. You must have all coversand filler panels installed during operation of the device.Do not operate the device in an explosive atmosphere or where there maybe flammable gases or fumes. If you must operate the device in such anenvironment, it must be in a suitably rated enclosure.If you need to clean the device, use a dry cloth. Make sure that the deviceis completely dry and free from contaminants before returning it to service.Operate the device only at or below Pollution Degree 2. Pollution is foreignmatter in a solid, liquid, or gaseous state that can reduce dielectric strengthor surface resistivity. The following is a description of pollution degrees:•Pollution Degree 1 means no pollution or only dry, nonconductivepollution occurs. The pollution has no influence.•Pollution Degree 2 means that only nonconductive pollution occurs inmost cases. Occasionally, however, a temporary conductivity causedby condensation must be expected.•Pollution Degree 3 means that conductive pollution occurs, or dry,nonconductive pollution occurs that becomes conductive due tocondensation.You must insulate signal connections for the maximum voltage for whichthe device is rated. Do not exceed the maximum ratings for the device. Donot install wiring while the device is live with electrical signals. Do notremove or add connector blocks when power is connected to the system.Avoid contact between your body and the connector block signal when hotswapping modules. Remove power from signal lines before connectingthem to or disconnecting them from the device.© National Instruments Corporation15USB-8451 OEM SpecificationsOperate the device at or below the Measurement Category I1. Measurementcircuits are subjected to working voltages2 and transient stresses(overvoltage) from the circuit to which they are connected duringmeasurement or test. Measurement categories establish standard impulsewithstand voltage levels that commonly occur in electrical distributionsystems. The following is a description of measurement categories:•Measurement Category I is for measurements performed on circuitsnot directly connected to the electrical distribution system referred toas MAINS3 voltage. This category is for measurements of voltagesfrom specially protected secondary circuits. Such voltagemeasurements include signal levels, special equipment, limited-energyparts of equipment, circuits powered by regulated low-voltage sources,and electronics.•Measurement Category II is for measurements performed on circuitsdirectly connected to the electrical distribution system. This categoryrefers to local-level electrical distribution, such as that provided by astandard wall outlet (for example, 115 V for U.S. or 230 V for Europe).Examples of Measurement Category II are measurements performedon household appliances, portable tools, and similar E Series devices.•Measurement Category III is for measurements performed in thebuilding installation at the distribution level. This category refers tomeasurements on hard-wired equipment such as equipment in fixedinstallations, distribution boards, and circuit breakers. Other examplesare wiring, including cables, bus-bars, junction boxes, switches,socket-outlets in the fixed installation, and stationary motors withpermanent connections to fixed installations.Measurement Category IV is for measurements performed at the primaryelectrical supply installation (<1,000 V). Examples include electricitymeters and measurements on primary overcurrent protection devices andon ripple control units.1 Measurement Category as defined in electrical safety standard IEC 61010-1. Measurement Category is also referred to as Installation Category.2 Working V oltage is the highest rms value of an AC or DC voltage that can occur across any particular insulation.3 MAINS is defined as a hazardous live electrical supply system that powers equipment. Suitably rated measuring circuits may be connected to the MAINS for measuring purposes.USB-8451 OEM Where to Go for SupportThe National Instruments Web site is your complete resource for technicalsupport. At /support you have access to everything fromtroubleshooting and application development self-help resources to emailand phone assistance from NI Application Engineers.A Declaration of Conformity (DoC) is our claim of compliance with theCouncil of the European Communities using the manufacturer’sdeclaration of conformity. This system affords the user protection forelectronic compatibility (EMC) and product safety. You can obtain the DoCfor your product by visiting /certification. If your productsupports calibration, you can obtain the calibration certificate for yourproduct at /calibration.National Instruments corporate headquarters is located at11500North Mopac Expressway, Austin, Texas, 78759-3504.National Instruments also has offices located around the world to helpaddress your support needs. For telephone support in the United States,create your service request at /support and follow the callinginstructions or dial 5127958248. For telephone support outside the UnitedStates, contact your local branch office:Australia1800300800, Austria4306624579900,Belgium32027570020, Brazil551132623599,Canada8004333488, China862165557838,Czech Republic420224235774, Denmark4545762600,Finland3850972572511, France330148142424,Germany490897413130, India918051190000,Israel972036393737, Italy3902413091, Japan81354722970,Korea820234513400,Lebanon96101332828,Malaysia1800887710, Mexico018000100793,Netherlands310348433466, New Zealand0800553322,Norway47066907660, Poland48223390150,Portugal351210311210, Russia70957836851,Singapore180********, Slovenia38634254200,South Africa270118058197, Spain34916400085,Sweden460858789500, Switzerland41562005151,Taiwan8860223772222, Thailand6622786777,United Kingdom4401635523545National Instruments, NI, , and LabVIEW are trademarks of National Instruments Corporation.Refer to the Terms of Use section on /legal for more information about NationalInstruments trademarks. Other product and company names mentioned herein are trademarks or tradenames of their respective companies. For patents covering National Instruments products, refer to theappropriate location: Help»Patents in your software, the patents.txt file on your CD, or/patents.© 2006 National Instruments Corporation. All rights reserved.290598A-01Jan06。

Features & Specifications• Available on FlexMove Aluminum Conveyors,FS (65 mm), FM (85 mm), FC (105 mm), FL (150 mm), FU (180 mm), and FV (260 mm)• Max. single product weight: 2.3 kg (5 lbs)• Max. product accumulation weight: 13.6 kg (30 lbs)• Max. conveyor speed: 50 m/min (164 ft/min)• Produces gap of approximately one product length• Pneumatic stop for pacing pucks or packages • Two Models:• Vertical Blade Stop; used in pairs as an alternating escapement for pacing round or rounded edge rectangular pucks• Horizontal Squeeze Stop; used in combination with Vertical Blade Stop for pacing product without rounded edges. Product must be able to withstand side squeeze pressure• Compatible with round or rectangular bottles, containers or pucks• UHMW face for non-marking contact surface • Includes flow controls with push-in air line connection• Requires photo sensors, pneumatic solenoid valves, wiring and programming• Rate depends on product size. Contact factory for detailsPUCK STOP MODULEDual Vertical Blade StopsHorizontal Squeeze Stop with Vertical Blade StopPuck stops alternate to pace productsVertical stop releases product and horizontal stop squeezes second to pace product141 mm[5.54 in]WW115 mm [4.52 in]50 mm [1.98 in]DimensionsTransforming Conveyor Automation© Dorner Mfg. Corp. 2021. All Rights Reserved. 851-954 0621Dorner – North & South AmericaDorner – U.S.A. Headquarters975 Cottonwood Ave Hartland, WI 53029, USA (800) 397-8664(262) 367-7600***************Dorner – Canada100-5515 North Service Road Burlington, Ontario L7L 6G6 Canada(289) 208-7306***************Dorner – Latin AmericaCarretera a Nogales #5297,Nave 11. Parque Industrial Nogales Zapopan, Jalisco C.P . 45222 Mexico+52.33.30037400****************************Dorner – EuropeDorner – GermanyKarl-Heinz-Beckurts-Straße 752428 Jülich, Germany+49 (0) 2461/93767-0 **********************Dorner – France8 rue des Frères Caudron 78140 Velizy-Villacoublay France+33 (0)1 84 73 24 27 **********************Dorner – Asia128 Jalan Permatang Damar Laut, Bayan Lepas 11960 Penang, Malaysia+604-626-2948|********************45 mm [1.78 in]W 91 mm[3.57 in]114 mm [4.48 in]W Vertical BladePart Number: 208169Horizontal SqueezePart Number: 208161141 mm 115 mm 50 mm [5.54 in]WW [4.52 in][1.98 in]。

NeoScan 45™Mobile Fingerprint Collection DeviceNEC Corporation of America/NeoScanThe Simplicity You Need. The Design You Want.Operational Simplicity. Elegant Design. Unmatched Accuracy.At a GlanceDesigned for public safety applications in the field, NeoScan 45 delivers the highest degree of speed and accuracy for mobile fingerprint roll and plain capture, including simultaneous two-finger capture. This innovative solution from NEC is simple to use,and features a large (1.6” x 1.5”) scanning platen for better image quality and greater accuracy, as proven by NIST (National Institute of Standards and Technology)*.NeoScan 45 supports multiple communication protocols including Bluetooth® and Wi-Fi. As such, the device is compatible with Apple® iOS and Android® operating systems, including the latest Apple and Samsung smartphone and tablet models. Equipped with a single and dual, plain and roll fingerprint capture sensor, NeoScan 45 is compliant with the FBI Image Quality Specification (IQS) Appendix F standards. With NEC’s Smart ID biometric identification solution, NeoScan 45 adheres to NIST and FBI EBTS transmission standards.As an open device, NeoScan 45 can operate with nearly all AFIS solutions, including NEC’s Integra-ID Multi-modal Biometrics Identification Solution (MBIS), enabling agencies to extend their existing AFIS infrastructure investments into mobile applications. NEC engineering teams worldwide collaborated to create this new standard in accuracy and compactness with NEC’s lightweight FAP 45 fingerprint collection device. Manufactured in Japan, it abides by NEC’s strict manufacturing and quality standards that are intended to substantially improve the design, ergonomics and reliability of the device.• The thinnest and lightest FAP 45 multi-fingerprintcapture device• 600% more fingerprint image capture than legacy FAP 10 devices• Forensic image quality for the cascading of searches against unsolved latent collection• Intuitive interface for rapidly accurate fingerprintcapture process• Bluetooth and Wi-Fi-enabled for both Apple® iOS and Android operating systems• Supports Mobile ID, Field Booking, and Cite & Release Workflows• Compatibility with most AFIS systems extendsexisting investmentsUltra-Portable DesignAccurate fingerprint identification is crucial in the field. Public Safety, Homeland Security, First Responders and even Healthcare providers all demand a compact, fail-proof tool that works in their real time operational environments. As the thinnest and lightest FAP 45multi-fingerprint capture device, NEC’s NeoScan 45 offers an advanced design for rapid and ease-of-use application in the field. Slightly larger than an Apple® iPhone 6 Plus, NEC’s NeoScan 45 fits into a shirt pocket or clip-on belt. Weighing at only 9 ounces it can be comfortably operated with only one hand.Operational SimplicityThe intuitive user interface of the NeoScan 45 guides users clearly through the fingerprint capture and identification process. Distinct color indicators provide scanning prompts and confirmation, while also displaying the fingerprint capture profile.Convenient LED indicators show device status including battery life, wireless connection, and fingerprint capture process. Fingerprint images are confirmed as high quality by an onboard NFIQ (NIST Fingerprint Image Quality) image test prior to image acceptance. When a quality fingerprint is captured, the finger icon LED illuminates in green.The NeoScan 45 adapts to the environment and user for unparalleled operational simplicity. If necessary, missing or scarred fingertipscan be skipped without hassle. The “Add New” button streamlines the scanning process when capturing a series of fingerprints from different individuals during the same session. Collected fingerprint sets are stored on the device until downloaded via Bluetooth or Wi-Fi. The ease of use of the NeoScan 45 helps reduce capture errors and wrong finger sequence captures.Built-in magnetic card swipe supports rapid demographic data collection by swiping Drivers Licenses and ID cards, as well as credit cards.Accurate, High-Quality Fingerprint ImagesNeoScan 45 is tested and certified to FBI FAP 45 specifications including EBTS Appendix F and PIV-071006. With capture dimensions of 1.6’’ x 1.5”, the NeoScan 45 can collect a larger size image, it is able to scan a two-finger slap capture, as well as up to10 rolled fingerprints. When more fingerprint images are captured simultaneously matching horse power is reduced while speed of identification increases.According to a study by NIST (NISTIR 7950), larger fingerprint sensors with higher FAP levels – like the NeoScan 45 – are more accurate, reduce sequence errors, and provide a higher rate of identification.* NeoScan 45 with its FAP 45 sensor captures over 600% more fingerprint image data than legacy FAP 10 devices. High resolution scans enable efficient cascading searches for latent fingerprint recognition; in turn, higher accuracy reduces demands on backend systems for better overall system performance.Open and ConnectedSupport of multiple communication protocols, such as Bluetooth and Wi-Fi, ensure reliable connectivity for the NeoScan 45. Compatibility with Apple® iOS and Android® operating systems provide extraordinary integration and operational flexibility.Battery life surpasses any other comparable device. The NeoScan45 can power up to 200 scans per day and 24 hours of standby. Because it can operate with nearly all AFIS solutions, agencies are able to extend their existing AFIS infrastructure investments into the latest mobile applications with NeoScan 45.Smart ID® and Live Scan FunctionalityPaired with NEC’s Smart ID and Smart LC applications, NeoScan45 would also support cite-and-release, field booking and scene of crime print elimination.NEC’s Smart ID biometricidentification applicationmeets NIST and EBTStransmission standards.Field booking and cite-and-release capabilitiesare possible with the efficiently designed NeoScan 45 and optional Live Scan Support Module. The NEC-patented Live Scan Support Module with a tablet PC transforms the NeoScan 45 into a portable booking station. Demographic data and fingerprints can be paired with a photograph, and sent for search against local, state and FBI RISC and other databases from nearly everywhere.Innovative Force in Biometric IdentificationFor more than 30 years, NEC has been a world leader in integrated, high availability biometric identification systems. The unparalleled identification accuracy and speed of our technologies have been independently verified by NIST time and again. NEC is well-versedin deploying massive-scale multi-modal identification systems globally. NeoScan 45 is NEC’s latest addition of innovative products and technologies. In par with our legacy innovations, NeoScan 45 provides the simplicity you need and the design you want!* National Institute of Standards and Technology (NIST) and FBI testing.NIST report (NISTIR 7950).HW15001 | v.01.16.15© 2015 NEC Corporation. All rights reserved. NEC, NEC logo, and UNIVERGE are trademarks or registered trademarks of NEC Corporation that may be registered in Japan and other jurisdictions. All trademarks identified with ® or ™ are registered trademarks or trademarks respectively. Models may vary for each country. Please refer to your local NEC representatives for further details.NEC Enterprise Solutions NEC Europe Ltd Corporate Headquarters (Japan)NEC Corporation North America (USA & Canada)NEC Corporation of America APACNEC Asia Pacific Pte Ltd .sg About NEC Corporation of America Headquartered in Irving, Texas, NEC Corporation of America is a leading provider of innovative IT, network and communications products and solutions for service carriers, Fortune 1000 and SMB businesses across multiple vertical industries, including Healthcare, Government, Education and Hospitality. NEC Corporation of America delivers one of the industry’s broadest portfolios of technology solutions and professional services, including unified communications, wireless, voice and data, managed services, server and storage infrastructure, optical network systems, microwave radio communications and biometric security. NEC Corporation of America is a wholly-owned subsidiary of NEC Corporation, a global technology leader with operations in 44 countries and more than $32.6 billion in revenues. For more information, please visit .Specifications for NeoScan 45。

单位内部认证PTN初级考试(试卷编号131)1.[单选题]路由器网络层的基本功能是A)配置IP地址B)寻找路由和转发报文C)将MAC地址解释成IP地址答案:B解析:2.[单选题]CITRANS R8000-3主控盘M/S灯快闪表示A)MGMT口收到数据B)ETH1口收到数据C)主控盘工作在主用D)主控盘工作在备用答案:C解析:3.[单选题]IPRAN 800设备最多可以支持的负载分担端口是（）个A)10B)8C)6D)4答案:B解析:4.[单选题]业务盘一端口有发包，有收包，请问下面那个选项是正确的A)该端口下业务正常B)该端口下业务不正常C)要判断业务是否正常还需看各种类型包的收发情况D)该业务闪断答案:C解析:5.[单选题]CTN 6500-16L设备，如果配置PSC交换板，则带宽板槽位的接入容量为（）A)120GB)100GC)40GD)80G答案:B6.[单选题]OSPF邻居到达哪个状态表示邻居关系正常建立A)InitB)2-wayC)ExStratD)D . Full答案:D解析:7.[单选题]B类地址的缺省掩码是A)255.0.0.0B)255.255.255.0C)255.255.0.0D)255.255.0.0答案:D解析:8.[单选题]640的单向LSP条目数为（）A)256B)512C)1024D)2048答案:C解析:9.[单选题]OSPF骨干区的区域编号为（）A)0.0.0.1B)255C)0.0.0.0D)255.255.255.255答案:C解析:10.[单选题]二层以太网帧头部中的LENGTH/TYPE字段值大于（）时，说明该字段是TYPE，并且这是以太网帧格式（）A)64B)1500C)1600D)9000答案:B解析:A)LSP1+1保护必须是在两个相邻的节点B)线性1+1保护必须是在两个相邻的节点C)线性1+1保护的备用路径上可以走额外业务D)LSP1：1保护的备用路径上不可以走额外业务答案:B解析:12.[单选题]在电信全动态组网模型中，汇聚设备之间互联端口（）配置静态ARP，主备汇聚节点L3VE接口（）配置静态ARPA)需要，需要B)需要，不需要C)不需要，需要D)不需要，不需要答案:D解析:13.[单选题]一下不会再路由表中出现的是A)吓一跳地址B)网络地址C)度量值D)MAC地址答案:D解析:14.[单选题]（）光纤是最佳的单波长高容量光纤，常用于海底光缆，但是不能用于DWDMA)G.652B)G.653C)G.654D)G.655答案:C解析:15.[单选题]OSI模型中，传输层的作用是A)端到端连接B)路由选择C)成帧D)物理拓扑答案:A解析:B)网间1：1保护C)基于IP路由下一跳的主备D)基于VPN路由下一跳的主备答案:D解析:17.[单选题]在N:1配置中DHCP的RELAY IP 配置在哪个接口上A)L3VE主接口B)L3VE子接口C)L2VE主接口D)L2VE子接口答案:B解析:18.[单选题]TCP/IP 模型的层之间使用 PDU （协议数据单元） 彼此交换信息， 传输层带 TCP 报头的 PDU 被称为？A)帧B)包C)二进制比特流D)段答案:C解析:19.[单选题]ELAN业务与ETREE业务相比A)ELAN中叶子节点能够互相通信,ETREE叶子节点不能通信B)ELAN中叶子节点不能通信,ETREE叶子节点不能通信C)ELAN中叶子节点不能通信D)ELAN中叶子节点不能互相通信答案:A解析:20.[单选题]单盘光功率查看在那个菜单下A)单盘配置B)网元配置C)单盘性能D)单盘告警答案:C解析:21.[单选题]有5类IP地址，下面哪一类地址是组播使用的C)CD)D答案:D解析:22.[单选题]在MPLS网络中，对于一台设备的标签转发表（基于全局）来说，如果吓一跳相同，但表项不通过的路由，那么这两天不同路由报文的出标签A)一定相同B)不一定相同C)可能相同D)以上都不对答案:B解析:23.[单选题]主机地址10.10.10.10/255.255.254.0的广播地址是多少A)10.10.10.255B)10.10.11.255C)10.10.255.255D)10.255.255.255答案:B解析:24.[单选题]用于创建外层标签的协议有（），用于创建内层标签的协议有A)LSP/LDP，RSVP/LDPB)LDP/RSVP，LDP/BGPC)LDP/RSVP，PW/BGPD)LDP/LSP，PW/BGP答案:B解析:25.[单选题]网管系统包括（）A)远程接入系统B)中心网管C)本地维护终端D)以上都是答案:D解析:26.[单选题]LTE业务的创建L3VPN时，RD值需要（）A)每个VPN内可重复D)不需设置答案:B解析:27.[单选题]当聚合组内有处于up状态的端口时，先比较端口的聚合优先级，当优先级相同时比较端口属性，下面端口属性最高的是A)全双工/高速率B)全双工/低速率C)半双工/高速率D)半双工/低速率答案:A解析:28.[单选题]CiTRANS R865通过（）盘的外部监测接口，对机房的环境进行实时监测和数据上报。

在日常生活中，我们时常听到「光纤通讯(Optical Fiber Communications)，但什麼是「光纤通讯呢它又是如何传递光的讯号呢为了解这个问题，我们先从「光传输的历史讲起，光纤通信是七十年代发展起来的一门新兴技术。

光纤是光导纤维的简称。

它是由玻璃材料(SiO2)抽丝而成的一种光传输媒体。

以光波传送资讯，以光纤为传输介质的通信方式称为光纤通信。

利用光进行资讯传递的历史至少可以追溯到我国古代的峰火台，当时是用火光来传递讯号作为警戒用途，至今已有七百多年的历史。

后来则是在海上航行的船只利用灯号来作为通讯用途，比如:海军旗语，信号弹。

乃至现在在大城市仍然使用的红绿灯都是利用光进行通信的。

从近代科技的发展史来看，「光通讯重大发明则是在西元1880年由贝尔(Alexander Graham Bell)发明的光话机(Photophone)所获得。

贝尔将太阳聚成一道极为狭窄的光束，照射在很薄的镜子上，当人们发出声音的声波让这面薄镜产生振动时。

反射光强度的变化使得感应的侦测器产生变动，改变电阻值。

而接收端则利用变化的电阻值产生电流，还原成原来的声波。

他的这项发明仅能传播约200公尺，因为藉由空气传递的光束，遇到的情况都不尽相同，例如雾，雨或雪都能阻挡光线，甚至在乾燥而新鲜的空气中，光线强度仍会随距离迅速减弱。

当时贝尔虽曾预测这项发明「在科学世界裏，将远比电话，留声机和麦克风更有趣，但是这种初期的光通信所能传送的资讯是十分有限的。

一方面由於普通光源或日光成份复杂，振动方面杂乱而无法调变;另一方面利用大气为介质进行光通信损耗大，受气候影响严重，不能全天侯进行，易受地理条件的限制。

因此，贝尔的"光话机"由於高强度光源的可靠度和低损耗介质的稳定性，仍未能解决而一直未能实用。

1960年，正当人们开始认识到资讯对未来社会重要性的时候，美国的Maimen发明了红宝石雷射二极体。

由此，人们得到了良好的同调光，使光通信得到了新生。

e 845/e 845 SInstruction manualDelivery includes Delivery includes• e 845 / e 845 S• MZQ 800 microphone clamp• pouch• quick guide• safety guideProduct overview1. Sound inlet basket2. XLR-3 connector3. On/off switch (e 845 S only)4. Screw (e 845 S only)InstallationInstallationAttaching the microphoneScrew the microphone clamp to a stand.Place the microphone with its back end into the microphone clamp.Orient the microphone together with the microphone clamp.Connecting the microphoneConnect the XLR-3 socket of the microphone cable (optional accessories) to the XLR-3 socket of the microphone.Using the windshieldPlace the MZW 4032 (optional accessories) windshield over the microphone head.OperationHolding the microphoneIf you cover the microphone head during transmission, this will change the pick-up pattern of themicrophone and consequently the sound.Only hold the radio microphone by its body.Positioning the microphoneIt is vital to observe the following notes:Position Resulting soundCommentaryA High proximity effect (large bass boost)Powerful, direct soundVery little crosstalk from other sound sourcesB Less proximity effect (less bass boost)Some room ambience, natural, balanced sound More crosstalk from other sound sourcesCVery little proximity effect (minimal bass boost)More room ambience, indirect soundHigher crosstalk from other sound sourcesA If sibilance occurs:Position the microphone slightly to the side and not directly in front of the mouth.Positioning the monitor loudspeakersTo prevent feedback and crosstalk, postion your monitor loudspeakers in the angle area of the highest cancellation of the microphone (approx. 120°).Switching the e 845 S on/offUse the on/off switch to switch the the e 845 S on or off.If necessary, use the screw to lock the on/off switch in the …on“ position.Cleaning and maintaining the e 845 / e 845 SCleaning and maintaining the e 845 / e 845 SCAUTIONLIQUIDS CAN DAMAGE THE ELECTRONICS OF THE PRODUCT!Liquids entering the housing of the product can cause a short-circuit and damage the electronics.Keep all liquids away from the product.Do not use any solvents or cleansing agents.Disconnect the products from the power supply system and remove rechargeable batteries and batteries before you begin cleaning.Clean all products only with a soft, dry cloth.Cleaning the sound inlet basket of the microphone moduleUnscrew the sound inlet basket.Remove the foam insert from the sound inlet basket.Use a slightly damp cloth to clean the sound inlet basket from the inside and ouside.If necessary, clean the foam insert with a mild detergent or replace the foam insert.Dry the foam insert.Reinsert the foam insert.Replace the sound inlet basket on the microphone head and screw it tight.SpecificationsSpecificationsTransducer principle dynamic Frequency response 40 - 16,000 Hz Pick-up patternsuper-cardioid Sensitivity (free field, no load) 1.8 mV/Pa Nominal impedance (at 1 kHz)350 ΩMin. terminating impedance 1 kΩConnector XLR-3Temperature range 0 °C to +40 °C Dimensions ⌀ 46 x 185 mm Weight330 gPolar pattern30°0°180°150°120°60°90°0510152025dB30°0°180°150°120°60°90°125 Hz 250 Hz 500 Hz 1,000 Hz 2,000 Hz 4,000 Hz8,000 Hz 16,000 HzFrequency response-40-50-60-70-80-900°, 1 m501002005001,0002,0005,00010,00020,000H zdBVOverview of applicationsConnector assignmentUNBALANCEDBALANCEDOverview of applicationsPrimary application Secondary application。

技能认证PTN专业考试(习题卷1)说明：答案和解析在试卷最后第1部分：单项选择题，共67题，每题只有一个正确答案,多选或少选均不得分。

1.[单选题]SPE控制器只需要和（）建立通讯即可A)NPEB)SPEC)UPE2.[单选题]下列关于静态arp配置说法正确的是？A)静态arp表中mac地址配置为本端地址B)静态arp表中ip地址配置为对端ip地址C)citrans 640上需要配置静态arpD)在L3设备的ARP表中需要配置LTE基站的mac地址3.[单选题]组播组使用以下哪个范围的IP地址A)1.0.0.0～126.255.255.255B)127.0.0.0～191.255.255.255C)192.0.0.0～223.255.255.255D)224.0.0.0～239.255.255.2554.[单选题]烽火CiTRANS R865设备的时钟/时间传递在什么单盘上完成（）A)时钟盘B)RCUO1盘C)SCUO1盘D)AIF盘5.[单选题]下面哪些机盘不能带电插拔（）A)XCUK1B)XSK1C)NMUK1D)E1K16.[单选题]CIDR（无类域间路由）技术用子网掩码中连续的1部份表示网络ID，连续的0部份表示主机ID，使用CIDR表示的一个IPV4地址为3.148.23.8/25,请问该地址的子网掩码是A)255.255.255.0B)255.255.255.128C)255.255.255.192D)255.255.128.07.[单选题]从整个Internet 的观点出发，如何有效的减少路由表的规模A)增加动态路由的更新频率B)使用路由过滤策略C)划分VLAND)路由聚合8.[单选题]当需要配置620A设备的GE口作为UNI时，修改了单盘配置并下发后，会出现的情况（）A)620A设备复位重启，业务中断B)620A设备仅NMU复位重启，业务不中断C)620A设备不复位重启，业务不中断D)620A设备不复位重启，但业务有闪断9.[单选题]在U31网管上PTN网元的业务配置典型流程是（ ）A)隧道配置，伪线配置，业务基本配置，业务配置B)业务基本配置，伪线配置，隧道配置，业务配置C)业务基本配置，隧道配置，伪线配置，业务配置D)隧道配置，伪线配置，业务配置，业务基本配置10.[单选题]PTN设备网元托管，不可能的原因是（）A)更换网块网元号后没有下发管理配置B)PTN对接设备异常信号干扰C)拨码开关设备侧与网管侧配置不一致D)支路盘故障11.[单选题]XGO1盘有（）个GE端口。

RT8511B®DS8511B-05 February 20151©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Ordering InformationNote :Richtek products are :❝ RoHS compliant and compatible with the current require-ments of IPC/JEDEC J-STD-020.❝ Suitable for use in SnPb or Pb-free soldering processes.Marking InformationPin Configurations(TOP VIEW)WDFN-8L 2x243V Asynchronous Boost WLED DriverGeneral DescriptionThe RT8511B is an LED driver IC that can support up to 10 WLED in series. It is composed of a current mode boost converter integrated with a 43V/2.2A power switch running at a fixed 500kHz frequency and covering a wide VIN range from 2.7V to 24V.The white LED current is set with an external resistor, and the feedback voltage is regulated to 200mV (typ.). During operation, the LED current can be controlled by the PWM input signal in which the duty cycle determines the feedback reference voltage.For brightness dimming, the RT8511B is able to maintain steady control of the LED current. Therefore, no audible noises are generated on the output capacitor. The RT8511B also has programmable over voltage pin to prevent the output from exceeding absolute maximum ratings during open LED conditions. The RT8511B is available in WDFN-8L 2x2 package.Features●Wide Input Voltage Range : 2.7V to 24V●High Output Voltage : up to 43V●Direct PWM Dimming Control and Frequency from 100Hz to 8kHz●Internal Soft-Start and Compensation ●200mV Reference Voltage●PWM Dimming with Internal Filter●Programmable Over Voltage Protection ●Over Temperature Protection ●Current Limit Protection ●Thin 8-Lead WDFN Package●RoHS Compliant and Halogen FreeApplications●UMPC and Notebook Computer Backlight ●GPS, Portable DVD BacklightEN PWM VIN LX0F : Product CodeW : Date CodeG : Green (Halogen Free and Pb Free)RT8511BRT8511B2DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Typical Application CircuitFigure 1. Typical Application Circuit of Normal OperationFigure 2. Typical Application Circuit of Low Voltage OperationVSET SETRT8511B3DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Function Block DiagramRT8511B4DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Electrical CharacteristicsRecommended Operating Conditions (Note 4)●Supply Input Voltage, V IN ------------------------------------------------------------------------------------------------2.7V to 24V ●Junction T emperature Range --------------------------------------------------------------------------------------------−40°C to 125°C ●Ambient T emperature Range --------------------------------------------------------------------------------------------−40°C to 85°CAbsolute Maximum Ratings (Note 1)●VIN, EN, PWM, DIMC to GND------------------------------------------------------------------------------------------−0.3V to 26.5V ●FB, OVP to GND ----------------------------------------------------------------------------------------------------------−0.3V to 48V ●LX to GND ------------------------------------------------------------------------------------------------------------------−0.3V to 48V < 500ns ----------------------------------------------------------------------------------------------------------------------−1V to 48V ● Power Dissipation, P D @ T A = 25°CWDFN-8L 2x2--------------------------------------------------------------------------------------------------------------0.833W ●Package Thermal Resistance (Note 2)WDFN-8L 2x2, θJA ---------------------------------------------------------------------------------------------------------120°C/W WDFN-8L 2x2, θJC ---------------------------------------------------------------------------------------------------------8.2°C/W ●Lead Temperature (Soldering, 10 sec.)-------------------------------------------------------------------------------260°C ●Junction T emperature -----------------------------------------------------------------------------------------------------150°C●Storage T emperature Range --------------------------------------------------------------------------------------------–65°C to 150°C ●ESD Susceptibility (Note 3)HBM (Human Body Model)----------------------------------------------------------------------------------------------2kV MM (Machine Model)-----------------------------------------------------------------------------------------------------200VRT8511B5DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Note 1. Stresses beyond those listed “Absolute Maximum Ratings ” may cause permanent damage to the device. These arestress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.Note 2. θJA is measured at T A = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC ismeasured at the exposed pad of the package.Note 3. Devices are ESD sensitive. Handling precaution is recommended.Note 4. The device is not guaranteed to function outside its operating conditions.RT8511B6DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.LED Current vs. PWM Duty Cycle1020304050600102030405060708090100PWM Duty Cycle (%)L E D C u r r e n t (m A)Typical Operating CharacteristicsFB Reference Voltage vs. Input Voltage198.0198.3198.6198.9199.2199.54812162024Input Voltage (V)F B R e f e r e n c e V o l t a g e (m V)Frequency vs. Input Voltage3504004505005506004812162024Input Voltage (V)F r e q u e n c y (k H z ) Efficiency vs. Input Voltage6065707580859095100479121417192224Input Voltage (V)E f f i c i e n c y (%)FB Reference Voltage vs. Temperature-205305580105Temperature (°C)Current Limit vs. Input Voltage1.01.41.82.22.63.02.55.25810.7513.516.251921.7524.5Input Voltage (V)C u r r e n t L i m i t (A )RT8511B7DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Application InformationThe RT8511B is a current mode boost converter which operates at a fixed frequency of 500kHz. It is capable of driving up to 10 white LEDs in series and integrates functions such as soft-start, compensation, and internal analog dimming control. The protection block also provides over-voltage, over-temperature, and current- limit protection features.LED Current SettingThe loop structure of the boost converter keeps the FB pin voltage equal to the reference voltage V FB . Therefore,by connecting the resistor, R SET between the FB pin and GND, the LED current will be determined by the current through R SET . The LED current can be calculated by the following equation :FBLED SET VI = R Brightness ControlFor the brightness dimming control of the RT8511B, the IC provides typically 200mV reference voltage when the PWM pin is constantly pulled high. However, the PWM pin allows a PWM signal to adjust the reference voltage by changing the PWM duty cycle to achieve LED brightness dimming control. The relationship between the duty cycle and the FB voltage can be calculated according to the following equation :V FB = 200mV x Dutywhere 200mV is the typical internal reference voltage and Duty is the duty cycle of the PWM signal.As shown in Figure 3, the duty cycle of the PWM signal is used to modify the internal 200mV reference voltage.With an on-chip output clamping amplifier and a serial resistor, the PWM dimming signal is easily low-pass filtered to an analog dimming signal with one external capacitor, C DIMC , for noise-free PWM dimming. Dimming frequency can be sufficiently adjusted from 100Hz to 8kHz.However, the LED current cannot be 100% proportional to the duty cycle. Referring to T able 1, the minimum dimming duty can be as low as 1% for the frequency range from 100Hz to 8kHz. It should be noted that the accuracy of 1% duty is not guaranteed.Figure 3. Block Diagram of Programmable FB Voltage Table 1. Minimum Duty for Dimming FrequencyBecause the voltage of DIMC and FB is small to 2mV andeasily affected by LX switching noise.ToControllerThe FB pin voltage will be decreased by lower PWM duty ratio . That will achieve LED current diming function for different brightness. But LED current is more accurate when higher PWM duty. The Table 2. shows typical variation value comparison between different PWM duty and condition is V IN = 3.7V, LED array = 6S2P , R SET =5Ω.Table 2. LED Current Variation vs PWM DutyIt also should be noted that when the input voltage is too close to the output voltage [(V OUT −V IN ) < 6V] , excessive audible noise may occur. Additionally, for accurate brightness dimming control, the input voltage should be kept lower than the LEDs' turn on voltage. When operating in the light load, excessive output ripple may occur.RT8511B8DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Mode2Mode3Figure 4. Power On SequenceMode1Mode3Figure 5. Power Off SequenceV INV OUTENV INV OUTENPWMV INV OUTENPWMV INV V INV OUTENPWMDelayMode1V INV ENSoft-StartThe RT8511B provides a built-in soft-start function to limit the inrush current, while allowing for an increased PWM frequency for dimming.Current Limiting ProtectionThe RT8511B can limit the peak current to achieve over current protection. The IC senses the inductor current through the LX pin in the charging period. When the value exceeds the current limiting threshold, the internal N-MOSFET will be turned off. In the off period, the inductor current will descend. The internal MOSFET is turned on by the oscillator during the beginning of the next cycle.Power SequenceIn order to assure that the normal soft-start function is in place for suppressing the inrush current, the input voltage and enable voltage should be ready before PWM pulls high. Figure 4 and Figure 5 show the power on and power off sequences.RT8511B9DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.OUT, OVP OVP R2V = V 1+R1⎛⎫⨯ ⎪⎝⎭where R1 and R2 make up the voltage divider connected to the OVP pin.Over Temperature ProtectionThe RT8511B has an Over T emperature Protection (OTP)function to prevent overheating caused by excessive power dissipation from overheating the device. The OTP will shut down switching operation if the junction temperature exceeds 160°C. The boost converter will start switching again when the junction temperature is cooled down by approximately 30°C.Inductor SelectionThe inductance depends on the maximum input current.As a general rule, the inductor ripple current range is 20%to 40% of the maximum input current. If 40% is selected as an example, the inductor ripple current can be calculated according to the following equation :OUT OUTIN(MAX)(MIN)IN(MIN)RIPPLE IN(MAX)V I I =V I = 0.4I η⨯⨯⨯where η is the efficiency of the boost converter, I IN(MAX) is the maximum input current, I OUT is the total current from all LED strings, and I RIPPLE is the inductor ripple current.The input peak current can be calculated by maximum input current plus half of inductor ripple current shown as following equation :I PEAK = 1.2 x I IN(MAX)Note that the saturated current of the inductor must be greater than I PEAK . The inductance can eventually be determined according to the following equation :Over Voltage ProtectionThe RT8511B equips Over Voltage Protection (OVP)function. When the voltage at the OVP pin reaches a threshold of approximately 1.2V , the MOSFET drive output will turn off. The MOSFET drive output will turn on again once the voltage at the OVP pin drops below the threshold.Thus, the output voltage can be clamped at a certain voltage level, as shown in the following equation :()())2IN OUT IN 2OUT OUT OSCV (V V L =0.4V I f η⨯⨯-⨯⨯⨯where f OSC is the switching frequency. For better efficiency,it is suggested to choose an inductor with small series resistance.Diode SelectionThe Schottky diode is a good choice for an asynchronous boost converter due to its small forward voltage. However,when selecting a Schottky diode, important parameters such as power dissipation, reverse voltage rating, and pulsating peak current must all be taken into consideration. A suitable Schottky diode's reverse voltage rating must be greater than the maximum output voltage,and its average current rating must exceed the average output current.Capacitor SelectionTwo 1μF ceramic input capacitors and two 1μF ceramic output capacitors are recommended for driving 10 WLEDs in series. For better voltage filtering, ceramic capacitors with low ESR are recommended. Note that the X5R and X7R types are suitable because of their wide voltage and temperature ranges.Thermal ConsiderationsFor continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula :P D(MAX) = (T J(MAX) − T A ) / θJAwhere T J(MAX) is the maximum junction temperature, T A is the ambient temperature, and θJA is the junction to ambient thermal resistance.For recommended operating condition specifications, the maximum junction temperature is 125°C. The junction to ambient thermal resistance, θJA , is layout dependent. For WDFN-8L 2x2 package, the thermal resistance, θJA , is 120°C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at T A = 25°C can be calculated by the following formulas :RT8511B10DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Figure 7. PCB Layout GuideLayout ConsiderationFor high frequency switching power supplies, the PCBlayout is important to obtain good regulation, high efficiency and stability. The following descriptions are the suggestions for better PCB layout.❝Input and output capacitors should be placed close to the IC and connected to the ground plane to reduce noise coupling.❝The GND and Exposed Pad should be connected to a strong ground plane for heat sinking and noise protection.❝The components L, D, C IN and C OUT must be placed as close as possible to reduce current loop. Keep the main current traces as possible as short and wide.❝The LX node of the DC/DC converter experiences is with high frequency voltage swings. It should be kept in a small area.❝The component R SET should be placed as close as possible to the IC and kept away from noisy devices.Figure 6. Derating Curve of Maximum Power DissipationP D(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for WDFN-8L 2X2 packageThe maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance, θJA . The derating curves in Figure 6 allow the designer to see the effect of rising ambient temperature on the maximum power dissipation.0.00.20.40.60.81.0255075100125Ambient Temperature (°C)M a x i m u m P o w e r D i s s i p a t i o n (W )IN as closed as possible to V I N pin for good filtering.directly from the output schottky diode to ground rather than across the WLEDs.The inductor should be placed as close as possible to theswitch pin to minimize the noise coupling into other circuits.LX node copper area should be minimized for reducing EMILocate R SET closeW-Type 8L DFN 2x2 PackageRichtek Technology Corporation14F, No. 8, Tai Yuen 1st Street, Chupei CityHsinchu, Taiwan, R.O.C.Tel: (8863)5526789Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.DS8511B-05 February 11。

8453紫外-可见分光光度计和紫外-可见分光光度计价格8453紫外-可见分光光度计 标题：8453紫外-可见分光光度计FTIR 、紫外-可见-近红外和荧光光谱 安捷伦针对生命科学研究、制药、材料科学、工业研发、质量控制和学术研究领域，提供了广泛的分子光谱解决方案。

凭借 60 多年的经验，安捷伦可提供专门满足您需要的 FTIR 、紫外-可见-近红外和荧光光谱产品，帮助您发现、表征和测试各种固体、液体以及有机和无机材料。

凭借功能强大的分析程序，可轻松获得可靠结果， 从而确保工作效率。

8453 紫外-可见分光光度计 Agilent 8453 紫外-可见分光光度计使用光电二极管阵列（PDA ），可以在不到一秒钟内同时测量从紫外到可见光的全部光谱。

PDA 技术具有卓越的可靠性和重现性。

安捷伦化学工作站软件具有强大的数据分析和数据存档功能，确保遵循优良实验室规范（GLP ）和药典规定。

特点 ...厂家：上海政泓 市场价格： 优惠价格：百度搜索联系Cary 60 紫外-可见分光光度计 标题：Cary 60 紫外-可见分光光度计FTIR 、紫外-可见-近红外和荧光光谱 安捷伦针对生命科学研究、制药、材料科学、工业研发、质量控制和学术研究领域，提供了广泛的分子光谱解决方案。

凭借 60 多年的经验，安捷伦可提供专门满足您需要的 FTIR 、紫外-可见-近红外和荧光光谱产品，帮助您发现、表征和测试各种固体、液体以及有机和无机材料。

凭借功能强大的分析程序，可轻松获得可靠结果， 从而确保工作效率。

Cary 60 紫外-可见分光光度计 安捷伦 Cary 60 紫外－可见分光光度计采用高效、精确和灵活的设计，旨在满足您当前和未来的挑战性测试需求。

安捷伦 Cary 60 紫外－可见分光光度计具有远程采样选件，以其成熟的性能和低购置使用成本带给您可信赖的结果。

特点 最低的购置使用成本&mdash;&mdash;脉冲... 厂家：上海政泓 市场价格： 优惠价格：百度搜索联系Cary 4000 紫外-可见分光光度计 标题：Cary 4000 紫外-可见分光光度计FTIR 、紫外-可见-近红外和荧光光谱 安捷伦针对生命科学研究、制药、材料科学、工业研发、质量控制和学术研究领域，提供了广泛的分子光谱解决方案。

SDM845简介SDM845是高通公司于2017年发布的一款移动处理器。

作为骁龙800系列的一员，SDM845采用了先进的制程工艺和创新的架构设计，为智能手机和其他移动设备提供出色的性能和功耗控制。

技术规格以下是SDM845的技术规格概述：•CPU：八核Kryo 385，最高主频达2.8 GHz•GPU：Adreno 630，支持Vulkan 1.1•DSP：Hexagon 685，提供丰富的音视频编解码和AI处理能力•ISP：Spectra 280，支持多摄像头配置和丰富的图像处理功能•LTE调制解调器：X20，支持LTE Cat 18下载和Cat 13上传•Wi-Fi：802.11ad，支持多Gbps的无线传输速度•其他：支持快速充电、多功能传感器集成等特性性能优势SDM845具有出色的性能优势，为用户带来更强大的移动体验。

以下是SDM845的几个重要特点：增强的处理能力SDM845采用了全新的Kryo 385架构，提供的八核CPU拥有更高的主频和更强的多线程性能。

这使得SDM845在运行复杂应用程序时能够更加流畅和高效地处理任务，提供更具吸引力的用户体验。

强大的图形性能Adreno 630 GPU是SDM845的重要组成部分，它提供出色的图形渲染和处理性能。

用户可以在SDM845设备上享受到流畅的游戏体验、高效的图像处理和高清视频播放。

先进的图像处理能力SDM845的Spectra 280 ISP支持多摄像头配置，可以实现更高质量的图像和视频捕捉。

该ISP还集成了多种图像增强和优化技术，包括高动态范围（HDR）、降噪和光学防抖等功能，进一步提升了拍照和摄像的质量。

高速的网络连接SDM845采用了先进的LTE调制解调器，支持LTE Cat 18下载和Cat 13上传。

这使得用户可以在SDM845设备上享受到更快速和稳定的移动数据连接，实现更快的下载和上传速度。

AI处理能力SDM845的Hexagon 685 DSP具备强大的AI处理能力，支持多种AI算法和框架，如TensorFlow和Caffe。

HT84XXX Magic Voice TMROM Selection TableThe HT84XXX series provides various voice capacity as shown below:Part No.HT84036HT84072HT84144HT84192HT84384ROM 768Kb 1536Kb 3072Kb 4096Kb 8192Kb Voice Length36sec72sec144sec192sec384secNote:The voice capacity is based on a sampling rate of 21Kb/s1April 26,2000General DescriptionThe HT84XXX family is a series of programma-ble speech synthesizers and tone generators de-signed for user-defined voice and melody applications.It provides various sampling rates and beats,tone levels,tempos for the speech synthesizer and melody generator.The HT84XXX series has two built-in high quality,current type D/A outputs with 16levels of vol-ume control.The user ¢s commands enable the user to program the powerful custom functionsuch as to build-in a tiny controller.The Magic Voice TM provides various operational functions similar to arithmetic operation,logic operation,branch decision,random counter,and a pro-grammable timer.The Magic Voice TM series are suitable for versatile voice and sound effect applications.The HT84XXX Magic Voice TM is Easy For-mat TM supported.Features·Operating voltage:2.4V~5.0V·Programmable tone melody generator ·ADPCM or m -law PCM,PCM synthesis ·Wide range of sampling rate for voice synthesis·Minimum sampling rate step:100Hz ·Voice melody mixed output·Programmable 2channels of melody mixed output·Programmable 2channels of voice mixed output·13kinds of melody beats·5octaves of tone level and 18tempos ·16levels of digital volume control ·Two current type D/A outputs ·Eight programmable I/O pins ·Four programmable input pins·Provides 36sec to 384sec of voice capacity ·Timer controller ·Voice fill-in function·Powerful user-defined functions ·Power-on initial setting ·28-pin SKDIP packageApplications·High-end educational leisure products ·Alert and warning systems·Speech synthesizers and sound effect generatorsMagic Voice TMis a trademark of Holtek SemiconductorInc.Easy Format TMis a trademark of Grow With Me,Inc.Block DiagramPin AssignmentHT84XXX2April 26,2000Pad AssignmentHT84036Chip size:2735´2105(m m)2*The IC substrate should be connected to VSS in the PCB layout artwork.3April26,2000Chip size:2735´2645(m m)2*The IC substrate should be connected to VSS in the PCB layout artwork.4April26,2000Chip size:2735´3735(m m)2*The IC substrate should be connected to VSS in the PCB layout artwork.5April26,2000Chip size:2735´4460(m m)2*The IC substrate should be connected to VSS in the PCB layout artwork.6April26,2000Chip size:2740´7350(m m)2*The IC substrate should be connected to VSS in the PCB layout artwork.7April26,2000Pad CoordinatesHT84036Unit:m m Pad No.X Y Pad No.X Y 1-1125.31114.7410320.15-774.242-1177.49-398.7911505.75-774.243-939.68-884.6112656.55-774.244-689.05-774.2413842.15-774.245-503.45-774.2414992.95-774.246-352.65-774.24151178.55-774.247-167.05-774.24161167.43-517.188-16.25-774.24171167.53-377.089169.35-774.24181167.53-35.96HT84072Unit:m m Pad No.X Y Pad No.X Y 1-1125.31-155.2610320.15-1044.242-1177.49-668.7911505.75-1044.243-939.68-1154.6112656.55-1044.244-689.05-1044.2413842.15-1044.245-503.45-1044.2414992.95-1044.246-352.65-1044.24151178.55-1044.247-167.05-1044.24161167.43-787.188-16.25-1044.24171167.53-647.089169.35-1044.24181167.53-305.96HT84144Unit:m m Pad No.X Y Pad No.X Y 1-1125.31-700.2610320.15-1589.242-1177.49-1213.7911505.75-1589.243-939.68-1699.6112656.55-1589.244-689.05-1589.2413842.15-1589.245-503.45-1589.2414992.95-1589.246-352.65-1589.24151178.55-1589.247-167.05-1589.24161167.43-1332.188-16.25-1589.24171167.53-1192.089169.35-1589.24181167.53-850.96HT84XXX8April 26,2000HT84192Unit:m mPad No.X Y Pad No.X Y1-1125.31-1062.7610320.15-1951.742-1177.49-1576.2911505.75-1951.743-939.68-2062.1112656.55-1951.744-689.05-1951.7413842.15-1951.745-503.45-1951.7414992.95-1951.746-352.65-1951.74151178.55-1951.747-167.05-1951.74161167.43-1694.688-16.25-1951.74171167.53-1554.589169.35-1951.74181167.53-1213.46HT84384Unit:m mPad No.X Y Pad No.X Y1-1121.81-2507.9610323.65-3396.942-1173.99-3021.4911509.25-3396.943-936.18-3507.3112660.05-3396.944-685.55-3396.9413845.65-3396.945-499.95-3396.9414996.45-3396.946-349.15-3396.94151182.05-3396.947-163.55-3396.94161170.93-3139.888-12.75-3396.94171171.03-2999.789172.85-3396.94181171.03-2658.66Pin DescriptionPin No.Pin Name I/O InternalConnection Description1~5,24~28NC¾¾No connection6VDD¾¾Positive power supply7AUD0O PMOSOpen Drain Audio output for driving an external transistor8AUD1O PMOSOpen Drain Audio output for driving an external transistor15~9PB1~PB7I/O Pull-high orCMOS Bidirectional I/O pinsCan be optioned as trigger inputs or LED outputs16PB0I/O Pull-high orCMOS Bidirectional I/O pinsCan be optioned as CDS interface with internal Schmitt trigger input9April26,2000Pin No.Pin Name I/O InternalConnection Description20~17PA0~PA3I Wake-upPull-high Trigger inputsCan also be configured as wake-up inputs21,22VSS¾¾Negative power supply,ground23OSC I¾Built-in RC oscillatorAn oscillator resistor is connected between OSC and VSSAbsolute Maximum RatingsSupply Voltage.................................-0.3V to6V Storage Temperature.................-50°C to125°C Input Voltage.................V SS-0.3V to V DD+0.3V Operating Temperature..............-20°C to70°CNote:These are stress ratings only.Stresses exceeding the range specified under²Absolute Maxi-mum Ratings²may cause substantial damage to the device.Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged expo-sure to extreme conditions may affect device reliability.Electrical Characteristics Ta=25°CSymbol ParameterTest ConditionsMin.Typ.Max.Unit V DD ConditionsV DD Operating Voltage¾¾ 2.4¾ 5.2VI STB Standby Current3V No load,system HALT¾13m A I DD Operating Current3V No load,f SYS=4MHz¾58mA I OL PB0~PB7Sink Current3V V OL=0.3V46¾mA I O Max.AUD1and AUD2Output Current3VV OH=0.6V-1.5-2¾mA f SYS System Frequency3V R OSC=240k W 3.6 4.0 4.4MHz10April26,2000Functional DescriptionThe Magic Voice TM series is a series of program-mable speech synthesizers and melody genera-tors.It provides various sampling rates and beats,tone levels,tempos for speech synthe-sizer and melody generator.For voice synthe-sizer,the Magic Voice TM provides8-bit PCM, 6-bit m-law PCM and4-bit ADPCM synthesis. In HT84XXX series,a mixed output of two channels PCM synthesis is allowed but only one channel ADPCM synthesis is allowed.For melody generator,the Magic Voice TM supports a tone melody and PCM melody generator and two channels mixed output for the whole series. The Magic Voice TM series build-in8program-mable I/O pins and4programmable input pins along with powerful user¢s command.The user¢s instructions are employed to develop new and customized functions for a wide vari-ety of innovative applications.Speech and melody analysisThe speech and melody sources of the Magic Voice TM can be recorded and edited from the PC sound card and media tools.Holtek¢s CAD tools first load a speech source file as.WAV or.PCM format,then transfer the speech file as PCM, LOG-PCM or ADPCM format,and finally save it to the internal mask ROM by changing a layer of the mask.The PCM format generates a higher sound quality whereas the ADPCM for-mat brings about a longer recording capacity. The melody source can either be in the.MID or in the.MLD format.The.MID file is the standard format of the win-dows media tools.The.MLD file is a text for-mat.After the.MID file is compiled,the.MLD file is automatically generated.The Magic Voice TM can support the following compression format of the voice.WAV and .PCM file:AD4,PCM8,m-law PCM.Current type D/A outputThe HT84XXX series supply two high accuracy current type D/A output pins for audio output. The output volume is changeable from0to15 digital levels by writing a value to the VOL-UME_n(n=1or2)registers.The D/A pins are PMOS open drain structure and ouput synthe-sized signals for driving a speaker through an external NPN transistor when the chip is ac-tive.However,it becomes floating when the chip is in the standby state.An8050type tran-sistor with h FE=150is recommended for the output driver of the D/A output pin.Melody/Tone generatorThe HT84XXX family has a built-in mel-ody/tone generator.The generator can generate 13different kinds of melody beats,5octaves of tone level,18tempos,and2channels mixed output.Of these components,the melody tempo is changeable and generates sound effects by writing a control value to the TEMPO register.The chip provides the following18tempos,13 beats,and5octaves for user¢s programming.·18tempos(Beats/Min.)68788293100105109114119125132139147156179192227310·13beats124,112,18,16,14,13,12,23,34,1,43,32,2·5octavesC1~B1,C2~B2,C3~B3,C4~B4,C5~B5PCM/ADPCM synthesizerThe HT84XXX family contains a PCM and ADPCM synthesizer.The synthesizer offers a wide range of sampling rates from4kHz to 24kHz for PCM synthesis and4kHz to16kHz for ADPCM synthesis.The sampling rate of the synthesizer can be changed by writing a control value to the sampling rate register.It also sup-ports a small variety of100Hz.For a higher performance sound quality,the PCM coding is required.But for a longer recording capacity, the ADPCM coding is recommended.11April26,2000The capability of the voice sampling rate for various voice compression format.f OSC PCM8m-lawPCM AD4 4M12kHz11kHz8kHz5M15kHz14kHz10kHz6M18kHz16kHz12kHz8M24kHz22kHz16kHzOscillator configurationThe HT84XXX series provides an RC oscillator for the system clock.The system oscillator stops in the standby state so as to reduce power consumption.For the oscillator circuit,an external resistor is required between OSC and VSS.The oscillator frequency is typically4MHz for an external re-sistor of240k W.The RC type of oscillator offers the most cost-effective solution,although the frequency of the oscillation may vary with tem-perature and the chip itself due to process vari-ation.R OSCf OSC HT84EVA HT84P00IC4M180k W240k W240k W5M150k W210k W210k W6M120k W180k W180k W8M91k W150k W150k WMask optionsThe following options have to be defined to en-sure a proper system functioning:·Pull-high resistor:33k W/98k W(3V)·Keydebouncetime:0ms~255ms(f OSC=4MHz)12April26,2000Application CircuitsBasic applicationHT84XXX13November 8,199914April26,200015April26,2000Note:In Easy64mode,only falling edge trigger can be used in input stateIn Easy64mode,the path command²TRn?L:pathname²and²TRn?H:pathname²areinvalid16April26,2000Push-pull amplifilter applicationOP amplifilter application17April26,2000Application NotesEasy Format TMThe syntax of the Easy Format TM consists of four major parts.They are format and audio file decla-ration part,input states declaration part,output states declaration part and path command part. The architecture of the Easy Format TM program is shown as follows:EASY n;Comment;Format and audio file declaration part....Stereo/Mono;Two AUD output or single AUD outputINPUT STATES;Input states declaration part....OUTPUT STATES;Output states declaration part....PATHS;Path command part....Note:Easy Format TM is a trademark of Grow With Me,Inc.Format and voice/melody file declarationIn this area the format and audio file declaration are used to define the number of input and output as well as declare the audio format.Syntax:EASY nThe EASY n command is used to define the maximum number of trigger input in the application cir-cuit.The alphanumeric n represents the number of trigger input where n has the choice from4to64 with a scale4.However,the determination of trigger input reflects the number of output.The rela-tion of the number of I/O is shown in the following table.EASY n TRn OUTnEASY4TR1,TR2,TR3,TR4OUT1,OUT2,....,OUT7EASY8TR1,TR2,....,TR8OUT1,OUT2,....,OUT6EASY12TR1,TR2,....,TR12OUT1,OUT2,....,OUT5EASY16TR1,TR2,....,TR16OUT1,OUT2,....,OUT4EASY20TR1,TR2,....,TR20OUT1,OUT2,OUT3EASY24TR1,TR2,....,TR24OUT1,OUT2EASY28TR1,TR2,....,TR28OUT1EASY32TR1,TR2,....,TR32EASY64TR1,TR2,....,TR64*refer to the application circuit18April26,2000Syntax:voice_file/compression_methodmelody_filetone_fileThe source audio files must be included in your Easy program.The audio files include the voice files with the extended name.PCM or.WAV,the melody files with.MID or.MLD format and the tone files with Holtek¢s.HT8format.The compression methods of voice files have three options such as m-law PCM,PCM8and AD4.Example:voice1.wav/pcm8;#0voice files declarationvoice2.pcm/ad4;#1melody1.mid;#2melody files declarationmelody2.mld;#3tone1.ht8;#4tone files declarationStereo/Mono:The audio output selection.If the audio output is declared as²Stereo²,the channel1voice will output via AUD1and the channel2voice will output via AUD2.If theaudio output is declared as²Mono²,the channel1and channel2voices will mixedlyoutput via AUD1and AUD2is invalid.The default declaration is²Mono².The au-dio file compressed by AD4cannot output through channel2.If the melody file out-puts through channel2,the melody file cannot include any channel1instructions.Input states declarationSyntax:INPUT STATES;TRn....statename:[rising_edge_path][/falling_edge_path]....The bracket[]is denoted as optional existence.If the path is assigned as²X²,the input trigger signal is ignored.Unassigned trigger paths will automatically be assigned as²X².When TRn detects a ris-ing edge or a falling edge signal,the path name of the rising edge path or falling edge path will be exe-cuted.The statename and path label can be any name defined by the user.The²/²denotes the falling edge path.The maximum number of statename are256and the maximum number of different pathname are128.Example:INPUT STATES;input states declaration;TR1TR2TR3Run:P12Start/P13Stop P14Go/P15Pausewhere²Run²denotes the input statename and²P12Start²,²/P13Stop²,²P14Go²and²/P15Pause²are all pathnames.When a rising edge signal triggers the TR1,then the path of P12Start will be exe-cuted.And if a falling edge signal triggers the TR1,then the signal is ignored,etc.19April26,2000Output states declarationSyntax:OUTPUT STATES;OUTn....statename:OutputMode....The possible output mode are listed and described on the following table.The maximum number of output state are256.Output Mode DescriptionX Set OUTn to input mode with pull-high resistorH Set the output pins to logic highL Set the output pins to logic lowP+Send a(+)pulse train to output pinsP-Send a(-)pulse train to output pinsSP+Send a plus single pulse to output pinsSP-Send a minus single pulse to output pinsExample:OUTPUT STATES;output states declaration;OUT1OUT2SirenOn:P+Lwhere²SirenOn²denotes the output statename.Executing²SirenOn²in the path command will send a positive pulse train to PB0and send a logic low to PB1.Path command definitionSyntax:PATHSpathname:path command....The pathname is defined according to the user¢s desire.The elements of the path command are listed and described on the following table.Each path equation consists of many path commands and each command is separated by one or more space.In order to increase the program readability if the path commands exceed the screen display you can break the path command to the next line and put the symbol²&²in front of the new line.20April26,2000Path_Command DescriptionInput statename To active input stateOutput statename To active output statePathname To execute the specified pathVAR=pathname Define the variable pathVAR To execute the variable pathVolume_1=n Define the volume1value(n=0~15)Volume_2=n Define the volume2value(n=0~15)Samplerate_1=n Define the sampling rate1valueSamplerate_2=n Define the sampling rate2valueDelay(n)To delay n(min=0.1s)(n=0.1~65),f OSC=4MHzTRn?H:pathname If TRn is logic High,then the pathname is executed.TRn?L:pathname If TRn is logic Low,then the pathname is executed.Flashrate=n Set the output pulse rate to²n²pulses per second,where n can beassigned as1,2,3,...,12FlashrateT=n Set the output pulse rate after the melody tempo,n=1,2,3,...,12FlashrateV=n Set the output pulse rate after the volume,n=1,2,...,12END Enter power down modeMi=PB Read Port B to MiSTOP1Stop the sound of channel1playbackSTOP2Stop the sound of channel2playbackMi=data Set the contents of Mi to be dataMi=Mj Set the contents Mi to be MjMi(bn)=1or0Set bit bn to be1or0,bn=0~7Mi=Mj+data Add immediate data with Mj to MiMi=Mi+Mj Add Mi with Mj to MiMi=Mj.AND.data And immediate data with Mj to Mi,data=0~255Mi=Mj.OR.data OR immediate data with Mj to Mi,data=0~255Mi=Mj.XOR.data XOR immediate data with Mj to Mi,data=0~255Mi?data:pathname If Mi=data then pathname is executedMi?Mj:pathname If Mi=Mj then pathname is executed.Mi(bn)?1:pathname If the bit bn of Mi is²1²then the pathname is executed.Mi(bn)?0:pathname If the bit bn of Mi is²0²then the pathname is executed.21April26,2000Path_Command DescriptionMi:[Path1,Path2, Path3,....Pathn]Path1is executed when Mi=1; Path2is executed when Mi=2; ....Pathn is executed when Mi=nRandom(Mi)Get a random code and put it to MiTimert:timer_path Initial the timer.If time out then timer_path is executed,t=0.1~65sec. TimerON Start the timer counterTimerOFF Stop timer countern*soundfile,n*#N or #N Play the soundfile n times#N is the N¢th soundfile which is defined in the audio file declaration part. The starting number is0[n*soundfile]or [repeat*soundfile]Play the soundfile n times or repeatedly via channel2and simultaneously execute the next path command.Wait Stop executing the next path command until the channel2soundfile isterminated.Note:The n of TRn ranges from1to32²Volume_1=15²is equal to²Volume=15²²Samplerate_1=4000²is equal to²Samplerate=4000²,²4000²means that the sampling rate is 4kHz.The Mi,Mj are working registers(i,j=0,1,2,...,10),the M0~M4are dedicated for users,the others are shared with VAR and Timer command.Register Command CommentM0~M4¾Normal registerM5,M6VAR If the VAR instruction is used,the M5,M6will be invalid.M7~M10Timer If the Timer instruction are used,the M7~M10will be in-valid.Example:EASY4INPUT STATES;TR1TR2TR3TR4start:/P1X X XPATHSPOWERON:start ENDwhere²POWERON²is a reserved pathname and provides the initial setting.When the power is turned on,a falling edge trigger in TR1is accepted and others are all ignored.22April26,2000Application 1¾One shot,nonretriggerable EASY 4voice.wav/pcm8;#0sound file declaration INPUT STATES ;TR1TR2TR3TR4state1:/path1X X X busy:XXXXPATHS POWERON:state1END path1:busy1*voicestate1ENDApplication 2¾One shot,retriggerable by itself EASY 4voice.wav/pcm8;#0sound file declaration INPUT STATES ;TR1TR2TR3TR4state1:/path1XXXPATHS POWERON:state1END path1:1*voiceENDHT84XXX23April 26,2000EASY4voice1.wav/pcm8;#0sound file declarationvoice2.wav/pcm8;#1voice3.wav/pcm8;#2voice4.wav/pcm8;#3INPUT STATES;TR1TR2TR3TR4state0:/path1/path2/path3/path4state1:X/path2/path3/path4state2:/path1X/path3/path4state3:/path1/path2X/path4state4:/path1/path2/path3XPATHSPOWERON:state0ENDpath1:state1#0state0ENDpath2:state2#1state0ENDpath3:state3#2state0ENDpath4:state4#3state0END24April26,2000EASY4voice1.wav/pcm8;#0sound file declarationvoice2.wav/pcm8;#1voice3.wav/pcm8;#2voice4.wav/pcm8;#3INPUT STATES;TR1TR2TR3TR4state0:/path1/path2/path3/path4state1:path11/path2/path3/path4state2:/path1path11/path3/path4state3:/path1/path2path11/path4state4:/path1/path2/path3path11PATHSPOWERON:state0ENDpath1:state1#0path1path2:state2#1path2path3:state3#2path3path4:state4#3path4path11:state0END25April26,2000Application 5¾LED output,direct mode EASY 4voice1.wav/pcm8;#0sound file declaration INPUT STATES ;TR1TR2TR3TR4state0:/path1X XXOUTPUT STATES;OUT 12alarm:P+L standby:L H turnoff:XXPATHS POWERON:state0flashrate=6Hz END path1:alarm#0standbydelay(2)turnoffENDApplication 6¾LED output matrix mode EASY 4INPUT STATES ;TR1state0:/path0OUTPUT STATES ;OUT1OUT2OUT3OUT4OUT5OUT6OUT7LED1:P+L L L H H H LED2:L P+L L H H H LED3:L L P+L H H H LED4:P+L L H L H H LED5:L P+L H L H H LED6:L L P+H L H H LED7:P+L L H H L H LED8:L P+L H H L H LED9:L L P+H H L H LED10:P+L L H H H L LED11:L P+L H H H L LED12:L L P+H H H L turnoff:XXXXXXXHT84XXX26April 26,2000PATHSPOWERON:state0M0=0flashrate=3Hz ENDpath0:M0=M0+1&M0:[P1,P2,P3,P4,P5,P6,P7,P8,P9,P10,P11,P12]P1:LED1delay(2)turnoff ENDP2:LED2delay(2)turnoff ENDP3:LED3delay(2)turnoff ENDP4:LED4delay(2)turnoff ENDP5:LED5delay(2)turnoff ENDP6:LED6delay(2)turnoff ENDP7:LED7delay(2)turnoff ENDP8:LED8delay(2)turnoff ENDP9:LED9delay(2)turnoff ENDP10:LED10delay(2)turnoff ENDP11:LED11delay(2)turnoff ENDP12:M0=0LED12delay(2)turnoff END27April26,2000Application7¾Police carThis is a full program application example to demonstrate how Easy Format handles a complicated design requirement.All the work is to be done on a single page.There are four input trigger buttons and two output pins to drive two LEDs.·BUTTON#1:Turn ON(START)or OFF the engine.·BUTTON#2:Gas pedal to give ACCELERATION sound from idle and then keep on at a steady running sound.·BUTTON#3:SIREN sound On/Off:toggle ON and toggle Off.·BUTTON#4:BRAKE,triggers deceleration sound and then brings the car to idle.·LEDs OUTPUTs:Blinks in opposite phase when the Siren sound is on.That is when one light is on, the other light is off in an alternating pattern.·TIME OUT REQUIREMENTS:every sound needs to be automatically shut down after a specified period if no more trigger signal is received.Easy Format TM application example:Police Car flow chart28April26,2000EASY4**********************************************************************;*voice file define**********************************************************************StartSnd.wav/ad4IdleSnd.wav/ad4AccelSnd.wav/ad4RunSnd.wav/ad4DecelSnd.wav/ad4SirenSnd.wav/ad4SiRunSnd.wav/ad4*********************************************************************;*I/O States*********************************************************************INPUT STATES;TR1TR2TR3TR4;Start Accel Siren BrakeStopCar:/P12Start/P13Accel/P14SirenOn XIdle:/P21Start/P23Accel/P25SirenOn XRun:X X/P35SirenOn/P32BrakeSiren X/P45Accel/P41SirenOff XSirenRun X X/P53SirenOff/P54BrakeOUTPUT STATES;OUT1OUT2SirenOn:P+P-SirenOff:H H*********************************************************************;*Paths*********************************************************************PathsPOWERON:StopCar SirenOff FLASHRATE=6Hz ENDP12Start:Idle1*StartSnd10*IdleSnd PowerDownP21Start:StopCar ENDP13Accel:Run2*IdleSnd1*AccelSnd20*RunSnd&PowerDown29April26,2000P14SirenOn:Siren SirenOn10*SirenSnd PowerDownP41SirenOff:StopCar SirenOff ENDP23Accel:Run1*AccelSnd20*RunSnd PowerDownP32Brake:Idle1*DecelSnd10*idleSnd PowerDownP25SirenOn:1*AccelSnd SirenRun SirenOn10*SiRunSnd PowerDownP35SirenOn:SirenRun SirenOn10*SiRunSond PowerDownP53SirenOff:SirenOff Run20*RunSnd PowerDownP45Accel:P25SirenOnP54Brake:1*DecelSnd Siren SirenOn10*SirenSnd&PowerDownPowerDown:SirenOff StopCar End30April26,2000HT84XXX31April 26,2000Copyright ã2000by HOLTEK SEMICONDUCTOR INC.The information appearing in this Data Sheet is believed to be accurate at the time of publication.However,Holtek assumes no responsibility arising from the use of the specifications described.The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification,nor recommends the use of its products for application that may pres-ent a risk to human life due to malfunction or otherwise.Holtek reserves the right to alter its products without prior notification.For the most up-to-date information,please visit our web site at .Holtek Semiconductor Inc.(Headquarters)No.3Creation Rd.II,Science-based Industrial Park,Hsinchu,Taiwan,R.O.C.Tel:886-3-563-1999Fax:886-3-563-1189Holtek Semiconductor Inc.(Taipei Office)5F,No.576,Sec.7Chung Hsiao E.Rd.,Taipei,Taiwan,R.O.C.Tel:886-2-2782-9635Fax:886-2-2782-9636Fax:886-2-2782-7128(International sales hotline)Holtek Semiconductor (Hong Kong)Ltd.RM.711,Tower 2,Cheung Sha Wan Plaza,833Cheung Sha Wan Rd.,Kowloon,Hong Kong Tel:852-2-745-8288Fax:852-2-742-8657元器件交易网。