SEN-R-1050-038中文资料

存储温度 工作温度
1
工业以太网交换机
工作湿度
通过认证
EMI EMS 冲击 跌落 震动 安全等级 MTBF (Hours) (MIL-HDBK-217F2, GB, GC, 25℃ ) 质保期
订购信息 I ES - 1 A A B A
代码定义 选项
10/100Base-T(X) 端口数 - 08: 8口 - 05: 5口
1-118
ww w.ori n g-n etw o r king . co m
以太网设备连接示意图
1-116
ww w.ori n g-n etw o r king . co m
工业以太网交换机 非网管型以太网交换机
.0/cn/Feb, 2012
尺寸
公司简介 2012产品概述 垂直市场应用
工业以太网交换机
工业接口转换器
(Unit=mm)
工业串口服务器
规格
工业无线接入点 ORing交换机型号 物理端口 IES-1080A IES-1050A
其它端口数 - 0: 0口
型号名称 供应型号 IES-1080A IES-1050A 装箱清单 �IES-1050A/1080A �快速安装指南 �导轨式套件 �壁挂式套件
描述 工业8口超薄型非网管型以太网交换机 含8x10/100Base-T(X)电口 工业5口超薄型非网管型以太网交换机 含5x10/100Base-T(X)电口 可选组件(可单独购买) �DR-45系列, 45W导轨式供电 �DR-75系列, 75W导轨式供电 �DR-120系列, 120W导轨式供电
5
工业蜂窝VPN路由器
以太网规范 MAC地址表 处理方式
LED指示灯
工业USB服务器

S105T01/S105T02S205T01/S205T02s Absolute Maximum Ratingss Outline DimensionsLow Profile TypeSolid State Relayss Features1. Programmable controllers2. Air conditioners3. Copiers4. Automatic vending machiness Applications1. Low profile type (height : 16mm)2. Built-in zero-cross circuit (S105T02/S205T02)3. RMS ON-state current I T : MAX. 5Arms4. Approved by TÜV, No. R9750790 (S205TY1/S205TY2)Input-Output : Basic Insulation*1 Refer to Fig.2, Fig.3*2 60Hz sine wave, start at Tj=25°C*3 Isolation voltage measuring method(1) Dielectric withstand voltage tester with zero cross circuit shall be used.(2) The applied voltage waveform shall be sine wave.(3) Voltage shall be applied between input and output.(Input and output terminals shall be shorted respectively.)(4) AC 60Hz, 1min, 40 to 60%RH.*4 For 10sParameter Symbol Rating UnitI FV R506HzA/µsInputOutput400600400600VVVmAA rmsAf55050dI T/dtI TV DRMI surgeV DSM45 to 653.0260V isoOperating temperatureOperating frequencyRepetitive peakOFF-state voltageCritical rate of rise of ON-state currentNon-repetitive peakOFF-state voltageForward currentRMS ON-state currentPeak one cycle surge currentReverse voltageT opr−30 to +125−25 to +100kV rmsT solStorage temperatureIsolation voltageSoldering temperatureT stg°C°C°C*3*4*2*1(Ta=25°C)S105T01S105T02S205T02S205T01S105T01S105T02S205T01S205T02Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/s Model line-upsFor 100V lines For 200V linesNo zero-cross circuitBuilt-in zero-cross circuitS105T01S105T02S205T01S205T02Fig.1 Forward Current vs. AmbientTemperatures Electro-optical CharacteristicsParameter Symbol MIN.TYP.MAX.Unit Forward voltage Reverse currentON-state voltage Critical rate of rise of OFF-state voltage Critical rate of rise of OFF-state voltage at commutaion Isolation resistanceV F I R −−−−−−−−−−−−I F =20mA 1.4−−−−−−−−−−−−−1.2545ΩV T I FT dV/dt(dV/dt)C R iso t ont off R th (j-c)R th (j-a)V R =3V DC500V, 40 to 60%RH I T =2A rms , Resistance load, I F =20mAV D =12V, R L =30ΩV D =2/3V DRMT j =125°C, V D =2/3V DRM , dI t /dt =−2.5A/ms 1.5−−−−8111010101×10101×10−4305V A A V/µs V/µs V rms mA msms°C/W°C/W Minimum trigger current Turn-ontime Turn-off timeThermal resistance(Between junction and case)Thermal resistance(Between junction and ambience)I n p u tO u t p u tT r a n s f e r c h a r a c t e r i s t i c s(Ta =25°C)Conditions −−V OX V D =6V, R L =30ΩI F =8mA35V Zero cross voltage Repetitive peak OFF-state current −−I DRM V D =V DRM1×10−4Holding current−−−I H 50mA S105T01/S205T01S105T01S105T02/S205T02S105T02S205T01S205T02S105T02/S205T02S105T01S105T02S205T01S205T02V D =100V rms , AC50Hz, I T =2A rms ,V D =200V rms , AC50Hz, I T =2A rms ,Resistance load, I F =20mA V D =100V rms , AC50Hz, I T =2A rms ,Resistance load, I F =20mA Resistance load, I F =20mA Resistance load, I F =20mAV D =200V rms , AC50Hz, I T =2A rms ,F o r w a r d c u r r e n t I F (m A )Ambient temperature T a (°C)060−2502550751001255040302010Fig.2 RMS ON-state Current vs. AmbientTemperatureFig.3 RMS ON-state Current vs. CaseTemperatureFig.4 Forward Current vs. Forward VoltageR M S O N -s t a t e c u r r e n t I T (A r m s )Ambient temperature T a (°C)0654321(1)With infinite heat sink(2)With heat sink (200×200×2mm Al plate)(3)With heat sink (100×100×2mm Al plate)(4)With heat sink (50×50×2mm Al plate)(5)Without heat sink(Note)With the Al heat sink set up vertically, tighten thedevice with a torque of 0.4N•m and apply thermal conductive silicone grease on the mounting face of heat sink. Forced cooling shall not be carried out.(Please use an isolation sheet if necessary.)R M S O N -s t a t e c u r r e n t I T (A r m s )Case temperature T C (°C) 06−25025507510012554321Fig.5 Surge Current vs. Power-on CycleS u r g e c u r r e n tI s u r g e (A )Power-on cycle (Times)0504030201060F o r w a r d c u r r e n t I F (m A )Forward voltage V F (mA)5010510.50.1Fig.8 Maximum ON-state Power Dissipationvs. RMS ON-state Current (Typical Value)Fig.9 Repetitive Peak OFF-state Current vs.Ambient TemperatureFig.10 Repetitive Peak OFF-state Current vs.Ambient TemperatureM a x i m u m O N -s t a t e p o w e r d i s s i p a t i o n (W )RMS ON-state current I T (A)07654321 R e p e t i t i v e p e a k O F F -s t a t e c u r r e n t I D R M (A )Ambient temperature T a (°C)10−910−310−410−510−610−710−8 R e p e t i t i v e p e a k O F F -s t a t e c u r r e n t I D R M (A )Ambient temperature T a (°C)10−910−310−410−510−610−710−8Fig.6 Minimum Trigger Current vs. AmbientTemperature (Typical Value)Fig.7 Minimum Trigger Current vs. AmbientTemperature (Typical Value)M i n i m u m t r i g g er c u r r e n t I F T (m A )Ambient temperature T a (°C)0108642M i n i m u m t r i g g e rc u r r e n t I F T (m A )Ambient temperature T a (°C)0108642Application CircuitsNOTICEq The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.q Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.q Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions:(i) The devices in this publication are designed for use in general electronic equipment designs such as:--- Personal computers--- Office automation equipment--- Telecommunication equipment [terminal]--- Test and measurement equipment--- Industrial control--- Audio visual equipment--- Consumer electronics(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as:--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)--- Traffic signals--- Gas leakage sensor breakers--- Alarm equipment--- Various safety devices, etc.(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:--- Space applications--- Telecommunication equipment [trunk lines]--- Nuclear power control equipment--- Medical and other life support equipment (e.g., scuba).q Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use.q If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices.q This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.q Contact and consult with a SHARP representative if there are any questions about the contents of this publication.。

39 38 37 36 35 34 33 32 31 30 29
TP26 TP27 V DD VREF N.C. CON3 COP3 IVP3 IVP2 IVP1 GND
40 41 42 43 44 1 2 3 4 5 6
28 27 26 25 24 23 22 21 20 19 18

CINP CIPP CONP COPP N.C. IIP3 IIN3 IIP2 IIN2 IIP1 IIN1
Connections for inner loop capacitors of A/D converters
Connection for current setting resistor Test pin. Connect to VSS Manufacturer's test pins (Leave unconnected)
sames
元器件交易网
#
-25 -25
+25 +25 VSS+1
µA µA V V Hz Hz
VDD-1 0 0 64 180
Recommended crystal: TV colour burst crystal, f = 3.5795 MHz With R = 24 kΩ -IR 45 50 55 µA connected to VSS VR 1.1 1.3 V Referred to VSS
n
n n n
n
n
DESCRIPTION The SAMES SA9105F Three Phase bidirectional Power/Energy metering integrated circuit generates pulse rate outputs for positive and negative energy directions, the frequency of which is proportional to the power consumption. The SA9105F performs the calculation for active power. The method of calculation takes the power factor into account. Energy consumption is determined by the power measurement being integrated over time. This innovative universal three phase power/ energy metering integrated circuit is ideally suited for applications such as residential and industrial energy metering and control. The SA9105F integrated circuit is available in 40 pin dual-in-line plastic (DIP-40), as well as in 44 pin plastic leaded chip carrier (PLCC-44) package types.

NOTES: ASSEMBLY CONSISTS OF 1 BOOT, MAT'L APM RUBRGLAS , 1 FRAME MAT'L C.R.S. ZINC PLATED WITH CHROMATE FINISH, &6#6-32 APM SEELSKREWS LENGTH =3/8 UNLESS OTHERWISE SPECIFIED TOLERANCES: UNLESS OTHERWISE NOTED 1/32 I S. GOK CHANGED TO Ø0.149", DELETED TO "DESIGN TO MEET MIL-5423" and DELETED TO SEELSKREW INFORMATION S. GOK H SCREW QUANTITY CHANGED G CAD COMPUTER GENERATED T.C. ADDED NOTES F DESCRIPTION REV. MAXIMUM AND MINIMUM MEASURECIRCUIT BREAKER BOOT, ENG. MENTS ARE STATED DIRECTLY ON EACH DIMENSION. TOGGLE, WIDE ANGLE, DWN. J. PALUMBO MAT'L: RUBRGLASS T (3 POLES) J. CELLA CHKD.
FINISH: GRADE 50 TRANSPARENT
APM-HEXSEAL CORPORATION
SCALE 1:1
DWG. NO.
CONFORMS TO A-A-59588 CL III
HE-1050
THIS DRAWING COVERS PROPRIETARY ITEM AND IS THE PROPERTY OF THE APM-HEXSEAL CORPORATION. THIS DRAWING IS NOT TO BE COPIED OR USED WITHOUT THE WRITTEN APPROVAL OF AN OFFICER OF THE APM-HEXSEAL CORPORATION.