第五章应用指令5.1 数据传送指令5-15.1.1 MOV, MOVP, DMOV, DMOVP ..................................................... 5-15.1.2 CMOV, CMOVP, DCMOV, DCMOVP .......................................... 5-35.1.3 GMOV, GMOVP .................................................................................. 5-65.1.4 FMOV, FMOVP ................................................................................... 5-85.1.5 BMOV, BMOVP ................................................................................ 5-10 5.2 转换指令5-125.1.1 BCD, BCDP, DBCD, DBCDP ......................................................... 5-125.2.2 BIN, BINP, DBIN, DBINP .............................................................. 5-15 5.3 比拟指令5-185.3.1 CMP, CMPP, DCMP, DCMPP ...................................................... 5-185.3.2 TCMP, TCMPP, DTCMP, DTCMPP .............................................. 5-225.3.3 LD ( =, >, <, >=, <=, <> ) ..................................................... 5-245.3.4 AND ( =, >, <, >=, <=, <>) ................................................... 5-255.3.5 OR ( =, >, <, >=, <=, <>) ...................................................... 5-27 5.4 增加/减少运算5-295.4.1 INC, INCP, DINC, DINCP ............................................................. 5-295.4.2 DEC, DECP, DDEC, DDECP .......................................................... 5-31 5.5 回转指令5-345.5.1 ROL, ROLP, DROL, DROLP .......................................................... 5-345.5.2 ROR, RORP, DROR, DRORP ....................................................... 5-375.5.3 RCL, RCLP, DRCL, DRCLP ............................................................ 5-395.5.4 RCR, RCRP, DRCR, DRCRP .......................................................... 5-425.6 移位指令5-445.6.1 BSFT, BSFTP ...................................................................................... 5-445.6.2 WSFT, WSFTP ................................................................................... 5-465.6.3 SR.......................................................................................................... 5-48 5.7 交换指令5-515.7.1 XCHG, XCHGP, DXCHG, DXCHGP ............................................ 5-51 5.8 BIN 算术指令5-535.8.1 ADD, ADDP, DADD, DADDP ...................................................... 5-535.8.2 SUB, SUBP, DSUB, DSUBP .......................................................... 5-555.8.3 MUL, MULP, DMUL, DMULP ..................................................... 5-575.8.4 MULS, MULSP, DMULS, DMULSP ............................................ 5-605.8.5 DIV, DIVP, DDIV, DDIVP ............................................................... 5-635.8.6 DIVS, DIVSP, DDIVS, DDIVSP .................................................... 5-65 5.9 BCD算术指令5-685.9.1 ADDB, ADDBP, DADDB, DADDBP ........................................... 5-685.9.2 SUBB, SUBBP, DSUBB, DSUBBP ................................................ 5-705.9.3 MULB, MULBP, DMULB, DMULBP ........................................... 5-745.9.4 DIVB, DIVBP, DDIVB, DDIVBP ................................................... 5-76 5.10 逻辑算术指令5-795.10.1 WAND, WANDP, DWAND, DWANDP ..................................... 5-795.10.2 WOR, WORP, DWOR, DWORP ................................................. 5-825.10.3 WXOR, WXORP, DWXOR, DWXORP ....................................... 5-845.10.4 WXNR, WXNRP, DWXNR, DWXNRP ...................................... 5-86 5.11 数据处理指令5-885.11.1 SEG, SEGP ......................................................................................... 5-895.11.2 ASC, ASCP ......................................................................................... 5-925.11.3 BSUM, BSUMP, DBSUM, DBSUMP .......................................... 5-945.11.4 ENCO, ENCOP .................................................................................. 5-975.11.5 DECO, DECOP ................................................................................ 5-1005.11.6 FILR, FILRP, DFILR, DFILRP ....................................................... 5-1025.11.7 FILW, FILWP, DFILW, DFILWP .................................................. 5-1055.11.8 DIS, DISP ......................................................................................... 5-1075.11.9 UNI, UNIP ........................................................................................ 5-1105.11.10 IORF, IORFP .................................................................................... 5-112 5.12 系统指令5-1145.12.1 FALS ................................................................................................... 5-1145.12.2 DUTY ................................................................................................. 5-1155.12.3 WDT, WDTP .................................................................................... 5-1185.12.4 OUTOFF ............................................................................................ 5-1205.12.5 STOP .................................................................................................. 5-121 5.13 跳转指令5-1225.13.1 JMP, JME .......................................................................................... 5-1225.13.2 CALL, CALLP, SBRT, RET ............................................................ 5-124 5.14 循环指令5-1265.14.1 FOR, NEXT ...................................................................................... 5-1275.14.2 BREAK ............................................................................................... 5-128 5.15 标志指令5-1295.15.1 STC, CLC ........................................................................................... 5-1295.15.2 CLE ..................................................................................................... 5-131 5.16 特殊模块指令5-1325.16.1 GET, GETP ........................................................................................ 5-1335.16.2 PUT, PUTP ....................................................................................... 5-135 5.17 数据连接指令5-1375.17.1 READ ................................................................................................. 5-1385.17.2 WRITE ................................................................................................ 5-1415.17.3 RGET .................................................................................................. 5-1435.17.4 RPUT .................................................................................................. 5-1475.17.5 STATUS .............................................................................................. 5-150 5.18 中断指令5-1525.18.1 EI, DI .................................................................................................. 5-1525.18.2 TDINT, IRET ..................................................................................... 5-1535.18.3 INT, IRET .......................................................................................... 5-1555.19 符号反转指令5-1565.19.1 NEG, NEGP, DNEG, DNEGP...................................................... 5-156 5.20 位接触指令5-1595.20.1 BLD, BLDN ....................................................................................... 5-1595.20.2 BAND, BANDN .............................................................................. 5-1605.20.3 BOR, BORN ..................................................................................... 5-1615.20.4 BOUT ................................................................................................. 5-1635.20.5 BSET, BRST ...................................................................................... 5-164 5.21 计算机连接模块指令5-1655.21.1 SND .................................................................................................... 5-1655.21.2 RCV .................................................................................................... 5-166 5.22 高速计数器指令5-1675.22.1 HST ..................................................................................................... 5-1675.22.2 HSC .................................................................................................... 5-170 5.23 RS-485 通讯指令5-1715.23.1 RECV .................................................................................................. 5-1725.23.2 SEND ................................................................................................. 5-1735应用指令5.1.1MOV, MOVP, DMOV, DMOVP1)功能-MOV(P) : 传送在[ S ]中的16位数据至指定的设备[ D ].16 位- DMOV(P) : 传送在指定设备[ S+1, S ]中的32位数据到指定的设备[ D+1, D ].-2) 编程举例在P020检测到一个上升沿，‘h70F3’被传送到P04。
M54HC4543M74HC4543February 1993BCD TO 7SEGMENT LATCH/DECODER/LCD DRIVERB1R(Plastic Package)ORDER CODES :M54HC4543F1R M74HC4543M1R M74HC4543B1R M74HC4543C1RF1R(Ceramic Package)M1R(Micro Package)C1R (Chip Carrier)PIN CONNECTIONS (top view)NC =No Internal Connecti o nDESCRIPTION.HIGH SPEEDt W =7ns (TYP.)AT V CC =5V .LOW POWER DISSIPATION I CC =4µA (MAX.)AT T A =25°C .HIGH NOISE IMMUNITYV NIH =V NIL =28%V CC (MIN.).OUTPUT DRIVE CAPABILITY 10LSTTL LOADS.SYMMETRICAL OUTPUT IMPEDANCE |I OH |=I OL =4mA (MIN.).BALANCED PROPAGATION DELAYS t PLH =t PHL.WIDE OPERATING VOLTAGE RANGE V CC (OPR)=2V TO 6V.PIN AND FUNCTION COMPATIBLE WITH 4543BThe M54/74HC4543is a high speed CMOS BCD-TO-7SEGMENT DECODER WITH LCD DRIVERfabricated in silicon gate C 2MOS technology.High speed latch and decode operation 120times as fast as standard CMOS 4511B while CMOS low power consumption in maintained.This device consist of BCD-TO-7segment decoder with a BCD input latch and a 7-segment driver for a liquid crystal display (LCD).When any illegal BCD input signal is applied or input BI is held high,the display isblanked.When driving LCDs,a common square wave signal should be applied not only to the PH input of this device but also to the electrically common backplane of the dis-play.For other types of readouts,such as light-emit-ting diode (LED),some additional drivers,such as a transistor array is required.All inputs are equipped with protection circuits against static discharge and transient excess voltage.1/12M54/M74HC4543TRUTH TABLEINPUTS OUTPUTDDISPLAY MODE LD BI PH D C B A a b c d e f gX H L X X X X L L L L L L L BLANKH L L L L L L H H H H H H L0H L L L L L H L H H L L L L1H L L L L H L H H L H H L H2H L L L L H H H H H H L L H3H L L L H L L L H H L L H H4H L L L H L H H L H H L H H5H L L L H H L H L H H H H H6H L L L H H H H H H L L L L7H L L H L L L H H H H H H H8H L L H L L H H H H H L H H9H L L H L H X L L L L L L L BLANKH L L H H X X L L L L L L L BLANKL L L X X X X######↑↑H↑INVERSE OF ABOVE OUTPUT LEVEL DISPLAY AS ABOVE X:Don’t Care↑:SAME AS ABOVE COMBINATIONS###:DEPENDS UPON THE BCD CODE PREVIOUSLY APPLIED WHEN LD=’H’LOGIC DIAGRAM2/12DISPLAY MODEPIN DESCRIPTIONPIN No SYMBOL NAME AND FUNCTION 12LD Latch Disable Input(Active HIGH)5,3,2,4A to D Address(Data)Inputs 6PH Phase Input(Active HIGH)7BI Blanking Input(ActiveHIGH)9,10,11,12,13,15,14a to g Segment Outputs8GND Ground(0V)16V CC Positive Supply Voltage IEC LOGIC SYMBOLINPUT AND OUTPUT EQUIVALENT CIRCUITM54/M74HC45433/12ABSOLUTE MAXIMUM RATINGSymbol Parameter Value Unit V CC Supply Voltage-0.5to+7V V I DC Input Voltage-0.5to V CC+0.5V V O DC Output Voltage-0.5to V CC+0.5VI IK DC Input Diode Current±20mAI OK DC Output Diode Current±20mAI O DC Output Source Sink Current Per Output Pin±25mAI CC or I GND DC V CC or Ground Current±50mAP D Power Dissipation500(*)mW T stg Storage Temperature-65to+150o C T L Lead Temperature(10sec)300o C Absolute Maximum Ratings are those values beyond whichdamage to the device may occu r.Functiona l ope ration und er these cond ition isnotimplied. (*)500mW:≅65o C derate to300mW by10mW/o C:65o C to85o CRECOMMENDED OPERATING CONDITIONSSymbol Parameter Value Unit V CC Supply Voltage2to6V V I Input Voltage0to V CC V V O Output Voltage0to V CC VT op Operating Temperature:M54HC SeriesM74HC Series -55to+125-40to+85o Co Ct r,t f Input Rise and Fall Time V CC=2V0to1000nsV CC=4.5V0to500V CC=6V0to400M54/M74HC45434/12DC SPECIFICATIONSSymbol ParameterTest Conditions ValueUnit V CC(V)T A=25o C54HC and74HC-40to85o C74HC-55to125o C54HCMin.Typ.Max.Min.Max.Min.Max.V IH High Level InputVoltage 2.0 1.5 1.5 1.5V 4.5 3.15 3.15 3.156.0 4.2 4.2 4.2V IL Low Level InputVoltage 2.00.50.50.5V 4.5 1.35 1.35 1.356.0 1.8 1.8 1.8V OH High LevelOutput Voltage 2.0V I=V IHorV ILI O=-20µA1.92.0 1.9 1.9V 4.5 4.4 4.5 4.4 4.46.0 5.9 6.0 5.9 5.94.5I O=-4.0mA 4.18 4.31 4.13 4.106.0I O=-5.2mA 5.68 5.8 5.63 5.60V OL Low Level OutputVoltage 2.0V I=V IHorV ILI O=20µA0.00.10.10.1V 4.50.00.10.10.16.00.00.10.10.14.5I O=4.0mA0.170.260.370.406.0I O=5.2mA0.180.260.370.40I I Input LeakageCurrent 6.0V I=V CC or GND±0.1±1±1µAI CC Quiescent SupplyCurrent 6.0V I=V CC or GND44080µAM54/M74HC45435/12AC ELECTRICAL CHARACTERISTICS(C L=50pF,Input t r=t f=6ns)Symbol ParameterTest Conditions ValueUnit V CC(V)T A=25o C54HC and74HC-40to85o C74HC-55to125o C54HCMin.Typ.Max.Min.Max.Min.Max.t TLH t THL Output TransitionTime2.0307595110ns4.581519226.07131619t PLH t PHL PropagationDelay Time(BCD-OUT)2.0160300375450ns4.5406075906.030516476t PLH t PHL PropagationDelay Time(BI-OUT)2.080175220265ns4.5233544536.017303745t PLH t PHL PropagationDelay Time(PH-OUT)2.058130165195ns4.5172633396.014222833t PLH t PHL PropagationDelay Time(LD-OUT)2.0130265335400ns4.5355366806.016455668t W(H)Minimum PulseWidth(LD)2.0307595110ns 4.581529226.07132619t s Minimum Set-upTime 2.0157595110ns 4.541519226.03131619t h Minimum HoldTime 2.0000ns 4.50006.0000C IN Input Capacitance5101010pFC PD(*)Power DissipationCapacitance 115pF(*)C PD is defined as the value of the IC’s internal equivalent capac itanc e which is calculated from the operating current con sump tion without load. (Refer to Test Circuit).Average operting current can be obtained by the following equ ation.I CC(opr)=C PD•V CC•f IN+I CC/2(per FLIP/FLOP)M54/M74HC45436/12M54/M74HC4543 SWITCHING CHARACTERISTICS TEST WAVEFORM7/12M54/M74HC4543Plastic DIP16(0.25)MECHANICAL DATAmm inch DIM.MIN.TYP.MAX.MIN.TYP.MAX.a10.510.020B0.77 1.650.0300.065 b0.50.020b10.250.010D200.787 E8.50.335e 2.540.100e317.780.700F7.10.280I 5.10.201L 3.30.130Z 1.270.050P001C 8/12M54/M74HC4543 Ceramic DIP16/1MECHANICAL DATAmm inchDIM.MIN.TYP.MAX.MIN.TYP.MAX.A200.787B70.276D 3.30.130E0.380.015e317.780.700F 2.29 2.790.0900.110G0.40.550.0160.022H 1.17 1.520.0460.060L0.220.310.0090.012M0.51 1.270.0200.050N10.30.406P7.88.050.3070.317Q 5.080.200P053D9/12M54/M74HC4543SO16(Narrow)MECHANICAL DATAmm inch DIM.MIN.TYP.MAX.MIN.TYP.MAX.A 1.750.068a10.10.20.0040.007 a2 1.650.064 b0.350.460.0130.018 b10.190.250.0070.010 C0.50.019c145°(typ.)D9.8100.3850.393E 5.8 6.20.2280.244e 1.270.050e38.890.350F 3.8 4.00.1490.157G 4.6 5.30.1810.208L0.5 1.270.0190.050 M0.620.024 S8°(max.)P013H 10/12M54/M74HC4543PLCC20MECHANICAL DATAmm inchDIM.MIN.TYP.MAX.MIN.TYP.MAX.A9.7810.030.3850.395B8.899.040.3500.356D 4.2 4.570.1650.180d1 2.540.100d20.560.022E7.378.380.2900.330e 1.270.050e3 5.080.200F0.380.015G0.1010.004M 1.270.050M1 1.140.045P027A11/12M54/M74HC4543Information furnished is believed to be accurate and reliable.However,SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use.No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.Specificationsmentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics.©1994SGS-THOMSON Microelectronics-All Rights ReservedSGS-THOMSON Microelectronics GROUP OF COMPANIESAustralia-Brazil-France-Germany-Hong Kong-Italy-Japan-Korea-Malaysia-Malta-Morocco-The Netherlands-Singapore-Spain-Sweden-Switzerland-Taiwan-Thailand-United Kingdom-U.S.A12/12。
