HLMP-C10X中文资料
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High Power T-1 (3 mm), T-13/4 (5 mm)
and Rectangular AS/TS AlGaAs
Plastic Lamps
Reliability Data
Description
The following cumulative test
results have been obtained from
testing performed at Agilent
Technologies in accordance with
the latest revisions of MIL- STD-883 and JIS C 7021.HLMP-C10X,
C11X, KXXX, R1XX,
D1XX, S1XX, and 41XX
Agilent tests parts at the absolute
maximum rated conditions
recommended for the device. The
actual performance you obtain
from Agilent parts depends on the
electrical and environmentalcharacteristics of your application
but will probably be better than the
performance outlined in Table 1.
Failure Rate Prediction
The failure rate of semiconductor
devices is determined by the
junction temperature of the device.
The relationship between ambient
temperature and actual junction
temperature is given by the
following:
TJ (°C) = TA (°C) + θJA PAVGwhere
TA = ambient temperature in °C
θJA = thermal resistance of junc-
tion-to-ambient in °C/watt
PAVG = average power dissipated
in wattsThe estimated MTBF and failure
rate at temperatures lower than the
actual stress temperature can be
determined by using an Arrhenius
model for temperature accelera-
tion. Results of such calculations
are shown in the table on the fol-
lowing page using an activation
energy of 0.43 eV (reference MIL-
HDBK-217).
Stress TestTotalUnitsTotalFailure Rate
ColorsConditionsDevice Hrs.TestedFailedMTBF(% /1K Hours)
AS AlGaAsTA = 55°C4,727,0001,51204,727,0000.002
IF = 30 mA
TS AlGaAsTA = 55°C5,572,0003,66805,572,0000.002
IF = 50 mA
AS AlGaAsTA = -40°C1,428,00095201,428,0000.070
IF = 30 mA
TS AlGaAsTA = -40°C1,708,00056001,708,0000.059
IF = 50 mATable 1. Life Tests
Demonstrated Performance
Point Typical
Performance元器件交易网www.cecb2b.com2
Table 2A. AS AlGaAs, 55°C @ 30 mAPoint TypicalPerformance
Performance [1]in Time [2]
in Time(90% Confidence)
AmbientJunctionFailure RateFailure Rate
Temperature (°C)Temperature (°C)MTBF [1](%/1K Hours)MTBF [2](%/1K Hours)
+85+1081,543,0000.065670,0000.149
+75+982,197,0000.046954,0000.105
+65+882,188,0000.031 1,385,0000.072
+55+784,727,0000.021 2,053,0000.049
+45+687,172,0000.014 3,115,0000.032
+35+5811,159,0000.0094,846,0000.021
+25+4817,847,0000.006 7,751,0000.013
Notes:1. The point typical MTBF (which repre-sents 60% confidence level) is the totaldevice hours divided by the number offailures. In the case of zero failures, onefailure is assumed for this calculation.
2. The 90% Confidence MTBF representsthe minimum level of reliability perfor-mance which is expected from 90% ofall samples. This confidence interval isbased on the statistics of the distribu-tion of failures. The assumeddistribution of failures is exponential.This particular distribution is com-monly used in describing useful life
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is:
(8 hours/day) x (5 days/week) / (168 hours/week) = 0.25
For 55°C and 50 mA:
The point failure rate per year (8760 hours) at 75°C ambient temperature is:
(0.037% / 1K hours) x 0.25 x (8760 hours/year) = 0.081% per year
Similarly, 90% confidence level failure rate per year at 75°C:
(0.086% / 1K hours) x 0.25 x (8760 hours/year) = 0.188% per yearTable 2B. TS AlGaAs, 55°C @ 50 mA
Point TypicalPerformance
Performance [1]in Time [2]
in Time(90% Confidence)
AmbientJunctionFailure RateFailure Rate
Temperature (°C)Temperature (°C)MTBF [1](%/1K Hours)MTBF [2](%/1K Hours)
+75+1102,718,0000.0371,181,0000.085
+65+1003,854,0000.0261,674,0000.060
+55+905,572,0000.018 2,420,0000.041
+45+808,225,0000.012 3,572,0000.028
+35+7012,419,0000.0085,394,0000.019
+25+6019,223,0000.0058,349,0000.012
failures. Refer to MIL-STD-690B for de-tails on this methodology.
3. A failure is any LED which is open,shorted, or fails to emit light.元器件交易网www.cecb2b.com3
Table 3. Environmental TestsMIL-STD-883CJIS C 7021UnitsUnits
Test NameReferenceRef.Test ConditionsTestedFailed
Temperature Cycle1010Method A-4-55°C to 120°C; 15 minute dwell,24,3885
5 minute transfer, 100 cycles
Resistance to2003Method A-1260°C for 5 seconds/2x dip47,4880
Soldering HeatCond. A
Solderability2003Method A-2230°C for 5 sec. 1 to 1.5 mm from body,4200
95% solder coverage of immersed area
Power Temp.Agilent Req.Agilent Req.-40°C to 85°C; 15 min. dwell, 5 min.2240
Cycletransfer @ 20 mA 5 min. on/off 1000 cycles
Power Temp.Agilent Req.Agilent Req.-40°C to 85°C; 18 min. dwell, 42 min.4480
Cycletransfer @ 30 mA 5 min. on/off 100 cyclesHumidity LifeAgilent Req.Agilent Req.85°C, 85% RH, 20 mA, 1000 hours1,1180
Resistance to2015N/A1. Z Propanol/mineral spirit solution2240
Solvents(1:3 by volume). 2. Propylene glycol
monomethylether/monoethanolamine/DI
