ILD211T中文资料

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Hot Side Temperature (°C) Δ Tmax (°C-dry N2): Qmax (watts): Imax (amps): Vmax (vdc): AC Resistance (ohms): 27°C 61 1.0 1.0 2.0 1.80 50°C 69 1.3 1.0 2.3 ---
元器件交易网
marlow
industries
Subsidiary of II-VI Incorporated
a global leader in thermoelectric solutions
Thermoelectric Cooler NL1011T
Performance Values
RoHS 2002/95/EC Compliant
Mechanical Characteristics
Positive Lead .260 [6.60] Leads: 28 AWG (0.32) Bus Solid Tinned Copper Negative Lead
.260 [6.60]
2.00 +/-.25 [50.80+/-6.35]
Operation Cautions
For maximum reliability, storage and operation below 85°C in a non-condensing environment is recommended. To minimize thermal stress, use linear/proportional temperature control or a similar method rather than an ON/OFF method.

March 2006 Rev 11/99STTH1212Ultrafast recovery - 1200 V diodeMain product characteristicsFeatures and benefits■Ultrafast, soft recovery■Very low conduction and switching losses ■High frequency and/or high pulsed current operation■High reverse voltage capability ■High junction temperatureDescriptionThe high quality design of this diode has produced a device with low leakage current,regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability.Such demanding applications include industrial power supplies, motor control, and similarmission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications.The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device.Order codesI F(AV)12 A V RRM 1200 V T j 175° C V F (typ) 1.25 V t rr (typ)50 nsPart Number Marking STTH1212D STTH1212D STTH1212G STTH1212G STTH1212G-TRSTTH1212GCharacteristics STTH12122/91 CharacteristicsTo evaluate the conduction losses use the following equation: P = 1.5 x I F(AV) + 0.033 I F 2(RMS)Table 1.Absolute ratings (limiting values at 25° C, unless otherwise specified)Symbol ParameterValue Unit V RRM Repetitive peak reverse voltage 1200V I F(RMS)RMS forward current30A I F(AV)Average forward current, δ = 0.5T c = 130° C12A I FRM Repetitive peak forward current t p = 5 µs, F = 5 kHz square 160A I FSM Surge non repetitive forward current t p = 10 ms Sinusoidal100A T stg Storage temperature range-65 to + 175°C T jMaximum operating junction temperature175°CTable 2.Thermal parameterSymbol ParameterValue Unit R th(j-c)Junction to case1.6°C/WTable 3.Static electrical characteristicsSymbol ParameterTest conditionsMin.TypMax.Unit I R (1)Reverse leakage currentT j = 25° C V R = V RRM10µAT j = 125° C 770V F (2)Forward voltage dropT j = 25° CI F = 12 A2.2V T j = 125° C 1.30 2.0T j = 150° C1.251.91.Pulse test: t p = 5 ms, δ < 2 %2.Pulse test: t p = 380 µs, δ < 2 %STTH1212Characteristics3/9Table 4.Dynamic characteristicsSymbolParameterTest conditionsMin.TypMax.Unitt rrReverse recovery timeI F = 1 A, dI F /dt = -50 A/µs, V R = 30 V , T j = 25° C 100nsI F = 1 A, dI F /dt = -100 A/µs,V R = 30 V , T j = 25° C 5070I RM Reverse recovery current I F = 12 A, dI F /dt = -200 A/µs,V R = 600 V , T j = 125° C 1624A S Softness factor I F = 12 A, dI F /dt = -200 A/µs,V R = 600 V , T j = 125° C 2t fr Forward recovery time I F = 12 A dI F /dt = 50 A/µs V FR = 1.5 x V Fmax , T j = 25° C 400ns V FPForward recovery voltageI F = 12 A, dI F /dt = 50 A/µs,T j = 25° C6VFigure 1.Conduction losses versusFigure 2.Forward voltage drop versusCharacteristicsSTTH12124/9Figure 3.Relative variation of thermal impedance junction to caseFigure 4.Peak reverse recovery current versus dI F /dt (typical values)Figure 5.Reverse recovery time versusFigure 6.Reverse recovery charges versusFigure 7.Softness factor versus dI F /dt (typical values)Figure 8.Relative variations of dynamic parameters versus junctionSTTH1212Characteristics5/9Figure 9.Transient peak forward voltageFigure 10.Forward recovery time versus dI F /dtFigure 11.Junction capacitance versusreverse voltage applied (typical values)Figure 12.Thermal resistance junction toambient versus copper surface under tab (Epoxy printed circuitPackage mechanical data STTH1212 2 Package mechanical dataEpoxy meets UL94, V0Cooling method: by conduction (C)Recommended torque value: 0.55 Nm (TO-220AC)Maximum torque value: 0.7 Nm (TO-220AC)6/9STTH1212Package mechanical data22In order to meet environmental requirements, ST offers these devices in ECOP ACK®packages. These packages have a Lead-free second level interconnect . The category ofsecond level interconnect is marked on the package and on the inner box label, incompliance with JEDEC Standard JESD97. The maximum ratings related to solderingconditions are also marked on the inner box label. ECOP ACK is an ST trademark.ECOP ACK specifications are available at: .7/9Ordering information STTH12128/93 Ordering information4 Revision historyPart Number Marking Package Weight Base qtyDelivery modeSTTH1212D STTH1212D TO-220AC 1.86 g 50Tube STTH1212G STTH1212G D 2P AK 1.48 g 50Tube STTH1212G-TRSTTH1212GD 2P AK1.48 g1000Tape & reelDate RevisionDescription of Changes02-Mar-20061First issue.STTH1212Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at anytime, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, ORSEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, anyliability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. 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Genesis GM5621 and GM5626 are all-in-one dual input LCD monitor controllers supporting resolutions up to SXGA/WXGA, available in a very low pin count package. GM5621/5626 leverage Genesis patented advanced image-processing technology, as well as a proven integrated ADC/PLL and an Ultra-Reliable DVI compliant digital receiver to deliver a highquality solution for mainstream analog and dual input monitors. GM5621/5626 offer new Instant Auto technology, which provides fast and accurate image alignment for both static and moving images of the analog input signal. GM5621 includes an on-chip, industry standard, dual channel LVDS transmitter and a TCON, and GM5626 includes a dual channel RSDS transmitter for direct interfacing of commercially available LVDS/RSDS LCD panel modules.