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SSC-MBT654中文资料

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(Ta=25ºC)
Unit V µA mcd lm nm nm nm deg lm/W
λd λP ∆λ
2 θ½
η
opt
*1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.
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*Customer:
SPECIFICATION
ITEM MODEL TOP LED DEVICE SSC-MBT722
[Contents]
1. Features
------------------------------------------------------------- 2
5. Rank of MBT722
▣ Rank Name Table X1 Iv X2 λd X3 Vf
▣ Luminous Intensity [Iv] Rank Iv (mcd) Name MIN MAX N 300 400 O 400 510 P 510 650 Q 650 860 ▣ Dominant Wavelength [λd] Rank λd (nm) Name MIN MAX 465 469 A 469 473 B C 473 477 ▣ Forward Voltage Rank Name 1 2 3 Vf (V) MIN 2.7 3.1 3.6 MAX 3.1 3.6 4.0
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MBT722
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CUSTOMER Checked by Approved by
SUPPLIER Drawn by Checked by Approved by
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. Rank of MBT722 6. Soldering Profile 7. Outline Dimension 8. Packing ---------------------------------------------------------------------------------------4 6 6 ---------------------------------------------------- 5
SSC-MBT722
- 5/9 -
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7. Outline Dimension
Package Outlines
6
5
4
Package Marking (Cathode)
Front View
1
2
3
Right View
Rear View
( Tolerance: ±0.2, Unit: mm )
8. Packing
Package Marking
( Tolerance: ±0.2,
Unit: mm )
(1) Quantity : 700pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
2. Application
Indoor and outdoor displays LCD Backlights etc. Blue – displays Automotive Indicator
3. Absolute Maximum Ratings *1
Parameter Power Dissipation Forward Current Forward Peak Surge Current (per die) Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM VR Topr Tstg
4. Electro-Optical Characteristics
Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity *1 Luminance Flux Dominant Wavelength Peak Wavelength Spectral Bandwidth Viewing Angle *2 Optical Efficiency Symbol VF IR IV ΦV Condition IF =20 mA VR=5V IF =60 mA IF =60 mA IF =60 mA IF =60mA IF =60 mA IF =60 mA IF =60 mA Min 2.7 300 465 Typ 3.3 580 1.8 470 463 27 120 9 Max 4.0 10 860 477 -
*2
(Ta=25ºC)
Value 360 90 100 5 -30 ~ +85 -4A V ºC ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MBT722
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260 240 220 200
180 150 ~
Pre-heating
Rising 5 °C/sec
Cooling -5 °C/sec
0 Time [Hr]
(2) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
-------------------------------------------------------------
9. Reel Packing Structure ------------------------------------------------- 7 10. Precaution for Use --------------------------------------------------- 8 11. Characteristic Diagram ---------------------------------------- 9
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MBT722
- 3/9 -
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SSC-MBT722
- 1/9 -
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1. Features
Pb-free Reflow Soldering application RoHS Compliant Material : InGaN Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window Encapsulating Resin : Epoxy Resin

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N2
SM PS
L1 = 10~30mH Common Mode Line Filter C1 = 220nF X2 Capacitor C2, C3 = 2200pF Y2 Capacitor C4 = 2200pF Y1 Capacitor
GND
L
IN P U T
50.8 2.000
R 0.3 [0.012] (8 PLCS)
25.40 1.000
15.24 0.600
45.72 1.800
5.08 0.200 5 (PLCS)
2
20.32 0.800
IN
OUT
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1 5
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PROTECTION CIRCUIT
parameter output over current over temperature over voltage conditions/description works at over 105% of the rating and recovers automatically. 150 ºC clamp, 130~150%
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rev. page page date date 1 of 4
10/2007
PART NUMBER: FSK-S5 series
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–3 V
–20
–10
–2.5 V
–2 V
0
–2 –4 –6 –8 –10
Drain to Source Voltage V DS (V)
Drain Current I D (A)
Typical Transfer Characteristics –50
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Drain to Source Voltage V DS (V)
5
2SJ554
Reverse Drain Current I DR (A) Repetitive Avalanche Energy E AR (mJ)
Reverse Drain Current vs.
Source to Drain Voltage –50
E Note3 AR
Channel dissipation
Pch Note2
Channel temperature
Tch
Storage temperature
Tstg
Note:
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1000 500 200
Switching Characteristics
t d(off) tf
100
tr
50
20
10 –0.1 –0.3
t d(on)
V GS = –10 V, V DD = –30 V PW = 5 µs, duty <= 1 %
–1 –3 –10 –30 –100
Drain Current I D (A)
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