1N5418-BYW172G中文资料

  • 格式:pdf
  • 大小:138.31 KB
  • 文档页数:5

1N5417/ 1N5418

Document Number 86097

Rev. 1.3, 13-Apr-05Vishay Semiconductors

www.vishay.com

1949588Fast Avalanche Sinterglass Diode

Features

•Glass passivated junction

•Hermetically sealed package

•Soft recovery characteristics

•Low reverse current

•Low forward voltage drop

•High pulse current capability

•Lead (Pb)-free component

•Component in accordance to RoHS 2002/95/EC

and WEEE 2002/96/EC

Applications

Fast rectification diodeMechanical Data

Case: SOD-64 Sintered glass case

Terminals: Plated axial leads, solderable per

MIL-STD-750, Method 2026

Polarity: Color band denotes cathode end

Mounting Position: Any

Weight: approx. 858 mg

Parts Table

Absolute Maximum Ratings

Tamb = 25°C, unless otherwise specified

Maximum Thermal Resistance

Tamb = 25°C, unless otherwise specifiedPartT

ype differentiationPackage

1N5417VR = 200 V; IFAV = 3 ASOD-64

1N5418VR = 400 V; IFAV = 3 ASOD-64

ParameterTest conditionPartSymbolValueUnit

Maximum repetitive peak reverse voltagesee electrical characteristics1N5417VR = VRRM200V

1N5418VR = VRRM400V

Maximum average forward rectified currentIF(AV)3.0A

Peak forward surge current10 ms single half sine-waveIFSM100A

Non repetitive reverse avalanche energyI(BR)R = 1 AER20mJ

ParameterTest conditionSymbolValueUnit

Junction ambientl = 10 mm, TL = constantRthJA25K/W

on PC board with spacing 25 mmRthJA70K/W

Operating junction and storage temperature rangeTJ, TSTG- 55 to + 175°Ce2元器件交易网www.cecb2b.comwww.vishay.com

2Document Number 86097

Rev. 1.3, 13-Apr-051N5417/ 1N5418

Vishay Semiconductors

Electrical Characteristics

Tamb = 25°C, unless otherwise specified

Typical Characteristics (Tamb = 25 °C unless otherwise specified)ParameterTest conditionSymbolMinTyp.MaxUnit

Maximum instantaneous forward voltageIF = 3 AVF1.10V

IF = 9 AVF1.50V

Reverse currentVR = VRRMIR1.0µA

VR = VRRM, Tj = 100°CIR20µA

Maximum reverse recovery timeIF = 0.5 A, IR = 1.0 A, Irr = 0.25 Atrr75100ns

Figure1. Max. Thermal Resistance vs. Lead Length

Figure2. Forward Current vs. Forward Voltage010203040

949466ll

TL=constant

R-Therm.Resist.Junction/Ambient(K/W)

thJA0

l-LeadLength(mm)51015253020

I-ForwardCurrent(A)

0.0010.010.1110100

00.51.01.52.02.5

VF-ForwardVoltage(V)16387FTj=25°CTj=175°CFigure3. Max. Average Forward Current vs. Ambient Temperature

Figure

4. Reverse Current vs. Junction Temperature16388I-AverageForwardCurrent(A)

FAV020406080100120140160180

Tamb-AmbientTemperature(°C)3.5

3.0

2.5

2.0

1.5

1.0

0.5

0VR=VRRMhalfsinewave

RthJA=25K/Wl=10mm

RthJA=70K/WPCB:d=25mm

1101001000

255075100125150175

Tj-JunctionTemperature(°C)16389VR=VRRM

I-ReverseCurrent(µA)

R元器件交易网www.cecb2b.com1N5417/ 1N5418

Document Number 86097

Rev. 1.3, 13-Apr-05Vishay Semiconductors

www.vishay.com

3Package Dimensions in mm (Inches)Figure5. Max. Reverse Power Dissipation vs. Junction Temperature020406080100120140160180

255075100125150175

Tj-JunctionTemperature(°C)16390VR=VRRM

P-ReversePowerDissipation(mW)

RPR-Limit@100%VR

PR-Limit@80%VR

Figure

6. Diode Capacitance vs. Reverse Voltage020406080100120

0.1110100

VR-ReverseVoltage(V)16391C-DiodeCapacitance(pF)

Df=1MHz

Figure7. Thermal Response

1101001000

Z-ThermalResistancef.PulseCond.(K/W

thp

tp-PulseLength(s)949562IFRM-RepetitivePeakForwardCurrent(A)10-410-310-210-1100101102102100101tp/T=0.05VRRM=600VRthJA=70K/W

tp/T=0.5

tp/T=0.2

tp/T=0.1

0.02

tp/T=0.01Tamb=25°C

45°C70°C

100°C

CathodeIdentification4.3(0.168)max.

1.35(0.053)max.

4.0(0.156)max.SinteredGlassCaseSOD-64

94958726(1.014)min.26(1.014)min.ISOMethodE元器件交易网www.cecb2b.comwww.vishay.com

4Document Number 86097

Rev. 1.3, 13-Apr-051N5417/ 1N5418

Vishay Semiconductors

Ozone Depleting Substances Policy Statement

It is the policy of Vishay Semiconductor GmbH to

1.Meet all present and future national and international statutory requirements.

2.Regularly and continuously improve the performance of our products, processes, distribution and operating

systems with respect to their impact on the health and safety of our employees and the public, as well as

their impact on the environment.

It is particular concern to control or eliminate releases of those substances into the atmosphere which are

known as ozone depleting substances (ODSs).

The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs

and forbid their use within the next ten years. Various national and international initiatives are pressing for an

earlier ban on these substances.

Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use

of ODSs listed in the following documents.

1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments

respectively

2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental