PHD10N10E中文资料

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Philips SemiconductorsProduct Specification PowerMOS transistorPHD10N10E

GENERAL DESCRIPTIONQUICK REFERENCE DATA

N-channel enhancement modeSYMBOLPARAMETERMAX.UNITfield-effect power transistor in aplastic envelope suuitable forVDSDrain-source voltage100Vsurface mounting. The device isIDDrain current (DC)11Aintended for use in Switched ModePtotTotal power dissipation60WPower Supplies (SMPS), motorTjJunction temperature175˚Ccontrol, welding, DC/DC and AC/DCRDS(ON)Drain-source on-state resistance0.25Ωconverters, and in general purposeswitching applications.

PINNING - SOT428PIN CONFIGURATIONSYMBOL

PINDESCRIPTION

1gate

2drain

3source

tabdrain

LIMITING VALUESLimiting values in accordance with the Absolute Maximum System (IEC 134)SYMBOLPARAMETERCONDITIONSMIN.MAX.UNITVDSDrain-source voltage--100VVDGRDrain-gate voltageRGS = 20 kΩ-100V±VGSGate-source voltage--30VIDDrain current (DC)Tmb = 25 ˚C-11AIDDrain current (DC)Tmb = 100 ˚C-7.7AIDMDrain current (pulse peak value)Tmb = 25 ˚C-44APtotTotal power dissipationTmb = 25 ˚C-60WTstgStorage temperature-- 55175˚CTjJunction Temperature--175˚C

THERMAL RESISTANCES

SYMBOLPARAMETERCONDITIONSTYP.MAX.UNITRth j-mbThermal resistance junction to-2.5K/Wmounting baseRth j-aThermal resistance junction topcb mounted, minimum50-K/Wambientfootprint123tabd

g

s

September 19971Rev 1.000元器件交易网www.cecb2b.comPhilips SemiconductorsProduct Specification PowerMOS transistorPHD10N10E

STATIC CHARACTERISTICSTj = 25 ˚C unless otherwise specifiedSYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNITV(BR)DSSDrain-source breakdownVGS = 0 V; ID = 0.25 mA100--VvoltageVGS(TO)Gate threshold voltageVDS = VGS; ID = 1 mA2.13.04.0VIDSSZero gate voltage drain currentVDS = 100 V; VGS = 0 V; Tj = 25 ˚C-110µAIDSSZero gate voltage drain currentVDS = 100 V; VGS = 0 V; Tj = 125 ˚C-0.11.0mAIGSSGate source leakage currentVGS = ±30 V; VDS = 0 V-10100nARDS(ON)Drain-source on-stateVGS = 10 V; ID = 5.5 A-0.220.25Ωresistance

DYNAMIC CHARACTERISTICSTj = 25 ˚C unless otherwise specifiedSYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNITgfsForward transconductanceVDS = 25 V; ID = 5.5 A34.2-SCissInput capacitanceVGS = 0 V; VDS = 25 V; f = 1 MHz-400500pFCossOutput capacitance-90120pFCrssFeedback capacitance-3550pFtd onTurn-on delay timeVDD = 30 V; ID = 3 A;-914nstrTurn-on rise timeVGS = 10 V; RGS = 50 Ω;-2540nstd offTurn-off delay timeRgen = 50 Ω-3045nstfTurn-off fall time-2040nsLdInternal drain inductanceMeasured from tab to centre of die-4.5-nHLsInternal source inductanceMeasured from source lead solder-7.5-nHpoint to source bond pad

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICSTj = 25 ˚C unless otherwise specifiedSYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNITIDRContinuous reverse drain---11AcurrentIDRMPulsed reverse drain current---44AVSDDiode forward voltageIF = 11 A ; VGS = 0 V-1.21.5VtrrReverse recovery timeIF = 11 A; -dIF/dt = 100 A/µs;-90-nsQrrReverse recovery chargeVGS = 0 V; VR = 30 V-0.35-µC

AVALANCHE LIMITING VALUETmb = 25 ˚C unless otherwise specifiedSYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNITWDSSDrain-source non-repetitiveID = 11 A ; VDD ≤ 50 V ;--35mJunclamped inductive turn-offVGS = 10 V ; RGS = 50 Ωenergy

September 19972Rev 1.000元器件交易网www.cecb2b.comPhilips SemiconductorsProduct Specification PowerMOS transistorPHD10N10E

Fig.1. Normalised power dissipation.PD% = 100⋅PD/PD 25 ˚C = f(Tmb)

Fig.2. Normalised continuous drain current.ID% = 100⋅ID/ID 25 ˚C = f(Tmb); conditions: VGS ≥ 10 V

Fig.3. Safe operating area. Tmb = 25 ˚CID & IDM = f(VDS); IDM single pulse; parameter tpFig.4. Transient thermal impedance.Zth j-mb = f(t); parameter D = tp/T

Fig.5. Typical output characteristics, Tj = 25 ˚C.ID = f(VDS); parameter VGS

Fig.6. Typical on-state resistance, Tj = 25 ˚C.RDS(ON) = f(ID); parameter VGS020406080100120140160180Tmb / CPD%Normalised Power Derating120 110 100 90 80 70 60 50 40 30 20 10 0 1E-071E-051E-031E-011E+01t / sZth j-mb / (K/W)1E+01

1E+00

1E-01

1E-02 00.50.20.10.050.02D = tptp

TTP

tDBUKX52

020406080100120140160180Tmb / CID%Normalised Current Derating120 110 100 90 80 70 60 50 40 30 20 10 0 0246810BUK452-100A

VDS / V20

15

10

5

0 45678101520ID / A

VGS / V =

1100VDS / VID / A100

10

1

0.1BUK452-100

10tp = 10 us

100 us1 ms10 ms100 msDCRDS(ON) = VDS/IDAB

02468101214161820BUK452-100A

ID / A1.0

0.8

0.6

0.4

0.2

0 4.555.566.577.5810

20RDS(ON) / Ohm

VGS / V =

September 19973Rev 1.000元器件交易网www.cecb2b.comPhilips SemiconductorsProduct Specification PowerMOS transistorPHD10N10E

Fig.7. Typical transfer characteristics.ID = f(VGS) ; conditions: VDS = 25 V; parameter Tj

Fig.8. Typical transconductance, Tj = 25 ˚C.gfs = f(ID); conditions: VDS = 25 V

Fig.9. Normalised drain-source on-state resistance.a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 5.5 A; VGS = 10 VFig.10. Gate threshold voltage.VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS