奥地利微电子发布首款跨入亚微米分辨率范围的集成线性霍尔编码器AS5311

Release Notes forMicrocontroller Development KitThis file contains release notes and last m inute changes.Information in this file, the accompany manuals, and software isCopyright © 2014 ARM Ltd and ARM Germany GmbH.All rights reserved.Contents1. What's New in the Microcontroller Developm ent Kit2. Exam ple Program s3. Device Database™4. Peripheral Sim ulation5. Technical Support6. Contact DetailsThe Microcontroller Development Kit (MDK-ARM) supports software developm ent for and debugging of ARM7,ARM9, Cortex-M, and Cortex-R4 processor-based devices. A detailed description of MDK-ARM can be found in the section Complete User's Guide Selection of the µVision window Books. The Getting Started User's Guide is a good introduction to the m ain concepts of MDK-ARM and gives guidelines for program m ing ARM devices.What's New in the Microcontroller Development KitThe next sections list the changes for each release of the MDK-ARM toolset.Microcontroller Development Kit - Version 4.74[µVision]This MDK-ARM release is delivered with µVision V4.74.0.22 IDE.[Middleware][ARM Middleware][TCPnet]Corrected: corrected file upload failure in FTP client.[FlashFS]Corrected: the FAT file nam e processing in FlashFS (filenam es with leading '.' were not listed). Thelibrary version 4.74 includes the corrected FTP server interface module.Corrected: overlap bug in fcheck() function for EFS.[Segger Graphic Library]Updated: Segger emWin graphic library version 5.24b in folder ..\ARM\Segger\emWin\.[Device Simulation]Added: param eter -MULS to the Cortex-M0 sim ulator, which configures Multiplier Im plem entation type as"Small"(32-cycle iterative multiplier).Corrected: behaviour of sim ulation when executing DCW instruction.[Target debugging]Updated: Segger J-Link driver for ARM devices to version 4.76d.Updated: J-Link USB Driver Installer to support CDC.Updated: support for ST-Link USB-JTAG debugger. The ST-LINKIII-KEIL_SWO.dll MDK driver in folder..\ARM\STLink\ has been updated to version 2.0.5.0.[CMSIS]Updated to CMSIS 4.0 including:CMSIS-CORE3.30 (updated).CMSIS-DSP1.4.2 (updated).CMSIS-RTOS-API1.02.CMSIS-SVD1.1.[Board Support]NXP SemiconductorsAdded: Blinky and RTX_Blinky exam ples for MCB1500 starter kit, based on LPC1549 device.[New Supported Devices]AtmelSAMG51G18, SAMG51N18, SAMG53G19, SAMG53N19,SAM4CP16B, SAM4CMP16C CM4P0, SAM4CMP16C CM4P1, SAM4CMP8C CM4P0, SAM4CMP8C CM4P1,SAM4CMS16C CM4P0, SAM4CMS16C CM4P1, SAM4CMS8C CM4P0, SAM4CMS8C CM4P1,SAMD21E15A, SAMD21E16A, SAMD21E17A, SAMD21E18A,SAMD21G16A, SAMD21G17A, SAMD21G18A,SAMD21J16A, SAMD21J18A, SAMD21J16A,SAMR21E16A, SAMR21E17A, SAMR21E18A,SAMR21G16A, SAMR21G17A, and SAMR21G18A.CypressCY8C4013SXI-411, CY8C4013LQI-411, CY8C4013SXI-400, CY8C4013SXI-410,CY8C4014LQI-421, CY8C4014LQI-412, CY8C4014SXI-411, CY8C4014SXI-421,CY8C4014LQI-422, CY8C4014LQI-SLT1, and CY8C4014LQI-SLT2.Freescale SemiconductorSKEAZ128xxx4, SKEAZ64xxx4, SKEAZN8xxx4, SKEAZN16xxx2, SKEAZN32xxx2, SKEAZN64xxx2,MKE04Z8xxx4, MKE02Z16xxx2, MKE02Z32xxx2, and MKE02Z64xxx2.NXPLPC1517, LPC1518, LPC1519, LPC1547, LPC1548, and LPC1549.SpansionS6E1A11B0A, S6E1A11C0A, S6E1A12B0A, and S6E1A12C0A.STMicroelectronicsSTM32F401CD, STM32F401RD, STM32F401VD, STM32F401CE, STM32F401RE, STM32F401VE, andSTM32L162RD.Texas InstrumentsTM4C123GH6ZXR, TM4C1290NCPDT, TM4C1290NCZAD, TM4C1292NCPDT, TM4C1292NCZAD,TM4C1294KCPDT, TM4C1294NCPDT, TM4C1294NCZAD, TM4C1299KCZAD, TM4C129CNCPDT,TM4C129CNCZAD,TM4C129DNCPDT, TM4C129DNCZAD, TM4C129EKCPDT, TM4C129ENCPDT, TM4C129ENCZAD, andTM4C129XNCZAD.Microcontroller Development Kit - Version 4.73[µVision]This MDK-ARM release is delivered with µVision V4.73.0.0 IDE.Corrected: issue when pressing the F7-Key, which started a rebuild of the project. New: pressing the F7-key builds only the changed files.[Middleware][ARM Middleware][TCPnet]Added: user-configurable character encoding in HTTP Server service. The function http_encoding()optionally changes the default character encoding in the browser to support various national charactersets.Corrected: TCP socket closing problem in half-open connection state.[USB Device and USB Host]Corrected: USB Device audio library to support sam ples of size different then 2^n (in bytes).[Segger Graphic Library]Updated: Segger emWin graphic library version 5.22a in folder ..\ARM\Segger\emWin\.[New Supported Devices]AtmelSAM4LC8A, SAM4LC8B, SAM4LC8C, SAM4LS8A, SAM4LS8B, SAM4LS8C,SAM4S2A, SAM4S2B, SAM4S2C, SAM4S4A, SAM4S4B, and SAM4S4C.CypressCY8C4124AXI-443, CY8C4124LQI-443, CY8C4124PVI-432, CY8C4124PVI-442, CY8C4125AXI-473,CY8C4125AXI-483, CY8C4125LQI-483, CY8C4125PVI-482, CY8C4244AXI-443, CY8C4244LQI-443,CY8C4244PVI-432, CY8C4244PVI-442, CY8C4245AXI-473, CY8C4245AXI-483,CY8C4245LQI-483, and CY8C4245PVI-482.Energy MicroEFM32ZG108F4, EFM32ZG108F8, EFM32ZG108F16, EFM32ZG108F32,EFM32ZG110F4, EFM32ZG110F8, EFM32ZG110F16, EFM32ZG110F32,EFM32ZG210F4, EFM32ZG210F8, EFM32ZG210F16, EFM32ZG210F32,EFM32ZG222F4, EFM32ZG222F8, EFM32ZG222F16, and EFM32ZG222F32.Freescale SemiconductorMK24FN1M0xxx12, MK63FN1M0xxx12, MK64FN1M0xxx12, and MK64FX512xxx12.HoltekHT32F1655 and HT32F1656.InfineonXMC1100-8, XMC1100-16, XMC1100-32,XMC1201-16, XMC1201-32, XMC1201-64, XMC1201-200,XMC1202-16, XMC1202-32, XMC1301-8, XMC1301-16, XMC1301-32,XMC1302-8, XMC1302-16, XMC1302-32, and XMC1302-64.NXP (founded by Philips)LPC11E37/401, LPC1125, LPC4312, LPC4312 CM0, LPC4313, LPC4313 CM0, LPC4315,LPC4315 CM0, LPC4317, LPC4317 CM0, LPC4322, LPC4322 CM0,LPC4323, LPC4323 CM0, LPC4325, LPC4325 CM0, LPC4327,LPC4327 CM0, LPC4333, LPC4333 CM0, LPC4337, and LPC4337 CM0.SpansionMB9AF121K, MB9AF121L, MB9AF131M, MB9AF131N, MB9AF132M, MB9AF132N,MB9AF421K, MB9AF421L, MB9AFA41L, MB9AFA41M, MB9AFA41N,MB9AFA42L, MB9AFA42M, MB9AFA42N, MB9AFA44L, MB9AFA44M,MB9AFA44N, MB9BF102N, MB9BF102R, MB9BF112N, MB9BF114N,MB9BF115N, MB9BF116N, MB9BF128S, MB9BF128T, MB9BF129S,MB9BF129T, MB9BF166M, MB9BF166N, MB9BF166R, MB9BF167M,MB9BF167N, MB9BF167R, MB9BF168M, MB9BF168N, MB9BF168R,MB9BF328S, MB9BF328T, MB9BF329S, MB9BF329T, MB9BF366M,MB9BF366N, MB9BF366R, MB9BF367M, MB9BF367N, MB9BF367R,MB9BF368M, MB9BF368N, MB9BF368R, MB9BF412N, MB9BF414N, MB9BF415N,MB9BF416N, MB9BF428S, MB9BF428T, MB9BF429S, MB9BF429T,MB9BF466M, MB9BF466N, MB9BF466R, MB9BF467M, MB9BF467N, MB9BF467R,MB9BF468M, MB9BF468N, MB9BF468R, MB9BF528S, MB9BF528T, MB9BF529S,MB9BF529T, MB9BF566M, MB9BF566N, MB9BF566R,MB9BF567M, MB9BF567N, MB9BF567R,MB9BF568M, MB9BF568N, and MB9BF568R.STMicroelectronicsSTM32F030C6, STM32F030C8, STM32F030F4, STM32F030K6, STM32F030R8, STM32F401CB, STM32F401CC, STM32F401RB, STM32F401RC, STM32F401VB, STM32F401VC,STM32L100C6, STM32L100R8, STM32L100RB, STM32L100RC, STM32L151CC,STM32L151UC, STM32L152CC, STM32L162RC, STM32L162VC, STM32F071CB,STM32F071RB, STM32F071VB, STM32F072C8, STM32F072R8, STM32F072RB,STM32F072VB, STM32F078CB, STM32F078VB, STM32L151C6xxA, STM32L151C8xxA,STM32L151CBxxA, STM32L151R6xxA, STM32L151R8xxA, STM32L151RBxxA,STM32L151V8xxA, STM32L151VBxxA, STM32L152C6xxA, STM32L152C8xxA,STM32L152CBxxA, STM32L152R6xxA, STM32L152R8xxA, STM32L152RBxxA,STM32L152V8xxA, and STM32L152VBxxA.Texas InstrumentsCC2538NF11, CC2538NF23, CC2538NF53, CC2538SF23, CC2538SF53,TM4C1297NCZAD, TM4C1299NCZAD, and TM4C129LNCZAD.ToshibaTMPM462F10FG, TMPM462F10XBG, TMPM462F15FG, and TMPM462F15XBG.[Device Support]AtmelAdded: System Viewer file for SAM9M10 devices, in folder ..\ARM\SFD\Atmel\SAM9M10\.[CMSIS support]AtmelAdded: suppport for SAM4C devices, in folders ..\ARM\INC\Atmel\SAM4C\,..\ARM\Startup\Atmel\SAM4C\, and ..\ARM\SFD\Atmel\SAM4C\.Added: suppport for SAM4L8 devices, in folders ..\ARM\INC\Atmel\SAM4L\,..\ARM\Startup\Atmel\SAM4L\, and ..\ARM\SFD\Atmel\SAM4L\.CypressAdded: suppport for Cypress CY8C42xx devices, in folder ..\ARM\Startup\Cypress\.EnergyMicroAdded: suppport for EFM32ZG devices, in folders ..\ARM\INC\EnergyMicro\EFM32ZG\,..\ARM\Startup\EnergyMicro\EFM32ZG\, and ..\ARM\SFD\EnergyMicro\EFM32ZG\.Fujitsu SemiconductorAdded: suppport for MB9B520T devices, in folders ..\ARM\INC\Fujitsu\MB9B520T\,..\ARM\Startup\Fujitsu\MB9B520T\, and ..\ARM\SFD\Fujitsu\MB9B520T\.Added: suppport for MB9B420T devices, in folders ..\ARM\INC\Fujitsu\MB9B420T\,..\ARM\Startup\Fujitsu\MB9B420T\, and ..\ARM\SFD\Fujitsu\MB9B420T\.Added: suppport for MB9B320T devices, in folders ..\ARM\INC\Fujitsu\MB9B320T\,..\ARM\Startup\Fujitsu\MB9B320T\, and ..\ARM\SFD\Fujitsu\MB9B320T\.Added: suppport for MB9B120T devices, in folders ..\ARM\INC\Fujitsu\MB9B120T\,..\ARM\Startup\Fujitsu\MB9B120T\, and ..\ARM\SFD\Fujitsu\MB9B120T\.Added: suppport for MB9A420L devices, in folders ..\ARM\INC\Fujitsu\MB9A420L\,..\ARM\Startup\Fujitsu\MB9A420L\, and ..\ARM\SFD\Fujitsu\MB9A420L\.Added: suppport for MB9A120L devices, in folders ..\ARM\INC\Fujitsu\MB9A120L\,..\ARM\Startup\Fujitsu\MB9A120L\, and ..\ARM\SFD\Fujitsu\MB9A120L\.Added: suppport for MB9AA40NA devices, in folders ..\ARM\INC\Fujitsu\MB9AA40NA\,..\ARM\Startup\Fujitsu\MB9AA40NA\, and ..\ARM\SFD\Fujitsu\MB9AA40NA\.Added: suppport for MB9A130N devices, in folders ..\ARM\INC\Fujitsu\MB9A130N\,..\ARM\Startup\Fujitsu\MB9A130N\, and ..\ARM\SFD\Fujitsu\MB9A130N\.Added: suppport for MB9B410R devices, in folders ..\ARM\INC\Fujitsu\MB9B410R\,..\ARM\Startup\Fujitsu\MB9B410R\, and ..\ARM\SFD\Fujitsu\MB9B410R\.Added: suppport for MB9B110R devices, in folders ..\ARM\INC\Fujitsu\MB9B110R\,..\ARM\Startup\Fujitsu\MB9B110R\, and ..\ARM\SFD\Fujitsu\MB9B110R\.Added: suppport for MB9B160R devices, in folders ..\ARM\INC\Fujitsu\MB9B160R\,..\ARM\Startup\Fujitsu\MB9B160R\, and ..\ARM\SFD\Fujitsu\MB9B160R\.Added: suppport for MB9B360R devices, in folders ..\ARM\INC\Fujitsu\MB9B360R\,..\ARM\Startup\Fujitsu\MB9B360R\, and ..\ARM\SFD\Fujitsu\MB9B360R\.Added: suppport for MB9B460R devices, in folders ..\ARM\INC\Fujitsu\MB9B460R\,..\ARM\Startup\Fujitsu\MB9B460R\, and ..\ARM\SFD\Fujitsu\MB9B460R\.Added: suppport for MB9B560R devices, in folders ..\ARM\INC\Fujitsu\MB9B560R\,..\ARM\Startup\Fujitsu\MB9B560R\, and ..\ARM\SFD\Fujitsu\MB9B560R\.NXP (founded by Philips)Added: suppport for LPC112x devices, in folders ..\ARM\INC\NXP\LPC112x\,..\ARM\Startup\NXP\LPC112x \, and ..\ARM\SFD\NXP\LPC112x\.STMicroelectronicsAdded: suppport for STM32L1xx Value Line Devices devices, in folder..\ARM\SFD\ST\STM32L1xx\.Added: suppport for STM32F030 devices, in folders ..\ARM\Startup\ST\STM32F0xx\ and..\ARM\SFD\ST\STM32F0xx\.Texas InstrumentsAdded: suppport for TI CC2538 devices, in folder ..\ARM\SFD\TI\CC2538\.[Flash programming]AtmelAdded: ATSAM4L_512.FLM flash program m ing algorithm for Atmel SAM4L8 based devices in folder ..\ARM\Flash\.CypressAdded: CY8C42xx.FLM flash program m ing algorithm for Cypress CY8C42xx devices, in folder..\ARM\Flash\.Fujitsu SemiconductorAdded: MB9B560_1024.FLM and MB9B560_WORK32.FLM flash program m ing algorithm s for Fujitsu MB9B160R, MB9B360R, MB9B460R, and MB9B560R based devices in folder ..\ARM\Flash\.Added: MB9B520T_1024.FLM, MB9B520T_1536.FLM, and MB9B520T_ROM1.FLM flash program m ing algorithm s for Fujitsu MB9B120T based devices in folder ..\ARM\Flash\.Added: MB9A420L_64.FLM flash program m ing algorithm s for Fujitsu MB9A120L based devices in folder ..\ARM\Flash\.NXP (founded by Philips)Added: LPC18xx43xx_384_BA.FLM and LPC18xx43xx_384_BB.FLM flash program m ing algorithm for NXP KPC43xx devices, in folder ..\ARM\Flash\.STMicroelectronicsAdded: STM32F4xx_128.FLM and STM32F4xx_256.FLM flash program m ing algorithm s forSTM32F401 based devices in folder ..\ARM\Flash\.Added: STM32F0xx_128.FLM , STM32F0xx_64.FLM, STM32F0xx_32.FLM, andSTM32F0xx_16.FLM flash program m ing algorithm s for STM32F030 based devices in folder..\ARM\Flash\.[Board Support]AtmelAdded: Blinky, RTX_Blinky, and Bootloader exam ples for AT91SAM9M10-EK starter kit, based onAT91SAM9M10 device.EnergyMicroAdded: Blinky and RTX_Blinky exam ples for EFM32ZG_STK3200 starter kit, based on EFM32ZG222F32device.Added: Blinky and RTX_Blinky exam ples for EFM32LG_DK3650 board, based on EFM32LG990F256device.Added: Blinky and RTX_Blinky exam ples for EFM32WG_STK3800 board, based on EFM32WG990F256device.Freescale SemiconductorAdded: Blinky exam ple for FRDM-KE04Z starter kit, based on MKE04Z8xxx4 device.Added: Blinky, RTX_Blinky, FlexMem_Cfg, and ProgOnce_Cfg exam ples for FRDM-K20D50M evaluationboard, based on MK20DX128xxx5 device.STMicroelectronicsAdded: Blinky and RTX_Blinky exam ples for STM32L1-Discovery evaluation board, based onSTM32L100RC device.Added: Blinky and RTX_Blinky exam ples for STM32F030-Discovery evaluation board, based onSTM32F030R8 device.Added: Blinky_ULp exam ple for STM32303C-EVAL board, based on STM32F303VC device.[Target debugging]Updated: The CMSIS-DAP driver now supports the Micro Trace Buffer (MTB) of Cortex-M0+ devices.Updated: ULINK2 device firm ware to version 2.02. This version rem oves the Windows warning "This device can perform faster if connected to USB 2.0".Updated: Segger J-Link driver for ARM devices to version 4.76d.Microcontroller Development Kit - Version 4.72a[µVision]This MDK-ARM release is delivered with µVision V4.72.10.0 IDE. This version corrects build errors. Microcontroller Development Kit - Version 4.72[ARM Compiler]This version of MDK-ARM contains ARM Compiler 5.03u2.All com piler related files are located in ..\ARM\ARMCC\ directory.Details can be found in the Compiler specific Release Notes..[µVision]This MDK-ARM release is delivered with µVision V4.72.0.0 IDE.[uVision Debugger][Middleware][ARM Middleware][TCPnet]Added: support for user application notification in FTP Server service. An optional notification functionftp_evt_notify() m ay be used to receive notification of FTP server events, such as: user login, userlogout, file upload, file download, etc.Updated: handling of file write errors and data transfer aborts in FTP Server service. If a local filewrite error occurs, the service aborts file upload operation. Additionally, if the data connection isaborted, the service stops file download operation.Added: support for extended DHCP option 42 (NTP server list) in DHCP Client. An additionalconfiguration option NTP Servers in Net_Config.c is used to enable or disable this option.Added: com m and FTPC_CMD_NLIST in FTP Client service. This com m and lists only file nam es, without any additional file inform ation.Added: data transfer abort functionality in file retrieve operation of FTP Client service. The FTP client service now aborts data transfer, if a file write error occurs on local system.Corrected: potential dynam ic memory dead-lock, if HTTP server is serving large web resources.[USB Device and USB Host]ExamplesAdded: CDC exam ple for Infineon Hexagon Application Kit in folder..ARM\Boards\Infineon\Hexagon Application Kit\CPU_45A-V2\RL\USB\Device\CDC_ACM. [New Supported Devices]AtmelSAM4N16B, SAM4N16C, SAM4N8A, SAM4N8B, SAM4N8C,SAMD20E14, SAMD20E15, SAMD20E16, SAMD20E17, SAMD20G14, SAMD20G15,SAMD20G16, SAMD20G17, SAMD20G18, SAMD20J14,SAMD20J15, SAMD20J16, SAMD20J17, and SAMD20J18.CypressCY8C5265AXI-LP056, CY8C5265AXI-LP082, CY8C5265LTI-LP050, CY8C5265LTI-LP058, CY8C5266AXI-LP033, CY8C5266AXI-LP132, CY8C5266LTI-LP029, CY8C5266LTI-LP150, CY8C5267AXI-LP051, CY8C5267LTI-LP089, CY8C5268AXI-LP047, CY8C5268LTI-LP030, CY8C5465AXI-LP043, CY8C5465LTI-LP104, CY8C5466AXI-LP002, CY8C5466AXI-LP107, CY8C5466LTI-LP072, CY8C5466LTI-LP085, CY8C5467AXI-LP108, CY8C5467LTI-LP003, CY8C5468AXI-LP106, CY8C5468LTI-LP026, CY8C5666AXI-LP001, CY8C5666AXI-LP004, CY8C5666LTI-LP005, CY8C5667AXI-LP006, CY8C5667AXI-LP040, CY8C5667LTI-LP008, CY8C5667LTI-LP009, CY8C5667LTI-LP041, CY8C5668AXI-LP010, CY8C5668AXI-LP013, CY8C5668AXI-LP034, CY8C5668LTI-LP014, CY8C5866AXI-LP020, CY8C5866AXI-LP021, CY8C5866LTI-LP022, CY8C5867AXI-LP023, CY8C5867AXI-LP024, CY8C5867LTI-LP025, CY8C5867LTI-LP028, CY8C5868AXI-LP031, CY8C5868AXI-LP032, CY8C5868AXI-LP035, CY8C5868LTI-LP036, CY8C5868LTI-LP038, and CY8C5868LTI-LP039.EnergyMicroEFM32WG230F128, EFM32WG230F256, EFM32WG230F64, EFM32WG232F128, EFM32WG232F256,EFM32WG232F64,EFM32WG280F128, EFM32WG280F256, EFM32WG280F64, EFM32WG290F128, EFM32WG290F256,EFM32WG290F64,EFM32WG295F128, EFM32WG295F256, EFM32WG295F64, EFM32WG330F128, EFM32WG330F256,EFM32WG330F64,EFM32WG332F128, EFM32WG332F256, EFM32WG332F64, EFM32WG380F128, EFM32WG380F256,EFM32WG380F64,EFM32WG390F128, EFM32WG390F256, EFM32WG390F64, EFM32WG395F128, EFM32WG395F256,EFM32WG395F64,EFM32WG840F128, EFM32WG840F256, EFM32WG840F64, EFM32WG842F128, EFM32WG842F256,EFM32WG842F64,EFM32WG880F128, EFM32WG880F256, EFM32WG880F64, EFM32WG890F128, EFM32WG890F256,EFM32WG890F64,EFM32WG895F128, EFM32WG895F256, EFM32WG895F64, EFM32WG940F128, EFM32WG940F256,EFM32WG940F64,EFM32WG942F128, EFM32WG942F256, EFM32WG942F64, EFM32WG980F128, EFM32WG980F256,EFM32WG980F64, EFM32WG990F128, EFM32WG990F256, EFM32WG990F64, EFM32WG995F128,EFM32WG995F256, and EFM32WG995F64.Freescale SemiconductorMKE02Z16xxx2, MKE02Z32xxx2, MKE02Z64xxx2, MKE04Z8xxx4,Fujitsu SemiconductorMB9AF141L, MB9AF141M, MB9AF141N, MB9AF142L, MB9AF142M,MB9AF142N, MB9AF144L, MB9AF144M, and MB9AF144N.NuvotonM0516LBN, M0516ZBN, M052LBN, M052ZBN, M054LBN,M054ZBN, M058LBN, M058SLAN, M058SSAN, M058SZAN,M058ZBN, MINI51TAN, MINI52TAN, MINI54TAN,NUC123SC2AN1, NUC123LC2AN1, NUC123ZC2AN1, NUC123SD4AN0, NUC123LD4AN0,NUC123ZD4AN0, NUC140VE3CN, NUC140RE3CN, NUC140RD2CN, NUC140RC1CN,NUC140LE3CN, NUC140LD2CN, NUC140LC1CN, NUC130VE3CN, NUC130RE3CN,NUC130RD2CN, NUC130RC1CN, NUC130LE3CN, NUC130LD2CN, NUC130LC1CN,NUC120RD2BN, NUC120RD1BN, NUC120RC1BN, NUC120LD2BN, NUC120LD1BN,NUC120LC1BN, NUC100RD2BN, NUC100RD1BN, NUC100RC1BN, NUC100LD2BN, NUC100LD1BN, NUC100LC1BN, NUC220VE3AN, NUC220SE3AN, NUC220LE3AN, NUC220SD2AN, NUC220LD2AN, NUC220SC2AN, NUC220LC2AN, NUC200VE3AN, NUC200SE3AN, NUC200LE3AN, NUC200SD2AN, NUC200LD2AN, NUC200SC2AN, NUC200LC2AN, NANO100KE3BN, NANO100SE3BN, NANO100KD3BN, NANO100SD3BN, NANO100LD3BN, NANO100KD2BN, NANO100SD2BN, NANO100LD2BN, NANO100KC2BN, NANO100LC2BN, NANO100LE3BN, NANO100SC2BN, NANO110KE3BN, NANO110SE3BN, NANO110KD3BN, NANO110SD3BN, NANO110KD2BN,NANO110SD2BN, NANO110KC2BN, NANO110SC2BN,NANO120KE3BN, NANO120SE3BN, NANO120LE3BN, NANO120KD3BN, NANO120SD3BN, NANO120LD3BN,NANO120KD2BN, NANO120SD2BN, NANO120LD2BN, NANO120KC2BN, NANO120SC2BN, NANO120LC2BN, NANO130KE3BN, NANO130SE3BN, NANO130KD3BN, NANO130SD3BN,NANO130KD2BN, NANO130SD2BN, NANO130KC2BN, NANO130SC2BN,NXP (founded by Philips)LPC4310 CM0, LPC4320 CM0, LPC4330 CM0, LPC4350 CM0, LPC4353 CM0, and LPC4357 CM0.STMicroelectronicsSTM32F429BG, STM32F429BI, STM32F429IG, STM32F429II, STM32F429NG,STM32F429NI, STM32F429VG, STM32F429VI, STM32F429ZG, STM32F429ZI,STM32F439BG, STM32F439BI, STM32F439IG, STM32F439II, STM32F439NG,STM32F439NI, STM32F439VG, STM32F439VI, STM32F439ZG, and STM32F439ZI.Texas InstrumentsTM4C1290NCPDT, TM4C1290NCZAD, TM4C1292NCPDT, TM4C1292NCZAD, TM4C1294NCPDT,TM4C1294NCZAD, TM4C129CNCPDT, TM4C129CNCZAD, TM4C129DNCPDT, TM4C129DNCZAD,TM4C129ENCPDT, TM4C129ENCZAD, TM4C129XNCZAD, TM4E129BNCZAD, TM4E129SNCZAD,TM4E129XNCZAD, TMPM343F10XBG, TMPM343FDXBG, and TMPM343FEXBG.[Device Support][CMSIS support]AtmelAdded: suppport for Atmel SAMD20 devices, in folders ..\ARM\INC\Atmel\SAMD20\,..\ARM\Startup\Atmel\SAMD20\, and ..\ARM\SFD\Atmel\SAMD20\.Added: suppport for Atmel SAM4N devices, in folders ..\ARM\INC\Atmel\SAM4N\,..\ARM\Startup\Atmel\SAM4N\, and ..\ARM\SFD\Atmel\SAM4N\.EnergyMicroAdded: suppport for EnergyMicro Wonder Gecko devices, in folders..\ARM\INC\EnergyMicro\EFM32WG\, ..\ARM\Startup\EnergyMicro\EFM32WG\, and..\ARM\SFD\EnergyMicro\EFM32WG\.Freescale SemiconductorAdded: suppport for Kinetis KE02 devices, in folders ..\ARM\INC\Freescale\Kinetis\,..\ARM\Startup\Freescale\Kinetis\, and ..\ARM\SFD\Freescale\Kinetis\.Added: suppport for Kinetis KE04 devices, in folders ..\ARM\INC\Freescale\Kinetis\,..\ARM\Startup\Freescale\Kinetis\, and ..\ARM\SFD\Freescale\Kinetis\.Fujitsu SemiconductorAdded: suppport for MB9A140N devices, in folders ..\ARM\INC\Fujitsu\MB9A140N\,..\ARM\Startup\Fujitsu\MB9A140N\, and ..\ARM\SFD\Fujitsu\MB9A140N\.NuvotonAdded: suppport for NUC123Series devices, in folders ..\ARM\INC\Nuvoton\NUC123Series\,..\ARM\Startup\Nuvoton\NUC123Series\, and ..\ARM\SFD\Nuvoton\NUC123Series\.Added: suppport for NUC200Series devices, in folders ..\ARM\INC\Nuvoton\NUC200Series\,..\ARM\Startup\Nuvoton\NUC200Series\, and ..\ARM\SFD\Nuvoton\NUC200Series\.Added: suppport for Nano1xx devices, in folders ..\ARM\INC\Nuvoton\Nano1xx\,..\ARM\Startup\Nuvoton\Nano1xx\, and ..\ARM\SFD\Nuvoton\Nano1xx\.SONiXAdded: suppport for SN32F100 based devices, in folders ..\ARM\INC\SONiX\SN32F100\,..\ARM\Startup\SONiX\SN32F100\, and ..\ARM\SFD\SONiX\SN32F100\.Added: suppport for SN32F110 based devices, in folders ..\ARM\INC\SONiX\SN32F110\,..\ARM\Startup\SONiX\SN32F110\, and ..\ARM\SFD\SONiX\SN32F110\.STMicroelectronicsAdded: suppport for STM32F4xx based devices, in folders ..\ARM\INC\ST\STM32F4xx\,..\ARM\Startup\ST\STM32F4xx\, and ..\ARM\SFD\ST\STM32F4xx\.Texas InstrumentsAdded: suppport for TM4C123 based devices, in folders ..\ARM\INC\TI\TM4C123\,..\ARM\Startup\TI\TM4C123\, and ..\ARM\SFD\TI\TM4C123\.Added: suppport for TM4C129 based devices, in folders ..\ARM\INC\TI\TM4C129\,..\ARM\Startup\TI\TM4C129\, and ..\ARM\SFD\TI\TM4C129\.Added: suppport for TM4E129 based devices, in folders ..\ARM\INC\TI\TM4E129 \,..\ARM\Startup\TI\TM4E129\, and ..\ARM\SFD\TI\TM4E129\.[Flash programming]AtmelAdded: ATSAMD20_16.FLM, ATSAMD20_32.FLM, ATSAMD20_64.FLM, ATSAMD20_128.FLM, and ATSAMD20_256.FLM flash program m ing algorithm s for Atmel ATSAM20D based devices in folder..\ARM\Falsh\.Added: ATSAM4N_512.FLM and ATSAM4N_1024.FLM flash program m ing algorithm s for AtmelATSAM4N based devices in folder ..\ARM\Falsh\.Freescale SemiconductorAdded: MKE02Zxxx_EE256B.FLM, MKE02Zxxx_P16KB.FLM, MKE02Zxxx_P32KB.FLM, andMKE02Zxxx_P64KB.FLM flash program m ing algorithm s for Kinetis KE02 based devices in folder..\ARM\Flash\.Added: MKE04Zxxx_P8KB.FLM flash program m ing algorithm s for Kinetis KE04 based devices in folder..\ARM\Flash\.NuvotonAdded: NUC2xx_CFG.FLM, NUC2xx_AP_128.FLM, NUC2xx_AP_64.FLM, NUC2xx_AP_32.FLM,NUC2xx_LD_4.FLM, and NUC2xx_DAT.FLM flash program m ing algorithm s for NUC200Series devicesin folder ..\ARM\Flash\.Added: Nano100_CFG.FLM, Nano100_AP_123.FLM, Nano100_DAT.FLM, Nano100_AP_64.FLM,Nano100_LD_4.FLM, and Nano100_AP_32.FLM flash program m ing algorithm s for Nano1xx baseddevices in folder ..\ARM\Flash\.SONiXAdded: SN32F100_64.FLM and SN32F110_64.FLM flash program m ing algorithm s for SN32F100 andSN32F110 based devices in folder ..\ARM\Flash\.[Board Support]AtmelAdded: Blinky and RTX_Blinky exam ples for SAMD20-XPRO board, based on SAMD20J18 device.SONiXAdded: Hello exam ple for SN32F100_Starter_Kit board, based on SN32F109 device.STMicroelectronicsAdded: Blinky and RTX_Blinky exam ples for STM324x9I-EVAL evaluation board, based on STM32F439NIdevice.Added: Blinky, RTX_Blinky, and Blinky_ULp for STM32437I-EVAL evaluation board, based onSTM32F437II device.[Target debugging]Updated: support for NULink debugger from Nuvoton. The Nu_Link.dll driver dll in folder ..\ARM\NULInk\ has been updated to version 1.2.1.0.Updated: debug driver lm idk-agdi.dll for TI Stellaris In-Ciruit debug interface to version 211.0.0.0 in folder..\ARM\BIN\.Microcontroller Development Kit - Version 4.71a[uVision Debugger]Corrected: Missing RTX views for Cortex-M targets.[New Supported Devices]SONiXSN32F107, SN32F108, SN32F109,SN32F117, SN32F118, and SN32F119.Microcontroller Development Kit - Version 4.71[ARM Compiler]This version of MDK-ARM contains ARM Compiler 5.03u1.All com piler related files are located in ..\ARM\ARMCC\ directory.Details can be found in the Compiler specific Release Notes..[CMSIS]Updated: version 3.20.The software portions that are deployed in the application program are now under a BSD license which allows usage of CMSIS com ponents in any com m ercial or open source projects. The individual com ponents have been updated as listed below:CMSIS-CORE adds functions for setting breakpoints, supports the latest GCC Compiler, and containsseveral corrections.CMSIS-DSP library is optim ized for m ore perform ance and contains several bug fixes.CMSIS-RTOS API is extended with capabilities for short tim eouts, Kernel initialization, and prepared for a C++ interface.CMSIS-SVD is unchanged.[µVision]This MDK-ARM release is delivered with µVision V4.71.0 IDE.Enhanced:Automatic Code Completion and Parameter Information.Enhanced: Dynamic Syntax Checking.[uVision Debugger]The uVision debugger now shows device specific interrupt nam es if defined in a System Viewer Description (SVD) file.The tim e window lim itation of 10 m s has been rem oved for searching and saving trace data in Unlimited Trace m ode.Updated: Segger J-Link driver for ARM devices to version 4.68a.[Middleware][ARM Middleware][TCPnet]Added: SNTP client im plem entation with support for unicast and broadcast m ode.Corrected: buffer queue clearing in BSD socket interface, which m ight cause early receive data loss in listening server sockets.Corrected: potential data loss in BSD socket receive, if the system runs out of m em ory.ExamplesAdded: BSD_client, BSD_server, DNS_dem o, FTP_dem o, Http_dem o, Http_upload, LEDClient,LEDSwitch, SMTP_dem o, SNMP_dem o, and Telnet_dem o exam ples for TWR-K60D100M evaluationboard in folder ..\Boards\Freescale\TWR-K60D100M\RL\TCPnet\ based on MK60DN512xxx10device.[FlashFS]ExamplesAdded: SD_File exam ple for TWR-K60D100M evaluation board in folder ..\Boards\Freescale\TWR-K60D100M\RL\FlashFS\ based on MK60DN512xxx10 device.[USB Device and USB Host]ExamplesAdded: HID and Mem ory exam ples for TWR-K60D100M evaluation board in folder..\Boards\Freescale\TWR-K60D100M\RL\USB\Device\ based on MK60DN512xxx10 device.Added: RTX HID and RTX Mem ory exam ples for TWR-K60D100M evaluation board in folder..\Boards\Freescale\TWR-K60D100M\RL\USB\Device\RTX\ based on MK60DN512xxx10 device.Added: HID_Kbd and MSD_File exam ples for TWR-K60D100M evaluation board in folder..\Boards\Freescale\TWR-K60D100M\RL\USB\Host\ based on MK60DN512xxx10 device.[CAN]ExamplesAdded: CAN_Ex1 and CAN_Ex1 exam ples for TWR-K60D100M evaluation board in folder..\Boards\Freescale\TWR-K60D100M\RL\CAN\ based on MK60DN512xxx10 device.[Segger Graphic Library]Updated: Segger emWin graphic library version 5.20b in folder ..\ARM\Segger\emWin\.[New Supported Devices]AtmelSAM3N00A, SAM3N00B, SAM3N0A, SAM3N0B, SAM3N0C,SAM4E16C, SAM4E16E, SAM4E8C, SAM4E8E,SAM4SA16B, SAM4SA16C, SAM4SD16B, SAM4SD16C, SAM4SD32B, and SAM4SD32C.Dialog SemiconductorDA14580.Freescale SemiconductorMK21FN1M0xxx12, MK21FX512xxx12, MK22FN1M0xxx12, MK22FX512xxx12,MKL02Z16xxx4, MKL02Z32xxx4, MKL02Z8xxx4, MKL16Z256xxx4,MKL26Z128xxx4, MKL26Z256xxx4, MKL34Z64xxx4, MKL36Z128xxx4,MKL36Z256xxx4, MKL46Z128xxx4, MKL46Z256xxx4, MKM13Z64xxx5,MKM14Z128xxx5, MKM14Z64xxx5, MKM32Z64xxx5, MKM33Z128xxx5,MKM33Z64xxx5, MKM34Z128xxx5, and MKM38Z128xxx5.。

IO-Link手册第三版请访问：/CN目录引言第4页第1部分：IO-Link简介第5页◆老派传感器第5页◆微型开关量传感器驱动第5页◆I O-Link：开放式低成本传感器接口第5页◆I O-Link节点第5页◆I O-Link系统第6页◆I O-Link接口在IEC 61131-9中被标准化为SDCI第6页◆物理层IO-Link标准化接口第6页◆物理层电气规范第7页◆自动化体系中的IO-Link第7页◆I O-Link：实现智能传感器第7页◆工业传感器生态系统第8页第6部分：提高系统性能第24页◆散热第24页◆测试A第24页◆测试B第24页◆测试C第24页◆热性能第24页◆分立解决方案第25页◆集成解决方案第25页◆选择TVS二极管第25页◆I O-Link保护电路第25页◆65 V（绝对最大值）如何帮助提供保护（对比40 V）第25页◆65 V绝对最大值的保护优势第25页◆小结第26页◆I O-Link信号摆率如何影响IO-Link电缆辐射？第26页引言当今的无风扇可编程逻辑控制器(PLC)和IO-Link®网关系统须消耗大量功率，具体取决于I/O配置（IO-Link、数字输入/输出、模拟输入/输出）。

随着这些PLC演变成新的工业4.0智能工厂，我们必须深谋远虑，实现更智能、更快速、更低功耗的解决方案。

这场革命的核心是一项名为“IO-Link”的新技术，能帮助实现灵活制造，从而改善工厂吞吐量，提高运营效率。

这项激动人心的新技术正使传统传感器转变为智能传感器。

ADI公司提供一系列先进的工厂自动化解决方案，并通过我们的IO-Link技术产品系列进一步改进性能，为实现工业4.0铺路架桥。

MAX22513是该产品系列的最新成员，这是一款微型双通道IO-Link收发器，集成了浪涌保护和DC-DC转换器，可减少热耗散并提高工厂车间传感器的稳定性。

为了帮助我们的客户缩短上市时间，我们与来自IO-Link联盟的软件协议栈供应商合作开发了一系列经过全面验证和测试的参考设计，本手册对此进行了详细说明。

模拟电路知识1、基尔霍夫定理的内容是什么？基尔霍夫定律包括电流定律和电压定律电流定律：在集总电路中，任何时刻，对任一节点，所有流出节点的支路电流的代数和恒等于零。

电压定律：在集总电路中，任何时刻，沿任一回路，所有支路电压的代数和恒等于零。

2、描述反馈电路的概念，列举他们的应用。

反馈，就是在电子系统中，把输出回路中的电量输入到输入回路中去。

反馈的类型有：电压串联负反馈、电流串联负反馈、电压并联负反馈、电流并联负反馈。

负反馈的优点：降低放大器的增益灵敏度，改变输入电阻和输出电阻，改善放大器的线性和非线性失真，有效地扩展放大器的通频带，自动调节作用。

电压负反馈的特点：电路的输出电压趋向于维持恒定。

电流负反馈的特点：电路的输出电流趋向于维持恒定。

3、有源滤波器和无源滤波器的区别无源滤波器：这种电路主要有无源元件R、L和C组成有源滤波器：集成运放和R、C组成，具有不用电感、体积小、重量轻等优点。

集成运放的开环电压增益和输入阻抗均很高，输出电阻小，构成有源滤波电路后还具有一定的电压放大和缓冲作用。

但集成运放带宽有限，所以目前的有源滤波电路的工作频率难以做得很高。

6、FPGA和ASIC的概念，他们的区别。

（未知）答案：FPGA是可编程ASIC。

ASIC:专用集成电路，它是面向专门用途的电路，专门为一个用户设计和制造的。

根据一个用户的特定要求，能以低研制成本，短、交货周期供货的全定制，半定制集成电路。

与门阵列等其它ASIC(Application Specific IC)相比，它们又具有设计开发周期短、设计制造成本低、开发工具先进、标准产品无需测试、质量稳定以及可实时在线检验等优点。

7、什么叫做OTP片、掩膜片，两者的区别何在？OTP means one time program，一次性编程MTP means multi time program，多次性编程OTP（One Time Program）是MCU的一种存储器类型MCU按其存储器类型可分为MASK(掩模)ROM、OTP(一次性可编程)ROM、FLASHROM 等类型。

3.1 时序输入指令223.1.1 读LD／读?非LDNOT223.1.2 与AND／与?非ANDNOT233.1.3 或OR／或?非ORNOT233.1.4 块?与ANDLD243.1.5 块?或ORLD243.1.6 非NOT（520）253.1.7 P.F.上升沿微分UP（521）253.1.8 P.F.下降沿微分DOWN（522）253.1.9 LD型?位测试LDTST（350）／LD型?位测试非LDTSTN（351）263.1.1 0AND型?位测试ANDTST（350）／ANDLD型?位测试非ANDTSTN（351）26 3.1.1 1OR型?位测试ORTST（350）／OR型?位测试非ORTSTN（351）273.2 时序输出指令273.2.1 输出OUT／输出非OUTNOT273.2.2 临时存储继电器TR283.2.3 保持KEEP（011）283.2.4 上升沿微分DIFU（013）293.2.5 下降沿微分DIFD（015）293.2.6 置位SET／复位RSET293.2.7 多位置位SETA（530）303.2.8 多位复位RSTA（531）303.2.9 1位置位SETB（532）／1位复位RSTB（533）313.2.1 01位输出OUTB（535）313.3 时序控制指令323.3.1 结束END（001）323.3.2 无功能NOP（000）323.3.3 互锁IL（002）／互锁解除ILC（003）333.3.4 多重互锁（微分标志保持型）MILH（517）／多重互锁（微分标志非保持型）MILR（518）／多重互锁解除MILC（519）333.3.5 转移JMP（005）／转移结束JME（005）343.3.6 条件转移CJP（510）/条件非转移CJPN（511）／转移结束JME（005）35 3.3.7 多重转移JMP0（515）／多重转移结束JME0（516）353.3.8 循环开始FOR（512）/循环结束NEXT（513）363.3.9 循环中断BREAK（515）37第4章定时器/计数器指令384.1 定时器指令384.1.1 定时器TIM／TIMX（550）384.1.2 高速定时器TIMH（015）／TIMHX（551）394.1.3 超高速定时器TMHH（540）／TMHHX（552）394.1.4 累计定时器TTIM（087）／TTIMX（555）404.1.5 长时间定时器TIML（542）／TIMLX（553）414.1.6 多输出定时器MTIM（543）／MTIMX（554）414.2 计数器指令424.2.1 计数器CNT／CNTX（546）424.2.2 可逆计数器CNTR（012）／CNTRX（548）434.2.3 定时器／计数器复位CNR（545）／CNRX（547）43第5章数据指令445.1 数据比较指令465.1.1 符号比较=、<>、<、<=、>、>=（S、L）（LD/AND/OR型）（300～328）465.1.2 时刻比较=DT、<>DT、<DT、<=DT、>DT、>=DT（LD/AND/OR型）（341～346）49 5.1.3 无符号比较CMP（020）／无符号倍长比较CMPL（060）505.1.4 带符号BIN比较CPS（114）／带符号BIN倍长比较CPSL（115）505.1.5 多通道比较MCMP（019）515.1.6 表格一致TCMP（085）515.1.7 无符号表间比较BCMP（068）525.1.8 扩展表间比较BCMP2（502）525.1.9 区域比较ZCP（088）／倍长区域比较ZCPL（116）535.2 数据传送指令545.2.1 传送MOV（021）／倍长传送MOVL（498）545.2.2 否定传送MVN（022）／否定倍长传送MVNL（499）545.2.3 位传送MOVB（082）555.2.4 数字传送MOVD（083）555.2.5 多位传送XFRB（062）565.2.6 块传送XFER（070）565.2.7 块设定BSET（071）575.2.8 数据交换XCHG（073）／数据倍长交换XCGL（562）575.2.9 数据分配DIST（080）575.2.1 0数据抽取COLL（081）585.2.1 1变址寄存器设定MOVR（560）／MOVRW（561）585.3 数据移位指令595.3.1 移位寄存器SFT（010）595.3.2 左右移位寄存器SFTR（084）595.3.3 非同步移位寄存器ASFT（017）605.3.4 字移位WSFT（016）605.3.5 1位左移位ASL（025）／1位倍长左移位ASLL（570）605.3.6 1位右移位ASR（026）／1位倍长右移位ASRL（571）615.3.7 带CY左循环1位ROL（027）／带CY倍长左循环1位ROLL（572）615.3.8 无CY左循环1位RLNC（574）／无CY倍长左循环1位RLNL（576）625.3.9 带CY右循环1位ROR（028）／带CY倍长右循环1位RORL（573）625.3.1 0无CY右循环1位RRNC（575）／无CY倍长右循环1位RRNL（577）625.3.1 11位左移位SLD（074）635.3.1 21位右移位SRD（075）635.3.1 3N位数据左移位NSFL（578）645.3.1 4N位数据右移位NSFR（579）645.3.1 5N位左移位NASL（580）／N位倍长左移位NSLL（582）655.3.1 6N位右移位NASR（581）／N位倍长右移位NSRL（583）655.4 数据转换指令665.4.1 BCD→BIN转换BIN（023）／BCD→BIN倍长转换BINL（058）665.4.2 BIN→BCD转换BCD（024）／BIN→BCD倍长转换BCDL（059）665.4.3 2的补数转换NEG（160）／2的补数倍长转换NEGL（161）675.4.4 符号扩展SIGN（600）685.4.5 4→16/8→256解码器MLPX（076）685.4.6 16→4/256→8编码器DMPX（077）695.4.7 ASCII代码转换ASC（086）705.4.8 ASCII→HEX转换HEX（162）705.4.9 位列→位行转换LINE（063）715.4.1 0位行→位列转换COLM（064）715.4.1 1带符号BCD→BIN转换BINS（470）725.4.1 2带符号BCD→BIN倍长转换BISL（472）735.4.1 3带符号BIN→BCD转换BCDS（471）745.4.1 4带符号BIN→BCD倍长转换BDSL（473）755.4.1 5格雷码转换GRY（474）765.5 数据控制指令775.5.1 PID运算PID（190）775.5.2 自带整定PID运算PIDAT（191）785.5.3 上下限限位控制LMT（680）795.5.4 死区控制BAND（681）805.5.5 死区控制ZONE（682）815.5.6 时分割比例输出TPO（685）815.5.7 定校比例SCL（194）825.5.8 定校比例2SCL2（486）835.5.9 定校比例3SCL3（487）835.5.1 0数据平均化AVG（195）845.6 表格数据处理指令855.6.1 栈区域设定SSET（630）855.6.2 栈数据存储PUSH（632）865.6.3 后进先出LIFO（634）865.6.4 先进先出FIFO（633）875.6.5 表区域声明DIM（631）875.6.6 记录位置设定SETR（635）885.6.7 记录位置读取GETR（636）885.6.8 数据检索SRCH（181）895.6.9 字节交换SWAP（637）895.6.1 0最大值检索MAX（182）905.6.1 1最小值检索MIN（183）915.6.1 2求和SUM（184）915.6.1 3FCS值计算FCS（180）925.6.1 4栈数据数输出SNUM（638）925.6.1 5栈数据参见SREAD（639）935.6.1 6栈数据更新SWRIT（640）935.6.1 7栈数据插入SINS（641）945.6.1 8栈数据删除SDEL（642）94第6章运算指令966.1 自加／自减指令（增量/减量指令）996.1.1 BIN增量++（590）／BIN倍长增量++L（591）996.1.2 BIN减量－－（592）／BIN倍长减量－－L（593）1006.1.3 BCD增量++B（594）／BCD倍长增量++BL（595）1016.1.4 BCD减量－－B（596）／BCD倍长减量－－BL（597）1026.2 四则运算指令1036.2.1 带符号?无CYBIN加法+（400）／带符号?无CYBIN倍长加法+L（401）103 6.2.2 符号?带CYBIN加法+C（402）／符号?带CYBIN倍长加法+CL（403）1046.2.3 无CYBCD加法+B（404）／无CYBCD倍长加法+BL（405）1056.2.4 带CYBCD加法+BC（406）／带CYBCD倍长加法+BCL（407）1056.2.5 带符号?无CYBIN减法－（410）／带符号?无CYBIN倍长减法－L（411）1066.2.6 符号?带CYBIN减法－C（412）／符号?带CYBIN倍长减法－CL（413）107 6.2.7 无CYBCD减法－B（414）／无CYBCD倍长减法－BL（415）1086.2.8 带CYBCD减法－BC（416）／带CYBCD倍长减法－BCL（417）1096.2.9 带符号BIN乘法*（420）／带符号BIN倍长乘法*L（421）1106.2.1 0无符号BIN乘法*U（422）／无符号BIN倍长乘法＊UL（423）1116.2.1 1BCD乘法*B（424）／BCD倍长乘法*BL（425）1116.2.1 2带符号BIN除法／（430）／带符号BIN倍长除法／L（431）1126.2.1 3无符号BIN除法／U（432）／无符号BIN倍长除法／UL（433）1136.2.1 4BCD除法／B（434）／BCD倍长除法／BL（435）1146.3 逻辑运算指令1146.3.1 字逻辑积ANDW（034）／字倍长逻辑积ANDL（610）1146.3.2 字逻辑和ORW（035）／字倍长逻辑和ORWL（611）1156.3.3 字同或逻辑和XORW（036）／字倍长同或逻辑和XORL（612）1166.3.4 字异或XNRW（037）／字倍长异或XNRL（613）1166.3.5 位反转COM（029）／位倍长反转COML（614）1176.4 特殊运算指令1186.4.1 BIN平方根运算ROTB（620）1186.4.2 BCD平方根运算ROOT（072）1186.4.3 数值转换APR（069）1196.4.4 浮点除法（BCD）FDIV（079）1196.4.5 位计数BCNT（067）1206.5 浮点转换?运算指令1206.5.1 浮点→16位BIN转换FIX（450）1206.5.2 浮点→32位BIN转换FIXL（451）1216.5.3 16位BIN→浮点转换FLT（452）1216.5.4 32位BIN→浮点转换FLTL（453）1216.5.5 浮点加法+F（454）1226.5.6 浮点减法－F（455）1226.5.7 浮点乘法*F（456）1226.5.8 浮点除法／F（457）1236.5.9 角度→弧度转换RAD（458）1236.5.1 0弧度→角度转换DEG（459）1236.5.1 1SIN运算SIN（460）1246.5.1 2COS运算COS（461）1246.5.1 3TAN运算TAN（462）1246.5.1 4SIN?1运算ASIN（463）1256.5.1 5COS?1运算ACOS（464）1256.5.1 6TAN?1运算ATAN（465）1256.5.1 7平方根运算SQRT（466）1266.5.1 8指数运算EXP（467）1266.5.1 9对数运算LOG（468）1266.5.2 0乘方运算PWR（840）1276.5.2 1单精度浮点数据比较=F、<>F、<F、<=F、>F、>=F（LD/AND/OR型）（329～334）1276.5.2 2浮点＜单＞→字符串转换FSTR（448）1286.5.2 3字符串→浮点＜单＞转换FVAL（449）1296.6 （倍）双精度浮点转换?运算指令1306.6.1 浮点→16位BIN转换＜倍＞FIXD（841）1306.6.2 浮点→32位BIN转换＜倍＞FIXLD（842）1306.6.3 16位BIN→浮点转换＜倍＞DBL（843）1306.6.4 32位BIN→浮点转换＜倍＞DBLL（844）1316.6.5 浮点加法＜倍＞+D（845）1316.6.6 浮点减法＜倍＞－D（846）1316.6.7 浮点乘法＜倍＞×D（847）1326.6.8 浮点除法＜倍＞／D（848）1326.6.9 角度→弧度转换＜倍＞RADD（849）1326.6.1 0弧度→角度转换＜倍＞DEGD（850）1336.6.1 1SIN运算＜倍＞SIND（851）1336.6.1 2COS运算＜倍＞COSD（852）1336.6.1 3TAN运算＜倍＞TAND（853）1346.6.1 4SIN?1运算＜倍＞ASIND（854）1346.6.1 5COS?1运算＜倍＞ACOSD（855）1346.6.1 6TAN?1运算＜倍＞ATAND（856）1356.6.1 7平方根运算＜倍＞SQRTD（857）1356.6.1 8指数运算＜倍＞EXPD（858）1356.6.1 9对数运算＜倍＞LOGD（859）1366.6.2 0乘方运算＜倍＞PWRD（860）1366.6.2 1倍精度浮点数据比较=D、<>D、<D、<=D、>D、>=D（LD/AND/OR型）（335～340）136第7章子程序及中断控制指令1387.1 子程序指令1387.1.1 子程序调用SBS（091）1387.1.2 宏MCRO（099）1397.1.3 子程序进入SBN（092）／子程序返回RET（093）1407.1.4 全局子程序调用GSBS（750）1407.1.5 全局子程序进入GSBN（751）／全局子程序返回GRET（752）141 7.2 中断控制指令1427.2.1 中断掩码组MSKS（690）1427.2.2 中断掩码读取MSKR（692）1437.2.3 中断解除CLI（691）1447.2.4 中断任务执行禁止DI（693）1447.2.5 中断任务执行禁止解除EI（694）145第8章 I/O单元用和高速计数／脉冲输出指令1468.1 I/O单元用指令1478.1.1 I/O刷新IORF（097）1478.1.2 7段解码器SDEC（078）1478.1.3 数字式开关DSW（210）1488.1.4 10键输入TKY（211）1488.1.5 16键输入HKY（212）1498.1.6 矩阵输入MTR（213）1498.1.7 7段显示7SEG（214）1508.1.8 智能I/O读出IORD（222）1508.1.9 智能I/O写入IOWR（223）1518.1.1 0CPU高功能单元每次I/O刷新DLNK（226）1518.2 高速计数／脉冲输出指令1528.2.1 动作模式控制INI（880）1528.2.2 脉冲当前值读取PRV（881）1538.2.3 脉冲频率转换PRV2（883）1538.2.4 比较表登录CTBL（882）1548.2.5 频率设定SPED（885）1548.2.6 脉冲量设置PULS（886）1558.2.7 定位PLS2（887）1568.2.8 频率加减速控制ACC（888）1568.2.9 原点搜索ORG（889）1578.2.1 0PWM输出PWM（891）158第9章通信指令1599.1 串行通信指令1609.1.1 协议宏PMCR（260）1609.1.2 串行端口输出TXD（236）1609.1.3 串行端口输入RXD（235）1619.1.4 串行通信单元串行端口输出TXDU（256）1619.1.5 串行通信单元串行端口输入RXDU（255）1629.1.6 串行端口通信设定变更STUP（237）1639.2 网络通信用指令1639.2.1 网络发送SEND（090）1639.2.2 网络接收RECV（098）1649.2.3 指令发送CMND（490）1649.2.4 通用Explicit信息发送指令EXPLT（720）1659.2.5 Explicit读出指令EGATR（721）1659.2.6 Explicit写入指令ESATR（722）1669.2.7 ExplicitCPU单元数据读出指令ECHRD（723）1669.2.8 ExplicitCPU单元数据写入指令ECHWR（724）167第10章块指令16810.1 块程序指令16910.1.1 块程序BPRG（096）／块程序结束BEND（801）16910.1.2 块程序暂时停止BPPS（811）／块程序再启动BPRS（812）16910.1.3 带条件结束EXIT（806）／带条件结束（非）EXITNOT（806）17010.1.4 条件分支块IF（802）／条件分支块（非）IFNOT（802）／条件分支伪块ELSE（803）／条件分支块结束IEND（804）17010.1.5 1扫描条件等待WAIT（805）／1扫描条件等待（非）WAITNOT（805）171 10.1.6 定时等待TIMW（813）／TIMWX（816）17210.1.7 计数等待CNTW（814）／CNTWX（818）17310.1.8 高速定时等待TMHW（815）／TMHWX（817）17310.1.9 重复块LOOP（809）／重复块结束LEND（810）／重复块结束（非）LEND NOT（810）17410.2 功能块用特殊指令175变量类别获得GETID（286）175第11章字符串处理指令及特殊指令17611.1 字符串处理指令17611.1.1 字符串?传送MOV$（664）17611.1.2 字符串?连接+$（656）17711.1.3 字符串?从左读出LEFT$（652）17711.1.4 字符串?从右读出RGHT$（653）17811.1.5 字符串?从任意位置的读出MID$（654）17811.1.6 字符串?检索FIND$（660）17911.1.7 字符串?长度检测LEN$（650）17911.1.8 字符串?置换RPLC$（661）18011.1.9 字符串?删除DEL$（658）18011.1.1 0字符串?交换XCHG$（665）18111.1.1 1字符串?清除CLR$（666）18111.1.1 2字符串?插入INS$（657）18211.1.1 3字符串比较LD、AND、OR=$、<>$、<$、<=$、>$、>=$（670～675）182 11.2 特殊指令18311.2.1 置进位/清除进位STC(040)/CLC(041)18311.2.2 循环时间监视时间设定WDT（094）18411.2.3 条件标志保存CCS（282）／条件标志加载CCL（283）18411.2.4 CV→CS地址转换FRMCV（284）18511.2.5 CS→CV地址转换TOCV（285）186第12章其他指令18712.1 工序（程）步进控制指令188步梯形区域步进SNXT（009）／步梯形区域定义STEP（008）18812.2 显（表）示功能用指令189信息显示MSG（046）18912.3 时钟功能用指令19012.3.1 日历加法CADD（730）19012.3.2 日历减法CSUB（731）19012.3.3 时分秒→秒转换SEC（065）19112.3.4 秒→时分秒转换HMS（066）19112.3.5 时钟补正DATE（735）19212.4 调试处理指令192跟踪存储器取样TRSM（045）19212.5 故障诊断指令19312.5.1 运转持续故障诊断FAL（006）19312.5.2 运转停止故障诊断FALS（007）19412.5.3 故障点检测FPD（269）19512.6 任务控制指令19512.6.1 任务执行启动TKON（820）19512.6.2 任务执行待机TKOF（821）19612.7 机种转换用指令19712.7.1 块传送XFERC（565）19712.7.2 数据分配DISTC（566）19812.7.3 数据抽出COLLC（567）19912.7.4 位传送MOVBC（568）20012.7.5 位计数BCNTC（621）200。

通信原理实验报告班级： 12050641姓名：谢昌辉学号： 1205064135实验一 抽样定理实验一、实验目的1、 了解抽样定理在通信系统中的重要性。

2、 掌握自然抽样及平顶抽样的实现方法。

3、 理解低通采样定理的原理。

4、 理解实际的抽样系统。

5、 理解低通滤波器的幅频特性对抽样信号恢复的影响。

6、 理解低通滤波器的相频特性对抽样信号恢复的影响。

7、 理解带通采样定理的原理。

二、实验器材1、 主控&信号源、3号模块 各一块2、 双踪示波器 一台3、 连接线 若干三、实验原理1、实验原理框图保持电路S1信号源A-outmusic抽样电路被抽样信号抽样脉冲平顶抽样自然抽样抽样输出抗混叠滤波器LPFLPF-INLPF-OUTFPGA 数字滤波FIR/IIR译码输出编码输入3# 信源编译码模块图1-1 抽样定理实验框图2、实验框图说明抽样信号由抽样电路产生。

将输入的被抽样信号与抽样脉冲相乘就可以得到自然抽样信号，自然抽样的信号经过保持电路得到平顶抽样信号。

平顶抽样和自然抽样信号是通过开关S1切换输出的。

抽样信号的恢复是将抽样信号经过低通滤波器，即可得到恢复的信号。

这里滤波器可以选用抗混叠滤波器（8阶3.4kHz 的巴特沃斯低通滤波器）或FPGA 数字滤波器（有FIR 、IIR 两种）。

反sinc 滤波器不是用来恢复抽样信号的，而是用来应对孔径失真现象。

要注意，这里的数字滤波器是借用的信源编译码部分的端口。

在做本实验时与信源编译码的内容没有联系。

四、实验步骤实验项目一抽样信号观测及抽样定理验证概述：通过不同频率的抽样时钟，从时域和频域两方面观测自然抽样和平顶抽样的输出波形，以及信号恢复的混叠情况，从而了解不同抽样方式的输出差异和联系，验证抽样定理。

1、关电，按表格所示进行连线。

源端口目标端口连线说明信号源：MUSIC 模块3：TH1(被抽样信号) 将被抽样信号送入抽样单元信号源：A-OUT 模块3：TH2(抽样脉冲) 提供抽样时钟模块3：TH3(抽样输出) 模块3：TH5(LPF-IN) 送入模拟低通滤波器2、开电，设置主控菜单，选择【主菜单】→【通信原理】→【抽样定理】。

万联证券证券研究报告|电子豪威发布汽车ASIC ，台积电3nm 制程有望试产强于大市（维持）——电子行业周观点（01.04-01.08）日期：2021年01月11日[Table_Summary] 行业核心观点：上周电子指数上涨，涨幅为4.79%，跑输沪深300指数0.66个百分点，从子行业来看，二级子行业全体上涨，涨幅最大的是电子制造Ⅱ(申万)。

半导体方面，豪威科技发布汽车专用集成电路（ASIC ）；台积电3纳米今年有望试产，与5nm 、7nm 100%IP 兼容。

消费电子方面，三星推出全新Neo QLED 电视。

建议投资者关注电子行业核心器件和材料的优质标的，推荐集成电路、显示器件、半导体材料等高景气度细分领域。

投资要点： ⚫豪威科技发布汽车专用集成电路（ASIC ）:豪威科技近期发布了汽车专用集成电路（ASIC ）——OAX8000，这款产品采用了AI 技术，针对入门级独立驾驶员监控系统（DMS ）进行了优化。

豪威科技是国内CIS 领军企业，旗下48M 以上CIS 产品与三星、索尼等老牌厂商可同台竞技，在图像处理领域积累了硬件的先发优势，为其进军汽车电子领域奠定了良好基础，此次发布入门级QAX8000，意在试探汽车SOC 新领域，集成化发展未来可期。

⚫台积电3纳米今年有望试产:台积电供应链近日透露，其3纳米新厂规划在今年7-8月开厂，相关供应商须在今年中以前备妥机台准备进机，3纳米于试产阶段（2021下半年）即可达约每月2-3万片的产能，到2023年将达10.5万片每月。

3纳米制程将依循7纳米及5纳米的家族模式，客户在同一制程节点可沿用既有设计基础架构，达到100%IP 兼容，可加速产品创新及上市速度。

⚫行业估值高于十年平均，行业交易活跃度上涨：上周日均交易额为1278.73亿元，交易活跃度环比上涨44.47%。

估值上看，SW 电子行业PE （TTM ）已从2018年低点23.17倍反弹至52.37倍，高于行业估值十年均值49.01倍6.86%，距行业估值的峰值88.11倍还有40.56%的空间。