LED背光源3014规格书

**
* If use the Type I of pick-up head must accord with the following rule:
1.The outside length of Pick-up Head “X3” must bigger than the window length of LED “X2”.
LED Sketch Map
4
Pick-up Head Sketch Map
Spectrum Distribution
Ta=25℃ IF=20mA
Forward Voltage vs. Forward Current
Ta=25℃
Forward Current vs. Relative Luminosity
4.The inside width of Pick-up Head “Y4” must smaller than the outside width of LED “Y1”.
** If use the Type II of pick-up head must accord with the following rule:
Approval Sheet
Product：
3014 White SMD LED
Part Number： PD14W01 V0
Customer： AUO
Issue Date： 2009/07/03
Feature
High brightness Side view LED Dice Technology : InGaN Small package outline (LxWxH) of 3.0 x 1.4 x 1.2 mm Wide viewing angle (Lambertian Emitter) Side Diffusion Lens No UV Qualified according to JEDEC moisture sensitivity Level 3
1 IF=20mA
0.8
0.6
0.4
0.2
0 20
40
60
80
100
Duty Ratio(%)
Chromaticity vs. Duty Ratio
0.2683 0.2682
40%
20%
0.2681 0.268
0.2679 100%
80%
60%
0.2678 0.2677
IF=20mA
0.2909 0.291 0.2911 0.2912 0.2913 0.2914 0.2915 0.2916
** The luminous intensity tolerance is ± 7%. *** Life time means that estimated time to 50% degradation of initial luminous intensity.
Life test board information, please refer to appendix II.
*
TYPE I
Y3 the outside width of Pick-up Head
*
Y4 the inside width of Pick-up Head
*
D the outside diameter of Pick-up Head **
TYPE II
d the inside diameter of Pick-up Head
Lead Solder
Temperature ( C)
Peak Temp. 235 C Max 235 220
180
Gradual Cooling
150
Preheat Zone
Soldering Zone
Temperature ( C)
Lead – Free Solder
260 220 200 160
IF=20mA
Forward Current vs. Chromaticity Coordinate
℃ Ta=25
Ambient Temperature vs. Forward Voltage
IF=20mA
Relative Luminous Intensity CIEy
Relative Luminous Intensity vs. Duty Ratio
The suggestion pick-up head is as same as follow the Sketch Map.
About the downward pressure of Pick-up Head, Please consult the Absolute Maximum Ratings.
Reflow Soldering and Temperature Profile
The SMD LED is designed for the reflow soldering process. Too high temperature or too large temperature gradient may cause the electrical and optical failures.
Chip specification
As appendix Ι
2
Outline Dimension & Recommended Solder Pattern
Cathode Mark
1(-)
2(+)
BACK VIEW
Unit:mm Tolerances:±0.10
Recommended Pad
Pin connection
30 0.5 45
Radiation Angle
45° 60°
75° 90°
60 715.0 90
View Angle Y-Y
1.0
0°
15°
0.9
30°
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-90° -75° -60 ° -45 ° -30 ° -15° 0 ° 15
30 0.5 45
Applications
LCD Back light Indicators Switch lights
MAKER
Prepared
Approved
Ivan Chiu
William Wu
CUSTOMER
1
Opto-Electronical Characteristics
Parameter Forward Voltage*
CIEx
6
Allowable Forward Current vs. Duty Ratio
℃ Ta=25
Radiation Pattern
Relative Luminosity
View Angle X-X
1.0
0°
15°
0.9
30°
0.8
0.7 0.6
0.5 0.4 0.3
0.2 0.1 0.0
-90° -75° -60 ° -45 ° -30 ° -15° 0 ° 15
1(-)
2(+)
Note: If the Bottom-Lead electrode contact the metal, it must be short.
3
Pick-up Head Suggestion
Symbol Definition
Specification
X1 the outside length of LED
Symbo Condition Min.
Typ.
Max.
Unit
l
VF
IF = 20mA
3.0
3.2
3.4 V
VF2
IF = 0.05µA
1.8
2.1
2.3
Luminous Flux**
Φv
IF = 20mA
4.6
5.7
7.0 lm
Luminous Intensity** Iv
IF = 20mA
( 1675 )
90 ~ 220 Sec
25 Sec Max.
Time
Peak Temp. 260 C Max 10 Sec Max.
Preheat Zone
Gradual Cooling
Soldering Zone
90 ~ 220 Sec
60 Sec Max.
Time
Reliability Test Items
9
1000
30
>70%
<110%
Temperature
2
60
humidity storage
90
-----
1000
30
>70%
<110%
3 Low temp Storage
-40
-----
1000
30
Steady State
4
Operating Life
25
IF =20mA
1000
30
-
( 2530 ) mcd
View Angle
θx-x θy-y
IF = 20mA
-
118 118
-
deg
-
deg
Leakage current
Ir
-5V
-
2
℃ Ta=60
Life time***
≦ ℃ IF=20mA
Tj 70
15000
-
-
µA
-
hrs
* The Forward Voltage tolerance is ±0.03V.
Ambient Temperature vs. Allowable Forward
℃ Ta=25
℃ Ta=25
5
Ambient Temperature Vs. Chromaticity Coordinate
Ambient Temperature vs. Relative Luminosity
IF=20mA
45° 60°
75° 90°
60 715.0 90
Radiation Angle
7
Relative Luminosity
Absolute Maximum Ratings
Parameter
Symbol Rating
Reverse Voltage
Vr
5
Forward Current
If
30
Power Dissipation
V
Kg/cm2
8
Surface Mounting Condition
In the automatic mounting of the SMD LED to the PCB, any bending, expanding, and pulling forces against the SMD LED should be minimized to prevent the electrical failures or mechanical damaged.
1.The Pick-up Head outside diameter “D” must bigger than the width of LED “Y1”.
2.The Pick-up Head inside diameter “d” must smaller than the length of LED “Y2”.
Pd
110
Pulse Forward Current* IFP
Storage Temperature
Ts
100 -40 ~ +100
Operation Temperature Top
-30 ~ +85
Junction Temperature Tj
105
Electrostatic Discharge(HBM)
ESD
1000
Allowable Pressure**
Pa
<1
* Condition : 1/10 duty, 0.1 msec width. ** LED allowable pressure value during SMT process.
Ta=25℃ Unit V mA mW mA oC oC oC
2.The inside length of Pick-up Head “X4” must smaller than the outside length of LED “X1”.
3.The outside width of Pick-up Head “Y3” must bigger than the window width of LED “Y2”.
2.7mm
X2 the window length of LED LED
Y1 the outside width of LED
1.6m 1.2mm
Y2 the window width of LED
0.6mm
X3 the outside length of Pick-up Head
*
X4 the inside length of Pick-up Head
Temperature Humidity
No
Items[1]
Other
(℃)wk.baidu.com
(%)
condition
High temperature
1
100
-----
storage
Criteria for judgment
Hrs Times Sampling LED
Vf @
brightness
@ 20mA 20mA