APG40overview_简略

TwinDie™ 1.2V DDR4 SDRAMMT40A4G4 – 128 Meg x 4 x 16 Banks x 2 RanksMT40A2G8 – 64 Meg x 8 x 16 Banks x 2 RanksDescriptionThe 16Gb (TwinDie™) DDR4 SDRAM usesMicron’s 8Gb DDR4 SDRAM die (essentially two ranksof the 8Gb DDR4 SDRAM). Refer to Micron’s 8GbDDR4 SDRAM data sheet for the specifications not in-cluded in this document. Specifications for base partnumber MT40A2G4 correlate to TwinDie manufactur-ing part number MT40A4G4; specifications for basepart number MT40A1G8 correlate to TwinDie manu-facturing part number MT40A2G8.Features•Uses 8Gb Micron die•Two ranks (includes dual CS#, ODT, and CKE balls)•Each rank has 4 groups of 4 internal banks for con-current operation•VDD = VDDQ = 1.2V (1.14–1.26V)•1.2V VDDQ-terminated I/O•JEDEC-standard ball-out•Low-profile package•TC of 0°C to 95°C–0°C to 85°C: 8192 refresh cycles in 64ms–85°C to 95°C: 8192 refresh cycles in 32msOptionsMarking•Configuration–128 Meg x 4 x 16 banks x 2 ranks4G4–64 Meg x 8 x 16 banks x 2 ranks2G8•FBGA package (Pb-free)–78-ball FBGA(9.5mm x 13mm x 1.2mm) Die Rev :AFSE–78-ball FBGA(8.0mm x 12mm x 1.2mm) Die Rev :BNRE•Timing – cycle time1–0.750ns @ CL = 18 (DDR4-2666)-075E–0.833ns @ CL = 16 (DDR4-2400)-083E–0.833ns @ CL = 17 (DDR4-2400)-083–0.937ns @ CL = 15 (DDR4-2133)-093E–0.937ns @ CL = 16 (DDR4-2133)-093•Self refresh–StandardNone•Operating temperature–Commercial (0°C ≤ TC ≤ 95°C)None•Revision:A:BNote:1.CL = CAS (READ) latency.Table 1: Key Timing ParametersSpeed Grade1Data Rate(MT/s)Target tRCD-tRP-CLtRCD (ns)tRP (ns)CL (ns)-075E266618-18-1813.5013.5013.50-075266619-19-1914.2514.2514.25-083E240016-16-1613.3213.3213.32-083240017-17-1714.16 (13.75)14.16 (13.75)14.16 (13.75)-093E213315-15-1514.06 (13.50)14.06 (13.50)14.06 (13.50)-093213316-16-1615.0015.0015.00Note:1.Refer to the Speed Bin Tables for additional details.16Gb: x4, x8 TwinDie DDR4 SDRAMDescriptionTable 2: AddressingParameter4096 Meg x 42048 Meg x 8Configuration128 Meg x 4 x 16 banks x 2 ranks64 Meg x 8 x 16 banks x 2 ranksBank group addressBG[1:0]BG[1:0]Bank count per group44Bank address in bank groupBA[1:0]BA[1:0]Row address128K A[16:0]64K A[15:0]Column address1K A[9:0]1K A[9:0]16Gb: x4, x8 TwinDie DDR4 SDRAMDescriptionImportant Notes and WarningsMicron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,including without limitation specifications and product descriptions. This document supersedes and replaces allinformation supplied prior to the publication hereof. You may not rely on any information set forth in this docu-ment if you obtain the product described herein from any unauthorized distributor or other source not authorizedby Micron.Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi-cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim ofproduct liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micronproducts are not designed or intended for use in automotive applications unless specifically designated by Micronas automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damageresulting from any use of non-automotive-grade products in automotive applications.Critical Applications. Products are not authorized for use in applications in which failure of the Micron compo-nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-mental damage by incorporating safety design measures into customer's applications to ensure that failure of theMicron component will not result in such harms. Should customer or distributor purchase, use, or sell any Microncomponent for any critical application, customer and distributor shall indemnify and hold harmless Micron andits subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim ofproduct liability, personal injury, or death arising in any way out of such critical application, whether or not Mi-cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of theMicron product.Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL-URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINEWHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, ORPRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are includedin customer's applications and products to eliminate the risk that personal injury, death, or severe property or en-vironmental damages will result from failure of any semiconductor component.Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequentialdamages (including without limitation lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not such damages are based on tort, warranty,breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's dulyauthorized representative.16Gb: x4, x8 TwinDie DDR4 SDRAMImportant Notes and Warnings

DDR4 SDRAM

MT40A2G4

MT40A1G8MT40A512M16

Features

•VDD = VDDQ = 1.2V ±60mV

•VPP = 2.5V, –125mV, +250mV

•On-die, internal, adjustable VREFDQ generation

•1.2V pseudo open-drain I/O

•Refresh time of 8192-cycle at TC temperature range:

–64ms at -40°C to 85°C

–32ms at >85°C to 95°C

–16ms at >95°C to 105°C

•16 internal banks (x4, x8): 4 groups of 4 banks each

•8 internal banks (x16): 2 groups of 4 banks each

•8n-bit prefetch architecture

•Programmable data strobe preambles

•Data strobe preamble training

•Command/Address latency (CAL)

•Multipurpose register READ and WRITE capability

•Write leveling

•Self refresh mode

•Low-power auto self refresh (LPASR)

•Temperature controlled refresh (TCR)

•Fine granularity refresh

•Self refresh abort

•Maximum power saving

•Output driver calibration

•Nominal, park, and dynamic on-die termination

(ODT)

第18届MSPO展会轻武器精选(Ⅲ)

作者：苏拉

来源：《轻兵器》 2011年第5期

苏拉塔尔诺博公司GS-40

独立使用型榴弹发射器塔尔诺博公司GA-40自动榴弹发射器改进型

GA-40自动榴弹发射器曾经在其他大型展会上展示过，本次展出的是其加以改良的新产品。过去的产品，其握把和扳机设在机匣后端，本次展出的新产品则将握把改为杆状设计，可以装在机匣后端下方的左右两侧。该自动榴弹发射器采用40×53mm口径，全长1 000mm，发射器(不含三脚架)质量为32kg。

德塔米克公司GSBO-40独立使用型榴弹发射器改进型

与原型相比，本次展出的GSBO-40榴弹发射器对枪托等部件进行了改进。该榴弹发射器的发射管采用向侧方摆出式。其口径40×46mm，全长500mm，发射管长250mm，发射器质量为2.3kg。将枪托、机匣上的皮卡汀尼导轨及机械瞄具取下，该榴弹发射器即变身为下挂式榴弹发射器，可以加装在96贝利埃路突击步枪上使用。

加装塔尔诺博公司下挂于96贝利埃路步枪的GP-40榴弹发射器

塔尔诺博公司的GP-40下挂式榴弹发射器是在波兰军队1974年选为制式的帕拉德下挂式榴弹发射器基础上开发而成的。其采用发射管尾端向下方旋转打开的方式，口径40×46mm，全长335mm，发射管长264mm，发射器质量1.32kg。

雷明顿公司加装KNOXX SPECOPS枪托的M870P警用霰弹枪雷明顿公司生产的M870P霰弹枪是现代警用唧筒式霰弹枪的代表产品，其结构简单，故障率低，评价颇高。图示产品为加装356mm长枪管的M870P警用霰弹枪。该枪全枪长较短，非常适合在警察巡逻车上使用，可以快速从车窗向外射击。另外，该枪加装KNOXXSPECOPS枪托，可以有效减小后坐力。

哈特森公司保护者MP-A警用霰弹枪土耳其生产的霰弹枪已树立了良好的口碑，其霰弹枪以品质高、价格低而著称。哈特森公司生产的保护者系列霰弹枪被土耳其警察和国境警备队所采用。目前，该系列霰弹枪正以其价格优势进军国际警用市场。

Commands

DESELECT

The DESELT (DES) command (CS# HIGH) prevents new commands from being execu-

ted by the DRAM. Operations already in progress are not affected.

NO OPERATION

The NO OPERATION (NOP) command (CS# LOW) prevents unwanted commands from

being registered during idle or wait states. Operations already in progress are not affec-

ted.

ZQ CALIBRATION LONG

The ZQ CALIBRATION LONG (ZQCL) command is used to perform the initial calibra-

tion during a power-up initialization and reset sequence (see Figure 46 (page 124)).

This command may be issued at any time by the controller, depending on the system

environment. The ZQCL command triggers the calibration engine inside the DRAM. Af-

ter calibration is achieved, the calibrated values are transferred from the calibration en-

gine to the DRAM I/O, which are reflected as updated RON and ODT values.