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Filtered modules 1EGG1-1 3EGG1-1 6EGG1-1 10EGG1-1 1EGG1-2 3EGG1-2 6EGG1-2 10EGG1-2 1EGG8-1 3EGG8-1 6EGG8-1 10EGG8-1 1EGG8-2 3EGG8-2 6EGG8-2 10EGG8-2 1EGS1-1 3EGS1-1 6EGS1-1 10EGS1-1 1EGS1-2 3EGS1-2 6EGS1-2 10EGS1-2 Filtered modules with ground circuit inductor 1EGG1C-1 3EGG1C-1 6EGG1C-1 1EGG1C-2 3EGG1C-2 6EGG1C-2 1EGG8C-1 3EGG8C-1 6EGG8C-1 1EGG8C-2 3EGG8C-2 6EGG8C-2 Medical filter modules 1EHG1-2 3EHG1-2 6EHG1-2 10EHG1-2 1EHG8-2 3EHG8-2 6EHG8-2 10EHG8-2 1EHGS1-2 3EHGS1-2 6EHGS1-2 10EHGS1-2
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Corcom Product Guide
Catalog: 1654001 Issue Date: 06.2011
Smallest Power Entry Module with Metric Fuse Holders (continued)
(not included)
HG Series
• Medical version of our GG Series • Mechanically identical to GG Series • Available only with dual fusing

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is notAccuPower¥Auto-SPM¥Build it Now¥CorePLUS¥CorePOWER¥CROSSVOLT¥CTL¥Current Transfer Logic¥DEUXPEED®Dual Cool™ EcoSPARK®EfficientMax¥ESBC¥®Fairchild®Fairchild Semiconductor®FACT Quiet Series¥FACT®FAST®FastvCore¥FETBench¥FlashWriter®*FPS¥F-PFS¥FRFET®Global Power Resource SMGreen FPS¥Green FPS¥ e-Series¥G max¥GTO¥IntelliMAX¥ISOPLANAR¥MegaBuck¥MICROCOUPLER¥MicroFET¥MicroPak¥MicroPak2¥MillerDrive¥MotionMax¥Motion-SPM¥OptoHiT™OPTOLOGIC®OPTOPLANAR®®PDP SPM™Power-SPM¥PowerTrench®PowerXS™Programmable Active Droop¥QFET®QS¥Quiet Series¥RapidConfigure¥¥Saving our world, 1mW/W/kW at a time™SignalWise¥SmartMax¥SMART START¥SPM®STEALTH¥SuperFET¥SuperSOT¥-3SuperSOT¥-6SuperSOT¥-8SupreMOS®SyncFET¥Sync-Lock™®*The Power Franchise®TinyBoost¥TinyBuck¥TinyCalc¥TinyLogic®TINYOPTO¥TinyPower¥TinyPWM¥TinyWire¥TriFault Detect¥TRUECURRENT¥*P SerDes¥UHC®Ultra FRFET¥UniFET¥VCX¥VisualMax¥XS™* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) areintended for surgical implant into the body or (b) support or sustain life,a nd (c) whose fa ilure to perform when properly used in a ccorda ncewith instructions for use provided in the la beling, ca n be rea sona bly expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, orsystem whose fa ilure to perform ca n be rea sona bly expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.ANTI-COUNTERFEITING POLICYFairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, , under Sales Support.Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.PRODUCT STATUS DEFINITIONSDefinition of TermsDatasheet Identification Product Status Definition分销商库存信息:FAIRCHILDGBPC3506W GBPC3502GBPC3510W GBPC3510GBPC1506GBPC2502 GBPC2506GBPC3504GBPC12005 GBPC1202W GBPC1202GBPC1210 GBPC1201GBPC1204W GBPC1206W GBPC1210W GBPC1206GBPC1208 GBPC1204GBPC1201W GBPC15005 GBPC1501GBPC1510W GBPC1506W GBPC1501W GBPC1504W GBPC1510 GBPC1508GBPC1502W GBPC1502 GBPC1508W GBPC1504GBPC15005W GBPC2501GBPC2508GBPC25005 GBPC2504GBPC3504W GBPC3508W GBPC3501W GBPC35005W GBPC3502W GBPC2510GBPC3508GBPC3501 GBPC35005GBPC3506GBPC2501W GBPC2502W GBPC25005W GBPC2508W GBPC2506W GBPC2510W。

LM98555LM98555 CCD DriverLiterature Number: SNAS290CLM98555 CCD DriverGeneral DescriptionThe LM98555 is a highly integrated driver circuit intended for CCD driving applications. It combines 25 drivers of varying drive strengths into one chip to provide a complete CCD driv-ing solution. Due to this one-chip integration, optimal skew control is achieved for this demanding application. Features■All CCD drivers integrated into one package■High strength drivers designed specifically for CCD loads ■Ability to scale clock driver strength■Skew specifications guaranteed■Separate input and output power supplies ■CMOS process technology■64-pin TSSOP package with extended power handling capabilityKey SpecificationsSupply Voltage Inputs 3.0 to 5.5VDrivers 4.5 to 5.8V Maximum Output Skew Between P1Aand P2Aoutputs0.5 nsMaximum PowerHandling2.0WFunctional Description20126401FIGURE 1. Functional Block DiagramTRI-STATE® is a registered trademark of National Semiconductor Corporation.© 2007 National Semiconductor 98555 CCD DriverCommercial Temperature RangeNS PackageLM98555CCMH64-Pin Exposed Pad TSSOPConnection Diagram20126402FIGURE 2. TSSOP Package Pinout 2L MSymbol Pin Type DescriptionDriver inputsP2BIN8Input CMOS logic input for the P2B driver.RSIN9Input CMOS logic input for the RS driver.CPIN10Input CMOS logic input for the CP driver.P1AIN15Input CMOS logic input for the P1A ganged (8) driver set.P2AIN18Input CMOS logic input for the P2A ganged (8) driver set.SHIN21Input CMOS logic input for the SH ganged (3) driver set.AFEIN22Input CMOS logic input for the AFE driver.MCLIN23Input CMOS logic input for the MCL driver.SHDIN24Input CMOS logic input for the SHD driver.Driver OutputsSHDOUT28Output; Low-Strength Driver output for the SHDINinput signal.MCLOUT30Output; Low-Strength Driver output for the MCLINinput signal.AFEOUT31Output; Low-Strength Driver output for the AFEINinput signal.CPOUT2Output; Low-Strength Driver output for the CPINinput signal. Typically used to drive the Clamp Gate input of the CCD.RSOUT3Output; Low-Strength Driver output for the RSINinput signal. Typically used to drive the Reset Gate input of the CCD.P2BOUT5Output; Low-Strength Driver output for the P2BINinput signal.P2AOUT047Output; TRI-STATE®; High-Strength Ganged driver outputs for the P2AINinput. Typically the user may join together these outputs to drive the φ2 clock input of the CCD. Some of these outputs may be disabled using the EN(1:0) inputs - see the Functional Description section.P2AOUT146P2AOUT243P2AOUT342P2AOUT439P2AOUT538P2AOUT635P2AOUT734P1AOUT050Output; TRI-STATE; High-Strength Ganged driver outputs for the P1AINinput. Typically the user may join together these outputs to drive the φ1 clock input of the CCD. Some of these outputs may be disabled using the EN(1:0) inputs - see the Functional Description section.P1AOUT151P1AOUT254P1AOUT355P1AOUT458P1AOUT559P1AOUT662P1AOUT763SHOUT026Output; Low-Strength Ganged driver outputs for the SHINinput signal. Typically used to drive the Shift Gate input of the CCD.SHOUT127SHOUT26Logic InputsEN011Input Driver enable control. Some of the P1A and P2A drivers can be disabled usingthese inputs. See the Functional Description section.EN112555Power & Ground Pins V DDI141620PowerV DD for pre-drivers.V DDO17293237404549535760PowerV DD for final-stage driver.GND I131719Ground Ground connection for all circuitry other than the Final-Stage Drivers.GND O425333641444852566164Ground Ground connection for the Final-Stage Drivers. 4L MIf Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.Supply Voltage−0.5V to 6.2V Package Power Rating at 25°C(Note 2) 2.0 Watts Voltage on Any Input or Output Pin−0.5V to VDD+0.5V DC Input Current at Any Pin25 mA DC Package Input Current50 mA Storage Temperature−65°C to +150°C Lead temperature (Soldering, 10 sec.)300°C ESD SusceptibilityHuman Body Model2000V Machine Model200V Operating ConditionsSupply VoltageVDDI+3.0V to +5.5V Supply VoltageVDDO+4.5V to +5.8VSupply Sequencing(Note 3)VDDI < VDDO+0.2VAmbient Temperature (TA)0 to 70°C Operating Frequency30 MHz Power Dissipation (Note 4) 2.0W Package Thermal Resistances PackageθJ-A(Note 5)θJ-PAD(Thermal Pad) 64-Lead ExposedPad TSSOP36.8°C / W 6.2°C / WDC Electrical CharacteristicsThe following specifications apply for GND = 0V, VDDI = 3.3V, VDDO= 5.0V, unless noted otherwise. Boldface limits apply forT A = TMINto TMAX; all other limits TA= 25°CSymbol Parameter Conditions Min Typical Max UnitsI I Logic 1 Input Current VI= VDDI-10.0041µALogic 0 Input Current VI= GNDI-10.0061µAV IT Input Threshold VDDI= 3.3V 1.41 1.57 1.75VInput Threshold VDDI= 5.0V 2.48VInput Threshold Hysteresis VDDI= 3.3V-7211100mVΔV IT Input Threshold Variation Between P1A, P2A inputs-100100mVROOutput Impedance P1A and P2AOutputs ILOAD= 525 mA6.19.9ΩRO= (VDDO- VO)/IOHorRO= VO/IOLROOutput Impedance All OtherOutputs ILOAD= 280 mA10.217.4ΩRO= (VDDO- VO)/IOHorRO= VO/IOL555The following specifications apply for GND = 0V, V DDI = 3.3V, V DDO = 5.0V, unless noted otherwise. Boldface limits apply for T A = T MIN to T MAX ; all other limits T A = 25°C Symbol ParameterConditionsMin Typical Max Unit PHL Prop Delay: High-to-Low P1A and P2A Outputs C L = 220 pF, R L = 10Ω(Note 6)3.064.66.55nst PHLProp Delay: High-to-Low CP, RS, P2B Outputs C L = 82 pF, R L = 10Ω(Note 6)(Note 8)4.1nst PLH Prop Delay: Low-to-High P1A and P2A Outputs C L = 220 pF, R L = 10Ω(Note 7)3.384.96.68nst PLHProp Delay: Low-to-High CP, RS, P2B Outputs C L = 82 pF, R L = 10Ω(Note 7)(Note 8)4.2nst SKEWProp Delay Skew High-to-Low Between any P1A or P2A Outputs on a Single UnitC L = 220 pF, R L = 10Ω109387psProp Delay Skew Low-to-High157490Important Note: Not all drivers can be loaded to the highest specified load at the same time without violating the maximum power dissipation limit. The syst design must guarantee that the maximum power dissipation specification is never exceeded.Note 1:Absolute maximum ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devic should be operated at these limits.Note 2:Package power rating assumes the exposed thermal pad is soldered to the printed circuit board as recommended, with significant heat spreading provid by vias to internal or bottom heat dissipation planes or pad. If this is not the case, then the package power rating should be reduced. See the Thermal Guidelin in the applications section for more information.Note 3:When powering up and down, transient voltage levels on V DDI must be lower than (V DDO + 0.2V)Note 4:This is the power dissipated on-chip due to all currents flowing through the device - both DC and AC. This operating condition will be violated if all dri outputs are fully loaded and operating at the same time at the rated F MAX . The system design must constrain the chip's operating conditions (loads, power supp number of parallel drivers enabled, frequency of operation) to make certain that this limit is never exceeded.Note 5:Package thermal resistance for junction to ambient is based on a 5.5 inch by 3 inch, 4 layer printed circuit board, with thermal vias connecting the he sinking pad to a full internal ground plane. Tests were done in still air, with a power dissipation of 2.0 W, at an ambient temperature of 22°C.Note 6:Propagation Delay High-to-Low with output low trigger voltage at V DDO *0.75.Note 7:Propagation Delay Low-to-High with output high trigger voltage at V DDO *0.25.Note 8:Typical values determined from characterization testing only. Not production tested or guaranteed.Test Conditions20126403FIGURE 3. AC Test Conditions 6L MThe LM98555 is a fully integrated clock driver/buffer for high speed CCD applications. It provides high performance low impedance drivers, with optimized low skew performance of the P1 and P2 outputs. Enable inputs allow use of two, four,six, or all eight P1 and P2 drivers to optimize the amount of drive for the application. The 64 pin thermally enhanced TSSOP provides excellent power handling through the use of an exposed heat transfer pad on the underside of the pack-age.THERMAL GUIDELINESThe LM98555's maximum power dissipation limit, shown in the Operating Conditions section, must be strictly adhered to.The product's multiple high-strength drivers, with their ability to drive a wide-range of loads, make it possible to be within spec on each output and yet violate the aggregate maximum power dissipation limit for the total product. Special caution must be paid to this by limiting the chip's operating conditions (loads, power supply, number of parallel drivers enabled, fre-quency of operation) to make certain that the maximum power dissipation limit is never exceeded.Thermal characterization of the device has been done to pro-vide reference points under specific conditions. θ junction to ambient was measured using a 5.5 inch by 3 inch, 4 layer PCB. The thermal contact pad on the board was connected using vias to a full ground plane on one of the internal layers.The recommended thermal pad is shown in Figure 4.20126406FIGURE 4. Exposed Pad Land PatternThe vias shown provide a path for heat to flow from the pad to a heat sinking or dissipating area of the printed circuit board. The following figures show several typical examples of how this can be done, and illustrate how heat is conducted away from the IC to larger areas where it is dissipated.20126407FIGURE 5. 4 Layer PCB - Example 120126409FIGURE 6. 4 Layer PCB - Example 220126408FIGURE 7. 2 Layer PCB555mal pad to this ground plane with vias will usually provide adequate heat management. In 2 layer boards, it is important to provide a large heat spreading pad on the opposite side of the board. The vias will provide a good thermal connection between the pad under the IC, and the heat spreading pad on the bottom of the board. Thermal modelling can be done using the θ junction to pad information provided, to calculate the required area of copper based on the ambient temperature of the system, and the calculated amount of thermal dissipation in the LM98555.POWER DISSIPATIONThe amount of power dissipated in the device can be deter-mined by considering the following factors:•Power dissipated delivering energy to the load capacitance•Power dissipated delivering energy to parasitic capacitance•Power dissipated due to leakage in the ICThe amount of power dissipated due to leakage is very small in this CMOS device. Most of the power will be due to the load capacitance being switched, with a small additional amount caused by the parasitic capacitance of the output circuitry,output pins, and PCB traces. A typical parasitic capacitance would be on the order of 5 pF. Since the load capacitance will be on the order of 100 pF or more, this usually dominates the power dissipation calculation. The following equation can be used to calculate the power dissipation due to capacitive switching of the loads:P = Sum[Output Frequency x Load Capacitance x Output Voltage Squared] (summed for all outputs)INPUT SIGNALSCare should be taken to match the trace lengths between timing signals that require low skew. Usually, the P1A and P2A signals will be the most critical. In some applications, the timing of P2B with respect to P1A and P2A can also be im-portant, and that input trace should also be carefully de-signed.Trace shape and width should also be carefully controlled.The trace geometry will determine the characteristic impedance of each trace. The impedance should be set to give reasonable immunity to noise coupling into the trace.With a known trace impedance, the signals can be terminated using a series resistor at the source that is equal to the char-acteristic impedance. This will provide a signal with minimum overshoot and ringing, and will contribute to better perfor-mance of the final signal reaching the CCD.OUTPUT CONNECTIONS AND LOADING EXAMPLES The LM98555 can be used with a wide variety of different CCD sensors. The P1Aoutx and P2Aoutx outputs can be se-lectively enabled to provide 2, 4, 6, or 8 drivers. This allows the available drive strength to be optimized for the sensor and application. Connecting multiple outputs together in parallel as shown in the typical application circuit provides lower drive impedance as needed to suit the load being driven. When driving smaller loads, lower switching noise will be generated if the minimum necessary outputs are enabled and used.The output signal traces should also be designed for a known impedance. Source terminating resistors should be used in series with each output to provide good matching to the trace characteristic impedance. The resistors should be located asbe combined after the termination resistors. This will provi the best summing of adjacent outputs. The combined sign should then pass through an EMI type ferrite bead. This co ponent can be selected to change the bandwidth or shape the clocking signal to achieve the best CCD transfer efficie cy.Several other techniques will also help maintain signal quali and minimize timing differences between critical signals. Vi should not be used for critical timing signals. These can a impedance discontinuities that will affect the waveform qu ity. Traces should have gradual bends and avoid sha changes in direction that can also introduce impedance d continuities.SELECTIVE DRIVER ENABLINGWith the Enable pins, the user has the capability to enab only the drivers that are required for the application, th eliminating unnecessary outputs switching. The following ble shows the details.EN1EN0Driver-set State00P1Aout(1:0) and P2Aout(1:0) are enabled; a others disabled.01P1Aout(3:0) and P2Aout(3:0) are enabled; a others disabled.10P1Aout(5:0) and P2Aout(5:0) are enabled; a others disabled.11All P1Aout and P2Aout drivers are enabled.Note: The disabled drivers' outputs are in TRI-STATE.POWER SUPPLY SEQUENCINGDuring device power-up and power-down, V DDI must be ma tained less than (V DDO + 0.2V) to prevent excessive curre flow through the internal ESD protection circuitry. Since mo applications will involve 3V on V DDI and 5V on V DDO , this c be easily met. If this voltage relationship cannot be met, th the DC pin and package limits for input current must be ma tained by controlling the source impedance of the V DDI suppPOWER AND GROUND - PLANES VERSUS BUSES The best performance will be achieved by using planes rath than traces for power and ground. Planes provide lower ele trical and thermal impedance. Ground bounce and ringing a reduced, electromagnetic emissions are minimized and t best thermal performance will be realized.A single common ground plane should be used for all pow and signal domains.Another circuit board layer can be used to provide power the various circuitry. Different power buses can be provid by isolated planes within this layer of the circuit board.EMI MANAGEMENTGood EMI control will be achieved by addressing the followi items:•Provide proper source termination of output signals •Limit length of output traces•Ensure adequate power supply decoupling•Provide power and ground planes as much as possible •Provide common ground plane for all signals, especiall between LM98555 outputs and load CCD•Enable and use the minimum number of outputs neede 8L M64-TSSOPNS Package Number MXD64A 555分销商库存信息:NATIONAL-SEMICONDUCTORLM98555CCMH/NOPB LM98555CCMHX/NOPB。

C
.335±.006 8.50±0.15
C
.063±.008 1.60±0.20 .024(w)X.016(t) [0.60x0.40]
B
.100±.002 2.54±0.05
B
A
NOTES: 1. INSULATOR MATERIAL: SEE PART NUMBER CODING. 2. CONTACT MATERIAL: PHOSPHOR BRONZE. 3. CONTACT PLATING: SEE PART NUMBER CODING. 4. CURRENT RATING: 3 AMPS 5. VOLTAGE RATING: 250V AC/DC 6. INSULATOR RESISTANCE: 5000 MEGOHMS MIN. 7. CONTACT RESISTANCE: 20 MILLIOHMS MAX. 8. DIELECTRIC WITHSTANDING: 500V AC. 9. OPERATING TEMPERATURE: -40° C TO +105° C.
分销商库存信息:
SULLINS-CONNECTOR PPTC041LGBN-RC PPPC081LGBN-RC PPPC061LGBN-RC PPPC131LGBN-RC PPTC181LGBN-RC PPTC191LGBN-RC PPPC161LGBN-RC PPTC231LGBN-RC PPPC261LGBN PPPC201LGBN-RC PPPC271LGBN PPPC291LGBN PPTC291LGBN-RC PPPC301LGBN PPTC311LGBN PPPC311LGBN-RC PPTC371LGBN PPPC371LGBN-RC PPPC381LGBN PPTC391LGBN-RC PPTC401LGBN-RC PPTC211LGBN-RC PPPC251LGBN-RC PPTC361LGBN-RC PPPC221LGBN-RC PPPC241LGBN PPTC281LGBN PPTC341LGBN-RC PPTC021LGBN-RC PPTC081LGBN-RC PPTC121LGBN-RC PPTC211LGBN PPTC361LGBN PPPC051LGBN-RC PPTC061LGBN-RC PPPC031LGBN-RC PPTC141LGBN-RC PPPC141LGBN-RC PPPC191LGBN-RC PPTC201LGBN-RC PPTC261LGBN PPPC261LGBN-RC PPTC271LGBN PPPC271LGBN-RC PPPC291LGBN-RC PPTC301LGBN PPPC301LGBN-RC PPTC311LGBN-RC PPPC241LGBN-RC PPTC371LGBN-RC PPTC381LGBN PPPC381LGBN-RC PPTC321LGBN-RC PPPC351LGBN-RC PPPC211LGBN-RC PPTC171LGBN PPPC401LGBN-RC PPTC221LGBN PPTC241LGBN PPTC281LGBN-RC PPPC391LGBN PPTC051LGBN-RC PPTC091LGBN PPTC141LGBN PPTC251LGBN PPTC401LGBN PPTC071LGBN-RC PPTC101LGBN-RC PPTC131LGBN-RC PPTC181LGBN PPTC191LGBN PPTC161LGBN-RC PPTC231LGBN PPTC261LGBN-RC PPPC181LGBN-RC PPTC271LGBN-RC PPTC221LGBN-RC PPTC291LGBN PPTC301LGBN-RC PPPC231LGBN-RC PPPC311LGBN PPPC281LGBN-RC PPPC371LGBN PPTC381LGBN-RC PPTC391LGBN PPPC321LGBN-RC PPTC031LGBN-RC PPPC041LGBN-RC PPTC171LGBN-RC PPPC221LGBN PPPC171LGBN-RC PPTC241LGBN-RC PPTC341LGBN PPPC391LGBN-RC PPTC071LGBN PPTC091LGBN-RC PPTC161LGBN PPTC251LGBN-RC