MAX2607EUT-T中文资料

40260型高性能通轴式编码器设计特点·厚度仅1.19″·可提供4、6、8极整流测试 ·300KHz 频率响应·输出形式：集电极开路输出， 推拉输出，5-28VDC 线驱动输出·空心轴孔径选择：从5mm ——0.625″ ·通轴带压紧式安装 ·简便新型的簧片式安装 ·IP64防护系统·120℃操作温度可供选择260型的大孔径(可达0.625″)及薄形外观设计，特别适合许多机械及马达控制方面的应用。

安装方面提供2种独特设计：一种是空心盲孔，另一种为全通轴式设计，两种设计都采用了E PC 公司的新型防滑动式带蝶形簧片的安装系统，以确保编码器工作的简便可靠及精密。

另外 ，其不同于传统模式的设计是：260型的整体轴承设计，确保了其工作的稳定可靠，避免了 可能出现的轴向及径向的摆动。

两种设计都采用了紧压片代替了螺丝，将编码器稳固在转轴 上，安装非常方便!对于无刷伺服电机的应用，260型以三个120度相位提供4、6、8极整流测 试反馈。

耐高温可达100℃(有的带可高达120℃)，使伺服电机能在更高功率输出及反复使用 中能正常工作，防止相关反馈设备的损坏。

其坚固的结构及IP64防护选择，使260型能完全 满足绝大多数工业环境下的性能要求。

应用·无刷伺服电机整流 ·机器人·电机安装反馈 ·数字绘图仪 ·高功率马达260型系列电参数输入电 压 70℃操作温度为5-28VDC(最小4.75VDC ，最大28VDC) 100℃操作温度为5-16VDC 120℃操作温度为5VDC 电 流 最大无负载电流为100mA输出电流在集电极开路输出时最大漏电流为50mA形式在正交输出中，当转轴顺时针转动时，A通道的方波领先B通道。

电路集电极开路输出；推拉输出(最大电流50mA)；5-28VDC线驱动输出(在供电电压为5VDC时，符合RS422标准)基准脉冲每转一周输出一次脉冲且其中心与A通道的中心对齐；频率响应标准为200KHz，300KHz可供选择每转标准脉冲数 200、250、256、500、512、600、1000、1024、1250、2000、2048、2500、2540(若需要的CRP值未列出，请与厂家联系)整流测试 4、6、8极(请与厂家联系)整流精度 1。

_______________General DescriptionThe MAX4172 is a low-cost, precision, high-side current-sense amplifier for portable PCs, telephones, and other systems where battery/DC power-line monitoring is criti-cal. High-side power-line monitoring is especially useful in battery-powered systems, since it does not interfere with the battery charger’s ground path. Wide bandwidth and ground-sensing capability make the MAX4172 suitable for closed-loop battery-charger and general-purpose current-source applications. The 0V to 32V input common-mode range is independent of the supply volt-age, which ensures that current-sense feedback remains viable, even when connected to a battery in deep dis-charge.To provide a high level of flexibility, the MAX4172 func-tions with an external sense resistor to set the range of load current to be monitored. It has a current output that can be converted to a ground-referred voltage with a sin-gle resistor, accommodating a wide range of battery volt-ages and currents.An open-collector power-good output (PG ) indicates when the supply voltage reaches an adequate level to guarantee proper operation of the current-sense amplifi-er. The MAX4172 operates with a 3.0V to 32V supply voltage, and is available in a space-saving, 8-pin µMAX or SO package.________________________ApplicationsPortable PCs: Notebooks/Subnotebooks/Palmtops Battery-Powered/Portable EquipmentClosed-Loop Battery Chargers/Current Sources Smart-Battery Packs Portable/Cellular PhonesPortable Test/Measurement Systems Energy Management Systems____________________________Featureso Low-Cost, High-Side Current-Sense Amplifier o ±0.5% Typical Full-Scale Accuracy Over Temperature o 3V to 32V Supply Operationo 0V to 32V Input Range—Independent of Supply Voltage o 800kHz Bandwidth [V SENSE = 100mV (1C)]200kHz Bandwidth [V SENSE = 6.25mV (C/16)]o Available in Space-Saving µMAX and SO PackagesMAX4172Low-Cost, Precision, High-SideCurrent-Sense Amplifier________________________________________________________________Maxim Integrated Products 1__________________Pin Configuration__________Typical Operating Circuit19-1184; Rev 0; 12/96For free samples & the latest literature: , or phone 1-800-998-8800*Contact factory for availability.M A X 4172Low-Cost, Precision, High-Side Current-Sense Amplifier 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V+ = +3V to +32V; RS+, RS- = 0V to 32V; T A = T MIN to T MAX ; unless otherwise noted. Typical values are at V+ = +12V, RS+ = 12V, T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V+, RS+, RS-, PG ...................................................-0.3V to +36V OUT..............................................................-0.3V to (V+ + 0.3V)Differential Input Voltage, V RS+- V RS-............................±700mV Current into Any Pin..........................................................±50mA Continuous Power Dissipation (T A = +70°C)SO (derate 5.88mW/°C above +70°C)..........................471mW µMAX (derate 4.10mW/°C above +70°C).....................330mWOperating Temperature RangeMAX4172E_A....................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10sec).............................+300°CELECTRICAL CHARACTERISTICS (continued)(V+ = +3V to +32V; RS+, RS- = 0V to 32V; T A = T MIN to T MAX ; unless otherwise noted. Typical values are at V+ = +12V, RS+ = 12V, T A = +25°C.)MAX4172Low-Cost, Precision, High-SideCurrent-Sense Amplifier_______________________________________________________________________________________3100095050010SUPPLY CURRENT vs. SUPPLY VOLTAGE600650550900850800V+ (V)S U P P L Y C U R R E N T (µA )2030750700400.50.4-0.510OUTPUT ERROR vs. SUPPLY VOLTAGE-0.3-0.4-0.20.30.20.1V+ (V)E R R O R (%)20300-0.1401.51.0-3.010C/16 LOAD OUTPUT ERROR vs. SUPPLY VOLTAGE-2.0-1.5-2.50.50V+ (V)E R R O R (%)2030-0.5-1.040__________________________________________Typical Operating Characteristics(V+ = +12V, V RS+= 12V, R OUT = 1k Ω, T A = +25°C, unless otherwise noted.)Note 1:6.25mV = 1/16 of typical full-scale sense voltage (C/16).Note 2:Valid operation of the MAX4172 is guaranteed by design when PG is low.0.750.55-0.6563040OUTPUT ERRORvs. COMMON-MODE VOLTAGE-0.45-0.250.350.15V RS- (V)E R R O R (%)1218-0.05242.952.902.45-40-1585V+ THRESHOLD FOR PG OUTPUT LOWvs. TEMPERATURE2.502.552.602.852.802.752.70TEMPERATURE (°C)V + T R I P T H R E S H O L D (V )10352.656040-50.1m10m 100m1m1ERROR vs. SENSE VOLTAGE0M A X 4172-04V SENSE (V)E R R O R (%)10515202530353500.010.11101001000POWER-SUPPLY REJECTION RATIOvs. FREQUENCY5POWER-SUPPLY FREQUENCY (kHz)E R R O R (%)151020302510µs/div0mV to 10mV V SENSE TRANSIENT RESPONSEGNDV SENSE 5mV/divV OUT 50mV/divGNDMAX4172-0810µs/div0mV to 100mV V SENSE TRANSIENT RESPONSEGNDV SENSE 50mV/divV OUT 500mV/divGNDMAX4172-09M A X 4172Low-Cost, Precision, High-Side Current-Sense Amplifier 4___________________________________________________________________________________________________________________Typical Operating Characteristics (continued)(V+ = +12V, V RS+= 12V, R OUT = 1k Ω, T A = +25°C, unless otherwise noted.)MAX4172Low-Cost, Precision, High-SideCurrent-Sense Amplifier_______________________________________________________________________________________55µs/divSTART-UP DELAYGNDV OUT 500mV/divV+ 2V/divGNDV SENSE = 100mVMAX4172-1010µs/divV+ to PG POWER-UP DELAYGNDPG 2V/divV+ 2V/divGND100k Ω PULL-UP RESISTOR FROM PG TO +4VMAX4172-11______________________________________________________________Pin Description____________________________Typical Operating Characteristics (continued)(V+ = +12V, V RS+= 12V, R OUT = 1k Ω, T A = +25°C, unless otherwise noted.)Current Output. OUT is proportional to the magnitude of the sense voltage (V RS+- V RS-). A 1k Ωresistor from OUT to ground will result in a voltage equal to 10V/V of sense voltage.OUT 6Power Good Open-Collector Logic Output. A low level indicates that V+ is sufficient to power the MAX4172, and adequate time has passed for power-on transients to settle out.PG 7Supply Voltage Input for the MAX4172V+8GroundGND 5No Connect. No internal connection. Leave open or connect to GND.N.C.3, 4PIN Load-side connection for the external sense resistor. The “-” indicates the direction of current flow.RS-2Power connection to the external sense resistor. The “+” indicates the direction of current flow.RS+1FUNCTIONNAME _______________Detailed DescriptionThe MAX4172 is a unidirectional, high-side current-sense amplifier with an input common-mode range that is inde-pendent of supply voltage. This feature not only allows the monitoring of current flow into a battery in deep dis-charge, but also enables high-side current sensing at voltages far in excess of the supply voltage (V+).The MAX4172 current-sense amplifier’s unique topolo-gy simplifies current monitoring and control. The MAX4172’s amplifier operates as shown in Figure 1.The battery/load current flows through the external sense resistor (R SENSE ), from the RS+ node to the RS-node. Current flows through R G1and Q1, and into the current mirror, where it is multiplied by a factor of 50before appearing at OUT.To analyze the circuit of Figure 1, assume that current flows from RS+ to RS-, and that OUT is connected to GND through a resistor. Since A1’s inverting input is high impedance, no current flows though R G2(neglect-ing the input bias current), so A1’s negative input is equal to V SOURCE - (I LOAD x R SENSE ). A1’s open-loop gain forces its positive input to essentially the same voltage level as the negative input. Therefore, the drop across R G1equals I LOAD x R SENSE . Then, since I RG1M A X 4172flows through R G1, I RG1x R G1= I LOAD x R SENSE . The internal current mirror multiplies I RG1by a factor of 50to give I OUT = 50 x I RG1. Substituting I OUT / 50 for I RG1,(I OUT / 50) x R G1 = I LOAD x R SENSE , or:I OUT = 50 x I LOAD x (R SENSE / R G1)The internal current gain of 50 and the factory-trimmed resistor R G1combine to result in the MAX4172transconductance (G m ) of 10mA/V. G m is de-fined as being equal to I OUT / (V RS+- V RS-). Since (V RS+- V RS-) = I LOAD x R SENSE , the output current (I OUT ) can be calculated with the following formula:I OUT = G m x (V RS+- V RS-) =(10mA/V) x (I LOAD x R SENSE )Current OutputThe output voltage equation for the MAX4172 is given below:V OUT = (G m ) x (R SENSE x R OUT x I LOAD )where V OUT = the desired full-scale output voltage,I LOAD = the full-scale current being sensed, R SENSE =the current-sense resistor, R OUT = the voltage-setting resistor, and G m = MAX4172 transconductance (10mA/V).The full-scale output voltage range can be set by changing the R OUT resistor value, but the output volt-age must be no greater than V+ - 1.2V. The above equation can be modified to determine the R OUT required for a particular full-scale range:R OUT = (V OUT ) / (I LOAD x R SENSE x G m )OUT is a high-impedance current source that can be integrated by connecting it to a capacitive load.PG OutputThe PG output is an open-collector logic output that indicates the status of the MAX4172’s V+ power sup-ply. A logic low on the PG output indicates that V+ is sufficient to power the MAX4172. This level is tempera-ture dependent (see Typical Operating Characteristics graphs), and is typically 2.7V at room temperature. The internal PG comparator has a 100mV (typical) hystere-sis to prevent possible oscillations caused by repeated toggling of the PG output, making the device ideal for power-management systems lacking soft-start capabili-ty. An internal delay (15µs typical) in the PG compara-tor allows adequate time for power-on transients to settle out. The PG status indicator greatly simplifies the design of closed-loop systems by ensuring that the components in the control loop have sufficient voltage to operate correctly.__________Applications InformationSuggested Component Valuesfor Various ApplicationsThe Typical Operating Circuit is useful in a wide variety of applications. Table 1 shows suggested component values and indicates the resulting scale factors for vari-ous applications required to sense currents from 100mA to 10A.Adjust the R SENSE value to monitor higher or lower cur-rent levels. Select R SENSE using the guidelines and for-mulas in the following section.Sense Resistor, R SENSEChoose R SENSE based on the following criteria:•Voltage Loss:A high R SENSE value causes thepower-source voltage to degrade through IR loss.For minimal voltage loss, use the lowest R SENSE value.Low-Cost, Precision, High-Side Current-Sense Amplifier6_______________________________________________________________________________________Figure 1. Functional Diagram•Accuracy:A high R SENSE value allows lower cur-rents to be measured more accurately. This is because offsets become less significant when the sense voltage is larger. For best performance,select R SENSE to provide approximately 100mV of sense voltage for the full-scale current in each application.•Efficiency and Power Dissipation:At high currentlevels, the I 2R losses in R SENSE can be significant.Take this into consideration when choosing the resistor value and its power dissipation (wattage)rating. Also, the sense resistor’s value might drift if it is allowed to heat up excessively.•Inductance:Keep inductance low if I SENSE has a large high-frequency component. Wire-wound resis-tors have the highest inductance, while metal film is somewhat better. Low-inductance metal-film resis-tors are also available. Instead of being spiral wrapped around a core, as in metal-film or wire-wound resistors, they are a straight band of metal and are available in values under 1Ω.•Cost:If the cost of R SENSE is an issue, you mightwant to use an alternative solution, as shown in Figure 2. This solution uses the PC board traces to create a sense resistor. Because of the inaccura-cies of the copper resistor, the full-scale current value must be adjusted with a potentiometer. Also,copper’s resistance temperature coefficient is fairly high (approximately 0.4%/°C).In Figure 2, assume that the load current to be mea-sured is 10A, and that you have determined a 0.3-inch-wide, 2-ounce copper to be appropriate. The resistivity of 0.1-inch-wide, 2-ounce (70µm thickness) copper is 30m Ω/ft. For 10A, you might want R SENSE = 5m Ωfor a 50mV drop at full scale. This resistor requires about 2inches of 0.1-inch-wide copper trace.Current-Sense Adjustment (Resistor Range, Output Adjust)Choose R OUT after selecting R SENSE . Choose R OUT to obtain the full-scale voltage you require, given the full-scale I OUT determined by R SENSE . OUT’s high imped-ance permits using R OUT values up to 200k Ωwith minimal error. OUT’s load impedance (e.g., the input of an op amp or ADC) must be much greater than R OUT (e.g., 100 x R OUT ) to avoid degrading measurement accuracy.High-Current MeasurementThe MAX4172 can achieve high-current measurements by using low-value sense resistors, which can be paral-leled to further increase the current-sense limit. As an alternative, PC board traces can be adjusted over a wide range.MAX4172Low-Cost, Precision, High-SideCurrent-Sense Amplifier_______________________________________________________________________________________7Table 1. Suggested Component ValuesFigure 2. MAX4172 Connections Showing Use of PC BoardMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.8___________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600©1996 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.M A X 4172Low-Cost, Precision, High-Side Current-Sense Amplifier ___________________Chip Information________________________________________________________Package InformationPower-Supply Bypassing and GroundingIn most applications, grounding the MAX4172 requires no special precautions. However, in high-current sys-tems, large voltage drops can develop across the ground plane, which can add to or subtract from V OUT .Use a single-point star ground for the highest current-measurement accuracy.The MAX4172 requires no special bypassing and responds quickly to transient changes in line current. If the noise at OUT caused by these transients is a prob-lem, you can place a 1µF capacitor at the OUT pin to ground. You can also place a large capacitor at the RS terminal (or load side of the MAX4172) to decouple the load, reducing the current transients. These capacitors are not required for MAX4172 operation or stability. The RS+ and RS- inputs can be filtered by placing a capac-itor (e.g., 1µF) between them to average the sensed current.TRANSISTOR COUNT: 177SUBSTRATE CONNECTED TO GND。

简单的限流开关模式Li +电池充电控制器--------------------------------------------------------------------------概述低成本的MAX1873R/S/T提供所有功能需要对高达4A或以上的2 - ，3 - 或4 - 系列的锂离子电池进行简单而有效的充电。

它提供调节充电电流和电压，少于±0.75％时，总电压在电池端出现错误。

在降压的DC - DC配置下，外部P沟道MOSFET有效地为电池充电，这是低成本的设计。

MAX1873R/S/T使用两个控制回路调节电池电压和充电电流，一起工作的两个控制回路在电压和电流调节之间顺利转换。

一个额外的控制回路限制电流来自输入端，可以使AC适配器尺寸和成本最小化。

模拟电压还提供其输出正比于充电电流，以便ADC或微控制器可以监控充电电流。

在多化学充电器设计时，MAX1873也可能被用来作一个有效的有限电流源对镍镉或镍氢电池充电。

MAX1873R/S/T采用节省空间的16引脚QSOP封装是可用的。

使用评估板（MAX1873EVKIT），可以帮助减少设计时间。

--------------------------------------------------------------------------应用笔记本电脑便携式网络片2 - ，3 - ，或4节锂离子电池充电器6 - ，9 – 10节镍电池充电器手持式仪表便携式桌面助理（PDA）台式插座充电器引脚配置在数据资料的最后。

--------------------------------------------------------------------------特征•低成本和简单电路•可对2 - ，3 - ，或4节串联锂离子电池充电•AC适配器输入电流限制回路•还可对以镍为主的电池充电•模拟输出监视充电电流•± 0.75％的电池调节电压•5μA关断电池电流•输入电压高达28V•200mV的压差电压/100％占空比•可调充电电流•为300kHz的PWM振荡器降低了噪音•采用节省空间的16引脚QSOP•采用MAX1873评估板以加快设计----------------------------------------------------------------------订购信息部分温度 .范围 PIN的封装MAX1873REEE -40 °C至85 °C 16 QSOPMAX1873SEEE-40 °C至85 °C16 QSOPMAX1873TEEE-40 °C至85 °C16 QSOP------------------------------------------------------------------典型工作电路极限值CSSP，CSSN，DCIN接GND ·······················- 0.3V至30V VL，ICHG / EN接GND ························- 0.3V至6V VH，EXT接DCIN ····························- 6V至0.3V VH，EXT接GND ·······················( V DCIN 0.3V） - 0.3V EXT接VH ······························6V至- 0.3V DCIN接VL······························30V至- 0.3V VADJ，REF，CCI，CCV，CCS， IOUT接GND··············- 0.3V至（VL 0.3V）BATT，CSB接GND···························- 0.3V至20V CSSP接CSSN·····························- 0.3V至0.6V CSB接BATT·····························- 0.3V至0.6V VL源电流··································+50mA VH反向电流································+40mA 连续功耗（TA=70℃）16引脚QSOP封装（在70° C以上，功率衰减8.3mW/° C···········+667mW 工作温度范围MAX1873_EEE·····················-40°C至+85°C 结点温度································+150 °C 存储温度范围··························-65°C至+150°C 引线温度（焊接，10S)···························300°C 超出“绝对最大额定值”中所列的压力可能会造成设备的永久性损坏。

General DescriptionThe MAX3205E/MAX3207E/MAX3208E low-capaci-tance, ±15kV ESD-protection diode arrays with an inte-grated transient voltage suppressor (TVS) clamp are suitable for high-speed and general-signal ESD protec-tion. Low input capacitance makes these devices ideal for ESD protection of signals in H DTV, PC monitors (DVI™, HDMI™), PC peripherals (FireWire ®, USB 2.0),server interconnect (PCI Express™, Infiniband ®), datacom, and interchassis interconnect. Each channel consists of a pair of diodes that steer ESD current puls-es to V CC or GND.The MAX3205E/MAX3207E/MAX3208E protect against ESD pulses up to ±15kV H uman Body Model, ±8kV Contact Discharge, and ±15kV Air-Gap Discharge, as specified in IEC 61000-4-2. An integrated TVS ensures that the voltage rise seen on V CC during an ESD event is clamped to a known voltage. These devices have a 2pF input capacitance per channel, and a channel-to-channel capacitance variation of only 0.05pF, making them ideal for use on high-speed, single-ended, or dif-ferential signals.The MAX3207E is a two-channel device suitable for USB 1.1, USB 2.0 (480Mbps), and USB OTG applica-tions. The MAX3208E is a four-channel device for Ethernet and FireWire applications. The MAX3205E is a six-channel device for cell phone connectors and SVGA video connections.The MAX3205E is available in 9-bump, tiny chip-scale (UCSP™), and 16-pin, 3mm x 3mm, thin QFN pack-ages. The MAX3207E is available in a small 6-pin SOT23 package. The MAX3208E is available in 10-pin µMAX ®and 16-pin, 3mm x 3mm TQFN packages. All devices are specified for the -40°C to +125°C automo-tive operating temperature range.ApplicationsDVI Input/Output Protection Set-Top Boxes PDAs/Cell Phones Graphics Controller Cards Displays/ProjectorsHigh-Speed, Full-Speed and Low-Speed USB Port ProtectionFireWire IEEE 1394 Ports Consumer EquipmentHigh-Speed Differential Signal ProtectionFeatures♦Low Input Capacitance of 2pF Typical♦Low Channel-to-Channel Variation of 0.05pF from I/O to I/O♦High-Speed Differential or Single-Ended ESD Protection±15kV–Human Body Model±8kV–IEC 61000-4-2, Contact Discharge ±15kV–IEC 61000-4-2, Air-Gap Discharge ♦Integrated Transient Voltage Suppressor (TVS)♦Optimized Pinout for Minimized Stub Instances on Controlled-Impedance Differential-Transmission Line Routing♦-40°C to +125°C Automotive Operating Temperature Range♦UCSP Packaging AvailableMAX3205E/MAX3207E/MAX3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICsOrdering Information19-3361; Rev 2; 3/05For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .*EP = Exposed pad.FireWire is a registered trademark of Apple Computer, Inc.PCI Express is a trademark of PCI-SIG Corporation.DVI is a trademark of Digital Display Working Group.HDMI is a trademark of HDMI Licensing, LCC.InfiniBand is a registered trademark of InfiniBand Trade Association.UCSP is a trademark and µMAX is a registered trademark of Maxim Integrated Products, Inc.Typical Operating Circuit and Pin Configurations appear at end of data sheet.M A X 3205E /M A X 3207E /M A X 3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Note 3:Guaranteed by design, not production tested.V CC to GND...........................................................-0.3V to +6.0V I/O_ to GND................................................-0.3V to (V CC + 0.3V)Continuous Power Dissipation (T A = +70°C)6-Pin SOT23 (derate 8.7mW/°C above +70°C)............696mW 9-Pin UCSP (derate 4.7mW/°C above +70°C).............379mW 10-Pin µMAX (derate 5.6mW/°C above +70°C)...........444mW 16-Pin Thin QFN (derate 20.8mW/°C above +70°C).1667mWOperating Temperature Range .........................-40°C to +125°C Storage Temperature Range.............................-65°C to +150°C Junction Temperature .....................................................+150°C Lead Temperature (soldering, 10s).................................+300°C Bump Temperature (soldering)Infrared (15s)...............................................................+220°C Vapor Phase (60s).......................................................+215°CMAX3205E/MAX3207E/MAX3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs_______________________________________________________________________________________3CLAMP VOLTAGE vs. DC CURRENTDC CURRENT (mA)C L A M P V O L T A G E (V )130110907050300.50.70.91.11.31.50.310150LEAKAGE CURRENT vs. TEMPERATUREM A X 3205E t o c 02TEMPERATURE (°C)L E K A G E C U R R E N T (p A )804010100100010,0001-40120INPUT CAPACITANCE vs. INPUT VOLTAGEM A X 3205E t o c 03INPUT VOLTAGE (V)I N P U T C A P A C I T A N C E (p F )43211234005Typical Operating Characteristics(V CC = +5V, T A = +25°C, unless otherwise noted.)M A X 3205E /M A X 3207E /M A X 3208EDetailed DescriptionThe MAX3205E/MAX3207E/MAX3208E low-capacitance,±15kV ESD-protection diode arrays with an integrated transient voltage suppressor (TVS) clamp are suitable for high-speed and general-signal ESD protection. Low input capacitance makes these devices ideal for ESD protection of signals in HDTV, PC monitors (DVI, HDMI),PC peripherals (FireWire, USB 2.0), Server Interconnect (PCI Express, Infiniband), Datacom, and Inter-Chassis Interconnect. Each channel consists of a pair of diodes that steer ESD current pulses to V CC or GND. The MAX3205E, MAX3207E, and MAX3208E are two, four,and six channels (see the Functional Diagram ).The MAX3205E/MAX3207E/MAX3208E are designed to work in conjunction with a device’s intrinsic ESD pro-tection. The MAX3205E/MAX3207E/MAX3208E limit theexcursion of the ESD event to below ±25V peak voltage when subjected to the H uman Body Model waveform.When subjected to the IEC 61000-4-2 waveform, the peak voltage is limited to ±60V when subjected to Contact Discharge. The peak voltage is limited to ±100V when subjected to Air-Gap Discharge. The device protected by the MAX3205E/MAX3207E/MAX3208E must be able to withstand these peak volt-ages, plus any additional voltage generated by the par-asitic of the board.A TVS is integrated into the MAX3205E/MAX3207E/MAX3208E to help clamp ESD to a known voltage. This helps reduce the effects of parasitic inductance on the V CC rail by clamping V CC to a known voltage during an ESD event. For the lowest possible clamp voltage dur-ing an ESD event, placing a 0.1µF capacitor as close to V CC as possible is recommended.Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs 4_______________________________________________________________________________________Functional DiagramApplications InformationDesign ConsiderationsMaximum protection against ESD damage results from proper board layout (see the Layout Recommendations section). A good layout reduces the parasitic series inductance on the ground line, supply line, and protect-ed signal lines. The MAX3205E/MAX3207E/MAX3208E ESD diodes clamp the voltage on the protected lines during an ESD event and shunt the current to GND or V CC . In an ideal circuit, the clamping voltage (V C ) is defined as the forward voltage drop (V F ) of the protec-tion diode, plus any supply voltage present on the cath-ode.For positive ESD pulses:V C = V CC + V F For negative ESD pulses:V C =-V FThe effect of the parasitic series inductance on the lines must also be considered (Figure 1).For positive ESD pulses:For negative ESD pulses:where, I ESD is the ESD current pulse.During an ESD event, the current pulse rises from zeroto peak value in nanoseconds (Figure 2). For example,in a 15kV IEC-61000 Air-Gap Discharge ESD event, the pulse current rises to approximately 45A in 1ns (di/dt =45 x 109). An inductance of only 10nH adds an addi-tional 450V to the clamp voltage, and represents approximately 0.5in of board trace. Regardless of the device’s specified diode clamp voltage, a poor layout with parasitic inductance significantly increases the effective clamp voltage at the protected signal line.Minimize the effects of parasitic inductance by placing the MAX3205E/MAX3207E/MAX3208E as close to the connector (or ESD contact point) as possible.A low-ESR 0.1µF capacitor is recommended between V CC and GND in order to get the maximum ESD protec-tion possible. This bypass capacitor absorbs the charge transferred by a positive ESD event. Ideally, the supply rail (V CC ) would absorb the charge caused by a positive ESD strike without changing its regulated value. All power supplies have an effective output impedance on their positive rails. If a power supply’s effective output impedance is 1Ω, then by using V = I x R, the clamping voltage of V C increases by the equa-tion V C = I ESD x R OUT . A +8kV IEC 61000-4-2 ESD event generates a current spike of 24A. The clamping voltage increases by V C = 24A x 1Ω, or V C = 24V.Again, a poor layout without proper bypassing increas-es the clamping voltage. A ceramic chip capacitor mounted as close as possible to the MAX3205E/MAX3207E/MAX3208E V CC pin is the best choice for this application. A bypass capacitor should also beplaced as close to the protected device as possible.MAX3205E/MAX3207E/MAX3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs_______________________________________________________________________________________5Figure 1. Parasitic Series InductanceFigure 2. IEC 61000-4-2 ESD Generator Current WaveformM A X 3205E /M A X 3207E /M A X 3208E±15kV ESD ProtectionESD protection can be tested in various ways. The MAX3205E/MAX3207E/MAX3208E are characterized for protection to the following limits:•±15kV using the Human Body Model•±8kV using the Contact Discharge Method specified in IEC 61000-4-2•±15kV using the IEC 61000-4-2 Air-Gap Discharge MethodESD Test ConditionsESD performance depends on a number of conditions.Contact Maxim for a reliability report that documents test setup, methodology, and results.Human Body ModelFigure 3 shows the H uman Body Model, and Figure 4shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the device through a 1.5k Ωresistor.IEC 61000-4-2The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. The MAX3205E/MAX3207E/MAX3208E help users design equipment that meets Level 4 of IEC 61000-4-2. The main differ-ence between tests done using the Human Body Modeland IEC 61000-4-2 is higher peak current in IEC 61000-4-2. Because series resistance is lower in the IEC 61000-4-2 ESD test model (Figure 5), the ESD-withstand voltage measured to this standard is general-ly lower than that measured using the H uman Body Model. Figure 2 shows the current waveform for the ±8kV, IEC 61000-4-2 Level 4, ESD Contact Discharge test. The Air-Gap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized.Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs 6_______________________________________________________________________________________Figure 4. Human Body Model Current WaveformLayout RecommendationsProper circuit-board layout is critical to suppress ESD-induced line transients (See Figure 6). The MAX3205E/MAX3207E/MAX3208E clamp to 100V; however, with improper layout, the voltage spike at the device can be much higher. A lead inductance of 10nH with a 45A current spike results in an additional 450V spike on the protected line. It is essential that the layout of the PC board follows these guidelines:1)Minimize trace length between the connector or input terminal, I/O_, and the protected signal line.2)Use separate planes for power and ground to reduce parasitic inductance and to reduce the impedance to the power rails for shunted ESD current.3)Ensure short low-inductance ESD transient return paths to GND and V CC .4)Minimize conductive power and ground loops.5)Do not place critical signals near the edge of the PC board.6)Bypass V CC to GND with a low-ESR ceramic capaci-tor as close to V CC as possible.7)Bypass the supply of the protected device to GND with a low-ESR ceramic capacitor as close to the supply pin as possible.UCSP Applications InformationFor the latest application details on UCSP construction,dimensions, tape carrier information, printed circuit board techniques, bump-pad layout, and recommend-ed reflow temperature profile, as well as the latest infor-mation on reliability testing results, go to the Maxim website at /ucsp for the Application Note, UCSP—A Wafer-Level Chip-Scale Package .Chip InformationDIODE COUNT:MAX3205E: 7MAX3207E: 3MAX3208E: 5PROCESS: BiCMOSMAX3205E/MAX3207E/MAX3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs_______________________________________________________________________________________7Typical Operating CircuitM A X 3205E /M A X 3207E /M A X 3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs 8_______________________________________________________________________________________Pin ConfigurationsMAX3205E/MAX3207E/MAX3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs_______________________________________________________________________________________9Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)M A X 3205E /M A X 3207E /M A X 3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs 10______________________________________________________________________________________Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)MAX3205E/MAX3207E/MAX3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs______________________________________________________________________________________11Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)M A X 3205E /M A X 3207E /M A X 3208EDual, Quad, and Hex High-Speed Differential ESD-Protection ICs 12______________________________________________________________________________________Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)Dual, Quad, and Hex High-SpeedDifferential ESD-Protection ICs Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses areimplied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________13©2005 Maxim Integrated Products Printed USAis a registered trademark of Maxim Integrated Products, Inc. Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages.)MAX3205E/MAX3207E/MAX3208E。