Exploring the Use of Multiple Analogical Models When Teaching and

Exploring the Concept of Universal Basic Income Universal Basic Income (UBI) is a concept that has gained significant attention in recent years. The idea of providing a guaranteed income to all citizens regardless of their employment status has been debated by economists, politicians, and social activists. While UBI has its supporters, it also has its critics. In this essay, we will explore the concept of Universal Basic Income, its benefits, drawbacks, and the challenges that come with its implementation.Proponents of UBI argue that it is an effective way to combat poverty and income inequality. They argue that UBI would provide a safety net for the most vulnerable members of society, ensuring that everyone has access to basic necessities such as food, shelter, and healthcare. UBI would also provide individuals with the freedom to pursue their interests without the fear of financial insecurity. This could lead to increased creativity and innovation, as people would be able to take risks and explore new ideas without the fear of failure.Critics of UBI argue that it is an expensive and unsustainable policy. They argue that UBI would require a significant increase in taxes, which would discourage investment and hinder economic growth. Critics also argue that UBI would discourage people from working, leading to a decline in productivity and economic output. They argue that UBI would create a culture of dependency, where people rely on government handouts instead of working to support themselves.One of the biggest challenges of implementing UBI is determining the amount of money that should be provided to each individual. Some argue that the amount should be enough to cover basic necessities such as food, shelter, and healthcare. Others argue that it should be enough to provide a comfortable standard of living. Determining the amount of UBI is a complex issue that requires careful consideration of economic factors, social norms, and political realities.Another challenge of implementing UBI is determining how it would be funded. Some argue that UBI could be funded through a combination of taxes on the wealthy, reductionsin government spending, and the implementation of a value-added tax (VAT). Others argue that UBI would require a complete overhaul of the tax system, including the implementation of a wealth tax and the elimination of tax breaks for corporations.Despite the challenges, UBI has been successfully implemented in several countries. In Finland, a two-year UBI pilot program was launched in 2017, providing 2,000 unemployed individuals with a month ly payment of €560. The program was designed to test the effectiveness of UBI in reducing poverty and promoting employment. While the results of the program were mixed, it did provide valuable insights into the potential benefits and drawbacks of UBI.In conclusion, Universal Basic Income is a concept that has the potential to transform our society. While it has its supporters and critics, it is clear that UBI is a complex issue that requires careful consideration of economic, social, and political factors. The implementation of UBI would require significant changes to our tax system and government spending, as well as a willingness to experiment with new policies and ideas. Despite the challenges, UBI has the potential to provide a safety net for the most vulnerable members of society and promote economic growth and innovation.。

Exploring the World of Virtual Reality Virtual reality, often abbreviated as VR, is a technology that has gained significant popularity in recent years. It allows users to immerse themselves in a simulated environment that can be similar to or completely different from the real world. The experience is typically achieved through the use of a VR headset, which covers the user's eyes and ears and provides a 360-degree view of the virtual world. As someone who has had the opportunity to explore the world of virtual reality, I can attest to the profound impact it can have on one's perception and understanding of reality. One of the most striking aspects of virtual reality is its ability to transport users to places and situations that would otherwise be impossible or impractical to experience in real life. Whether it's exploring the depths of the ocean, walking on the surface of Mars, or flying through a fantasy world, VR opens up a whole new realm of possibilities for exploration and adventure. The sense of presence and immersion that VR provides is truly remarkable, making users feel as though they are actually inhabiting the virtual world rather than just observing it from a distance. Beyond its entertainment value, virtual reality also holds immense potential for education and training. Imagine being able to take a virtual tour of ancient ruins, conduct virtual science experiments, or practice surgical procedures in a safe and controlled environment. VR has the power to revolutionize the way we learn and acquire new skills, offering a level of interactivity and engagement that traditional methods simply cannot match. By simulating realistic scenarios and providing immediate feedback, VR has the ability to enhance learning outcomes and improve retention rates. However, as with any emerging technology, virtual reality also raises important ethical and social considerations. One of the key concerns is the potential impact of prolonged VR use on mental and physical health. Extended exposure to virtual environments can lead to symptoms such as eye strain, motion sickness, and disorientation, especially if the VR experience is not properly calibrated or if users have pre-existing conditions. It is crucial for developers and users alike to be mindful of these risks and take appropriate measures to ensure a safe and comfortable experience. Another issue to consider is the potential for addiction and escapism associated with virtual reality. Theimmersive nature of VR can be so captivating that users may find it difficult to disconnect from the virtual world and return to reality. This can have negative consequences on mental well-being and social relationships, as excessive VR use may lead to isolation and withdrawal from real-life experiences. It is important for users to establish healthy boundaries and balance their virtual activities with real-world interactions to maintain a sense of perspective and connection. Despite these challenges, the world of virtual reality continues to evolve and expand, offering new possibilities and opportunities for innovation. From interactive storytelling and virtual concerts to collaborative workspaces and therapeutic applications, VR has the potential to transform various aspects of our lives and society as a whole. As we navigate this exciting and rapidly changing landscape, it is essential to approach virtual reality with a sense of curiosity, responsibility, and mindfulness, ensuring that we harness its power for the greater good and enrich our understanding of the world around us.。

As a high school student with a keen interest in music, Ive always been fascinated by the rich tapestry of sounds that different cultures produce. Recently, I embarked on a journey to explore the world of traditional Chinese musical instruments, a venture that has not only broadened my musical horizons but also deepened my appreciation for the cultural heritage of China.My quest began with the guzheng, an ancient plucked string instrument with a history that dates back over 2,500 years. The guzhengs melodic resonance and the way it can evoke a myriad of emotions captivated me. I was particularly moved by the story of how the guzheng was played by ancient poets and scholars to express their innermost feelings. The instruments 21 strings, stretched over a large, resonant soundboard, produce a sound that is both ethereal and deeply moving. Listening to a master guzheng player is like witnessing a dance of fingers on strings, each pluck telling a story, each strum painting a picture.Next, I delved into the world of the pipa, a fourstringed instrument that is often referred to as the Chinese lute. The pipa has a unique shape, with a pearshaped body and a distinctive curved neck. It is known for its versatility, capable of producing a wide range of sounds from soft, delicate melodies to powerful, percussive strokes. I was intrigued by the pipas role in traditional Chinese music, where it often takes the lead in ensembles, guiding the musical narrative with its expressive capabilities.My exploration took a more rhythmic turn when I discovered the erhu, a twostringed bowed instrument sometimes likened to a violin but with adistinctly Chinese character. The erhus sound is hauntingly beautiful, often described as having a voicelike quality that can convey deep sorrow or joy.I was particularly struck by the erhus ability to mimic the human voice, a testament to the skill of the musician and the instruments expressive range.The dizi, a transverse bamboo flute, was another instrument that I found utterly enchanting. Its clear, crisp tones and the agility with which it can navigate through complex melodies left a lasting impression on me. The dizi is often used in folk music and is a staple in various Chinese musical genres. I was amazed by the breath control and finger dexterity requiredto play the dizi, skills that take years to master.As I continued my musical odyssey, I came across the yangqin, a hammered dulcimer that produces a bright, shimmering sound. The yangqins unique playing style, where the musician strikes the strings with small hammers, is both visually engaging and sonically rich. It is often used to provide rhythmic accompaniment in traditional Chinese music ensembles.My journey through the realm of Chinese traditional instruments wouldnt be complete without mentioning the suona, a doublereed horn with a distinctive, penetrating sound. The suona is often played during festivals and celebrations, its powerful sound cutting through the air and energizing the atmosphere.What Ive learned from this exploration is that each instrument is not just a tool for making music but also a vessel for storytelling and culturalexpression. The craftsmanship involved in creating these instruments is a testament to the ingenuity and artistry of the Chinese people. Moreover, the music produced by these instruments is a reflection of the rich history and cultural diversity of China.In conclusion, my foray into the world of traditional Chinese musical instruments has been an enlightening experience. It has shown me that music is a universal language that transcends borders and connects people across cultures. As I continue to learn and grow as a musician, I hope to incorporate elements of this rich musical heritage into my own performances, honoring the legacy of these timeless instruments and the stories they tell.。

Dual, 16-Bit, 1230 MSPS,TxDAC+® Digital-to-Analog ConverterAD9122 Rev. AInformation furnished by Analresponsibility is assumed by Ana rights of third parties that may re license is granted by implication T rademarks and registered trad MA 02062-9106, U.S.A. Inc. All rights reserved.og Devices is believed to be accurate and reliable. However, nolog Devices for its use, nor for any infringements of patents or other sult from its use. Specifications subject to change without notice. No or otherwise under any patent or patent rights of Analog Devices. emarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, Tel: 781.329.4700Fax: 781.461.3113 ©2010 Analog Devices,FEATURESFlexible LVDS interface allows word, byte, or nibble load Single-carrier W-CDMA ACLR = 82 dBc @ 122.88 MHz IF Analog output: adjustable 8.7 mA to 31.7 mA, R L = 25 Ω to 50 Ω Novel 2×/4×/8× interpolator/complex modulator allows carrier placement anywhere in the DAC bandwidthGain and phase adjustment for sideband suppression Multiple chip synchronization interfacesHigh performance, low noise PLL clock multiplierDigital inverse sinc filterLow power: 1.5 W @ 1.2 GSPS, 800 mW @ 500 MSPS, full operating conditions72-lead, exposed paddle LFCSPAPPLICATIONSWireless infrastructureW-CDMA, CDMA2000, TD-SCDMA, WiMAX, GSM, LTEDigital high or low IF synthesisTransmit diversityWideband communications: LMDS/MMDS, point-to-point GENERAL DESCRIPTIONThe AD9122 is a dual 16-bit, high dynamic range, digital-to-analog converter (DAC) that provides a sample rate of 1200 MSPS, permitting a multicarrier generation up to the Nyquist frequency. It includes features optimized for direct conversion transmit applications, including complex digital modulation, and gain and offset compensation. The DAC outputs are optimized to interface seamlessly with analog quadrature modulators, such as the ADL537x F-MOD series from Analog Devices, Inc. A 4-wire serial port interface provides for programming/readback of many internal parameters. Full-scale output current can be programmed over a range of 8.7 mA to 31.7 mA. The AD9122 comes in a 72-lead LFCSP.PRODUCT HIGHLIGHTS1.Ultralow noise and intermodulation distortion (IMD)enable high quality synthesis of wideband signals frombaseband to high intermediate frequencies.2. A proprietary DAC output switching technique enhancesdynamic performance.3.The current outputs are easily configured for varioussingle-ended or differential circuit topologies.4.Flexible LVDS digital interface allows the standard 32-wirebus to be reduced to ½ or ¼ of the width.TYPICAL SIGNAL CHAINCOMPLEX BASEBANDDC COMPLEX IFf IFRFLO – f IF8281-1 Figure 1.AD9122Rev. A | Page 2 of 60TABLE OF CONTENTSFeatures .............................................................................................. 1 Applications ....................................................................................... 1 General Description ......................................................................... 1 Product Highlights ........................................................................... 1 Typical Signal Chain ......................................................................... 1 Revision History ............................................................................... 3 Functional Block Diagram .............................................................. 4 Specifications ..................................................................................... 5 DC Specifications ......................................................................... 5 Digital Specifications ................................................................... 6 Digital Input Data Timing Specifications ................................. 6 AC Specifications .......................................................................... 7 Absolute Maximum Ratings ............................................................ 8 Thermal Resistance ...................................................................... 8 ESD Caution .................................................................................. 8 Pin Configuration and Function Descriptions ............................. 9 Typical Performance Characteristics ........................................... 11 Terminology .................................................................................... 17 Differences Between the AD9122R1 and AD9122R2 ............... 18 Theory of Operation ...................................................................... 19 Serial Port Operation ................................................................. 19 Data Format ................................................................................ 19 Serial Port Pin Descriptions ...................................................... 19 Serial Port Options ..................................................................... 20 Device Configuration Register Map and Descriptions ......... 21 LVDS Input Data Ports .................................................................. 33 Word Interface Mode ................................................................. 33 Byte Interface Mode ................................................................... 33 Nibble Interface Mode ............................................................... 33 FIFO Operation .......................................................................... 33 Interface Timing ......................................................................... 35 Digital Datapath .............................................................................. 37 Premodulation ............................................................................ 37 Interpolation Filters ................................................................... 37 NCO Modulation ....................................................................... 40 Datapath Configuration ............................................................ 40 Determining Interpolation Filter Modes ................................ 41 Datapath Configuration Example ............................................ 42 Data Rates vs. Interpolation Modes ......................................... 43 Coarse Modulation Mixing Sequences .................................... 43 Quadrature Phase Correction ................................................... 44 DC Offset Correction ................................................................ 44 Inverse Sinc Filter ....................................................................... 44 DAC Input Clock Configurations ................................................ 45 DAC Input Clock Configurations ............................................ 45 Analog Outputs............................................................................... 47 Transmit DAC Operation .......................................................... 47 Auxiliary DAC Operation ......................................................... 48 Baseband Filter Implementation .............................................. 49 Driving the ADL5375-15 .......................................................... 49 Reducing LO Leakage and Unwanted Sidebands .................. 50 Device Power Dissipation .............................................................. 51 Temperature Sensor ................................................................... 52 Multichip Synchronization ............................................................ 53 Synchronization with Clock Multiplication ............................... 53 Synchronization with Direct Clocking .................................... 54 Data Rate Mode Synchronization ............................................ 54 FIFO Rate Mode Synchronization ........................................... 55 Additional Synchronization Features ...................................... 55 Interrupt Request Operation ........................................................ 57 Interrupt Service Routine .......................................................... 57 Interface Timing Validation .......................................................... 58 SED Operation ............................................................................ 58 SED Example .............................................................................. 58 Example Start-Up Routine ........................................................ 59 Outline Dimensions ....................................................................... 60 Ordering Guide .. (60)AD9122Rev. A | Page 3 of 60REVISION HISTORY3/10—Rev. 0 to Rev. AChanges to Reflect Differences Between R1 and R2Silicon................................................................................... Universal Changes to Features Section ............................................................ 1 Changes to Table 1 ............................................................................ 5 Changes to Table 2 ............................................................................ 6 Changes to Table 5 ............................................................................ 7 Change to IOVDD Rating in Table 6 .............................................. 8 Changes to Table 8 ............................................................................ 9 Changes to Figure 10 to Figure 15 ................................................ 12 Added Differences Between the AD9122R1 and AD9122R2 Section, Added Figure 36 and Figure 37; RenumberedSequentially ...................................................................................... 18 Changes to Table 10 ........................................................................ 21 Changes to Table 11 ........................................................................ 23 Changes to FIFO Operation Section ............................................ 33 Changes to Resettling the FIFO Section and Replaced Table 13; Renumbered Sequentially; Added Serial Port Initiated FIFO Reset Section, and Added FRAME Initiated Relative FIFOReset Section .................................................................................... 34 Added FRAME Initiated Absolute FIFO Reset Section andReplaced Table 14 ............................................................................ 35 Changes to Figure 54 ...................................................................... 38 Changes to Table 18 ........................................................................ 39 Changes to SED Example Section ................................................. 58 Added Example Start-Up Routine Section .................................. 59 9/09—Revision 0: Initial VersionAD9122Rev. A | Page 4 of 60FUNCTIONAL BLOCK DIAGRAMD15P—D15ND0P—D0NIOUT1P IOUT1NIOUT2P IOUT2NFSADJREFIO DCI FRAME08281-002Figure 2. AD9122 Functional Block DiagramAD9122Rev. A | Page 5 of 60SPECIFICATIONSDC SPECIFICATIONST MIN to T MAX , AVDD33 = 3.3 V , DVDD18 = 1.8 V , CVDD18 =1.8 V , I OUTFS = 20 mA, maximum sample rate, unless otherwise noted. Table 1.Parameter Min Typ Max Unit RESOLUTION 16 Bits ACCURACY Differential Nonlinearity (DNL) ±2.1 LSB Integral Nonlinearity (INL) ±3.7 LSB MAIN DAC OUTPUTS Offset Error −0.001 0 +0.001 % FSR Gain Error (with Internal Reference) −3.6 ±2 +3.6 % FSR Full-Scale Output Current 18.66 19.6 31.66 mA Output Compliance Range −1.0 +1.0 V Output Resistance 10 MΩ Gain DAC Monotonicity Guaranteed Settling Time to Within ±0.5 LSB 20 ns MAIN DAC TEMPERATURE DRIFT Offset 0.04 ppm/°C Gain 100 ppm/°C Reference Voltage 30 ppm/°C REFERENCE Internal Reference Voltage 1.2 V Output Resistance 5 kΩ ANALOG SUPPLY VOLTAGES AVDD33 3.13 3.3 3.47 V CVDD18 1.71 1.8 1.89 V DIGITAL SUPPLY VOLTAGES DVDD18 1.71 1.8 1.89 V IOVDD 1.71 1.8/3.3 3.47 V POWER CONSUMPTION 2× Mode, f DAC = 491.22 MSPS, IF = 10 MHz, PLL Off 834 mW 2× Mode, f DAC = 491.22 MSPS, IF = 10 MHz, PLL On 913 mW 8× Mode, f DAC = 800 MSPS, IF = 10 MHz, PLL Off 1135 1241 mWAVDD33 55 57 mA CVDD18 85 90 mA DVDD18 444 495 mA Power-Down Mode (Register 0x01 = 0xF1) 6.5 18.8 mW Power Supply Rejection Ratio, AVDD33 −0.3 +0.3 % FSR/V OPERATING RANGE −40 +25 +85 °C1Based on a 10 kΩ external resistor.AD9122Rev. A | Page 6 of 60DIGITAL SPECIFICATIONST MIN to T MAX , AVDD33 = 1.8 V , IOVDD = 3.3 V , DVDD18 = 1.8 V , CVDD18 = 1.8 V , I OUTFS = 20 mA, maximum sample rate, unless otherwise noted.1LVDS receiver is compliant to the IEEE 1596 reduced range link, unless otherwise noted.DIGITAL INPUT DATA TIMING SPECIFICATIONSTable 3.Parameter Min Typ Max UnitLATENCY (DACCLK Cycles) 1× Interpolation (With or Without Modulation) 64 Cycles 2× Interpolation (With or Without Modulation) 135 Cycles 4× Interpolation (With or Without Modulation) 292 Cycles 8× Interpolation (With or Without Modulation) 608 Cycles Inverse Sinc 20 Cycles Fine Modulation 8 Cycles Power-Up Time 260 msAD9122Rev. A | Page 7 of 60AC SPECIFICATIONST MIN to T MAX , AVDD33 = 3.3 V , DVDD18 = 1.8 V , CVDD18 = 1.8 V , I OUTFS = 20 mA, maximum sample rate, unless otherwise noted. Table 4.ParameterMin Typ Max UnitSPURIOUS-FREE DYNAMIC RANGE (SFDR) f DAC = 100 MSPS, f OUT = 20 MHz 78 dBc f DAC = 200 MSPS, f OUT = 50 MHz 80 dBc f DAC = 400 MSPS, f OUT = 70 MHz 69 dBc f DAC = 800 MSPS, f OUT = 70 MHz72 dBc TWO-TONE INTERMODULATION DISTORTION (IMD) f DAC = 200 MSPS, f OUT = 50 MHz 84 dBc f DAC = 400 MSPS, f OUT = 60 MHz 86 dBc f DAC = 400 MSPS, f OUT = 80 MHz 84 dBc f DAC = 800 MSPS, f OUT = 100 MHz81 dBc NOISE SPECTRAL DENSITY (NSD) EIGHT-TONE, 500 kHz TONE SPACING f DAC = 200 MSPS, f OUT = 80 MHz −162 dBm/Hz f DAC = 400 MSPS, f OUT = 80 MHz −163 dBm/Hz f DAC = 800 MSPS, f OUT = 80 MHz−164 dBm/Hz W-CDMA ADJACENT CHANNEL LEAKAGE RATIO (ACLR), SINGLE CARRIER f DAC = 491.52 MSPS, f OUT = 10 MHz 84 dBc f DAC = 491.52 MSPS, f OUT = 122.88 MHz 82 dBc f DAC = 983.04 MSPS, f OUT = 122.88 MHz 83 dBc W-CDMA SECOND ACLR, SINGLE CARRIER f DAC = 491.52 MSPS, f OUT = 10 MHz 88 dBc f DAC = 491.52 MSPS, f OUT = 122.88 MHz 86 dBc f DAC = 983.04 MSPS, f OUT = 122.88 MHz88dBcTable 5. Interface SpeedsBus Width Interpolation Factorf BUS (Mbps)1.8 V ± 5% 1.8 V ± 2% 1.9 V ± 5% Nibble (4 Bits) 1×1100 1200 1230 2× (HB1) 1100 1200 1230 2× (HB2) 1100 1200 1230 4× 1100 1200 1230 8× 1100 1200 1230 Byte (8 Bits) 1×1100 1200 1230 2× (HB1) 1100 1200 1230 2× (HB2) 1100 1200 1230 4× 1100 1200 1230 8× 550 600 615 Word (16 Bits) 1×1100 1200 1230 2× (HB1) 900 1000 1000 2× (HB2) 1100 1200 1230 4× 550 600 615 8×275 300 307.5AD9122Rev. A | Page 8 of 60ABSOLUTE MAXIMUM RATINGSTHERMAL RESISTANCEThe exposed paddle (EPAD) must be soldered to the ground plane for the 72-lead, LFCSP . The EPAD performs as an electrical and thermal connection to the board.Typical θJA , θJB , and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation effectively reducing θJA and θJB . Table 7. Thermal ResistancePackage θJA θJB θJC Unit Conditions 72-Lead LFCSP_VQ 20.7 10.9 1.1 °C/W EPAD solderedESD CAUTIONStresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operationalsection of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.AD9122Rev. A | Page 9 of 6008281-003D 11P D 11N D 10P D 10N D 9P D 9N D 8P D 8N D C I D C I D V D D 18D V S D 7P D 7N D 6P D 6N D 5P D 5N PIN CONFIGURATION AND FUNCTION DESCRIPTIONS12345678910111213141516CVDD18DACCLKP DACCLKNCVSS FRAMEP FRAMENIRQ D15P D15N NC IOVDD DVDD18D14P D14N D13P D13N 17D12P 18D12N 19202122232425262728293031323334P N S 3536545352515049484746454443424140393837RESET CS SCLK SDIO SDO DVDD18D0N D0P D1N D1P DVSS DVDD18D2N D2P D3N D3P D4N D4P727170696867666564636261605958575655C VD D 18C V D D 18REF C L K P R E F C L K N A V D D 33I O U T 1P I O U T 1N A V D D 33A V S S F S A D J R E F I O A V S S A V D D 33I O U T 2N I O U T 2P A V D D 33A V S S NCNOTES1. NC = NO CONNECT.2. EXPOSED PAD MUST BE CONNECTED TO AVSS.Figure 3. Pin ConfigurationAD9122Rev. A | Page 10 of 60AD9122050100150200250300350400450f OUT (MHz)TYPICAL PERFORMANCE CHARACTERISTICS0–10–20–30–40–50–60–70–80–90–100H A R M O N I C S (d B c)08281-10150100150200250300350400450f OUT (MHz)Figure 4. Harmonics vs. f OUT over f DATA , 2× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mA0–10–20–30–40–50–60–70–80–90–100H A R M O N I C S (d B c )08281-10208281-1030–10–20–30–40–50–60–70–80–90–100050100150200250300350400450H A R M O N I C S (d B c )f OUT(MHz)08281-1040–10–20–30–40–50–60–70–80–90–10050100150200250300350400450H A R M O N I C S (d B c )f OUT (MHz)Figure 7. Second Harmonic vs. f OUT over Digital Scale, 2× Interpolation,f DATA = 400 MSPS, f SC= 20 mA08281-1050–10–20–30–40–50–60–70–80–90–10050100150200250300350400450H A R M O N I C S (d B c )f OUT (MHz)Figure 5. Harmonics vs. f OUT over f DATA , 4× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mAFigure 8. Third Harmonic vs. f OUT over Digital Scale, 2× Interpolation,f DATA = 400 MSPS, f SC = 20 mA0–10–20–30–40–50–60–70–80–90–100H A R M O N I C S (d B c )100200300400500600700f OUT (MHz)08281-106Figure 6. Harmonics vs. f OUT over f DATA , 8× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mA Figure 9. Second Harmonic vs. f OUT over f SC , 2× Interpolation,f DATA = 400 MSPS, Digital Scale = 0 dBFSAD9122–69–70–71–72–73–74–75–77H I G H E S T D I G I T A L S P U R (d B c )–78–79050100150200250300350400450f OUT (MHz)–7608281-10708281-110START 1.0MHz #RES BW 10kHzVBW 10kHzSTOP 500.0MHzSWEEP 6.017s (601 PTS)08281-111START 1.0MHz #RES BW 10kHzVBW 10kHzSTOP 800.0MHzSWEEP 9.634s (601 PTS)Figure 10. Highest Digital Spur vs. f OUT over f DATA , 2× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mA–60–65–70–75–80–85H I G H E S T D I G I T A L S P U R (d B c )050100150200250300350400450f OUT (MHz)08281-108Figure 11. Highest Digital Spur vs. f OUT over f DATA , 4× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mA–60–90–95–85–80–75–70–65H I G H E S T D I G I T A L S P U R (d B c )010*******400500600700f OUT (MHz)08281-109Figure 12. Highest Digital Spur vs. f OUT over f DATA , 8× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mAFigure 13. 2× Interpolation, Single-Tone Spectrum, f DATA = 250 MSPS,f OUT= 101 MHzFigure 14. 4× Interpolation, Single-Tone Spectrum, f DATA = 200 MSPS,f OUT = 151 MHz08281-START 1.0MHz #RES BW 10kHzVBW 10kHzSTOP 800.0MHzSWEEP 9.634s (601 PTS)112Figure 15. 8× Interpolation, Single-Tone Spectrum, f DATA = 100 MSPS,f OUT = 131 MHzAD91220–90–80–70–60–50–40–30–20–10I M D (d B c )050100150200250300350400450f OUT (MHz)308281-11Figure 16. IMD vs. f OUT over f DATA , 2× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mA0–80–70–60–50–40–30–20–10–90I M D (d B c )050100150200250300350400450f OUT (MHz)408281-11Figure 17. IMD vs. f OUT over f DATA , 4× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mA0–80–70–60–50–40–30–20–10I M D (d B c )–100–90050100150200250300350400450f OUT(MHz)08281-115Figure 18. IMD vs. f OUT over f DATA , 8× Interpolation,Digital Scale = 0 dBFS, f SC = 20 mA0–90–80–70–60–50–40–30–20–10050100150200250300350400450I M D (d B c )f OUT(MHz)08281-116Figure 19. IMD vs. f OUT over Digital Scale, 2× Interpolation,f DATA = 400 MSPS, f SC = 20 mA–50–85–80–75–70–65–60–55050100150200250300350400450I M D (d B c )f OUT (MHz)08281-117Figure 20. IMD vs. f OUT over f SC , 2× Interpolation, f DATA = 400 MSPS,Digital Scale = 0 dBFS–40–90–85–80–75–70–65–60–55–50–45I M D (d B c)050100150200250300350400450f OUT (MHz)08281-118Figure 21. IMD vs. f OUT , PLL On vs. PLL Off, 4× Interpolation, f DATA = 200 MSPS,Digital Scale = 0 dBFS, f SC = 20 mAAD9122–152–156–154–158–160–162–164––166N S D (d B m /H z )50100150200250300350400450f OUT (MHz)908281-11Figure 22. 1-Tone NSD vs. f OUT over Interpolation Rate, Digital Scale = 0 dBFS,f SC = 20 mA, PLL Off–154–158–156–160–162–164–166–168N S D (d B m /H z )050100150200250300350400450f OUT (MHz)08281-12Figure 23. 1-Tone NSD vs. f OUT over Digital Scale, f DATA = 200 MSPS,4× Interpolation, f SC = 20 mA, PLL Off–158–159–160–161–162–163–164–165N S D (d B m /H z )–166050100150200250300350400450f OUT (MHz)08281-121Figure 24. 1-Tone NSD vs. f OUT over Interpolation Rate, Digital Scale = 0 dBFS,f SC = 20 mA, PLL On 161.0–165.5–165.0–164.5–164.0–163.5–163.0–162.5–162.0–161.5050100150200250300350400450N S D (d B m /H z )f OUT(MHz)08281-122Figure 25. 8-Tone NSD vs. f OUT over Interpolation Rate, Digital Scale = 0 dBFS,f SC = 20 mA, PLL Off–161.0–166.5–165.5–166.0–165.0–164.5–164.0–163.5–163.0–162.5–162.0–161.5050100150200250300350400450N S D (d B m /H z )fOUT (MHz)08281-123Figure 26. 8-Tone NSD vs. f OUT over Digital Scale, f DATA = 200 MSPS,4× Interpolation, f SC = 20 mA, PLL Off–160–161–162–163–164–165–166N S D (d B m /H z)050100150200250300350400450f OUT (MHz)08281-124Figure 27. 8-Tone NSD vs. f OUT over Interpolation Rate, Digital Scale = 0 dBFS,f SC = 20 mA, PLL OnAD9122–77–84–83–82–81–80–79–78A C L R (d B c )–050100150200250fOUT (MHz)50–55–60–65–70–75–80–85–900100200300400500A C L R (dB c )f OUT(MHz)08281-12508281-128Figure 28. 1-Carrier W-CDMA ACLR vs. f OUT over Digital Scale,Adjacent Channel, PLL Off–78–88–86–84–82–80–90A C L R (dB c )050100150200250fOUT (MHz)08281-126Figure 29. 1-Carrier W-CDMA ACLR vs. f OUT over f DAC ,Alternate Channel, PLL Off–70–90–85–80–75A C L R (dB c )–95050100150200250fOUT (MHz)08281-127Figure 30. 1-Carrier W-CDMA ACLR vs. f OUT over f DAC ,Second Alternate Channel, PLL Off Figure 31. 1-Carrier W-CDMA ACLR vs. f OUT , Adjacent Channel,PLL On vs. PLL Off–70–72–74–76–78–80–82–84–86–88–900100200300400500A C L R (dB c )f OUT(MHz)08281-129Figure 32. 1-Carrier W-CDMA ACLR vs. f OUT , Alternate Channel,PLL On vs. PLL Off–70–95–90–85–80–75A C L R (dB c)0100200300400500f OUT (MHz)08281-130Figure 33. 1-Carrier W-CDMA ACLR vs. f OUT , Second Alternate Channel,PLL On vs. PLL OffAD912208281-131START 133.06MHz #RES BW 30kHzVBW 30kHz STOP 166.94MHzSWEEP 143.6ms (601 PTS)START 125.88MHz #RES BW 30kHz VBW 30kHz STOP 174.42MHzSWEEP 206.9ms (601 PTS)TOTAL CARRIER POWER –11.19dBm/15.3600MHz RRC FILTER: OFF FILTER ALPHA 0.22REF CARRIER POWER –16.89dBm/3.84000MHzLOWER UPPER OFFSET FREQ INTEG BW dBc dBm dBc dBm 1–16.92dBm 5.000MHz 3.840MHz –65.88–82.76–67.52–84.40RMS RESULTS FREQ LOWER UPPER OFFSET REF BW dBc dBm dBc dBm CARRIER POWER 5.00MHz 3.840MHz –75.96–85.96–77.13–87.13–10.00dBm/10.00MHz 3.840MHz –85.33–95.33–85.24–95.253.840MHz15.00MHz2.888MHz–95.81–95.81–85.43–95.4308281-1322–16.89dBm 10.00MHz 3.840MHz –68.17–85.05–69.91–86.793–17.43dBm 15.00MHz 3.840MHz–70.42–87.31–71.40–88.284–17.64dBmFigure 35. 1-Carrier W-CDMA ACLR Performance, IF = ~150 MHzFigure 34. 4-Carrier W-CDMA ACLR Performance, IF = ~150 MHzAD9122 TERMINOLOGYIntegral Nonlinearity (INL)INL is defined as the maximum deviation of the actual analog output from the ideal output, determined by a straight line drawn from zero scale to full scale.Differential Nonlinearity (DNL)DNL is the measure of the variation in analog value, normalized to full scale, associated with a 1 LSB change in digital input code. Offset ErrorThe deviation of the output current from the ideal of zero is called offset error. For IOUT1P, 0 mA output is expected when the inputs are all 0s. For IOUT1N, 0 mA output is expected when all inputs are set to 1.Gain ErrorThe difference between the actual and ideal output span. The actual span is determined by the difference between the output when all inputs are set to 1 and the output when all inputs are set to 0.Output Compliance RangeThe range of allowable voltage at the output of a current output DAC. Operation beyond the maximum compliance limits can cause either output stage saturation or breakdown, resulting in nonlinear performance.Temperature DriftTemperature drift is specified as the maximum change from the ambient (25°C) value to the value at either T MIN or T MAX. For offset and gain drift, the drift is reported in ppm of full-scale range (FSR) per degree Celsius. For reference drift, the drift is reported in ppm per degree Celsius.Power Supply Rejection (PSR)The maximum change in the full-scale output as the supplies are varied from minimum to maximum specified voltages. Settling TimeThe time required for the output to reach and remain within a specified error band around its final value, measured fromthe start of the output transition.Spurious Free Dynamic Range (SFDR)The difference, in decibels, between the peak amplitude of the output signal and the peak spurious signal within the dc to the Nyquist frequency of the DAC. Typically, energy in this band is rejected by the interpolation filters. This specification, therefore, defines how well the interpolation filters work and the effect of other parasitic coupling paths to the DAC output.Signal-to-Noise Ratio (SNR)SNR is the ratio of the rms value of the measured output signal to the rms sum of all other spectral components below the Nyquist frequency, excluding the first six harmonics and dc. The value for SNR is expressed in decibels.Interpolation FilterIf the digital inputs to the DAC are sampled at a multiple rate of f DATA (interpolation rate), a digital filter can be constructed that has a sharp transition band near f DATA/2. Images that typically appear around f DAC (output data rate) can be greatly suppressed. Adjacent Channel Leakage Ratio (ACLR)The ratio in decibels relative to the carrier (dBc) between the measured power within a channel relative to its adjacent channel. Complex Image RejectionIn a traditional two-part upconversion, two images are created around the second IF frequency. These images have the effect of wasting transmitter power and system bandwidth. By placing the real part of a second complex modulator in series with the first complex modulator, either the upper or lower frequency image near the second IF can be rejected.。