J255_4F_87_____1_0104_21_MWB_lesen

“J”字头代码(SMD Marking Code)代码规格型号生产商封装备注J0 HSMS-2840 HP SOT23 schottky diodeJ01 SO2906R - - 2N2906J03 SO2907AR - - 2N2907AJ05 SO2907R - - 2N2907J1 HSMS-2841 HP SOT23 schottky diodeJ1 ZC830 Zet ZC820 varicapsJ1 BSS138L Mot SOT23 n-ch enh TMOS fetJ1A ZC830A Zet SOT23 varicap hyperabrupt 28V 10pF@2VJ1B ZC830B Zet SOT23 varicap hyperabrupt 28V 10pF@2VpJ1 BSH101 Phi SOT23 n-ch 60V 0.7A mosfet pJ2 BSH102 Phi SOT23 n-ch 30V 1A mosfetJ2 ZC833 Zet SOT23 ZC823J2A ZC833A Zet SOT23 varicap hyperabrupt 28V 33pF@2VJ2B ZC833B Zet SOT23 varicap hyperabrupt 28V 33pF@2VpJ3 BSH103 Phi SOT23 n-ch 30V 0.8A mosfet J3 ZC831 Zet SOT23 ZC821J3A ZC831A Zet SOT23 varicap hyperabrupt 28V 15pF@2VJ3B ZC831B Zet SOT23 varicap hyperabrupt 28V 15pF@2VJ3D MSB81T1 Mot - vhf pnp fT 0.6GHzJ4A MBV109 Mot SOT23 29pF VHF varicap diode J4 ZC832 Zet SOT23 ZC823J4A ZC832A Zet SOT23 varicap hyperabrupt 28V 22pF@2VJ4B ZC832B Zet SOT23 varicap hyperabrupt 28V 22pF@2VJ5 ZC834 Zet SOT23 ZC824J5A ZC834A Zet SOT23 varicap hyperabrupt 28V 47pF@2VJ5B ZC834B Zet SOT23 varicap hyperabrupt 28V 47pF@2VJ6 M1MA174 Mot - gp Si diode 100V J6 ZC835 Zet SOT23 ZC825J6A ZC835A Zet SOT23 varicap hyperabrupt 28V 68pF@2VJ6B ZC835B Zet SOT23 varicap hyperabrupt 28V 68pF@2VJ7 ZC836 Zet SOT23 ZC826J7A ZC830A Zet SOT23 varicap hyperabrupt 28V 100pF@2VJ7B ZC830B Zet SOT23 varicap hyperabrupt 28V 100pF@2VJ8 BCX71JR Phi SOT23R BCY79-ixJ9A ZC829A Zet SOT23 varicap hyperabrupt 28V 8.2pF@2VJ9B ZC829B Zet SOT23 varicap hyperabrupt 28V 8.2pF@2VJ12 SO2906AR - - 2N2906AJ32 SO5400R SGS - 2N5400J33 SO5401R SGS - 2N5401J39 SO692R SGS - pnp Vce 300VJA BAV74 Zet SOT23 dual diode cc 50V 0.1A JA BAV74 Mot SOT23 dual sw diodesJBs BAR74 Sie SOT23 fast sw diode 50V 0.25A JCs BAL74 Sie SOT23 fast sw diode 50V 0.25A JFs BAL99 Sie SOT23 fast sw diode 70V 0.25A JG BAR99 Sie - fast sw diode 70V 0.25AJKs BF1009 Sie SOT143 biased n-ch dg mosfet 1GHz 9VJLs BF1009S Sie SOT143 biased n-ch dg mosfet 1GHz 9VJL MRF949 Mot SOT323 npn RF fT 9GHzJPs BAS19 Sie SOT23 120V 250mA fast sw diodeJPs BAW101 Sie SOT143 pair isolated 300V sw diodesJRs BAS20 Sie SOT23 150V 250mA fast sw diodeJSs BAS21 Sie SOT143 200V 250mA fast sw diodeJS BAW100 Sie SOT143 dual isolated fast sw diodesJTs BAS28 Sie SOT143 dual isolated fast sw diodesJTs BAS28W Sie SOT343 dual isolated fast sw diodesJV BAS116 Sie SOT23 250V 75mA Ir 5nAJX BAV170 Mot SOT23 dual cc Si diode low IrJY BAV199 Mot SOT23 dual series Si diode low IrJZ BAW156 Mot SOT23 dual ca Si diode low Ir。

©A s s e m b l éo n 1Keeping Cost per placement under control using 01005 componentsJeroen de GrootMarketing Director Assembleon AsiaOctober 13th©A s s e m bl éo n 2Market of microchips (0201 and 01005 size)Cellular phone(Board of main body)0201Small video (DSC, DVC, etc.)©A s s e m b l éo n 3Migration of microchips to modules•Component distribution (source: Murata ):–Now: 70 % of microchips on main board (30 % in modules)–Future (3-5 years from now): 60% of microchips in modules•Reasons for this migration:–Difficult to solder both microchips and large IC ’s at same board –Less RF specific competence needed–Reduced investments at manufacturer of end-products•Less specific production equipment necessary (wire bonders, FC placers, etc.)–Shorter Time-to-market (TTM)•Off-the-shelf functionality–More flexibility in mobile phone design•Diversity based on modular architecture©A s s e m b l éo n 5Design•Traces may have to pass around the component. Stencil printing•Finer grain size of the solder particles in the solder paste •The risk of blocked stencil apertures and bridging•The need for using even thinner stencils ( down to 50 µm)Inspection•Visual inspection and willbecome more difficult and repair is not possibleChallenges for ‘01005’ componentsSource: Philips CFT –February 2003Component placement•Required placement accuracy better than 50 micron (3 sigma)•Special nozzle (with an extremely small nozzle diameter)•Placement force is critical (risk of component cracking)•High resolution vision camera •Positional accuracy of feeder and tape•Measuring / correcting pick-up position Soldering•Poor solder balling.©A s s e m b l éo n 6‘01005’ process challenges•‘01005’ chip size requires thinner stencils ( down to 50 µm ) and does not fit in existing reflow process for applications with mixed components. Extra process steps would be necessary and existing lines must be adapted accordingly.•‘01005’ components can be used in modules & System InPackage (SiP) applications where all the components are small •The available process window for lead free soldering of ‘01005’ is more critical. Due to higher temperatures the risk of flux evaporation is present.©A s s e m b l éo n 9Parallel principle of operation©A s s e m b l éo n 11Factors that influence efficiency•Workload ….•Scheduled downtime–Easy to maintain systems•Unscheduled downtime–Easy to repair/replace systems•Model change–Fast to changeover systems•New product introduction–First time right systems•General operator practice and behavior–Easy to use systems•Supporting processes (e.g. logistics)•...©A s s e m b l éo n 12Requirements –01005 process•Pick process–Feeder indexing accuracy–Auto pick correction at system level•Alignment process–Alignment unit resolution•Placement process–Placement accuracy•Placement force control©A s s e m b l éo n 13Much waste material !Much waste material !©A s s e m b l éo n 19Helping you to reduce PPM levels -1©A s s e m b l éo n 20Helping you to reduce PPM levels -2©A s s e m b l éo n 21Solder Paste Pattern AlignmentGenerally component follows solderpaste offsets in both X and Y direction©A s s e m b l éo n 22Use of pattern entities as fiducialsFigure of M. Nikeshina/Pre-developmentPM1PM2Artwork recognition5.45.8 5.65.053.63.453.83.83.43.13.322.962.62.652.832.42.32.322.162.242.02Interspacing (8×200μm150μm100μm80μm60μm884SMD / cm©A s s e m b l éo n 25Placement accuracy 75 micron©A s s e m b l éo n 26Placement accuracy 50 micron©A s s e m b l éo n 28Typical process failures©A s s e m b l éo n 29Placement force control•Static Component Break Strength–The static 0201 placement force should be lower than 3N. What ’s more, according to the Murata formula, 01005 component break strength is expected to be 43.56% compared with 0201 components . This also suggests that the 01005 “static ” placement force setting should be about 1.5N or less•Impact Force Control–The dynamic behavior of the placement action can also be the cause of chip damage. Therefore, preferably, the peak of the impact force should be lower than the static placement force setting.•Board support & Board Height control–For 0201/01005 placement, it is important to control the placement impact and force, being independent from either board support system (elasticity of the placement point) or board height.settingF =©A s s e m b l éo n 32。

Heat Responsive Device (Controlled Closure):
ERL (Electric Resettable Link) is standard on dampers with electric actuators: 250°F (121°C) standard. 165°F (74°C), 212°F (100°C) and 350°F (177°C) available.
Velocity/ Pressure Rating
Elevated Temp.
°F
Minimum Single Section Vertical / Horizontal
Maximum Single Section Vertical / Horizontal
24
250/350 8" x 8" (203 x 203). 24" x 24" (610 x 610)

Model 1271G combination fire/smoke damper is specifically designed for supply or return ducts that terminate at a grille. The special factory sleeve with unique 3/4” (19) grille mounting flanges simplifies installation, saves on field labor and eliminates the requirements for unsightly front retaining angles which commonly protrude from behind the grill. Steel grille with correctly located countersunk screw holes is available from Nailor and installs over and completely hides the mounting flanges. The damper is offset in the sleeve to accommodate a single or double deflection supply air grille, single deflection supply air register or a return air grille or register.

General DescriptionThe MAX14778 evaluation kit (EV kit) provides a proven design to evaluate the MAX14778 dual Q 25V above- and below-the-rails 4:1 analog multiplexer. The EV kit oper-ates from a single +3V to +5.5V supply and supports analog signals between -25V and +25V.The EV kit PCB comes with a MAX14778ETP+ installed. Contact the factory for free samples.FeaturesS +3V to +5.5V Input Supply Range S Dual 4:1 MuxS Independent Mux Control S Q 25V Voltage Signal Input Range S Proven PCB LayoutS Fully Assembled and TestedDESIGNATIO N QTY DESCRIPTIONA0–A3, ACOM, B0–B3, BCOM,VDD11Small red test pointsC111F F Q 10%, 16V X5R ceramic capacitor (0603)TDK C1608X5R1C105K C2, C320.1F F Q 10%, 50V X5R ceramic capacitors (0603)TDK C1608X5R1H104K C4, C50Not installed, ceramic capacitors (0603)DESIGNATIONQTY DESCRIPTIONGND 4Black test points JU1–JU663-pin headersR1, R20Not installed, resistors (2512)U11Dual Q 25V 4:1 analog multiplexer (20 TQFN-EP*)Maxim MAX14778ETP+—6Shunts—1PCB: MAX14778 EVALUATION KITSUPPLIERPHONE WEBSITETDK Corp.847-803-6100MAX14778 Evaluation KitEvaluates: MAX14778Component ListComponent Supplier19-6283; Rev 0; 4/12Ordering Information appears at end of data sheet.*EP = Exposed pad.Note: Indicate that you are using the MAX14778 when contacting this component supplier.JUMPERSHUNTPOSITIONDESCRIPTIONJU11-2MUX B enabled 2-3*MUX B disabledJU21-2B_ connects to BCOM (Table 3) 2-3*JU31-2B_ connects to BCOM (Table 3) 2-3*JU41-2MUX A enabled 2-3*MUX A disabledJU51-2A_ connects to ACOM (Table 2) 2-3*JU61-2A_ connects to ACOM (Table 2) 2-3*Quick StartRequired Equipment• MAX14778 EV kit• +5V, 100mA power supply• +25V, 800mA power supply• Two voltmetersProcedure The EV kit is fully assembled and tested. Follow the steps below to verify board operation:1) Verify that all jumpers (J U1–J U6) are in their defaultposition, as shown in Table 1.2) Connect the +5V supply positive and ground termi-nals to the VCC and GND test points, respectively. 3) Connect the +25V supply positive and ground termi-nals to the A0 and GND test points, respectively.4) Connect the +25V supply positive and ground termi-nals to the B0 and GND test points, respectively.5) Connect a voltmeter at the ACOM and GND testpoints.6) Connect a voltmeter at the BCOM and GND testpoints.7) Enable the +5V supply.8) Enable the +25V supply.9) Place shunts on pins 1-2 on jumpers JU1 and JU4.10) Verify that both voltmeters display +25V.Detailed Description of Hardware The MAX14778 EV kit is a fully assembled and tested circuit board that simplifies evaluation of the MAX14778 dual Q25V above- and below-the-rails 4:1 analog multi-plexer. The EV kit operates from a single +3V to +5.5V input voltage range.The IC integrates bias circuitry to provide a Q25V analog voltage range with a single +3V to +5.5V supply. This extended input range allows multiplexing different communications signals such as RS-232, RS-485, audio, and USB 1.1 onto the same connector. The IC features 1.5I (max) on-resistance for analog signals between -25V and +25V.J umpers J U4 and J U1 are available for controlling the turn-on/off of MUX A and MUX B, respectively. Jumpers JU2, JU3, JU5, and JU6 are available for routing the B_ and A_ input signals to the corresponding BCOM and ACOM outputs, respectively. Inputs A_ and B_ can pass up to Q300mA of continuous current. The current flow through the multiplexers can be bidirectional, allow i ng operation as either a multiplexer or a demultiplexer.The EV kit provides PCB pads in addition to red test points for monitoring the multiplexer input and output sig-nals. The EV kit is also populated with 2515 resistor PCB pads and 0603 capacitor PCB pads for load-specific applications at the ACOM and BCOM connectors.User-Supplied Power Supply The EV kit is powered from a +3V to +5.5V power sup-ply connected at the VCC and GND test points. The EV kit circuit inputs (A_, B_, ACO, and BCOM) can transmit signals of up to Q25V.Multiplexer Configuration J umpers J U4, J U5, and J U6 control the operation for MUX A. JU4 enables/disables the ACOM output and JU5 and JU6 control the signal routing to ACOM. See Table 2 for proper jumper settings for operating MUX A.J umpers J U1, J U2, and J U3 control the operation for MUX B. JU1 enables/disables the BCOM output and JU2 and JU3 control the signal routing to BCOM. See Table 3 for proper jumper settings for operating MUX B.Table 1. Jumper Descriptions (JU1–JU6) *Default position.SHUNT POSITION ACOMCONNECTED TO JU4 (ENA)JU5 (SA1)JU6 (SA0)1-22-32-3A01-22-31-2A11-21-22-3A21-21-21-2A32-3X X Switch is openSHUNT POSITION BCOMCONNECTED TO JU1 (ENB)JU2 (SB1)JU3 (SB0)1-22-32-3B01-22-31-2B11-21-22-3B21-21-21-2B32-3X X Switch is openTable 2. MUX A Routing Configuration (JU4, JU5, JU6)Table 3. MUX B Routing Configuration (JU1, JU2, JU3)X = Don’t care.X = Don’t care.Figure 1. MAX14778 EV Kit SchematicFigure 2. MAX14778 EV Kit Component Placement Guide—Component SideFigure 3. MAX14778 EV Kit Component PCB Layout—Component SideFigure 4. MAX14778 EV Kit PCB Layout—Solder SideFigure 5. MAX14778 EV Kit Component Placement—Solder SideOrdering InformationPART TYPEMAX14778EVKIT#EV Kit#Denotes RoHS compliant.REVISION NUMBER REVISIONDATEDESCRIPTIONPAGESCHANGED04/12Initial release—Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.Revision History。