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Touch Panel設計簡介一.TP種類及應用簡介二.RTP設計簡介三.FIP設計簡介四.ATT設計簡介六.RFQ 需求資料目錄五.各結構比較1.TP應用領域公共場所:銀行ATM,圖書館檢索系統,車站自動售票機汽車用:衛星導航儀民生用:手機,PDA,筆計本電腦,數位相機工廠自動化:人機介面2.TP按其原理分類如下電阻式:偵測觸碰點電壓變化電容式:偵測觸碰點電容變化近場感應式：偵測觸碰點電(磁)場變化超音波式：超音波矩陣遮斷紅外線式：光矩陣遮斷X G T 技術：複合電阻與電容式3. ~~~TP 種類Resistive Touch Panel (RTP)Field Induce Pad (FIP)Advanced Touch Technology (ATT)Wintek 專有名詞Capacitive Touch Panel (CTP)Apple 專有名詞=Wintek 專有名詞1.RTP結構介紹1.RTP 結構介紹a.F/G(ITO Film/ITO Glass)V/AIT O Gla s s ITO FilmDCT a =0.15ABCDEF XLXRYUYD各層厚度:ITO Film 0.188/0.125DCT 0.06Insulation layer+銀電極0.04ITO Glass 0.5/0.71.RTP 結構介紹b. D/F/G (Decoration FILM/ITO Film/ITO Glass)1.RTP結構介紹c. D/F/F (Decoration FILM/Up ITO Film/Down ITO Film)Deco film OCA ITO film DCTITO film OCAPC substrateFPC 各層厚度:Deco Film: 0.188/0.125 OCA(PSA): 0.05UP ITO Film 0.18/0.125 OCA 0.025 Down ITO Film 0.18/0.125Lens: 0.7~1.22.RTP 設計注意事項“A”LensDeco filmaLensbUV“A”防水膠二.RTP設計簡介 1.MRTP結構介紹a. MRTP走線+=ITO FilmITO GlassAssemblyM-RTP 有兩種Type: F/G and G/G F/G Type: ITO Film(0.188) +DCT(0.06)+ITO Glass(0.7~1.5) G/G Type: ITO Glass + 框膠(0.2)+ITO Glass, 需設計密封口(10*0.8),置於FPC對過的玻璃邊上二.RTP設計簡介 1.MRTP結構介紹b. F/F &G/G結構F/G TypeITO Film 絕緣層 FPC Cu 0.5 FPCITO Glass0.3 0.30.5G/G Type0.1 UP ITO Glass 0.3min FPC Cu FPC0.3 Down ITO Glass三.FIP設計簡介 1.結構介紹a. G/GLens INK ASF OCA Sensor透明孔 IR孔材料搭配: Lens 0.7~1.1 Ink 0.009max ASF 0.075 OCA 0.125,0.175,0.2.. Sensor 0.4,0.5HTCLOGOIC三.FIP設計簡介 1.結構介紹b. G/F/FPET Film材料搭配: Lens 0.7~1.1 Ink 0.009max OCA 0.05 Up ITO Film 0.125/0.18 OCA 0.05 Down TIO Film 0.125/0.18 ……HTCICiii三.FIP設計簡介 1.結構介紹b. G/F/FFlex LensPET PSA Down ITO Film PSA Up ITO FilmPSAPETPSA三.FIP設計簡介 1.結構介紹b. G/F/FItem Film / Film Film / Film Double side ITOCover LensBM BM BMCover LensMetal Y-ITOCover LensPSABM BM Metal Y-ITOStructureITO FilmPSAAg Ag Y-ITO Ag Ag ITO FilmPSABMPET FilmAg X-ITOPET FilmX-ITOPET FilmX-ITO X-ITOPSAPSAPSAX-ITOITO FilmX-ITOAg ITO FilmPET FilmPET FilmPET FilmMetal trace process Trace Pitch (Line width/Line space) Thickness (Lens 0.7mm) StatusScreen printingPhotolithographyPhotolithography100um/100um50um/50um30um/30um1.025mm Mass production1.025mm Mass production1.0mm Sample (2010 Q3)三.FIP設計簡介 2.FIP設計注意事項a. Sensor A/A與 Lens INK Open關係INK OPENLCD A/A Sensor A/ALCD A/A +1.0 = INK Open INK Open +1.0 = Sensor A/A三.FIP設計簡介 2.FIP設計注意事項b. Sensor 與 Lens搭配SensorNotes: 1.a=0.35min 2.Sensor四角不可倒R角 3.如Border需求,可設計倒C角aHTCC角三.FIP設計簡介 2.FIP設計注意事項c. 何時設計Shield pad 目的:降低LCD Noise干擾X Y PattenITO GlassShield layer GapLCMFlex shield pad三.FIP設計簡介 2.FIP設計注意事項d. Lens 設計注意事項A BA>=1.2 B>=2C 0.15INK Thickness 9um max技術參數: DOL CS 油墨附住性 穿透率 硬度 油墨厚度 Ball Drope. PSA 設計注意事項2.FIP 設計注意事項PSA1.PSA需完全覆蓋Trace走線2.PSA OD內縮Sensor 單邊0.33.需設計對位mark4.需預留重離型膜尺寸a= 7mm5.PSA常用厚度0.175a技術參數:透光率霧度(HAZE)剝離力上下離型膜離型力f. Sensor border 評估2.FIP 設計注意事項Trace with 0.03Trace pitch 0.06a 線離邊0.8b 至A/A 1.0mini. Same sideab16 x 8c左border0.8+0.1+8*0.06 +0.3=1.68下border1.8+0.5+(8+7+1)*0.06 +0.3=2.56ESD Ring2.FIP設計注意事項f. Sensor border評估ii. Both side2.FIP設計注意事項f. Sensor border評估雙側上下對分iii.3.FIP G/G Flow Chartcleaning and inspection UV glue Coating CuringACF AttachmentACF Attachment 2lens &Sensor Glass assembly CGFlex BondingFlex Bonding 2Appearance Inspection OCA AttachmentLabel Printing FI UV glue curingAutoclaveGasket Attachment Protective film AttachmentFinal appearance inspection對位本壓QC AppearanceInspectionPackagingBonding TestFinal Test。
学习报告接触TP这个行业，那么对于TP相关术语就要有所了解，以下为TP一些相关术语：英文简称英文全称中文含义TP touch panel 触摸屏RTP resistive touch panel 电阻式触摸屏CTP capacitive touch panel 电容式触摸屏AA active area 可操作区域VA/(INK OPENING) view area 可视区域（VA 区域尺寸小于AA 区域）BM AA 区外围边框区，面板黑框区ITO indium Tin oxide 氧化铟锡ATO Antmony Tin oxide 氧化锑锡FPC(B) flexible print circuit (board) 柔性印刷线路板IC integrated circuit 集成电路GFF glass-film-filmG1F glass-filmGG glass-glassG2 (OGS) one glass solution 一体化触控PET Polyester 聚脂薄膜PC Polyester 聚碳酸酯耐力板TOL touch on lens 单层电容式触控于保护玻璃上CG(CL) cover glass (cover lens) 盖板玻璃TG tempered glass 强化玻璃OCA optically clear adhesive 光学透明胶LOCA liquid optically clear adhensive液态光学透明胶（水胶）用在G+G中间ACF anisotropic conductive film 导电热熔胶ESD electro-static discharge 抗静电OC over coat 保护膜PSA pressure sensitive adhesive 压敏胶IR infrared ray 红外UV ultraviolet ray 紫外PRC Photorisist coating 光阻涂层CP cooling pump冷却泵AR anti reflective反射AG anti glare防炫AS anti stain 防污COB chip on board 通过绑定将IC裸片固定于印刷电路版上COF chip on FPC 将IC固定于柔性线路板上COG chip on glass 将IC固定于玻璃上TAB tape automated bonding 卷带自动结合TCP thermo compression bonding 热压结合PF2 保护膜。
触摸屏tp的工艺流程The touch screen TP (touch panel) manufacturing process involves several key steps, from design and material selection to production and testing. The process typically begins with the selection of the appropriate touch technology, such as resistive, capacitive, or infrared, based on the specific requirements of the application. Once the technology is chosen, the design and material selection phase begins, where the touch panel's layout, size, and materials are determined. This phase is crucial as it directly impacts the performance and functionality of the final product.After the design and material selection phase, the manufacturing process moves on to the production of the touch panel. This involves several key steps, including the deposition of conductive materials, the application of protective coatings, and the assembly of the touch panel components. Each step in the production process requires precision and attention to detail to ensure the quality andreliability of the final product. For example, the deposition of conductive materials must be done with precision to ensure proper touch sensitivity and accuracy.Following the production phase, the touch panel undergoes testing to ensure that it meets the required performance and quality standards. This typically involves a series of tests to evaluate the touch sensitivity, accuracy, durability, and overall performance of the touch panel. Any issues or defects identified during testing are addressed and corrected before the touch panel is deemed ready for use.In addition to the manufacturing process, the touch panel industry also places a strong emphasis on research and development to continually improve touch panel technology. This involves ongoing research into new materials, manufacturing techniques, and touch technologies to enhance the performance, functionality, and durability of touch panels. This commitment to innovation and improvement is essential to meet the evolving needs of the market and maintain a competitive edge in the industry.From a business perspective, the touch panel manufacturing process also involves considerations such as cost management, supply chain logistics, and quality control. These factors are crucial to ensuring the profitability and success of touch panel production. Effective cost management involves optimizing production processes, minimizing waste, and sourcing materials and components at competitive prices. Supply chain logistics play a key role in ensuring the timely delivery of materials and components to support production schedules. Quality control measures are essential to maintaining the high standards of touch panel performance and reliability.From a consumer perspective, the touch panel manufacturing process directly impacts the quality and performance of the devices that incorporate touch panels, such as smartphones, tablets, and other electronic devices. Consumers rely on touch panels to provide intuitive and responsive touch input, and the manufacturing process plays a critical role in delivering a positive user experience. A well-executed manufacturing process results in touch panelsthat are durable, accurate, and reliable, meeting the expectations and demands of consumers.In conclusion, the touch panel manufacturing process is a complex and multifaceted endeavor that involves design, material selection, production, testing, research and development, business considerations, and consumer expectations. Each step in the process is essential to delivering touch panels that meet the highest standards of quality, performance, and reliability. The ongoing commitment to innovation and improvement in touch panel technology ensures that the industry continues to evolve and meet the changing needs of the market and consumers.。
