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MRF6VP2600HR5;MRF6VP2600HR6;中文规格书,Datasheet资料

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RF Power Field Effect TransistorN--Channel Enhancement--Mode Lateral MOSFETDesigned primarily for wideband applications with frequencies up to 500MHz.Device is unmatched and is suitable for use in broadcast applications.•Typical DVB--T OFDM Performance:V DD =50Volts,I DQ =2600mA,P out =125Watts Avg.,f =225MHz,Channel Bandwidth =7.61MHz,Input Signal PAR =9.3dB @0.01%Probability on CCDF.Power Gain —25dB Drain Efficiency —28.5%ACPR @4MHz Offset —--61dBc @4kHz Bandwidth •Typical Pulsed Performance:V DD =50Volts,I DQ =2600mA,P out =600Watts Peak,f =225MHz,Pulse Width =100μsec,Duty Cycle =20%Power Gain —25.3dB Drain Efficiency —59%•Capable of Handling 10:1VSWR,@50Vdc,225MHz,600Watts Peak Power,Pulse Width =100μsec,Duty Cycle =20%Features•Characterized with Series Equivalent Large--Signal Impedance Parameters •CW Operation Capability with Adequate Cooling •Qualified Up to a Maximum of 50V DD Operation •Integrated ESD Protection•Designed for Push--Pull Operation•Greater Negative Gate--Source Voltage Range for Improved Class C Operation•RoHS Compliant•In Tape and Reel.R6Suffix =150Units per 56mm,13inch Reel.Table 1.Maximum RatingsRatingSymbol Value Unit Drain--Source Voltage V DSS --0.5,+110Vdc Gate--Source Voltage V GS --6.0,+10Vdc Storage Temperature Range T stg --65to +150°C Case Operating Temperature T C 150°C Operating Junction Temperature (1,2)T J225°CTable 2.Thermal CharacteristicsCharacteristicSymbol Value (2,3)Unit Thermal Resistance,Junction to CaseCase Temperature 99°C,125W CW,225MHz,50Vdc,I DQ =2600mA Case Temperature 64°C,610W CW,352.2MHz,50Vdc,I DQ =150mA Case Temperature 81°C,610W CW,88--108MHz,50Vdc,I DQ =150mAR θJC0.200.140.16°C/W1.Continuous use at maximum temperature will affect MTTF.2.MTTF calculator available at /rf.Select Software &Tools/Development Tools/Calculators to access MTTF calculators by product.3.Refer to AN1955,Thermal Measurement Methodology of RF Power Amplifiers.Go to /rf.Document Number:MRF6VP2600HRev.5.1,7/2010Freescale Semiconductor Technical DataMRF6VP2600HR62--500MHz,600W,50V LATERAL N--CHANNELBROADBAND RF POWER MOSFETMRF6VP2600HR6Table 3.ESD Protection CharacteristicsTest MethodologyClass Human Body Model (per JESD22--A114)2(Minimum)Machine Model (per EIA/JESD22--A115)A (Minimum)Charge Device Model (per JESD22--C101)IV (Minimum)Table 4.Electrical Characteristics (T A =25°C unless otherwise noted)CharacteristicSymbolMinTypMaxUnitOff Characteristics (1)Gate--Source Leakage Current (V GS =5Vdc,V DS =0Vdc)I GSS ——10μAdc Drain--Source Breakdown Voltage (I D =150mA,V GS =0Vdc)V (BR)DSS 110——Vdc Zero Gate Voltage Drain Leakage Current (V DS =50Vdc,V GS =0Vdc)I DSS ——50μAdc Zero Gate Voltage Drain Leakage Current (V DS =100Vdc,V GS =0Vdc)I DSS——2.5mAOn CharacteristicsGate Threshold Voltage (1)(V DS =10Vdc,I D =800μAdc)V GS(th)1 1.653Vdc Gate Quiescent Voltage (2)(V DD =50Vdc,I D =2600mAdc,Measured in Functional Test)V GS(Q) 1.5 2.7 3.5Vdc Drain--Source On--Voltage (1)(V GS =10Vdc,I D =2Adc)V DS(on)—0.25—VdcDynamic Characteristics (1)Reverse Transfer Capacitance(V DS =50Vdc ±30mV(rms)ac @1MHz,V GS =0Vdc)C rss — 1.7—pF Output Capacitance(V DS =50Vdc ±30mV(rms)ac @1MHz,V GS =0Vdc)C oss —101—pF Input Capacitance(V DS =50Vdc,V GS =0Vdc ±30mV(rms)ac @1MHz)C iss—287—pFFunctional Tests (2)(In Freescale Test Fixture,50ohm system)V DD =50Vdc,I DQ =2600mA,P out =125W Avg.,f =225MHz,DVB--T OFDM Single Channel.ACPR measured in 7.61MHz Channel Bandwidth @±4MHz Offset.Power Gain G ps 242527dB Drain EfficiencyηD 2728.5—%Adjacent Channel Power Ratio ACPR —--61--59dBc Input Return Loss IRL —--18--9dB Typical Performance —352.2MHz (In Freescale 352.2MHz Test Fixture,50ohm system)V DD =50Vdc,I DQ =150mA,P out =600W CWPower Gain G ps —22—dB Drain Efficiency ηD —68—%Input Return LossIRL—--15—dBTypical Performance —88--108MHz (In Freescale 88--108MHz Test Fixture,50ohm system)V DD =50Vdc,I DQ =150mA,P out =600WCWPower Gain G ps —24.5—dB Drain Efficiency ηD —74—%Input Return LossIRL—--5—dB1.Each side of device measured separately.2.Measurement made with device in push--pull configuration.MRF6VP2600HR6Figure 2.MRF6VP2600HR6Test Circuit SchematicZ13,Z140.224″x 0.253″Microstrip Z15*,Z16*0.095″x 0.253″Microstrip Z17,Z180.052″x 0.253″Microstrip Z190.053″x 0.080″Microstrip Z20 1.062″x 0.080″MicrostripPCBArlon CuClad 250GX--0300--55--22,0.030″,εr =2.55*Line length includes microstrip bendsZ1 1.049″x 0.080″Microstrip Z2*0.143″x 0.080″Microstrip Z3*0.188″x 0.080″Microstrip Z40.192″x 0.133″Microstrip Z5,Z60.418″x 0.193″Microstrip Z7,Z80.217″x 0.518″Microstrip Z9,Z100.200″x 0.518″Microstrip Z11,Z120.375″x 0.214″MicrostripTable 5.MRF6VP2600HR6Test Circuit Component Designations and ValuesPartDescriptionPart NumberManufacturer B195Ω,100MHz Long Ferrite Bead 2743021447Fair--Rite C147pF Chip Capacitor ATC100B470JT500XT ATC C2,C443pF Chip Capacitors ATC100B430JT500XT ATC C3100pF Chip Capacitor ATC100B101JT500XT ATC C510pF Chip Capacitor ATC100B7R5CT500XT ATC C6,C9 2.2μF,50V Chip Capacitors C1825C225J5RAC Kemet C7,C13,C2010K pF Chip Capacitors ATC200B103KT50XT ATC C8220nF,50V Chip Capacitor C1812C224J5RAC Kemet C10,C17,C181000pF Chip Capacitors ATC100B102JT50XT ATC C11,C220.1μF,50V Chip Capacitors CDR33BX104AKYS Kemet C12,C2120K pF Chip Capacitors ATC200B203KT50XT ATC C1410μF,35V Tantalum Capacitor T491D106K035AT Kemet C1522μF,35V Tantalum Capacitor T491X226K035AT Kemet C1647μF,50V Electrolytic Capacitor 476KXM050M Illinois Cap C192.2μF,Chip Capacitor2225X7R225KT3AB ATC C23,C24,C25470μF 63V Electrolytic Capacitors MCGPR63V477M13X26--RH MulticompJ1,J2Jumpers from PCB to T1&T2Copper Foil L117.5nH,6Turn InductorB06T CoilCraftL28Turn,#20AWG ID =0.125″Inductor,Hand Wound Copper Wire L382nH,Inductor1812SMS--82NJ CoilCraft L4*9Turn,#18AWG Inductor,Hand Wound Copper Wire R120Ω,3W Axial Leaded Resistor 5093NW20R00J VishayT1Balun TUI--9Comm Concepts T2BalunTUO--4Comm Concepts *L4is wrapped around R1.MRF6VP2600HR6Figure3.MRF6VP2600HR6Test Circuit Component Layout*L4is wrapped around R1.MRF6VP2600HR6TYPICAL CHARACTERISTICS50110002010V DS ,DRAIN--SOURCE VOLTAGE (VOLTS)Figure 4.Capacitance versus Drain--Source VoltageC ,C A P A C I T A N C E (p F )301001040110011010V DS ,DRAIN--SOURCE VOLTAGE (VOLTS)Figure 5.DC Safe Operating AreaI D ,D R A I N C U R R E N T (A M P S )100G p s ,P O W E R G A I N (d B )212602524P out ,OUTPUT POWER (WATTS)PULSEDFigure 8.Pulsed Power Gain versusOutput Power G p s ,P O W E R G A I N (d B )10023600700Figure 9.Pulsed Power Gain and Drain Efficiencyversus Output PowerP out ,OUTPUT POWER (WATTS)PULSED10100100022200300400500D ,Note:Each side of device measured separately.Note:Each side of device measured separately.MRF6VP2600HR6TYPICAL CHARACTERISTICS —TWO--TONEFigure 10.Intermodulation Distortion Products versus Output Power--70--2010P out ,OUTPUT POWER (WATTS)PEP--30--40--50100700I M D ,I N T E R M O D U L A T I O N D I S T O R T I O N (d B c )--605Figure 11.Intermodulation Distortion Products versus Tone Spacing10--100.1TWO--TONE SPACING (MHz)--30--40--50140I M D ,I N T E R M O D U L A T I O N D I S T O R T I O N (d B c )Figure 12.Two--Tone Power Gain versus Output Power 23.52620P out ,OUTPUT POWER (WATTS)PEP25.524100700G p s ,P O W E R G A I N (d B )2524.5Figure 13.Third Order IntermodulationDistortion versus Output PowerP out ,OUTPUT POWER (WATTS)PEP100--25--30--40--45--50I N T E R M O D U L A T I O N D I S T O R T I O N (d B c )I M D ,T H I R D O R D E R --2070020--60--20--35MRF6VP2600HR6TYPICAL CHARACTERISTICS —OFDMP R O B A B I L I T Y (%)25.825.6G p s ,P O W E R G A I N (d B )25.425.22524.824.424.224.6Figure 18.Single--Carrier DVB--T OFDM ACPR PowerGain and Drain Efficiency versus Output PowerP out ,OUTPUT POWER (WATTS)AVG.30ηD 400100MRF6VP2600HR6TYPICAL CHARACTERISTICS250 10990T J,JUNCTION TEMPERATURE(°C)Figure19.MTTF versus Junction Temperature--CW This above graph displays calculated MTTF in hours when the deviceis operated at V DD=50Vdc,P out=125W Avg.,andηD=28.5%.MTTF calculator available at /rf.SelectSoftware&Tools/Development Tools/Calculators to access MTTFcalculators by product.107106105110130150170190MTTF(HOURS)210230 108MRF6VP2600HR6Z o =10ΩZ loadZ sourcef =225MHzf =225MHzV DD =50Vdc,I DQ =2600mA,P out =125W Avg.f MHz Z sourceΩZ load Ω2251.42+j8.094.45+j1.16Z source =Test circuit impedance as measured fromgate to gate,balancedconfiguration.Z load=Test circuit impedance as measured from drain to drain,balanced configuration.Figure 20.Series Equivalent Source and Load ImpedanceZ sourceZloadOutput Matching NetworkMRF6VP2600HR6Figure 21.MRF6VP2600HR6Test Circuit Component Layout —88--108MHzTable 6.MRF6VP2600HR6Test Circuit Component Designations and Values —88--108MHzPartDescriptionPart NumberManufacturer B195Ω,100MHz Long Ferrite Bead 2743021447Fair--Rite C1 6.8μF,50V Chip Capacitor C4532X7R1H685K TDK C230pF Chip Capacitor ATC100B300JT500XT ATC C3,C13,C141000pF Chip Capacitors ATC100B102JT50XT ATC C4,C5,C61μF,100V Chip Capacitors GRM31CR72A105KA01L Murata C7,C8,C9,C10,C11,C123900pF Chip Capacitors ATC700B392JT50X ATC C15 4.7μF,100V Chip Capacitor GRM55ER72A475KA01B Murata C16,C17470μF,63V Electrolytic Capacitors MCGPR63V477M13X26--RH Multicomp C18220μF,100V Electrolytic Capacitor MCGPR100V227M16X26--RHMulticompJ1Jumper with Copper Tape L182nH Inductor1812SMS--82NJ CoilCraft L28Turn,#14AWG ID=0.250″Inductor,Hand Wound Copper Wire Freescale L3,L48nH InductorsA03TKLCCoilCraft R115Ω,1/4W Chip Resistor CRCW120615R0FKEA VishayT1Balun TransformerTUI--LF--9Comm Concepts Coax1,Coax225Ω,Semi Rigid RF Cable,3mm Line,16cm Length UT--141C--25Micro--Coax Coax325Ω,Semi Rigid RF Cable,3mm Line,15cm Length UT--141C--25Micro--Coax PCB0.030″,εr =2.55GX0300--55--22Arlon分销商库存信息:FREESCALEMRF6VP2600HR5MRF6VP2600HR6。

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Bosch LTC 2600 Series 视频多路复用器说明书

Bosch LTC 2600 Series 视频多路复用器说明书

Instruction ManualEN Video MultiplexersTable of ContentsImportant Safeguards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 FCC & ICES Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 1.1Guide to This Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 2UNPACKING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3SERVICE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 4UNDERSTANDING VIDEO MULTIPLEXERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 5INSTALLING THE VIDEO MULTIPLEXER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 5.1Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 5.2Connecting the Video Multiplexer System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 5.3Guide to the Multiplexer Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 6PROGRAMMING – QUICK SETUP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 6.1Using QUICK SETUP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 7PROGRAMMING – ADV ANCED SETUP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 7.1Using ADV ANCED SETUP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 8SYSTEM4PROGRAMMING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 8.1System4 Advanced Setup: VCR Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 8.2System4 Advanced Setup: Action Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 8.3System4 Advanced Setup: Alarm Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 8.4System4 Advanced Setup: Configure Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 8.5System4 Advanced Setup: Camera Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 8.6System4 Advanced Setup: PC Printer Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 8.7System4 Advanced Setup: Log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 8.8System4 Advanced Setup: Password . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 8.9System4 Advanced Setup: Expand System Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 8.10System4 Advanced Setup: Remote System4 Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 9OPERATING THE LTC 2600 SERIES VIDEO MULTIPLEXER . . . . . . . . . . . . . . . . . . . . . .33 9.1Live Display Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 9.2Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 9.3Playback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 9.4Combined Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 9.5Security Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 9.6VCR T est Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 10SYSTEM4ENHANCED OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 10.1 System4 Special Operating Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 10.2 System Keyboards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Appendix A: FEATURES AND SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Appendix B: SPECIAL APPLICATIONS/SYSTEM CONFIGURATIONS . . . . . . . . . . . . . . . . . . . . .41 Appendix C: FACTORY DEFAULT SETTINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Appendix D: PROGRAMMING REFERENCE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Appendix E: QUICK FUNCTION KEYS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Appendix F: ACCESSORY CABLES FOR THE LTC 2600 SERIES MULTIPLEXERS . . . . . . . . . . .594UNDERSTANDING VIDEOMULTIPLEXERSThe LTC 2600 Series Video Multiplexers are designed to control multichannel recording and playback with the added capability of multiscreen viewing. The units allow monitoring of multiple camera sites without the need for multiple monitors and VCRs. They can be programmed easily via front panel control keys and on-screen display menus.Video multiplexers are available in the following main categories:•Standard Models provide high qualitymultiplexing. They are designed to be plug-and-play, therefore simplifying installation.•System4 T riplex Models provide a variety of advanced system features such as control viaremote keypad, PC control, system cameracontrol (i.e. Pan/Tilt/Zoom control forcontrollable cameras), as well as enhancedmultiplexing (e.g. two multiscreen outputs andtwo VCRs to increase recording speed).Each type of multiplexer may operate in one of the following modes:•Simplex Models allow live multiscreen monitor viewing or playback or VCR recording.•Duplex Models allow live multiscreen monitor viewing or playback and at the same timerecord all video.•T riplex Models allow live multiscreen monitor viewing and playback and at the same timerecord all video.T o identify your specific LTC 2600 Series Video Multiplexer model, refer to the following chart which also provides basic operating specifications:Model No.Mode Rated Voltage Voltage Range Power 6-channel: Color L TC 2622/90Duplex120/230 VAC, 50/60 Hz108 to 25330 W 9-channel: Monochrome L TC 2632/90Duplex120/230 VAC, 50/60 Hz108 to 25330 W 9-channel: Universal L TC 2642/90Duplex120/230 VAC, 50/60 Hz108 to 25330 W 9-channel: System4 L TC 2672/90Triplex120/230 VAC, 50/60 Hz108 to 25330 W 16-channel: Monochrome L TC 2652/90Duplex120/230 VAC, 50/60 Hz108 to 25330 W 16-channel: Universal L TC 2661/90Simplex120/230 VAC, 50/60 Hz108 to 25330 W 16-channel: Universal L TC 2662/90Duplex120/230 VAC, 50/60 Hz108 to 25330 W 16-channel: System4 L TC 2682/90Triplex120/230 VAC, 50/60 Hz108 to 25330 W5INSTALLING THE VIDEO MULTIPLEXER5.1MountingThe multiplexer is supplied as a desktop unit. If desired, the unit may be mounted via using the included rack mount kit.5.2Connecting the Video MultiplexerSystem1.Refer to FIGURES5A, 5B, and/or 5C fordetails on the input/output connections suppliedby the multiplexer. (Be sure to reference theappropriate drawing for your multiplexermodel.)2.Review the typical installation diagramsprovided in APPENDIX B at the back of themanual, and determine the number of cameras,monitors, and VCRs to be incorporated into thesystem.Use the following keys for VCR functions:VCR Function Press KeyRECORD REC/SETPLAYBACK PLAY/SHOTSTOP ZOOMPAUSE FREEZEFAST FORWARD CAMEO/>FAST REWIND FULL/<Allplex+ SELECT: T o switch control to another multiplexer.Allplex+ ALT: T o Enter and Exit the keyboard TEST mode.Pan/Tilt Control: For Pan/Tilt controllable units, operation of the joystick (LTC 2602) or four directional keys (LTC 2601) will make the selected camera tilt up or down, pan left or right, or move diagonally.Lens Control: The joystick of the LTC 2602 keyboard is used to provide zoom control by rotating the knob in either a clockwise or counterclockwise direction. The LTC 2601 provides two additional keys required to operate the zoom functions. Push buttons are included with both keyboards to control focus near or far and to open or close the iris (on applicable lenses).CAMERA TITLE:Camera Title CAMERA 1SEQUENCES:Seq Dwell Full A8 sec 1 - 60 secSeq Dwell Quad A8 sec 1 - 60 secSeq Dwell Full B8 sec 1 - 60 secSeq Dwell Quad B8 sec 1 - 60 secMon A Full1-161-16.Any camera in a 16 camera sequencei.e.1, 5, 8, 4, 2, 3, 4Mon A Quad1-4, 5-8, 9-12, 13-16Any camera to cameo assignment is allowedNote: 9-channel product has only 3Quads instead of 4Mon B Full1-161-16.Any camera in a 16 camerasequence i.e.1, 5, 8, 4, 2, 3, 4Mon B Quad1-4, 5-8, 9-12, 13-16Any camera to cameo assignment is allowedNote: 9-channel product has only 3 Quadsinstead of 8CONFIGURE SETUPS:Setup Title SETUP 1Any 12 character titleSystem4 Models ONL Y:PC/PRINTER/VCR:Connect to VCR Printer; GUI, CCL, VCRSerial Port96, n, 8, 1Baud: 6, 12, 24, 48, 96, 192Parity: o(odd), e(even), n(none)Data bits: 7, 8Stop bit 1Autoprint Disable Enable, disableLOG:Log Setup All off ACT, ALM, EVT, VL,ERR - All can be eitherselected or not selectedPASSWORD:Password11111111 - 9999, where 1111 = no passwordEXPAND SYSTEM:Number Mux0101 to 30TIME EVENTS:Setup on/off Off On, offStart Time00:00Days SMTWTFS SMTWTFS - Any day or days of the week Run One Time Off On, offRecord Off On, offCONFIGURE DISPLAY:Time/Date MON A On On, offTime/Date MON B On On, offShow T ext MON A On On, offShow T ext MON B On On, offT ext White: Black Clear: White, Clear: Gray, Clear: BlackWhite: Clear, White: Gray, White: BlackGray: Clear, Gray: White, Gray: BlackBlack: Clear, Black: White, Black: Gray Cameo Borders Black White, Gray BlackVCR Status Off On/offDisplay Lock List1-161-16.Any camera in a camera sequence Menu Timeout On On, offAuto Gain Control On On, offVIDEO LOSS:Video Loss o/p Enable Enable, disableVideo Loss Relay N/O N/C, N/OVideo Loss List No Cameras Selected Any Camera or Cameras LANGUAGE:Language English English, French, German, Spanish,Italian, Dutch。

佰赛特六五英寸UHD显示屏综为特伏特参考手册说明书

佰赛特六五英寸UHD显示屏综为特伏特参考手册说明书

Philips Signage Solutions D-Line Display65"UHD (3840 x 2160)500cd/m²65BDL4510DSay moreSmart, fast 24/7 display.Make it stand out with a fast D-Line professional 4K UHD display. Philips’ superb picture quality ensures true colours and intense contrast. You can effortlessly display content from multiple sources on a single screen.Effortless setup. Total control.•Operate, monitor and maintain with CMND & Control •Schedule what you want, when you want with SmartPlayer Cost-effective system solution•FailOver ensures content is always playing •Energy-saving automatic backlight control Brilliant picture. Blazing processor speed.•4K UHD. Rich, deep images. Stunning contrast •ADS wide-view panel display•Place in landscape or portrait orientation Operational flexibility•SmartPower for energy savingHighlightsCMND & ControlRun your display network over a local (LAN) connection. CMND & Control allows you to perform vital functions like controlling inputs and monitoring display status. Whether you're in charge of one screen or 100.FailOverFrom waiting room to meeting room, never show a blank screen. FailOver lets your Philips Professional Display switch automatically between primary and secondary inputs ensuring content keeps playing even if theprimary source goes down. Simply set a list of alternate inputs to be sure your business is always on.ADS wide-view panel displayBe seen from any angle with ADS wide-view technology. Advanced Super Dimension Switch delivers faster on-display pictureprocessing for smoother content transitions, remarkable image accuracy, and superior colour reproduction with 180 degree viewing.SmartPowerThe backlight intensity can be controlled and pre-set by the system to reduce the powerconsumption by up to 50%, which saves substantially on energy costs.SmartPlayerTurn your USB into a true cost effective digital signage device. Simply save your content(video, audio, pictures) on your USB and plug into your display.Create your playlist and schedule your content via the on screen menu, and enjoy your own created playlists anytime, anywhere.Issue date 2022-07-14Version: 1.0.112 NC: 8670 001 68869EAN: 87 12581 76899 7© 2022 Koninklijke Philips N.V.All Rights reserved.Specifications are subject to change without notice. Trademarks are the property of Koninklijke Philips N.V. or their respective owners.SpecificationsPicture/Display•Diagonal screen size: 64.5 inch / 163.8 cm •Panel resolution: 3840 x 2160•Optimum resolution: 3840 x 2160 @60Hz •Brightness: 500 cd/m²•Contrast ratio (typical): 1200:1•Aspect ratio: 16:9•Response time (typical): 8 ms •Pixel pitch: 0.372 x 0.372 mm •Display colors: 1.07 Billion•Viewing angle (H / V): 178 / 178 degree •Dynamic contrast ratio: 500,000:1•Panel technology: ADS•Picture enhancement: 3/2 - 2/2 motion pull down, 3D Combfilter, 3D MA deinterlacing, Dynamic contrast enhancement, Motion compens. deinterlacing, Progressive scanConnectivity•Video input: HDMI 2.0 (x3), Display Port1.2 (x1), DVI-I (x 1), USB 2.0 (x2)•Video output: DisplayPort 1.2 (x1), HDMI 2.0 (x1)•Audio input: 3.5 mm jack •Audio output: 3.5mm jack •Other connections: OPS•External control: RJ45, RS232C (in/out) 2.5 mm jack, IR (in/out) 3.5 mm jack Supported Display Resolution•Computer formats Resolution Refresh rate 1920 x 1080 60Hz 1680 x 1050 60Hz 1600 x 900 60Hz 1024 x 768 60Hz1280 x 102460Hz 1280 x 72060Hz 1440 x 900 60 Hz 3840 x 2160 30, 60Hz 640 x 480 60Hz 800 x 600 60Hz •Video formatsResolutionRefresh rate 1080i 50, 60Hz 576p 50Hz 576i 50Hz 480p 60Hz 480i 60Hz 1080p 50, 60Hz2160p 24, 30, 60Hz 720p 50,60 Hz Dimensions •Set dimensions (W x H x D):1462.3 x 837.3 x 68.9 (@Wall mount)/ 89.9 (@Handle) mm•Set dimensions in inch (W x H x D):57.57 x 32.96 x 2.71 inch(wall mount)/3.54 (@Handle) inch•Bezel width: 14.9 mm (Even bezel)•Product weight (lb): 61.29 lb •Product weight: 27.8 kg•Wall Mount: 400 (H) x 400(V) mm, M6Convenience•Placement: Landscape (24/7), Portrait (24/7)•Keyboard control: Hidden, Lockable•Signal loop through: IR Loopthrough, DisplayPort, HDMI, RS232•Network controllable: RJ45, RS232•Screen saving functions: Pixel Shift, Low Bright •Energy saving functions: Smart PowerPower•Standby power consumption: <0.5 W •Mains power: 100 ~ 240 VAC, 50 ~ 60 Hz •Consumption (Typical): 135 W •Consumption (Max): 290 W •Energy Label Class: GOperating conditions•Temperature range (operation): 0 ~ 40 °C •Temperature range (storage): -20 ~ 60 °C •Altitude: 0 ~ 3000 m •MTBF: 50,000 hour(s)•Humidity range (operation)[RH]: 20 ~ 80% (without condensation)•Humidity range (storage) [RH]: 5 ~ 95% (without condensation)Sound•Built-in speakers: 2 x 10W RMSAccessories•Included accessories: AC Power Cord, RS232 cable, Quick start guide, IR sensor cable (1.8M), Remote Control & AAA Batteries•Included Accessories: Philips logo (x1), AC SwitchCover, RS232 daisy-chain cable, Screws, USB Cover (x1)Multimedia Applications•USB Playback Audio: AAC, HEAAC, MPEG •USB Playback Picture: BMP, JPEG, PNG•USB Playback Video: MPEG, H.263, H.264, H.265, VP8Miscellaneous•On-Screen Display Languages: English, French, German, Spanish, Polish, Turkish, Russian, Italian, Simplified Chinese, Traditional Chinese, Arabic, Japanese, Danish, Dutch, Finnish, Norwegian, Portuguese, Swedish•Regulatory approvals: CB, CE, BSMI, CCC, CU, EMF, FCC, Class A, PSB, RoHS, VCCI, EnergyStar 8.0, ETL•Warranty: 3 year warranty。

EM640FV16F系列256Kx16位超低功耗低电压全CMOS静态RAM产品说明书

EM640FV16F系列256Kx16位超低功耗低电压全CMOS静态RAM产品说明书

Document Title256K x16 bit Super Low Power and Low Voltage Full CMOS Static RAMRevision HistoryRevision No. History Date Remark0.0-.Initial Draft May262003Preliminary0.1-.Add Pb-free part number Feb.1320040.2-.I SB1(Max.) changed from 12uA to 6uA.Mar.3120080.3-.Add 45ns part specification.Apr.22009-.I SB1(Typ.) changed from 1uA to 0.25uA.-.I SB1(Max.) changed from 6uA to 4uA.-.Memory Function Guide updated in the last page.Apr.72009Release1.0-.EM640FV16F(KGD), EM640FV16F series & EM640FV16FUseries are unified to EM640FV16F Family.Emerging Memory & Logic Solutions Inc.3F Korea Construction Financial Cooperative B/D, 301-1 Yeon-Dong, Jeju-Si, Jeju-Do, Rep.of Korea Zip Code : 690-717Tel : +82-64-740-1700 Fax : +82-64-740-1750 / Homepage : The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office.PRODUCT FAMILY1. “xx” represents speed.2. Typical values are measured at Vcc=3.3V, T A =25o C and not 100% tested.Product FamilyOperating Temperature Vcc RangeSpeedPower DissipationPKG Type Standby (I SB1, Typ.)Operating (I CC1.Max.)EM640FV16F Industrial (-40 ~ 85o C)2.7 ~3.6 V 45/55/70 ns0.25 µA 2)3 mAKGDEM640FV16F - xx 1)LF VFBGA-48 EM640FV16FU - xx 1)LF44-TSOP2FEATURES•Process Technology : 0.18µm Full CMOS •Organization : 256K x 16 bit•Power Supply Voltage : 2.7V ~ 3.6V •Low Data Retention Voltage : 1.5V(Min.)•Three state output and TTL Compatible •Package Type : VFBGA-48, 44-TSOP2GENERAL DESCRIPTIONThe EM640FV16F families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current.R o w S e l e c tI/O Circuit Column SelectData ContData ContPre-charge CircuitMemory Array 2048 x 2048A1A2A3A4A5A6A7A0A8A9A11A12A13A14A15A16A17WE OE UB LB CS1DQ0 ~ DQ7DQ8 ~ DQ15VCCVSSControl LogicA10FUNCTIONAL BLOCK DIAGRAMCS2PIN DESCRIPTIONName FunctionName FunctionCS1, CS2Chip Select inputs V CC Power Supply OE Output Enable input V SS GroundWE Write Enable input UB Upper Byte (DQ8~DQ15)A0~A17 Address inputs LB Lower Byte (DQ0~DQ7)DQ0~DQ15Data inputs/outputsNCNo ConnectionPIN CONFIGURATIONSVFBGA-48 : Top view(ball down)123456A LB OE A0A1A2CS2B DQ8UB A3A4CS1DQ0C DQ9DQ10A5A6DQ1DQ2D VSS DQ11A17A7DQ3VCCE VCC DQ12 NC A16DQ4VSSF DQ14DQ13A14A15DQ5DQ6G DQ15NC A12A13WE DQ7HNCA8A9A10A11NC1234567891011121314151644434241403938373635343332313029A4A3A2A1A0CS1DQ0DQ1DQ2DQ3VCC VSS DQ4DQ5DQ6DQ7A5A6A7OE UB LB DQ15DQ14DQ13DQ12VSS VCC DQ11DQ10DQ9DQ844 - TSOP2171819202122282726252423WE A17A16A15A14A13CS2A8A9A10A11A1244 - TSOP2 : Top viewABSOLUTE MAXIMUM RATINGS 1)1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.FUNCTIONAL DESCRIPTIONNOTE : X means don’t care. (Must be low or high state)ParameterSymbol Ratings Unit Voltage on Any Pin Relative to Vss V IN , V OUT-0.2 to 4.0V Voltage on Vcc supply relative to Vss V CC -0.2 to 4.0V Power Dissipation P D 1.0WOperating TemperatureT A-40 to 85oCCS1CS2OE WE LB UB DQ0~7DQ8~15Mode Power H X X X X X High-Z High-Z Deselected Stand by X L X X X X High-Z High-Z Deselected Stand by X X X X H H High-Z High-Z Deselected Stand by L H H H L X High-Z High-Z Output Disabled Active L H H H X L High-Z High-Z Output Disabled Active L H L H L H Data Out High-Z Lower Byte Read Active L H L H H L High-Z Data Out Upper Byte Read Active L H L H L L Data Out Data Out Word Read Active L H X L L H Data In High-Z Lower Byte Write Active L H X L H L High-Z Data In Upper Byte Write Active LHXLLLData InData InWord WriteActiveRECOMMENDED DC OPERATING CONDITIONS 1)1. TA= -40 to 85o C, otherwise specified2. Overshoot: VCC +2.0 V in case of pulse width < 20ns3. Undershoot: -2.0 V in case of pulse width < 20ns4. Overshoot and undershoot are sampled, not 100% tested.CAPACITANCE 1) (f =1MHz, T A =25o C)1. Capacitance is sampled, not 100% tested.DC AND OPERATING CHARACTERISTICS1. Typical values are measured at Vcc=3.3V, T A =25o C and not 100% tested.ParameterSymbol Min Typ Max Unit Supply voltage V CC 2.7 3.3 3.6V GroundV SS 000V Input high voltage V IH 2.2 -V CC + 0.22)V Input low voltageV IL-0.23)-0.6VItemSymbol Test ConditionMin Max Unit Input capacitance C IN V IN =0V -8pF Input/Ouput capacitanceC IOV IO =0V-10pFParameterSymbol Test Conditions Min Typ Max Unit Input leakage current I LI V IN =V SS to V CC-1-1µA Output leakage current I LO CS 1=V IH or CS 2=V IL or OE=V IH or WE=V IL or LB=UB=V IH V IO =V SS to V CC-1-1µA Operating power supplyI CC I IO =0mA, CS 1=V IL , CS 2=WE=V IH , V IN =V IH or V IL --3mA Average operating currentI CC1Cycle time=1µs, 100% duty, I IO =0mA,CS 1<0.2V, LB<0.2V or/and UB<0.2V, CS 2>V CC -0.2V, V IN <0.2V or V IN >V CC -0.2V--3mAI CC2Cycle time = Min, I IO =0mA, 100% duty,CS 1=V IL , CS 2=V IH, LB=V IL or/and UB=V IL , V IN =V IL or V IH 45ns --35mA55ns --3070ns--25 Output low voltage V OL I OL = 2.1mA--0.4V Output high voltage V OH I OH = -1.0mA2.4--V Standby Current (TTL)I SBCS 1=V IH , CS 2=V IL , Other inputs=V IH or V IL --0.3mAStandby Current (CMOS)I SB1CS 1>V CC -0.2V, CS 2>V CC -0.2V (CS 1 controlled) or 0V<CS 2<0.2V (CS 2 controlled), Other inputs = 0~V CC(Typ. condition : V CC =3.3V @ 25oC) (Max. condition : V CC =3.6V @ 85o C)LL LF-0.25 1)4µAAC OPERATING CONDITIONSTest Conditions (Test Load and Test Input/Output Reference)Input Pulse Level : 0.4 to 2.2V Input Rise and Fall Time : 5nsInput and Output reference Voltage : 1.5VOutput Load (See right) : CL 1) = 100pF+ 1 TTL(70ns) CL 1) = 30pF + 1 TTL(45ns/55ns)1. Including scope and Jig capacitance2. R 1=3070Ω, R 2=3150Ω3. V TM =2.8V4. CL = 5pF + 1 TTL (measurement with tLZ, tOLZ, tHZ, tOHZ, tWHZ)READ CYCLE (V cc =2.7 to 3.6V, Gnd = 0V, T A = -40o C to +85o C)WRITE CYCLE (V cc =2.7 to 3.6V, Gnd = 0V, T A = -40o C to +85o C)ParameterSymbol45ns 55ns70nsUnitMin Max Min Max Min Max Read cycle time t RC 45-55-70-ns Address access time t AA -45-55-70ns Chip select to output t CO1, t CO2-45-55-70ns Output enable to valid output t OE -20-25-35ns UB, LB acess time t BA 45 55 70ns Chip select to low-Z output t LZ1, t LZ210-10-10-ns UB, LB enable to low-Z output t BLZ 5-5-5-ns Output enable to low-Z output t OLZ 5-5-5-ns Chip disable to high-Z output t HZ1, t HZ2020020025ns UB, LB disable to high-Z output t BHZ 020020025ns Output disable to high-Z output t OHZ 020020025ns Output hold from address changet OH10-10-10-nsParameterSymbol45ns 55ns70nsUnitMin Max Min Max Min Max Write cycle timet WC 45-55-70-ns Chip select to end of write t CW1, t CW235-45-60-ns Address setup time t AS 0-0-0-ns Address valid to end of write t AW 35-45-60-ns UB, LB valid to end of write t BW 35-45-60-ns Write pulse width t WP 35-40-55-ns Write recovery time t WR 0-0-0-ns Write to ouput high-Z t WHZ 0202025nsData to write time overlap t DW 25 25 30 ns Data hold from write time t DH 0-0-0-ns End write to output low-Zt OW5-5-5-nsCL 1)V TM 3)R 12)R 22)TIMING WAVEFORM OF READ CYCLE(2) (WE = V IH )t RCAddresst AA Data Validt OHPrevious Data ValidTIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS=OE=V IL , WE=V IH, UB or/and LB =V IL )Data OutTIMING DIAGRAMSNOTES (READ CYCLE)1. t HZ1,2 and t OHZ are defined as the outputs achieve the open circuit conditions and are not referenced to output voltage levels.2. At any given temperature and voltage condition, t HZ1,2(Max.) is less than t LZ1,2(Min.) both for a given device and from device to device interconnection.t RCAddressCS1CS2UB,LBOEData Outt CO1,2t OHt BAt OEHigh-Zt BHZt OHZData Validt OLZt BLZ t LZ1,2t AAt HZ1,2TIMING WAVEFORM OF WRITE CYCLE(1)(WE Controlled)TIMING WAVEFORM OF WRITE CYCLE(2) (CS1 Controlled)t WC AddressCS1 CS2 UB,LB WE Data in Data outt CW1(2)t WR(4)t AWt BWt WP(1)t DW t DH tAS(3)High-Z High-ZData Validt WR(4)t WCAddressCS1CS2 UB,LB WE Data in Data outt CW1,2(2)t AWt BWt WP(1)t AS(3)High-Zt DW t DHHigh-Zt OWt WHZData UndefinedData ValidTIMING WAVEFORM OF WRITE CYCLE(3)(CS2 Controlled)t WC AddressCS1CS2 WE Data in Data outt CW2(2)t WR(4)t AWt WP(1)t DW t DH High-Z High-ZData Validt AS(3)TIMING WAVEFORM OF WRITE CYCLE(4) (UB, LB Controlled)NOTES (WRITE CYCLE)1. A write occurs during the overlap(t WP ) of low CS1 a high CS2 and low WE. A write begins at the lastest transition among CS1 goes low, CS2 goes high and WE goes low. A write ends at the earliest transition when CS1 goes high, CS2 goes high and WE goes high. The t WP is measured from the beginning of write to the end of write.2. t CW is measured from the CS1 going low to end of write.3. t AS is measured from the address valid to the beginning of write.4. t WR is measured from the end or write to the address change. t WR applied in case a write ends as CS1 or WE going high.t WCAddressCS1CS2UB,LBWEData in Data outt CW1,2(2)t WR (4)t AW t BWt WP (1)t DWt DHHigh-ZHigh-ZData Validt AS (3)DATA RETENTION CHARACTERISTICSNOTES1. See the I SB1 measurement condition of datasheet page 5.2. Typical values are measured at T A =25o C and not 100% tested.ParameterSymbolTest ConditionMinTyp 2)MaxUnitV CC for Data Retention V DR I SB1 Test Condition (Chip Disabled) 1)1.5- 3.6V Data Retention CurrentI DR V CC =1.5V, I SB1 Test Condition (Chip Disabled) 1)-0.5-µAChip Deselect to Data Retention Time t SDR See data retention wave form0--nsOperation Recovery Timet RDRt RC--DATA RETENTION WAVE FORMt SDRt RDRData Retention ModeCS1 > Vcc-0.2VV cc 2.7V2.2V V DRCS1, LB / UBGNDt SDRt RDRData Retention ModeV cc 2.7V CS2V DR 0.4V GNDCS2 < 0.2VPACKAGE DIMENSION44 - TSOP2 (0.8mm pin pitch)Unit : millimeters / inchesAB CD E F G H654321DVFBGA 48 BALLS (6X7X1 0.75mm ball pitch)M Min.NOR.Max.A ---1A10.220.32A20.21 REF A30.45 REF b 0.32 5.250.42D 6 BSCE 7 BSC e 0.75 BSC D10.35 BSC E15.25 BSCNOTES.1). DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z.2). DATUM Z (SEATING PLANE) IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.3). PARALLELISM MESUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE.DETAIL KA1 CORNERUnit: millimetersA1 CORNERXE Y0.1 ZE17X ee/2e/25X eD148X b 1)0.15 M Z X Y 0.08 M ZDETAIL KM0.08 ZZ0.1 ZAA1(A2)(A3)SEATING PLANE2)3)MEMORY FUNCTION GUIDE1. Memory Component8. VersionBlank---------------Mother die2. Device Type A ---------------2 nd generation 6---------------Low Power SRAM B ---------------3 rd generation 7---------------STRAM C ---------------4 th generation C ---------------CellularRAM D ---------------5 th generation E ---------------6 th generation3. Density F ---------------7 th generation 1--------------- 1MG ---------------8 th generation 2--------------- 2M 4--------------- 4M 9. Package8--------------- 8M Blank---------------KGD, FBGA 16--------------- 16M S ---------------32 sTSOP132--------------- 32M T ---------------32 TSOP164--------------- 64M U ---------------44 TSOP228---------------128MV ---------------32 SOP 4. Option 10. Speed 0---------------Dual CS 45--------------- 45ns 1---------------Single CS 55--------------- 55ns 60--------------- 60ns 5. Technology 70--------------- 70ns F ---------------Full CMOS 85--------------- 85ns 90--------------- 90ns 6. Operating Voltage 10---------------100ns T ---------------5.0V 12---------------120nsV ---------------3.3V U ---------------3.0V 11. Power S ---------------2.5V LL ---------------Low Low PowerR ---------------2.0V LF ---------------Low Low Power(Pb-free & Green)P ---------------1.8V L ---------------Low PowerS ---------------Standard Power7. Organization 8--------------- X8 bit 16---------------X16 bit 32---------------X32 bitEMX XX XXX XX XX -XX XX1. EMLSI Memory2. Device Type 11. Power3. Density 10. Speed4. Function 9. Package5. Technology 8. Version6. Operating Voltage7. Organization。

北京思普瑞特 SP-RMD6微型热敏打印机 说明书

北京思普瑞特 SP-RMD6微型热敏打印机 说明书

SP-RMD6
微
型
热
敏
打
印
机
说 明 书
(VER 1.01)
北京思普瑞特科技发展有限公司
1
目录
目录...................................................................................................................................................2 简介...................................................................................................................................................3 第一章 特征与性能指标 ...........................................................................................................3 1.1 主要特征............................................................................................................................3 1.2 性能指标............................................................................................................................4 第二章 安装说明 ............