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Indium8.9E Pb-Free Solder Paste 98461 R3

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OVER—>Features •High transfer effi ciency through small apertures(≤ 0.66AR) •Eliminates graping phenomenon on small deposits •Low voiding in BGA/CSP solder joints Introduction Indium8.9E is an air refl ow, no-clean solder paste specifi cally formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium8.9E offers unprecedented stencil print transfereffi ciency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium8.9Evirtually eliminates incomplete coalescence (graping) of small deposits.Alloys Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-Free alloys that cover a broad range of melting temperatures. Type 4 and Type 3 powder are standard offerings with SAC305 & SAC387 alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependant upon the powder type andapplication. Standard product offerings are detailed in the following table.BELLCORE AND J-STD TESTS & RESULTST est Result J-STD-004A (IPC-TM-650)• F lux Type (per J-STD-004A) ROL1• F lux Induced Corrosion (Copper Mirror) Type L • P resence of Halide Silver Chromate Pass Fluoride Spot Test Pass Ion Chromatography <0.5% CI - eq.• S R Pass Indium8.9E Pb-Free Solder PasteT est Result J-STD-005 (IPC-TM-650)• T ypical Solder Paste ViscosityM alcom (10rpm)Type 4 1500 poise Type 3 1450 poise • S lump Test Pass• S older Ball Test Pass• T ypical Tackiness 35g• W etting Test PassBELLCORE GR-78• S I R Pass • E lectromigration PassAll information is for reference only. Not to be used as incoming product specifi cations.Alloy Me t al Load IPN95.5Sn/3.8Ag/0.7Cu (SAC387) 88.50% (Type 4) 800446 95.5Sn/3.8Ag/0.7Cu (SAC387) 88.75% (Type 3) 800445PackagingIndium8.9E is currently available in 500g jars or 600g cartridges. Packaging for enclosed print head systems is also readily available. Alternate packaging options may be available upon request.Storage and HandlingProceduresRefrigerated storage will prolong the shelf life of solderpaste. The shelf life of Indium8.9E is 6 months when storedat <10°C. Solder paste packaged in cartridges should be stored tip down.Solder paste should be allowed to reach ambient working temperature prior to use. Generally, paste should be removed from refrigeration at least two hours before use. Actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verifi ed before use. Jars and cartridges should be labeled with date andtime of opening. askus@ASIA: Singapore, Cheongju: +65 6268 8678This product data sheet is provided for general information only. It is not intended, and shall not be construed, to warrant or guarantee the performance of the products described which are sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices.Indium8.9E Pb-Free Solder Paste PrintingStencil Design:Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:• Discrete components — A 10-20% reduction of stencilaperture has signifi cantly reduced or eliminated theoccurrence of mid-chip solder beads. The “home plate”design is a common method for achieving this reduction.• Fine pitch components — A surface area reduction isrecommended for apertures of 20 mil pitch and fi ner.This reduction will help minimize solder balling andbridging that can lead to electrical shorts. The amountof reduction necessary is process dependent (5-15% is common).• For optimum transfer effi ciency and release of the solder paste from the stencil apertures, industry standardaperture and aspect ratios should be adhered to. Printer Operation:The following are general recommendations for stencil printer optimization. Adjustments may be necessary based on specifi c process requirement:• Solder Paste Bead Size: 20-25mm diameter• Print Speed: 50-100mm/sec• Squeegee Pressure: 0.018-0.027kg/mmof blade length• Underside Stencil Wipe: Start at once every 5prints then decreasefrequency until anoptimum value isdetermined.• Solder Paste Stencil Life: >8 hrs. @ 30-60% RH &22°-28°CCleaningIndium8.9E is designed for no-clean applications, however the fl ux can be removed if necessary by using a commercially available fl ux residue remover.Stencil Cleaning is best performed using isopropyl alcohol (IPA) as a solvent. Most commercially available stencil cleaners work well. Recommended Profi le:The stated profi le recommendations apply to mostPb-Free alloys in the Sn/Ag/Cu (SAC) alloy system, including SAC 305 (96.5Sn/3.0Ag/0.5Cu). This canbe used as a general guideline in establishing a refl owprofi le when using Indium8.9E Solder Paste. Deviations from these recommendations are acceptable, and maybe necessary, based on specifi c process requirements, including board size, thickness & density.Heating Stage:The use of a linear ramp rate or ramp-to-spike (RTS) typeprofi le assists in minimizing the greatest overall number of defects associated with the refl ow process. If the ramp rate is too fast, it can cause solder balling, solder beading, and aggravated hot slump which can lead to bridging. The ramp rate in the preheat stage of the profi le can range from 0.5°-2.5°C/second (0.5°-1°C/second is ideal). A short soak of20-30 seconds just below the melting point of the solder alloy can help minimize tombstoning when using a RTS type profi le.If necessary, a ramp-soak-spike (RSS) profi le can be implemented to minimize voiding on BGA and CSP type packages. A soak zone between 200°-210°C for up to 2 minutes is acceptable.Liquidus Stage:To achieve acceptable wetting and form a quality solder joint, the acceptable temperature range above the melting point of the solder alloy is 12°-50°C (15°-30°C is ideal). The acceptable range for time above liquidus (TAL) is 30-100 seconds (45-60 seconds is ideal). A peak temperature and TAL above these recommendations can result in excessive intermetallic formation that can decrease solder joint reliability.Cooling Stage:A rapid cool down is desired to form a fi ne grain structure. Slow cooling will form a large grain structure, which typically exhibits poor fatigue resistance. The acceptable cooling range is 0.5°C-6.0°C/second (2.0°-6.0°C/second is ideal).-Ì>`>À`->*ÊrÊÓ£Çc/i«iÀ>ÌÕÀiÊ­c®/ iÊ­ ®ÓxäÓää£xä£ääxäääÊ£ÊÓÊÎÊ{ÊxÊÈÊ askus@ ASIA: Singapore, Cheongju: +65 6268 8678。

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半导体专业词汇--汇总

半导体专业词汇--汇总


Lifting, peeling or flaking of the lead finish is rejectable excluding 0.2mm of the lead length from body. Any lead with dam bar step dimensions exceeding 0.1mm is rejectable. end plug (S) manager of XX department XX Electronics CO.Ltd X-ray yield X-ray X-ray inspection safety curtain safety stock safety glasses ammoniam water Press the emergency button. lot for lot lifted bond lifted wedge cavity plate,cavity block PPM (parts per million) Pareto chart plate mold semiconductor insufficient ball size off loader wrong orentation molding wrong orientation molding molding molding mold chase mold chase molding mismatch packing packing packing box packing defect criteria shipping box carrying cost carrying cost rate safety time holdup time shelf life scrap remark backside metal (Au/Ag) back side back marking chip package chips specific gravity specific gravity hydrometer closed loop MRP closing time bending side rail edge die reject die around slice edge side rail edge die Tape & Reel tape/real peel back force test braid flat cable,ribbon cable flat ball variation discoloration discolor(yellowish,blcken,water mark) discoloration/oxidation/lifting deformed
TAMURA锡膏-衡鹏代理-TLF-204-NH

TAMURA锡膏-衡鹏代理-TLF-204-NH

2008.4Pb-FREE SOLDER PASTE TLF-SERIESLFSOLDERTLF-204-NHLFSOLDER TLF-204-NH is the Pb-free and Halogen-free solder paste which it used spherical Pb-free solder powder and the halogen-free flux. Also, after reflow, the flux residue of this paste becomes with halogen free, because it does not include halogen. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux without washing.1. Outstanding Features 1) Pb-free (Sn/Ag/Cu series) solder alloy is used. 2) Halogen-free flux is used. 3) Stable printability is obtained with little change in viscosity during continuous printing. 4) Having a good solderability even in air reflow. 5) Excellent solderability can be attained for a high peak temperature. 6) Superior reliability is provided by no washing.2. Characteristics Characteristics of LFSOLDER TLF-204-NH is shown in Table 1 and Table 2. Table 1 - Characteristics of LFSOLDER TLF-204-NH Items Alloy composition Melting point Particle size of solder powder Shape of solder powder Flux content Chlorine content* Viscosity Characteristics Sn 96.5 / Ag 3.0/ Cu 0.5 216 25 220 41µm Test methods JIS Z 3282 (1999) According to DSC measurement According to laser diffraction method Annex 1 to JIS Z 3284 (1994) JIS Z 3284 (1994) JIS Z 3197 (1999) Annex 6 to JIS Z 3284 (1994) Viscometer, type PCU, manufactured by Malcom, at 25Spherical 12.0% 0.0 % 210 Pa s1Table 2 - Characteristics of LFSOLDER TLF-204-NH Items Water solution resistance test Insulation resistance test Characteristics More than 1×104 Ω cm More than 1×109 Ω Test methods JIS Z 3197 (1999) Board type 2,Annex 3 to JIS Z 3284 (1994) Reflow: By reflow soldering system. Print the paste on ceramics board and heat for 60 seconds at 150 . Measure slumping width from before and after heating. STD-092b Print the paste on ceramics board. After melting and heating, observe with a microscope of 50 times. STD-009e JIS Z 3197 (1986) 6.10 JIS Z 3197 (1986) 6.6.1 Annex 12 to JIS Z 3284 (1994) (The written characteristics is not a guarantee value.)Slump testLess than 0.20mmSolder ball test Solder spread test Copper plate corrosion test Tackiness test of residue Test method of our companySolder balls seldom occur. More than 70% No corrosion Pass3. Quality Guarantee Period The quality guarantee period shall be 180 days after manufacture if the products are stored in sealed containers at temperature below 10 .4. Product Packaging Units The standard of the packing unit of this product is 500g.25. Cautions for Use (1) Stirring of Solder Paste (1.1) In the Case of Manual Stirring Thoroughly stir solder paste stored in refrigerators with spatula or the like after returning to room temperature without fail (It takes about one to two hours if left standing at 25 the paste will absorb moisture to cause solder balls. ). If the seal is broken(1.2) In the Case of Using Automatic Stirring Apparatus An automatic stirring apparatus is utilized at times to use solder paste stored in refrigerators by returning it to room temperature in a short period of time. Even if such automatic stirring apparatus is used, no change will occur to the characteristics of the solder paste. With the lapse of stirring time, the temperature of solder paste will rise as shown in Fig.1: If the stirring time is lengthened, it will lead to the possibility of throwing solder paste with temperature higher than the working environment onto boards and thus causing bleeding during printing. So, be careful. Conduct adequate test beforehand since the stirring time will vary according to the specifications of apparatus, ambient temperature, and other conditions. (In case of using solder softener SS-1, appropriate stirring time will be about 20 minutes).40Temperature ( )30 20 10 0 0 10 20 30 Stirring time (min) 40Fig.1 - Stirring time and temperature rise of solder paste when using automatic stirring apparatus Apparatus: Solder softener SS-1 manufactured by Malcom3(2) Conditions for Printing Printing conditions recommended for LFSOLDER TLF-204-NH is shown in Table 3: Table 3 - Printing conditions recommended Items Metal mask Squeegee Squeegee angle Squeegee speed Printing pressure Setting range Laser machined, manufactured by additive (or those having flat opening side) Metal, Urethane (hardness 80 to 90 degrees) 50 to 70 degrees 20 100 40mm/s 200kPa(3) Parts Mounting Time Mount the parts within 24 hours after printing the solder paste. If left standing for a long time after printing, the surface of solder paste will dry up to cause mount error of parts.(4) Reflow Conditions Recommended temperature profile of air reflow is shown in Fig.2.250Temperature ( )220 200 150 100 25 0 50 100 150 200Reflow time (s) Fig.2 - Temperature profile of air reflow4[Precautions] 1) Preheat Set the temperature rising speed A at a rate of 1~3 /s. Careful about rapid temperature rise in preheat zone as it may cause excessive slumping of the solder paste. Appropriate preheat time B will be from 60 to 100 seconds. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if performed excessively, fine balls and large balls will generate in clusters at a time. Appropriate preheat ending temperature C will be from 150 to 200 . If the temperature is too low, non-melting tends to be caused in the area with large heat capacity after reflow.2) Heating Careful about sudden rise in temperature as it may worsen the slump of solder paste. Set the peak temperature D in the range from 235 to 245 . Adjust the melting time that the time over 220 ,E, will be from 20 to 60 seconds.3) Cooling Careful about slow cooling as it may cause the positional shift of parts and decline in joining strength at times.Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of parts and boards, and the specifications of the reflow furnace.56. Cautions from Standpoints of Safety and Sanitation 1) Physiological interaction varies by individuals. As a prudent policy, therefore, care, should be exercised not to inhale gas of fume of solvent emitted during operations and not to have your skin exposed (especially mucous membrane and other parts vulnerable to stimuli) for a long time. 2) This paste is contains the organic solvent, but it is no flammable. 3) If the paste sticks to the skin, wipe it off with ethanol and the like, and wash thoroughly with soapy water.*The physical chemistry-character among written contents etc. is not a guarantee value. The evaluation of danger and noxiousness is based and makes material, information, and the data, etc. which can be acquired now. However, it is not because all material was covered and note handling enough, please. As for notes, it is the one intended for usual handling. Special handling is not assumed. Please observe the restriction of related various regulations, and use after executing suitable safety measures for the usage. Before start using our paste, please kindly conduct sufficient examination on manufacturing process and credibility. We will not guarantee your product in case a problem occurs to your product while using our product.6TAMURA KAKEN CORPORATIONhttp://www.tamura-kaken.co.jp/Head Office / Factory: 16-2, Sayamagahara, Iruma-shi, Saitama-Prefecture, 358-8501, JapanPhone: 81-4-2934-6131 Fax: 81-4-2934-6559Kodama Factory: 200-2, Toyohara, Motohara, Kamikawa-cho, Kodama-gun, Saitama-Prefecture, 367-0241, JapanPhone: 81-495-77-3611 Fax: 81-495-77-4468Suzuka Factory: 7651-18, Ishimaru, Kokubu-cho, Suzuka-shi, Mie-Prefecture, 513-0836, JapanPhone: 81-59-378-6761 Fax: 81-59-378-8636TA FONG ELECTRO CHEMICAL INDUSTRY CO., LTD.No.9 Alley 2, Lane 97, Ming-Sheng, East Road, Sec.4. Taipei, TaiwanPhone: 886-22-712-1315 Fax : 886-22-716-038TAMURA KAKEN (U.K.) LTD.Caswell Road, Brackmill Industrial Estate, Northampton NN4 7PW, United KinPhone: 44-1604-768888 Fax : 44-1604-768808TAMURA KAKEN SINGAPORE PTE., LTD.67, Ayer Rajah Crescent #01-01/02 Ayer Rajah Industrial Estate, Singapore 139Phone: 65-6779-3100 Fax : 65-6778-2186DONG-HWA TAMURA KAKEN CO., LTD.58-3,Shin-kungi-Dong, Ansung-shi, Kyungki-Do, Korea 9F, 88 Zun Yi S Road, Shanghai 200336, ChinaPhone: 82-031-676-2374 Fax : 82-031-674-442 Phone: 86-21-6278-8870 Fax : 86-21-6278-887SHANGHAI XIANG-LE TAMURA ELECTRO CHEMICAL INDUSTRY CO., LTD. TAMURA KAKEN CORP., U.S.A.100, North Winchester Boulevard Santa Clara, California CA, 95050 Suite 330, U.S.A.Phone: 1-408-246-1708 Fax : 1-408-246-0717http://www.tamura-ss.co.jp/Head Office: 1-19-43, Higashiohizumi, Nerima-ku, Tokyo, 178-8511, Japan Electronic Equipment Sales DivisionDealer:7。

淼田电子有限公司LQG15HH系列芯片电感说明书

淼田电子有限公司LQG15HH系列芯片电感说明书

SpecNo.JELF243B-9101H-01 P.1 / 11Reference OnlyCHIP COIL (CHIP INDUCTORS) LQG15HH □□□□02DMurata Standard REFERENCE SPECIFICATION [AEC-Q200]1.ScopeThis reference specification applies to LQG15HH series Chip coil (Chip Inductors) for Automotive Electoronics based on AEC-Q200.2.Part Numbering(ex) LQ G 15 H H 1N0 S 0 2 DProduct ID Struture Dimension Applications Category Inductance Tolerance Features Electrode Pakaging(L ×W) and for Automotive D:TapingCharacteristics Electoronics3.Rating・Operating Temperature Range. –55°C to +125°C ・Storage Temperature Range. –55°C to +125°CCustomer Part Number MURATAPart NumberInductance (nH) ToleranceQ(min.)DC Resistance (Ω max. ) Self ResonantFrequency (MHz min. )Rated Current (mA)ESD Rank 1C:1kV(*1)(refer to below comment)LQG15HH1N0B02D1.0B:±0.1nHC:±0.2nH S:±0.3nH8 0.07 10000 10001CLQG15HH1N0C02D LQG15HH1N0S02D LQG15HH1N1B02D1.1 6000 LQG15HH1N1C02DLQG15HH1N1S02D LQG15HH1N2B02D 1.2 LQG15HH1N2C02D LQG15HH1N2S02DLQG15HH1N3B02D1.3 LQG15HH1N3C02DLQG15HH1N3S02D LQG15HH1N5B02D1.5 LQG15HH1N5C02DLQG15HH1N5S02D LQG15HH1N6B02D 1.6 LQG15HH1N6C02D LQG15HH1N6S02D LQG15HH1N8B02D 1.8 0.08 950LQG15HH1N8C02D LQG15HH1N8S02DLQG15HH2N0B02D2.0 0.09 900LQG15HH2N0C02DLQG15HH2N0S02DLQG15HH2N2B02D 2.2 LQG15HH2N2C02D LQG15HH2N2S02D LQG15HH2N4B02D2.4 0.11 850 LQG15HH2N4C02DLQG15HH2N4S02D LQG15HH2N7B02D 2.7 0.12 800 LQG15HH2N7C02D LQG15HH2N7S02D LQG15HH3N0B02D 3.0 0.125LQG15HH3N0C02D LQG15HH3N0S02DLQG15HH3N3B02D3.3 LQG15HH3N3C02DLQG15HH3N3S02D LQG15HH3N6B02D3.6 0.14 750 LQG15HH3N6C02DLQG15HH3N6S02DCustomer Part Number MURATAPart NumberInductance (nH) ToleranceQ(min.)DC Resistance (Ω max. ) Self ResonantFrequency(MHz min. )RatedCurrent(mA)ESD Rank 1C:1kV(*1)(refer to below comment)LQG15HH3N9B02D3.9 B:±0.1nHC:±0.2nHS:±0.3nH8 0.14 6000 7501CLQG15HH3N9C02DLQG15HH3N9S02DLQG15HH4N3B02D 4.3 LQG15HH4N3C02D LQG15HH4N3S02D LQG15HH4N7B02D 4.7 0.16 700LQG15HH4N7C02D LQG15HH4N7S02DLQG15HH5N1B02D5.1 0.18 5300 650LQG15HH5N1C02DLQG15HH5N1S02DLQG15HH5N6B02D5.6 4500 LQG15HH5N6C02DLQG15HH5N6S02D LQG15HH6N2B02D6.2 0.20 600LQG15HH6N2C02DLQG15HH6N2S02DLQG15HH6N8G02D6.8 G:±2%H:±3%J:±5%0.22 LQG15HH6N8H02DLQG15HH6N8J02D LQG15HH7N5G02D 7.5 0.24 4200 550LQG15HH7N5H02D LQG15HH7N5J02DLQG15HH8N2G02D 8.2 3700 LQG15HH8N2H02D LQG15HH8N2J02DLQG15HH9N1G02D 9.1 0.26 3400500LQG15HH9N1H02D LQG15HH9N1J02DLQG15HH10NG02D10 LQG15HH10NH02D LQG15HH10NJ02D LQG15HH12NG02D12 0.28 3000 LQG15HH12NH02DLQG15HH12NJ02DLQG15HH15NG02D15 0.32 2500 450 LQG15HH15NH02DLQG15HH15NJ02D LQG15HH18NG02D18 0.36 2200 400 LQG15HH18NH02DLQG15HH18NJ02D LQG15HH22NG02D 22 0.42 1900 350 LQG15HH22NH02D LQG15HH22NJ02D LQG15HH27NG02D 27 0.46 1700 LQG15HH27NH02D LQG15HH27NJ02D LQG15HH33NG02D33 0.58 1600 LQG15HH33NH02DLQG15HH33NJ02D LQG15HH39NG02D39 0.65 1200 300 LQG15HH39NH02DLQG15HH39NJ02DCustomer Part Number MURATAPart NumberInductance (nH) Tolerance Q(min.) DC Resistance (Ω max. ) Self Resonant Frequency (MHz min. )Rated Current (mA)ESD Rank 1C:1kV(*1)(refer to below comment)LQG15HH47NG02D 47 G:±2%H:±3%J:±5%8 0.72 1000 3001CLQG15HH47NH02D LQG15HH47NJ02DLQG15HH56NG02D 56 0.82 800 250LQG15HH56NH02D LQG15HH56NJ02DLQG15HH68NG02D68 0.92 LQG15HH68NH02DLQG15HH68NJ02D LQG15HH82NG02D82 1.20 700 200 LQG15HH82NH02DLQG15HH82NJ02D LQG15HHR10G02D100 1.25 600 LQG15HHR10H02DLQG15HHR10J02DLQG15HHR12G02D120 1.30 LQG15HHR12H02DLQG15HHR12J02DLQG15HHR15G02D 150 2.99 550 150LQG15HHR15H02D LQG15HHR15J02DLQG15HHR18G02D 180 3.38 500 LQG15HHR18H02D LQG15HHR18J02D LQG15HHR22G02D 220 3.77 450 120 LQG15HHR22H02D LQG15HHR22J02D LQG15HHR27G02D270 4.94 400 110 LQG15HHR27H02DLQG15HHR27J02D(*1) Standard Testing Conditions《Unless otherwise specified 》 《In case of doubt 》Temperature : Ordinary Temperature / 15°C to 35°C Temperature: 20°C ± 2°CHumidity :Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa4. Appearance and Dimensions■Unit Mass (Typical value)6.Q200 Requirement6.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer)AEC-Q200 Rev.D issued June 1. 2010AEC-Q200 Murata Specification / Deviation No Stress TestMethod3 HighTemperatureExposure 1000hours at 125 deg CSet for 24hours at roomtemperature, then measured.Meet Table A after testing.Table A4 TemperatureCycling 1000cycles-40 deg C to +125 deg CSet for 24hours at roomtemperature,thenmeasured.Meet Table A after testing.7 Biased Humidity 1000hours at 85 deg C, 85%RHunpowered.Meet Table A after testing.8 Operational Life Apply 125 deg C 1000hoursSet for 24hours at roomtemperature, then measuredMeet Table A after testing.9 External Visual Visual inspection No abnormalities10 Physical Dimension Meet ITEM 4（Style and Dimensions）No defects12 Resistanceto Solvents PerMIL-STD-202Method 215Not ApplicableAppearance No damageInductanceChange(at 100MHz)Within ±10%AEC-Q200 Murata Specification / Deviation No Stress TestMethod13 Mechanical Shock Per MIL-STD-202Method 213Condition C : 100g’s(0.98N),6ms, Half sine, 12.3ft/sMeet Table A after testing.14 Vibration 5g's(0.049N) for 20 minutes,12cycles each of 3 oritentationsTest from 10-2000Hz.Meet Table A after testing.15 Resistanceto Soldering Heat No-heatingSolder temperature260C+/-5 deg CImmersion time 10sMeet Table A after testing.Pre-heating 150C +/-10 deg C, 60s to 90s17 ESD Per AEC-Q200-002 ESD Rank: refer to the Item3 (Rating).Meet Table A after testing18 Solderbility Per J-STD-002 Method b : Not Applicable90% of the terminations is to be soldered.19 ElectricalCharacterizationMeasured : Inductance No defects20 Flammability Per UL-94 Not Applicable21 Board Flex Epoxy-PCB(1.6mm)Deflection 2mm(min)Holding time 60s Meet Table B after testing.Table BAppearance No damage DCresistanceChangeWithin ±10%22 Terminal Strength Per AEC-Q200-006A force of 17.7Nfor 60s Murata Deviation Request: 5N No defects7.Specification of Packaging(in mm)7.2 Specification of Taping(1) Packing quantity (standard quantity)10,000 pcs. / reel(2) Packing MethodProducts shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.(3) Sprocket holeThe sprocket holes are to the right as the tape is pulled toward the user.(4) Spliced pointBase tape and Top tape has no spliced point.(5) Missing components numberMissing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,andare not continuous. The Specified quantity per reel is kept.0.8m ax.7.3 Pull StrengthTop tape5N min.Bottom tape7.4 Peeling off force of cover tapeSpeed of Peeling off 300mm/min Peeling off force0.1N to 0.6N(minimum value is typical)7.5 Dimensions of Leader-tape,Trailer and ReelThere shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.7.6 Marking for reelCustomer part number, MURATA part number, Inspection number(*1) ,RoHS Marking(*2), Quantity etc ･･･*1) <Expression of Inspection No.> □□ OOOO ⨯⨯⨯(1) (2) (3)(1) Factory Code (2) Date First digit : Year / Last digit of yearSecond digit: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digi : Day(3) Serial No.*2) <Expression of RoHS Marking> ROHS – Y (△)(1) (2)(1) RoHS regulation conformity parts. (2) MURATA classification number7.7 Marking for Outside package (corrugated paper box)Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking(*2) ,Quantity, etc ･･･7.8. Specification of Outer CaseOuter Case Dimensions(mm)Standard Reel Quantityin Outer Case (Reel)W D H 186 186 93 5* Above Outer Case size is typical. It depends on a quantity of an order.F165to 180degreeTop tape Bottom tapeBase tapeWDLabelH8. △!Caution8.1 Caution(Rating)Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred.8.2 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may becaused by the abnormal function or the failure of our product.8.3 Limitation of ApplicationsPlease contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment(3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above9. NoticeProducts can only be soldered with reflow. This product is designed for solder mounting.Please consult us in advance for applying other mounting method such as conductive adhesive.9.1 Land pattern designinga 0.4b 1.4 to 1.5c 0.5 to 0.6(in mm)9.2 Flux, Solder・Use rosin-based flux.Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder.・Standard thickness of solder paste : 100μm to 150μm.Resist9.3 Reflow soldering conditions・Inductance value may be changed a little due to the amount of solder.So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows.The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality.・Reflow soldering profileStandard Profile Limit Profile Pre-heating 150°C ～180°C 、90s ±30s Heating above 220°C ､30s ～60s above 230°C ､60s max. Peak temperature 245°C ±3°C 260°C,10s Cycle of reflow 2 times 2 times9.4 Reworking with soldering ironThe following conditions must be strictly followed when using a soldering iron.Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)sTime 2 timesNote :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock.9.5 Solder Volume・ Solder shall be used not to be exceed the upper limits as shown below.・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance.1/3T ≦t ≦TT ：thickness of product9.6 Mount ShockOver Mechanical stress to products at mounting process causes crack and electrical failure etc.Limit ProfileStandard Profile 90s±30s 230℃260℃245℃±3℃220℃30s～60s 60s max.180150Temp.(s)(℃)Time.9.7 Product’s locationThe following shall be considered when designing and laying out P.C.B.'s.(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress due to warping the board.［Products direction ］Products shall be located in the sideways direction (Length:a ＜b) to the mechanical stress.(2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board.It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress.Contents of MeasuresStress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part.A >B (3) Keep the mounting position of the component away from the board separation surface. A > C*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.(3) Mounting Components Near Screw HolesWhen a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.9.8 Cleaning ConditionsProducts shall be cleaned on the following conditions.(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B.Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.(3) Cleaner1. Alcohol type cleanerIsopropyl alcohol (IPA)2. Aqueous agentPINE ALPHA ST-100S(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us.〈Poor example 〉〈Good example 〉ba9.9 Resin coatingThe inductance value may change and/or it may affect on the product's performance due to highcure-stress of resin to be used for coating / molding products. So please pay your careful attention whenyou select resin.In prior to use, please make the reliability evaluation with the product mounted in your application set.9.10 Handling of a substrateAfter mounting products on a substrate, do not apply any stress to the product caused by bending ortwisting to the substrate when cropping the substrate, inserting and removing a connector from thesubstrate or tightening screw to the substrate.Excessive mechanical stress may cause cracking in the product.Bending Twisting9.11 Storage and Handing Requirements(1) Storage periodUse the products within 6 months after deliverd.Solderability should be checked if this period is exceeded.(2) Storage conditions・Products should be stored in the warehouse on the following conditions.Temperature: -10°C to 40°CHumidity: 15% to 85% relative humidity No rapid change on temperature and humidityDon't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may causeoxidization of electrode, resulting in poor solderability.・Products should be storaged on the palette for the prevention of the influence from humidity, dust and so on.・Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on.・Products should be storaged under the airtight packaged condition.(3) Handling ConditionCare should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.10．△!Note(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product.(2) You are requested not to use our product deviating from the reference specifications.(3) The contents of this reference specification are subject to change without advance notice.Please approve our product specifications or transact the approval sheet for product specificationsbefore ordering.Reference OnlySpecNo.JELF243B-9101H-01 P.11 / 11。

常用的几个材料数据库网站

常用的几个材料数据库网站

物性参数：/bbs材料学科常用的20个数据库列表1、ASM-International /asm_tms/phase_diagrams/pd/2、日本国立材料科学研究所：材料数据库--- http://mits.nims.go.jp/db_top_eng.htm3、Thermophysical Properties of Matter Databasehttps:///Applications/TPMD/Demo?action=Select+Material+Group&mgcode=1 4、(美国)国家标准与技术局(NIST)物性数据库/chemistry/name-ser.html5、中科院物性及热化学数据库—/sdb_2004/all_thermochemistry.html6、Database for Solder Properties with Emphasis on Ne /div853/lead%20free/solders.html7、台湾生贸公司无铅焊料系列文献下载/service_load.asp8、la surface com /accueil/index.php9、Surface Analysis Forum（大容量）-- /10、Lead-Free Solder Alloy --- /~bozack/Pb-FreeSolder.html11、Lead-Free Solder--- /Db/_Lead-Free.html12、化工引擎--- /13、NIST XPS Database--- /xps/Bind_e_spec_query.asp14、Solder Systems Computational Thermodynamics /phase/solder/solder.html15、Phase Diagrams and Articles—http://www.crct.polymtl.ca/fact/index.php?websites=116、韩国多元相图--- http://www.icm.re.kr/mdb/phase/index.jsp?ca=2&index=A17、二（三）元相图FactSage Database- - http://www.crct.polymtl.ca/fact/ ... tel/FSstel_Figs.htm18、剑桥大学材料资源-- /index.html19、二元相图库--- http://web.met.kth.se/dct/pd/periodic-table.html20、金相实验室-- /index.html关于材料常数及论文方面一些有用的网站(转)常用的材料常数及各种标准/元素周期表http://cimesg1.epfl.ch/CIOLS/crystal1.pl晶体学网站，里面有很多有用的链接/cuu/Constants/i...?/codata86.html物理常数/world/lecture/index.html讲义/晶体之星/default.cfm材料科学与工程方面的论文网站/default.cfm一个关于论文的搜索网址/NewFiles/material_properties.html材料学数据/ludlum/p...roductLine.html/servlet/N ... 0&c=&page=2//ams/ams.asp/amse/amse.asp///cljpk//biaozun.php/fms/WebCourse/chapter1/c1-s1.asp/index.jsp?url=htt...g%3D1%26age%3D0/index.jsp材料大全A到Z (金属、陶瓷、高分子、复合材料)(免费) 材料大全A到Z (金属、陶瓷、高分子、复合材料)(免费)/materials.asp日本国立材料科学研究所：材料数据库(免费)http://mits.nims.go.jp/db_top_eng.htmDatabase of Published Interatomic Parameters(免费)/DFRL/researc ... database/index.htmlLiqCryst Online (液晶数据库)(部分免费)http://liqcryst.chemie.uni-hamburg.de/PoLyInfo (高分子材料设计所需的各种数据)(免费)http://polymer.nims.go.jp/polyinfo_top_eng.htm保温材料数据库NASA TPSX(免费)/CAMPUS (塑料产品数据库, 免费)/Chemical Resistance of Resin Materials(免费)/html/chemical.htmlGoodfellow (金属与材料)/ILL's 3D structure gallery in VRML (各种有趣的无机材料的3D结构)http://www.ill.fr/dif/3D-crystals/index.htmlKey to Metals (有色金属数据库)/Materials Science International Services (合金材料组成和相图数据) /World Wide Composites Search Engine (英特网复合材料搜索引擎)/材料手册, Ceramic Industry(免费)/FILES/HTML/MaterialsHandbook/0,2772,,00.html化学相容性(化学品与材料之间)数据库, Cole-Parmer(免费)/techinfo/chemcomp.asp金属合金物性数据库(Principal Metals, Inc.提供)(免费)/prime/step1.asp科学数据库/美国、加拿大再生塑料产品/厂家目录(Recycled Plastic Products Directory)(免费) /溶剂选择数据库(免费)/陶瓷材料参考指南，Reference Guide Index(免费)/FILES/HTML/ReferenceIndex/0,2796,,00.html吸声材料数据表(免费)/tecref_acoustictable.html【网址推荐】材料学一些网站1. /常用的材料常数及各种标准2. /元素周期表3. http://cimesg1.epfl.ch/CIOLS/crystal1.pl晶体学网站，里面有很多有用的链接4. /cuu/Constants/index.html?/codata86.html物理常数5. /world/lecture/index.html讲义6. /晶体之星7. /default.cfm材料科学与工程方面的论文网站8./l ... p/G.16/qx/ProductLi ne.html9. /servlet/N ... 0&c=&page=2关于不锈钢的数据10. http://mits.nims.go.jp/db_top_eng.htm日本国立材料科学研究所：材料数据库。