电子技术基础chapter1

Microelectronics packaging technology(R eview contents)Chapter 1：Introduction1.The development characteristics and trends of microelectronics packaging.2.The functions of microelectronics packaging.3.The levels of microelectronics packaging technology.4.The methods for chip bonding.Chapter 2：Chip interconnection technologyIt is one of the key chapters1.The Three kinds of chip interconnection, and their characteristics and applications.2.The types of wire bonding (WB) technology, their characteristics and working principles.3.The working principle and main process of the wire ball bonding.4.The major materials for wire bonding.5.Tape automated bonding (TAB) technology:1）The characteristic and application of TAB technology.2）The key materials and technologies of TAB technology.3）The internal lead and outer lead welding technology of TAB technology.6. Flip Chip Bonding (FCB) Technology1）The characteristic and application of flip chip bonding technology2）UBM and multilayer metallization under chip bump；UBM’s structure and material, and the roles ofeach layer.3）The main fabrication method of chip bumps.4）FCB technology and its reliability.5）C4 soldering technology and its advantages.6）The role of underfill in FCB.7）The interconnection principles for Isotropic and anisotropic conductive adhesive respectively. Chapter 3: Packaging technology of Through-Hole components1.The classification of Through-Hole components.2.Focused on：DIP packaging technology, including its process flow.3.The characteristics of PGA.Chapter 4：Packaging technology of surface mounted device (SMD)1.The advantages and disadvantages of SMD.2.The types of SMD.3.The main SMD packaging technologies, focused on：SOP、PLCC、LCCC、QFP.4.The packaging process flow of QFP.5.The risk of moisture absorption in plastic packages, the mechanism of the cracking caused by moistureabsorption, and solutions to prevent for such failure.Chapter 5：Packaging technology of BGA and CSP1.The characteristics of BGA and CSP.2.The packaging technology for PBGA，and its process flow.3.The characteristics of packaging technology for CSP.4.The reliability problems of BGA and CSP.Chapter 6：Multi-Chip Module（MCM）1.The classification and characteristics of MCM2. The assembly technology of MCM.Chapter 7：Electronic packaging materials and substrate technology1. The classification of the materials for electronic packaging, the main requirements for packagingmaterials.2. The types of metals in electronic packaging, and their main applications.3. The main requirements for polymer materials in electronic packaging.4.Classification of main substrate materials, and the major requirements for substrate materials.Chapter 8：Microelectronics packaging reliability1.The basic concepts of electronic packaging reliability.2.The basic concepts for failure mode and failure mechanism in electronic packaging.3.Main failure (defect) modes (types) of electronic packaging.4.The purpose and procedure of failure analysis (FA) ；Common FA techniques (such as cross section, dyeand pry, SEM, CSAM ...).5 The purpose and key factors (such as stress level, stress type …) to design accelerated reliability test. Chapter 9：Advanced packaging technologies1.The concept of wafer level packaging (WLP) technology.2.The key processes of WL-CSP.3.The concept and types of the 3D packaging technologies.Specified Subject 1：LED packaging technology1. Describe briefly the four ways to achieve LED white light, and how they are packaged？2. Describe briefly the difference and similar aspects (similarity) between LED packaging andmicroelectronics packaging.3. And also describe briefly the development trend for LED package technology and the whole LED industryrespectively.Specified Subject 2：MEMS packaging technology1.The differences between micro-electro-mechanical system (MEMS) packaging technology and theconventional microelectronics packaging technologies.2.The function requirements of MEMS packaging.Extra requirement:The common used terms (Abbreviation) for electronic packaging.。

电气工程及其自动化专业必备知识Chapter 1：电气工程基础知识⑴电流、电压和电阻⑵电路基础和欧姆定律⑶串并联电路的分析⑷电源和电能⑸电磁场基础知识Chapter 2：电路分析与设计⑴直流电路分析⑵交流电路分析⑶功率与功率因数校正⑷谐振电路设计与分析⑸数字电路设计基础Chapter 3：电机与变压器⑴三相交流电机⑵单相交流电机⑶直流电机⑷传感器与执行器⑸变压器基础知识与应用Chapter 4：电力系统与配电⑴电力系统概述⑵发电与变电⑶输电与配电系统⑷电力负荷管理⑸电能质量与调节Chapter 5：自动控制系统⑴控制系统基础⑵反馈控制系统⑶ PID 控制器⑷离散时间控制系统⑸自动化系统与工业控制Chapter 6：电气安全与规范⑴电气安全基础知识⑵国家电气安全法规与标准⑶高压电器安全操作⑷电气事故预防措施⑸地线与接地系统Chapter 7：电气测试与测量⑴仪器与测量误差⑵电气量测量⑶准确度和置信度⑷频谱分析仪与示波器⑸电气信号处理与测试工具Chapter 8：现代电气工程技术⑴电力电子技术⑵光伏与风能发电⑶电动汽车技术⑷智能电网与电力交易⑸在电气工程中的应用附件：⒈实验报告范例⒉电路设计案例⒊自动控制系统仿真软件教程⒋电气安全操作手册⒌测量仪器使用指南法律名词及注释：⒈电力法：是对电力工业进行管理和监督的法律法规。

⒉电力安全法：是为保障电力生产、供应、消费等环节的安全而制定的法律法规。

⒊电力负荷管理条例：是对电力系统负荷进行合理安排和管理的相关规定。

⒋地线：用于将设备或系统与地面接地连接的线路。

⒌接地系统：用于保护电气设备和人员免受电击的系统。

附件：⒈实验报告范例：[文件]⒉电路设计案例：[文件]⒊自动控制系统仿真软件教程：[文件]⒋电气安全操作手册：[文件]⒌测量仪器使用指南：[文件]法律名词及注释：⒈电力法：根据国家法律关于电力工业的规定。

⒉电力安全法：根据国家法律关于电力安全的规定。

⒊电力负荷管理条例：根据国家法律关于电力负荷管理的规定。

Sichuan UniversityP.R.ChinaDepartment of Electrical and Electronic centerBasics of Analog Electronic TechnologyCourse SyllabusCourse Name Basics of Analog Electronic TechnologyCourse No.907017030Department Electrical andElectronic centerHours48Academic credit3Course Descriptions This course is designed to serve as the fundamentals course in Electric Engineering curriculum.Topic covered include:Electronic system and signal; basic semiconductor knowledge;regulated voltage source;basic amplifier; feedback amplifier;operational amplifier and signal process circuit;signal generate circuit and regulated voltage source etc.It combines basic thesis with new technology in this course.The course introduces the basic thesis and knowledge of analog circuit,and also enhances the circuit analysis and circuit design ability of students for their future study.Course Materials(Textbooks)Huaguang Kang,Basic of Analog Electronic Technology,Higher Education Press of China, ISBN978-7-04-017789-3GradingClass participation10%Homework20%Final exam70%Instructor InformationBinbing Chen,Associated Professor,Department of Electrical and Electronic center,Sichuan UniversityTentative Course ScheduleChapter Title Topic1Introduction1)Signal2)The spectrum of the signal3)Analog signal and digital signal4)Amplifier circuit modelSichuan UniversityP.R.China5)The main performance indexes of Amplifier circuit2Operational amplifier1)Integrated circuit operational amplifier2)ideal operational amplifier3)Basic linear amplifier circuit4)Other applications of Noninverting input and invertinginput amplifier circuit5)The examples of SPICE simulation3Diode1)Semiconductor2)Formation and characteristics of P-N junction3)Diode4)analytical methods of diode basic circuit5)Special diode6)The examples of SPICE simulation4BJT and its amplifiercircuit 1)BJT2)common-emitter amplifier circuit3)analytical methods of amplifier circuit4)the Stability of static work point of the amplified circuits5)common-collector and common-base amplifier circuit6)combination amplify circuit7)Frequency response of amplifier circuit8)transient response of Single stage amplifier circuit9)The examples of SPICE simulation5Mosfet amplifier circuit1)MOSFET2)MOSFET amplifier circuit3)JFET4)MESFET5)Comparison of Circuit performances6)The examples of SPICE simulation6Analogue integratedcircuit 1)Biasing technique2)Differential amplifier3)transmission characteristics of Differential amplifier4)Integrated circuit operational amplifier5)major parameters of Integrated circuit operational amplifier6)Variable transconductance analog multiplier7)Noise and interference8)The examples of SPICE simulation7Feedback amplifier circuit1)The basic concept and classification of Feedback2)Four configurations of Negative feedback amplifier circuit3)Gain of Negative feedback amplifier circuit4)The influence of the negative feedback on amplifier circuitSichuan UniversityP.R.China5)Depth negative feedback6)Design of Negative feedback amplifier circuit7)Frequency response of Negative feedback amplifier circuit8)The stability of Negative feedback amplifier circuit9)The examples of SPICE simulation8Power amplifier circuit1)general issues of Power amplifier circuit2)emitter follower3)Integrated power amplifier4)The examples of SPICE simulation9signal processingand signal circuit 1)The basic concept and classification of filter circuit2)First order active filter circuit3)High order active filter circuit4)Switched Capacitor Filter5)Oscillating conditions of Sinusoidal oscillator circuit6)RC sinusoidal oscillator circuit7)LC sinusoidal oscillator circuit8)voltage comparator,Astable Multivibrator and Sawtooth wavegenerating circuit9)The examples of SPICE simulation10DC stabilized powersupply 1)Low power rectifier filter circuit2)series feed voltage regulator circuit3)switch voltage-stabilizing circuit4)The examples of SPICE simulation11computer aided analysisand design 1)SPICE program aided analysis of Electronic circuit2)SPICE program aided design of Electronic circuit。